WO2013100067A1

WO2013100067A1 - Cover glass for electronic device, manufacturing method therefor, and touch sensor module for electronic device

Info

Publication number: WO2013100067A1
Application number: PCT/JP2012/083915
Authority: WO
Inventors: 橋本　和明
Original assignee: Hoya株式会社
Priority date: 2011-12-27
Filing date: 2012-12-27
Publication date: 2013-07-04
Also published as: JPWO2013100067A1; CN103988153B; JP5878562B2; CN103988153A

Abstract

Provided is a cover glass for an electronic device, which achieves thinning of the electronic device, which simplifies structural design for when assembling the cover glass with a display device, and which can reduce the electronic device manufacturing costs. Also provided is a manufacturing method therefor, and a touch sensor module for an electronic device. The cover glass for an electronic device is for protecting a display screen of an electronic device, and has a pair of main surfaces. One of the pair of main surfaces has a glass substrate provided with a frame part which projects outward in the plate thickness direction and into which is fitted a sensor base material for detecting a user operation.

Description

Cover glass for electronic equipment, manufacturing method thereof, and touch sensor module for electronic equipment

The present invention provides an electronic device for protecting a display screen, a circuit board, and the like of an electronic device including a portable device such as a mobile phone, a PDA (Personal Digital Assistant), a digital still camera, a video camera, or a slate PC (Personal Computer). The present invention relates to a cover glass for equipment, a manufacturing method thereof, and a touch sensor module for electronic equipment.

Electronic device cover glass is used mainly for the purpose of protecting internal components such as display screens and circuit boards of electronic devices including portable devices. In recent years, various cover glasses for electronic devices have been produced in order to meet the demands for slimming down and high functionality of portable devices, as well as the casings and display screens of portable devices of various shapes.

For example, Patent Document 1 discloses a cover glass for portable equipment as a cover glass for electronic equipment used for a capacitive touch panel. This cover glass for portable equipment is made of chemically tempered glass or the like, and is provided so as to protect a display device of an electro-optical device with an input function such as a mobile phone or a PDA. The touch panel has a cover glass for portable devices and a sensor substrate made of a transparent substrate on which a transparent conductive film is formed, and a touch sensor module for portable devices for generating an electrical signal according to a user's operation. Is configured to function as An input position detection electrode is formed on the upper surface of the sensor substrate, and the cover glass for portable devices is laminated on the sensor substrate with an adhesive.

JP 2011-216042 A

By the way, since the cover glass for portable devices of patent document 1 is laminated | stacked via the adhesive agent on the sensor board | substrate, each plate thickness of the cover glass for portable equipment and a sensor board | substrate is the thickness of a touch panel. Increased by simply being added. Therefore, when this touch panel is used, it may be difficult to reduce the thickness of the portable device.

Therefore, it is conceivable to reduce the thickness of the portable device by reducing the thickness of the cover glass for the electronic device and the thickness of the touch panel by reducing the thickness of the sensor substrate. However, in this case, since the strength of the cover glass for electronic devices is reduced by reducing the plate thickness, the function of the cover glass for electronic devices that protects the display device may not be achieved.
Therefore, when the cover glass for electronic devices is laminated on the sensor substrate, it has been difficult to sufficiently reduce the thickness of the electronic device.

Further, in the technique described in Patent Document 1, wiring for electrically connecting the input position detection electrode and the flexible wiring board is provided on the sensor board. In order to shield this wiring from the outside, a light shielding part having a light shielding property is provided on the periphery of the main surface of the cover glass for portable devices. By providing the light shielding portion, the cover glass for mobile devices is formed such that the area of the main surface is larger than the area of the main surface of the sensor substrate.

Here, the touch panel configured by laminating the cover glass for electronic devices on the sensor substrate is formed in a convex shape due to the difference in the area of the main surface. In this case, a gap is formed on the outer periphery of the sensor substrate. This gap has an influence such as difficulty in structural design when the touch panel is combined with a display device.

In order to avoid the influence of the above-described gap, for example, it is necessary to fill the gap by providing an adhesive layer composed of an adhesive or the like on the outer periphery of the sensor substrate. However, when an adhesive layer or the like is provided, the number of parts and the manufacturing process increase, which increases the manufacturing cost of the touch panel, and thus the manufacturing cost of electronic devices including portable devices. Therefore, when the cover glass for electronic devices was laminated | stacked on the sensor board | substrate, the problem that the manufacturing cost of a portable device increased also had arisen.

