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WO2016006391A1 - Module avec composant électronique intégré - Google Patents

Module avec composant électronique intégré Download PDF

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Publication number
WO2016006391A1
WO2016006391A1 PCT/JP2015/067122 JP2015067122W WO2016006391A1 WO 2016006391 A1 WO2016006391 A1 WO 2016006391A1 JP 2015067122 W JP2015067122 W JP 2015067122W WO 2016006391 A1 WO2016006391 A1 WO 2016006391A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
substrate
module
gap
component built
Prior art date
Application number
PCT/JP2015/067122
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English (en)
Japanese (ja)
Inventor
良春 末守
小田　哲也
日口　真人
Original Assignee
株式会社村田製作所
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Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2016006391A1 publication Critical patent/WO2016006391A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to an electronic component built-in module, and more specifically, a gas (such as water vapor) generated from a liquid component (water or the like) contained in a sealing resin inside even when heated when soldering to a substrate or the like of an electronic device.
  • a gas such as water vapor
  • This is related to a module with a built-in electronic component that is less likely to cause an electrical short circuit or poor conduction due to ().
  • An electronic component built-in module having a structure in which a plurality of electronic components are mounted on a substrate and these electronic components are covered with a sealing resin is used in an electronic device or the like as a high-function module.
  • Solder flash is the solder used to join the land electrode on the board and the terminal electrode of the electronic component in the electronic component built-in module by heating when the electronic component built-in module is soldered to the board of the electronic device. It refers to the phenomenon of remelting and leaching into fine gaps, or further leaching of the solder to electrically short-circuit the terminal electrodes of the electronic component.
  • Patent Document 1 For example, in an electronic component built-in module (circuit board) disclosed in Japanese Patent Application Laid-Open No. 2011-165695 (Patent Document 1), by devising the shape of land electrodes (electrode pads) formed on the board, for example, By dividing the land electrode or the like, it is easy to fill the sealing resin between the substrate and the mounted electronic component, thereby preventing the occurrence of solder flash. That is, in the electronic component built-in module disclosed in Patent Document 1, the electronic component built-in module is mounted on a substrate of an electronic device or the like by densely filling a sealing resin around the mounted electronic component and generating no gap. Even if the solder is remelted by heating at the time of soldering, the terminal electrodes of the electronic component are not electrically short-circuited.
  • Patent Document 2 As another method, in the electronic component built-in module (semiconductor device) disclosed in Japanese Patent Laid-Open No. 2005-302835 (Patent Document 2), conversely, a sealing resin is provided between the substrate and the mounted electronic component. The solder flash is prevented by making the space without filling.
  • FIG. 8 shows an electronic component built-in module 500 disclosed in Patent Document 2.
  • the electronic component built-in module 500 includes a substrate 101.
  • a land electrode 102 is formed on the main surface of the substrate 101.
  • 104 is implemented. Specifically, the terminal electrode 103 a of the electronic component 103 and the flip chip electrode of the electronic component 104 are fixed to the land electrode 102 by a brazing material, for example, solder 105.
  • examples of the electronic component 103 in which the terminal electrodes 103a are formed at both ends of the component main body include a capacitor element, a coil element, and a resistance element.
  • examples of the electronic component 104 having a plurality of flip chip electrodes formed on the bottom surface of the component body include a surface acoustic wave device, a semiconductor device, and an integrated circuit device.
  • a resin film 106 is formed so as to cover the electronic components 103 and 104 mounted on the substrate 101.
  • a sealing resin 107 is formed on the resin film 106.
  • the sealing resin 107 is solidified or cured after being disposed on the film 106 in a semi-molten state. Since the sealing resin 107 has the film 106, the sealing resin 107 does not flow into the gap between the substrate 101 and the electronic components 103 and 104, and a space S1 is formed in the gap between the substrate 101 and the electronic components 103 and 104, respectively. Yes.
  • the sealing resin 107 is not filled between the substrate 101 and the mounted electronic components 103 and 104, and the space S1 is formed. Even when the solder 105 is remelted and expanded due to heating when soldering (not shown) or the like, the expansion of the volume can be absorbed in the space S1, so a solder flash occurs. It is difficult to do.
