WO2016163364A1 - Electroconductive layered product, touch panel, and process for producing electroconductive layered product - Google Patents

Abstract

The purpose of the present invention is to provide an electroconductive layered product which is excellent in terms of solvent resistance and scratch resistance and has a low haze and an extremely high light transmittance. The present invention is an electroconductive layered product which includes an electroconductive layer comprising an electroconductive fibrous filler as an outermost layer, the electroconductive layered product being characterized by having a Martens hardness, as measured at an indentation depth from the surface of 100 nm, of 150-3,000 N/mm². The electroconductive layered product is further characterized in that the proportion of the one or more electroconductive-material elements constituting the electroconductive fibrous filler, in the outermost surface of the electroconductive layer, is 0.15-5.00 at% in terms of atomic percentage.

Description

Conductive laminate, touch panel, and method for producing conductive laminate

The present invention relates to a conductive laminate, a touch panel, and a method for manufacturing a conductive laminate.

Conventionally, transparent and conductive thin films have been used as transparent electrodes for displays such as liquid crystal displays (LCD) and plasma display panels (PDP), touch panels, and solar cells. Examples of such thin films include: A transparent conductive thin plate in which a conductive film made of indium tin oxide (ITO) or the like is laminated on a glass substrate has been used.
However, since a transparent conductive thin plate using a glass substrate is inferior in flexibility, a vacuum deposition method has recently been used on a base film made of a flexible resin such as polyester (PET) film or polyethylene naphthalate (PEN). A conductive film provided with a conductive film made of ITO or the like by sputtering or sputtering has been mainly used.

However, since the conductive film made of ITO or the like was not flexible, there was a problem that when the conductive film was provided on a base film made of a flexible resin, cracks were likely to occur.
On the other hand, for example, a transparent conductor in which a transparent conductive layer containing metal nanowires is provided on a substrate is known (see, for example, Patent Document 1).
The transparent conductor described in Patent Document 1 is prepared by coating an aqueous dispersion in which metal nanowires are dispersed in a dispersion solvent on a substrate, preferably a hydrophilic polymer layer provided on a base material, and drying. The transparent conductive material produced by forming a transparent conductive layer with the method is in a state where metal nanowires are embedded in the base material or the hydrophilic polymer layer.
However, such a transparent conductor has a problem that it is inferior in solvent resistance and scratch resistance because the surface of a substrate or the like in which metal nanowires are embedded is not cured.

Also, for example, in Patent Document 2, a transparent conductive film is produced by forming a transparent conductive film on a base material, further providing a cured film on the transparent conductive film, and then patterning the transparent conductive film by etching. A method is disclosed. According to the method of providing such a cured film on the transparent conductive film, improvement in solvent resistance and scratch resistance can be expected.
However, in a transparent conductive film in which a cured film is provided on a transparent conductive film, if the thickness of the cured layer is thick, the surface resistance increases, and it takes a long time to etch the transparent conductive film. It was necessary to make the thickness of the cured film provided in the thin film.
However, since it is difficult to form a cured film thinly, a polymer material having a good film forming property is often selected and used, and a cured film made of such a polymer material having a good film forming property is inferior in hardness. Even when a high-hardness monomer is used, there is a problem that the film is thin and the curing is incomplete, resulting in insufficient scratch resistance.

In addition, for example, a method of manufacturing a conductive film by a so-called transfer method in which a conductive film is formed on a support and copied onto a base film is also known (see, for example, Patent Documents 3 and 4). According to such a conductive film, improvement in solvent resistance and scratch resistance can be expected.
However, in recent years, the optical performance required for image display devices and the like has become higher and higher. Therefore, the optical performance superior to the conductive film, in particular, the light transmission performance with a low haze value can be extremely excellent. Although required, a conventional conductive film provided with a conductive film by a transfer method cannot be said to have sufficient optical performance.

JP 2010-084173 A JP 2014-188828 A JP 2009-252493 A Japanese Patent No. 5430792

In view of the above situation, the present invention is excellent in solvent resistance and scratch resistance and has a low haze value and an extremely high light transmittance, a touch panel using the conductive laminate, and An object of the present invention is to provide a method for producing a conductive laminate.

The present invention is a conductive laminate having a conductive layer containing a conductive fibrous filler on the outermost surface, and has a Martens hardness of 150 to 3000 N / mm ^{2 when the} amount of indentation from the surface is 100 nm. The conductive laminate is characterized in that the ratio of the conductive material element constituting the conductive fibrous filler on the outermost surface side of the layer is 0.15 to 5.00 at% in terms of atomic composition percentage.

In addition, the conductive laminate of the present invention preferably has a total light transmittance of 80% or more and a haze of 5% or less.
The conductive layer has a binder resin and a conductive fibrous filler contained in the binder resin, and a part of the conductive fibrous filler is a surface on the outermost surface side of the conductive layer. It is preferable to protrude from.
Moreover, it is preferable that the thickness of the said electroconductive layer is less than the fiber diameter of an electroconductive fibrous filler.
The conductive fibrous filler preferably has a fiber diameter of 200 nm or less and a fiber length of 1 μm or more.
The conductive fibrous filler is preferably at least one selected from the group consisting of conductive carbon fibers, metal fibers, and metal-coated synthetic fibers.
Moreover, it is preferable that the electroconductive laminated body of this invention has the said electroconductive layer on a resin layer.

Moreover, this invention is also a touchscreen obtained by using the electroconductive laminated body of this invention mentioned above.

Further, the present invention is a method for producing a conductive laminate having a conductive layer containing a conductive fibrous filler on the outermost surface, and using a transfer film having at least the conductive layer on a release film, It is also a method for producing a conductive laminate, comprising a transfer step of transferring the conductive layer to the transfer target.

In the method for producing a conductive laminate of the present invention, the conductive film preferably has a haze value of 5% or less and a total light transmittance of 80% or more.
Further, the conductive layer in the transfer film has a binder resin and a conductive fibrous filler contained in the binder resin, and a part of the conductive fibrous filler is part of the conductive layer. It is preferable to protrude from the surface opposite to the film side.
Moreover, it is preferable that the thickness of the said electroconductive layer is less than the fiber diameter of the said electroconductive fibrous filler.
The conductive fibrous filler preferably has a fiber diameter of 200 nm or less and a fiber length of 1 μm or more.
The conductive fibrous filler is preferably at least one selected from the group consisting of conductive carbon fibers, metal fibers, and metal-coated synthetic fibers.
Moreover, it is preferable to further have a treatment step of irradiating and / or heating the conductive layer with ultraviolet rays.
Further, the transfer object is preferably a resin layer.
Hereinafter, the present invention will be described in detail.
In the present specification, “resin” is a concept including monomers, oligomers, polymers and the like unless otherwise specified.