Therefore, the present invention aims to reduce the thickness of the electronic device, facilitate the structural design when combined with the display device, and further reduce the manufacturing cost of the electronic device, and the manufacturing method thereof, It is another object of the present invention to provide a touch sensor module for electronic equipment.

The aspect of this invention is the cover glass for portable devices for protecting the display screen of a portable device.
The cover glass for portable devices is
A glass substrate having a pair of main surfaces opposed to each other in the plate thickness direction, wherein one of the pair of main surfaces has a recess for fitting with a transparent substrate on which a transparent conductive film is formed. have.

In the cover glass for a portable device, it is preferable that the side surface portion of the concave portion is formed so as to be inclined toward the central portion of the bottom surface portion from the one main surface toward the bottom surface portion of the concave portion.

In the above-described cover glass for portable devices, it is preferable that an interposed surface is provided between the one main surface and the side surface of the concave portion.

The said cover glass for portable devices WHEREIN: The said recessed part is a surface of the said transparent substrate when the said transparent substrate fits into the said recessed part, Comprising: The surface opposite to the said glass substrate is the same as said one main surface It is preferable that it is formed so as to form a plane.

In the above cover glass for portable devices, a shielding portion for shielding light is provided on the one main surface, and the concave portion is a surface of the transparent substrate when the transparent substrate is fitted to the concave portion. In addition, it is preferable that the surface opposite to the glass substrate is the surface of the shielding portion and is formed to be flush with the surface opposite to the glass substrate.

Another aspect of the present invention is a touch sensor module for a mobile device that is provided in the mobile device and generates an electrical signal corresponding to a user operation.
The mobile device touch sensor module is:
The above-mentioned cover glass for portable devices;
The transparent substrate,
The transparent substrate is fitted into the recess,
The said transparent conductive film is used as a transparent electrode for producing | generating the electrical signal according to the user's operation with respect to the other main surface among the pair of said main surfaces of the said glass substrate.

Another aspect of the present invention is a method for manufacturing a cover glass for a mobile device for protecting a display unit of the mobile device.
The manufacturing method includes:
Forming a recess for fitting with a transparent substrate on which a transparent conductive film is formed on a glass substrate having a pair of main surfaces opposed to each other in the plate thickness direction, wherein one of the pair of main surfaces Forming a recess on the surface.

In the method for manufacturing a cover glass for a portable device, it is preferable that in the step of forming the recess, the recess is formed by etching.

Another aspect of the present invention is a cover glass for a portable device for protecting a display screen of an electronic device.
The cover glass for electronic devices is
An electronic device cover glass for protecting a display screen of an electronic device,
It has a pair of main surfaces, and one main surface side of the pair of main surfaces protrudes outward in the thickness direction and forms a space for fitting a sensor base material for detecting a user operation. A glass substrate provided with a frame portion to be provided.

Another aspect of the present invention is a touch sensor module for electronic devices.
The electronic device touch sensor module includes:
An electronic device touch sensor module for generating an electrical signal according to a user's operation provided in an electronic device,
The above-described cover glass for electronic devices;
And the sensor base material provided on the cover glass for electronic equipment so as to fit in the frame part.

Another aspect of the present invention is a cover glass for an electronic device used for at least a part of an exterior of the electronic device for protecting internal components of the electronic device.
The cover glass for electronic devices is
A frame portion that has a pair of main surfaces and protrudes outward in the thickness direction on one main surface side of the pair of main surfaces, and forms a space for fitting at least a part of the internal components. A glass substrate is provided.

Another aspect of the present invention is a method for manufacturing a cover glass for an electronic device for protecting a display screen of the electronic device.
The manufacturing method of the cover glass for electronic equipment is as follows:
A frame portion is formed on one main surface side of the pair of main surfaces of the glass substrate so as to protrude outward in the thickness direction and form a space for fitting a sensor base material for detecting a user operation.

According to the present invention, it is possible to reduce the thickness of the portable device, facilitate the structural design when combined with the display device, and further reduce the manufacturing cost of the portable device.