  • the electronic component built-in module 500 disclosed in Patent Document 2 is less likely to cause solder flash when the electronic component built-in module 500 is soldered to a substrate of an electronic device or the like.
  • FIG. 9A and 9B are cross-sectional views of the electronic component built-in module 500 in which the land electrode 102, the electronic components 103 and 104, the solder 105, and the film 106 are omitted. Therefore, only the substrate 101 and the sealing resin 107 are shown in FIG. 9A, and only the sealing resin 107 is shown in FIG. 9B. Note that FIG. 9B illustrates a cross section of a portion XX in FIG.
  • the sealing resin 107 is solidified or cured after being disposed on the film 106 in a semi-molten state.
  • the liquid component contained in the sealing resin 107 is sequentially dried from the outer surface side of the sealing resin 107, the liquid resin contained in the sealing resin 107 near the center portion or on the substrate 101 of the sealing resin 107. The liquid component tends to remain on the side in contact.
  • M1, M2, and M3 indicate portions where the liquid component remains in the sealing resin 107, and the residual concentration of the liquid component is higher in the order of M1, M2, and M3.
  • the electronic component built-in module 500 in which the liquid component remains in this way is heated to be soldered to a substrate (not shown) of an electronic device, it is included in the M1, M2, and M3 portions of the sealing resin 107.
  • the liquid component thus formed becomes gas (water vapor or the like) and expands in the direction indicated by the black arrow in FIGS. 9 (A) and 9 (B). That is, the gas expands in a direction perpendicular to the main surface of the substrate 101, but also expands in the direction parallel to the main surface of the substrate 101 from the vicinity of the central portion of the substrate 101 toward the outer edge of the substrate 101. .
  • the expansion of the gas may cause an electrical short circuit between the terminal electrodes 103a of the electronic component 103 or may cause a conduction failure between the terminal electrode 103a of the electronic component 103 and the land electrode 102. This will be described in more detail with reference to FIGS.
  • FIGS. 10A and 10B are cross-sectional views of the main part of the electronic component built-in module 500.
  • FIG. 10A shows a state before the electronic component built-in module 500 is soldered to a substrate (not shown) of an electronic device.
  • FIG. 10B shows a state where the electronic component built-in module 500 is heated for soldering.
  • an electronic component 103 in which terminal electrodes 103a are formed on both ends of a component main body is mounted on a substrate 101 using land electrodes 102.
  • the terminal electrode 103 a of the electronic component 103 is fixed to the land electrode 102 with the solder 105.
  • a resin film 106 is formed so as to cover the electronic component 103 mounted on the substrate 101.
  • a sealing resin 107 is formed on the resin film 106. Since the sealing resin 107 has the film 106, the sealing resin 107 does not flow into the gap between the substrate 101 and the electronic component 103, and a space S 1 is formed in the gap between the substrate 101 and the electronic component 103.
  • the solder 105 When the electronic component built-in module 500 is heated to be soldered to a substrate or the like of an electronic device, the solder 105 is remelted, and as shown in FIG. 10B, the liquid component contained in the sealing resin 107 is It becomes gas and expands in a direction parallel to the main surface of the substrate 101 indicated by the black arrow. Since the film 106 allows gas to pass therethrough, the gas may enter between the terminal electrode 103a of the electronic component 103 and the film 106 to push out the molten solder 105 (the right-side solder 105 in the figure) to form a space S2. It was.
  • the extruded solder 105 flows into the space S1 between the substrate 101 and the electronic component 103, and the opposite land electrode 102 (left land electrode 102 in the figure) and solder 105 (left solder 105 in the figure). There was a case where it reached. That is, there is a case where the terminal electrodes 103a of the electronic component 103 are electrically short-circuited.
  • the space S2 is formed, the melted solder 105 is pushed out, and the terminal electrode 103a of the electronic component 103 and the land electrode 102 may be poorly connected.
