WO2016002865A1 - Two-part mixing-type adhesive agent - Google Patents
Two-part mixing-type adhesive agent Download PDFInfo
- Publication number
- WO2016002865A1 WO2016002865A1 PCT/JP2015/069079 JP2015069079W WO2016002865A1 WO 2016002865 A1 WO2016002865 A1 WO 2016002865A1 JP 2015069079 W JP2015069079 W JP 2015069079W WO 2016002865 A1 WO2016002865 A1 WO 2016002865A1
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- composition
- compound
- component mixed
- meth
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- 239000000853 adhesive Substances 0.000 title claims abstract description 146
- 239000000203 mixture Substances 0.000 claims abstract description 143
- 150000001875 compounds Chemical class 0.000 claims abstract description 136
- 238000010511 deprotection reaction Methods 0.000 claims abstract description 51
- 125000006239 protecting group Chemical group 0.000 claims abstract description 44
- 125000000524 functional group Chemical group 0.000 claims abstract description 19
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 18
- 150000004985 diamines Chemical class 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims description 143
- 229920000642 polymer Polymers 0.000 claims description 78
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 59
- 239000002245 particle Substances 0.000 claims description 38
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 27
- 238000002156 mixing Methods 0.000 claims description 19
- 239000011258 core-shell material Substances 0.000 claims description 12
- 125000002723 alicyclic group Chemical group 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 125000004427 diamine group Chemical group 0.000 claims 1
- -1 polypropylene Polymers 0.000 description 31
- 238000002360 preparation method Methods 0.000 description 28
- 239000012790 adhesive layer Substances 0.000 description 27
- 230000001965 increasing effect Effects 0.000 description 21
- 238000006116 polymerization reaction Methods 0.000 description 21
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- 125000005842 heteroatom Chemical group 0.000 description 17
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- 230000000052 comparative effect Effects 0.000 description 14
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- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 12
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- 238000003860 storage Methods 0.000 description 11
- 230000003993 interaction Effects 0.000 description 9
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 8
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- 238000005259 measurement Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
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- 239000004215 Carbon black (E152) Substances 0.000 description 2
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- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000005700 Putrescine Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
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- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
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- 125000003368 amide group Chemical group 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
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- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
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- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
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- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- DLIJPAHLBJIQHE-UHFFFAOYSA-N butylphosphane Chemical compound CCCCP DLIJPAHLBJIQHE-UHFFFAOYSA-N 0.000 description 1
- 125000000480 butynyl group Chemical group [*]C#CC([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- SEKCXMNFUDONGJ-UHFFFAOYSA-L copper;2-ethylhexanoate Chemical compound [Cu+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O SEKCXMNFUDONGJ-UHFFFAOYSA-L 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 150000005676 cyclic carbonates Chemical group 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- UYAUGHKQCCCFDK-UHFFFAOYSA-N cyclohexane-1,3,5-triamine Chemical compound NC1CC(N)CC(N)C1 UYAUGHKQCCCFDK-UHFFFAOYSA-N 0.000 description 1
- NISGSNTVMOOSJQ-UHFFFAOYSA-N cyclopentanamine Chemical compound NC1CCCC1 NISGSNTVMOOSJQ-UHFFFAOYSA-N 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- PTLIZOFGXLGHSY-UHFFFAOYSA-N dibutylphosphane Chemical compound CCCCPCCCC PTLIZOFGXLGHSY-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- LJSQFQKUNVCTIA-UHFFFAOYSA-N diethyl sulfide Chemical compound CCSCC LJSQFQKUNVCTIA-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- VZZJVOCVAZHETD-UHFFFAOYSA-N diethylphosphane Chemical compound CCPCC VZZJVOCVAZHETD-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 150000004662 dithiols Chemical class 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- GLVVKKSPKXTQRB-UHFFFAOYSA-N ethenyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC=C GLVVKKSPKXTQRB-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- JLHMVTORNNQCRM-UHFFFAOYSA-N ethylphosphine Chemical compound CCP JLHMVTORNNQCRM-UHFFFAOYSA-N 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000004820 halides Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- DMQSHEKGGUOYJS-UHFFFAOYSA-N n,n,n',n'-tetramethylpropane-1,3-diamine Chemical compound CN(C)CCCN(C)C DMQSHEKGGUOYJS-UHFFFAOYSA-N 0.000 description 1
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- FUUUBHCENZGYJA-UHFFFAOYSA-N n-cyclopentylcyclopentanamine Chemical compound C1CCCC1NC1CCCC1 FUUUBHCENZGYJA-UHFFFAOYSA-N 0.000 description 1
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- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 1
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 1
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- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 1
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
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- 239000005011 phenolic resin Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920003251 poly(α-methylstyrene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 description 1
- PZZICILSCNDOKK-UHFFFAOYSA-N propane-1,2,3-triamine Chemical compound NCC(N)CN PZZICILSCNDOKK-UHFFFAOYSA-N 0.000 description 1
- ZNZJJSYHZBXQSM-UHFFFAOYSA-N propane-2,2-diamine Chemical compound CC(C)(N)N ZNZJJSYHZBXQSM-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007660 shear property test Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920006132 styrene block copolymer Polymers 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- PZTAGFCBNDBBFZ-UHFFFAOYSA-N tert-butyl 2-(hydroxymethyl)piperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCCCC1CO PZTAGFCBNDBBFZ-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- RAOIDOHSFRTOEL-UHFFFAOYSA-N tetrahydrothiophene Chemical compound C1CCSC1 RAOIDOHSFRTOEL-UHFFFAOYSA-N 0.000 description 1
- 125000002813 thiocarbonyl group Chemical group *C(*)=S 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- CMHHITPYCHHOGT-UHFFFAOYSA-N tributylborane Chemical compound CCCCB(CCCC)CCCC CMHHITPYCHHOGT-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- ZMPKTELQGVLZTD-UHFFFAOYSA-N tripropylborane Chemical compound CCCB(CCC)CCC ZMPKTELQGVLZTD-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Definitions
- the present invention relates to a two-component mixed adhesive.
- an adhesive using an organoborane complex has been studied as a material capable of adhering such a difficult-to-adhere material (see Japanese Patent Publication No. 11-512123 and International Publication No. 2012/160452).
- this adhesive one composition contains a group derived from an organoborane and a complex having the protecting group, and the other composition contains a compound that acts on the protecting group to liberate the organoborane. It is.
- the organoborane having radical polymerization initiating ability is liberated, and the adhesive component can be cured and bonded.
- radicals generated from the liberated organoborane and oxygen molecules can modify the surface of difficult-to-adhere materials such as polypropylene, so that excellent adhesion can be achieved without plasma treatment or the like.
- the present invention has been made based on the circumstances as described above, and an object thereof is to provide a two-component mixed adhesive that is excellent in adhesive strength, curing rate, hot strength, and dripping suppression.
- composition (I) a first composition
- composition (II) a second composition
- a two-component mixed adhesive wherein the composition (I) contains a complex having a group derived from an organoborane and a protecting group thereof (hereinafter also referred to as “[A] complex”), and the composition (II) Contains a compound that undergoes a deprotection reaction with the protecting group (hereinafter also referred to as “[D] compound”), and the deprotection reaction product produced by the deprotection reaction between the protecting group and the [D] compound has a polymerizable property. It is characterized by having.
- the two-component mixed adhesive includes the composition (I) containing the [A] complex and the composition (II) containing the [D] compound, so that the adhesive strength, the curing rate, the hot strength, Excellent sag control.
- the reason why the two-component mixed adhesive has the above-described configuration and thus achieves the above effect is not necessarily clear, but can be inferred as follows, for example. That is, when the protecting group of the [A] complex and the [D] compound undergo a deprotection reaction, the released organoborane and the polymerization site in the deprotection reaction product are located closer to each other, resulting in more effective polymerization. It is considered that the curing rate is improved.
- the adhesive layer formed by polymerization contains a group generated by the deprotection reaction, so that the strength is further improved and the interaction with the adherend is increased. It is considered that the hot strength is improved. Furthermore, it is considered that thixotropy is increased and liquid dripping suppression is improved due to the fact that moderate interaction is exerted between groups generated by the deprotection reaction.
- the protecting group of the complex is preferably derived from a compound having two or more functional groups.
- the deprotection reaction product formed from the protective group of [A] complex and the [D] compound by making the compound derived from the protective group of [A] complex have two or more functional groups.
- the curing rate is further improved, and since the resulting polymer has a three-dimensional cross-linked structure, the adhesive strength and the hot strength can be further improved.
- Diamine is preferable as the compound derived from the protecting group.
- the speed of the deprotection reaction is increased and the curing rate is further improved, and the group formed by the deprotection reaction exhibits a hydrogen bond.
- the strength of the adhesive layer and the interaction with the adherend can be further increased, and the adhesive strength and the hot strength are further improved.
- a hydrogen bond can be appropriately formed between groups generated by the deprotection reaction, the dripping suppression property can be further improved.
- the [D] compound is preferably a (meth) acrylate having an isocyanate group.
- the deprotection reaction rate and the polymerization rate are further increased, the curing rate is further improved, and the groups formed by the deprotection reaction are increased.
- the adhesive strength, the hot strength, and the dripping suppression property can be further improved.
- the molar ratio of the isocyanate group to the diamine is preferably 1 or more and 3 or less.
- the composition (I), the composition (II) or both further contain a (meth) acrylate or polymer component having no isocyanate group.
- the composition (I) and / or the composition (II) contains a (meth) acrylate or polymer component having no isocyanate group, the two-component mixed adhesive has the strength of the adhesive layer. Further, the adhesive strength and the hot strength are further improved, and the initial adhesive strength can be improved and the curing shrinkage can be suppressed.
- the (meth) acrylate having no isocyanate group preferably has an alicyclic ring. As described above, the (meth) acrylate having no isocyanate group has an alicyclic ring, whereby the two-component mixed adhesive can further improve the hot strength.
- polymer particles are contained as the polymer component.
- the two-component mixed adhesive can further improve the flexibility of the adhesive layer.
- the content of the polymer particles in the polymer component is preferably 10% by mass or more and 50% by mass or less.
- the two-component mixed adhesive can increase both the flexibility and the adhesive strength of the adhesive layer.
- the polymer particles preferably have a core-shell structure.
- the two-component mixed adhesive can further improve the flexibility of the adhesive layer.
- the “core-shell structure” refers to a structure having a core part serving as a nucleus and a shell part covering the core part. However, it is not necessary that the core part is entirely covered with the shell part.
- the molar ratio of the protecting group to the group derived from organoborane in the complex is preferably 1 or more and 8 or less.
- the storage stability of the two-component mixed adhesive can be improved by setting the molar ratio of the protecting group to the group derived from the organoborane within the specific range.
- the thixotropy index is preferably 3 or more.
- the said 2 liquid mixture type adhesive can exhibit high dripping suppression property by making the value of TI into the said range.
- the “thixotropic index (TI)” refers to the ratio of the viscosity ( ⁇ 5 ) measured at 5 rpm to the viscosity ( ⁇ 50 ) measured at 50 rpm.
- the two-component mixed adhesive of the present invention high adhesive strength and hot strength can be obtained at a high curing rate while suppressing dripping. Therefore, the two-component mixed adhesive can be suitably used for bonding various materials including difficult-to-adhere materials such as automobile outer plates.
- the two-component mixed adhesive includes a composition (I) and a composition (II).
- the two-component mixed adhesive includes the composition (I) containing the [A] complex and the composition (II) containing the [D] compound, so that the adhesive strength, the curing rate, the hot strength, Excellent sag control.
- the composition (I) and the composition (II) are mixed so that the [D] compound in the composition (II) is converted into the [A] in the composition (I).
- a reaction occurs with the protecting group constituting the complex, and as a result, a reaction product of organoborane and the protecting group with the [D] compound (hereinafter also referred to as “deprotection reaction product (p)”).
- This deprotection reaction product (p) has polymerizability, for example, it is polymerized using the produced organoborane as a polymerization initiator, and in addition, for example, a radical formed from the organoborane and the adherend. Bonding or the like is also formed, and adhesion proceeds.
- the two-component mixed adhesive can exhibit the above effects without requiring the inclusion of a curing accelerator such as an acid halide compound.
- a curing accelerator such as an acid halide compound.
- the reason why the two-component mixed adhesive has the above-described configuration provides the above-mentioned effect is not necessarily clear, but can be inferred as follows, for example. That is, when the protective group of the [A] complex and the [D] compound undergo a deprotection reaction, the liberated organoborane and the polymerization site in the deprotection reaction product become closer to each other, resulting in more effective polymerization. It is believed that the cure rate is improved.
- the adhesive layer formed by polymerization contains a group generated by the above deprotection reaction, so that the strength is further improved and the interaction with the adherend is increased, so the adhesive strength is improved.
- the hot strength is improved.
- thixotropy is increased and liquid dripping suppression is improved due to the fact that moderate interaction is exerted between groups generated by the deprotection reaction.
- the deprotection reaction product (p) is bonded to the adhesive layer by polymerization and taken in by adopting the above configuration, so that the bleed out from the adhesive layer is prevented. It is thought to be reduced.
- the two-component mixed adhesive further includes another composition that does not contain the [A] complex and the [D] compound, and is a mixture of three or more components.
- a mold adhesive may be used.
- composition (I) and the composition (II) will be described.
- Composition (I) contains a [A] complex.
- the composition (I) preferably contains a compound having one polymerizable group (hereinafter also referred to as “[B] polymerizable compound”) and / or a [C] polymer component.
- [B] polymerizable compound a compound having one polymerizable group
- [C] polymer component a compound having one polymerizable group
- other components other than the above-mentioned components [A] to [C] may be contained.
- each component will be described.
- the complex is a complex having a group derived from organoborane and a protecting group thereof.
- the complex is usually formed from an organoborane and a compound (a) capable of forming a protective group by coordination bonding to the organoborane and suppressing the polymerization initiation ability of the organoborane.
- Organoborane can form an [A] complex by interacting with one or more compounds (a).
- organoborane is a compound in which the hydrogen atom of borane is substituted with an organic group.
- An organic group refers to a group containing at least one carbon atom.
- Examples of the organoborane include compounds represented by the following formula (1).
- R 1 , R 2 and R 3 are monovalent organic groups having 1 to 20 carbon atoms.
- Examples of the monovalent organic group having 1 to 20 carbon atoms represented by R 1 , R 2 and R 3 include, for example, a monovalent hydrocarbon group having 1 to 20 carbon atoms, and the carbon-carbon gap of the hydrocarbon group. And a group ( ⁇ ) having a divalent heteroatom-containing group, a group in which part or all of the hydrogen atoms of the hydrocarbon group and the group ( ⁇ ) are substituted with a monovalent heteroatom-containing group, and the like.
- Examples of the monovalent hydrocarbon group having 1 to 20 carbon atoms include, for example, a monovalent chain hydrocarbon group having 1 to 20 carbon atoms, a monovalent alicyclic hydrocarbon group having 3 to 20 carbon atoms, Examples thereof include 6-20 monovalent aromatic hydrocarbon groups.
- Examples of the monovalent chain hydrocarbon group having 1 to 20 carbon atoms include alkyl groups such as a methyl group, an ethyl group, a propyl group, and a butyl group; An alkenyl group such as an ethenyl group, a propenyl group, a butenyl group; Examples thereof include alkynyl groups such as ethynyl group, propynyl group and butynyl group.
- Examples of the monovalent alicyclic hydrocarbon group having 3 to 20 carbon atoms include cycloalkyl groups such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, norbornyl group, adamantyl group, and tricyclodecyl group; And cycloalkenyl groups such as a cyclopentenyl group, a cyclohexenyl group, a norbornenyl group, and a tricyclodecenyl group.
- Examples of the monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms include aryl groups such as phenyl group, tolyl group, xylyl group, naphthyl group, and anthryl group; Examples thereof include aralkyl groups such as benzyl group, phenethyl group, and naphthylmethyl group.
- hetero atom contained in the monovalent and divalent heteroatom-containing group examples include an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, and a silicon atom.
- Examples of the divalent heteroatom-containing group include —O—, —CO—, —NR′—, —S—, —CS—, —SO—, —SO 2 —, —POR ′ 2 —, and —SiR. ' 2- , a group combining these and the like.
- R ′ is a monovalent hydrocarbon group having 1 to 10 carbon atoms.
- Examples of the monovalent heteroatom-containing group include —OH, —COOH, —NH 2 , —CN, —NO 2 , —SH and the like.
- the organoborane is preferably a compound in which R 1 to R 3 in the above formula (1) are hydrocarbon groups from the viewpoint of high polymerization initiating ability, stability, and availability, more preferably trialkylborane, Borane, triethylborane, tripropylborane and tributylborane are more preferred, and triethylborane is particularly preferred.
- Compound (a) is a compound that serves as a protective group for organoborane and can undergo a deprotection reaction with the [D] compound described below.
- Examples of the compound (a) include compounds having a functional group (hereinafter also referred to as “functional group (x)”).
- the functional group (x) is preferably a functional group containing a hetero atom from the viewpoint of both the ability to form a complex with an organoborane and the ease of deprotection reaction with the [D] compound.
- a functional group a nitrogen atom, an oxygen atom, a sulfur atom, a phosphorus atom etc. are mentioned, for example.
- the hetero atom is preferably an atom having an unshared electron pair from the viewpoint of further enhancing the ability to form a complex with an organoborane and the ease of the deprotection reaction with the [D] compound.
- Examples of the functional group containing the hetero atom include an amino group, a substituted amino group (a hydrogen atom of —NH 2 substituted with a hydrocarbon group), an imino group (—CH ⁇ N—), and the like.
- Examples of the functional group containing an oxygen atom include a hydroxy group and an ether group.
- Examples of the functional group containing a sulfur atom include a sulfanyl group and a thioether group.
- Examples of the functional group containing a phosphorus atom include a phosphino group, a substituted phosphino group (a hydrogen atom of —PH 2 substituted with a hydrocarbon group), and the like.
- Examples of compounds having an amino group include monoamines such as methylamine, ethylamine, propylamine, butylamine, aniline, and ethanolamine; 1,2-diaminoethane, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1 , 8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane, 1,12-diaminododecane, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 4,4′-diaminobenzophenone, 2,2-bis (4-aminophenyl) propane, 2- (3-aminophenyl) -2- (4
- Examples of the compound having a substituted amino group include dimethylamine, diethylamine, dipropylamine, dibutylamine, cyclopentylamine, cyclohexylamine, dicyclopentylamine, dicyclohexylamine, N, N′-dimethyl-1,3-diaminopropane, N , N, N ′, N′-tetramethyl-1,3-diaminopropane, diethanolamine and the like.
- Examples of the compound having an imino group include N-methylbutylaldimine.
- Examples of the compound having a hydroxy group include monoalcohols such as methanol and ethanol; Diols such as ethylene glycol, 1,4-butanediol, 1,2-cyclohexanediol; Examples include triols such as glycerin and trimethylolpropane.
- Examples of the compound having an ether group include diethyl ether, dibutyl ether, tetrahydrofuran and the like.
- Examples of the compound having a sulfanyl group include monothiols such as mercaptan and ethanethiol; And dithiols such as ethanedithiol and butanedithiol.
- Examples of the compound having a thioether group include diethyl thioether, dibutyl thioether, tetrahydrothiophene and the like.
- Examples of the compound having a phosphino group include monophosphines such as ethylphosphine and butylphosphine; Examples include diphosphinoethane and diphosphinobutane.
- Examples of the compound having a substituted phosphino group include diethyl phosphine and dibutyl phosphine.
- the number of functional groups (x) possessed by the compound (a) may be 1 or 2 or more, preferably 2 or more, more preferably 2 to 4 and even more preferably 2 or 3 Two are particularly preferred.
- a deprotection reaction product having a plurality of polymerization sites (A) and a protective group of the [A] complex formed from the compound (a) and a compound [D] As a result of the formation of p), the curing rate is further improved, and the resulting polymer has a three-dimensional crosslinked structure, so that the adhesive strength and the hot strength can be further improved.
- the functional group (x) those having a hetero atom to which at least one hydrogen atom is bonded are preferred from the viewpoint of facilitating the deprotection reaction between the protective group and the [D] compound.
- Examples of such a functional group (x) include an amino group, —NHR, hydroxy group, sulfanyl group, phosphino group, —PHR and the like.
- R is a monovalent hydrocarbon group.
- an amino group and —NHR are preferable, and an amino group is more preferable.
- the compound (a) is preferably an active hydrogen-containing compound having a hetero atom to which at least one hydrogen atom is bonded, from the viewpoint of facilitating the deprotection reaction between the protecting group and the [D] compound.
- the compound (a) is preferably a compound containing an amino group, more preferably a diamine and a triamine, from the viewpoint of further facilitating the deprotection reaction and further increasing the adhesive strength and hot strength.
- diamines having diaminoalkanes and ether bonds More preferred are diamines having diaminoalkanes and ether bonds, particularly preferred are diaminoalkanes having 2 to 4 carbon atoms and diamines having ether bonds having 6 to 12 carbon atoms, and 1,3-aminopropane and 4,7 , 10-trioxatridecane-1,13-diamine is most preferred.
- the lower limit of the molar ratio of the group derived from the compound (a) in the [A] complex to the group derived from the organoborane is preferably 0.5, more preferably 0.7, still more preferably 0.9, Is particularly preferred, 1.8 is more particularly preferred, 2.5 is even more particularly preferred, and 3.5 is most preferred.
- the upper limit of the molar ratio is preferably 8, more preferably 7, still more preferably 6, and particularly preferably 5.5.
- the lower limit of the molar ratio of the compound (a) to the organoborane used in the preparation of the composition (I) is preferably 0.5, more preferably 0.7, still more preferably 0.9, and particularly preferably 1. 1.8 is more particularly preferable, 2.5 is further particularly preferable, and 3.5 is most preferable.
- the upper limit of the molar ratio is preferably 8, more preferably 7, still more preferably 6, and particularly preferably 5.5.
- the lower limit of the content of the [A] complex in the composition (I) is 0.1 mass from the viewpoint of further improving the adhesive strength, curing rate, hot strength, and sag suppression of the two-component mixed adhesive.
- % Is preferable 0.5% by mass is more preferable, 1% by mass is further preferable, and 2% by mass is particularly preferable.
- the upper limit of the content is preferably 20% by mass, more preferably 10% by mass, further preferably 6% by mass, and particularly preferably 4% by mass from the viewpoint of easy handling of the two-component mixed adhesive.
- the polymerizable compound is a compound having one polymerizable group (provided that the compounds corresponding to the [C] polymer component and the [D] compound are excluded).
- the two-component mixed adhesive can improve the strength of the adhesive layer, and as a result, the adhesive strength and the hot strength can be further improved.
- Examples of the polymerizable group include carbon-carbon double bond-containing groups such as a vinyl group, allyl group, styryl group, and (meth) acryloyl group; carbon-carbon triple bond-containing groups such as ethynyl group and propargyl group. .
- a carbon-carbon double bond-containing group is preferable and a (meth) acrylolyl group is more preferable from the viewpoint of superior polymerizability.
- Examples of the polymerizable compound include olefins such as butene, pentene, hexene, octene, decene, and dodecene; Styrene compounds such as styrene, ⁇ -methylstyrene and methylstyrene; Vinyl carboxylates such as vinyl acetate, vinyl propionate and vinyl laurate; Halogenated olefins such as vinyl chloride and vinylidene chloride; Vinyl compounds such as methyl vinyl ketone and methyl vinyl ether; Alkyl (meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate; Cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate,
- (meth) acrylate is preferred from the viewpoint of superior polymerizability, and (meth) acrylate having no isocyanate group is more preferred.
- a heteroatom-containing (meth) acrylate is preferable, and tetrahydrofurfuryl (meth) acrylate is more preferable.
- alkyl (meth) acrylate is preferable, and 2-ethylhexyl (meth) acrylate is more preferable.
- (meth) acrylate having an alicyclic ring is preferable, cycloalkyl (meth) acrylate is more preferable, and tricyclodecyl (meth) acrylate is further preferable.
- One or two or more polymerizable compounds may be used.
- the lower limit of the content of the [B] polymerizable compound in the composition (I) is preferably 10% by mass, more preferably 30% by mass, 50 mass% is further more preferable, and 60 mass% is especially preferable.
- the upper limit of the said content 99 mass% is preferable, 95 mass% is more preferable, 90 mass% is further more preferable, 85 mass% is especially preferable.
- composition (I) preferably contains a [C] polymer component from the viewpoint of improving the initial adhesive strength and adjusting the viscosity of the two-component mixed adhesive, and suppressing the curing shrinkage of the adhesive layer.
- the polymer component is not particularly limited as long as it is a polymer, and examples thereof include polyolefin, polystyrene, styrene copolymer, poly (meth) acrylate, polydiene, acrylic copolymer, and thermoplastic elastomer. Further, ethylene-vinyl acetate copolymer, epoxy resin, phenol resin, silicone resin, polyester resin, urethane resin, and the like can be used. Furthermore, as a [C] polymer component, the copolymer containing the structure of these polymers can also be used suitably.
- polystyrene resin examples include polyethylene, polypropylene, and ethylene- ⁇ -olefin copolymers.
- polystyrene examples include polystyrene and poly ( ⁇ -methylstyrene).
- styrene copolymer examples include styrene-methyl methacrylate copolymer, styrene-acrylic acid copolymer, styrene-maleic anhydride copolymer, styrene-acrylonitrile copolymer, ABS (acrylonitrile-butadiene-styrene copolymer). Polymer) and the like.
- poly (meth) acrylate include polymethyl (meth) acrylate, polyethyl (meth) acrylate, polybutyl (meth) acrylate and the like.
- polydiene examples include polybutadiene and polyisoprene.
- acrylic copolymer examples include polymers having plural types of (meth) acrylic acid ester units, butyl (meth) acrylate-acrylonitrile copolymers, and the like.
- thermoplastic elastomer examples include SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butadiene-styrene block copolymer), SIS (styrene-isoprene-styrene block copolymer), and SEPS.
- conjugated diene copolymers such as (styrene-ethylene-propylene-styrene block copolymer), and hydrogenated products thereof.
- thermoplastic elastomers and poly (meth) acrylates are preferable, and thermoplastic elastomers are more preferable.
- the polymer component preferably has a polymerization site.
- the [C] polymer component and the deprotection reaction product (p), etc. are copolymerized.
- the polymerization site include a carbon-carbon double bond in the polymer main chain, a polymerizable group in the side chain or terminal of the polymer, and the like.
- the [C] polymer component having a polymerization site include an unhydrogenated product of a conjugated diene copolymer. Among these, SBS is preferable from the viewpoint of having a more appropriate viscosity.
- the polymer component may be a polymer particle or a polymer that does not form a particle.
- the composition (I) preferably contains polymer particles as the [C] polymer component. When the composition (I) contains polymer particles, the two-component mixed adhesive can further improve the flexibility of the adhesive layer.
- the composition (I) more preferably contains polymer particles and a polymer not forming particles as the [C] polymer component. When the composition (I) contains both the polymer particles and the polymer not forming the particles, the two-component mixed adhesive can further improve the flexibility of the adhesive layer.
- the polymer component forming the polymer particles is preferably a polyolefin, polystyrene, styrene copolymer, poly (meth) acrylate, polydiene acrylic copolymer, or a copolymer containing the structure of these polymers, and polystyrene.