The perspective view of the cover glass for portable devices of this embodiment. The top view of the cover glass for portable devices. The bottom view of the cover glass for portable devices. The principal part expanded sectional view of the cover glass for portable devices. The principal part expanded sectional view which shows the modification of the cover glass for portable devices shown to FIG. 4A. The principal part expanded sectional view which shows the modification of the cover glass for portable devices shown to FIG. 4A. Sectional drawing of the touch sensor module for portable devices. Sectional drawing of the touch sensor module for portable devices. Sectional drawing of the touch sensor module for portable devices. Sectional drawing which shows the modification of the touch sensor module for portable devices shown to FIG. 6A. Sectional drawing which shows the modification of the touch sensor module for portable devices shown to FIG. 6A. Sectional drawing which shows the modification of the touch sensor module for portable devices. Sectional drawing which shows the process of forming a groove | channel on a glass substrate using an etching in order. 1 is a diagram illustrating a schematic configuration of a display device including a touch sensor module for a portable device according to an embodiment. The figure explaining schematic structure of the display apparatus containing the touch sensor module for portable devices of a well-known technique.

(1) Cover Glass for Portable Device of the Present Embodiment The configuration of the cover glass for portable device (hereinafter referred to as cover glass) of the present embodiment will be described with reference to FIGS. 1 to 3 and FIGS. 4A to 4C. 1 is a perspective view of the cover glass of the present embodiment, FIG. 2 is a plan view of the cover glass, FIG. 3 is a bottom view of the cover glass, and FIG. 4A is an enlarged cross-sectional view of the main part of the cover glass for portable devices (IV in FIG. 2). 4B and 4C are main part enlarged cross-sectional views showing a modification of the cover glass for a portable device shown in FIG. 4A.

The cover glass of the present embodiment is, for example, a portable electronic device that can perform an operation input to the display screen (operation input as a touch panel function), particularly a mobile phone, a PDA, a digital still camera, a video camera, or a slate PC. Used to protect equipment display screens and circuit boards. For this reason, since the cover glass of this embodiment needs to be a glass which is thin and has high strength in order to satisfy the specifications for the operation input to the drop or the display screen, it is chemically strengthened by ion exchange treatment. Yes.

As shown in FIG. 1 to FIG. 3 and FIG. 4A to FIG. 4C, the cover glass 10 of the present embodiment is formed in a plate shape, and the main surface of the glass substrate 11 constituting the cover glass 10 is, for example, longitudinal It is formed in a substantially rectangular shape with a direction dimension of 8 to 16 cm and a lateral dimension of 4 to 8 cm. In addition, the shape of the main surface of the glass substrate 11 is not limited to a substantially rectangular shape or a rectangular shape, and may be appropriately changed according to the shape and structure of various portable devices. Further, the cover glass 10 may be provided with a hole penetrating in the thickness direction of the cover glass 10 for voice output from a speaker provided in the portable device, voice input to a microphone, or the like.

Although the thickness T of the glass substrate 11 is not particularly limited, it is usually preferably 1 mm or less from the viewpoint of suppressing the weight increase of various portable devices using the cover glass 10 and reducing the thickness of the portable device. More preferably, it is 7 mm or less. In addition, it is preferable that the lower limit of the plate thickness T is 0.2 mm or more from the viewpoint of ensuring the mechanical strength of the cover glass 10.

The glass substrate 11 is formed to be attachable to a display screen of a portable device. The glass substrate 11 faces the first main surface 11a facing the outside of the mobile device when attached to the display screen of the mobile device and the display screen of the mobile device when attached to the display screen of the mobile device. And a second main surface 11b. The

main surfaces

11a and 11b are opposed to the glass substrate 11 in the thickness direction (vertical direction in FIGS. 4A to 4C). Further, the second main surface 11b of the glass substrate 11 is formed with a recess 12 for fitting with a touch sensor 20 described later.

The shape of the recess 12 is a shape that is recessed from the second main surface 11b toward the first main surface 11a. Moreover, the recessed part 12 has the side part 12a and the bottom face part 12b. Side surface portion 12a is provided between second main surface 11b and bottom surface portion 12b. Further, the side surface portion 12 a is arranged along the thickness direction of the glass substrate 11. Bottom surface portion 12b is formed to form a plane parallel to second main surface 11b. The recesses 12 are arranged at an interval (preferably an interval of 2 mm or more) from the outer peripheral end surface of the glass substrate 11 toward the inner side in the surface direction of the second main surface 11b. That is, the outer peripheral edge part and the recessed part 12 are formed in the 2nd main surface 11b.