The present invention is a conductive laminate having a conductive layer containing a conductive fibrous filler on the outermost surface.
As a result of intensive studies, the present inventors have found that in a conductive laminate in which a conductive layer containing a conductive fibrous filler is provided on the outermost surface, the surface hardness is within a predetermined range, and the conductive layer The conductive material element constituting the conductive fibrous filler is present at a predetermined ratio on the outermost surface side of the material, so that it has excellent solvent resistance and scratch resistance, and also has an extremely high light transmittance at a low haze value. The present inventors have found that the conductive laminate can be obtained and have completed the present invention.

The conductive laminate of the present invention has a Martens hardness of 150 to 3000 N / mm ^{2 when the} amount of indentation from the surface is 100 nm. The “surface” means the outermost surface on the conductive layer side of the conductive laminate of the present invention.
When the amount of indentation from the surface is 100 nm and the Martens hardness is less than 150 N / mm ² , the conductive laminate of the present invention is easily damaged, and when it exceeds 3000 N / mm ² , the etching rate is slow. Or the problem of cracking with respect to bending tends to occur. The preferable lower limit of the Martens hardness when the indentation amount is 100 nm from the surface is 200 N / mm ² , the preferable upper limit is 1000 N / mm ² , the more preferable lower limit is 250 N / mm ² , and the more preferable upper limit is 500 N / mm ² . is there.
In the present specification, the Martens hardness is the Martens hardness when the indentation amount is 100 nm from the surface measured using an ultra-micro hardness test system “Picodenter” manufactured by Fischer.

The conductive laminate of the present invention preferably has a high Martens hardness at a position closer to the outermost surface. Specifically, it is preferable that the Martens hardness is 1000 to 40000 N / mm ^{2 when the} indentation is 5 to 10 nm from the surface. By having such Martens hardness, the durability test is conducted even after the durability test such as the solvent resistance test and the scratch resistance test is performed on the conductive laminate of the present invention. The previous scratch resistance and solvent resistance are easily obtained.
In the conductive laminate of the present invention, it is preferable that the Martens hardness is 20 to 1000 N / mm ^{2 when} the indentation from the surface is 500 to 1000 nm. By having such Martens hardness, the hardness balance of the entire conductive laminate of the present invention is improved, and it becomes easy to improve the etching rate and adhesion properties of the conductive laminate of the present invention. . The amount of indentation from the surface of 500 to 1000 nm means that the depth below the interface between the conductive layer and the lower layer provided on the side opposite to the outermost surface of the conductive layer, that is, the depth on the lower layer side. It is.
Depending on the manufacturing method, the solvent or some resin component may dissolve or penetrate into the lower layer of the conductive laminate of the present invention, which is too soft compared to the Martens hardness of the conductive layer. In some cases, the amount of indentation from the surface may affect various physical properties. Therefore, it is more preferable that the Martens hardness balance of the entire conductive laminate of the present invention is in an appropriate range with respect to the Martens hardness when the indentation amount is 100 nm from the surface described above.

The conductive layer contains a conductive fibrous filler.
In the present invention, the conductive layer may contain a binder resin in addition to the conductive fibrous filler. In this case, a part of the conductive fibrous filler is the outermost surface of the conductive layer. It is preferable to protrude from the side surface (hereinafter also simply referred to as the surface).
The conductive laminate having such a conductive layer can have a low light haze value and high light transmission performance.
Moreover, by setting it as the structure which has an electroconductive fibrous filler in the said binder resin, the abrasion resistance of the said electroconductive layer will be especially excellent.

The binder resin is not particularly limited, and is preferably, for example, a transparent one. For example, an ionizing radiation curable resin that is a resin curable by ultraviolet rays or electron beams is cured by irradiation with ultraviolet rays or electron beams. Is preferred.
Examples of the ionizing radiation curable resin include compounds having one or more unsaturated bonds such as compounds having functional groups such as acrylates. Examples of the compound having one unsaturated bond include ethyl (meth) acrylate, ethylhexyl (meth) acrylate, styrene, methylstyrene, N-vinylpyrrolidone and the like. Examples of the compound having two or more unsaturated bonds include trimethylolpropane tri (meth) acrylate, tripropylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, and pentaerythritol. Tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, trimethylolpropane tri (meth) ) Acrylate, ditrimethylolpropane tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, tripentaerythritol octa (meth) acrylate Rate, tetrapentaerythritol deca (meth) acrylate, isocyanuric acid tri (meth) acrylate, isocyanuric acid di (meth) acrylate, polyester tri (meth) acrylate, polyester di (meth) acrylate, bisphenol di (meth) acrylate, diglycerin Polyfunctional compounds such as tetra (meth) acrylate, adamantyl di (meth) acrylate, isoboronyl di (meth) acrylate, dicyclopentane di (meth) acrylate, tricyclodecane di (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate Etc. Among these, pentaerythritol triacrylate (PETA), dipentaerythritol hexaacrylate (DPHA), and pentaerythritol tetraacrylate (PETTA) are preferably used. In the present specification, “(meth) acrylate” refers to methacrylate and acrylate. In the present invention, as the ionizing radiation curable resin, a compound obtained by modifying the above-described compound with PO, EO or the like can also be used.

In addition to the above compounds, relatively low molecular weight polyester resins having unsaturated double bonds, polyether resins, acrylic resins, epoxy resins, urethane resins, alkyd resins, spiroacetal resins, polybutadiene resins, polythiol polyene resins, etc. It can be used as an ionizing radiation curable resin.

The ionizing radiation curable resin is used in combination with a solvent-drying resin (a thermoplastic resin or the like, which is a resin that forms a film only by drying the solvent added to adjust the solid content during coating). You can also. By using the solvent-drying resin in combination, film defects on the coating surface of the coating liquid can be effectively prevented when the conductive layer is formed.
The solvent-drying resin that can be used in combination with the ionizing radiation curable resin is not particularly limited, and a thermoplastic resin can be generally used.
The thermoplastic resin is not particularly limited. For example, a styrene resin, a (meth) acrylic resin, a vinyl acetate resin, a vinyl ether resin, a halogen-containing resin, an alicyclic olefin resin, a polycarbonate resin, or a polyester resin. Examples thereof include resins, polyamide-based resins, cellulose derivatives, silicone-based resins, rubbers, and elastomers. The thermoplastic resin is preferably amorphous and soluble in an organic solvent (particularly a common solvent capable of dissolving a plurality of polymers and curable compounds). In particular, from the viewpoint of transparency and weather resistance, styrene resins, (meth) acrylic resins, alicyclic olefin resins, polyester resins, cellulose derivatives (cellulose esters, etc.) and the like are preferable.

