WO2014067492A1

WO2014067492A1 - Novel multi-functional semiconductor refrigerating and warming dual-purpose box and manufacturing method

Info

Publication number: WO2014067492A1
Application number: PCT/CN2013/086518
Authority: WO
Inventors: 刘万辉
Original assignee: 沈茂相
Priority date: 2012-11-05
Filing date: 2013-11-04
Publication date: 2014-05-08
Also published as: US20150303124A1; CN103808097A; US9673126B2

Abstract

Disclosed are a multi-functional semiconductor refrigerating and warming dual-purpose box and a manufacturing method. The multi-functional semiconductor refrigerating and warming dual-purpose box comprises a dual-purpose box body having two independent upper rooms (1), a lower room (2) and a bottom machine room (3), an upper room semiconductor refrigerating and heating device (20) and a lower room semiconductor refrigerating and heating device (21). The manufacturing method comprises the steps of mounting the upper room semiconductor refrigerating and heating device (20) into an upper room working chamber (4), and mounting the lower room semiconductor refrigerating and heating device (21) into the lower room working chamber (5), and then the upper room semiconductor refrigerating and heating device (20), the lower room semiconductor refrigerating and heating device (21), a composite condenser (12) and a liquid delivering pump (15) being in communication by means of connection pipes to constitute a circulation flow passage for a liquid refrigerant. The manufacturing method is simple to operate, is capable of reducing the difficulty of foaming, and is convenient to maintain.

Description

Novel multifunctional semiconductor refrigerating and warming dual-purpose box and manufacturing method thereof

Technical field

The invention relates to a semiconductor refrigerated warm storage box and a manufacturing method thereof, in particular to a novel multifunctional semiconductor refrigerating and warming dual-purpose box having two independent storage rooms and a manufacturing method thereof.

Background technique

At present, there are two compartments of electric water tank products. In the production process, the evaporator and other related components are basically installed in the box and then foamed. This method is difficult to be used in the multifunctional semiconductor refrigerating and warming. The main reason for the application of the industrialization of the box is that the difficulty in preparing the foaming of the box is increased. The second reason is that the after-sales maintenance service of the multifunctional semiconductor refrigerated warm-up dual-use box is more difficult.

Summary of the invention

The object of the present invention is to overcome the shortcomings of the prior art, and to provide a novel multifunctional refrigerator refrigerated warm-up dual-use box which is simple in operation, reduces the difficulty of foaming preparation of the cabinet, and reduces the workload of the after-sales maintenance service of the product.

The main technical solution of the present invention: After installing the pre-prepared semiconductor cooling and heating device into the working chamber of each room of the prepared multi-functional semiconductor refrigerating and warming dual-purpose box, the connecting tube is used to connect the semiconductor cooling and heating The device, the composite condenser and the infusion pump constitute a circulating flow path of the liquid refrigerant.

The invention relates to a novel multifunctional semiconductor refrigerating and warming dual-purpose box, characterized in that:

1) a dual-purpose box body, wherein the dual-purpose box body is assembled into a foaming mold by assembling the outer plate, the inner liner and the related parts, and the dual-purpose box body has two separate parts. Separate upper and lower chambers, the upper chamber (1) has an upper chamber working inside and outside, and the lower chamber has a lower chamber working inside and outside. The bottom of the dual-use box is Machine room that runs through before and after;

2), semiconductor refrigeration heater: including upper compartment semiconductor refrigeration heater and lower compartment semiconductor refrigeration heater (21), wherein the upper compartment semiconductor refrigeration heater is installed in the upper compartment working chamber The outdoor heat exchanger, the semiconductor refrigeration sheet and the upper indoor heat exchanger are arranged in close contact with each other in close contact; the lower compartment semiconductor refrigeration heater is installed by the lower outdoor heat exchanger installed in the lower chamber working chamber, The other semiconductor refrigeration sheet and the lower indoor heat exchanger are arranged in close contact with each other in close contact;

3), the upper outdoor heat exchanger and the lower outdoor heat exchanger are connected to the composite condenser and the infusion pump through a pipeline to form a circulating flow path of the liquid refrigerant;

4) The composite condenser is composed of a horizontal composite condenser and a vertical composite condenser, wherein the horizontal composite condenser and the infusion pump are located in the machine room, and the vertical composite condenser is located in the dual-purpose box. The back of the cabinet.