  • the electronic component built-in module 500 disclosed in Patent Document 2 is provided with a space S1 between the substrate 101 and the electronic component 103, so that a solder flash for soldering to a substrate or the like of an electronic device can be obtained.
  • the generation is suppressed, when the sealing resin 107 contains a liquid component, there is a possibility that an electrical short circuit or a conduction failure may occur inside.
  • the electronic component built-in module of the present invention includes a substrate, a land electrode formed on at least one main surface of the substrate, An electronic component having at least one pair of terminal electrodes, the terminal electrode being fixed to the land electrode by a brazing material, and an electronic component mounted on the main surface of the substrate and covering the electronic component on the main surface of the substrate A sealing resin, and a space is provided between the substrate and the electronic component, and at least one fixing portion between the land electrode made of the brazing material and the terminal electrode of the electronic component other than the fixing portion facing the space In the place, a gap is formed along the fixed portion.
  • the expanded gas can pass through the gap, so that the molten brazing material (solder or the like) is pushed out into the space between the substrate and the electronic component. There is no occurrence of electrical short circuit or conduction failure.
  • the terminal electrode of the electronic component is composed of, for example, cap-shaped terminal electrodes formed at both ends of the electronic component main body.
  • a cap-shaped terminal electrode there is no gap to allow gas to pass in the vicinity of the fixed portion between the land electrode and the terminal electrode by the brazing material, and when soldering the electronic component built-in module to the substrate of the electronic device, Since the brazing material is easily affected by the expanded gas and the brazing material is pushed out and an electrical short circuit or conduction failure is likely to occur inside, the effect of applying the present invention is great.
  • the electronic component and the substrate may be covered with a film, and the film may be covered with a sealing resin.
  • a space can be easily provided between the substrate and the electronic component.
  • the gap includes, for example, a gap formed between the substrate, the fixed portion, and the film.
  • gap consists of the clearance gap formed between the board
  • the gap is formed by making the width of the land electrode smaller than the width of the terminal electrode in the land electrode and the terminal electrode facing each other in the fixed portion.
  • the width of the land electrode and the width of the terminal electrode refer to the width of the land electrode and the width of the terminal electrode that appear when the fixed portion is cut in the width direction of the electronic component (for example, the cross section of FIG. 2). The width of the land electrode and the width of the terminal electrode appearing in the figure).
  • gap is formed of the groove
  • a plurality of methods may be used in combination as the above-described void formation method.
  • the gap along the fixed portion can be formed, for example, in a direction connecting the central portion of the substrate and the electronic component.
  • the direction in which the gas in the sealing resin expands can coincide with the direction in which the voids are formed, the gas can easily pass through the voids.
  • another electronic component having a plurality of flip chip electrodes formed on the bottom surface may be further flip-chip mounted on the main surface of the substrate.
  • Examples of such electronic components include a surface acoustic wave device, a semiconductor device, an integrated circuit device, and the like. In this case, the electronic component built-in module can be made more sophisticated.
  • the electronic component built-in module of the present invention can pass gas (water vapor or the like) through a gap along the fixed portion, when the electronic component built-in module is soldered to a substrate of an electronic device or the like, it is used as a sealing resin. Due to the gas generated from the contained liquid component (water or the like), the occurrence of electrical short circuit or poor conduction inside is suppressed.
  • FIG. 1 is an exploded plan view of the electronic component built-in module 100 according to the first embodiment.
  • FIG. 1 shows an internal state of the electronic component built-in module 100 from which the film 6 and the sealing resin 7 are removed. However, in FIG. 1, the positions of the gaps S formed by the film 6 are indicated by broken lines.
  • FIG. 2 is a cross-sectional view of a main part of the electronic component built-in module 100, and shows a YY portion of FIG.
  • FIGS. 3A and 3B are perspective views illustrating steps performed in an example of a method for manufacturing the electronic component built-in module 100.
  • FIG. 4 is a continuation of FIG. 3B, and is a perspective view showing a process performed in an example of a method for manufacturing the electronic component built-in module 100.
  • FIG. 1 is an exploded plan view of the electronic component built-in module 100 according to the first embodiment.