The conductive layer may contain a thermosetting resin.
The thermosetting resin is not particularly limited. For example, phenol resin, urea resin, diallyl phthalate resin, melamine resin, guanamine resin, unsaturated polyester resin, polyurethane resin, epoxy resin, aminoalkyd resin, melamine-urea cocondensation Examples thereof include resins, silicon resins, polysiloxane resins, and the like.

The conductive layer containing the binder resin is, for example, coated on the base film described later, containing the conductive fibrous filler, the monomer component of the ionizing radiation curable resin, and the solvent. And it can form by hardening the coating film formed by drying by ionizing radiation irradiation etc.

Examples of the solvent contained in the conductive layer composition include alcohols (eg, methanol, ethanol, propanol, isopropanol, n-butanol, s-butanol, t-butanol, benzyl alcohol, PGME, ethylene glycol), ketones (Acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, etc.), ethers (dioxane, tetrahydrofuran, etc.), aliphatic hydrocarbons (hexane, etc.), alicyclic hydrocarbons (cyclohexane, etc.), aromatic hydrocarbons ( Toluene, xylene, etc.), halogenated carbons (dichloromethane, dichloroethane, etc.), esters (methyl acetate, ethyl acetate, butyl acetate, etc.), cellosolves (methyl cellosolve, ethyl cellosolve, etc.), cellosolve acetates, sulfoxide (Dimethyl sulfoxide), amides (dimethylformamide, dimethylacetamide, etc.) and the like can be exemplified, or a mixture thereof.

The conductive layer composition preferably further contains a photopolymerization initiator.
The photopolymerization initiator is not particularly limited, and known ones can be used. Specific examples include, for example, acetophenones, benzophenones, Michler benzoyl benzoate, α-amyloxime ester, thioxanthones, propio Examples include phenones, benzyls, benzoins, and acylphosphine oxides. Further, it is preferable to use a mixture of photosensitizers, and specific examples thereof include n-butylamine, triethylamine, poly-n-butylphosphine and the like.

As the photopolymerization initiator, when the resin component contained in the conductive layer composition is a resin system having a radical polymerizable unsaturated group, acetophenones, benzophenones, thioxanthones, benzoin, benzoin methyl ether, etc. Are preferably used alone or in combination. When the resin component is a resin system having a cationic polymerizable functional group, examples of the photopolymerization initiator include aromatic diazonium salts, aromatic sulfonium salts, aromatic iodonium salts, metallocene compounds, benzoin sulfonate esters, and the like. Are preferably used alone or as a mixture.

The content of the photopolymerization initiator in the conductive layer composition is preferably 0.5 to 10.0 parts by mass with respect to 100 parts by mass of the resin component. If the amount is less than 0.5 parts by mass, the hardness of the conductive layer to be formed may be insufficient. If the amount exceeds 10.0 parts by mass, there is a possibility that the curing may be hindered.

The content ratio (solid content) of the raw material in the conductive layer composition is not particularly limited, but it is usually preferably 5 to 70% by mass, particularly preferably 25 to 60% by mass.

According to the purpose of increasing the hardness of the conductive layer, suppressing curing shrinkage, controlling the refractive index, etc., a conventionally known dispersant, surfactant, antistatic agent, Silane coupling agent, thickener, anti-coloring agent, coloring agent (pigment, dye), antifoaming agent, leveling agent, flame retardant, UV absorber, adhesion-imparting agent, polymerization inhibitor, antioxidant, surface modification An agent or the like may be added.
As the leveling agent, for example, silicone oil, fluorine-based surfactant and the like are preferable because the curable resin layer is prevented from having a Benard cell structure. When a resin composition containing a solvent is applied and dried, a surface tension difference or the like is generated between the coating film surface and the inner surface in the coating film, thereby causing many convections in the coating film. The structure generated by this convection is called a Benard cell structure, and causes problems such as the skin and coating defects in the conductive layer to be formed.

The method for preparing the composition for a conductive layer is not particularly limited as long as each component can be mixed uniformly. For example, the composition can be performed using a known apparatus such as a paint shaker, a bead mill, a kneader, or a mixer.

The method for applying the conductive layer composition on the base film is not particularly limited, and examples thereof include spin coating, dipping, spraying, die coating, bar coating, roll coater, meniscus coater, Known methods such as a flexographic printing method, a screen printing method, and a pea coater method can be exemplified.

In addition, as a method of irradiating ionizing radiation when curing the coating film after drying, for example, a light source such as an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc lamp, a black light fluorescent lamp, or a metal halide lamp is used. A method is mentioned.
Further, as the wavelength of ultraviolet rays, a wavelength range of 190 to 380 nm can be used. Specific examples of the electron beam source include various electron beam accelerators such as a cockcroft-wald type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type.

Moreover, when the said electroconductive layer contains the said binder resin, the thickness of the hardened | cured material of the said binder resin (henceforth a binder resin layer) in this electroconductive layer is less than the fiber diameter of the said electroconductive fibrous filler. Preferably there is. When the thickness of the binder resin layer is equal to or larger than the fiber diameter of the conductive fibrous filler, the amount of binder resin entering the contact of the conductive fibrous filler increases, and the conduction of the conductive layer deteriorates, and the target resistance value May not be obtained.
Specifically, the thickness of the binder resin layer is preferably 200 nm or less. When the thickness of the binder resin layer exceeds 200 nm, it is necessary to increase the fiber diameter of the conductive fibrous filler beyond a suitable range described later, so that the haze of the conductive laminate rises and the total light transmission is achieved. The rate may decrease and is optically unsuitable.
The thickness of the binder resin layer is more preferably 50 nm or less, and further preferably 30 nm or less.
On the other hand, when the conductive layer does not contain the binder resin, since the conductive layer is composed of a conductive fibrous filler, the cross section in the thickness direction does not have a portion where the conductive fibrous filler exists. A place is observed. Where the conductive fibrous filler is present, there may be a place where the conductive fibrous filler is laminated alone and two or more places where the conductive fibrous filler is laminated, but a place where the conductive fibrous filler is not present ( That is, when the thickness of the conductive layer is measured according to the following definition, the thickness of the conductive layer that does not contain the binder resin is usually the fiber of the conductive fibrous filler. It becomes less than the diameter.
The thickness of the conductive layer is, for example, an arbitrary 10 locations where the thickness is measured by observing the cross section of the conductive layer at 1000 to 500,000 times using an electron microscope such as SEM, STEM, or TEM. It can be obtained as an average value.

