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WO2016005965A1 - Systèmes et procédés améliorés pour l'écriture directe informatisée - Google Patents

Systèmes et procédés améliorés pour l'écriture directe informatisée Download PDF

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Publication number
WO2016005965A1
WO2016005965A1 PCT/IL2015/000032 IL2015000032W WO2016005965A1 WO 2016005965 A1 WO2016005965 A1 WO 2016005965A1 IL 2015000032 W IL2015000032 W IL 2015000032W WO 2016005965 A1 WO2016005965 A1 WO 2016005965A1
Authority
WO
WIPO (PCT)
Prior art keywords
patterned substrate
instruction database
printing instruction
imaging
direct writing
Prior art date
Application number
PCT/IL2015/000032
Other languages
English (en)
Inventor
Uri Gold
Ram Oron
Original Assignee
Orbotech Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd. filed Critical Orbotech Ltd.
Priority to KR1020167034521A priority Critical patent/KR102330565B1/ko
Priority to CN201580033534.7A priority patent/CN106574901B/zh
Publication of WO2016005965A1 publication Critical patent/WO2016005965A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0082—Digital printing on bodies of particular shapes

Definitions

  • the present invention relates to computerized direct writing generally.
  • the present invention seeks to provide an improved system and method for computerized direct writing.
  • An advantage of the system and method according to the invention is that it can produce improved printing accuracy over fiducial registration based methods as it can provide better accuracy per each element or group of elements, and the printing method can compensate for global and local distortions of the substrate.
  • a method for computerized direct optical writing on a patterned substrate including the steps of providing a printing instruction database containing precise instructions for printing on the patterned substrate, imaging the patterned substrate to provide a patterned substrate image, and employing a computer for referencing at least the printing instruction database and the patterned substrate image for instructing an optical writer to write on the patterned substrate in accordance with the precise instructions without carrying out fiducial registration between the printing instruction database and the patterned substrate during the time between the imaging and the instructing.
  • referencing at least the printing instruction database and the patterned substrate image for instructing an optical writer to write on the patterned substrate in accordance with the precise instructions also includes providing CAM data corresponding to the patterned substrate, computerized mutual overlaying of an imaged pattern of the patterned substrate and the CAM data corresponding to the patterned substrate, and utilizing information from the overlaying in providing the precise instructions.
  • utilizing information from the overlaying in providing the precise instructions includes utilizing the CAM data to modify the precise instructions contained in the printing instruction database. Additionally, the printing instruction database is used to modify the CAM data for use in the utilizing step.
  • the imaging is executed by an automated optical inspection subsystem.
  • the optical writer is a direct imaging subsystem.
  • a system for computerized direct optical writing on a patterned substrate including a printing instruction database containing precise instructions for printing on the patterned substrate, imaging functionality operable for imaging the patterned substrate to provide a patterned substrate image, and a computer operable for referencing at least the printing instruction database and the patterned substrate image and for instructing an optical writer to write on the patterned substrate in accordance with the precise instructions without carrying out fiducial registration between the printing instruction database and the patterned substrate during the time between the imaging and the instructing.
  • the computer is also operable for mutual overlaying of an imaged pattern of the patterned substrate and CAM data corresponding to the patterned substrate, and for utilizing information from the overlaying in providing the precise instructions.
  • the computer is also operable for employing the CAM data to modify the precise instructions contained in the printing instruction database.
  • the printing instruction database is used to modify the CAM data for use by the computer.
  • the imaging functionality is encapsulated in an automated optical inspection subsystem.
  • the optical writer is a direct imaging subsystem.
  • FIG. 1A is a simplified illustration of a system for computerized direct writing constructed and operative in accordance with one preferred embodiment of the present invention
  • FIG. IB is a simplified illustration of a system for computerized direct writing constructed and operative in accordance with another preferred embodiment of the present invention.
  • FIG. 2 is a simplified flow chart illustrating steps in the operation of the systems of Figs. 1A and IB;
  • FIG. 3 is a simplified flow chart illustrating optional additional steps in the operation of the systems of Figs. 1 A - 2;
  • FIG. 4A is a simplified block diagram illustration of one embodiment of part of the systems of Figs. lA - 3;
  • Fig. 4B is a simplified block diagram illustration of another embodiment of part of the systems of Figs. 1A - 3.
  • FIG. 1 A is a simplified illustration of a system for computerized direct writing constructed and operative in accordance with one preferred embodiment of the present invention.