The manufacturing method of a novel multifunctional semiconductor refrigerating and warming dual-purpose box referred to in the present invention comprises the following steps:

1. Preparation of dual-purpose box body: The two-in-one box outer plate, inner liner and related parts are assembled and assembled. The foaming mold is foamed and prepared into a dual-purpose box body. The dual-purpose box body has two separate upper and lower compartments, and the upper compartment has an upper and a lower chamber working inside and outside. The back chamber of the room has a lower chamber working inside and outside, and the bottom of the dual-purpose box is a machine room that runs through the front and back.

2. Preparation of a semiconductor refrigeration heater: an upper chamber heat exchange of one of a semiconductor refrigeration sheet, an upper outdoor heat exchanger of one of the upper compartment refrigeration heater metal components, and one of the upper compartment refrigeration heater metal components The device is closely contacted and attached to each other, and is fastened by a fastening member to form an upper compartment semiconductor cooling and heating device; the lower outdoor heat exchanger of the semiconductor refrigeration chip, the lower compartment refrigeration heater metal component and the lower The lower indoor heat exchanger of one of the metal components of the intercooling and heating device is closely contacted and closely attached, and is fixed by a fastening member to form a lower compartment semiconductor cooling and heating device.

3. Assembly: After installing the upper compartment semiconductor cooling heater into the upper chamber studio and the lower compartment semiconductor cooling heater into the lower chamber, the connection tube is used to connect the upper chamber to the semiconductor refrigeration system. The upper outdoor heat exchanger of the heat exchanger, the lower outdoor heat exchanger of the lower compartment semiconductor refrigeration heater, the composite condenser and the infusion pump constitute a circulating flow path of the liquid refrigerant.

According to the above structure and manufacturing method, compared with the multifunctional semiconductor refrigerating and warming dual-purpose box without the bottom machine room of the box, the new multi-functional semiconductor refrigerating and warming dual-purpose box is now in the cooling efficiency and the cooling temperature difference depth. And the product volume has to be significantly improved. The test results of the test sample are compared. The new multi-function semiconductor refrigerated warm-up dual-use box with the bottom of the box and the multi-function semiconductor refrigerated without the box bottom machine room manufactured by the previous method. Compared with the warm storage tank, when the upper chamber and the lower chamber are both cooled, the temperature difference between the hot end temperature and the ambient temperature of the former composite condenser is higher than the hot end temperature and the ambient temperature of the latter composite condenser. The temperature difference d, half, the heat dissipation effect is significantly improved, and now the new multi-functional semiconductor refrigerated warm-up dual-use box has a three-fold improvement in cooling efficiency and a 30% increase in the cooling depth. The multifunctional semiconductor refrigerated warm-up dual-use box product can be manufactured. The volume has been increased from about 100L to about 500L, and all aspects have been significantly improved. We have developed a 260L large-volume all-glass. Door Semiconductor Wine Rejection: The National Daily Electrical Appliance Testing Center's inspection The national daily electrical appliance testing center's external name is Guangzhou Weikai Testing Technology Co., Ltd., and the test report number is WTS2012-4875.

BRIEF DESCRIPTION OF THE DRAWINGS:

1 is a schematic cross-sectional view showing an assembly structure of a novel multifunctional semiconductor refrigerating and warming dual-use box;

2 is a schematic cross-sectional view of a novel multifunctional semiconductor refrigerating and warming dual-purpose box;

3 is a schematic diagram of a connection scheme between an upper outdoor heat exchanger, a lower outdoor heat exchanger, a composite condenser, and an infusion pump of an upper compartment semiconductor refrigeration heater in an upper compartment semiconductor refrigeration heater according to the technical solution of the present invention; ;

4 is a schematic cross-sectional view showing the structure of an upper outdoor heat exchanger in the technical solution of the present invention;

5 is a schematic cross-sectional view showing the structure of a lower outdoor heat exchanger in the technical solution of the present invention;

In the figure: 1. upper compartment; 2. lower compartment; 3. machine room; 4. upper compartment studio; 5. lower compartment studio; 6. upper compartment heat exchanger; 7. semiconductor refrigeration section 8. Upper outdoor heat exchanger; 9. Lower indoor heat exchanger; 10. Semiconductor refrigeration film; 1 1. Lower outdoor heat exchanger; 12. Composite condenser; Horizontal composite condenser; 14. Vertical composite condenser; 15. Infusion pump; 16. External heat exchange fan; 17. Rehydration vent; 18. Upper chamber inflow/outlet; 19. Flow path; Upper compartment semiconductor refrigeration heater; 21. lower compartment semiconductor refrigeration heater; 22. lower compartment inflow/outlet; 23. flow path. detailed description

The invention will be further described below with reference to the accompanying drawings: Referring to the drawings: The novel multifunctional semiconductor refrigerated warm-up dual-use box includes:

1) a dual-purpose box body, wherein the dual-purpose box body is assembled into a foaming mold by assembling the outer plate, the inner liner and the related parts, and the dual-purpose box body has two separate parts. Separate upper compartment 1 and lower compartment 2, upper compartment (1) has an upper compartment chamber 4 with internal and external passages on the back, and a lower compartment studio 5 with internal and external passages on the back of the lower compartment 2, dual-use The bottom of the box body is a machine room 3 that runs through the front and back;

2), a semiconductor refrigeration heater: comprising an upper compartment semiconductor refrigeration heater 20 and a lower compartment semiconductor refrigeration heater 21, wherein the upper compartment semiconductor refrigeration heater 20 is installed in the upper compartment chamber 4 The upper outdoor heat exchanger 8, the semiconductor refrigerating sheet 7 and the upper indoor heat exchanger 6 are arranged in close contact with each other in close contact; the lower compartment semiconductor cooling and heating device 21 is installed in the lower chamber working chamber 5 The lower outdoor heat exchanger 11, the other semiconductor refrigerating sheet 10 and the lower indoor heat exchanger 9 are arranged in close contact with each other in close contact; 3), the upper outdoor heat exchanger 8, and the lower outdoor The heat exchanger 11 is connected to the composite condenser (12) and the infusion pump 15 through a pipeline to constitute a circulating flow path of the liquid refrigerant;

4) The composite condenser 12 is composed of a horizontal composite condenser 13 and a vertical composite condenser 14 connected to each other, and the horizontal composite condenser 13 and the infusion pump 15 are located in the machine room 3, and the vertical composite The condenser 14 is located on the back of the dual purpose tank.

The horizontal composite condenser 13 described above is composed of at least one horizontal single layer condenser.

Further: The vertical composite condenser 14 is composed of at least one vertical single layer condenser.

An external heat exchange fan 16 for improving the heat exchange capacity of the horizontal composite condenser 13 and the air is installed beside the horizontal composite condenser 13 in the machine room 3.

Further, the upper outdoor heat exchanger 8 has a liquid refrigerant inflow/outlet port 18 and an S-shaped flow passage 19; and the upper outdoor heat exchanger 8 has a liquid replacement exhaust port 17 therein.

The above-mentioned new multifunctional semiconductor refrigerated warm-up dual-use box is manufactured as follows:

It can be seen from Fig. 2 that the outer casing, the inner liner and the related components of the dual-purpose box are assembled and filled into a foaming mold to be foamed, and are prepared into a dual-purpose box body, and the dual-purpose box body has two independent ones. The upper compartment 1 and the lower compartment 2, the upper compartment 1 has an upper compartment chamber 4 which is internally and externally connected, and the lower compartment 2 has a lower compartment studio 5 which is open inside and outside, and a bottom of the dual-purpose compartment It is a machine room 3 that penetrates front and rear; as shown in Fig. 1, one of the upper and lower outdoor heat exchangers 8 and the upper compartment cooling and heating metal components of the semiconductor refrigerating sheet 7, the upper chamber cooling and heating metal assembly The upper indoor heat exchanger 6 is in close contact with each other in sequence, and is fixed by a fastening member to form an upper compartment semiconductor cooling and heating device 20, and one of the semiconductor refrigeration sheet 10 and the lower compartment cooling and heating metal component. The lower indoor heat exchanger 11 of the lower outdoor heat exchanger 11 and the lower compartment refrigeration heater metal assembly are closely contacted and closely attached, and are fastened by fastening connectors to form a lower compartment semiconductor cooling and heating 21; in combination with FIG. 1 and FIG. 2, the upper compartment semiconductor cooling heater 20 is mounted on Room studio 4 and lower room semi-conductor After the body cooling and heating device 21 is installed in the lower chamber working chamber 5, the upper and lower outdoor heat exchangers 8 and the lower chamber semiconductor cooling and heating device 21 of the upper chamber semiconductor cooling and heating device 20 are connected by a connecting tube. The outdoor heat exchanger 11, the composite condenser 12, and the infusion pump 15 constitute a circulating flow path of the liquid refrigerant.

As shown in FIG. 1 and FIG. 3, in the technical solution of the present invention, the lower outdoor heat exchanger 11 of the lower compartment semiconductor cooling and heating device 21, and the upper outdoor heat exchanger 8 of the upper compartment semiconductor cooling and heating device 20, The hybrid condenser 12 and the infusion pump 15 are circulating flow paths that are sequentially connected in series to form a liquid refrigerant.