- Poly (meth) acrylates, polydienes and copolymers comprising the structures of these polymers are more preferred.
- the lower limit of the average particle diameter of the polymer particles is preferably 0.005 ⁇ m, more preferably 0.01 ⁇ m, further preferably 0.05 ⁇ m, and particularly preferably 0.1 ⁇ m.
- the upper limit of the average particle diameter is preferably 1 ⁇ m, more preferably 0.8 ⁇ m, further preferably 0.6 ⁇ m, and particularly preferably 0.4 ⁇ m.
- polymer particles examples include single particles and particles having a core-shell structure (core-shell particles). Of these, core-shell particles are preferred.
- core-shell particles are preferred.
- the two-component mixed adhesive can further improve the flexibility of the adhesive layer. Examples of such commercially available core-shell particles include “Kane Ace M-511”, “M-521”, “M-570”, “M-711” of Kaneka Corporation, “FX602P” of JSR Corporation. ”,“ FX501 ”,“ Zeon F351 ”manufactured by Nippon Zeon Co., Ltd., and the like.
- the lower limit of the content of the polymer particles in the [C] polymer component is preferably 10% by mass, more preferably 15% by mass, and 20% by mass. Further preferred is 25% by mass.
- 70 mass% is preferable, 50 mass% is more preferable, 45 mass% is further more preferable, 40 mass% is especially preferable.
- the [C] polymer component not forming the particles styrene copolymer, poly (meth) acrylate, polydiene, thermoplastic elastomer, silicone resin, polyester resin and urethane resin are preferable, and thermoplastic elastomer is more preferable. SBS is more preferred.
- the lower limit of the content of the [C] polymer component in the composition (I) is preferably 1% by mass, more preferably 5% by mass, and 8% by mass. % Is more preferable, and 10% by mass is particularly preferable.
- As an upper limit of the said content 60 mass% is preferable, 45 mass% is more preferable, 35 mass% is further more preferable, 30 mass% is especially preferable.
- composition (I) may contain, for example, a crosslinkable compound, a plasticizer, an inorganic filler, a colorant, a polymerization inhibitor and the like as other components other than the above-described components [A] to [C]. These other components may contain 1 type (s) or 2 or more types, respectively.
- the crosslinkable compound is a compound having two or more polymerizable groups.
- a crosslinkable compound in the composition (I) By including a crosslinkable compound in the composition (I), the hot strength and the elongation percentage of the adhesive layer can be further increased.
- Examples of the polymerizable group possessed by the crosslinkable compound include those exemplified as the polymerizable group possessed by the above-mentioned [B] polymerizable compound.
- a (meth) acryloyl group is preferable from the viewpoint that the polymerization rate can be increased and the hot strength can be further increased.
- the number of polymerizable groups possessed by the crosslinkable compound is preferably 2 to 4, more preferably 2 or 3, and even more preferably 2 from the viewpoint of improving the hot strength.
- crosslinkable compounds examples include chain glycol crosslinkable compounds such as ethylene glycol di (meth) acrylate and triethylene glycol di (meth) acrylate; Alicyclic glycol-based crosslinkable compounds such as tricyclodecanediyl di (meth) acrylate; Trimethylolpropane-based crosslinkable compounds such as trimethylolpropane tri (meth) acrylate; Bisphenol crosslinkable compounds such as bisphenol A bis (polyethylene glycol (meth) acrylate); Imido isocyanurate crosslinkable compounds such as tri (N-hydroxyethyl) isocyanurate di (meth) acrylate; Urethane-based crosslinkable compounds such as compounds represented by the following formula (2); Examples thereof include terminal bismaleimide-modified polyimide crosslinkable compounds such as a compound represented by the following formula (3).
- chain glycol crosslinkable compounds such as ethylene glycol di (meth) acrylate and triethylene glycol di (meth) acrylate
- n is an integer of 1-20.
- R 4 and R 5 are each independently an alkylene group having 1 to 20 carbon atoms.
- Ar 1 is an arylene group having 6 to 20 carbon atoms.
- n is 2 or more, the plurality of R 4 may be the same or different, and the plurality of Ar 1 may be the same or different.
- crosslinkable compound an alicyclic glycol-based crosslinkable compound is preferable, and tricyclodecanediyl di (meth) acrylate is more preferable.
- the content of the crosslinkable compound in the composition (I) is 0.1% by mass from the viewpoint of further increasing the hot strength and the elongation rate of the adhesive layer.
- 0.5 mass% is more preferable, and 2 mass% is further more preferable.
- 20 mass% is preferable, 15 mass% is more preferable, 12 mass% is further more preferable, and 10 mass% is especially preferable.
- plasticizer examples include phthalic acid esters such as dibutyl phthalate, di (2-ethylhexyl) phthalate and butyl benzyl phthalate; non-aromatic dibasic acid esters such as dioctyl adipate and dioctyl sebacate; dipropylene glycol dibenzoate, tri Examples thereof include benzoic acid esters such as ethylene glycol dibenzoate.
- examples of the inorganic filler include alumina, silica, titanium dioxide and the like.
- Examples of the colorant include carbon black.
- the metal salt can be contained for adjusting the pot life of the two-component mixed adhesive.
- the metal salt include copper (II) bromide, copper (II) chloride, copper (II) 2-ethylhexanoate and the like.
- polymerization inhibitor examples include hydroquinone and hydroquinone monomethyl ether.
- Composition (II) contains a [D] compound.
- the composition (II) preferably contains the [B] polymerizable compound ”and / or the [C] polymer component, and may contain other components, like the composition (I). .
- each component will be described.
- the compound [D] is a compound that forms a deprotection reaction product (p) by deprotection reaction with the protecting group of the above-mentioned [A] complex, and the deprotection reaction product (p) has polymerizability.
- the two-component mixed adhesive by mixing the composition (I) and the composition (II), the [D] compound undergoes a deprotection reaction with the protecting group of the [A] complex.
- a deprotection reaction product (p) and an organoborane are produced, and the deprotection reaction product (p) is polymerized due to the polymerization initiation ability of the organoborane, whereby the adhesion proceeds.
- Examples of the [D] compound include a compound having a group capable of deprotecting with the above protecting group (hereinafter also referred to as “group (a)”) and a polymerizable group.
- the group (a) is not particularly limited as long as it can react with the protecting group.
- a cyclic group containing a hetero atom such as an epoxy group or a cyclic carbonate group; Examples include an acid halide group, an ester group, an amide group, an acid anhydride group, and a leaving group-containing group such as a carboxy group.
- the group (a) includes a vinyl group corresponding to a polymerizable group described later.
- a group having a heteroatom-containing multiple bond is preferable from the viewpoint of easier deprotection reaction and higher curing rate, and higher interaction between groups formed by the deprotection reaction, and adhesion.
- an isocyanate group and an isothiocyanate group are more preferable, and an isocyanate group is further preferable.
- polymeric group the group similar to what was illustrated as a polymeric group which the said [B] polymeric compound has, for example is mentioned.
- a (meth) acryloyl group is preferable from the viewpoints of high polymerizability and a higher curing rate.
- the number of groups (a) possessed by the [D] compound is preferably 1 to 3, more preferably 1 and 2, and even more preferably 1 from the viewpoint of facilitating the deprotection reaction.
- the number of polymerizable groups possessed by the compound is preferably 1 to 3, more preferably 1 and 2, more preferably 1 from the viewpoint of further increasing the polymerization rate of the deprotection reaction product (p) to be formed. preferable.
- the number of groups (a) is preferably 1 and 2, and the number of polymerizable groups is preferably 1 and 2, and the group (a) And the number of polymerizable groups is preferably 1.
- Isocyanatoalkyl (meth) acrylates such as isocyanatoethyl (meth) acrylate and isocyanatopropyl (meth) acrylate;
- (meth) acrylates having an isocyanate group such as an adduct of diisocyanate and hydroxyalkyl (meth) acrylate;
- alkenes having an isocyanate group such as isocyanatobutene, isocyanatopentene, and isocyanatohexene.
- Isothiocyanatoalkyl (meth) acrylates such as isothiocyanatoethyl (meth) acrylate and isothiocyanatopropyl (meth) acrylate; having an isothiocyanate group such as an adduct of diisothiocyanate and hydroxyalkyl (meth) acrylate ( (Meth) acrylate;
- Examples include alkene having an isothiocyanate group such as isothiocyanatobutene, isothiocyanatopentene, isothiocyanatohexene and the like.
- (meth) acrylate having an isocyanate group and (meth) acrylate having an isothiocyanate group are preferable, (meth) acrylate having an isocyanate group is more preferable, isocyanatoalkyl (meth) acrylate is further preferable, and isocyanate. Natoethyl (meth) acrylate is particularly preferred.
- the lower limit of the content of the [D] compound in the composition (II) is preferably 0.2% by mass, more preferably 1% by mass, further preferably 2% by mass, and particularly preferably 2.5% by mass.
- As an upper limit of the said content 40 mass% is preferable, 20 mass% is more preferable, 10 mass% is further more preferable, 7 mass% is especially preferable.
- the group (a) is an isocyanate group or an isothiocyanate group
- the group (x) is It is preferably an amino group, more preferably the group (a) is an isocyanate group and the group (x) is an amino group.
- the lower limit of the molar ratio of the group (a) to the protecting group is preferably 0.5, more preferably 0.7, still more preferably 1, and particularly preferably 1.5.
- the upper limit of the molar ratio is preferably 6, more preferably 4, more preferably 3, and particularly preferably 2.5.
- the lower limit of the molar ratio of the isocyanate group to the diamine is preferably 1, more preferably 1.3, and even more preferably 1.5 1.7 is particularly preferable.
- the upper limit of the molar ratio is preferably 3, more preferably 2.7, even more preferably 2.5, and particularly preferably 2.3.
- the lower limit of the thixotropy index (TI) of the two-component mixed adhesive is preferably 3 as a value immediately after mixing the composition (I) and the composition (II), more preferably 5, and further 6 preferable.
- the upper limit of the TI is preferably 10, more preferably 9, and even more preferably 8.
- the said 2 liquid mixture type adhesive can exhibit high dripping suppression property by making TI value between the said minimum and the said upper limit.
- the said TI value can be calculated
- composition (II) preferably contains [B] a polymerizable compound.
- the explanation about the polymerizable compound, the preferred one and the content thereof are the same as in the case of the composition (I).
- composition (II) preferably contains a [C] polymer component.
- [C] The explanation, preferred and content of the polymer component are the same as in the case of the composition (I).
- composition (II) may contain other components. About description, preferable thing, and content about another component, it is the same as that of the case of composition (I).
- the crosslinkable compound is preferably contained in the composition (II).
- the two-component mixed adhesive is prepared by, for example, preparing the composition (I) by mixing the [A] complex and, if necessary, the [B] polymerizable compound, the [C] polymer component, and other components, Separately, it can be obtained by preparing the composition (II) by mixing the [D] compound and, if necessary, the [B] polymerizable compound, the [C] polymer component and other components.
- the two-component mixed adhesive can be used by a known method. For example, during the bonding operation, the composition (I) and the composition (II) are mixed, and after the obtained mixture is applied to one of the adherends, the other adherend is brought into close contact with the applied mixture. Thus, it can be carried out by overlapping. Moreover, after apply
- the thickness of the adhesive layer formed between the two adherends is usually 0.01 mm to 5 mm, preferably 0.05 mm to 3 mm, more preferably 0.1 mm to 1 mm.
- composition (I) 97.5 g of the mixed solution (a) prepared above and 2.5 g of triethylborane-diaminopropane complex (TEB-DAP) as a complex [A] were placed in a plastic container and mixed to obtain a composition (I- 1) was prepared.
- TEB-DAP triethylborane-diaminopropane complex
- composition (II) 95.5 g of the prepared mixed solution (a) and 4.5 g of 2-isocyanatoethyl methacrylate (MOI) as the [D] compound were placed in a plastic container and mixed to obtain a composition (II-1) Was prepared.
- compositions (I) to (II-4) Preparation of two-component mixed adhesives (J-2) to (J-4)
- the composition (I) prepared in Example 1 was directly used as the compositions (I-2) to (I-4).
- the mass of MOI used / the mass of the mixed solution (a) used in the preparation of the composition (II-1) of Example 1 was 6.75 g / 93.25 g, 5.
- Compositions (II-2) to (II-4) were prepared in the same manner as in Example 1, except that the amount was 4 g / 94.6 g, 3.6 g / 96.4 g.
- Composition (II) was prepared as follows. A 300 mL separable flask equipped with a stirrer was charged with 20.0 g of SBS and 54.75 g of THFMA and stirred in an oil bath at 40 ° C. for 3 hours to completely dissolve SBS in THFMA. Next, 15.0 g of 2EHMA, 10.0 g of mono-2- (methacryloyloxy) ethyl maleate and 0.25 g of p-toluenesulfonyl chloride were added, and the mixture was further stirred for 1 hour and then degassed under reduced pressure for 2 hours. A composition (II-C) was obtained.
- [Measurement of shear strength] (Test piece preparation method) Prepare two adherends (each 2.5 cm long ⁇ 10 cm wide) and immediately before applying the adhesive, clean the surface with a paper wiper containing acetone (“Kimwipe” from Nippon Paper Crecia). Removed. Next, the composition (I) and the composition (II) were mixed by a bag mixing method. That is, in a polyethylene bag, the composition (I) and the composition (II) are respectively weighed so as to have a mass ratio of 1: 1, sealed, and mixed uniformly. Mix for 1 minute by rolling. Next, the corners of the bag were cut with scissors, and the mixed adhesive was uniformly applied to one 1.25 cm square portion of the adherend. In order to make the thickness of the adhesive constant, glass beads having a diameter of 0.25 mm were sandwiched, and the other adherend was stacked on top to prepare a test piece.
- T-peel strength (Test piece preparation method) Prepare two pieces of adherend processed by bending an adherend (ED steel plate) 2.5 cm long ⁇ 20 cm wide at 90 ° at 5 cm from one side, and applying an adhesive to each. Immediately before, surface dirt was removed with a paper wiper containing acetone (“Kimwipe” manufactured by Nippon Paper Crecia Co., Ltd.). Adhesives were mixed in the same manner as in the above-described shear test piece preparation method, and the mixed adhesive was uniformly applied to one long side portion of the adherend. In order to make the thickness of the adhesive constant, glass beads having a diameter of 0.25 mm were sandwiched, and the other adherend was stacked on top to prepare a test piece.
- T-type peel test method With respect to the prepared test piece, the T-shaped peel strength of the bonded portion was measured according to JIS-K6854-3 using a tensile tester (“Autograph AG5000B” manufactured by Shimadzu Corporation). The measurement conditions were as follows: temperature: 23 ° C., distance between chucks: 50 mm, test speed: 200 mm / min.
- the elongation at break of the cured product was measured using a tensile tester (“Autograph AG5000B” manufactured by Shimadzu Corporation). The measurement conditions were as follows: temperature: 23 ° C., distance between chucks: 30 mm, test speed: 100 mm / min. The elongation percentage of the adhesive layer was calculated from the moving distance of the chuck when the test piece broke.
- Table 1 (in the case of glass fiber reinforced polypropylene / glass fiber reinforced polypropylene (GFPP / GFPP)) and Table 2 show the relationship between curing time and adhesive strength for the two-component mixed adhesives of Example 1 and Comparative Example 1. (In the case of electrodeposited steel / electrodeposited steel (ED / ED)).
- the fracture modes indicate A: interface fracture, B: material fracture, B ′: material stretching, and C: cohesive fracture, respectively. “C> A” indicates that the fracture mode is complex, mainly cohesive fracture, and partially interfacial fracture).
- the subscripts A and B in the failure mode indicate the material in which the failure occurred.
- composition (I ′) Using a composition to which diaminopropane is added (composition (I ′)), the composition (I ′) and each composition (II) (compositions (II-1) and (II-C) are in a mass ratio)
- the measured values and calculated TI values are shown in Table 6 below.
- composition (I) [A] 2.5 g of TEB-DAP as a complex, 6B of THFMA and 17.5 g of 2EHMA as a [B] polymerizable compound, and 20.0 g of SBS as a [C] polymer component are mixed in a plastic container. To prepare a composition (I-5).
- composition (II) [B] 55.7 g of THFMA and 16.2 g of 2EHMA as polymerizable compounds, 18.6 g of SBS as a polymer component and 5.0 g of “Kaneace M-521” of Kaneka Corporation as core-shell particles, [D] A 4.5 g MOI compound was placed in a plastic container and mixed to prepare a composition (II-5).
- Example 6 to 11 Preparation of two-component mixed adhesives (J-6) to (J-11)
- a composition (I) and a composition (II) were prepared in the same manner as in Example 5 except that the components of the types and blending amounts shown in Table 7 below were used. “-” In Table 7 indicates that the corresponding component was not used.
- Table 7 shows the types and blending amounts of the components in the compositions (I) and (II) of the two-component mixed adhesive prepared in Examples 1 to 4 and Comparative Example 1.
- “* 1” in Comparative Example 1 indicates that 10.0 g of mono 2- (methacryloyloxy) ethyl maleate and 0.25 g of p-toluenesulfonyl chloride were blended.
- [C] the polymer component can be used in combination with the matrix component and the particle component to improve the T-shaped peel strength and the adhesive layer. It was shown that the flexibility of can be increased. Moreover, from the result of Table 8, according to the two-component mixed adhesive of the example, it was also shown that the shear strength and the T-shaped peel strength can be further improved by optimizing the blending amount of the [A] complex. .
- composition (I) [A] 2.5 g of TEB-DAP as a complex, 60.0 g of THFMA as a polymerizable compound and 17.5 g of tricyclodecyl methacrylate (TCDMA: “FA-513M” from Hitachi Chemical Co., Ltd.), [C] A composition (I-12) was prepared by placing 20.0 g of SBS as a polymer component in a plastic container and mixing them.
- composition (II) [B] THFMA 58.0 g and TCDMA 17.5 g as a polymerizable compound, [C] SBS 20.0 g as a polymer component, and MOD 4.5 g as a [D] compound were placed in a plastic container and mixed. Composition (II-12) was prepared.
- Example 13 to 16 A composition (I) and a composition (II) were prepared in the same manner as in Example 12 except that the components of the types and blending amounts shown in Table 9 below were used.
- TCDDMA tricyclodecane dimethacrylate
- - Light Ester DCP-M
- Table 9 indicates that the corresponding component was not used.
- composition (I) [A] A mixture of 2.5 g of TEB-DAP as a complex and 1.0 g of 4,7,10-trioxatridecane-1,13-diamine (TTD), and [B] 53.8 g of THFMA as a polymerizable compound; 15.6 g of 2EHMA, 17.7 g of SBS as a [C] polymer component, and 9.9 g of core-shell particles were placed in a plastic container and mixed to prepare composition (I-17).
- TTD 4,7,10-trioxatridecane-1,13-diamine
- composition (II) [B] THFMA 52.0 g and 2EHMA 15.2 g as a polymerizable compound, [C] SBS 17.3 g and core-shell particles 9.6 g as a polymer component, and [D] MOI 5.9 g as a compound A composition (II-17) was prepared by mixing in a container.
- Example 18 and 19 A composition (I) and a composition (II) were prepared in the same manner as in Example 17 except that the components of the types and blending amounts shown in Table 11 below were used. “-” In Table 11 indicates that the corresponding component was not used.
- the two-component mixed adhesive of the present invention high adhesive strength and hot strength can be obtained at a high curing rate while suppressing liquid dripping. Therefore, the two-component mixed adhesive can be suitably used for bonding various materials including difficult-to-adhere materials such as automobile outer plates.
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Abstract
The present invention is a two-part mixing-type adhesive agent comprising a first composition and a second composition, said adhesive agent being characterized in that the first composition contains a complex having both a group derived from an organoborane and a protecting group for the aforementioned group, the second composition contains a compound capable of carrying out a deprotection reaction with the protecting group, and a deprotection reaction product produced by the deprotection reaction between the protecting group and the compound has polymerizability. It is preferred that the protecting group in the complex is derived from a compound having at least two functional groups. The compound from which the protecting group is derived is preferably a diamine.
Description
本発明は、2液混合型接着剤に関する。
The present invention relates to a two-component mixed adhesive.
昨今の環境問題に対処すべく、自動車等の軽量化が要求されており、そのため樹脂材料を用いることが進められている。この樹脂材料は、樹脂材料どうしの接合、又は金属等の異種材料との接合に、接着剤を用いることが必要となる。しかし、樹脂材料のうち、リサイクル及びコストの面で優れるポリプロピレン等は、接着剤による接着が難しい材料である。
In order to deal with recent environmental problems, there is a demand for weight reduction of automobiles and the like, and therefore resin materials are being used. For this resin material, it is necessary to use an adhesive for joining the resin materials or joining different materials such as metals. However, among resin materials, polypropylene and the like, which are excellent in terms of recycling and cost, are materials that are difficult to bond with an adhesive.
このような難接着材料を接着できるものとして、近年、オルガノボラン錯体を用いた接着剤が検討されている(特表平11-512123号公報及び国際公開第2012/160452号公報参照)。この接着剤は、一方の組成物にオルガノボランに由来する基及びその保護基を有する錯体を含有させ、他方の組成物に上記保護基に作用してオルガノボランを遊離させうる化合物を含有させるものである。この接着剤によれば、接着の際に2つの組成物を混合することにより、ラジカル重合開始能を有するオルガノボランが遊離し、接着剤成分を硬化させ接着させることができる。この場合、遊離したオルガノボランと酸素分子とから生じるラジカルが、ポリプロピレン等の難接着性材料の表面を改質することができるので、プラズマ処理等を行わなくても、優れた接着性を示すとされている。
In recent years, an adhesive using an organoborane complex has been studied as a material capable of adhering such a difficult-to-adhere material (see Japanese Patent Publication No. 11-512123 and International Publication No. 2012/160452). In this adhesive, one composition contains a group derived from an organoborane and a complex having the protecting group, and the other composition contains a compound that acts on the protecting group to liberate the organoborane. It is. According to this adhesive, by mixing the two compositions at the time of bonding, the organoborane having radical polymerization initiating ability is liberated, and the adhesive component can be cured and bonded. In this case, radicals generated from the liberated organoborane and oxygen molecules can modify the surface of difficult-to-adhere materials such as polypropylene, so that excellent adhesion can be achieved without plasma treatment or the like. Has been.
しかし、上記従来の接着剤では、接着強度、硬化速度及び高温時の接着性を示す熱間強度が、市場の要求に対して未だ不十分であり、また、接着の際の液ダレが抑制できないという不都合もある。
However, with the above conventional adhesives, the adhesive strength, the curing rate, and the hot strength showing the adhesiveness at high temperature are still insufficient for the market demand, and the dripping at the time of adhesion cannot be suppressed. There is also an inconvenience.
本発明は以上のような事情に基づいてなされたものであり、その目的は、接着強度、硬化速度、熱間強度及び液ダレ抑制性に優れる2液混合型接着剤を提供することにある。
The present invention has been made based on the circumstances as described above, and an object thereof is to provide a two-component mixed adhesive that is excellent in adhesive strength, curing rate, hot strength, and dripping suppression.
上記課題を解決するためになされた発明は、第1組成物(以下、「組成物(I)」ともいう)と第2組成物(以下、「組成物(II)」ともいう)とを備える2液混合型接着剤であって、組成物(I)がオルガノボランに由来する基及びその保護基を有する錯体(以下、「[A]錯体」ともいう)を含有し、組成物(II)が上記保護基と脱保護反応する化合物(以下、「[D]化合物」ともいう)を含有し、上記保護基と[D]化合物との脱保護反応により生じる脱保護反応生成物が重合性を有することを特徴とする。
The invention made to solve the above problems comprises a first composition (hereinafter also referred to as “composition (I)”) and a second composition (hereinafter also referred to as “composition (II)”). A two-component mixed adhesive, wherein the composition (I) contains a complex having a group derived from an organoborane and a protecting group thereof (hereinafter also referred to as “[A] complex”), and the composition (II) Contains a compound that undergoes a deprotection reaction with the protecting group (hereinafter also referred to as “[D] compound”), and the deprotection reaction product produced by the deprotection reaction between the protecting group and the [D] compound has a polymerizable property. It is characterized by having.
当該2液混合型接着剤は、[A]錯体を含有する組成物(I)と[D]化合物を含有する組成物(II)とを備えることで、接着強度、硬化速度、熱間強度及び液ダレ抑制性に優れる。当該2液混合型接着剤が上記構成を有することで、上記効果を奏する理由については必ずしも明確ではないが、例えば以下のように推察することができる。すなわち、[A]錯体の保護基と[D]化合物とが脱保護反応した際、遊離したオルガノボランと脱保護反応生成物における重合部位とが、より近傍に位置する結果、より効果的に重合が開始され、硬化速度が向上すると考えられる。また、この硬化速度の向上と共に、重合により形成される接着層が上記脱保護反応により生じる基を含むことで、より強度が向上し、かつ被着材との相互作用が高まるため、接着強度が向上し、また熱間強度が向上すると考えられる。さらに、上記脱保護反応により生じる基間で適度な相互作用が発揮されることに起因して、チクソトロピー性が高まり、液ダレ抑制性が向上すると考えられる。
The two-component mixed adhesive includes the composition (I) containing the [A] complex and the composition (II) containing the [D] compound, so that the adhesive strength, the curing rate, the hot strength, Excellent sag control. The reason why the two-component mixed adhesive has the above-described configuration and thus achieves the above effect is not necessarily clear, but can be inferred as follows, for example. That is, when the protecting group of the [A] complex and the [D] compound undergo a deprotection reaction, the released organoborane and the polymerization site in the deprotection reaction product are located closer to each other, resulting in more effective polymerization. It is considered that the curing rate is improved. In addition to the improvement in the curing rate, the adhesive layer formed by polymerization contains a group generated by the deprotection reaction, so that the strength is further improved and the interaction with the adherend is increased. It is considered that the hot strength is improved. Furthermore, it is considered that thixotropy is increased and liquid dripping suppression is improved due to the fact that moderate interaction is exerted between groups generated by the deprotection reaction.
[A]錯体の保護基は2以上の官能基を有する化合物に由来することが好ましい。このように、[A]錯体の保護基の由来化合物を、2以上の官能基を有するものとすることで、[A]錯体の保護基と[D]化合物とから形成される脱保護反応生成物が複数の重合部位を有する結果、硬化速度がより向上し、また、得られる重合体が3次元架橋構造を有するため、接着強度及び熱間強度をより向上させることができる。さらに、上述の脱保護反応により生じる基間の相互作用が増大すると考えられ、液ダレ抑制性がより向上する。
[A] The protecting group of the complex is preferably derived from a compound having two or more functional groups. Thus, the deprotection reaction product formed from the protective group of [A] complex and the [D] compound by making the compound derived from the protective group of [A] complex have two or more functional groups. As a result of the product having a plurality of polymerization sites, the curing rate is further improved, and since the resulting polymer has a three-dimensional cross-linked structure, the adhesive strength and the hot strength can be further improved. Furthermore, it is thought that the interaction between groups produced by the above-mentioned deprotection reaction increases, and the dripping suppression property is further improved.