The preferred range for the dimensions of the recess 12 is as follows. The size of the opening surface in the recess 12 (portion that is coplanar with the second main surface 11b) is 24 to 154 mm in the longitudinal direction and 9 to 74 mm in the lateral direction. The size of the bottom surface portion 12b in the recess 12 is 24 to 154 mm in the longitudinal direction and 9 to 7 mm in the short direction. Further, the depth of the recess 12 is 0.1 to 0.3 mm.

Here, when the cross section of the glass substrate 11 is viewed, as shown in FIGS. 4A to 4C, the side surface portion 12a is inclined with respect to the plate thickness direction from the second main surface 11b toward the bottom surface portion 12b (for example, It is preferably formed so as to incline toward the center of the bottom surface portion 12b. That is, when the cross section of the glass substrate 11 is seen, it is preferable that the angle formed by the extended surfaces of the side surface portion 12a and the bottom surface portion 12b is an obtuse angle. Specifically, for example, when the angle formed by the extension surfaces of the side surface portion 12a and the bottom surface portion 12b is an acute angle or a right angle, when laminating the shielding portion 13 and the adhesive 14 described later on the recess 12 In addition, a gap is easily generated between the boundary between the side surface portion 12 a and the bottom surface portion 12 b and the shielding portion 13 or the adhesive 14. In this case, the incident light from the outside is reflected by the air in the gap, which causes problems such as difficulty in viewing the display screen of the portable device. Therefore, by forming the side surface portion 12a and the bottom surface portion 12b as described above, it is possible to prevent a gap from being formed.

Further, as shown in FIGS. 4A and 4B, it is preferable that an intervening surface 12c is provided between the second main surface 11b and the side surface portion 12a. The intervening surface 12c may be formed by chamfering the boundary between the second main surface 11b and the side surface portion 12a. When the cross section of the glass substrate 11 (cross section taken along line IV-IV in FIG. 2) is seen, the interposition surface 12c may be formed linearly as shown in FIG. 4A or curved as shown in FIG. 4B. May be formed. By providing the intervening surface 12c, the surface of the glass substrate 11 is smoothly inclined from the second main surface 11b to the side surface portion 12a. For this reason, the touch sensor 20 can be easily fitted into the recess 12.

In addition, as shown in FIG. 4C, the glass substrate 11 may be provided with a shielding part (painting part) 13. The shielding portion 13 is provided by being laminated on each of the peripheral portions of the second main surface 11b, the side surface portion 12a, and the bottom surface portion 12b, and light incident in the thickness direction of the glass substrate 11 from the first main surface 11a. Shield. The thickness of the shielding part 13 is preferably 3 to 50 μm from the viewpoint of reducing the thickness of the portable device.

The shielding part 13 is preferably formed by laminating paints in multiple layers in a printing process to be described later. The printed content of the printed layer formed by laminating the coatings in multiple layers is not limited, but a typical example of forming a printed layer having a multilayer structure (example in which the first layer is negative printing) is the first layer. Is a layer that prints the frame portion on the outer periphery, and the first layer has a device model, a company logo, various sensor holes, and the like.

The second layer is a layer that prints the logo of the company name and the model name in the specified color, the third layer is the back layer for removing the light shielding property of the printing part of the logo and the model name and the pinhole of the frame printing part, the fourth layer In addition, the backing layer, the fifth layer is a filter ink for adjusting the transmittance to be printed in the lightness sensor hole portion, the sixth layer is a guideline for alignment when adhering to the housing or attaching the sensor glass substrate 21 described later. There is a configuration.

A compressive stress layer having a predetermined thickness is formed on each of the

main surfaces

11a and 11b of the glass substrate 11 of the present embodiment by chemical strengthening described later. This compressive stress layer is an altered layer in which a part of the alkali metal originally contained in the glass material constituting the glass substrate 11 is replaced with an alkali metal having a larger ionic radius. For example, sodium ions contained in the glass material constituting the glass substrate 11 of the present embodiment are replaced with potassium ions.

Moreover, it is preferable that the glass substrate 11 of this embodiment is comprised, for example with aluminosilicate glass, soda-lime glass, borosilicate glass, etc. Above all, the glass substrate 11, a SiO ₂ and _Al 2 _{O 3,} it is preferably made of aluminosilicate glass containing at least one alkali metal oxide, a is selected from Li ₂ O and Na ₂ O, .