The conductive fibrous filler preferably has a fiber diameter of 200 nm or less and a fiber length of 1 μm or more.
When the fiber diameter exceeds 200 nm, the haze value of the electroconductive laminate to be produced may increase or the light transmission performance may be insufficient. A preferable lower limit of the fiber diameter of the conductive fibrous filler is 10 nm from the viewpoint of the conductivity of the conductive layer, and a more preferable range of the fiber diameter is 15 to 180 nm.
Moreover, when the fiber length of the conductive fibrous filler is less than 1 μm, a conductive layer having sufficient conductive performance may not be formed, and aggregation may occur, resulting in an increase in haze value or a decrease in light transmission performance. Therefore, the preferred upper limit of the fiber length is 500 μm, the more preferred range of the fiber length is 3 to 300 μm, and the more preferred range is 10 to 30 μm.
The fiber diameter and fiber length of the conductive fibrous filler are, for example, 1000 to 500,000 times using an electron microscope such as SEM, STEM, or TEM. It can obtain | require as an average value of 10 places measured.

Such a conductive fibrous filler is preferably at least one selected from the group consisting of conductive carbon fibers, metal fibers, and metal-coated synthetic fibers.
Examples of the conductive carbon fiber include vapor grown carbon fiber (VGCF), carbon nanotube, wire cup, and wire wall. These conductive carbon fibers can use 1 type (s) or 2 or more types.

As said metal fiber, the fiber produced by the wire-drawing method or the cutting method which extends stainless steel, iron, gold | metal | money, silver, aluminum, nickel, titanium etc. thinly and long can be used, for example. Such metal fiber can use 1 type (s) or 2 or more types.

Examples of the metal-coated synthetic fibers include fibers obtained by coating acrylic fibers with gold, silver, aluminum, nickel, titanium, and the like. One or more kinds of such metal-coated synthetic fibers can be used.

When the conductive layer contains the binder resin, the content of the conductive fibrous filler is preferably, for example, 20 to 3000 parts by mass with respect to 100 parts by mass of the binder resin. When the amount is less than 20 parts by mass, a conductive layer having sufficient conductivity may not be formed. When the amount exceeds 3000 parts by mass, the haze of the conductive laminate of the present invention increases or the light transmission performance is insufficient. It may become. Further, the amount of the binder resin entering the contact of the conductive fibrous filler is increased, so that the conductivity of the conductive layer is deteriorated, and the target resistance value may not be obtained in the conductive laminate of the present invention. The minimum with more preferable content of the said conductive fibrous filler is 50 mass parts, and a more preferable upper limit is 1000 mass parts.

When the conductive layer contains the binder resin, it is preferable that a part of the conductive fibrous filler protrudes from the surface of the conductive layer.
As will be described later, when the conductive laminate of the present invention is produced by a transfer method using a transfer film, the conductive layer is laminated so that the side surface of the conductive layer and the transfer target face each other, and pressure is applied. Since the conductive fibrous filler protrudes from the surface opposite to the release film side of the conductive layer (that is, the surface of the conductive layer pressed against the transfer target), the protruding conductive fibrous filler is As a result, the conductive laminate is transferred in a state where it is embedded in the transfer body, and the solvent resistance of the resulting conductive laminate is improved, and a conductive pattern can be suitably formed by etching or the like. In addition, the conductive laminate is excellent in scratch resistance.

When the conductive layer contains the binder resin, it is preferable that a part of the conductive fibrous filler protrudes in the range of 5 to 600 nm from the surface of the conductive layer. In the present invention, the vertical distance from the flat portion where the conductive fibrous filler on the surface of the conductive layer does not protrude to the tip of the protruding conductive fibrous filler is preferably 5 to 600 nm. If the vertical distance is less than 5 nm, the solvent resistance of the conductive laminate of the present invention may not be improved. If it exceeds 600 nm, the conductive fibrous filler may fall off from the conductive layer. A more preferable lower limit of the vertical distance is 10 nm, and a more preferable upper limit is 200 nm.
The vertical distance of the conductive fibrous filler protruding from the surface of the conductive layer is, for example, 1000 to 500,000 times using an electron microscope such as SEM, STEM, or TEM. And the vertical distance from the flat portion of the surface of the conductive layer to the tip of the conductive fibrous filler measured can be obtained as an average value of 10 locations.

In the conductive laminate of the present invention, in the conductive layer, the ratio of the conductive material elements constituting the conductive fibrous filler on the surface is 0.15 to 5.00 at% in terms of atomic composition percentage. If it is less than 0.15 at%, the conductivity of the conductive laminate of the present invention becomes insufficient, and the etching rate becomes low. When it exceeds 5.00 at%, the light transmittance of the conductive laminate of the present invention is lowered, and the scratch resistance is inferior. The preferable lower limit of the proportion of the conductive material element constituting the conductive fibrous filler present on the surface of the conductive layer is 0.20 at%, the preferable upper limit is 2.00 at%, and the more preferable lower limit is 0.30 at%, A more preferable upper limit is 1.00 at%.
In addition, the ratio of the conductive material element which comprises the conductive fibrous filler which exists in the surface of the said conductive layer can be measured on condition of the following using X-ray photoelectron spectroscopy.
Acceleration voltage: 15 kV
Emission current: 10mA
X-ray source: Al dual anode Measurement area: 300 × 700 μmφ
Measured from the surface to a depth of 10 nm n = average of 3 times Note that the conductive layer having such a surface is attributed to the conductive fibrous filler on the surface, resulting in solvent resistance and scratch resistance, and further low It is preferable that the concavo-convex shape is formed so that an extremely high light transmittance can be achieved with a haze value.

The method for producing the conductive laminate of the present invention is not particularly limited as long as it satisfies the above-described Martens hardness and atomic composition percentage, but preferably a transfer film having at least the above-mentioned conductive layer on a release film. And a method having a transfer step of transferring the conductive layer to a transfer target. The method for producing such a conductive laminate of the present invention is also one aspect of the present invention.
In the transfer step, a transfer film having at least a conductive layer on the release film is used.
The member to be transferred is not particularly limited as long as it is a member that can be provided with a conductive layer. For example, a substrate made of any material such as glass, resin, metal, ceramic, or the like, Examples include a formed layer to be transferred such as a resin layer and an adhesive layer.
Especially, it is preferable that it is a resin layer formed on the base film for providing transparent electrodes, such as displays, such as LCD, a touch panel, a solar cell, using the said electroconductive layer.
That is, the conductive laminate of the present invention preferably has a structure having the conductive layer on the resin layer.