上記保護基の由来化合物としてはジアミンが好ましい。このように、[A]錯体の保護基の由来化合物をジアミンとすることで、脱保護反応の速度が高まって硬化速度がさらに向上し、かつ脱保護反応により形成される基が水素結合を発揮する結果、接着層の強度及び被着材との相互作用をさらに高めることができると考えられ、接着強度及び熱間強度がより向上する。また、脱保護反応により生じる基どうしで適度に水素結合を形成することができるので、液ダレ抑制性をさらに向上させることができる。
Diamine is preferable as the compound derived from the protecting group. Thus, by using the diamine as the compound derived from the protective group of the [A] complex, the speed of the deprotection reaction is increased and the curing rate is further improved, and the group formed by the deprotection reaction exhibits a hydrogen bond. As a result, it is considered that the strength of the adhesive layer and the interaction with the adherend can be further increased, and the adhesive strength and the hot strength are further improved. Moreover, since a hydrogen bond can be appropriately formed between groups generated by the deprotection reaction, the dripping suppression property can be further improved.
上記[D]化合物としてはイソシアネート基を有する(メタ)アクリレートが好ましい。このように、上記[D]化合物として上記特定の化合物を用いることにより、上述の脱保護反応速度及び重合速度がさらに高まって、硬化速度がさらに向上し、かつ脱保護反応により形成される基間の相互作用がさらに高まる結果、接着強度、熱間強度及び液ダレ抑制性をさらに向上させることができる。
The [D] compound is preferably a (meth) acrylate having an isocyanate group. Thus, by using the specific compound as the [D] compound, the deprotection reaction rate and the polymerization rate are further increased, the curing rate is further improved, and the groups formed by the deprotection reaction are increased. As a result of further increasing the interaction, the adhesive strength, the hot strength, and the dripping suppression property can be further improved.
上記イソシアネート基のジアミンに対するモル比としては1以上3以下が好ましい。このように、上記モル比を上記特定範囲とすることで、接着強度、硬化速度、熱間強度及び液ダレ抑制性をさらに向上させることができる。
The molar ratio of the isocyanate group to the diamine is preferably 1 or more and 3 or less. Thus, by making the said molar ratio into the said specific range, adhesive strength, a cure rate, hot strength, and dripping suppression property can further be improved.
上記組成物(I)、組成物(II)又はその双方がイソシアネート基を有しない(メタ)アクリレート又はポリマー成分を更に含有することが好ましい。このように、組成物(I)及び/又は組成物(II)がイソシアネート基を有しない(メタ)アクリレート又はポリマー成分を含有することで、当該2液混合型接着剤は、接着層の強度がさらに高まり、接着強度及び熱間強度がさらに向上すると共に、初期接着強度の向上、硬化収縮抑制等を発揮することができる。
It is preferable that the composition (I), the composition (II) or both further contain a (meth) acrylate or polymer component having no isocyanate group. Thus, since the composition (I) and / or the composition (II) contains a (meth) acrylate or polymer component having no isocyanate group, the two-component mixed adhesive has the strength of the adhesive layer. Further, the adhesive strength and the hot strength are further improved, and the initial adhesive strength can be improved and the curing shrinkage can be suppressed.
上記イソシアネート基を有しない(メタ)アクリレートは、脂環を有することが好ましい。このように、上記イソシアネート基を有しない(メタ)アクリレートが脂環を有することで、当該2液混合型接着剤は、熱間強度をさらに向上させることができる。
The (meth) acrylate having no isocyanate group preferably has an alicyclic ring. As described above, the (meth) acrylate having no isocyanate group has an alicyclic ring, whereby the two-component mixed adhesive can further improve the hot strength.
上記ポリマー成分として、ポリマー粒子を含有することが好ましい。このように、上記ポリマー成分としてポリマー粒子を含有することで、当該2液混合型接着剤は、接着層の柔軟性をさらに向上させることができる。
It is preferable that polymer particles are contained as the polymer component. Thus, by containing polymer particles as the polymer component, the two-component mixed adhesive can further improve the flexibility of the adhesive layer.
上記ポリマー成分中のポリマー粒子の含有率としては、10質量%以上50質量%以下が好ましい。このように、上記ポリマー粒子の含有率を上記特定範囲とすることで、当該2液混合型接着剤は、接着層の柔軟性と接着強度とを共により高めることができる。
The content of the polymer particles in the polymer component is preferably 10% by mass or more and 50% by mass or less. Thus, by making the content rate of the polymer particles in the specific range, the two-component mixed adhesive can increase both the flexibility and the adhesive strength of the adhesive layer.
上記ポリマー粒子はコア-シェル構造を有することが好ましい。このように、上記ポリマー粒子がコア-シェル構造を有することで、当該2液混合型接着剤は、接着層の柔軟性をさらに向上させることができる。「コア-シェル構造」とは、核となるコア部と、このコア部を被覆するシェル(殻)部とを有する構造をいう。但し、コア部が全てシェル部で被覆されている必要はない。
The polymer particles preferably have a core-shell structure. As described above, since the polymer particles have a core-shell structure, the two-component mixed adhesive can further improve the flexibility of the adhesive layer. The “core-shell structure” refers to a structure having a core part serving as a nucleus and a shell part covering the core part. However, it is not necessary that the core part is entirely covered with the shell part.
上記錯体におけるオルガノボランに由来する基に対する保護基のモル比としては、1以上8以下が好ましい。このように、上記オルガノボランに由来する基に対する保護基のモル比を上記特定範囲とすることで、当該2液混合型接着剤の保存安定性を向上させることができる。
The molar ratio of the protecting group to the group derived from organoborane in the complex is preferably 1 or more and 8 or less. Thus, the storage stability of the two-component mixed adhesive can be improved by setting the molar ratio of the protecting group to the group derived from the organoborane within the specific range.
チクソトロピー指数としては3以上が好ましい。当該2液混合型接着剤は、TIの値を上記範囲とすることで、高い液ダレ抑制性を発揮することができる。「チクソトロピー指数(TI)」とは、5rpmの回転数で測定した粘度(η5)の50rpmの回転数で測定した粘度(η50)に対する比をいう。
The thixotropy index is preferably 3 or more. The said 2 liquid mixture type adhesive can exhibit high dripping suppression property by making the value of TI into the said range. The “thixotropic index (TI)” refers to the ratio of the viscosity (η 5 ) measured at 5 rpm to the viscosity (η 50 ) measured at 50 rpm.
以上説明したように、本発明の2液混合型接着剤によれば、液ダレを抑制しつつ、高い硬化速度で、高い接着強度及び熱間強度を得ることができる。従って、当該2液混合型接着剤は、自動車外板等の難接着材料を含む種々材料の接着に好適に用いることができる。
As described above, according to the two-component mixed adhesive of the present invention, high adhesive strength and hot strength can be obtained at a high curing rate while suppressing dripping. Therefore, the two-component mixed adhesive can be suitably used for bonding various materials including difficult-to-adhere materials such as automobile outer plates.
<2液混合型接着剤>
当該2液混合型接着剤は、組成物(I)と組成物(II)とを備える。当該2液混合型接着剤は、[A]錯体を含有する組成物(I)と[D]化合物を含有する組成物(II)とを備えることで、接着強度、硬化速度、熱間強度及び液ダレ抑制性に優れる。 <Two-component mixed adhesive>
The two-component mixed adhesive includes a composition (I) and a composition (II). The two-component mixed adhesive includes the composition (I) containing the [A] complex and the composition (II) containing the [D] compound, so that the adhesive strength, the curing rate, the hot strength, Excellent sag control.
当該2液混合型接着剤は、組成物(I)と組成物(II)とを備える。当該2液混合型接着剤は、[A]錯体を含有する組成物(I)と[D]化合物を含有する組成物(II)とを備えることで、接着強度、硬化速度、熱間強度及び液ダレ抑制性に優れる。 <Two-component mixed adhesive>
The two-component mixed adhesive includes a composition (I) and a composition (II). The two-component mixed adhesive includes the composition (I) containing the [A] complex and the composition (II) containing the [D] compound, so that the adhesive strength, the curing rate, the hot strength, Excellent sag control.
当該2液混合型接着剤は、組成物(I)と組成物(II)とを混合することで、組成物(II)中の[D]化合物が、組成物(I)中の[A]錯体を構成する保護基と反応(脱保護反応)を生じ、その結果、オルガノボラン、及び保護基と[D]化合物との反応生成物(以下、「脱保護反応生成物(p)」ともいう)が生成する。この脱保護反応生成物(p)は重合性を有しており、例えば生成したオルガノボランを重合開始剤として重合するものであり、加えて、例えばオルガノボランから形成されたラジカルにより被着材との結合等も形成されて接着が進行する。
In the two-component mixed adhesive, the composition (I) and the composition (II) are mixed so that the [D] compound in the composition (II) is converted into the [A] in the composition (I). A reaction (deprotection reaction) occurs with the protecting group constituting the complex, and as a result, a reaction product of organoborane and the protecting group with the [D] compound (hereinafter also referred to as “deprotection reaction product (p)”). ) Is generated. This deprotection reaction product (p) has polymerizability, for example, it is polymerized using the produced organoborane as a polymerization initiator, and in addition, for example, a radical formed from the organoborane and the adherend. Bonding or the like is also formed, and adhesion proceeds.
当該2液混合型接着剤は、例えば酸ハライド化合物等の硬化促進剤の含有を要することなく、上記効果を発揮することができる。当該2液混合型接着剤が上記構成を有することで上記効果を奏する理由については必ずしも明確ではないが、例えば以下のように推察することができる。すなわち、[A]錯体の保護基と[D]化合物とが脱保護反応した際、遊離したオルガノボランと脱保護反応生成物における重合部位とが、より近傍となる結果、より効果的に重合が開始され、硬化速度が向上すると考えられる。またこの硬化速度の向上と共に、重合により形成される接着層が上記脱保護反応により生じる基を含むことで、より強度が向上すると共に、被着材との相互作用が高まるため、接着強度が向上し、また熱間強度が向上すると考えられる。さらに、上記脱保護反応により生じる基間で適度な相互作用が発揮されることに起因して、チクソトロピー性が高まり、液ダレ抑制性が向上すると考えられる。また、当該2液混合型接着剤によれば、上記構成とすることにより、脱保護反応生成物(p)が重合により、接着層に結合生成して取り込まれるため、接着層からのブリードアウトが低減されると考えられる。
The two-component mixed adhesive can exhibit the above effects without requiring the inclusion of a curing accelerator such as an acid halide compound. The reason why the two-component mixed adhesive has the above-described configuration provides the above-mentioned effect is not necessarily clear, but can be inferred as follows, for example. That is, when the protective group of the [A] complex and the [D] compound undergo a deprotection reaction, the liberated organoborane and the polymerization site in the deprotection reaction product become closer to each other, resulting in more effective polymerization. It is believed that the cure rate is improved. In addition to the improvement in the curing rate, the adhesive layer formed by polymerization contains a group generated by the above deprotection reaction, so that the strength is further improved and the interaction with the adherend is increased, so the adhesive strength is improved. In addition, it is considered that the hot strength is improved. Furthermore, it is considered that thixotropy is increased and liquid dripping suppression is improved due to the fact that moderate interaction is exerted between groups generated by the deprotection reaction. In addition, according to the two-component mixed adhesive, the deprotection reaction product (p) is bonded to the adhesive layer by polymerization and taken in by adopting the above configuration, so that the bleed out from the adhesive layer is prevented. It is thought to be reduced.
なお、当該2液混合型接着剤は、組成物(I)及び組成物(II)以外に、[A]錯体及び[D]化合物を含有しない他の組成物をさらに備え、3液以上の混合型接着剤としてもよい。
In addition to the composition (I) and the composition (II), the two-component mixed adhesive further includes another composition that does not contain the [A] complex and the [D] compound, and is a mixture of three or more components. A mold adhesive may be used.
以下、組成物(I)及び組成物(II)について説明する。
Hereinafter, the composition (I) and the composition (II) will be described.
<組成物(I)>
組成物(I)は、[A]錯体を含有する。また、組成物(I)は、1の重合性基を有する化合物(以下、「[B]重合性化合物」ともいう)及び/又は[C]ポリマー成分を含有することが好ましく、本発明の効果を損なわない範囲において、上記[A]~[C]成分以外のその他の成分を含有していてもよい。以下、各成分について説明する。 <Composition (I)>
Composition (I) contains a [A] complex. The composition (I) preferably contains a compound having one polymerizable group (hereinafter also referred to as “[B] polymerizable compound”) and / or a [C] polymer component. In the range not impairing the above, other components other than the above-mentioned components [A] to [C] may be contained. Hereinafter, each component will be described.
組成物(I)は、[A]錯体を含有する。また、組成物(I)は、1の重合性基を有する化合物(以下、「[B]重合性化合物」ともいう)及び/又は[C]ポリマー成分を含有することが好ましく、本発明の効果を損なわない範囲において、上記[A]~[C]成分以外のその他の成分を含有していてもよい。以下、各成分について説明する。 <Composition (I)>
Composition (I) contains a [A] complex. The composition (I) preferably contains a compound having one polymerizable group (hereinafter also referred to as “[B] polymerizable compound”) and / or a [C] polymer component. In the range not impairing the above, other components other than the above-mentioned components [A] to [C] may be contained. Hereinafter, each component will be described.
[[A]錯体]
[A]錯体は、オルガノボランに由来する基及びその保護基を有する錯体である。[A]錯体は、通常オルガノボランと、このオルガノボランに配位結合等して保護基を形成し、オルガノボランの重合開始能を抑制可能な化合物(a)から形成される。オルガノボランは、1又は複数の化合物(a)と相互作用することにより[A]錯体を形成することができる。 [[A] complex]
[A] The complex is a complex having a group derived from organoborane and a protecting group thereof. [A] The complex is usually formed from an organoborane and a compound (a) capable of forming a protective group by coordination bonding to the organoborane and suppressing the polymerization initiation ability of the organoborane. Organoborane can form an [A] complex by interacting with one or more compounds (a).
[A]錯体は、オルガノボランに由来する基及びその保護基を有する錯体である。[A]錯体は、通常オルガノボランと、このオルガノボランに配位結合等して保護基を形成し、オルガノボランの重合開始能を抑制可能な化合物(a)から形成される。オルガノボランは、1又は複数の化合物(a)と相互作用することにより[A]錯体を形成することができる。 [[A] complex]
[A] The complex is a complex having a group derived from organoborane and a protecting group thereof. [A] The complex is usually formed from an organoborane and a compound (a) capable of forming a protective group by coordination bonding to the organoborane and suppressing the polymerization initiation ability of the organoborane. Organoborane can form an [A] complex by interacting with one or more compounds (a).
(オルガノボラン)
上記オルガノボランは、ボランの水素原子を有機基で置換した化合物である。有機基とは、少なくとも1個の炭素原子を含む基をいう。上記オルガノボランとしては、例えば下記式(1)で表される化合物等が挙げられる。 (Organoborane)
The organoborane is a compound in which the hydrogen atom of borane is substituted with an organic group. An organic group refers to a group containing at least one carbon atom. Examples of the organoborane include compounds represented by the following formula (1).
上記オルガノボランは、ボランの水素原子を有機基で置換した化合物である。有機基とは、少なくとも1個の炭素原子を含む基をいう。上記オルガノボランとしては、例えば下記式(1)で表される化合物等が挙げられる。 (Organoborane)
The organoborane is a compound in which the hydrogen atom of borane is substituted with an organic group. An organic group refers to a group containing at least one carbon atom. Examples of the organoborane include compounds represented by the following formula (1).
上記式(1)中、R1、R2及びR3は、炭素数1~20の1価の有機基である。
In the above formula (1), R 1 , R 2 and R 3 are monovalent organic groups having 1 to 20 carbon atoms.
上記R1、R2及びR3で表される炭素数1~20の1価の有機基としては、例えば炭素数1~20の1価の炭化水素基、この炭化水素基の炭素-炭素間に2価のヘテロ原子含有基を有する基(α)、上記炭化水素基及び基(α)が有する水素原子の一部又は全部を1価のヘテロ原子含有基で置換した基等が挙げられる。
Examples of the monovalent organic group having 1 to 20 carbon atoms represented by R 1 , R 2 and R 3 include, for example, a monovalent hydrocarbon group having 1 to 20 carbon atoms, and the carbon-carbon gap of the hydrocarbon group. And a group (α) having a divalent heteroatom-containing group, a group in which part or all of the hydrogen atoms of the hydrocarbon group and the group (α) are substituted with a monovalent heteroatom-containing group, and the like.
上記炭素数1~20の1価の炭化水素基としては、例えば炭素数1~20の1価の鎖状炭化水素基、炭素数3~20の1価の脂環式炭化水素基、炭素数6~20の1価の芳香族炭化水素基等が挙げられる。
Examples of the monovalent hydrocarbon group having 1 to 20 carbon atoms include, for example, a monovalent chain hydrocarbon group having 1 to 20 carbon atoms, a monovalent alicyclic hydrocarbon group having 3 to 20 carbon atoms, Examples thereof include 6-20 monovalent aromatic hydrocarbon groups.
上記炭素数1~20の1価の鎖状炭化水素基としては、例えば
メチル基、エチル基、プロピル基、ブチル基等のアルキル基;
エテニル基、プロペニル基、ブテニル基等のアルケニル基;
エチニル基、プロピニル基、ブチニル基等のアルキニル基などが挙げられる。 Examples of the monovalent chain hydrocarbon group having 1 to 20 carbon atoms include alkyl groups such as a methyl group, an ethyl group, a propyl group, and a butyl group;
An alkenyl group such as an ethenyl group, a propenyl group, a butenyl group;
Examples thereof include alkynyl groups such as ethynyl group, propynyl group and butynyl group.
メチル基、エチル基、プロピル基、ブチル基等のアルキル基;
エテニル基、プロペニル基、ブテニル基等のアルケニル基;
エチニル基、プロピニル基、ブチニル基等のアルキニル基などが挙げられる。 Examples of the monovalent chain hydrocarbon group having 1 to 20 carbon atoms include alkyl groups such as a methyl group, an ethyl group, a propyl group, and a butyl group;
An alkenyl group such as an ethenyl group, a propenyl group, a butenyl group;
Examples thereof include alkynyl groups such as ethynyl group, propynyl group and butynyl group.
上記炭素数3~20の1価の脂環式炭化水素基としては、例えば
シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、ノルボルニル基、アダマンチル基、トリシクロデシル基等のシクロアルキル基;
シクロペンテニル基、シクロヘキセニル基、ノルボルネニル基、トリシクロデセニル基等のシクロアルケニル基などが挙げられる。 Examples of the monovalent alicyclic hydrocarbon group having 3 to 20 carbon atoms include cycloalkyl groups such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, norbornyl group, adamantyl group, and tricyclodecyl group;
And cycloalkenyl groups such as a cyclopentenyl group, a cyclohexenyl group, a norbornenyl group, and a tricyclodecenyl group.
シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、ノルボルニル基、アダマンチル基、トリシクロデシル基等のシクロアルキル基;
シクロペンテニル基、シクロヘキセニル基、ノルボルネニル基、トリシクロデセニル基等のシクロアルケニル基などが挙げられる。 Examples of the monovalent alicyclic hydrocarbon group having 3 to 20 carbon atoms include cycloalkyl groups such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, norbornyl group, adamantyl group, and tricyclodecyl group;
And cycloalkenyl groups such as a cyclopentenyl group, a cyclohexenyl group, a norbornenyl group, and a tricyclodecenyl group.
上記炭素数6~20の1価の芳香族炭化水素基としては、例えば
フェニル基、トリル基、キシリル基、ナフチル基、アントリル基等のアリール基;
ベンジル基、フェネチル基、ナフチルメチル基等のアラルキル基などが挙げられる。 Examples of the monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms include aryl groups such as phenyl group, tolyl group, xylyl group, naphthyl group, and anthryl group;
Examples thereof include aralkyl groups such as benzyl group, phenethyl group, and naphthylmethyl group.
フェニル基、トリル基、キシリル基、ナフチル基、アントリル基等のアリール基;
ベンジル基、フェネチル基、ナフチルメチル基等のアラルキル基などが挙げられる。 Examples of the monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms include aryl groups such as phenyl group, tolyl group, xylyl group, naphthyl group, and anthryl group;
Examples thereof include aralkyl groups such as benzyl group, phenethyl group, and naphthylmethyl group.
上記1価及び2価のヘテロ原子含有基が有するヘテロ原子としては、例えば酸素原子、窒素原子、硫黄原子、リン原子、ケイ素原子等が挙げられる。
Examples of the hetero atom contained in the monovalent and divalent heteroatom-containing group include an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, and a silicon atom.
上記2価のヘテロ原子含有基としては、例えば-O-、-CO-、-NR’-、-S-、-CS-、-SO-、-SO2-、-POR’2-、-SiR’2-、これらを組み合わせた基等が挙げられる。R’は、炭素数1~10の1価の炭化水素基である。
Examples of the divalent heteroatom-containing group include —O—, —CO—, —NR′—, —S—, —CS—, —SO—, —SO 2 —, —POR ′ 2 —, and —SiR. ' 2- , a group combining these and the like. R ′ is a monovalent hydrocarbon group having 1 to 10 carbon atoms.
上記1価のヘテロ原子含有基としては、例えば-OH、-COOH、-NH2、-CN、-NO2、-SH等が挙げられる。
Examples of the monovalent heteroatom-containing group include —OH, —COOH, —NH 2 , —CN, —NO 2 , —SH and the like.
上記オルガノボランとしては、高い重合開始能、安定性及び入手容易性の観点から、上記式(1)のR1~R3が炭化水素基である化合物が好ましく、トリアルキルボランがより好ましく、トリメチルボラン、トリエチルボラン、トリプロピルボラン及びトリブチルボランがさらに好ましく、トリエチルボランが特に好ましい。
The organoborane is preferably a compound in which R 1 to R 3 in the above formula (1) are hydrocarbon groups from the viewpoint of high polymerization initiating ability, stability, and availability, more preferably trialkylborane, Borane, triethylborane, tripropylborane and tributylborane are more preferred, and triethylborane is particularly preferred.
(化合物(a))
化合物(a)は、オルガノボランの保護基となり、かつ後述する[D]化合物と脱保護反応しうる化合物である。 (Compound (a))
Compound (a) is a compound that serves as a protective group for organoborane and can undergo a deprotection reaction with the [D] compound described below.
化合物(a)は、オルガノボランの保護基となり、かつ後述する[D]化合物と脱保護反応しうる化合物である。 (Compound (a))
Compound (a) is a compound that serves as a protective group for organoborane and can undergo a deprotection reaction with the [D] compound described below.
化合物(a)としては、例えば官能基(以下、「官能基(x)」ともいう)を有する化合物等が挙げられる。上記官能基(x)としては、オルガノボランとの錯体形成能及び[D]化合物との脱保護反応の容易性の両立の観点から、ヘテロ原子を含む官能基が好ましい。上記ヘテロ原子としては、例えば窒素原子、酸素原子、硫黄原子、リン原子等が挙げられる。上記ヘテロ原子としては、オルガノボランとの錯体形成能及び[D]化合物との脱保護反応の容易性をより高める観点から、非共有電子対を有する原子が好ましい。
Examples of the compound (a) include compounds having a functional group (hereinafter also referred to as “functional group (x)”). The functional group (x) is preferably a functional group containing a hetero atom from the viewpoint of both the ability to form a complex with an organoborane and the ease of deprotection reaction with the [D] compound. As said hetero atom, a nitrogen atom, an oxygen atom, a sulfur atom, a phosphorus atom etc. are mentioned, for example. The hetero atom is preferably an atom having an unshared electron pair from the viewpoint of further enhancing the ability to form a complex with an organoborane and the ease of the deprotection reaction with the [D] compound.
上記ヘテロ原子を含む官能基としては、
窒素原子を含む官能基として、例えばアミノ基、置換アミノ基(-NH2の水素原子を炭化水素基で置換したもの)、イミノ基(-CH=N-)等が、
酸素原子を含む官能基として、例えばヒドロキシ基、エーテル基等が、
硫黄原子を含む官能基として、例えばスルファニル基、チオエーテル基等が、
リン原子を含む官能基として、例えばホスフィノ基、置換ホスフィノ基(-PH2の水素原子を炭化水素基で置換したもの)等が挙げられる。 As the functional group containing the hetero atom,
Examples of the functional group containing a nitrogen atom include an amino group, a substituted amino group (a hydrogen atom of —NH 2 substituted with a hydrocarbon group), an imino group (—CH═N—), and the like.
Examples of the functional group containing an oxygen atom include a hydroxy group and an ether group.
Examples of the functional group containing a sulfur atom include a sulfanyl group and a thioether group.
Examples of the functional group containing a phosphorus atom include a phosphino group, a substituted phosphino group (a hydrogen atom of —PH 2 substituted with a hydrocarbon group), and the like.
窒素原子を含む官能基として、例えばアミノ基、置換アミノ基(-NH2の水素原子を炭化水素基で置換したもの)、イミノ基(-CH=N-)等が、
酸素原子を含む官能基として、例えばヒドロキシ基、エーテル基等が、
硫黄原子を含む官能基として、例えばスルファニル基、チオエーテル基等が、
リン原子を含む官能基として、例えばホスフィノ基、置換ホスフィノ基(-PH2の水素原子を炭化水素基で置換したもの)等が挙げられる。 As the functional group containing the hetero atom,
Examples of the functional group containing a nitrogen atom include an amino group, a substituted amino group (a hydrogen atom of —NH 2 substituted with a hydrocarbon group), an imino group (—CH═N—), and the like.
Examples of the functional group containing an oxygen atom include a hydroxy group and an ether group.
Examples of the functional group containing a sulfur atom include a sulfanyl group and a thioether group.
Examples of the functional group containing a phosphorus atom include a phosphino group, a substituted phosphino group (a hydrogen atom of —PH 2 substituted with a hydrocarbon group), and the like.
アミノ基を有する化合物として、例えば
メチルアミン、エチルアミン、プロピルアミン、ブチルアミン、アニリン、エタノールアミン等のモノアミン;
1,2-ジアミノエタン、1,2-ジアミノプロパン、1,3-ジアミノプロパン、1,4-ジアミノブタン、1,5-ジアミノペンタン、1,6-ジアミノヘキサン、1,7-ジアミノヘプタン、1,8-ジアミノオクタン、1,9-ジアミノノナン、1,10-ジアミノデカン、1,12-ジアミノドデカン、4,4’-ジアミノジフェニルメタン、4,4’-ジアミノジフェニルエーテル、4,4’-ジアミノベンゾフェノン、2,2-ビス(4-アミノフェニル)プロパン、2-(3-アミノフェニル)-2-(4-アミノフェニル)プロパン、1,4-ビス[1-(4-アミノフェニル)-1-メチルエチル]ベンゼン、1,3-ビス[1-(4-アミノフェニル)-1-メチルエチル]ベンゼン、4,7,10-トリオキサトリデカン-1,13-ジアミン、4,9-ジオキサドデカン-1,12-ジアミン、3,6,9-トリオキサウンデカン-1,11-ジアミン等のジアミン;
1,2,3-トリアミノプロパン、1,2,4-トリアミノブタン、1,3,5-トリアミノシクロヘキサン、1,3,5-トリアミノベンゼン等のトリアミンなどが挙げられる。 Examples of compounds having an amino group include monoamines such as methylamine, ethylamine, propylamine, butylamine, aniline, and ethanolamine;
1,2-diaminoethane, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1 , 8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane, 1,12-diaminododecane, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 4,4′-diaminobenzophenone, 2,2-bis (4-aminophenyl) propane, 2- (3-aminophenyl) -2- (4-aminophenyl) propane, 1,4-bis [1- (4-aminophenyl) -1-methyl Ethyl] benzene, 1,3-bis [1- (4-aminophenyl) -1-methylethyl] benzene, 4,7,10-trioxatrideca 1,13-diamine, 4,9-oxa-1,12-diamine, diamines such as 3,6,9-trio key sound-1,11-diamine;
And triamines such as 1,2,3-triaminopropane, 1,2,4-triaminobutane, 1,3,5-triaminocyclohexane, 1,3,5-triaminobenzene, and the like.