  • FIG. 1 shows an internal state of the electronic component built-in module 100 from which the film 6 and the sealing resin 7 are removed. However
  • FIG. 5 is a cross-sectional view of an essential part showing an electronic component built-in module 200 according to the second embodiment.
  • FIG. 6 is a cross-sectional view of an essential part showing an electronic component built-in module 300 according to the third embodiment.
  • FIG. 7 is a cross-sectional view of an essential part showing an electronic component built-in module 400 according to the fourth embodiment.
  • FIG. 8 is a cross-sectional view showing a conventional electronic component built-in module 500 disclosed in Patent Document 2.
  • FIGS. 9A and 9B are cross-sectional views showing a conventional electronic component built-in module 500, and FIG. 9B shows an XX portion of FIG. 9A.
  • FIGS. 9A and 9B are cross-sectional views showing a conventional electronic component built-in module 500, and FIG. 9B shows an XX portion of FIG. 9A.
  • FIGS. 9A and 9B are cross-sectional views showing a conventional electronic component built-in module 500, and FIG. 9B shows an XX portion of FIG
  • FIGS. 10A and 10B are cross-sectional views of main parts of a conventional electronic component built-in module 500, and FIG. 10A shows the electronic component built-in module 500 as an electronic device substrate (not shown). FIG. 10B shows a state in which the electronic component built-in module 500 is heated for soldering.
  • FIG. 1 and 2 each show an electronic component built-in module 100 according to the first embodiment.
  • 1 is an exploded plan view
  • FIG. 2 is a cross-sectional view.
  • FIG. 2 corresponds to the YY portion of FIG. 1 shows an internal state of the electronic component built-in module 100 from which the sealing resin 7 shown in FIG. 2 has been removed.
  • the position of the space S formed by the sealing resin 7 is indicated by a broken line.
  • the electronic component built-in module 100 includes a substrate 1.
  • the substrate 1 is made of, for example, resin or ceramic.
  • the substrate 1 may be formed in a multilayer structure.
  • substrate 1 may incorporate the electronic component inside.
  • the land electrode 2 is formed on the main surface of the substrate 1.
  • the material of the land electrode 2 is arbitrary, but, for example, copper, aluminum or the like is used.
  • wiring electrodes for connecting the land electrodes 2 and the like may be formed on the main surface of the substrate 1.
  • An electronic component 3 in which terminal electrodes 3a are formed on both ends of a component body using a land electrode 2, and an electronic component in which a plurality of flip chip electrodes (not shown) are formed on the bottom surface of the component body. 4 is implemented. Specifically, the terminal electrode 3 a of the electronic component 3 and the flip chip electrode of the electronic component 4 are fixed to the land electrode 2 by a brazing material, for example, solder 5.
  • a sealing resin 7 is formed so as to cover the electronic components 3 and 4 mounted on the substrate 1.
  • the material of the sealing resin 7 is arbitrary, for example, a curable resin such as an epoxy resin or a polyimide resin can be used.
  • a gap S which is an important component for the present invention, is formed by the gap formed between the substrate 1, the fixed portion of the land electrode 2 and the terminal electrode 3a by the solder 5, and the sealing resin 7. .
  • the gap S is formed along the fixed portion by the solder 5, so that the space around the fixed portion is in contact with the surrounding resin material together with the space provided between the substrate 1 and the electronic component 3. There are voids that do not.
  • the sealing resin 7 is a curable resin, it is cured after being placed on the electronic components 3 and 4 in a semi-molten state. A space (not shown) is formed in each gap between the substrate 1 and the electronic components 3 and 4.
  • the liquid component remains in the sealing resin or the sealing resin absorbs the liquid component. is there.
  • the electronic component built-in module 100 even if a liquid component remains in the sealing resin at the time of manufacture, or even if the sealing resin absorbs the liquid component during storage, the electronic device When soldering to a substrate or the like, no electrical short circuit or poor conduction occurs inside.
  • the completed electronic component built-in module is placed under high humidity for a certain period of time to absorb liquid components and then heated and soldered to the board.
  • the electronic component built-in module 100 according to the present embodiment does not cause an electrical short circuit or poor conduction inside even in such an inspection.