As shown in FIG. 1 and FIG. 3, the composite condenser 12 is composed of a horizontal composite condenser 13 and a vertical composite condenser 14 connected to each other, and the horizontal composite condenser 13 and the infusion pump 15 are provided. The vertical composite condenser 14 is placed in the machine compartment 3 of the new multifunctional semiconductor refrigerated warm-up compartment, and the vertical composite condenser 14 is placed on the outer back of the new multifunctional semiconductor refrigerated warm-up compartment.

In the technical solution of the present invention, the horizontal composite condenser 13 is composed of one or more horizontal single-layer condensers.

In the technical solution of the present invention, the vertical composite condenser 14 is composed of one or more vertical single-layer condensers.

In the technical solution of the present invention shown in Fig. 1, an external heat exchange fan 16 for improving the heat exchange capacity of the horizontal composite condenser 13 and the air is installed beside the horizontal composite condenser 13 in the machine room 3.

As shown in FIG. 4, in the technical solution of the present invention, the upper outdoor heat exchanger 8 is provided with a liquid refrigerant upper chamber inflow/outlet 18 through which the liquid refrigerant passes, and the upper outdoor heat exchanger 8 has a liquid refrigerant flowing therein. The shape of the flow passage 19, the upper outdoor heat exchanger 8 is provided with a fluid replacement vent 17.

As shown in Fig. 5, in the technical solution of the present invention, the lower outdoor heat exchanger 11 is provided with a liquid refrigerant lower chamber inflow/outlet 22 through which the liquid refrigerant passes, and the lower outdoor heat exchanger 11 has a liquid refrigerant flowing therein. Shaped flow path 23.

Claims

Rights request

1. A new type of multifunctional semiconductor refrigeration and heating box, which is characterized by: including

1), dual-purpose box body. The dual-purpose box body is a whole body in which the outer panel, inner tank and related parts are assembled and put into a foaming mold for foam molding. There are two dual-purpose box bodies. There are independent upper chambers (1) and lower chambers (2). The upper chamber (1) has a working room (4) on the back that connects the inside and outside, and the lower chamber (2) has a working room (4) on the back that connects the inside and the outside. The lower room is the working room (5), and the bottom of the dual-purpose box is the machine room (3) that runs from front to back;

2). Semiconductor refrigeration and heating device: including an upper compartment semiconductor refrigeration and heating device (20) and a lower compartment semiconductor refrigeration and heating device (21), in which the upper compartment semiconductor refrigeration and heating device (20) is composed of a semiconductor refrigeration and heating device in the upper compartment. The upper outdoor heat exchanger (8), semiconductor refrigeration plate (7) and upper indoor heat exchanger (6) installed in the working room (4) are in close contact with each other and fixedly connected in sequence; the lower semiconductor room The refrigeration and heating device (21) consists of a lower outdoor heat exchanger (11) installed in the lower working room (5), another semiconductor refrigeration piece (10) and a lower indoor heat exchanger (9) in sequence. It is formed after contact and fixed connection;

3), the upper outdoor heat exchanger (8) and the lower outdoor heat exchanger (11) are connected to the composite condenser (12) and the infusion pump (15) through pipelines to form a circulation flow path for the liquid refrigerant;

4). The composite condenser (12) is composed of a horizontal composite condenser (13) and a vertical composite condenser (14) that are interconnected and combined. The horizontal composite condenser (13) and the infusion pump (15) ) is located in the machine room (3), and the vertical composite condenser (14) is located on the back of the dual-purpose box.

2. A new type of multifunctional semiconductor refrigeration and heating box as claimed in claim 1, characterized by: the horizontal composite condenser (13) is composed of at least one horizontal single-layer condenser connected.

3. A new type of multifunctional semiconductor refrigeration and heating box as claimed in claim 1, characterized by: the vertical composite condenser (14) is composed of at least one vertical single-layer condenser connected.

4. A new type of multifunctional semiconductor refrigeration and heating box as claimed in claim 1, characterized by: a horizontal compound condenser that can be raised is installed next to the horizontal compound condenser (13) in the machine room (3) (13) External heat exchange fan (16) with high heat exchange capacity with air.

5. A new type of multifunctional semiconductor refrigeration and heating box as claimed in claim 1, characterized by: the upper outdoor heat exchanger (8) has a liquid refrigerant inflow/outlet (18) and an S-shaped flow path. (19); The upper outdoor heat exchanger (8) is provided with a liquid refill exhaust port (Π).

6. A new type of multifunctional semiconductor refrigeration and heating box as claimed in claim 1, characterized by: the lower outdoor heat exchanger (11) has another liquid refrigerant inflow/outlet (22) and another S Shaped flow path (23).