The base film is not particularly limited. For example, polyester resin, acetate resin, polyethersulfone resin, polycarbonate resin, polyamide resin, polyimide resin, polyolefin resin, (meth) acrylic resin, Examples thereof include polyvinyl chloride resins, polyvinylidene chloride resins, polystyrene resins, polyvinyl alcohol resins, polyarylate resins, polyphenylene sulfide resins, and the like. Of these, polyester resins, polycarbonate resins, and polyolefin resins are preferably used.

In addition, examples of the base film include an amorphous olefin polymer (Cyclo-Olefin-Polymer: COP) film having an alicyclic structure. This is a base material in which a norbornene polymer, a monocyclic olefin polymer, a cyclic conjugated diene polymer, a vinyl alicyclic hydrocarbon polymer, and the like are used. Zeonoa (norbornene resin), Sumitrite Bakelite's Sumilite FS-1700, JSR's Arton (modified norbornene resin), Mitsui Chemicals' apell (cyclic olefin copolymer), Ticona's Topas (cyclic) Olefin copolymer), Optretz OZ-1000 series (alicyclic acrylic resin) manufactured by Hitachi Chemical.
Further, the FV series (low birefringence, low photoelastic modulus film) manufactured by Asahi Kasei Chemicals is also preferable as an alternative base material for triacetylcellulose.

The thickness of the base film is preferably 1 to 100 μm. When the thickness is less than 1 μm, the mechanical strength of the transferred material may be insufficient. When the thickness exceeds 100 μm, the flexibility of the conductive film may be insufficient. The more preferable lower limit of the thickness of the substrate film is 20 μm, the more preferable upper limit is 80 μm, the still more preferable lower limit is 40 μm, and the still more preferable upper limit is 60 μm.

The substrate film may have been subjected to etching treatment or undercoating treatment such as sputtering, corona discharge, ultraviolet irradiation, electron beam irradiation, chemical conversion, oxidation, etc. on the surface in advance. By performing these treatments in advance, the adhesion with the resin layer formed on the substrate film can be improved. Moreover, before forming a resin layer, the base film surface may be dust-removed and cleaned by solvent cleaning, ultrasonic cleaning, or the like as necessary.

Although it does not specifically limit as a release film of the said transfer film, For example, an untreated polyethylene terephthalate (PET) film is used suitably. An untreated PET film is excellent in releasability of the conductive layer when the conductive layer is transferred to the above-mentioned transfer target, and a film made of another material such as a surface-treated PET film or COP film. Can be obtained at a low price, and the manufacturing cost of the conductive laminate of the present invention can be prevented from rising.

As a method for transferring the conductive layer to the transferred body using the transfer film, the transfer film described above is laminated so that the side of the conductive layer is on the transferred body side, pressed, and then the release film is used. The method of making it peel is mentioned.

In the method for producing a conductive laminate of the present invention, the transfer object is preferably a resin layer as described above, and the resin layer is a resin having the same composition as that of the conductive layer composition described above. After forming the coating film using the layer composition, it is not completely cured but is made into an uncured coating film, and the conductive layer is transferred by the above-described method using the uncured coating film as a transfer target. It is preferable that the uncured coating film is completely cured by the treatment step.
As described above, in the conductive layer of the transfer film, part of the conductive fibrous filler may protrude from the surface opposite to the release film side, and the protruding conductive fibrous filler may be embedded in the transfer target. Preferably, the conductive fibrous filler can be embedded more suitably when the transfer target is an uncured coating film. In addition, as said conductive fibrous filler, the thing similar to the conductive fibrous filler demonstrated with the conductive laminated body of this invention mentioned above is mentioned.
In addition, although the electroconductive laminated body of this invention can be manufactured by transferring an electroconductive layer to a to-be-transferred body using the transfer film mentioned above, this transfer film is the release film side of the said electroconductive layer, for example. A coating resin layer may be formed on the opposite side of the conductive resin layer, and the conductive layer may be transferred by the transfer film together with the coating resin layer. In this case, the conductive layer has a structure transferred to the transfer medium via the coating resin layer. The coating resin layer is not particularly limited, and examples thereof include those made of the same material as the resin layer described above.
Here, in the conductive laminate of the present invention, the proportion of the conductive material elements constituting the conductive fibrous filler on the surface of the conductive layer (side opposite to the release film side) is 0 in atomic composition percentage. When the coating resin layer is formed, the atomic composition percentage on the side surface opposite to the conductive layer side of the coating resin layer is within the above range. In order to satisfy such a requirement for the atomic composition percentage, it is necessary that the thickness of the coating resin layer be as thin as about 1 to 200 nm, for example. Therefore, the electronic composition percentage on the surface of the conductive layer also limits the structure and surface state of the layer such as the coating resin layer laminated on the conductive layer.

Moreover, it is preferable that the manufacturing method of the electroconductive laminated body of this invention further has the process process of irradiating and / or heating with respect to this electroconductive layer, when the said electroconductive layer contains binder resin. In addition, when the said transfer film has the said coating resin layer, the said process process may perform ultraviolet irradiation and / or a heating with respect to the said electroconductive layer with the said coating resin layer. By performing the said process process, the electroconductivity of the electroconductive laminated body to manufacture can be made more excellent.
In addition, the said process process may be performed before the said transcription | transfer process, may be performed after the said transcription | transfer process, and may be further performed before peeling a release film in the said transcription | transfer process.
When irradiating with ultraviolet rays in the above treatment step, for example, it is preferable to use a known flash lamp because a conductive laminate having more excellent conductivity can be obtained. The light emitted from a flash lamp having a wavelength from UV to visible light can heat the surface of the conductive layer in a concentrated manner, so that the layer disposed below the conductive layer compared to a conventional heat source It is preferable because the heat effect on the substrate film and the like can be extremely reduced, that is, only the surface layer can be instantaneously heated.
Further, the conditions of ultraviolet irradiation are not particularly limited, but it is preferable to irradiate ultraviolet rays of about 50 to 3000 mJ.

Further, when heating is performed in the treatment step, the condition is preferably, for example, at a temperature of 110 to 150 ° C. for about 1 to 30 minutes.