  • the system preferably comprises a chassis 101 which is preferably mounted on a conventional optical table 102.
  • Chassis 101 defines a substrate support surface 104 onto which a patterned substrate 106 may be placed.
  • Substrate 106 may be, for example, a circuit board onto which a solder mask is to be printed.
  • a bridge 112 is arranged for linear motion relative to substrate support surface
  • a read/write assembly 116 is arranged for linear motion relative to bridge 112 along a second axis 118, perpendicular to first axis 114.
  • the system preferably also includes a control assembly 124, preferably including a computer 126 having a user interface 128.
  • Computer 126 preferably includes software modules operative to operate read/write assembly 116.
  • Control assembly 124 also preferably includes a printing instruction database
  • read/write assembly 116 preferably includes an automated optical inspection subsystem (AOI) 132 operable for imaging patterned substrate 106 to provide a patterned substrate image 134 of patterned substrate 106 to computer 126, and a direct imaging subsystem (DI) 136 including an optical writer operable for writing on patterned substrate 106.
  • AOI automated optical inspection subsystem
  • DI direct imaging subsystem
  • computer 126 is operable for referencing precise printing instructions stored in printing instruction database 130 and patterned substrate image 134, and for providing precise printing instructions 138 to DI 136 for writing on patterned substrate 106 without carrying out fiducial registration between the printing instruction database and patterned substrate 106 during the time between imaging patterned substrate 106 by AOI 132 and writing on patterned substrate 106 by DI 136.
  • Fig. IB is a simplified illustration of a system for computerized direct writing constructed and operative in accordance with another preferred embodiment of the present invention.
  • the system preferably comprises a motion chassis 201 which is preferably mounted on a lower stationary chassis 202 and is arranged for linear motion along an axis 203 defined with respect to lower stationary chassis 202.
  • Chassis 201 defines a substrate support surface 204 onto which a patterned substrate 206 may be placed.
  • Substrate 206 may be, for example, a circuit board onto which a solder mask is to be printed.
  • a stationary bridge 212 is preferably supported above motion chassis 201 and allows for linear movement of motion chassis 201 therebelow along axis 203.
  • the system preferably also includes a control assembly 224, preferably including a computer 226 and a printing instruction database 230 containing precise instructions for printing on patterned substrate 206.
  • a control assembly 224 preferably including a computer 226 and a printing instruction database 230 containing precise instructions for printing on patterned substrate 206.
  • bridge 212 preferably supports an automated optical inspection subsystem (AOI) 232 operable for imaging patterned substrate 206 to provide a patterned substrate image 234 of patterned substrate 206 to computer 226, and a direct imaging subsystem (DI) 236 including an optical writer operable for writing on patterned substrate 206.
  • AOI automated optical inspection subsystem
  • DI direct imaging subsystem
  • computer 226 is operable for referencing precise printing instructions stored in printing instruction database 230 and patterned substrate image 234, and for providing precise printing instructions 238 to DI 236 for writing on patterned substrate 206 without carrying out fiducial registration between the printing instruction database and patterned substrate 206 during the time between imaging patterned substrate 206 by AOI 232 and writing on patterned substrate 206 by DI 236.
  • Fig. IB provides for one dimensional movement of motion chassis 201 relative to stationary chassis 202
  • a system which provides for two-dimensional movement of motion chassis 201 relative to stationary chassis 202 may also be provided.
  • Fig. 2 is a simplified flow chart illustrating steps in the operation of the systems of Figs. 1A and IB.
  • a panel such as patterned substrates 106 and 206 of Figs. 1A & IB is initially loaded onto the system (250). Thereafter, the panel is preferably scanned (252) and is imaged (254). The acquired image is then preferably processed (256), such processing may include detection and characterization of individual elements or groups of elements. Such characterization may include size, location, shape, and type.
  • a printing instruction database is referenced to provide precise printing instructions which correlate to elements of the acquired image (258). Thereafter, the precise printing instructions are employed to directly write onto the panel (260).
  • the method illustrated in Fig. 2 comprises providing a printing instruction database containing precise instructions for printing on the patterned substrate, imaging the patterned substrate to provide a patterned substrate image, referencing the printing instruction database and the patterned substrate image for instructing an optical writer to write on the patterned substrate in accordance with the precise instructions without carrying out fiducial registration between the printing instruction database and the patterned substrate during the time between the imaging and the instructing.
  • Fig. 3 is a simplified flow chart illustrating optional additional steps in the operation of the systems of Figs. 1A - 2.
  • the referencing of the printing instruction database to provide precise printing instructions as described hereinabove with reference to Figs. 1A - 2 includes providing CAM data corresponding to the patterned substrate and computerized mutual overlaying of the patterned substrate image and the CAM data corresponding to the patterned substrate, and automatically employing information from the overlaying in providing the precise instructions.