7. A method for manufacturing a new type of multifunctional semiconductor refrigeration and heating box, which is characterized in that the preparation process includes the following steps: 1). Prepare the dual-purpose box body: Assemble the outer panel, inner liner and related parts of the box and put them into the foaming mold for foaming to prepare a dual-purpose box body. There are two dual-purpose box bodies. There are independent upper chambers (1) and lower chambers (2). The upper chamber (1) has a working room (4) that connects the inside and outside, and the back of the lower chamber (2) has a working room that connects the inside and the outside. The lower room is the working room (5), and the bottom of the dual-purpose box is the machine room (3) that runs from front to back;

2) Preparing the semiconductor refrigeration and heating device: Combine the semiconductor refrigeration piece (7), the upper outdoor heat exchanger (8), one of the metal components of the upper compartment refrigeration and heating device, and one of the metal components of the upper compartment refrigeration and heating device. The heat exchangers (6) in the upper chamber are in close contact with each other in sequence and fixed with fasteners to form the semiconductor refrigeration and heating device (20) in the upper chamber; put the semiconductor refrigeration piece (10) into the lower chamber refrigeration unit The lower outdoor heat exchanger, one of the metal components of the heater

(11) and the lower chamber heat exchanger (9), one of the metal components of the lower chamber refrigeration and heating device, are in close contact with each other in sequence and fixed with fastening connectors to form the lower chamber semiconductor refrigeration and heating device (21) ) ;

3). Assembly: Install the semiconductor refrigeration and heating device (20) of the upper compartment into the working room (4) of the upper compartment and the semiconductor refrigeration and heating device (21) of the lower compartment into the working room (5) of the lower compartment. ), and then use connecting pipes to connect the upper outdoor heat exchanger (8) of the semiconductor refrigeration and heating device (20) in the upper compartment and the lower outdoor heat exchanger (11) of the semiconductor refrigeration and heating device (21) in the lower compartment. , the composite condenser (12) and the infusion pump (15) form a circulation flow path for the liquid refrigerant.

8. The manufacturing method of a new type of multifunctional semiconductor refrigeration and heating box as claimed in claim 7, characterized by: the lower outdoor heat exchanger (11) of the lower compartment semiconductor refrigeration and heating device (21), The upper outdoor heat exchanger (8), composite condenser (12) and infusion pump (15) of the upper chamber semiconductor refrigeration and heating device (20) are connected in series and circulate in sequence to form a circulation flow path for the liquid refrigerant.

9. The manufacturing method of a new type of multifunctional semiconductor refrigeration and heating dual-purpose box as claimed in claim 7, characterized in that: the compound condenser (12) consists of a horizontal compound condenser (13) and a vertical compound condenser The horizontal composite condenser (13) and the infusion pump (15) are placed in the machine room (3) of the new multifunctional semiconductor refrigeration and heating box, and the vertical composite condenser The device (14) is placed on the outer back of the new multifunctional semiconductor refrigeration and heating dual-purpose box.

10. The manufacturing method of a new type of multifunctional semiconductor refrigeration and heating box as claimed in claim 7, characterized in that: the horizontal composite condenser (13) is composed of one or more horizontal single-layer condensers connected together.

11. The manufacturing method of a new multifunctional semiconductor refrigeration and heating box as claimed in claim 7, characterized in that: the vertical composite condenser (14) is connected by one or more vertical single-layer condensers composition.

12. The manufacturing method of a new type of multifunctional semiconductor refrigeration and heating dual-use box as claimed in claim 7, characterized by: a horizontal compound condenser (13) in the machine room (3) is installed next to it to increase the horizontal compound condenser. The external heat exchange fan (16) has the heat exchange capacity between the condenser (13) and the air.

13. The manufacturing method of a new type of multifunctional semiconductor refrigeration and heating box as claimed in claim 7, It is characterized by: the upper outdoor heat exchanger (8) has an inflow/outlet port (18) for the liquid refrigerant in the upper chamber through which the liquid refrigerant passes, and the upper outdoor heat exchanger (8) has an S-shape inside for the liquid refrigerant to flow. The flow path (19), the upper outdoor heat exchanger (8) is provided with a liquid refill exhaust port (Π).

14. The manufacturing method of a new type of multifunctional semiconductor refrigeration and heating box as claimed in claim 7, characterized by: the lower outdoor heat exchanger (11) has a lower chamber through which liquid refrigerant flows into/ The outflow port (22) and the lower outdoor heat exchanger (11) have an S-shaped flow path (23) inside which the liquid refrigerant flows.