  • the electronic component built-in module 100 according to the first embodiment having the above-described structure can be manufactured through, for example, the steps shown in FIGS. 3 (A), 3 (B), and FIG.
  • a land electrode 2 is formed on a substrate 1.
  • the land electrode 2 can be formed, for example, by attaching a copper foil to the entire main surface of the substrate 1 and etching it into a desired shape.
  • an electronic component 3 having terminal electrodes 3a formed on both ends of the component body on the land electrode 2 is formed. Temporarily fix.
  • the electronic component 4 having a plurality of flip chip electrodes formed on the bottom surface of the component body is temporarily fixed on the land electrode 2 coated with cream solder 5 '.
  • the cream solder 5 ′ is heated to melt, and then cooled to solidify, whereby the terminal electrode 3 a of the electronic component 3 is fixed to the land electrode 2 by the solder 5.
  • the flip chip electrode of the electronic component 4 is fixed to the land electrode 2 with the solder 5.
  • the electronic component built-in module 100 is completed by covering the substrate 1 and the electronic components 3 and 4 mounted on the substrate 1 with the sealing resin 7.
  • the step of covering the electronic components 3 and 4 with the sealing resin 7 is performed by, for example, placing the semi-molten sealing resin 7 on the electronic components 3 and 4 when the sealing resin 7 is a curable resin.
  • the lower surface is deformed according to the shape of the electronic components 3 and 4 and the upper surface is flattened, and then the sealing resin 7 is cured by a method such as thermosetting or photocuring.
  • the gap S is formed in this step, but the temperature, melted state, etc. of the sealing resin 7 are adjusted, and the magnitude of the pressure for pressing the sealing resin 7 toward the substrate, the pressing speed, etc. are adjusted.
  • the gap S can be easily formed.
  • the gap S is formed by a gap formed between the substrate 1, a fixed portion between the land electrode 2 and the terminal electrode 3 a by the solder 5, and the sealing resin 7. .
  • the method for forming the void S is not limited to this method.
  • the gap S may be formed by making the width of the land electrode 2 and the terminal electrode 3a opposite to each other in the fixed portion smaller than the width of the terminal electrode 3a.
  • a groove may be formed on the main surface of the substrate 1 and the gap S may be formed by the groove.
  • FIG. 5 shows an electronic component built-in module 200 according to the second embodiment. However, FIG. 5 is a cross-sectional view of the main part of the electronic component built-in module 200.
  • the width of the land electrode 2 and the terminal electrode 3a facing each other in the fixed portion is slightly larger than the width of the terminal electrode 3a. (See FIG. 2).
  • the width W1 of the land electrode 2 is made smaller than the width W2 of the terminal electrode 3a.
  • the gap S can be easily formed between the substrate 1, the fixed portion of the land electrode 2 and the terminal electrode 3a by the solder 5, and the sealing resin 7. It has become.
  • FIG. 6 shows an electronic component built-in module 300 according to the third embodiment. However, FIG. 6 is a cross-sectional view of the main part of the electronic component built-in module 300.
  • a groove 1a is formed in advance on the main surface of the substrate 1, and the groove 1a is defined as a gap S.
  • FIG. 7 shows an electronic component built-in module 400 according to the fourth embodiment. However, FIG. 7 is a cross-sectional view of the main part of the electronic component built-in module 400.
  • the film 6 is formed so as to cover the electronic components 3 and 4 mounted on the substrate 1 according to the first embodiment.
  • gap S which is an important component for this invention is formed by the clearance gap formed between the board
  • FIG. . The gap S is formed along the fixed portion by the solder 5, so that the space around the fixed portion is in contact with the surrounding resin material together with the space provided between the substrate 1 and the electronic component 3. There are voids that do not.
  • a sealing resin 7 is formed on the film 6.
  • the film 6 of this embodiment allows gas to permeate.
  • the material of the film 6 is not ask
  • the film 6 may be a single layer or may have a laminated structure including a plurality of layers.