メチルアミン、エチルアミン、プロピルアミン、ブチルアミン、アニリン、エタノールアミン等のモノアミン;
1,2-ジアミノエタン、1,2-ジアミノプロパン、1,3-ジアミノプロパン、1,4-ジアミノブタン、1,5-ジアミノペンタン、1,6-ジアミノヘキサン、1,7-ジアミノヘプタン、1,8-ジアミノオクタン、1,9-ジアミノノナン、1,10-ジアミノデカン、1,12-ジアミノドデカン、4,4’-ジアミノジフェニルメタン、4,4’-ジアミノジフェニルエーテル、4,4’-ジアミノベンゾフェノン、2,2-ビス(4-アミノフェニル)プロパン、2-(3-アミノフェニル)-2-(4-アミノフェニル)プロパン、1,4-ビス[1-(4-アミノフェニル)-1-メチルエチル]ベンゼン、1,3-ビス[1-(4-アミノフェニル)-1-メチルエチル]ベンゼン、4,7,10-トリオキサトリデカン-1,13-ジアミン、4,9-ジオキサドデカン-1,12-ジアミン、3,6,9-トリオキサウンデカン-1,11-ジアミン等のジアミン;
1,2,3-トリアミノプロパン、1,2,4-トリアミノブタン、1,3,5-トリアミノシクロヘキサン、1,3,5-トリアミノベンゼン等のトリアミンなどが挙げられる。 Examples of compounds having an amino group include monoamines such as methylamine, ethylamine, propylamine, butylamine, aniline, and ethanolamine;
1,2-diaminoethane, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1 , 8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane, 1,12-diaminododecane, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 4,4′-diaminobenzophenone, 2,2-bis (4-aminophenyl) propane, 2- (3-aminophenyl) -2- (4-aminophenyl) propane, 1,4-bis [1- (4-aminophenyl) -1-methyl Ethyl] benzene, 1,3-bis [1- (4-aminophenyl) -1-methylethyl] benzene, 4,7,10-trioxatrideca 1,13-diamine, 4,9-oxa-1,12-diamine, diamines such as 3,6,9-trio key sound-1,11-diamine;
And triamines such as 1,2,3-triaminopropane, 1,2,4-triaminobutane, 1,3,5-triaminocyclohexane, 1,3,5-triaminobenzene, and the like.
置換アミノ基を有する化合物としては、例えばジメチルアミン、ジエチルアミン、ジプロピルアミン、ジブチルアミン、シクロペンチルアミン、シクロヘキシルアミン、ジシクロペンチルアミン、ジシクロヘキシルアミン、N,N’-ジメチル-1,3-ジアミノプロパン、N,N,N’,N’-テトラメチル-1,3-ジアミノプロパン、ジエタノールアミン等が挙げられる。
Examples of the compound having a substituted amino group include dimethylamine, diethylamine, dipropylamine, dibutylamine, cyclopentylamine, cyclohexylamine, dicyclopentylamine, dicyclohexylamine, N, N′-dimethyl-1,3-diaminopropane, N , N, N ′, N′-tetramethyl-1,3-diaminopropane, diethanolamine and the like.
イミノ基を有する化合物としては、例えばN-メチルブチルアルジミン等が挙げられる。
Examples of the compound having an imino group include N-methylbutylaldimine.
ヒドロキシ基を有する化合物としては、例えば
メタノール、エタノール等のモノアルコール;
エチレングリコール、1,4-ブタンジオール、1,2-シクロヘキサンジオール等のジオール;
グリセリン、トリメチロールプロパン等のトリオールなどが挙げられる。 Examples of the compound having a hydroxy group include monoalcohols such as methanol and ethanol;
Diols such as ethylene glycol, 1,4-butanediol, 1,2-cyclohexanediol;
Examples include triols such as glycerin and trimethylolpropane.
メタノール、エタノール等のモノアルコール;
エチレングリコール、1,4-ブタンジオール、1,2-シクロヘキサンジオール等のジオール;
グリセリン、トリメチロールプロパン等のトリオールなどが挙げられる。 Examples of the compound having a hydroxy group include monoalcohols such as methanol and ethanol;
Diols such as ethylene glycol, 1,4-butanediol, 1,2-cyclohexanediol;
Examples include triols such as glycerin and trimethylolpropane.
エーテル基を有する化合物としては、例えばジエチルエーテル、ジブチルエーテル、テトラヒドロフラン等が挙げられる。
Examples of the compound having an ether group include diethyl ether, dibutyl ether, tetrahydrofuran and the like.
スルファニル基を有する化合物としては、例えばメルカプタン、エタンチオール等のモノチオール;
エタンジチオール、ブタンジチオール等のジチオールなどが挙げられる。 Examples of the compound having a sulfanyl group include monothiols such as mercaptan and ethanethiol;
And dithiols such as ethanedithiol and butanedithiol.
エタンジチオール、ブタンジチオール等のジチオールなどが挙げられる。 Examples of the compound having a sulfanyl group include monothiols such as mercaptan and ethanethiol;
And dithiols such as ethanedithiol and butanedithiol.
チオエーテル基を有する化合物としては、例えばジエチルチオエーテル、ジブチルチオエーテル、テトラヒドロチオフェン等が挙げられる。
Examples of the compound having a thioether group include diethyl thioether, dibutyl thioether, tetrahydrothiophene and the like.
ホスフィノ基を有する化合物としては、例えばエチルホスフィン、ブチルホスフィン等のモノホスフィン;
ジホスフィノエタン、ジホスフィノブタン等のジホスフィンなどが挙げられる。 Examples of the compound having a phosphino group include monophosphines such as ethylphosphine and butylphosphine;
Examples include diphosphinoethane and diphosphinobutane.
ジホスフィノエタン、ジホスフィノブタン等のジホスフィンなどが挙げられる。 Examples of the compound having a phosphino group include monophosphines such as ethylphosphine and butylphosphine;
Examples include diphosphinoethane and diphosphinobutane.
置換ホスフィノ基を有する化合物としては、例えばジエチルホスフィン、ジブチルホスフィン等が挙げられる。
Examples of the compound having a substituted phosphino group include diethyl phosphine and dibutyl phosphine.
化合物(a)が有する官能基(x)の数としては、1個でもよく、2個以上でもよいが、2個以上が好ましく、2~4個がより好ましく、2個及び3個がさらに好ましく、2個が特に好ましい。官能基(x)の数を上記範囲とすることで、化合物(a)から形成される[A]錯体の保護基と[D]化合物とから、複数の重合部位を有する脱保護反応生成物(p)が形成される結果、硬化速度がより向上し、また得られる重合体が3次元架橋構造を有するため、接着強度及び熱間強度をより向上させることができる。また上述の脱保護反応により生じる基間の相互作用が増大すると考えられ、液ダレ抑制性がより向上する。
The number of functional groups (x) possessed by the compound (a) may be 1 or 2 or more, preferably 2 or more, more preferably 2 to 4 and even more preferably 2 or 3 Two are particularly preferred. By setting the number of functional groups (x) within the above range, a deprotection reaction product having a plurality of polymerization sites (A) and a protective group of the [A] complex formed from the compound (a) and a compound [D] ( As a result of the formation of p), the curing rate is further improved, and the resulting polymer has a three-dimensional crosslinked structure, so that the adhesive strength and the hot strength can be further improved. Moreover, it is thought that the interaction between groups which arises by the above-mentioned deprotection reaction increases, and dripping suppression property improves more.
官能基(x)としては、保護基と[D]化合物との脱保護反応をより容易にする観点から、少なくとも1の水素原子が結合したヘテロ原子を有するものが好ましい。そのような官能基(x)としては、アミノ基、-NHR、ヒドロキシ基、スルファニル基、ホスフィノ基、-PHR等が挙げられる。Rは、1価の炭化水素基である。これらの中で、上記脱保護反応をさらに容易にする観点から、アミノ基及び-NHRが好ましく、アミノ基がより好ましい。
As the functional group (x), those having a hetero atom to which at least one hydrogen atom is bonded are preferred from the viewpoint of facilitating the deprotection reaction between the protective group and the [D] compound. Examples of such a functional group (x) include an amino group, —NHR, hydroxy group, sulfanyl group, phosphino group, —PHR and the like. R is a monovalent hydrocarbon group. Among these, from the viewpoint of further facilitating the deprotection reaction, an amino group and —NHR are preferable, and an amino group is more preferable.
化合物(a)としては、保護基と[D]化合物との脱保護反応をより容易にする観点から、少なくとも1の水素原子が結合したヘテロ原子を有する活性水素含有化合物が好ましい。化合物(a)としては、これらの中でも、上記脱保護反応をさらに容易にし、かつ接着強度及び熱間強度をさらに高める観点から、アミノ基を含む化合物が好ましく、ジアミン及びトリアミンがより好ましく、ジアミンがさらに好ましく、ジアミノアルカン及びエーテル結合を有するジアミンが特に好ましく、炭素数2~4のジアミノアルカン及び炭素数6~12のエーテル結合を有するジアミンがさらに特に好ましく、1,3-アミノプロパン及び4,7,10-トリオキサトリデカン-1,13-ジアミンが最も好ましい。
The compound (a) is preferably an active hydrogen-containing compound having a hetero atom to which at least one hydrogen atom is bonded, from the viewpoint of facilitating the deprotection reaction between the protecting group and the [D] compound. Among these, the compound (a) is preferably a compound containing an amino group, more preferably a diamine and a triamine, from the viewpoint of further facilitating the deprotection reaction and further increasing the adhesive strength and hot strength. More preferred are diamines having diaminoalkanes and ether bonds, particularly preferred are diaminoalkanes having 2 to 4 carbon atoms and diamines having ether bonds having 6 to 12 carbon atoms, and 1,3-aminopropane and 4,7 , 10-trioxatridecane-1,13-diamine is most preferred.
上記[A]錯体における化合物(a)に由来する基のオルガノボランに由来する基に対するモル比の下限としては、0.5が好ましく、0.7がより好ましく、0.9がさらに好ましく、1が特に好ましく、1.8がより特に好ましく、2.5がさらに特に好ましく、3.5が最も好ましい。上記モル比の上限としては、8が好ましく、7がより好ましく、6がさらに好ましく、5.5が特に好ましい。上記モル比を上記範囲とすることで、[A]錯体の安定性をより向上させることができ、その結果、当該2液混合型接着剤の保存安定性をより向上させることができる。
The lower limit of the molar ratio of the group derived from the compound (a) in the [A] complex to the group derived from the organoborane is preferably 0.5, more preferably 0.7, still more preferably 0.9, Is particularly preferred, 1.8 is more particularly preferred, 2.5 is even more particularly preferred, and 3.5 is most preferred. The upper limit of the molar ratio is preferably 8, more preferably 7, still more preferably 6, and particularly preferably 5.5. By making the said molar ratio into the said range, the stability of a [A] complex can be improved more and, as a result, the storage stability of the said 2 liquid mixture type adhesive can be improved more.
組成物(I)の調製に用いた化合物(a)のオルガノボランに対するモル比の下限としては、0.5が好ましく、0.7がより好ましく、0.9がさらに好ましく、1が特に好ましく、1.8がより特に好ましく、2.5がさらに特に好ましく、3.5が最も好ましい。上記モル比の上限としては、8が好ましく、7がより好ましく、6がさらに好ましく、5.5が特に好ましい。上記モル比を上記範囲とすることで、[A]錯体の安定性をより向上させることができ、その結果、当該2液混合型接着剤の保存安定性をより向上させることができる。
The lower limit of the molar ratio of the compound (a) to the organoborane used in the preparation of the composition (I) is preferably 0.5, more preferably 0.7, still more preferably 0.9, and particularly preferably 1. 1.8 is more particularly preferable, 2.5 is further particularly preferable, and 3.5 is most preferable. The upper limit of the molar ratio is preferably 8, more preferably 7, still more preferably 6, and particularly preferably 5.5. By making the said molar ratio into the said range, the stability of a [A] complex can be improved more and, as a result, the storage stability of the said 2 liquid mixture type adhesive can be improved more.
組成物(I)における[A]錯体の含有量の下限としては、当該2液混合型接着剤の接着強度、硬化速度、熱間強度及び液ダレ抑制性をより高める観点から、0.1質量%が好ましく、0.5質量%がより好ましく、1質量%がさらに好ましく、2質量%が特に好ましい。上記含有量の上限としては、当該2液混合型接着剤の取扱容易性の観点から、20質量%が好ましく、10質量%がより好ましく、6質量%がさらに好ましく、4質量%が特に好ましい。
The lower limit of the content of the [A] complex in the composition (I) is 0.1 mass from the viewpoint of further improving the adhesive strength, curing rate, hot strength, and sag suppression of the two-component mixed adhesive. % Is preferable, 0.5% by mass is more preferable, 1% by mass is further preferable, and 2% by mass is particularly preferable. The upper limit of the content is preferably 20% by mass, more preferably 10% by mass, further preferably 6% by mass, and particularly preferably 4% by mass from the viewpoint of easy handling of the two-component mixed adhesive.
[[B]重合性化合物]
[B]重合性化合物は、1個の重合性基を有する化合物である(但し、[C]ポリマー成分及び[D]化合物に該当するものを除くものとする)。当該2液混合型接着剤は、[B]重合性化合物を含有することで、接着層の強度を向上させ、その結果、接着強度及び熱間強度をさらに向上させることができる。 [[B] polymerizable compound]
[B] The polymerizable compound is a compound having one polymerizable group (provided that the compounds corresponding to the [C] polymer component and the [D] compound are excluded). By including the [B] polymerizable compound, the two-component mixed adhesive can improve the strength of the adhesive layer, and as a result, the adhesive strength and the hot strength can be further improved.
[B]重合性化合物は、1個の重合性基を有する化合物である(但し、[C]ポリマー成分及び[D]化合物に該当するものを除くものとする)。当該2液混合型接着剤は、[B]重合性化合物を含有することで、接着層の強度を向上させ、その結果、接着強度及び熱間強度をさらに向上させることができる。 [[B] polymerizable compound]
[B] The polymerizable compound is a compound having one polymerizable group (provided that the compounds corresponding to the [C] polymer component and the [D] compound are excluded). By including the [B] polymerizable compound, the two-component mixed adhesive can improve the strength of the adhesive layer, and as a result, the adhesive strength and the hot strength can be further improved.
重合性基としては、例えばビニル基、アリル基、スチリル基、(メタ)アクリロイル基等の炭素-炭素二重結合含有基;エチニル基、プロパギル基等の炭素-炭素三重結合含有基等が挙げられる。
これらの中で、重合性により優れる観点から、炭素-炭素二重結合含有基が好ましく、(メタ)アクリロリル基がより好ましい。 Examples of the polymerizable group include carbon-carbon double bond-containing groups such as a vinyl group, allyl group, styryl group, and (meth) acryloyl group; carbon-carbon triple bond-containing groups such as ethynyl group and propargyl group. .
Among these, a carbon-carbon double bond-containing group is preferable and a (meth) acrylolyl group is more preferable from the viewpoint of superior polymerizability.
これらの中で、重合性により優れる観点から、炭素-炭素二重結合含有基が好ましく、(メタ)アクリロリル基がより好ましい。 Examples of the polymerizable group include carbon-carbon double bond-containing groups such as a vinyl group, allyl group, styryl group, and (meth) acryloyl group; carbon-carbon triple bond-containing groups such as ethynyl group and propargyl group. .
Among these, a carbon-carbon double bond-containing group is preferable and a (meth) acrylolyl group is more preferable from the viewpoint of superior polymerizability.
[B]重合性化合物としては、例えば
ブテン、ペンテン、ヘキセン、オクテン、デセン、ドデセン等のオレフィン;
スチレン、α-メチルスチレン、メチルスチレン等のスチレン化合物;
酢酸ビニル、プロピオン酸ビニル、ラウリル酸ビニル等のカルボン酸ビニル;
塩化ビニル、塩化ビニリデン等のハロゲン化オレフィン;
メチルビニルケトン、メチルビニルエーテル等のビニル化合物;
メチル(メタ)アクリレート、エチル(メタ)アクリレート、ブチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート等のアルキル(メタ)アクリレート;
シクロペンチル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、4-ブチルシクロヘキシル(メタ)アクリレート、ボルニル(メタ)アクリレート、イソボルニル(メタ)アクリレート、トリシクロデカン-イル(メタ)アクリレート、テトラシクロドデカン-イル(メタ)アクリレート等のシクロアルキル(メタ)アクリレート、シクロペンテニル(メタ)アクリレート、シクロヘキセニル(メタ)アクリレート、トリシクロデセン-イル(メタ)アクリレート等のシクロアルケニル(メタ)アクリレートなどの脂環を有する(メタ)アクリレート;
フェニル(メタ)アクリレート、トリル(メタ)アクリレート等のアリール(メタ)アクリレート;
ヒドロキシエチル(メタ)アクリレート、グリシジル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート等のヘテロ原子含有(メタ)アクリレート;
(メタ)アクリルアミド、N-メチル(メタ)アクリルアミド、(メタ)アクリロニトリルなどが挙げられる。 [B] Examples of the polymerizable compound include olefins such as butene, pentene, hexene, octene, decene, and dodecene;
Styrene compounds such as styrene, α-methylstyrene and methylstyrene;
Vinyl carboxylates such as vinyl acetate, vinyl propionate and vinyl laurate;
Halogenated olefins such as vinyl chloride and vinylidene chloride;
Vinyl compounds such as methyl vinyl ketone and methyl vinyl ether;
Alkyl (meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate;
Cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate, tricyclodecan-yl (meth) acrylate, tetracyclododecan-yl (meth) ) Having an alicyclic ring such as cycloalkenyl (meth) acrylate such as cycloalkyl (meth) acrylate such as acrylate, cyclopentenyl (meth) acrylate, cyclohexenyl (meth) acrylate, tricyclodecenyl (meth) acrylate (meta) ) Acrylate;
Aryl (meth) acrylates such as phenyl (meth) acrylate and tolyl (meth) acrylate;
Heteroatom-containing (meth) acrylates such as hydroxyethyl (meth) acrylate, glycidyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate;
(Meth) acrylamide, N-methyl (meth) acrylamide, (meth) acrylonitrile and the like can be mentioned.
ブテン、ペンテン、ヘキセン、オクテン、デセン、ドデセン等のオレフィン;
スチレン、α-メチルスチレン、メチルスチレン等のスチレン化合物;
酢酸ビニル、プロピオン酸ビニル、ラウリル酸ビニル等のカルボン酸ビニル;
塩化ビニル、塩化ビニリデン等のハロゲン化オレフィン;
メチルビニルケトン、メチルビニルエーテル等のビニル化合物;
メチル(メタ)アクリレート、エチル(メタ)アクリレート、ブチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート等のアルキル(メタ)アクリレート;
シクロペンチル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、4-ブチルシクロヘキシル(メタ)アクリレート、ボルニル(メタ)アクリレート、イソボルニル(メタ)アクリレート、トリシクロデカン-イル(メタ)アクリレート、テトラシクロドデカン-イル(メタ)アクリレート等のシクロアルキル(メタ)アクリレート、シクロペンテニル(メタ)アクリレート、シクロヘキセニル(メタ)アクリレート、トリシクロデセン-イル(メタ)アクリレート等のシクロアルケニル(メタ)アクリレートなどの脂環を有する(メタ)アクリレート;
フェニル(メタ)アクリレート、トリル(メタ)アクリレート等のアリール(メタ)アクリレート;
ヒドロキシエチル(メタ)アクリレート、グリシジル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート等のヘテロ原子含有(メタ)アクリレート;
(メタ)アクリルアミド、N-メチル(メタ)アクリルアミド、(メタ)アクリロニトリルなどが挙げられる。 [B] Examples of the polymerizable compound include olefins such as butene, pentene, hexene, octene, decene, and dodecene;
Styrene compounds such as styrene, α-methylstyrene and methylstyrene;
Vinyl carboxylates such as vinyl acetate, vinyl propionate and vinyl laurate;
Halogenated olefins such as vinyl chloride and vinylidene chloride;
Vinyl compounds such as methyl vinyl ketone and methyl vinyl ether;
Alkyl (meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate;
Cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate, tricyclodecan-yl (meth) acrylate, tetracyclododecan-yl (meth) ) Having an alicyclic ring such as cycloalkenyl (meth) acrylate such as cycloalkyl (meth) acrylate such as acrylate, cyclopentenyl (meth) acrylate, cyclohexenyl (meth) acrylate, tricyclodecenyl (meth) acrylate (meta) ) Acrylate;
Aryl (meth) acrylates such as phenyl (meth) acrylate and tolyl (meth) acrylate;
Heteroatom-containing (meth) acrylates such as hydroxyethyl (meth) acrylate, glycidyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate;
(Meth) acrylamide, N-methyl (meth) acrylamide, (meth) acrylonitrile and the like can be mentioned.
これらの中で、重合性により優れる観点から、(メタ)アクリレートが好ましく、イソシアネート基を有しない(メタ)アクリレートがより好ましい。その中で、当該2液混合型接着剤の臭気低減の観点及び後述する[C]ポリマー成分を溶解させる観点から、ヘテロ原子含有(メタ)アクリレートが好ましく、テトラヒドロフルフリル(メタ)アクリレートがより好ましい。接着層への柔軟性付与の観点から、アルキル(メタ)アクリレートが好ましく、2-エチルヘキシル(メタ)アクリレートがより好ましい。熱間強度をより向上させる観点から、脂環を有する(メタ)アクリレートが好ましく、シクロアルキル(メタ)アクリレートがより好ましく、トリシクロデシル(メタ)アクリレートがさらに好ましい。[B]重合性化合物としては、1種又は2種以上用いてもよい。
Of these, (meth) acrylate is preferred from the viewpoint of superior polymerizability, and (meth) acrylate having no isocyanate group is more preferred. Among them, from the viewpoint of reducing the odor of the two-component mixed adhesive and from the viewpoint of dissolving the [C] polymer component described later, a heteroatom-containing (meth) acrylate is preferable, and tetrahydrofurfuryl (meth) acrylate is more preferable. . From the viewpoint of imparting flexibility to the adhesive layer, alkyl (meth) acrylate is preferable, and 2-ethylhexyl (meth) acrylate is more preferable. From the viewpoint of further improving the hot strength, (meth) acrylate having an alicyclic ring is preferable, cycloalkyl (meth) acrylate is more preferable, and tricyclodecyl (meth) acrylate is further preferable. [B] One or two or more polymerizable compounds may be used.
組成物(I)が[B]重合性化合物を含有する場合、組成物(I)における[B]重合性化合物の含有量の下限としては、10質量%が好ましく、30質量%がより好ましく、50質量%がさらに好ましく、60質量%が特に好ましい。上記含有量の上限としては、99質量%が好ましく、95質量%がより好ましく、90質量%がさらに好ましく、85質量%が特に好ましい。上記含有量を上記下限と上記上限の間とすることで、接着層の強度をより向上させ、その結果、接着強度及び熱間強度をさらに向上させることができる。
When the composition (I) contains a [B] polymerizable compound, the lower limit of the content of the [B] polymerizable compound in the composition (I) is preferably 10% by mass, more preferably 30% by mass, 50 mass% is further more preferable, and 60 mass% is especially preferable. As an upper limit of the said content, 99 mass% is preferable, 95 mass% is more preferable, 90 mass% is further more preferable, 85 mass% is especially preferable. By setting the content to be between the lower limit and the upper limit, the strength of the adhesive layer can be further improved, and as a result, the adhesive strength and the hot strength can be further improved.
[[C]ポリマー成分]
組成物(I)は、当該2液混合型接着剤の初期接着強度の向上及び粘度調整、接着層の硬化収縮抑制等の観点から、[C]ポリマー成分を含有することが好ましい。 [[C] Polymer component]
The composition (I) preferably contains a [C] polymer component from the viewpoint of improving the initial adhesive strength and adjusting the viscosity of the two-component mixed adhesive, and suppressing the curing shrinkage of the adhesive layer.
組成物(I)は、当該2液混合型接着剤の初期接着強度の向上及び粘度調整、接着層の硬化収縮抑制等の観点から、[C]ポリマー成分を含有することが好ましい。 [[C] Polymer component]
The composition (I) preferably contains a [C] polymer component from the viewpoint of improving the initial adhesive strength and adjusting the viscosity of the two-component mixed adhesive, and suppressing the curing shrinkage of the adhesive layer.
[C]ポリマー成分としては、ポリマーであれば特に限定されず、例えばポリオレフィン、ポリスチレン、スチレン共重合体、ポリ(メタ)アクリレート、ポリジエン、アクリル共重合体、熱可塑性エラストマー等が挙げられる。また、エチレン-酢酸ビニル共重合体、エポキシ樹脂、フェノール樹脂、シリコーン樹脂、ポリエステル樹脂、ウレタン樹脂等も用いることができる。さらに、[C]ポリマー成分としては、これらのポリマーの構造を含む共重合体も好適に用いることができる。
[C] The polymer component is not particularly limited as long as it is a polymer, and examples thereof include polyolefin, polystyrene, styrene copolymer, poly (meth) acrylate, polydiene, acrylic copolymer, and thermoplastic elastomer. Further, ethylene-vinyl acetate copolymer, epoxy resin, phenol resin, silicone resin, polyester resin, urethane resin, and the like can be used. Furthermore, as a [C] polymer component, the copolymer containing the structure of these polymers can also be used suitably.
上記ポリオレフィンとしては、例えばポリエチレン、ポリプロピレン、エチレン-α-オレフィン共重合体等が挙げられる。
Examples of the polyolefin include polyethylene, polypropylene, and ethylene-α-olefin copolymers.
上記ポリスチレンとしては、例えばポリスチレン、ポリ(α-メチルスチレン)等が挙げられる。
Examples of the polystyrene include polystyrene and poly (α-methylstyrene).
上記スチレン共重合体としては、例えばスチレン-メタクリル酸メチル共重合体、スチレン-アクリル酸共重合体、スチレン-無水マレイン酸共重合体、スチレン-アクリロニトリル共重合体、ABS(アクリロニトリル-ブタジエン-スチレン共重合体)等が挙げられる。
上記ポリ(メタ)アクリレートとしては、ポリメチル(メタ)アクリレート、ポリエチル(メタ)アクリレート、ポリブチル(メタ)アクリレート等が挙げられる。 Examples of the styrene copolymer include styrene-methyl methacrylate copolymer, styrene-acrylic acid copolymer, styrene-maleic anhydride copolymer, styrene-acrylonitrile copolymer, ABS (acrylonitrile-butadiene-styrene copolymer). Polymer) and the like.