(2) Touch sensor module for portable device as a touch sensor module for electronic device according to the embodiment Next, the touch sensor module for portable device 30 (hereinafter referred to as module 30) as the touch sensor module for electronic device according to the present embodiment. The configuration will be described with reference to FIGS. 5A and 5B. 5A and 5B are cross-sectional views of the module of this embodiment.
The module 30 according to the present embodiment functions as a capacitive coupling type touch panel. For example, the capacitance change that is changed by pressing the first main surface 11a of the glass substrate 11 can be obtained as a resistance value, a voltage, a current, or the like. Detection is based on changes. Further, the module 30 of the present embodiment includes the cover glass 10 and the touch sensor 20.

The touch sensor 20 includes a sensor glass substrate 21 as a sensor base material and a transparent conductive film 22, and is interposed between the cover glass 10 and the display screen of the mobile device to operate the display screen of the mobile device. It is configured to detect input. The sensor glass substrate 21 is formed in a plate shape that can be attached to a display screen of a portable device. The main surface of the sensor glass substrate 21 has, for example, a longitudinal dimension of 2 to 15 cm and a lateral dimension. Is formed in a substantially rectangular shape of 0.5 to 7 cm. Here, the sensor glass substrate 21 will be described as an example of the sensor base material. However, the sensor base material may be, for example, a film or an acrylic plate.

The sensor glass substrate 21 faces the first main surface 21a facing the outside of the portable device when attached to the display screen of the portable device and the display screen of the portable device when attached to the display screen of the portable device. And a second main surface 21b. Each

main surface

21a, 21b is opposed to the plate thickness direction of the sensor glass substrate 21 (vertical direction in FIGS. 5A and 5B). The plate thickness T1 of the sensor glass substrate 21 is preferably 0.5 mm or less, and more preferably 0.4 mm or less, from the viewpoint of reducing the thickness of the portable device. The sensor glass substrate 21 is an example of a transparent substrate.

The transparent conductive film 22 is used as a transparent electrode for generating an electrical signal corresponding to a user operation on the first main surface 11a of the cover glass 10. The transparent conductive film 22 is provided on the first main surface 21a and is formed in a plane parallel to the first main surface 21a. Here, to make a plane parallel to the first main surface 21a means that the transparent conductive film 22 has a configuration including a bent portion to the extent that no disconnection occurs inside.

The transparent conductive film 22 is disposed with a predetermined thickness along the first main surface 21a of the sensor glass substrate 21. Here, the predetermined thickness is, for example, 100 nm or less when the transparent conductive film 22 is formed by sputtering, and transparent resin is used when the transparent conductive film 22 is formed by printing. Including 1000 nm or less.

Further, the transparent conductive film 22 is operated by a user of a mobile device (for example, a user of the mobile device) with respect to the first main surface 11a of the glass substrate 11 when the cover glass 10 is attached to the display screen of the mobile device. An electrical signal is generated in response to pressing the first main surface 11a with a finger or the like. The transparent conductive film 22 outputs the generated electrical signal to a connection portion (not shown) such as a land for electrically connecting to an FPC (flexible printed circuit board) or a metal pattern for signal wiring.

The transparent conductive film 22 may be formed with an arbitrary pattern in which gaps such as a lattice are formed so as to form a plurality of transparent electrodes. The transparent conductive film 22 may be arranged in multiple layers in the thickness direction of the sensor glass substrate 21.

The electrical signal output from the transparent conductive film 22 is transmitted to a position detection circuit (not shown) through the connection portion. The position detection circuit detects a pressed position based on a resistance value, a voltage, a current, and the like that are changed when the first main surface 11a of the glass substrate 11 is pressed.

The touch sensor 20 configured as described above is fitted in the thickness direction of the glass substrate 11 with respect to the recess 12 of the glass substrate 11 as shown in FIG. 5A. In this case, as shown in FIG. 5B, the first main surface 21a of the sensor glass substrate 21 is disposed so as to face the bottom surface portion 12b of the recess 12, and the second main surface 21b of the sensor glass substrate 21 is It arrange | positions so that it may face the same direction (downward in FIG. 5B) as the 2nd main surface 11b. Further, for example, a gel adhesive 14 may be interposed between the touch sensor 20 and the recess 12.