  • the film 6 is attached to the substrate 1 and the mounted electronic components 3 and 4 by a method capable of following a complicated surface shape, such as vacuum lamination, rubber press, or isostatic pressing, and is cured by heat or light. It is hardened by such a method.
  • the electronic component built-in module 400 includes the film 6, it is easy to form a space between the electronic components 3 and 4 and the substrate 1. Further, by adjusting the processing conditions when covering the film 6, the rigidity of the film 6 itself, and the pressure when the film 6 is applied, the substrate 1, the fixed portion between the land electrode 2 and the terminal electrode 3 a by the solder 5, The gap S can be easily formed between the film 6 and the film 6. Furthermore, also in the fourth embodiment, since the gap S is formed, it is not affected by the gas due to the liquid component contained in the sealing resin 7, and an electrical short circuit or conduction failure of the electronic component occurs. do not do.
  • the film 6 applied to the electronic component built-in module 400 according to the fourth embodiment can also be applied to the electronic component built-in modules 200 and 300 according to the second and third embodiments described above.
  • the gap S formed around the fixed portion of the solder 5 does not need to be provided at the connection portion between the terminal electrode 3a and the land electrode 2 at both ends of the electronic component 3, and is provided only on one terminal electrode side. It may be.
  • gap S does not need to be provided in the circumference
  • the gap S formed around the fixed portion of the solder 5 is provided for all the electronic components 3 mounted on the substrate 1. However, the gap S is not applied to a pattern having a large gap between the land electrodes.
  • 1 substrate, 2: land electrode, 3: electronic component (electronic component on which at least one pair of terminal electrodes 3a is formed), 3a: terminal electrode, 4: electronic component (a plurality of flip chip electrodes are formed on the bottom surface) Electronic component), 5: solder, 5 ′: cream solder, 6: film, 7: sealing resin, S: gap, 100, 200, 300, 400: module with built-in electronic component.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Le module avec composant électronique intégré de l'invention est équipé : d'un substrat (1) ; d'une électrode de pastille (2) ; d'un composant électronique (3) qui est équipé au moins d'une paire d'électrodes de borne (3a) ; et d'une résine de scellement (7). Un espace est agencé entre le substrat (1) et le composant électronique (3). Simultanément, dans au moins une portion fixation entre l'électrode de pastille (2) et les électrodes de borne (3a) du composant électronique (3) mettant en œuvre une soudure (métal d'apport de brasage) (5), est formé un vide (S) suivant cette portion fixation, en un endroit autre que la portion de fixation en vis-à-vis avec l'espace.
PCT/JP2015/067122 2014-07-09 2015-06-15 Module avec composant électronique intégré WO2016006391A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014141560 2014-07-09
JP2014-141560 2014-07-09

Publications (1)

Publication Number Publication Date
WO2016006391A1 true WO2016006391A1 (fr) 2016-01-14

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WO (1) WO2016006391A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006012943A (ja) * 2004-06-23 2006-01-12 Murata Mfg Co Ltd 電子装置、及び電子装置の製造方法
JP2006147747A (ja) * 2004-11-18 2006-06-08 Matsushita Electric Ind Co Ltd 電子部品内蔵モジュール
JP2013026234A (ja) * 2011-07-14 2013-02-04 Mitsubishi Electric Corp 半導体装置
JP2013251323A (ja) * 2012-05-30 2013-12-12 Kyocera Corp 電子部品
JP2014049816A (ja) * 2012-08-29 2014-03-17 Kyocera Corp 電子部品及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006012943A (ja) * 2004-06-23 2006-01-12 Murata Mfg Co Ltd 電子装置、及び電子装置の製造方法
JP2006147747A (ja) * 2004-11-18 2006-06-08 Matsushita Electric Ind Co Ltd 電子部品内蔵モジュール
JP2013026234A (ja) * 2011-07-14 2013-02-04 Mitsubishi Electric Corp 半導体装置
JP2013251323A (ja) * 2012-05-30 2013-12-12 Kyocera Corp 電子部品
JP2014049816A (ja) * 2012-08-29 2014-03-17 Kyocera Corp 電子部品及びその製造方法

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