The conductive laminate of the present invention thus produced can achieve both a low haze value and high transparency. Specifically, the conductive laminate preferably has a haze value of 5% or less and a total light transmittance of 80% or more. If the haze value exceeds 5% or the total light transmittance is less than 80%, the optical performance becomes insufficient. A preferable upper limit of the haze value is 1.5%, and a more preferable upper limit is 1.2%. The preferable lower limit of the total light transmittance is 88%, and the more preferable upper limit is 89%.
The haze value is the sum of the internal haze value and the surface haze value, and is a value measured according to JIS K-7136 (2000). As an instrument used for the measurement, a reflection / transmittance meter HM-150 (manufactured by Murakami Color Research Laboratory) can be mentioned.
The total light transmittance is a value measured according to JIS K-7361-1 (1997). As an instrument used for the measurement, a reflection / transmittance meter HM-150 (manufactured by Murakami Color Research Laboratory) can be mentioned.
Moreover, it is preferable that the haze value derived from the said conductive fibrous filler is 4% or less, More preferably, it is 1.5% or less, More preferably, it is 1.0% or less. The haze value derived from the conductive fibrous filler is a highly transparent adhesive transfer tape (Optically Clear Adhesive Tape :) on both surfaces of the same film as the conductive layer described above except that the conductive fibrous filler is not included. Sample 1 prepared by attaching HCA to sample 0 prepared by bonding to glass using OCA) and bonding the glass to both surfaces of the above-described conductive layer containing conductive fibrous filler using OCA. The haze measured for H was H1, and the haze obtained from H1-H0 was the haze value derived from the conductive fibrous filler.
The glass used for the measurement of the haze value derived from the conductive fibrous filler was 1.1 mm thick soda glass, and OCA was 3M OCA, 8146-2 (tape thickness 50 μm). Use.

In addition, the conductive laminate of the present invention is excellent in scratch resistance. For example, using a Gakushin Abrasion Tester, the surface of the conductive layer opposite to the transfer target side is reciprocated five times with a waste mounted on a 1 kg / 4 cm ² jig. It is preferable that no scratches or significant increase in resistance value is observed on the surface opposite to the transfer member.

In addition, the conductive laminate of the present invention can be used as a transparent electrode for a display such as a liquid crystal display (LCD) or a plasma display panel (PDP), a touch panel or a solar cell. A touch panel using such a conductive laminate of the present invention is also one aspect of the present invention.

Since the conductive laminate of the present invention has the above-described configuration, it has a very high light transmittance with a low haze value. For this reason, the conductive laminate of the present invention can be suitably used for displays such as liquid crystal displays (LCDs) and plasma display panels (PDPs), and transparent electrodes such as touch panels and solar cells. Particularly preferred.
Moreover, since the manufacturing method of the electroconductive laminated body of this invention consists of the structure mentioned above, the electroconductive laminated body which has a very high light transmittance with a low haze value can be manufactured suitably.

Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited to these examples and comparative examples.
In the text, “part” or “%” is based on mass unless otherwise specified.

(Example 1)
(Production of transfer film)
As a release film, a 50 μm thick polyester film (A4100, manufactured by Toyobo Co., Ltd.) was used, and the following composition for a conductive layer was applied to the untreated surface of the polyester film so as to be 10 mg / m ^2. After drying at 70 ° C. for 1 minute, UV irradiation was performed at UV 50 mJ to form a conductive layer, and a transfer film was produced.

(Preparation of composition for conductive layer)
Using ethylene glycol (EG) as the reducing agent and polyvinylpyrrolidone (PVP: PVP: average molecular weight 1.3 million, manufactured by Aldrich) as the shape control agent and protective colloid agent, the nucleation step and particle growth step shown below Were separated to form particles to prepare a silver nanowire dispersion liquid.

(Nucleation process)
While stirring 100 mL of the EG solution maintained at 160 ° C. in the reaction vessel, 2.0 mL of an EG solution of silver nitrate (silver nitrate concentration: 1.0 mol / L) was added at a constant flow rate over 1 minute.
Thereafter, the silver ions were reduced while being held at 160 ° C. for 10 minutes to form silver core particles. The reaction solution exhibited a yellow color derived from surface plasmon absorption of nano-sized silver fine particles, and it was confirmed that silver ions were reduced to form silver fine particles (nuclear particles).
Subsequently, 10.0 mL of an EG solution of PVP (PVP concentration: 3.0 × 10 ⁻¹ mol / L) was added at a constant flow rate over 10 minutes.

(Particle growth process)
The reaction liquid containing the core particles after the nucleation step was held at 160 ° C. with stirring, 100 mL of an EG solution of silver nitrate (silver nitrate concentration: 1.0 × 10 ⁻¹ mol / L), and PVP 100 mL of EG solution (PVP concentration: 3.0 × 10 ⁻¹ mol / L) was added over 120 minutes at a constant flow rate using the double jet method.
In this particle growth process, the reaction solution was collected every 30 minutes and confirmed with an electron microscope. As a result, the core particles formed in the nucleation process grew into a wire-like form over time. Formation of new fine particles in the process was not observed. About the silver nanowire finally obtained, the electron micrograph was image | photographed, the particle size of the major axis direction and the minor axis direction of 300 silver nanowire particle images was measured, and the arithmetic average was calculated | required. The average particle size in the minor axis direction was 100 nm, and the average length in the major axis direction was 40 μm.

(Demineralized water washing process)
After cooling the reaction liquid which completed the particle growth process to room temperature, while performing the desalting water washing process using the ultrafiltration membrane with a molecular weight cut off of 0.2 micrometer, the solvent was substituted to ethanol. Finally, the liquid volume was concentrated to 100 mL to prepare a silver nanowire EtOH dispersion.

PET-30 (manufactured by Nippon Kayaku Co., Ltd.), Irgacure 184 (manufactured by BASF) and a diluting solvent are added to the obtained silver nanowire EtOH dispersion, and the silver nanowire concentration is 0.1% by mass, PET-30 1% by mass and Irgacure 184 (5% of PET-30) were blended to prepare a composition for a conductive layer. In addition, 30 mass% of the dilution solvent was cyclohexanone.

(Preparation of transfer object)
As a base film, a 50 μm thick polyester film (A4100, manufactured by Toyobo Co., Ltd.) is used, and on the primer-treated surface of the polyester film, the hard coat layer composition having the following composition is dried to have a thickness of 2 μm. It was applied to form a coating film, and the coating film was dried at 70 ° C. for 1 minute to prepare a transfer body in which a hard coat layer was formed on a base film.
(Composition for hard coat layer)
KAYARAD PET-30 (Pentaerythritol triacrylate / pentaerythritol tetraacrylate mixture, manufactured by Nippon Kayaku Co., Ltd.)
30% by mass
Irgacure 184 (BASF) 1.5% by mass
MEK 50% by mass
Cyclohexanone 18.5% by mass

After lamination so that the surface of the obtained transfer film on which the conductive layer was formed and the hard coat layer of the transfer target were combined, ultraviolet light was irradiated (600 mJ) from the transfer film side in the state of being bonded. Note that the ultraviolet irradiation may be performed from the transfer target side.
Thereafter, the release film of the transfer film was peeled off to obtain a conductive laminate in which the conductive layer was transferred to the transfer target.