Examples of the poly (meth) acrylate include polymethyl (meth) acrylate, polyethyl (meth) acrylate, polybutyl (meth) acrylate and the like.
上記ポリ(メタ)アクリレートとしては、ポリメチル(メタ)アクリレート、ポリエチル(メタ)アクリレート、ポリブチル(メタ)アクリレート等が挙げられる。 Examples of the styrene copolymer include styrene-methyl methacrylate copolymer, styrene-acrylic acid copolymer, styrene-maleic anhydride copolymer, styrene-acrylonitrile copolymer, ABS (acrylonitrile-butadiene-styrene copolymer). Polymer) and the like.
Examples of the poly (meth) acrylate include polymethyl (meth) acrylate, polyethyl (meth) acrylate, polybutyl (meth) acrylate and the like.
上記ポリジエンとしては、例えばポリブタジエン、ポリイソプレン等が挙げられる。
Examples of the polydiene include polybutadiene and polyisoprene.
上記アクリル共重合体としては、例えば複数種の(メタ)アクリル酸エステル単位を有する重合体、ブチル(メタ)アクリレート-アクリロニトリル共重合体等が挙げられる。
上記熱可塑性エラストマーとしては、例えばSBS(スチレン-ブタジエン-スチレンブロック共重合体)、SEBS(スチレン-エチレン-ブタジエン-スチレンブロック共重合体)、SIS(スチレン-イソプレン-スチレンブロック共重合体)、SEPS(スチレン-エチレン-プロピレン-スチレンブロック共重合体)等の共役ジエン系共重合体の未水素添加体、これらの水素添加体などが挙げられる。 Examples of the acrylic copolymer include polymers having plural types of (meth) acrylic acid ester units, butyl (meth) acrylate-acrylonitrile copolymers, and the like.
Examples of the thermoplastic elastomer include SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butadiene-styrene block copolymer), SIS (styrene-isoprene-styrene block copolymer), and SEPS. Non-hydrogenated products of conjugated diene copolymers such as (styrene-ethylene-propylene-styrene block copolymer), and hydrogenated products thereof.
上記熱可塑性エラストマーとしては、例えばSBS(スチレン-ブタジエン-スチレンブロック共重合体)、SEBS(スチレン-エチレン-ブタジエン-スチレンブロック共重合体)、SIS(スチレン-イソプレン-スチレンブロック共重合体)、SEPS(スチレン-エチレン-プロピレン-スチレンブロック共重合体)等の共役ジエン系共重合体の未水素添加体、これらの水素添加体などが挙げられる。 Examples of the acrylic copolymer include polymers having plural types of (meth) acrylic acid ester units, butyl (meth) acrylate-acrylonitrile copolymers, and the like.
Examples of the thermoplastic elastomer include SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butadiene-styrene block copolymer), SIS (styrene-isoprene-styrene block copolymer), and SEPS. Non-hydrogenated products of conjugated diene copolymers such as (styrene-ethylene-propylene-styrene block copolymer), and hydrogenated products thereof.
これらの中で、より適度な粘度を有する観点から、熱可塑性エラストマー及びポリ(メタ)アクリレートが好ましく、熱可塑性エラストマーがより好ましい。
Among these, from the viewpoint of having a more appropriate viscosity, thermoplastic elastomers and poly (meth) acrylates are preferable, and thermoplastic elastomers are more preferable.
[C]ポリマー成分としては、重合部位を有するものが好ましい。[C]ポリマー成分が重合部位を有することで、[C]ポリマー成分と脱保護反応生成物(p)等とが共重合し、その結果、上述の初期接着強度の向上、粘度調整及び硬化収縮抑制をより効果的に行うことができる。上記重合部位としては、例えばポリマー主鎖中の炭素-炭素二重結合、ポリマーの側鎖又は末端が有する重合性基等が挙げられる。重合部位を有する[C]ポリマー成分としては、例えば共役ジエン系共重合体の未水素添加体が挙げられる。これらの中でも、より適度な粘度を有する観点から、SBSが好ましい。
[C] The polymer component preferably has a polymerization site. [C] Since the polymer component has a polymerization site, the [C] polymer component and the deprotection reaction product (p), etc. are copolymerized. As a result, the above-mentioned improvement in initial adhesive strength, viscosity adjustment and cure shrinkage Suppression can be performed more effectively. Examples of the polymerization site include a carbon-carbon double bond in the polymer main chain, a polymerizable group in the side chain or terminal of the polymer, and the like. Examples of the [C] polymer component having a polymerization site include an unhydrogenated product of a conjugated diene copolymer. Among these, SBS is preferable from the viewpoint of having a more appropriate viscosity.
[C]ポリマー成分としては、ポリマー粒子であってもよく、粒子を形成していないポリマーであってもよい。組成物(I)は、[C]ポリマー成分として、ポリマー粒子を含有することが好ましい。組成物(I)がポリマー粒子を含有することで、当該2液混合型接着剤は、接着層の柔軟性をより向上させることができる。また、組成物(I)は、[C]ポリマー成分として、ポリマー粒子と粒子を形成していないポリマーとを含有することがより好ましい。組成物(I)がポリマー粒子と粒子を形成していないポリマーとを両方含有することで、当該2液混合型接着剤は、接着層の柔軟性をさらに向上させることができる。
[C] The polymer component may be a polymer particle or a polymer that does not form a particle. The composition (I) preferably contains polymer particles as the [C] polymer component. When the composition (I) contains polymer particles, the two-component mixed adhesive can further improve the flexibility of the adhesive layer. The composition (I) more preferably contains polymer particles and a polymer not forming particles as the [C] polymer component. When the composition (I) contains both the polymer particles and the polymer not forming the particles, the two-component mixed adhesive can further improve the flexibility of the adhesive layer.
上記ポリマー粒子を形成する[C]ポリマー成分としては、ポリオレフィン、ポリスチレン、スチレン共重合体、ポリ(メタ)アクリレート、ポリジエンアクリル共重合体及びこれらのポリマーの構造を含む共重合体が好ましく、ポリスチレン、ポリ(メタ)アクリレート、ポリジエン及びこれらのポリマーの構造を含む共重合体がより好ましい。
[C] The polymer component forming the polymer particles is preferably a polyolefin, polystyrene, styrene copolymer, poly (meth) acrylate, polydiene acrylic copolymer, or a copolymer containing the structure of these polymers, and polystyrene. , Poly (meth) acrylates, polydienes and copolymers comprising the structures of these polymers are more preferred.
上記ポリマー粒子の平均粒子径の下限としては、0.005μmが好ましく、0.01μmがより好ましく、0.05μmがさらに好ましく、0.1μmが特に好ましい。上記平均粒子径の上限としては、1μmが好ましく、0.8μmがより好ましく、0.6μmがさらに好ましく、0.4μmが特に好ましい。
The lower limit of the average particle diameter of the polymer particles is preferably 0.005 μm, more preferably 0.01 μm, further preferably 0.05 μm, and particularly preferably 0.1 μm. The upper limit of the average particle diameter is preferably 1 μm, more preferably 0.8 μm, further preferably 0.6 μm, and particularly preferably 0.4 μm.
上記ポリマー粒子としては、例えば単一粒子、コア-シェル構造を有する粒子(コア-シェル粒子)等が挙げられる。これらの中で、コア-シェル粒子が好ましい。上記ポリマー粒子としてコア-シェル粒子を用いることで、当該2液混合型接着剤は、接着層の柔軟性をさらに向上させることができる。このようなコア-シェル粒子の市販品としては、例えばカネカ社の「カネエースM-511」、「同M-521」、「同M-570」、「同M-711」、JSR社の「FX602P」、「FX501」、日本ゼオン社の「ゼオンF351」等が挙げられる。
Examples of the polymer particles include single particles and particles having a core-shell structure (core-shell particles). Of these, core-shell particles are preferred. By using core-shell particles as the polymer particles, the two-component mixed adhesive can further improve the flexibility of the adhesive layer. Examples of such commercially available core-shell particles include “Kane Ace M-511”, “M-521”, “M-570”, “M-711” of Kaneka Corporation, “FX602P” of JSR Corporation. ”,“ FX501 ”,“ Zeon F351 ”manufactured by Nippon Zeon Co., Ltd., and the like.
[C]ポリマー成分としてポリマー粒子を含有している場合、[C]ポリマー成分中の上記ポリマー粒子の含有率の下限としては、10質量%が好ましく、15質量%がより好ましく、20質量%がさらに好ましく、25質量%が特に好ましい。上記含有率の上限としては、70質量%が好ましく、50質量%がより好ましく、45質量%がさらに好ましく、40質量%が特に好ましい。上記ポリマー粒子の含有率を上記範囲とすることで、当該2液混合型接着剤は、接着層の柔軟性と接着強度とを共に高めることができる。
[C] When polymer particles are contained as the polymer component, the lower limit of the content of the polymer particles in the [C] polymer component is preferably 10% by mass, more preferably 15% by mass, and 20% by mass. Further preferred is 25% by mass. As an upper limit of the said content rate, 70 mass% is preferable, 50 mass% is more preferable, 45 mass% is further more preferable, 40 mass% is especially preferable. By setting the content of the polymer particles in the above range, the two-component mixed adhesive can increase both the flexibility and the adhesive strength of the adhesive layer.
上記粒子を形成していない[C]ポリマー成分としては、スチレン共重合体、ポリ(メタ)アクリレート、ポリジエン、熱可塑性エラストマー、シリコーン樹脂、ポリエステル樹脂及びウレタン樹脂が好ましく、熱可塑性エラストマーがより好ましく、SBSがより好ましい。
As the [C] polymer component not forming the particles, styrene copolymer, poly (meth) acrylate, polydiene, thermoplastic elastomer, silicone resin, polyester resin and urethane resin are preferable, and thermoplastic elastomer is more preferable. SBS is more preferred.
組成物(I)が[C]ポリマー成分を含有する場合、組成物(I)における[C]ポリマー成分の含有量の下限としては、1質量%が好ましく、5質量%がより好ましく、8質量%がさらに好ましく、10質量%が特に好ましい。上記含有量の上限としては、60質量%が好ましく、45質量%がより好ましく、35質量%がさらに好ましく、30質量%が特に好ましい。上記含有量を上記下限と上記上限の間とすることで、初期接着強度の向上及び粘度調整、接着層の硬化収縮抑制等をより効果的に行うことができる。
When the composition (I) contains a [C] polymer component, the lower limit of the content of the [C] polymer component in the composition (I) is preferably 1% by mass, more preferably 5% by mass, and 8% by mass. % Is more preferable, and 10% by mass is particularly preferable. As an upper limit of the said content, 60 mass% is preferable, 45 mass% is more preferable, 35 mass% is further more preferable, 30 mass% is especially preferable. By setting the content to be between the lower limit and the upper limit, it is possible to effectively improve the initial adhesive strength, adjust the viscosity, suppress the curing shrinkage of the adhesive layer, and the like.
[その他の成分]
組成物(I)は、上記[A]~[C]成分以外のその他の成分として、例えば架橋性化合物、可塑剤、無機充填剤、着色剤、重合禁止剤等を含有していてもよい。これらのその他の成分は、それぞれ1種又は2種以上を含有していてもよい。 [Other ingredients]
The composition (I) may contain, for example, a crosslinkable compound, a plasticizer, an inorganic filler, a colorant, a polymerization inhibitor and the like as other components other than the above-described components [A] to [C]. These other components may contain 1 type (s) or 2 or more types, respectively.
組成物(I)は、上記[A]~[C]成分以外のその他の成分として、例えば架橋性化合物、可塑剤、無機充填剤、着色剤、重合禁止剤等を含有していてもよい。これらのその他の成分は、それぞれ1種又は2種以上を含有していてもよい。 [Other ingredients]
The composition (I) may contain, for example, a crosslinkable compound, a plasticizer, an inorganic filler, a colorant, a polymerization inhibitor and the like as other components other than the above-described components [A] to [C]. These other components may contain 1 type (s) or 2 or more types, respectively.
(架橋性化合物)
上記架橋性化合物は、2以上の重合性基を有する化合物である。組成物(I)に架橋性化合物を含有させることで、熱間強度及び接着層の伸び率をより高めることができる。 (Crosslinkable compound)
The crosslinkable compound is a compound having two or more polymerizable groups. By including a crosslinkable compound in the composition (I), the hot strength and the elongation percentage of the adhesive layer can be further increased.
上記架橋性化合物は、2以上の重合性基を有する化合物である。組成物(I)に架橋性化合物を含有させることで、熱間強度及び接着層の伸び率をより高めることができる。 (Crosslinkable compound)
The crosslinkable compound is a compound having two or more polymerizable groups. By including a crosslinkable compound in the composition (I), the hot strength and the elongation percentage of the adhesive layer can be further increased.
上記架橋性化合物が有する重合性基としては、例えば上記[B]重合性化合物が有する重合性基として例示したもの等が挙げられる。これらの中で、重合速度を高くでき、熱間強度をより高めることができる観点から、(メタ)アクリロイル基が好ましい。
Examples of the polymerizable group possessed by the crosslinkable compound include those exemplified as the polymerizable group possessed by the above-mentioned [B] polymerizable compound. Among these, a (meth) acryloyl group is preferable from the viewpoint that the polymerization rate can be increased and the hot strength can be further increased.
上記架橋性化合物が有する重合性基の数としては、熱間強度向上の観点から、2~4が好ましく、2又は3がより好ましく、2がさらに好ましい。
The number of polymerizable groups possessed by the crosslinkable compound is preferably 2 to 4, more preferably 2 or 3, and even more preferably 2 from the viewpoint of improving the hot strength.
上記架橋性化合物としては、例えば
エチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート等の鎖状グリコール系架橋性化合物;
トリシクロデカンジイルジ(メタ)アクリレート等の脂環式グリコール系架橋性化合物;
トリメチロールプロパントリ(メタ)アクリレート等のトリメチロールプロパン系架橋性化合物;
ビスフェノールAビス(ポリエチレングリコール(メタ)アクリレート)等のビスフェノール系架橋性化合物;
トリ(N-ヒドロキシエチル)イソシアヌレートジ(メタ)アクリレート等のイミド系イソシアヌレート系架橋性化合物;
下記式(2)で表される化合物等のウレタン系架橋性化合物;
下記式(3)で表される化合物等の末端ビスマレイミド変性のポリイミド系架橋性化合物などが挙げられる。 Examples of the crosslinkable compounds include chain glycol crosslinkable compounds such as ethylene glycol di (meth) acrylate and triethylene glycol di (meth) acrylate;
Alicyclic glycol-based crosslinkable compounds such as tricyclodecanediyl di (meth) acrylate;
Trimethylolpropane-based crosslinkable compounds such as trimethylolpropane tri (meth) acrylate;
Bisphenol crosslinkable compounds such as bisphenol A bis (polyethylene glycol (meth) acrylate);
Imido isocyanurate crosslinkable compounds such as tri (N-hydroxyethyl) isocyanurate di (meth) acrylate;
Urethane-based crosslinkable compounds such as compounds represented by the following formula (2);
Examples thereof include terminal bismaleimide-modified polyimide crosslinkable compounds such as a compound represented by the following formula (3).
エチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート等の鎖状グリコール系架橋性化合物;
トリシクロデカンジイルジ(メタ)アクリレート等の脂環式グリコール系架橋性化合物;
トリメチロールプロパントリ(メタ)アクリレート等のトリメチロールプロパン系架橋性化合物;
ビスフェノールAビス(ポリエチレングリコール(メタ)アクリレート)等のビスフェノール系架橋性化合物;
トリ(N-ヒドロキシエチル)イソシアヌレートジ(メタ)アクリレート等のイミド系イソシアヌレート系架橋性化合物;
下記式(2)で表される化合物等のウレタン系架橋性化合物;
下記式(3)で表される化合物等の末端ビスマレイミド変性のポリイミド系架橋性化合物などが挙げられる。 Examples of the crosslinkable compounds include chain glycol crosslinkable compounds such as ethylene glycol di (meth) acrylate and triethylene glycol di (meth) acrylate;
Alicyclic glycol-based crosslinkable compounds such as tricyclodecanediyl di (meth) acrylate;
Trimethylolpropane-based crosslinkable compounds such as trimethylolpropane tri (meth) acrylate;
Bisphenol crosslinkable compounds such as bisphenol A bis (polyethylene glycol (meth) acrylate);
Imido isocyanurate crosslinkable compounds such as tri (N-hydroxyethyl) isocyanurate di (meth) acrylate;
Urethane-based crosslinkable compounds such as compounds represented by the following formula (2);
Examples thereof include terminal bismaleimide-modified polyimide crosslinkable compounds such as a compound represented by the following formula (3).
上記式(2)中、mは、1~20の整数である。
上記式(3)中、nは、1~20の整数である。R4及びR5は、それぞれ独立して、炭素数1~20のアルキレン基である。Ar1は、炭素数6~20のアリーレン基である。nが2以上の場合、複数のR4は同一でも異なっていてもよく、複数のAr1は同一でも異なっていてもよい。 In the above formula (2), m is an integer of 1-20.
In the above formula (3), n is an integer of 1-20. R 4 and R 5 are each independently an alkylene group having 1 to 20 carbon atoms. Ar 1 is an arylene group having 6 to 20 carbon atoms. When n is 2 or more, the plurality of R 4 may be the same or different, and the plurality of Ar 1 may be the same or different.
上記式(3)中、nは、1~20の整数である。R4及びR5は、それぞれ独立して、炭素数1~20のアルキレン基である。Ar1は、炭素数6~20のアリーレン基である。nが2以上の場合、複数のR4は同一でも異なっていてもよく、複数のAr1は同一でも異なっていてもよい。 In the above formula (2), m is an integer of 1-20.
In the above formula (3), n is an integer of 1-20. R 4 and R 5 are each independently an alkylene group having 1 to 20 carbon atoms. Ar 1 is an arylene group having 6 to 20 carbon atoms. When n is 2 or more, the plurality of R 4 may be the same or different, and the plurality of Ar 1 may be the same or different.
上記架橋性化合物としては、脂環式グリコール系架橋性化合物が好ましく、トリシクロデカンジイルジ(メタ)アクリレートがより好ましい。
As the crosslinkable compound, an alicyclic glycol-based crosslinkable compound is preferable, and tricyclodecanediyl di (meth) acrylate is more preferable.
組成物(I)が架橋性化合物を含有する場合、組成物(I)における架橋性化合物の含有量としては、熱間強度及び接着層の伸び率をさらに高める観点から、0.1質量%が好ましく、0.5質量%がより好ましく、2質量%がさらに好ましい。上記含有量の上限としては、20質量%が好ましく、15質量%がより好ましく、12質量%がさらに好ましく、10質量%が特に好ましい。
When the composition (I) contains a crosslinkable compound, the content of the crosslinkable compound in the composition (I) is 0.1% by mass from the viewpoint of further increasing the hot strength and the elongation rate of the adhesive layer. Preferably, 0.5 mass% is more preferable, and 2 mass% is further more preferable. As an upper limit of the said content, 20 mass% is preferable, 15 mass% is more preferable, 12 mass% is further more preferable, and 10 mass% is especially preferable.
上記可塑剤としては、例えばジブチルフタレート、ジ(2-エチルヘキシル)フタレート、ブチルベンジルフタレート等のフタル酸エステル;ジオクチルアジペート、ジオクチルセバケート等の非芳香族二塩基酸エステル;ジプロピレングリコールジベンゾエート、トリエチレングリコールジベンゾエート等の安息香酸エステルなどが挙げられる。
Examples of the plasticizer include phthalic acid esters such as dibutyl phthalate, di (2-ethylhexyl) phthalate and butyl benzyl phthalate; non-aromatic dibasic acid esters such as dioctyl adipate and dioctyl sebacate; dipropylene glycol dibenzoate, tri Examples thereof include benzoic acid esters such as ethylene glycol dibenzoate.
上記無機充填剤としては、例えばアルミナ、シリカ、二酸化チタン等が挙げられる。
Examples of the inorganic filler include alumina, silica, titanium dioxide and the like.
上記着色剤としては、例えばカーボンブラック等が挙げられる。
Examples of the colorant include carbon black.
上記金属塩は、当該2液混合型接着剤のポットライフ調整のために含有させることができる。上記金属塩としては、例えば臭化銅(II)、塩化銅(II)、銅(II)2-エチルヘキサノエート等が挙げられる。
The metal salt can be contained for adjusting the pot life of the two-component mixed adhesive. Examples of the metal salt include copper (II) bromide, copper (II) chloride, copper (II) 2-ethylhexanoate and the like.
上記重合禁止剤としては、例えばヒドロキノン、ヒドロキノンモノメチルエーテル等が挙げられる。
Examples of the polymerization inhibitor include hydroquinone and hydroquinone monomethyl ether.
<組成物(II)>
組成物(II)は、[D]化合物を含有する。組成物(II)は、また、組成物(I)と同様に、[B]重合性化合物」及び/又は[C]ポリマー成分を含有することが好ましく、その他の成分を含有していてもよい。
以下、各成分について説明する。 <Composition (II)>
Composition (II) contains a [D] compound. The composition (II) preferably contains the [B] polymerizable compound ”and / or the [C] polymer component, and may contain other components, like the composition (I). .
Hereinafter, each component will be described.
組成物(II)は、[D]化合物を含有する。組成物(II)は、また、組成物(I)と同様に、[B]重合性化合物」及び/又は[C]ポリマー成分を含有することが好ましく、その他の成分を含有していてもよい。
以下、各成分について説明する。 <Composition (II)>
Composition (II) contains a [D] compound. The composition (II) preferably contains the [B] polymerizable compound ”and / or the [C] polymer component, and may contain other components, like the composition (I). .
Hereinafter, each component will be described.
[[D]化合物]
[D]化合物は、上記[A]錯体の保護基と脱保護反応して脱保護反応生成物(p)を形成する化合物であり、かつこの脱保護反応生成物(p)が重合性を有する。上述したように、当該2液混合型接着剤の使用時に、組成物(I)と組成物(II)を混合することで、[D]化合物は[A]錯体の保護基と脱保護反応して、脱保護反応生成物(p)とオルガノボランとが生じ、このオルガノボランの重合開始能により、脱保護反応生成物(p)が重合することにより接着が進行する。 [[D] Compound]
The compound [D] is a compound that forms a deprotection reaction product (p) by deprotection reaction with the protecting group of the above-mentioned [A] complex, and the deprotection reaction product (p) has polymerizability. . As described above, when the two-component mixed adhesive is used, by mixing the composition (I) and the composition (II), the [D] compound undergoes a deprotection reaction with the protecting group of the [A] complex. As a result, a deprotection reaction product (p) and an organoborane are produced, and the deprotection reaction product (p) is polymerized due to the polymerization initiation ability of the organoborane, whereby the adhesion proceeds.
[D]化合物は、上記[A]錯体の保護基と脱保護反応して脱保護反応生成物(p)を形成する化合物であり、かつこの脱保護反応生成物(p)が重合性を有する。上述したように、当該2液混合型接着剤の使用時に、組成物(I)と組成物(II)を混合することで、[D]化合物は[A]錯体の保護基と脱保護反応して、脱保護反応生成物(p)とオルガノボランとが生じ、このオルガノボランの重合開始能により、脱保護反応生成物(p)が重合することにより接着が進行する。 [[D] Compound]
The compound [D] is a compound that forms a deprotection reaction product (p) by deprotection reaction with the protecting group of the above-mentioned [A] complex, and the deprotection reaction product (p) has polymerizability. . As described above, when the two-component mixed adhesive is used, by mixing the composition (I) and the composition (II), the [D] compound undergoes a deprotection reaction with the protecting group of the [A] complex. As a result, a deprotection reaction product (p) and an organoborane are produced, and the deprotection reaction product (p) is polymerized due to the polymerization initiation ability of the organoborane, whereby the adhesion proceeds.
[D]化合物としては、例えば上記保護基と脱保護反応しうる基(以下、「基(a)」ともいう)と重合性基とを有する化合物等が挙げられる。
Examples of the [D] compound include a compound having a group capable of deprotecting with the above protecting group (hereinafter also referred to as “group (a)”) and a polymerizable group.
上記基(a)としては、上記保護基と反応することができる限り特に限定されないが、例えば
カルボニル基、チオカルボニル基、ニトロソ基、イミノ基(-CH=N-)、イソシアネート基、イソチオシアネート基、イソシアニド基、リン酸基等のヘテロ原子含有多重結合を有する基;
エポキシ基、環状カーボネート基等のヘテロ原子を含む環状基;
酸ハライド基、エステル基、アミド基、酸無水物基、カルボキシ基等の脱離基含有基などが挙げられる。なお、基(a)には、後述する重合性基にも該当するビニル基等も含まれる。これらの中で、脱保護反応がより容易となり、硬化速度を高くできる観点から、ヘテロ原子含有多重結合を有する基が好ましく、また脱保護反応により形成される基間の相互作用がより高く、接着強度、熱間強度及び液ダレ抑制性をさらに高める観点から、イソシアネート基及びイソチオシアネート基がより好ましく、イソシアネート基がさらに好ましい。 The group (a) is not particularly limited as long as it can react with the protecting group. For example, a carbonyl group, a thiocarbonyl group, a nitroso group, an imino group (—CH═N—), an isocyanate group, an isothiocyanate group , Groups having a heteroatom-containing multiple bond such as an isocyanide group and a phosphate group;
A cyclic group containing a hetero atom such as an epoxy group or a cyclic carbonate group;
Examples include an acid halide group, an ester group, an amide group, an acid anhydride group, and a leaving group-containing group such as a carboxy group. The group (a) includes a vinyl group corresponding to a polymerizable group described later. Among these, a group having a heteroatom-containing multiple bond is preferable from the viewpoint of easier deprotection reaction and higher curing rate, and higher interaction between groups formed by the deprotection reaction, and adhesion. From the viewpoint of further increasing the strength, hot strength, and dripping suppression, an isocyanate group and an isothiocyanate group are more preferable, and an isocyanate group is further preferable.
カルボニル基、チオカルボニル基、ニトロソ基、イミノ基(-CH=N-)、イソシアネート基、イソチオシアネート基、イソシアニド基、リン酸基等のヘテロ原子含有多重結合を有する基;
エポキシ基、環状カーボネート基等のヘテロ原子を含む環状基;
酸ハライド基、エステル基、アミド基、酸無水物基、カルボキシ基等の脱離基含有基などが挙げられる。なお、基(a)には、後述する重合性基にも該当するビニル基等も含まれる。これらの中で、脱保護反応がより容易となり、硬化速度を高くできる観点から、ヘテロ原子含有多重結合を有する基が好ましく、また脱保護反応により形成される基間の相互作用がより高く、接着強度、熱間強度及び液ダレ抑制性をさらに高める観点から、イソシアネート基及びイソチオシアネート基がより好ましく、イソシアネート基がさらに好ましい。 The group (a) is not particularly limited as long as it can react with the protecting group. For example, a carbonyl group, a thiocarbonyl group, a nitroso group, an imino group (—CH═N—), an isocyanate group, an isothiocyanate group , Groups having a heteroatom-containing multiple bond such as an isocyanide group and a phosphate group;
A cyclic group containing a hetero atom such as an epoxy group or a cyclic carbonate group;
Examples include an acid halide group, an ester group, an amide group, an acid anhydride group, and a leaving group-containing group such as a carboxy group. The group (a) includes a vinyl group corresponding to a polymerizable group described later. Among these, a group having a heteroatom-containing multiple bond is preferable from the viewpoint of easier deprotection reaction and higher curing rate, and higher interaction between groups formed by the deprotection reaction, and adhesion. From the viewpoint of further increasing the strength, hot strength, and dripping suppression, an isocyanate group and an isothiocyanate group are more preferable, and an isocyanate group is further preferable.