  • the CAM data is preferably stored in the printing instruction database.
  • the step of providing precise printing instructions which correlate to elements of the acquired image (300) initially includes retrieving CAM data corresponding to the patterned substrate (302) and receiving processed image data of the substrate (304). Thereafter, the CAM data corresponding to the patterned substrate is overlaid onto the patterned substrate image (306) and information resulting from the overlaying is employed in providing the precise instructions (308). It is appreciated that information resulting from the overlaying may include, for example, pattern matching of patterns comprised in the CAM data and patterns appearing in the receiving processed image data of the substrate. As described hereinabove, it is a particular feature of the present invention that providing the precise instructions is performed without carrying out fiducial registration between the system and the patterned substrate during the time between the imaging and providing the precise instructions.
  • FIGs. 4A and 4B are simplified block diagram illustrations of two alternative embodiments of part of the systems of Figs. 1A - 3.
  • Fig. 4A illustrates a rule-based embodiment
  • Fig. 4B illustrates a CAM data and rule-based embodiment.
  • the elements illustrated in Figs 4A or in Fig. 4B are instrumental in executing step 258 of Fig. 2 in which a printing instruction database is referenced to provide precise printing instructions which correlate to elements of the acquired image.
  • the elements illustrated in Fig. 4B are instrumental in executing step 308 of Fig. 3, in which information resulting from overlaying CAM data corresponding to the patterned substrate onto the patterned substrate image is employed in providing the precise instructions.
  • the system preferably includes a plurality of rules 410 which govern the placement of any overlay component layer 404 over a corresponding base component layer 402. It is appreciated that rules 410 may be stored in a database, such as databases 130 and 230 of Figs. 1A and IB.
  • rules 410 may dictate an allowed variation in the placement angle between overlay component layer 404 and corresponding base component layer 402. Rules 410 may also govern mutual alignment of a multiplicity of overlay components in an overlay component layer 404, each of the multiplicity of overlay components corresponding to one of a multiplicity of base components in base component layer 402, the base components having a different mutual alignment.
  • a rule may establish that a frame of a predetermined width is printed around any square shape of size X x Y. Such a shape may correspond to a pad in a printed circuit board.
  • a rule may establish that mutually aligned frames of a predetermined width are printed around each one of a predetermined shaped array of square shapes of size X x Y. Such an array may correspond to an array of pads for mounting of a given circuit component on a PCB.
  • rules 410 may include compliance rules which govern the overlay component layer 404 and corresponding base component layer 402.
  • rules 410 may include rules regarding minimum dimensions of an overlay component of component layer 404 relative to a base component of base component layer 402. It is therefore appreciated that rules 410 are operative to modify the precise placement of overlay component layer 404 over a corresponding base component layer 402.
  • the CAM data 400 includes a plurality of pairs of design layers, each of the pairs preferably including a base component layer 402 and an overlay component layer 404 to be written onto a corresponding base component layer 402.
  • Base component layer 402 and the overlay component layer 404 may be of different types and may be designated for executing different functions on the resulting circuit board.
  • data encapsulated in CAM data 400 may dictate modification of rules 410.
  • data encapsulated in CAM data 400 may dictate minimum dimensions of an overlay component of component layer 404 relative to a base component of base component layer 402, and may thereby overrule at least one of rules 410.
  • the CAM data may be used for selecting or confirming correct selection of appropriate ones of rules 410.
  • An imaging subsystem 420 such as AOI subsystems 132 and 232 of Figs. 1A and Fig. IB is preferably provided for imaging patterned substrates such as patterned substrates 106 and 206 of Figs. 1A and IB.
  • patterned substrate image 422 such as patterned substrate images 134 and 234 of Figs. 1A and IB is acquired
  • contouring functionality 424 is preferably employed to provide a contoured image 426 of the patterned substrate image. This contouring process is described in U.S. Patent 7,181,059 of the Applicant.
  • Image overlapping functionality 428 is preferably provided for overlapping contoured image 426 over base component layer 402, thereby matching existing elements in contoured image 426 to corresponding elements in base component layer 402.
  • Image overlapping functionality 428 may employ well known geometric shape matching processes or methods described in U.S. Patent 7,388,978 of the Applicant.
  • Functional tagging functionality 430 is preferably provided for functional tagging of elements of base component layer 402.
  • a method of functional tagging is described in U.S. Patent 7,388,978 of the Applicant.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