(Example 2)
In the production of the transfer film, a transfer film was produced in the same manner as in Example 1 except that the coating amount of the conductive layer composition was changed to 12 mg / m ^2, and then the produced transfer film was used. Except for this, a conductive film was obtained in the same manner as in Example 1.

(Example 3)
A diluting solvent was added to the silver nanowire EtOH dispersion obtained in Example 1, and blended so that the silver nanowire concentration was 0.1% by mass to prepare a composition 2 for a conductive layer. In addition, 30 mass% of the dilution solvent was cyclohexanone.
In the production of the transfer film, a transfer film was produced in the same manner as in Example 1 except that the conductive layer composition 2 was used and the coating amount was changed to 12 mg / m ^2. A conductive film was obtained in the same manner as in Example 1 except that it was used.

Example 4
In the production of the transfer film, a transfer film was produced in the same manner as in Example 1 except that the conductive layer composition 2 was used and the coating amount was changed to 15 mg / m ^2. A conductive film was obtained in the same manner as in Example 1 except that it was used.

(Example 5)
In the production of the transfer film, a transfer film was produced in the same manner as in Example 1 except that the conductive layer composition 2 was used and the coating amount was changed to 25 mg / m ^2. A conductive film was obtained in the same manner as in Example 1 except that it was used.

(Example 6)
In the production of the transfer film, a transfer film was produced in the same manner as in Example 1 except that the conductive layer composition 2 was used and the coating amount was changed to 50 mg / m ^2. A conductive film was obtained in the same manner as in Example 1 except that it was used.

(Example 7)
After releasing the release film of the transfer film produced in the same manner as in Example 3, ultraviolet rays were additionally irradiated (600 mJ) to obtain a conductive film.

(Example 8)
On the conductive layer of the transfer film produced in the same manner as in Example 3, a coating resin layer composition having the following composition was applied so that the thickness after drying was 100 nm, dried at 70 ° C. for 1 minute, and then irradiated with ultraviolet light. By irradiation (10 mJ), a coating resin layer was formed, and a transfer film was produced. Thereafter, a conductive film was obtained in the same manner as in Example 1 except that the produced transfer film was used.
(Composition for coating resin layer)
KAYARAD PET-30 (Pentaerythritol triacrylate / pentaerythritol tetraacrylate mixture, manufactured by Nippon Kayaku Co., Ltd.)
5% by mass
Irgacure 184 (BASF) 0.25% by mass
MEK 70% by mass
Cyclohexanone 24.75% by mass

(Comparative Example 1)
The transfer film produced in the same manner as in Example 1 was used as it was as a conductive film.

(Comparative Example 2)
On the conductive layer of the transfer film produced in the same manner as in Example 1, a coating resin layer composition having the same composition as in Example 8 was applied so that the thickness after drying was 30 nm. The coating resin layer was formed by irradiating with ultraviolet rays (600 mJ) after drying for minutes, and a conductive film was obtained.

(Comparative Example 3)
A conductive film was obtained in the same manner as in Comparative Example 2 except that the coating resin layer composition was applied so that the thickness after drying was 100 nm.

(Comparative Example 4)
A conductive film was obtained in the same manner as in Comparative Example 2 except that the coating resin layer composition was applied so that the thickness after drying was 5 μm.

(Comparative Example 5)
In the production of the transfer film, a transfer film was produced in the same manner as in Example 1 except that the coating amount of the composition 1 for conductive layer was changed to 75 mg / m ^2, and then the produced transfer film was used. A conductive film was obtained in the same manner as in Example 1 except that.

The following evaluation was performed about the conductive film obtained by the Example and the comparative example. The results are shown in Table 1.

(Total light transmittance)
The total light transmittance of the conductive film was measured by a method based on JIS K7105 using a haze meter (HM150) manufactured by Murakami Color Research Laboratory.

(Haze value)
The haze of the conductive film was measured by a method based on JIS K7105 using a haze meter (HM150) manufactured by Murakami Color Research Laboratory.

(Haze value derived from conductive fibrous filler)
As shown in Table 1, a highly transparent adhesive transfer tape (on both sides of the base material according to Experimental Example 1 produced in the same manner as the conductive layer according to the example except that the conductive fibrous filler was not included) Haze measured for sample 0 produced by bonding to glass using Optically Clear Adhesive Tape (OCA) was set to H0, and both sides of the conductive layer according to each example and comparative example were bonded to glass using OCA. The haze measured for the produced sample 1 was H1, and the haze obtained by H1-H0 was the haze value derived from the conductive fibrous filler.

(Sheet resistance value)
In accordance with JIS K7194: 1994 (Resistivity testing method for conductive plastics by the four-probe method), a Lorester GP (MCP-T610 type) manufactured by Mitsubishi Chemical Corporation is used to cover the conductive layer of each conductive film. The resistance value (sheet resistance) on the surface opposite to the transfer member side was measured.

(Percentage of conductive material elements)
The ratio of the conductive material element (Ag) on the surface opposite to the transfer target side of the conductive layer of each conductive film was measured in terms of atomic composition percentage using X-ray photoelectron spectroscopy under the following conditions. In addition, as described below, the measurement was performed with the measured value at a depth of 10 nm from the surface as the ratio of the surface conductive material element.
Acceleration voltage: 15 kV
Emission current: 10mA
X-ray source: Al dual anode Measurement area: 300 × 700 μmφ
Measure depth 10nm from the surface. Average value of n = 3 (arbitrary 3 locations)

(surface hardness)
The surface hardness of the conductive layer of each conductive film was measured under the following measurement conditions using a micro hardness tester (Picotender hardness measuring machine, manufactured by Fischer).
Maximum load: 40mN
Load application: 20s
Indentation amount from surface: measured at 1000 nm, 100 nm, 10 nm, average value of each measurement n = 5 (arbitrary 5 points each)

(Solvent resistance)
Using the Gakushoku Abrasion Tester, the solvent resistance of the surface of the conductive film on the side opposite to the transfer target side of the conductive layer was evaluated under the following conditions.
Prepare a waste with IPA and PMA in a waste mounted on a 1 kg / 4 cm ² jig, and each waste is opposite to the transfer target side of the conductive layer of each conductive film. The surface resistance value after 5 reciprocations on the side surface and the appearance were evaluated.
The evaluation length of 5 reciprocations was 50 mm, the rubbing speed was 100 mm / sec, and the appearance was visually confirmed by reflecting the surface with a fluorescent lamp.