上記重合性基としては、例えば上記[B]重合性化合物が有する重合性基として例示したものと同様の基等が挙げられる。
これらの中で、重合性が高く、硬化速度をより高めることができる観点から、(メタ)アクリロイル基が好ましい。 As said polymeric group, the group similar to what was illustrated as a polymeric group which the said [B] polymeric compound has, for example is mentioned.
Among these, a (meth) acryloyl group is preferable from the viewpoints of high polymerizability and a higher curing rate.
これらの中で、重合性が高く、硬化速度をより高めることができる観点から、(メタ)アクリロイル基が好ましい。 As said polymeric group, the group similar to what was illustrated as a polymeric group which the said [B] polymeric compound has, for example is mentioned.
Among these, a (meth) acryloyl group is preferable from the viewpoints of high polymerizability and a higher curing rate.
[D]化合物が有する基(a)の数としては、上記脱保護反応をより容易にする観点から、1~3が好ましく、1及び2がより好ましく、1がさらに好ましい。
The number of groups (a) possessed by the [D] compound is preferably 1 to 3, more preferably 1 and 2, and even more preferably 1 from the viewpoint of facilitating the deprotection reaction.
[D]化合物が有する重合性基の数としては、形成される脱保護反応生成物(p)の重合速度をより高める観点から、1~3が好ましく、1及び2がより好ましく、1がさらに好ましい。
[D] The number of polymerizable groups possessed by the compound is preferably 1 to 3, more preferably 1 and 2, more preferably 1 from the viewpoint of further increasing the polymerization rate of the deprotection reaction product (p) to be formed. preferable.
[D]化合物が有する基(a)の数と重合性基の数の組み合わせとしては、基(a)の数が1及び2かつ重合性基の数が1及び2が好ましく、基(a)及び重合性基の数が共に1が好ましい。
[D] As the combination of the number of groups (a) and the number of polymerizable groups in the compound, the number of groups (a) is preferably 1 and 2, and the number of polymerizable groups is preferably 1 and 2, and the group (a) And the number of polymerizable groups is preferably 1.
[D]化合物としては、例えば
イソシアネート基を有する化合物として、
イソシアナトエチル(メタ)アクリレート、イソシアナトプロピル(メタ)アクリレート等のイソシアナトアルキル(メタ)アクリレート;ジイソシアネートと、ヒドロキシアルキル(メタ)アクリレートの付加物などのイソシアネート基を有する(メタ)アクリレート;
イソシアナトブテン、イソシアナトペンテン、イソシアナトヘキセン等のイソシアネート基を有するアルケンなどが挙げられる。 As the compound [D], for example, as a compound having an isocyanate group,
Isocyanatoalkyl (meth) acrylates such as isocyanatoethyl (meth) acrylate and isocyanatopropyl (meth) acrylate; (meth) acrylates having an isocyanate group such as an adduct of diisocyanate and hydroxyalkyl (meth) acrylate;
Examples thereof include alkenes having an isocyanate group such as isocyanatobutene, isocyanatopentene, and isocyanatohexene.
イソシアネート基を有する化合物として、
イソシアナトエチル(メタ)アクリレート、イソシアナトプロピル(メタ)アクリレート等のイソシアナトアルキル(メタ)アクリレート;ジイソシアネートと、ヒドロキシアルキル(メタ)アクリレートの付加物などのイソシアネート基を有する(メタ)アクリレート;
イソシアナトブテン、イソシアナトペンテン、イソシアナトヘキセン等のイソシアネート基を有するアルケンなどが挙げられる。 As the compound [D], for example, as a compound having an isocyanate group,
Isocyanatoalkyl (meth) acrylates such as isocyanatoethyl (meth) acrylate and isocyanatopropyl (meth) acrylate; (meth) acrylates having an isocyanate group such as an adduct of diisocyanate and hydroxyalkyl (meth) acrylate;
Examples thereof include alkenes having an isocyanate group such as isocyanatobutene, isocyanatopentene, and isocyanatohexene.
また、イソチオシアネート基を有する化合物として、
イソチオシアナトエチル(メタ)アクリレート、イソチオシアナトプロピル(メタ)アクリレート等のイソチオシアナトアルキル(メタ)アクリレート;ジイソチオシアネートと、ヒドロキシアルキル(メタ)アクリレートの付加物などのイソチオシアネート基を有する(メタ)アクリレート;
イソチオシアナトブテン、イソチオシアナトペンテン、イソチオシアナトヘキセン等のイソチオシアネート基を有するアルケンなどが挙げられる。 In addition, as a compound having an isothiocyanate group,
Isothiocyanatoalkyl (meth) acrylates such as isothiocyanatoethyl (meth) acrylate and isothiocyanatopropyl (meth) acrylate; having an isothiocyanate group such as an adduct of diisothiocyanate and hydroxyalkyl (meth) acrylate ( (Meth) acrylate;
Examples include alkene having an isothiocyanate group such as isothiocyanatobutene, isothiocyanatopentene, isothiocyanatohexene and the like.
イソチオシアナトエチル(メタ)アクリレート、イソチオシアナトプロピル(メタ)アクリレート等のイソチオシアナトアルキル(メタ)アクリレート;ジイソチオシアネートと、ヒドロキシアルキル(メタ)アクリレートの付加物などのイソチオシアネート基を有する(メタ)アクリレート;
イソチオシアナトブテン、イソチオシアナトペンテン、イソチオシアナトヘキセン等のイソチオシアネート基を有するアルケンなどが挙げられる。 In addition, as a compound having an isothiocyanate group,
Isothiocyanatoalkyl (meth) acrylates such as isothiocyanatoethyl (meth) acrylate and isothiocyanatopropyl (meth) acrylate; having an isothiocyanate group such as an adduct of diisothiocyanate and hydroxyalkyl (meth) acrylate ( (Meth) acrylate;
Examples include alkene having an isothiocyanate group such as isothiocyanatobutene, isothiocyanatopentene, isothiocyanatohexene and the like.
これらの中で、イソシアネート基を有する(メタ)アクリレート及びイソチオシアネート基を有する(メタ)アクリレートが好ましく、イソシアネート基を有する(メタ)アクリレートがより好ましく、イソシアナトアルキル(メタ)アクリレートがさらに好ましく、イソシアナトエチル(メタ)アクリレートが特に好ましい。
Among these, (meth) acrylate having an isocyanate group and (meth) acrylate having an isothiocyanate group are preferable, (meth) acrylate having an isocyanate group is more preferable, isocyanatoalkyl (meth) acrylate is further preferable, and isocyanate. Natoethyl (meth) acrylate is particularly preferred.
組成物(II)における[D]化合物の含有量の下限としては0.2質量%が好ましく、1質量%がより好ましく、2質量%がさらに好ましく、2.5質量%が特に好ましい。上記含有量の上限としては、40質量%が好ましく、20質量%がより好ましく、10質量%がさらに好ましく、7質量%が特に好ましい。[D]化合物の含有量を上記下限と上記上限の間とすることで、当該2液混合型接着剤の接着強度及び硬化速度をさらに高めることができる。
The lower limit of the content of the [D] compound in the composition (II) is preferably 0.2% by mass, more preferably 1% by mass, further preferably 2% by mass, and particularly preferably 2.5% by mass. As an upper limit of the said content, 40 mass% is preferable, 20 mass% is more preferable, 10 mass% is further more preferable, 7 mass% is especially preferable. By setting the content of the [D] compound between the lower limit and the upper limit, the adhesive strength and the curing rate of the two-component mixed adhesive can be further increased.
[D]化合物における基(a)と[A]錯体における化合物(a)の官能基(x)との組み合わせとしては、基(a)がイソシアネート基又はイソチオシアネート基で、かつ基(x)がアミノ基であることが好ましく、基(a)がイソシアネート基で、かつ基(x)がアミノ基であることがより好ましい。基(a)と官能基(x)とを上記組み合わせとすることで、脱保護反応によりウレア基が生成し、その結果、当該2液混合型接着剤のチクソトロピー性がさらに高いものとなる。この理由としては、例えば脱保護反応生成物(p)が有するウレア基間により適度な水素結合が働くためと推察される。
[D] As a combination of the group (a) in the compound and the functional group (x) of the compound (a) in the [A] complex, the group (a) is an isocyanate group or an isothiocyanate group, and the group (x) is It is preferably an amino group, more preferably the group (a) is an isocyanate group and the group (x) is an amino group. When the group (a) and the functional group (x) are combined as described above, a urea group is generated by the deprotection reaction, and as a result, the thixotropic property of the two-component mixed adhesive is further increased. This is presumably because, for example, an appropriate hydrogen bond works between the urea groups of the deprotection reaction product (p).
上記基(a)の上記保護基に対するモル比の下限としては、0.5が好ましく、0.7がより好ましく、1がさらに好ましく、1.5が特に好ましい。上記モル比の上限としては、6が好ましく、4がより好ましく、3がさらに好ましく、2.5が特に好ましい。上記モル比を上記下限と上記上限の間とすることで、当該2液混合型接着剤の接着速度、硬化速度、熱間強度及び液ダレ抑制性をさらに高めることができる。
The lower limit of the molar ratio of the group (a) to the protecting group is preferably 0.5, more preferably 0.7, still more preferably 1, and particularly preferably 1.5. The upper limit of the molar ratio is preferably 6, more preferably 4, more preferably 3, and particularly preferably 2.5. By setting the molar ratio between the lower limit and the upper limit, it is possible to further increase the adhesion rate, the curing rate, the hot strength, and the dripping suppression property of the two-component mixed adhesive.
上記基(a)がイソシアネート基、かつ上記保護基の由来化合物がジアミンの場合、上記イソシアネート基のジアミンに対するモル比の下限としては、1が好ましく、1.3がより好ましく、1.5がさらに好ましく、1.7が特に好ましい。上記モル比の上限としては、3が好ましく、2.7がより好ましく、2.5がさらに好ましく、2.3が特に好ましい。上記モル比を上記下限と上記上限の間とすることで、当該2液混合型接着剤の接着速度、硬化速度、熱間強度及び液ダレ抑制性をさらに高めることができる。
When the group (a) is an isocyanate group and the protective group-derived compound is a diamine, the lower limit of the molar ratio of the isocyanate group to the diamine is preferably 1, more preferably 1.3, and even more preferably 1.5 1.7 is particularly preferable. The upper limit of the molar ratio is preferably 3, more preferably 2.7, even more preferably 2.5, and particularly preferably 2.3. By setting the molar ratio between the lower limit and the upper limit, it is possible to further increase the adhesion rate, the curing rate, the hot strength, and the dripping suppression property of the two-component mixed adhesive.
当該2液混合型接着剤のチクソトロピー指数(TI)の下限としては、組成物(I)と組成物(II)とを混合した直後の値として、3が好ましく、5がより好ましく、6がさらに好ましい。上記TIの上限としては、10が好ましく、9がより好ましく、8がさらに好ましい。当該2液混合型接着剤は、TI値を上記下限と上記上限の間とすることで、高い液ダレ抑制性を発揮することができる。なお、上記TI値は、組成物(I)に[A]錯体を含有しないものを調製し、これと組成物(II)とを混合させたものについて測定することにより求めることができる。
The lower limit of the thixotropy index (TI) of the two-component mixed adhesive is preferably 3 as a value immediately after mixing the composition (I) and the composition (II), more preferably 5, and further 6 preferable. The upper limit of the TI is preferably 10, more preferably 9, and even more preferably 8. The said 2 liquid mixture type adhesive can exhibit high dripping suppression property by making TI value between the said minimum and the said upper limit. In addition, the said TI value can be calculated | required by preparing what does not contain an [A] complex in composition (I), and measuring this and mixing with composition (II).
[[B]重合性化合物]
組成物(II)は、[B]重合性化合物を含有することが好ましい。[B]重合性化合物についての説明、好ましいもの及び含有量については、組成物(I)の場合と同様である。 [[B] polymerizable compound]
The composition (II) preferably contains [B] a polymerizable compound. [B] The explanation about the polymerizable compound, the preferred one and the content thereof are the same as in the case of the composition (I).
組成物(II)は、[B]重合性化合物を含有することが好ましい。[B]重合性化合物についての説明、好ましいもの及び含有量については、組成物(I)の場合と同様である。 [[B] polymerizable compound]
The composition (II) preferably contains [B] a polymerizable compound. [B] The explanation about the polymerizable compound, the preferred one and the content thereof are the same as in the case of the composition (I).
[[C]ポリマー成分]
組成物(II)は、[C]ポリマー成分を含有することが好ましい。[C]ポリマー成分についての説明、好ましいもの及び含有量については、組成物(I)の場合と同様である。 [[C] Polymer component]
The composition (II) preferably contains a [C] polymer component. [C] The explanation, preferred and content of the polymer component are the same as in the case of the composition (I).
組成物(II)は、[C]ポリマー成分を含有することが好ましい。[C]ポリマー成分についての説明、好ましいもの及び含有量については、組成物(I)の場合と同様である。 [[C] Polymer component]
The composition (II) preferably contains a [C] polymer component. [C] The explanation, preferred and content of the polymer component are the same as in the case of the composition (I).
[その他の成分]
組成物(II)は、その他の成分を含有していてもよい。その他の成分についての説明、好ましいもの及び含有量については、組成物(I)の場合と同様である。上記架橋性化合物は、組成物(II)中に含有させることが好ましい。 [Other ingredients]
The composition (II) may contain other components. About description, preferable thing, and content about another component, it is the same as that of the case of composition (I). The crosslinkable compound is preferably contained in the composition (II).
組成物(II)は、その他の成分を含有していてもよい。その他の成分についての説明、好ましいもの及び含有量については、組成物(I)の場合と同様である。上記架橋性化合物は、組成物(II)中に含有させることが好ましい。 [Other ingredients]
The composition (II) may contain other components. About description, preferable thing, and content about another component, it is the same as that of the case of composition (I). The crosslinkable compound is preferably contained in the composition (II).
<2液混合型接着剤の調製方法>
当該2液混合型接着剤は、例えば[A]錯体、並びに必要に応じて[B]重合性化合物、[C]ポリマー成分及びその他の成分を混合することにより組成物(I)を調製し、また別途、[D]化合物、並びに必要に応じて[B]重合性化合物、[C]ポリマー成分及びその他の成分を混合することにより組成物(II)を調製することにより得ることができる。 <Method for preparing two-component mixed adhesive>
The two-component mixed adhesive is prepared by, for example, preparing the composition (I) by mixing the [A] complex and, if necessary, the [B] polymerizable compound, the [C] polymer component, and other components, Separately, it can be obtained by preparing the composition (II) by mixing the [D] compound and, if necessary, the [B] polymerizable compound, the [C] polymer component and other components.
当該2液混合型接着剤は、例えば[A]錯体、並びに必要に応じて[B]重合性化合物、[C]ポリマー成分及びその他の成分を混合することにより組成物(I)を調製し、また別途、[D]化合物、並びに必要に応じて[B]重合性化合物、[C]ポリマー成分及びその他の成分を混合することにより組成物(II)を調製することにより得ることができる。 <Method for preparing two-component mixed adhesive>
The two-component mixed adhesive is prepared by, for example, preparing the composition (I) by mixing the [A] complex and, if necessary, the [B] polymerizable compound, the [C] polymer component, and other components, Separately, it can be obtained by preparing the composition (II) by mixing the [D] compound and, if necessary, the [B] polymerizable compound, the [C] polymer component and other components.
<2液混合型接着剤の使用方法>
当該2液混合型接着剤は、公知の方法により使用することができる。例えば接着操作の際に、組成物(I)と組成物(II)とを混合し、得られた混合物を被着材の一方に塗布した後、塗布した混合物に他方の被着材を密着させるように重ねること等により行うことができる。また、上記混合物を、両方の被着材に塗布した後、これらの塗布した混合物どうしを密着させるようにしてもよい。被着材としては、ポリプロピレン(PP)、ポリエチレン(PE)、ポリフェニレンスルフィド(PPS)、ポリアミド6(PA6)、ポリアミド66(PA66)等の樹脂材料;ステンレス鋼(SUS)、溶融亜鉛メッキ鋼(SGHC)、電着鋼(ED)等の金属材料などが挙げられ、これらのうちの同種又は異種のものを用いることができ、樹脂材料どうし、金属材料どうし及び樹脂材料-金属材料の接着を行うことができる。両被着材の間に形成される接着層の厚みとしては、通常0.01mm~5mmであり、0.05mm~3mmが好ましく、0.1mm~1mmがより好ましい。 <How to use a two-component mixed adhesive>
The two-component mixed adhesive can be used by a known method. For example, during the bonding operation, the composition (I) and the composition (II) are mixed, and after the obtained mixture is applied to one of the adherends, the other adherend is brought into close contact with the applied mixture. Thus, it can be carried out by overlapping. Moreover, after apply | coating the said mixture to both to-be-adhered materials, you may make it closely adhere these applied mixtures. As the adherend, polypropylene (PP), polyethylene (PE), polyphenylene sulfide (PPS), polyamide 6 (PA6), polyamide 66 (PA66) and other resin materials; stainless steel (SUS), hot dip galvanized steel (SGHC) ), Metal materials such as electrodeposited steel (ED), etc., of which the same or different types can be used, and resin materials, metal materials and resin materials-metal materials can be bonded Can do. The thickness of the adhesive layer formed between the two adherends is usually 0.01 mm to 5 mm, preferably 0.05 mm to 3 mm, more preferably 0.1 mm to 1 mm.
当該2液混合型接着剤は、公知の方法により使用することができる。例えば接着操作の際に、組成物(I)と組成物(II)とを混合し、得られた混合物を被着材の一方に塗布した後、塗布した混合物に他方の被着材を密着させるように重ねること等により行うことができる。また、上記混合物を、両方の被着材に塗布した後、これらの塗布した混合物どうしを密着させるようにしてもよい。被着材としては、ポリプロピレン(PP)、ポリエチレン(PE)、ポリフェニレンスルフィド(PPS)、ポリアミド6(PA6)、ポリアミド66(PA66)等の樹脂材料;ステンレス鋼(SUS)、溶融亜鉛メッキ鋼(SGHC)、電着鋼(ED)等の金属材料などが挙げられ、これらのうちの同種又は異種のものを用いることができ、樹脂材料どうし、金属材料どうし及び樹脂材料-金属材料の接着を行うことができる。両被着材の間に形成される接着層の厚みとしては、通常0.01mm~5mmであり、0.05mm~3mmが好ましく、0.1mm~1mmがより好ましい。 <How to use a two-component mixed adhesive>
The two-component mixed adhesive can be used by a known method. For example, during the bonding operation, the composition (I) and the composition (II) are mixed, and after the obtained mixture is applied to one of the adherends, the other adherend is brought into close contact with the applied mixture. Thus, it can be carried out by overlapping. Moreover, after apply | coating the said mixture to both to-be-adhered materials, you may make it closely adhere these applied mixtures. As the adherend, polypropylene (PP), polyethylene (PE), polyphenylene sulfide (PPS), polyamide 6 (PA6), polyamide 66 (PA66) and other resin materials; stainless steel (SUS), hot dip galvanized steel (SGHC) ), Metal materials such as electrodeposited steel (ED), etc., of which the same or different types can be used, and resin materials, metal materials and resin materials-metal materials can be bonded Can do. The thickness of the adhesive layer formed between the two adherends is usually 0.01 mm to 5 mm, preferably 0.05 mm to 3 mm, more preferably 0.1 mm to 1 mm.
以下、本発明を実施例に基づいて具体的に説明するが、本発明はこれらの実施例に限定されるものではない。
Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to these examples.
<2液混合型接着剤の調製>
[実施例1](2液混合型接着剤(J-1)の調製)
([B]重合性化合物及び[C]ポリマー成分混合溶液の調製)
攪拌機を備えた300mLセパラブルフラスコに、SBS20.0g及びテトラヒドロフルフリルメタクリレート(THFMA)60.0gを仕込み、40℃のオイルバス中で3時間撹拌し、SBSをTHFMAに完全に溶解させた。次いで、2-エチルヘキシルメタクリレート(2EHMA)17.5gを加えてさらに1時間撹拌して混合した後、2時間減圧脱泡して混合溶液(a)を調製した。 <Preparation of two-component mixed adhesive>
[Example 1] (Preparation of two-component mixed adhesive (J-1))
(Preparation of [B] polymerizable compound and [C] polymer component mixed solution)
A 300 mL separable flask equipped with a stirrer was charged with 20.0 g of SBS and 60.0 g of tetrahydrofurfuryl methacrylate (THFMA), and stirred in an oil bath at 40 ° C. for 3 hours to completely dissolve SBS in THFMA. Next, 17.5 g of 2-ethylhexyl methacrylate (2EHMA) was added, and the mixture was further stirred for 1 hour and mixed, and then degassed under reduced pressure for 2 hours to prepare a mixed solution (a).
[実施例1](2液混合型接着剤(J-1)の調製)
([B]重合性化合物及び[C]ポリマー成分混合溶液の調製)
攪拌機を備えた300mLセパラブルフラスコに、SBS20.0g及びテトラヒドロフルフリルメタクリレート(THFMA)60.0gを仕込み、40℃のオイルバス中で3時間撹拌し、SBSをTHFMAに完全に溶解させた。次いで、2-エチルヘキシルメタクリレート(2EHMA)17.5gを加えてさらに1時間撹拌して混合した後、2時間減圧脱泡して混合溶液(a)を調製した。 <Preparation of two-component mixed adhesive>
[Example 1] (Preparation of two-component mixed adhesive (J-1))
(Preparation of [B] polymerizable compound and [C] polymer component mixed solution)
A 300 mL separable flask equipped with a stirrer was charged with 20.0 g of SBS and 60.0 g of tetrahydrofurfuryl methacrylate (THFMA), and stirred in an oil bath at 40 ° C. for 3 hours to completely dissolve SBS in THFMA. Next, 17.5 g of 2-ethylhexyl methacrylate (2EHMA) was added, and the mixture was further stirred for 1 hour and mixed, and then degassed under reduced pressure for 2 hours to prepare a mixed solution (a).
(組成物(I)の調製)
上記調製した混合溶液(a)97.5gと、[A]錯体としてのトリエチルボラン-ジアミノプロパン錯体(TEB-DAP)2.5gとをプラスチック製容器中に入れて混合させ、組成物(I-1)を調製した。 (Preparation of composition (I))
97.5 g of the mixed solution (a) prepared above and 2.5 g of triethylborane-diaminopropane complex (TEB-DAP) as a complex [A] were placed in a plastic container and mixed to obtain a composition (I- 1) was prepared.
上記調製した混合溶液(a)97.5gと、[A]錯体としてのトリエチルボラン-ジアミノプロパン錯体(TEB-DAP)2.5gとをプラスチック製容器中に入れて混合させ、組成物(I-1)を調製した。 (Preparation of composition (I))
97.5 g of the mixed solution (a) prepared above and 2.5 g of triethylborane-diaminopropane complex (TEB-DAP) as a complex [A] were placed in a plastic container and mixed to obtain a composition (I- 1) was prepared.
(組成物(II)の調製)
上記調製した混合溶液(a)95.5gと、[D]化合物としての2-イソシアナトエチルメタクリレート(MOI)4.5gとをプラスチック製容器中に入れて混合させ、組成物(II-1)を調製した。 (Preparation of composition (II))
95.5 g of the prepared mixed solution (a) and 4.5 g of 2-isocyanatoethyl methacrylate (MOI) as the [D] compound were placed in a plastic container and mixed to obtain a composition (II-1) Was prepared.
上記調製した混合溶液(a)95.5gと、[D]化合物としての2-イソシアナトエチルメタクリレート(MOI)4.5gとをプラスチック製容器中に入れて混合させ、組成物(II-1)を調製した。 (Preparation of composition (II))
95.5 g of the prepared mixed solution (a) and 4.5 g of 2-isocyanatoethyl methacrylate (MOI) as the [D] compound were placed in a plastic container and mixed to obtain a composition (II-1) Was prepared.
なお、調製に用いた各成分は、以下のものを用いた。
SBS:JSR社の「TR2787」
THFMA:共栄社化学社の「ライトエステルTHF」
2EHMA:共栄社化学社の「ライトエステルEH」
TEB-DAP:BASFジャパン社の「TEB-DAP」
MOI:昭和電工社の「カレンズMOI」 In addition, the following were used for each component used for preparation.
SBS: “TR2787” from JSR
THFMA: “Light Ester THF” from Kyoeisha Chemical Co., Ltd.
2EHMA: Kyoeisha Chemical Company's “Light Ester EH”
TEB-DAP: “TEB-DAP” from BASF Japan
MOI: “Karenz MOI” from Showa Denko
SBS:JSR社の「TR2787」
THFMA:共栄社化学社の「ライトエステルTHF」
2EHMA:共栄社化学社の「ライトエステルEH」
TEB-DAP:BASFジャパン社の「TEB-DAP」
MOI:昭和電工社の「カレンズMOI」 In addition, the following were used for each component used for preparation.
SBS: “TR2787” from JSR
THFMA: “Light Ester THF” from Kyoeisha Chemical Co., Ltd.
2EHMA: Kyoeisha Chemical Company's “Light Ester EH”
TEB-DAP: “TEB-DAP” from BASF Japan
MOI: “Karenz MOI” from Showa Denko
[実施例2~4](2液混合型接着剤(J-2)~(J-4)の調製)
組成物(I)については、上記実施例1で調製した組成物(I-1)をそのまま組成物(I-2)~(I-4)として用いた。組成物(II)については、上記実施例1の組成物(II-1)の調製において、用いたMOIの質量/混合溶液(a)の質量を、それぞれ6.75g/93.25g、5.4g/94.6g、3.6g/96.4gとした以外は、実施例1の場合と同様にして、組成物(II-2)~(II-4)を調製した。 [Examples 2 to 4] (Preparation of two-component mixed adhesives (J-2) to (J-4))
For the composition (I), the composition (I-1) prepared in Example 1 was directly used as the compositions (I-2) to (I-4). For the composition (II), the mass of MOI used / the mass of the mixed solution (a) used in the preparation of the composition (II-1) of Example 1 was 6.75 g / 93.25 g, 5. Compositions (II-2) to (II-4) were prepared in the same manner as in Example 1, except that the amount was 4 g / 94.6 g, 3.6 g / 96.4 g.