L'invention concerne un procédé pour l'écriture optique directe informatisée sur un substrat à motifs, comprenant les étapes de fourniture d'une base de données d'instructions d'impression contenant des instructions précises pour l'impression sur le substrat à motifs, d'imagerie du substrat à motifs pour fournir une image de substrat à motifs, et de recours à un référencement par ordinateur d'au moins la base de données d'instructions d'impression et de l'image de substrat à motifs pour donner pour instruction à un lecteur optique d'écrire sur le substrat à motifs conformément aux instructions précises sans effectuer d'alignement de repère entre la base de données d'instructions d'impression et le substrat à motifs pendant le laps de temps entre l'imagerie et l'envoi d'instruction.
PCT/IL2015/000032 2014-07-08 2015-06-23 Systèmes et procédés améliorés pour l'écriture directe informatisée WO2016005965A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020167034521A KR102330565B1 (ko) 2014-07-08 2015-06-23 컴퓨터화된 직접 기록 시스템 및 방법
CN201580033534.7A CN106574901B (zh) 2014-07-08 2015-06-23 用于计算机化直写的改进系统和方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462021716P 2014-07-08 2014-07-08
US62/021,716 2014-07-08

Publications (1)

Publication Number Publication Date
WO2016005965A1 true WO2016005965A1 (fr) 2016-01-14

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ID=55063673

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2015/000032 WO2016005965A1 (fr) 2014-07-08 2015-06-23 Systèmes et procédés améliorés pour l'écriture directe informatisée

Country Status (4)

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KR (1) KR102330565B1 (fr)
CN (1) CN106574901B (fr)
TW (1) TWI660856B (fr)
WO (1) WO2016005965A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11935221B2 (en) 2019-11-27 2024-03-19 AT&S (Chongqing) Company Limited User interface for judgment concerning quality classification of displayed arrays of component carriers

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112590406B (zh) * 2020-10-31 2021-10-26 长沙雅冠新材料科技有限公司 自适应牌体激光印刷平台

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7218771B2 (en) * 1999-12-23 2007-05-15 Orbotech, Ltd. Cam reference for inspection of contour images
US7508515B2 (en) * 2002-05-02 2009-03-24 Orbotech Ltd System and method for manufacturing printed circuit boards employing non-uniformly modified images

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5465880B2 (ja) * 2005-11-18 2014-04-09 ケーエルエー−テンカー コーポレイション 検査データと組み合わせて設計データを使用するための方法及びシステム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7218771B2 (en) * 1999-12-23 2007-05-15 Orbotech, Ltd. Cam reference for inspection of contour images
US7508515B2 (en) * 2002-05-02 2009-03-24 Orbotech Ltd System and method for manufacturing printed circuit boards employing non-uniformly modified images

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11935221B2 (en) 2019-11-27 2024-03-19 AT&S (Chongqing) Company Limited User interface for judgment concerning quality classification of displayed arrays of component carriers

Also Published As

Publication number Publication date
KR102330565B1 (ko) 2021-11-26
TWI660856B (zh) 2019-06-01
KR20170030486A (ko) 2017-03-17
TW201617233A (zh) 2016-05-16
CN106574901B (zh) 2020-03-03
CN106574901A (zh) 2017-04-19

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