(Abrasion resistance)
Using the Gakushoku Abrasion Tester, the scratch resistance of the surface of the conductive film opposite to the transfer target side of the conductive layer was evaluated under the following conditions.
The cloth mounted on a 1 kg / 4 cm ² jig was evaluated for sheet resistance and appearance after 5 reciprocations of the surface of the conductive layer on the opposite side of the conductive layer of each conductive film.
The evaluation length of 5 reciprocations was 50 mm, the rubbing speed was 100 mm / sec, and the appearance was visually confirmed by reflecting the surface with a fluorescent lamp.

(Etching aptitude)
Phosphoric acid acetic acid aqueous solution (SEA-5, manufactured by Kanto Chemical Co., Inc.) is heated to 35 ° C., the conductive film is immersed for 2 minutes, and the resistance value of the conductive layer on the side opposite to the transfer side is measured and wet. The etching suitability according to the conditions was confirmed.

(Bending test)
With each conductive layer coated surface obtained in the examples and comparative examples facing outside, the sheet resistance value after being wound around a φ4 mm metal rod was measured by the method described above, and the presence or absence of cracks was confirmed visually. did.

In Table 1, “Over Load” indicates that the resistance value is larger than the measurable range and cannot be measured.

As shown in Table 1, the conductive laminate according to the example is excellent in all light transmittance, haze, surface hardness, solvent resistance, scratch resistance and etching suitability, and the conductive layer has a binder resin. The conductive films according to Examples 3 to 6 and 8 that do not contain slab had lower resistance values than Examples 1 and 2 in which the conductive layer contained a binder resin. In addition, the conductive film which concerns on Example 8 is resistance value in a coating resin layer surface. Moreover, since the electroconductive film which concerns on Example 7 peels the release film of a transfer film and is performing additional ultraviolet irradiation, it is excellent in surface hardness compared with the electroconductive film which concerns on Example 3. It was.
On the other hand, since the conductive laminate according to Comparative Example 1 had a configuration in which a conductive layer was simply applied on a release film, the surface hardness, solvent resistance, and scratch resistance were inferior. In addition, the conductive laminates according to Comparative Example 2 and Comparative Example 3 in which the coating resin layer is provided on the conductive layer has a small proportion of the conductive material element constituting the conductive fibrous filler on the surface of the conductive layer, The conductive laminate according to Comparative Example 2 provided with the thin coating resin layer is inferior in surface hardness, solvent resistance and scratch resistance, and the conductive layer according to Comparative Example 3 provided with the thick coating resin layer. The conductive laminate was inferior in surface hardness and scratch resistance, and inferior in etching suitability. In addition, the conductive film according to Comparative Example 4 provided with an extremely thick coating resin layer was inferior in sheet resistance. Moreover, since the conductive film which concerns on the comparative example 5 had many application amounts of the composition for electroconductive layers, the total light transmittance was low and the value of haze (and haze (and conductive fiber filler origin haze)) was small.

The conductive laminate of the present invention is excellent in solvent resistance and scratch resistance, and has a very high light transmittance at a low haze value, such as a liquid crystal display (LCD), a plasma display panel (PDP), etc. It can be suitably used for a transparent electrode such as a display, a touch panel, or a solar cell, particularly for a transparent electrode of a touch panel.

Claims (16)

1. A conductive laminate having a conductive layer containing a conductive fibrous filler on the outermost surface,
   The Martens hardness is 150 to 3000 N / mm ^{2 when the} amount of indentation from the surface is 100 nm,
   The conductive laminate is characterized in that the ratio of the conductive material element constituting the conductive fibrous filler on the outermost surface of the conductive layer is 0.15 to 5.00 at% in terms of atomic composition percentage. .
2. The conductive laminate according to claim 1, wherein the total light transmittance is 80% or more and the haze is 5% or less.
3. The conductive layer has a binder resin and a conductive fibrous filler contained in the binder resin,
   The conductive laminate according to claim 1, wherein a part of the conductive fibrous filler protrudes from a surface on the outermost surface side of the conductive layer.
4. The conductive laminate according to claim 1, wherein the thickness of the conductive layer is less than the fiber diameter of the conductive fibrous filler.
5. The conductive laminate according to claim 1, 2, 3, or 4, wherein the conductive fibrous filler has a fiber diameter of 200 nm or less and a fiber length of 1 µm or more.
6. The conductive laminate according to claim 1, 2, 3, 4, or 5, wherein the conductive fibrous filler is at least one selected from the group consisting of conductive carbon fibers, metal fibers, and metal-coated synthetic fibers.
7. The conductive laminate according to claim 1, further comprising a conductive layer on the resin layer.
8. A touch panel comprising the conductive laminate according to claim 1, 2, 3, 4, 5, 6 or 7.
9. A method for producing a conductive laminate having a conductive layer containing a conductive fibrous filler on the outermost surface,
   A method for producing a conductive laminate, comprising a transfer step of transferring the conductive layer to a transfer target using a transfer film having at least the conductive layer on a release film.
10. The method for producing a conductive laminate according to claim 9, wherein the conductive film has a haze value of 5% or less and a total light transmittance of 80% or more.
11. The conductive layer in the transfer film has a binder resin and a conductive fibrous filler contained in the binder resin,
    The method for producing a conductive laminate according to claim 9 or 10, wherein a part of the conductive fibrous filler protrudes from the surface of the conductive layer opposite to the release film side.
12. The method for producing a conductive laminate according to claim 9, 10 or 11, wherein the thickness of the conductive layer is less than the fiber diameter of the conductive fibrous filler.
13. The method for producing a conductive laminate according to claim 9, 10, 11 or 12, wherein the conductive fibrous filler has a fiber diameter of 200 nm or less and a fiber length of 1 µm or more.
14. The conductive fibrous filler according to claim 9, 10, 11, 12, or 13, wherein the conductive fibrous filler is at least one selected from the group consisting of conductive carbon fibers, metal fibers, and metal-coated synthetic fibers. Method.
15. The method for producing a conductive laminate according to claim 9, further comprising a treatment step of irradiating and / or heating the conductive layer with ultraviolet rays.
16. The method for producing a conductive laminate according to claim 9, wherein the transfer object is a resin layer.