組成物(I)については、上記実施例1で調製した組成物(I-1)をそのまま組成物(I-2)~(I-4)として用いた。組成物(II)については、上記実施例1の組成物(II-1)の調製において、用いたMOIの質量/混合溶液(a)の質量を、それぞれ6.75g/93.25g、5.4g/94.6g、3.6g/96.4gとした以外は、実施例1の場合と同様にして、組成物(II-2)~(II-4)を調製した。 [Examples 2 to 4] (Preparation of two-component mixed adhesives (J-2) to (J-4))
For the composition (I), the composition (I-1) prepared in Example 1 was directly used as the compositions (I-2) to (I-4). For the composition (II), the mass of MOI used / the mass of the mixed solution (a) used in the preparation of the composition (II-1) of Example 1 was 6.75 g / 93.25 g, 5. Compositions (II-2) to (II-4) were prepared in the same manner as in Example 1, except that the amount was 4 g / 94.6 g, 3.6 g / 96.4 g.
[比較例1](2液混合型接着剤(CJ-1)の調製)
組成物(I)については、上記実施例1で調製した組成物(I-1)をそのまま組成物(I-C)として用いた。 [Comparative Example 1] (Preparation of two-component mixed adhesive (CJ-1))
As for the composition (I), the composition (I-1) prepared in Example 1 was used as it was as the composition (IC).
組成物(I)については、上記実施例1で調製した組成物(I-1)をそのまま組成物(I-C)として用いた。 [Comparative Example 1] (Preparation of two-component mixed adhesive (CJ-1))
As for the composition (I), the composition (I-1) prepared in Example 1 was used as it was as the composition (IC).
組成物(II)は、以下のようにして調製した。攪拌機を備えた300mLセパラブルフラスコに、SBS20.0g及びTHFMA54.75gを仕込み、40℃のオイルバス中で3時間撹拌し、SBSをTHFMAに完全に溶解させた。次いで、2EHMA15.0g、マレイン酸モノ2-(メタクリロイロキシ)エチル10.0g及びp-トルエンスルホニルクロライド0.25gを加えてさらに1時間撹拌して混合した後、2時間減圧脱泡することにより組成物(II-C)を得た。
Composition (II) was prepared as follows. A 300 mL separable flask equipped with a stirrer was charged with 20.0 g of SBS and 54.75 g of THFMA and stirred in an oil bath at 40 ° C. for 3 hours to completely dissolve SBS in THFMA. Next, 15.0 g of 2EHMA, 10.0 g of mono-2- (methacryloyloxy) ethyl maleate and 0.25 g of p-toluenesulfonyl chloride were added, and the mixture was further stirred for 1 hour and then degassed under reduced pressure for 2 hours. A composition (II-C) was obtained.
<評価>
上記調製した各2液混合型接着剤を用い、下記方法に従って、接着強度測定用試験片を作製し、下記剪断試験及びT形剥離試験により接着強度(剪断強度及びT形剥離強度)を測定し、評価した。また、接着層の伸び率について、下記方法に従って測定した。 <Evaluation>
Using each of the two-component mixed adhesives prepared above, a test piece for measuring adhesive strength was prepared according to the following method, and the adhesive strength (shear strength and T-type peel strength) was measured by the following shear test and T-type peel test. ,evaluated. Further, the elongation percentage of the adhesive layer was measured according to the following method.
上記調製した各2液混合型接着剤を用い、下記方法に従って、接着強度測定用試験片を作製し、下記剪断試験及びT形剥離試験により接着強度(剪断強度及びT形剥離強度)を測定し、評価した。また、接着層の伸び率について、下記方法に従って測定した。 <Evaluation>
Using each of the two-component mixed adhesives prepared above, a test piece for measuring adhesive strength was prepared according to the following method, and the adhesive strength (shear strength and T-type peel strength) was measured by the following shear test and T-type peel test. ,evaluated. Further, the elongation percentage of the adhesive layer was measured according to the following method.
[剪断強度の測定]
(試験片作製方法)
2枚の被着材(それぞれ縦2.5cm×横10cm)を準備し、それぞれ接着剤を塗布する直前に、アセトンを含んだ紙ワイパー(日本製紙クレシア社の「キムワイプ」)で表面の汚れを除去した。次に、組成物(I)と組成物(II)とをバッグ混合法により混合した。すなわち、ポリエチレン製の袋に、組成物(I)と組成物(II)とを1:1の質量比になるようそれぞれ秤量し、袋を封じた後、均一に混合するため、手のひらの上で転動させることにより、1分間混合した。次いで、袋の隅をハサミでカットし、混合された接着剤を、被着材の一方の1.25cm四方の部分に均一に塗布した。接着剤の厚みを一定にするため、直径0.25mmのガラスビーズを挟んでから、他方の被着材を上に重ねて、試験片を作製した。 [Measurement of shear strength]
(Test piece preparation method)
Prepare two adherends (each 2.5 cm long × 10 cm wide) and immediately before applying the adhesive, clean the surface with a paper wiper containing acetone (“Kimwipe” from Nippon Paper Crecia). Removed. Next, the composition (I) and the composition (II) were mixed by a bag mixing method. That is, in a polyethylene bag, the composition (I) and the composition (II) are respectively weighed so as to have a mass ratio of 1: 1, sealed, and mixed uniformly. Mix for 1 minute by rolling. Next, the corners of the bag were cut with scissors, and the mixed adhesive was uniformly applied to one 1.25 cm square portion of the adherend. In order to make the thickness of the adhesive constant, glass beads having a diameter of 0.25 mm were sandwiched, and the other adherend was stacked on top to prepare a test piece.
(試験片作製方法)
2枚の被着材(それぞれ縦2.5cm×横10cm)を準備し、それぞれ接着剤を塗布する直前に、アセトンを含んだ紙ワイパー(日本製紙クレシア社の「キムワイプ」)で表面の汚れを除去した。次に、組成物(I)と組成物(II)とをバッグ混合法により混合した。すなわち、ポリエチレン製の袋に、組成物(I)と組成物(II)とを1:1の質量比になるようそれぞれ秤量し、袋を封じた後、均一に混合するため、手のひらの上で転動させることにより、1分間混合した。次いで、袋の隅をハサミでカットし、混合された接着剤を、被着材の一方の1.25cm四方の部分に均一に塗布した。接着剤の厚みを一定にするため、直径0.25mmのガラスビーズを挟んでから、他方の被着材を上に重ねて、試験片を作製した。 [Measurement of shear strength]
(Test piece preparation method)
Prepare two adherends (each 2.5 cm long × 10 cm wide) and immediately before applying the adhesive, clean the surface with a paper wiper containing acetone (“Kimwipe” from Nippon Paper Crecia). Removed. Next, the composition (I) and the composition (II) were mixed by a bag mixing method. That is, in a polyethylene bag, the composition (I) and the composition (II) are respectively weighed so as to have a mass ratio of 1: 1, sealed, and mixed uniformly. Mix for 1 minute by rolling. Next, the corners of the bag were cut with scissors, and the mixed adhesive was uniformly applied to one 1.25 cm square portion of the adherend. In order to make the thickness of the adhesive constant, glass beads having a diameter of 0.25 mm were sandwiched, and the other adherend was stacked on top to prepare a test piece.
(剪断試験方法)
上記作製した試験片について、接着部の引張剪断強度を、引張試験機(島津製作所社の「オ-トグラフAG5000B」)を使用してJIS-K6850に準拠して測定した。測定条件は、温度:23℃、チャック間距離:110mm、テストスピード:5mm/分とした。 (Shear test method)
With respect to the prepared test piece, the tensile shear strength of the bonded portion was measured according to JIS-K6850 using a tensile tester (“Autograph AG5000B” manufactured by Shimadzu Corporation). The measurement conditions were as follows: temperature: 23 ° C., distance between chucks: 110 mm, test speed: 5 mm / min.
上記作製した試験片について、接着部の引張剪断強度を、引張試験機(島津製作所社の「オ-トグラフAG5000B」)を使用してJIS-K6850に準拠して測定した。測定条件は、温度:23℃、チャック間距離:110mm、テストスピード:5mm/分とした。 (Shear test method)
With respect to the prepared test piece, the tensile shear strength of the bonded portion was measured according to JIS-K6850 using a tensile tester (“Autograph AG5000B” manufactured by Shimadzu Corporation). The measurement conditions were as follows: temperature: 23 ° C., distance between chucks: 110 mm, test speed: 5 mm / min.
[T形剥離強度の測定]
(試験片作製方法)
縦2.5cm×横20cmの被着材(ED鋼板)を片側から5cmの部分で90°に曲げ、L字になるように加工した被着材を2枚準備し、それぞれ接着剤を塗布する直前に、アセトンを含んだ紙ワイパー(日本製紙クレシア社の「キムワイプ」)で表面の汚れを除去した。接着剤の混合は、上記剪断試験片作製方法の場合と同様に行い、混合された接着剤を、被着材の一方の長辺部分に均一に塗布した。接着剤の厚みを一定にするため、直径0.25mmのガラスビーズを挟んでから、他方の被着材を上に重ねて、試験片を作製した。 [Measurement of T-peel strength]
(Test piece preparation method)
Prepare two pieces of adherend processed by bending an adherend (ED steel plate) 2.5 cm long × 20 cm wide at 90 ° at 5 cm from one side, and applying an adhesive to each. Immediately before, surface dirt was removed with a paper wiper containing acetone (“Kimwipe” manufactured by Nippon Paper Crecia Co., Ltd.). Adhesives were mixed in the same manner as in the above-described shear test piece preparation method, and the mixed adhesive was uniformly applied to one long side portion of the adherend. In order to make the thickness of the adhesive constant, glass beads having a diameter of 0.25 mm were sandwiched, and the other adherend was stacked on top to prepare a test piece.
(試験片作製方法)
縦2.5cm×横20cmの被着材(ED鋼板)を片側から5cmの部分で90°に曲げ、L字になるように加工した被着材を2枚準備し、それぞれ接着剤を塗布する直前に、アセトンを含んだ紙ワイパー(日本製紙クレシア社の「キムワイプ」)で表面の汚れを除去した。接着剤の混合は、上記剪断試験片作製方法の場合と同様に行い、混合された接着剤を、被着材の一方の長辺部分に均一に塗布した。接着剤の厚みを一定にするため、直径0.25mmのガラスビーズを挟んでから、他方の被着材を上に重ねて、試験片を作製した。 [Measurement of T-peel strength]
(Test piece preparation method)
Prepare two pieces of adherend processed by bending an adherend (ED steel plate) 2.5 cm long × 20 cm wide at 90 ° at 5 cm from one side, and applying an adhesive to each. Immediately before, surface dirt was removed with a paper wiper containing acetone (“Kimwipe” manufactured by Nippon Paper Crecia Co., Ltd.). Adhesives were mixed in the same manner as in the above-described shear test piece preparation method, and the mixed adhesive was uniformly applied to one long side portion of the adherend. In order to make the thickness of the adhesive constant, glass beads having a diameter of 0.25 mm were sandwiched, and the other adherend was stacked on top to prepare a test piece.
(T形剥離試験方法)
上記作製した試験片について、接着部のT形剥離強度を、引張試験機(島津製作所社の「オートグラフAG5000B」)を使用してJIS-K6854-3に準拠して測定した。測定条件は、温度:23℃、チャック間距離:50mm、テストスピード:200mm/分とした。 (T-type peel test method)
With respect to the prepared test piece, the T-shaped peel strength of the bonded portion was measured according to JIS-K6854-3 using a tensile tester (“Autograph AG5000B” manufactured by Shimadzu Corporation). The measurement conditions were as follows: temperature: 23 ° C., distance between chucks: 50 mm, test speed: 200 mm / min.
上記作製した試験片について、接着部のT形剥離強度を、引張試験機(島津製作所社の「オートグラフAG5000B」)を使用してJIS-K6854-3に準拠して測定した。測定条件は、温度:23℃、チャック間距離:50mm、テストスピード:200mm/分とした。 (T-type peel test method)
With respect to the prepared test piece, the T-shaped peel strength of the bonded portion was measured according to JIS-K6854-3 using a tensile tester (“Autograph AG5000B” manufactured by Shimadzu Corporation). The measurement conditions were as follows: temperature: 23 ° C., distance between chucks: 50 mm, test speed: 200 mm / min.
[接着層の伸び率の測定]
(試験片作製方法)
接着剤の混合は上記剪断試験片作製方法の場合と同様に行い、混合された接着剤を、厚み2mmのステンレス製の型枠中で上下をPETフィルムで挟み、室温で4日間硬化させることで平坦なシート状の硬化物を作製した。得られたシートからJISK-6251に規定されるダンベル状2号形のダンベル打ち抜き機を用いてダンベル試験片を作製した。 [Measurement of elongation rate of adhesive layer]
(Test piece preparation method)
Adhesive mixing is performed in the same manner as in the above shear test piece preparation method, and the mixed adhesive is sandwiched between PET films on the top and bottom in a 2 mm thick stainless steel mold and cured at room temperature for 4 days. A flat sheet-like cured product was produced. A dumbbell test piece was prepared from the obtained sheet using a dumbbell-shaped No. 2 dumbbell punching machine defined in JISK-6251.
(試験片作製方法)
接着剤の混合は上記剪断試験片作製方法の場合と同様に行い、混合された接着剤を、厚み2mmのステンレス製の型枠中で上下をPETフィルムで挟み、室温で4日間硬化させることで平坦なシート状の硬化物を作製した。得られたシートからJISK-6251に規定されるダンベル状2号形のダンベル打ち抜き機を用いてダンベル試験片を作製した。 [Measurement of elongation rate of adhesive layer]
(Test piece preparation method)
Adhesive mixing is performed in the same manner as in the above shear test piece preparation method, and the mixed adhesive is sandwiched between PET films on the top and bottom in a 2 mm thick stainless steel mold and cured at room temperature for 4 days. A flat sheet-like cured product was produced. A dumbbell test piece was prepared from the obtained sheet using a dumbbell-shaped No. 2 dumbbell punching machine defined in JISK-6251.
上記作製したダンベル試験片について、硬化物の破断伸びを、引張試験機(島津製作所社の「オートグラフAG5000B」)を使用して測定した。測定条件は、温度:23℃、チャック間距離:30mm、テストスピード:100mm/分とした。接着層の伸び率は、試験片が破断した時のチャックの移動距離から算出した。
For the dumbbell test piece produced above, the elongation at break of the cured product was measured using a tensile tester (“Autograph AG5000B” manufactured by Shimadzu Corporation). The measurement conditions were as follows: temperature: 23 ° C., distance between chucks: 30 mm, test speed: 100 mm / min. The elongation percentage of the adhesive layer was calculated from the moving distance of the chuck when the test piece broke.
[接着強度及び硬化速度]
実施例1及び比較例1の2液混合型接着剤に対して、硬化時間と接着強度との関係を表1(ガラス繊維補強ポリプロピレン/ガラス繊維補強ポリプロピレン(GFPP/GFPP)の場合)及び表2(電着鋼/電着鋼(ED/ED)の場合)に示す。 [Adhesive strength and curing speed]
Table 1 (in the case of glass fiber reinforced polypropylene / glass fiber reinforced polypropylene (GFPP / GFPP)) and Table 2 show the relationship between curing time and adhesive strength for the two-component mixed adhesives of Example 1 and Comparative Example 1. (In the case of electrodeposited steel / electrodeposited steel (ED / ED)).
実施例1及び比較例1の2液混合型接着剤に対して、硬化時間と接着強度との関係を表1(ガラス繊維補強ポリプロピレン/ガラス繊維補強ポリプロピレン(GFPP/GFPP)の場合)及び表2(電着鋼/電着鋼(ED/ED)の場合)に示す。 [Adhesive strength and curing speed]
Table 1 (in the case of glass fiber reinforced polypropylene / glass fiber reinforced polypropylene (GFPP / GFPP)) and Table 2 show the relationship between curing time and adhesive strength for the two-component mixed adhesives of Example 1 and Comparative Example 1. (In the case of electrodeposited steel / electrodeposited steel (ED / ED)).
表1及び表2の結果から、実施例の2液混合型接着剤は、比較例のものに比べて、硬化速度及び接着強度に共に優れることが示された。
From the results of Tables 1 and 2, it was shown that the two-component mixed adhesives of the examples were superior in both curing speed and adhesive strength as compared with the comparative examples.
[被着材の種類]
各種被着材間における接着性を評価した。被着材としては、樹脂材料として、ガラス繊維補強ポリプロピレン(GFPP)、ポリエチレン(PE)、ポリフェニレンスルフィド(PPS)、ポリアミド6(PA6)及びポリアミド66(PA66)、金属材料として、ステンレス鋼(SUS)、溶融亜鉛メッキ鋼(SGHC)及び電着鋼(ED)のものを下記表3に示す組み合わせで用い、接着強度の測定を行った。剪断強度の測定値を下記表3に示す。 [Type of substrate]
The adhesion between various adherends was evaluated. As the adherend, glass fiber reinforced polypropylene (GFPP), polyethylene (PE), polyphenylene sulfide (PPS), polyamide 6 (PA6) and polyamide 66 (PA66) are used as the resin material, and stainless steel (SUS) is used as the metal material. Using the combinations shown in Table 3 below, the adhesive strength was measured using hot dip galvanized steel (SGHC) and electrodeposited steel (ED). The measured values of shear strength are shown in Table 3 below.
各種被着材間における接着性を評価した。被着材としては、樹脂材料として、ガラス繊維補強ポリプロピレン(GFPP)、ポリエチレン(PE)、ポリフェニレンスルフィド(PPS)、ポリアミド6(PA6)及びポリアミド66(PA66)、金属材料として、ステンレス鋼(SUS)、溶融亜鉛メッキ鋼(SGHC)及び電着鋼(ED)のものを下記表3に示す組み合わせで用い、接着強度の測定を行った。剪断強度の測定値を下記表3に示す。 [Type of substrate]
The adhesion between various adherends was evaluated. As the adherend, glass fiber reinforced polypropylene (GFPP), polyethylene (PE), polyphenylene sulfide (PPS), polyamide 6 (PA6) and polyamide 66 (PA66) are used as the resin material, and stainless steel (SUS) is used as the metal material. Using the combinations shown in Table 3 below, the adhesive strength was measured using hot dip galvanized steel (SGHC) and electrodeposited steel (ED). The measured values of shear strength are shown in Table 3 below.
また、破壊モードを目視により評価した。破壊モードは、A:界面破壊、B:材料破壊、B’:材料延伸、C:凝集破壊であったことをそれぞれ示す。「C>A」は、破壊モードが複合的であり、主に凝集破壊で、一部界面破壊であることを示す)。また、破壊モードのA及びBの下付文字は、破壊が起こった材料を示す。
Also, the failure mode was visually evaluated. The fracture modes indicate A: interface fracture, B: material fracture, B ′: material stretching, and C: cohesive fracture, respectively. “C> A” indicates that the fracture mode is complex, mainly cohesive fracture, and partially interfacial fracture). The subscripts A and B in the failure mode indicate the material in which the failure occurred.
表3の結果から、実施例の2液混合型接着剤によれば、種々の種類の被着材に対して、高い接着強度を発揮できることが示され、また、比較例の2液混合型接着剤の場合に接着強度が低かった被着材に対しても高い接着強度を得ることができることも示された。
From the results of Table 3, it is shown that the two-component mixed adhesive of the example can exhibit high adhesive strength to various types of adherends, and the two-component mixed adhesive of the comparative example It was also shown that a high adhesive strength can be obtained even for an adherend having a low adhesive strength in the case of an agent.
[熱間強度]
熱間強度は、室温で7日間硬化させた試験片を90℃雰囲気下で引張試験を行うことにより評価した(室温で引張試験を行った結果について合わせて示す)。被着材としては2つのED板のものを用いた。評価結果を下記表4に示す。破壊モードについても合わせて示す。 [Hot strength]
The hot strength was evaluated by performing a tensile test in a 90 ° C. atmosphere on a test piece cured for 7 days at room temperature (the results of the tensile test performed at room temperature are also shown). As the adherend, two ED plates were used. The evaluation results are shown in Table 4 below. The destruction mode is also shown.
熱間強度は、室温で7日間硬化させた試験片を90℃雰囲気下で引張試験を行うことにより評価した(室温で引張試験を行った結果について合わせて示す)。被着材としては2つのED板のものを用いた。評価結果を下記表4に示す。破壊モードについても合わせて示す。 [Hot strength]
The hot strength was evaluated by performing a tensile test in a 90 ° C. atmosphere on a test piece cured for 7 days at room temperature (the results of the tensile test performed at room temperature are also shown). As the adherend, two ED plates were used. The evaluation results are shown in Table 4 below. The destruction mode is also shown.
表4の結果から、実施例の2液混合型接着剤によれば、比較例のものに比べて、接着層の耐熱性がより高く、熱時での強度低下が抑制できることが示された。
From the results in Table 4, it was shown that according to the two-component mixed adhesive of the example, the heat resistance of the adhesive layer was higher than that of the comparative example, and the strength reduction during heating could be suppressed.
[動的粘弾性]
2液混合型接着剤について、動的粘弾性測定装置(UBM社の「Rheogel-E4000」)を用いて、2液混合後、4日間室温で硬化させて得た硬化物の動的粘弾性を測定し、貯蔵弾性率(E’)及び損失正接(tanδ)の温度依存性並びにガラス転移温度(Tg)を求めた。測定チャートを図1((A)実施例1の2液混合型接着剤(J-1)、(B)比較例1の2液混合型接着剤(CJ-1))に示す。Tgは、実施例1の場合は76℃、比較例1の場合は68℃であった。
実施例の2液混合型接着剤では、比較例のものよりも、Tgが高く、かつ粘性領域での貯蔵弾性率が高いことから架橋密度の上昇が認められた。 [Dynamic viscoelasticity]
For the two-component mixed adhesive, the dynamic viscoelasticity of the cured product obtained by mixing the two components using a dynamic viscoelasticity measuring apparatus (UBM “Rheogel-E4000”) and curing at room temperature for 4 days was measured. The temperature dependence of the storage elastic modulus (E ′) and loss tangent (tan δ) and the glass transition temperature (Tg) were determined. The measurement chart is shown in FIG. 1 ((A) the two-component mixed adhesive (J-1) of Example 1 and (B) the two-component mixed adhesive (CJ-1) of Comparative Example 1). Tg was 76 ° C. in Example 1 and 68 ° C. in Comparative Example 1.
In the two-component mixed adhesives of Examples, the Tg was higher than that of Comparative Examples, and the storage elastic modulus in the viscous region was high, so that an increase in crosslinking density was observed.
2液混合型接着剤について、動的粘弾性測定装置(UBM社の「Rheogel-E4000」)を用いて、2液混合後、4日間室温で硬化させて得た硬化物の動的粘弾性を測定し、貯蔵弾性率(E’)及び損失正接(tanδ)の温度依存性並びにガラス転移温度(Tg)を求めた。測定チャートを図1((A)実施例1の2液混合型接着剤(J-1)、(B)比較例1の2液混合型接着剤(CJ-1))に示す。Tgは、実施例1の場合は76℃、比較例1の場合は68℃であった。
実施例の2液混合型接着剤では、比較例のものよりも、Tgが高く、かつ粘性領域での貯蔵弾性率が高いことから架橋密度の上昇が認められた。 [Dynamic viscoelasticity]
For the two-component mixed adhesive, the dynamic viscoelasticity of the cured product obtained by mixing the two components using a dynamic viscoelasticity measuring apparatus (UBM “Rheogel-E4000”) and curing at room temperature for 4 days was measured. The temperature dependence of the storage elastic modulus (E ′) and loss tangent (tan δ) and the glass transition temperature (Tg) were determined. The measurement chart is shown in FIG. 1 ((A) the two-component mixed adhesive (J-1) of Example 1 and (B) the two-component mixed adhesive (CJ-1) of Comparative Example 1). Tg was 76 ° C. in Example 1 and 68 ° C. in Comparative Example 1.
In the two-component mixed adhesives of Examples, the Tg was higher than that of Comparative Examples, and the storage elastic modulus in the viscous region was high, so that an increase in crosslinking density was observed.
[イソシアネート基のアミノ基に対するモル比]
上記実施例1~4で調製した2液混合型接着剤の剪断強度及び破壊モードの評価結果を、2液混合型接着剤に含まれるイソシアネート基/ジアミンのモル比(及びNCO基/NH2基のモル比)の値と共に下記表5に示す。表5中の「-」は、破壊が認められなかったことを示す。 [Molar ratio of isocyanate group to amino group]
The evaluation results of the shear strength and fracture mode of the two-component mixed adhesives prepared in Examples 1 to 4 above are the molar ratios of isocyanate groups / diamines (and NCO groups / NH 2 groups included in the two-component mixed adhesives). Are shown in Table 5 below together with the value of “-” In Table 5 indicates that no destruction was observed.
上記実施例1~4で調製した2液混合型接着剤の剪断強度及び破壊モードの評価結果を、2液混合型接着剤に含まれるイソシアネート基/ジアミンのモル比(及びNCO基/NH2基のモル比)の値と共に下記表5に示す。表5中の「-」は、破壊が認められなかったことを示す。 [Molar ratio of isocyanate group to amino group]
The evaluation results of the shear strength and fracture mode of the two-component mixed adhesives prepared in Examples 1 to 4 above are the molar ratios of isocyanate groups / diamines (and NCO groups / NH 2 groups included in the two-component mixed adhesives). Are shown in Table 5 below together with the value of “-” In Table 5 indicates that no destruction was observed.
表5の結果から、イソシアネート基のジアミンに対するモル比を1以上3以下とすることが、接着強度をより高めるためには効果的であることが分かる。
From the results in Table 5, it can be seen that setting the molar ratio of the isocyanate group to the diamine to be 1 or more and 3 or less is effective in increasing the adhesive strength.
[チクソトロピー指数(TI)]
実施例1及び比較例1の組成物(I)の調製において、TEB-DAP錯体を含まない混合溶液(a)に、TEB-DAPと同じモル数になるように、1.08gの1,3-ジアミノプロパンを添加したもの(組成物(I’))を使用し、組成物(I’)と各組成物(II)(組成物(II-1)及び(II-C)とを質量比1:1で混合し、混合溶液(J’-1)及び(CJ’-1)を調製した。得られた混合溶液の粘度を、粘度計(東機産業社の「RE-85U型粘度計」)を用いて、5rpm及び50rpmの異なる回転数で測定して、各粘度(η5及びη50)を求め、これらの測定値からTI値(=η5/η50)を算出した。粘度の測定値及び算出されたTI値を下記表6に示す。 [Thixotropic index (TI)]
In the preparation of the composition (I) of Example 1 and Comparative Example 1, 1.08 g of 1,3 was added to the mixed solution (a) containing no TEB-DAP complex so as to have the same number of moles as TEB-DAP. Using a composition to which diaminopropane is added (composition (I ′)), the composition (I ′) and each composition (II) (compositions (II-1) and (II-C) are in a mass ratio) The mixed solutions (J′-1) and (CJ′-1) were prepared by mixing 1: 1, and the viscosity of the obtained mixed solution was measured with a viscometer (“RE-85U type viscometer manufactured by Toki Sangyo Co., Ltd.). )), The respective viscosities (η 5 and η 50 ) were determined at different rotation speeds of 5 rpm and 50 rpm, and the TI values (= η 5 / η 50 ) were calculated from these measured values. The measured values and calculated TI values are shown in Table 6 below.
