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WO2016117579A9 - 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板および電子部品 - Google Patents

熱硬化性樹脂組成物、硬化膜、硬化膜付き基板および電子部品 Download PDF

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Publication number
WO2016117579A9
WO2016117579A9 PCT/JP2016/051487 JP2016051487W WO2016117579A9 WO 2016117579 A9 WO2016117579 A9 WO 2016117579A9 JP 2016051487 W JP2016051487 W JP 2016051487W WO 2016117579 A9 WO2016117579 A9 WO 2016117579A9
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WO
WIPO (PCT)
Prior art keywords
cured film
resin composition
thermosetting resin
electronic component
substrate provided
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PCT/JP2016/051487
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English (en)
French (fr)
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WO2016117579A1 (ja
Inventor
篤史 室谷
敬幸 廣田
克幸 杉原
佳宏 出山
信太 諸越
伊丹　節男
敏行 高橋
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Jnc株式会社
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Application filed by Jnc株式会社 filed Critical Jnc株式会社
Priority to US15/544,472 priority Critical patent/US10793717B2/en
Priority to KR1020177022199A priority patent/KR102473932B1/ko
Priority to JP2016570666A priority patent/JP6687854B2/ja
Priority to CN201680006583.6A priority patent/CN107207702B/zh
Publication of WO2016117579A1 publication Critical patent/WO2016117579A1/ja
Publication of WO2016117579A9 publication Critical patent/WO2016117579A9/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/308—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
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    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16—Polyester-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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    • C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D177/12—Polyester-amides
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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    • C09D7/61—Additives non-macromolecular inorganic
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Optical Filters (AREA)
  • Polyamides (AREA)

Abstract

ポリエステルアミド酸（Ａ）、フルオレン骨格を有するエポキシ化合物（Ｂ）、エポキシ硬化剤（Ｃ）、および、着色剤（Ｄ）を含む熱硬化性樹脂組成物であって、硬度および高温条件下におけるガラスに対する密着性が良好なバランスに優れる硬化膜を形成することができる熱硬化性樹脂組成物が提供され、その熱硬化性樹脂組成物の用途も提供される。
PCT/JP2016/051487 2015-01-23 2016-01-20 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板および電子部品 WO2016117579A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US15/544,472 US10793717B2 (en) 2015-01-23 2016-01-20 Thermosetting resin composition, cured film, substrate with cured film, and electronic component
KR1020177022199A KR102473932B1 (ko) 2015-01-23 2016-01-20 열경화성 수지 조성물, 경화막, 경화막 부착 기판 및 전자 부품
JP2016570666A JP6687854B2 (ja) 2015-01-23 2016-01-20 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板および電子部品
CN201680006583.6A CN107207702B (zh) 2015-01-23 2016-01-20 热固性树脂组合物、固化膜、带固化膜的基板以及电子零件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-011823 2015-01-23
JP2015011823 2015-01-23

Publications (2)

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WO2016117579A1 WO2016117579A1 (ja) 2016-07-28
WO2016117579A9 true WO2016117579A9 (ja) 2017-05-11

Family

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Country Status (5)

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US (1) US10793717B2 (ja)
JP (1) JP6687854B2 (ja)
KR (1) KR102473932B1 (ja)
CN (1) CN107207702B (ja)
WO (1) WO2016117579A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180135886A (ko) * 2016-04-18 2018-12-21 제이엔씨 주식회사 열경화성 수지 조성물, 경화막, 경화막 부착 기판 및 전자 부품
KR102716106B1 (ko) * 2017-04-13 2024-10-11 제이엔씨 주식회사 열경화성 수지 조성물, 경화막, 경화막 부착 기판, 전자 부품 및 잉크젯용 잉크
JP2019139091A (ja) * 2018-02-13 2019-08-22 Jnc株式会社 感光性組成物
JP6988566B2 (ja) * 2018-02-27 2022-01-05 Jnc株式会社 熱硬化性組成物
JP6947102B2 (ja) * 2018-03-29 2021-10-13 Jnc株式会社 熱硬化性組成物
EP3909747A1 (en) * 2020-05-12 2021-11-17 TIGER Coatings GmbH & Co. KG Thermosetting material for use in a 3d printing process
CN114806350B (zh) * 2021-01-29 2025-01-07 太阳油墨（苏州）有限公司 导热性糊剂、干膜、固化物和电子部件

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
JPH04323216A (ja) * 1991-04-23 1992-11-12 Toto Kasei Kk エポキシ樹脂組成物
JP2591392B2 (ja) * 1991-11-26 1997-03-19 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
TW200516111A (en) * 2003-09-09 2005-05-16 Chisso Corp Thermosetting resin composition and cured film
JP4569233B2 (ja) 2003-09-09 2010-10-27 チッソ株式会社 熱硬化性樹脂組成物及び硬化膜
JP5298428B2 (ja) 2006-12-26 2013-09-25 Ｊｎｃ株式会社 熱硬化性樹脂組成物及び硬化膜
JP5018197B2 (ja) * 2007-04-09 2012-09-05 Ｊｎｃ株式会社 熱硬化性樹脂組成物及び硬化膜
TW200909521A (en) * 2007-07-27 2009-03-01 Chisso Corp Composition comprising polyester amide acid and ink-jet composition using the composition
JP2009122478A (ja) * 2007-11-16 2009-06-04 Chisso Corp カラーフィルター用着色液
JP2009210688A (ja) * 2008-03-03 2009-09-17 Fujifilm Corp 着色硬化性組成物、カラーフィルタ、カラーフィルタの製造方法、及び液晶表示装置
JP5297065B2 (ja) * 2008-03-26 2013-09-25 大阪瓦斯株式会社 樹脂成形体及びその製造方法
JP2009237225A (ja) * 2008-03-27 2009-10-15 Toray Ind Inc カラーフィルター用熱硬化性着色組成物
JP2009237441A (ja) * 2008-03-28 2009-10-15 Fujifilm Corp 着色感光性組成物、カラーフィルタ、及び表示装置
JP5581180B2 (ja) 2010-11-10 2014-08-27 大阪ガスケミカル株式会社 フルオレン骨格を有するエポキシ樹脂組成物およびその硬化物
JP2013170210A (ja) * 2012-02-21 2013-09-02 Jnc Corp 透明導電膜の保護膜用熱硬化性組成物
JP6213281B2 (ja) 2013-03-19 2017-10-18 Jnc株式会社 感光性ジアミン、液晶配向剤および液晶表示素子
JP2014218651A (ja) * 2013-04-08 2014-11-20 Jnc株式会社 熱硬化性組成物

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Publication number Publication date
KR20170126866A (ko) 2017-11-20
US10793717B2 (en) 2020-10-06
WO2016117579A1 (ja) 2016-07-28
US20180009983A1 (en) 2018-01-11
JP6687854B2 (ja) 2020-04-28
KR102473932B1 (ko) 2022-12-06
CN107207702A (zh) 2017-09-26
JPWO2016117579A1 (ja) 2017-11-02
CN107207702B (zh) 2021-04-09

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