実施例1及び比較例1の組成物(I)の調製において、TEB-DAP錯体を含まない混合溶液(a)に、TEB-DAPと同じモル数になるように、1.08gの1,3-ジアミノプロパンを添加したもの(組成物(I’))を使用し、組成物(I’)と各組成物(II)(組成物(II-1)及び(II-C)とを質量比1:1で混合し、混合溶液(J’-1)及び(CJ’-1)を調製した。得られた混合溶液の粘度を、粘度計(東機産業社の「RE-85U型粘度計」)を用いて、5rpm及び50rpmの異なる回転数で測定して、各粘度(η5及びη50)を求め、これらの測定値からTI値(=η5/η50)を算出した。粘度の測定値及び算出されたTI値を下記表6に示す。 [Thixotropic index (TI)]
In the preparation of the composition (I) of Example 1 and Comparative Example 1, 1.08 g of 1,3 was added to the mixed solution (a) containing no TEB-DAP complex so as to have the same number of moles as TEB-DAP. Using a composition to which diaminopropane is added (composition (I ′)), the composition (I ′) and each composition (II) (compositions (II-1) and (II-C) are in a mass ratio) The mixed solutions (J′-1) and (CJ′-1) were prepared by mixing 1: 1, and the viscosity of the obtained mixed solution was measured with a viscometer (“RE-85U type viscometer manufactured by Toki Sangyo Co., Ltd.). )), The respective viscosities (η 5 and η 50 ) were determined at different rotation speeds of 5 rpm and 50 rpm, and the TI values (= η 5 / η 50 ) were calculated from these measured values. The measured values and calculated TI values are shown in Table 6 below.
表6の結果から、実施例の2液混合型接着剤は、比較例のものに比べて、チクソトロピー性が高いことが示された。この高いチクソトロピー性は、実施例1の2液混合型接着剤(J-1)において、組成物(I)と組成物(II)とを混合することにより、イソシアネート基とアミノ基との反応により、脱保護反応により生じる基としてウレア基が生成し、このウレア基間で適度な水素結合が形成されることによるものと考えられる。この高いチクソトロピー性により、当該2液混合型接着剤の使用時の液ダレが抑制される。
From the results in Table 6, it was shown that the two-component mixed adhesives of the examples had higher thixotropic properties than those of the comparative examples. This high thixotropy is obtained by mixing the composition (I) and the composition (II) in the two-component mixed adhesive (J-1) of Example 1 and reacting with the isocyanate group and the amino group. It is considered that a urea group is generated as a group generated by the deprotection reaction, and an appropriate hydrogen bond is formed between the urea groups. Due to this high thixotropy, dripping during use of the two-component mixed adhesive is suppressed.
<2液混合型接着剤の調製>
以下の実施例5~7及び11において、[C]ポリマー成分として、マトリックス及び粒子を形成するものを用いた。また、実施例8~10では、[A]錯体の配合量について検討した。 <Preparation of two-component mixed adhesive>
In Examples 5 to 7 and 11 below, those forming a matrix and particles were used as the [C] polymer component. In Examples 8 to 10, the amount of the [A] complex was examined.
以下の実施例5~7及び11において、[C]ポリマー成分として、マトリックス及び粒子を形成するものを用いた。また、実施例8~10では、[A]錯体の配合量について検討した。 <Preparation of two-component mixed adhesive>
In Examples 5 to 7 and 11 below, those forming a matrix and particles were used as the [C] polymer component. In Examples 8 to 10, the amount of the [A] complex was examined.
[実施例5](2液混合型接着剤(J-5)の調製)
(組成物(I)の調製)
[A]錯体としてのTEB-DAP2.5gと、[B]重合性化合物としてのTHFMA60.0g及び2EHMA17.5gと、[C]ポリマー成分としてのSBS20.0gとをプラスチック製容器中に入れて混合させ、組成物(I-5)を調製した。 [Example 5] (Preparation of two-component mixed adhesive (J-5))
(Preparation of composition (I))
[A] 2.5 g of TEB-DAP as a complex, 6B of THFMA and 17.5 g of 2EHMA as a [B] polymerizable compound, and 20.0 g of SBS as a [C] polymer component are mixed in a plastic container. To prepare a composition (I-5).
(組成物(I)の調製)
[A]錯体としてのTEB-DAP2.5gと、[B]重合性化合物としてのTHFMA60.0g及び2EHMA17.5gと、[C]ポリマー成分としてのSBS20.0gとをプラスチック製容器中に入れて混合させ、組成物(I-5)を調製した。 [Example 5] (Preparation of two-component mixed adhesive (J-5))
(Preparation of composition (I))
[A] 2.5 g of TEB-DAP as a complex, 6B of THFMA and 17.5 g of 2EHMA as a [B] polymerizable compound, and 20.0 g of SBS as a [C] polymer component are mixed in a plastic container. To prepare a composition (I-5).
(組成物(II)の調製)
[B]重合性化合物としてのTHFMA55.7g及び2EHMA16.2gと、[C]ポリマー成分としてのSBS18.6g及びコア-シェル粒子であるカネカ社の「カネエースM-521」5.0gと、[D]化合物としてのMOI4.5gとをプラスチック製容器中に入れて混合させ、組成物(II-5)を調製した。 (Preparation of composition (II))
[B] 55.7 g of THFMA and 16.2 g of 2EHMA as polymerizable compounds, 18.6 g of SBS as a polymer component and 5.0 g of “Kaneace M-521” of Kaneka Corporation as core-shell particles, [D] A 4.5 g MOI compound was placed in a plastic container and mixed to prepare a composition (II-5).
[B]重合性化合物としてのTHFMA55.7g及び2EHMA16.2gと、[C]ポリマー成分としてのSBS18.6g及びコア-シェル粒子であるカネカ社の「カネエースM-521」5.0gと、[D]化合物としてのMOI4.5gとをプラスチック製容器中に入れて混合させ、組成物(II-5)を調製した。 (Preparation of composition (II))
[B] 55.7 g of THFMA and 16.2 g of 2EHMA as polymerizable compounds, 18.6 g of SBS as a polymer component and 5.0 g of “Kaneace M-521” of Kaneka Corporation as core-shell particles, [D] A 4.5 g MOI compound was placed in a plastic container and mixed to prepare a composition (II-5).
[実施例6~11](2液混合型接着剤(J-6)~(J-11)の調製)
下記表7に示す種類及び配合量の各成分を用いた以外は、実施例5と同様にして組成物(I)と組成物(II)とをそれぞれ調製した。表7における「-」は、該当する成分を用いなかったことを示す。また、上記実施例1~4及び比較例1で調製した2液混合型接着剤の組成物(I)及び組成物(II)における各成分の種類及び配合量について表7に合わせて示す。比較例1における「*1」は、マレイン酸モノ2-(メタクリロイロキシ)エチル10.0g及びp-トルエンスルホニルクロライド0.25gを配合したことを示す。 [Examples 6 to 11] (Preparation of two-component mixed adhesives (J-6) to (J-11))
A composition (I) and a composition (II) were prepared in the same manner as in Example 5 except that the components of the types and blending amounts shown in Table 7 below were used. “-” In Table 7 indicates that the corresponding component was not used. In addition, Table 7 shows the types and blending amounts of the components in the compositions (I) and (II) of the two-component mixed adhesive prepared in Examples 1 to 4 and Comparative Example 1. “* 1” in Comparative Example 1 indicates that 10.0 g of mono 2- (methacryloyloxy) ethyl maleate and 0.25 g of p-toluenesulfonyl chloride were blended.
下記表7に示す種類及び配合量の各成分を用いた以外は、実施例5と同様にして組成物(I)と組成物(II)とをそれぞれ調製した。表7における「-」は、該当する成分を用いなかったことを示す。また、上記実施例1~4及び比較例1で調製した2液混合型接着剤の組成物(I)及び組成物(II)における各成分の種類及び配合量について表7に合わせて示す。比較例1における「*1」は、マレイン酸モノ2-(メタクリロイロキシ)エチル10.0g及びp-トルエンスルホニルクロライド0.25gを配合したことを示す。 [Examples 6 to 11] (Preparation of two-component mixed adhesives (J-6) to (J-11))
A composition (I) and a composition (II) were prepared in the same manner as in Example 5 except that the components of the types and blending amounts shown in Table 7 below were used. “-” In Table 7 indicates that the corresponding component was not used. In addition, Table 7 shows the types and blending amounts of the components in the compositions (I) and (II) of the two-component mixed adhesive prepared in Examples 1 to 4 and Comparative Example 1. “* 1” in Comparative Example 1 indicates that 10.0 g of mono 2- (methacryloyloxy) ethyl maleate and 0.25 g of p-toluenesulfonyl chloride were blended.
上記調製した各2液混合型接着剤を用い、上記方法に従って、剪断強度及びT形剥離強度並びに接着層の伸び率を測定した。評価結果を下記表8に示す。なお、表8における実施例2~4の「-」は各物性を測定していないことを示す。また、実施例7及び11の「-」は、組成物の調製が困難であったことを示す。上記実施例1~4及び比較例1における評価結果についても表8に合わせて示す。
Using each of the two-component mixed adhesives prepared above, the shear strength, T-peel strength, and elongation rate of the adhesive layer were measured according to the above methods. The evaluation results are shown in Table 8 below. In Table 8, “−” in Examples 2 to 4 indicates that each physical property was not measured. In addition, “-” in Examples 7 and 11 indicates that it was difficult to prepare the composition. The evaluation results in Examples 1 to 4 and Comparative Example 1 are also shown in Table 8.
表8の結果から、実施例の2液混合型接着剤によれば、[C]ポリマー成分としてマトリックスとなるもの及び粒子となるものを併用することで、T形剥離強度を向上できること及び接着層の柔軟性を高めることができることが示された。また、表8の結果から、実施例の2液混合型接着剤によれば、[A]錯体の配合量を最適化することで、剪断強度及びT形剥離強度をより向上できることも示された。
From the results of Table 8, according to the two-component mixed adhesives of the examples, [C] the polymer component can be used in combination with the matrix component and the particle component to improve the T-shaped peel strength and the adhesive layer. It was shown that the flexibility of can be increased. Moreover, from the result of Table 8, according to the two-component mixed adhesive of the example, it was also shown that the shear strength and the T-shaped peel strength can be further improved by optimizing the blending amount of the [A] complex. .
以下の実施例12~16において、[B]重合性化合物としての脂環を有する(メタ)アクリレート、及び架橋性化合物を用いた。
In Examples 12 to 16 below, [B] (meth) acrylate having an alicyclic ring as a polymerizable compound and a crosslinkable compound were used.
[実施例12](2液混合型接着剤(J-12)の調製)
(組成物(I)の調製)
[A]錯体としてのTEB-DAP2.5gと、[B]重合性化合物としてのTHFMA60.0g及びトリシクロデシルメタクリレート(TCDMA:日立化成社の「FA-513M」)17.5gと、[C]ポリマー成分としてのSBS20.0gとをプラスチック製容器中に入れて混合させ、組成物(I-12)を調製した。 [Example 12] (Preparation of two-component mixed adhesive (J-12))
(Preparation of composition (I))
[A] 2.5 g of TEB-DAP as a complex, 60.0 g of THFMA as a polymerizable compound and 17.5 g of tricyclodecyl methacrylate (TCDMA: “FA-513M” from Hitachi Chemical Co., Ltd.), [C] A composition (I-12) was prepared by placing 20.0 g of SBS as a polymer component in a plastic container and mixing them.
(組成物(I)の調製)
[A]錯体としてのTEB-DAP2.5gと、[B]重合性化合物としてのTHFMA60.0g及びトリシクロデシルメタクリレート(TCDMA:日立化成社の「FA-513M」)17.5gと、[C]ポリマー成分としてのSBS20.0gとをプラスチック製容器中に入れて混合させ、組成物(I-12)を調製した。 [Example 12] (Preparation of two-component mixed adhesive (J-12))
(Preparation of composition (I))
[A] 2.5 g of TEB-DAP as a complex, 60.0 g of THFMA as a polymerizable compound and 17.5 g of tricyclodecyl methacrylate (TCDMA: “FA-513M” from Hitachi Chemical Co., Ltd.), [C] A composition (I-12) was prepared by placing 20.0 g of SBS as a polymer component in a plastic container and mixing them.
(組成物(II)の調製)
[B]重合性化合物としてのTHFMA58.0g及びTCDMA17.5gと、[C]ポリマー成分としてのSBS20.0gと、[D]化合物としてのMOI4.5gとをプラスチック製容器中に入れて混合させ、組成物(II-12)を調製した。 (Preparation of composition (II))
[B] THFMA 58.0 g and TCDMA 17.5 g as a polymerizable compound, [C] SBS 20.0 g as a polymer component, and MOD 4.5 g as a [D] compound were placed in a plastic container and mixed. Composition (II-12) was prepared.
[B]重合性化合物としてのTHFMA58.0g及びTCDMA17.5gと、[C]ポリマー成分としてのSBS20.0gと、[D]化合物としてのMOI4.5gとをプラスチック製容器中に入れて混合させ、組成物(II-12)を調製した。 (Preparation of composition (II))
[B] THFMA 58.0 g and TCDMA 17.5 g as a polymerizable compound, [C] SBS 20.0 g as a polymer component, and MOD 4.5 g as a [D] compound were placed in a plastic container and mixed. Composition (II-12) was prepared.
[実施例13~16]
下記表9に示す種類及び配合量の各成分を用いた以外は、実施例12と同様にして、組成物(I)と組成物(II)とをそれぞれ調製した。架橋性化合物としてのTCDDMA(トリシクロデカンジメタクリレート)は、共栄社化学社の「ライトエステルDCP-M」を用いた。表9における「-」は、該当する成分を用いなかったことを示す。 [Examples 13 to 16]
A composition (I) and a composition (II) were prepared in the same manner as in Example 12 except that the components of the types and blending amounts shown in Table 9 below were used. TCDDMA (tricyclodecane dimethacrylate) as a crosslinkable compound was “Light Ester DCP-M” manufactured by Kyoeisha Chemical Co., Ltd. “-” In Table 9 indicates that the corresponding component was not used.
下記表9に示す種類及び配合量の各成分を用いた以外は、実施例12と同様にして、組成物(I)と組成物(II)とをそれぞれ調製した。架橋性化合物としてのTCDDMA(トリシクロデカンジメタクリレート)は、共栄社化学社の「ライトエステルDCP-M」を用いた。表9における「-」は、該当する成分を用いなかったことを示す。 [Examples 13 to 16]
A composition (I) and a composition (II) were prepared in the same manner as in Example 12 except that the components of the types and blending amounts shown in Table 9 below were used. TCDDMA (tricyclodecane dimethacrylate) as a crosslinkable compound was “Light Ester DCP-M” manufactured by Kyoeisha Chemical Co., Ltd. “-” In Table 9 indicates that the corresponding component was not used.
上記調製した各2液混合型接着剤を用い、上記方法に従って、室温における剪断強度及び80℃における剪断強度(熱間強度)を測定した。評価結果を下記表10に示す。
Using each of the two-component mixed adhesives prepared above, the shear strength at room temperature and the shear strength at 80 ° C. (hot strength) were measured according to the above method. The evaluation results are shown in Table 10 below.
表10の結果から、実施例の2液混合型接着剤によれば、[B]重合性化合物として脂環を有するものを用いることを用いることで、室温における剪断強度をさらに向上できることが示され、また、架橋性化合物を用いることにより、熱間強度をさらに向上できることも示された。
From the results of Table 10, it was shown that according to the two-component mixed adhesive of the example, the shear strength at room temperature can be further improved by using the [B] polymerizable compound having an alicyclic ring. It was also shown that the hot strength can be further improved by using a crosslinkable compound.
以下の実施例17~19において、[A]錯体におけるオルガノボランに由来する基とその保護基とのモル比について検討した。
In Examples 17 to 19 below, the molar ratio between the group derived from organoborane in the [A] complex and its protecting group was examined.
[実施例17](2液混合型接着剤(J-17)の調製)
(組成物(I)の調製)
[A]錯体としてのTEB-DAP2.5g及び4,7,10-トリオキサトリデカン-1,13-ジアミン(TTD)1.0gの混合物と、[B]重合性化合物としてのTHFMA53.8g及び2EHMA15.6gと、[C]ポリマー成分としてのSBS17.7g及びコア-シェル粒子9.9gとをプラスチック製容器中に入れて混合させ、組成物(I-17)を調製した。 [Example 17] (Preparation of two-component mixed adhesive (J-17))
(Preparation of composition (I))
[A] A mixture of 2.5 g of TEB-DAP as a complex and 1.0 g of 4,7,10-trioxatridecane-1,13-diamine (TTD), and [B] 53.8 g of THFMA as a polymerizable compound; 15.6 g of 2EHMA, 17.7 g of SBS as a [C] polymer component, and 9.9 g of core-shell particles were placed in a plastic container and mixed to prepare composition (I-17).
(組成物(I)の調製)
[A]錯体としてのTEB-DAP2.5g及び4,7,10-トリオキサトリデカン-1,13-ジアミン(TTD)1.0gの混合物と、[B]重合性化合物としてのTHFMA53.8g及び2EHMA15.6gと、[C]ポリマー成分としてのSBS17.7g及びコア-シェル粒子9.9gとをプラスチック製容器中に入れて混合させ、組成物(I-17)を調製した。 [Example 17] (Preparation of two-component mixed adhesive (J-17))
(Preparation of composition (I))
[A] A mixture of 2.5 g of TEB-DAP as a complex and 1.0 g of 4,7,10-trioxatridecane-1,13-diamine (TTD), and [B] 53.8 g of THFMA as a polymerizable compound; 15.6 g of 2EHMA, 17.7 g of SBS as a [C] polymer component, and 9.9 g of core-shell particles were placed in a plastic container and mixed to prepare composition (I-17).
(組成物(II)の調製)
[B]重合性化合物としてのTHFMA52.0g及び2EHMA15.2gと、[C]ポリマー成分としてのSBS17.3g及びコア-シェル粒子9.6gと、[D]化合物としてのMOI5.9gとをプラスチック製容器中に入れて混合させ、組成物(II-17)を調製した。 (Preparation of composition (II))
[B] THFMA 52.0 g and 2EHMA 15.2 g as a polymerizable compound, [C] SBS 17.3 g and core-shell particles 9.6 g as a polymer component, and [D] MOI 5.9 g as a compound A composition (II-17) was prepared by mixing in a container.
[B]重合性化合物としてのTHFMA52.0g及び2EHMA15.2gと、[C]ポリマー成分としてのSBS17.3g及びコア-シェル粒子9.6gと、[D]化合物としてのMOI5.9gとをプラスチック製容器中に入れて混合させ、組成物(II-17)を調製した。 (Preparation of composition (II))
[B] THFMA 52.0 g and 2EHMA 15.2 g as a polymerizable compound, [C] SBS 17.3 g and core-shell particles 9.6 g as a polymer component, and [D] MOI 5.9 g as a compound A composition (II-17) was prepared by mixing in a container.
[実施例18及び19]
下記表11に示す種類及び配合量の各成分を用いた以外は、実施例17と同様にして、組成物(I)と組成物(II)とをそれぞれ調製した。表11における「-」は、該当する成分を用いなかったことを示す。 [Examples 18 and 19]
A composition (I) and a composition (II) were prepared in the same manner as in Example 17 except that the components of the types and blending amounts shown in Table 11 below were used. “-” In Table 11 indicates that the corresponding component was not used.
下記表11に示す種類及び配合量の各成分を用いた以外は、実施例17と同様にして、組成物(I)と組成物(II)とをそれぞれ調製した。表11における「-」は、該当する成分を用いなかったことを示す。 [Examples 18 and 19]
A composition (I) and a composition (II) were prepared in the same manner as in Example 17 except that the components of the types and blending amounts shown in Table 11 below were used. “-” In Table 11 indicates that the corresponding component was not used.
上記調製した各2液混合型接着剤を用い、上記方法に従って、室温における剪断強度及びT形剥離強度を測定した。評価結果を下記表12に示す。
Using each of the two-component mixed adhesives prepared above, the shear strength at room temperature and the T-shaped peel strength were measured according to the above method. The evaluation results are shown in Table 12 below.
表12の結果から、[A]錯体におけるオルガノボランに由来する基とその保護基とのモル比を最適化することにより、剪断強度及びT形剥離強度をより向上させることができることが示された。
From the results of Table 12, it was shown that the shear strength and the T-shaped peel strength can be further improved by optimizing the molar ratio between the group derived from the organoborane in the [A] complex and the protecting group. .
[保存安定性]
下記表13に示す組成物(I)の粘度η50(mPa・s)を、調製直後(保存時間0日)と40℃で7日保管した後とについて測定した。組成物の粘度は、粘度計(東機産業社の「TE-85U型粘度計」)を用いて50rpmで測定した。組成物の各保存時間における粘度の値を組成物(I)の[A]錯体中のオルガノボランに由来する基に対する保護基(アミノ基)のモル比の値と共に下記表13に示す。 [Storage stability]
The viscosity η 50 (mPa · s) of the composition (I) shown in Table 13 below was measured immediately after preparation (storage time 0 days) and after storage at 40 ° C. for 7 days. The viscosity of the composition was measured at 50 rpm using a viscometer (“TE-85U viscometer” manufactured by Toki Sangyo Co., Ltd.). The viscosity values at each storage time of the composition are shown in Table 13 below together with the molar ratio of the protecting group (amino group) to the group derived from the organoborane in the [A] complex of the composition (I).
下記表13に示す組成物(I)の粘度η50(mPa・s)を、調製直後(保存時間0日)と40℃で7日保管した後とについて測定した。組成物の粘度は、粘度計(東機産業社の「TE-85U型粘度計」)を用いて50rpmで測定した。組成物の各保存時間における粘度の値を組成物(I)の[A]錯体中のオルガノボランに由来する基に対する保護基(アミノ基)のモル比の値と共に下記表13に示す。 [Storage stability]
The viscosity η 50 (mPa · s) of the composition (I) shown in Table 13 below was measured immediately after preparation (
表13の結果から、[A]錯体のオルガノボランに由来する基に対する保護基のモル比を大きくすることによって、組成物(I)の粘度の経時変動が小さく、かつゲル化が抑制され、保存安定性をより向上できることが示された。
From the results shown in Table 13, by increasing the molar ratio of the protecting group to the group derived from the organoborane of the [A] complex, the change in the viscosity of the composition (I) with time is small, gelation is suppressed, and storage is performed. It was shown that the stability can be further improved.
本発明の2液混合型接着剤によれば、液ダレを抑制しつつ、高い硬化速度で、高い接着強度及び熱間強度を得ることができる。従って、当該2液混合型接着剤は、自動車外板等の難接着材料を含む種々材料の接着に好適に用いることができる。
According to the two-component mixed adhesive of the present invention, high adhesive strength and hot strength can be obtained at a high curing rate while suppressing liquid dripping. Therefore, the two-component mixed adhesive can be suitably used for bonding various materials including difficult-to-adhere materials such as automobile outer plates.
Claims (12)
- 第1組成物と第2組成物とを備える2液混合型接着剤であって、
上記第1組成物がオルガノボランに由来する基及びその保護基を有する錯体を含有し、
上記第2組成物が上記保護基と脱保護反応する化合物を含有し、上記保護基と上記化合物との脱保護反応により生じる脱保護反応生成物が重合性を有することを特徴とする2液混合型接着剤。 A two-component mixed adhesive comprising a first composition and a second composition,
The first composition contains a complex having a group derived from organoborane and a protecting group thereof,
The two-component mixing characterized in that the second composition contains a compound that undergoes a deprotection reaction with the protecting group, and the deprotection reaction product produced by the deprotection reaction between the protecting group and the compound has polymerizability. Mold adhesive. - 上記錯体の保護基が2以上の官能基を有する化合物に由来する請求項1に記載の2液混合型接着剤。 The two-component mixed adhesive according to claim 1, wherein the protective group of the complex is derived from a compound having two or more functional groups.
- 上記保護基の由来化合物がジアミンである請求項1又は請求項2に記載の2液混合型接着剤。 The two-component mixed adhesive according to claim 1 or 2, wherein the protective group-derived compound is a diamine.
- 上記脱保護反応する化合物がイソシアネート基を有する(メタ)アクリレートである請求項1、請求項2又は請求項3に記載の2液混合型接着剤。 The two-component mixed adhesive according to claim 1, 2 or 3, wherein the deprotecting compound is a (meth) acrylate having an isocyanate group.
- 上記保護基の由来化合物がジアミンであり、
上記イソシアネート基の上記ジアミンに対するモル比が1以上3以下である請求項4に記載の2液混合型接着剤。 The compound derived from the protecting group is a diamine,
The two-component mixed adhesive according to claim 4, wherein the molar ratio of the isocyanate group to the diamine is 1 or more and 3 or less. - 上記第1組成物、第2組成物又はその双方がイソシアネート基を有しない(メタ)アクリレート又はポリマー成分をさらに含有する請求項1から請求項5のいずれか1項に記載の2液混合型接着剤。 The two-component mixed adhesive according to any one of claims 1 to 5, wherein the first composition, the second composition, or both further contain a (meth) acrylate or polymer component having no isocyanate group. Agent.
- 上記イソシアネート基を有しない(メタ)アクリレートが、脂環を有する請求項6に記載の2液混合型接着剤。 The two-component mixed adhesive according to claim 6, wherein the (meth) acrylate having no isocyanate group has an alicyclic ring.
- 上記ポリマー成分として、ポリマー粒子を含有する請求項6又は請求項7に記載の2液混合型接着剤。 The two-component mixed adhesive according to claim 6 or 7, which contains polymer particles as the polymer component.
- 上記ポリマー成分中の上記ポリマー粒子の含有率が、10質量%以上50質量%以下である請求項8に記載の2液混合型接着剤。 The two-component mixed adhesive according to claim 8, wherein the content of the polymer particles in the polymer component is 10% by mass or more and 50% by mass or less.
- 上記ポリマー粒子がコア-シェル構造を有する請求項8又は請求項9に記載の2液混合型接着剤。 The two-component mixed adhesive according to claim 8 or 9, wherein the polymer particles have a core-shell structure.
- 上記錯体におけるオルガノボランに由来する基に対する保護基のモル比が、1以上8以下である請求項1から請求項10のいずれか1項に記載の2液混合型接着剤。 The two-component mixed adhesive according to any one of claims 1 to 10, wherein the molar ratio of the protecting group to the group derived from organoborane in the complex is 1 or more and 8 or less.
- チクソトロピー指数が3以上である請求項1から請求項11のいずれか1項に記載の2液混合型接着剤。
The two-component mixed adhesive according to any one of claims 1 to 11, wherein the thixotropy index is 3 or more.
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US10590232B2 (en) | 2016-06-02 | 2020-03-17 | Hitachi Chemical Company, Ltd. | Resin composition and method of producing laminate |
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JPWO2019064522A1 (en) * | 2017-09-29 | 2020-09-24 | サンメディカル株式会社 | Composite particles, kits, materials and methods for manufacturing composite particles |
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US12173149B2 (en) | 2017-09-29 | 2024-12-24 | Sun Medical Co., Ltd. | Composite particles, kit, material, and method for producing composite particles |
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