Here, since the cover glass 10 of the present embodiment has a recess 12 that fits with the touch sensor 20, the thickness T <b> 2 of the module 30 of the present embodiment is determined by, for example, covering the cover glass 10 with the touch sensor 20. It is smaller than the thickness (T + T1) of the module when stacked on top. Therefore, by using the cover glass 10 of this embodiment, it is possible to suppress an increase in the thickness of the module 30.

Moreover, the size of the space | gap S formed in the outer periphery of the part which protrudes outside from the 2nd main surface 11b of the glass substrate 11 when the touch sensor 20 fits into the recessed part 12 among the glass substrates 21 for sensors is, for example, When the cover glass 10 is laminated on the touch sensor 20, the size of the gap formed on the outer periphery of the sensor glass substrate 21 is smaller. Therefore, when the module 30 is combined with a display device of a portable device, it is possible to reduce influences such as difficulty in structural design.

Furthermore, since the size of the gap formed on the outer periphery of the sensor glass substrate 21 can be reduced, the need to provide an adhesive or the like for filling the gap on the outer periphery of the sensor glass substrate 21 can be almost eliminated. Thereby, the increase in a number of parts and a manufacturing process can be suppressed, and the manufacturing cost of the module 30 can be reduced.

6A, when the sensor glass substrate 21 is fitted to the recess 12, the recess 12 has a second main surface 21b of the sensor glass substrate 21 (a first main surface 21a facing the glass substrate 11). Is preferably formed so as to be flush with the second main surface 11 b of the glass substrate 11. For example, when the adhesive 14 is not used, the depth of the recess 12 may be formed to the same size as the plate thickness of the sensor glass substrate 21. Thereby, the size of the gap formed on the outer periphery of the sensor glass substrate 21 can be made extremely small. Here, forming the same plane means that the step between the second main surface 11b of the glass substrate 11 and the second main surface 21b of the sensor glass substrate 21 in the plate thickness direction of the glass substrate 11 is 200 μm or less. That is formed. This step may be formed by the second main surface 11b of the glass substrate 11 projecting in the plate thickness direction of the glass substrate 11 relative to the second main surface 21b of the sensor glass substrate 21, or the sensor glass. The second main surface 21 b of the substrate 21 may be formed by protruding in the plate thickness direction of the glass substrate 11 from the second main surface 11 b of the glass substrate 11. In addition, it is more preferable that the level | step difference between each plane is formed in 100 micrometers or less.

Moreover, when the shielding part 13 is provided in the 2nd main surface 11b of the glass substrate 11, when the glass substrate 21 for sensors is fitted with the recessed part 12, as shown to FIG. The second main surface 21b of the substrate 21 is formed to be flush with the shielding portion surface 13a which is the surface of the shielding portion 13 and is the surface opposite to the glass substrate 11 (the lower surface in FIG. 6B). It is preferable. Even in this case, the size of the gap formed in the outer periphery of the sensor glass substrate 21 can be made extremely small.

In addition, the shielding part 13 may be provided in the 1st main surface 11a side of the glass substrate 11, as shown in FIG. In this case, the shielding part 13 is provided via the adhesive 14 on the peripheral part of the 1st main surface 11a. Further, a film 15 such as an anti-scattering film (ASF) formed by laminating polyester may be provided on the upper surfaces of the shielding part 13 and the adhesive 14.

Here, the cover glass and the touch sensor module described so far can be expressed as a cover glass and a touch sensor module having the following configurations, respectively, based on FIGS.
1 to 3 and 4A to 4C, the glass substrate 11 has a pair of

main surfaces

11a and 12b. On the side of the main surface 12b of the glass substrate 11, a space having a quadrangular shape in a plan view for forming a sensor base material for projecting a user's operation is formed to protrude outward in the thickness direction with respect to the main surface 12b. A frame portion 11c is provided. The frame portion 11 c is formed of the same material as the glass substrate 11 and is configured integrally with the glass substrate 11. The frame portion 11c has a tip surface 11b, an inner wall surface 12a formed so as to be inclined with respect to the plate thickness direction, and an intervening surface 12c interposed between the tip surface 11b and the inner wall surface 12a. The cover glass having the glass substrate 11 provided with such a frame portion 11c is configured to protect one main surface of the sensor substrate 21 and the outer side wall surface.

Here, as shown in FIG. 8, the frame portion 11 c may be formed to correspond to the outer peripheral shape of the sensor substrate 21 for positioning the sensor substrate 21. That is, the inner wall surface 12a of the frame portion 11c is formed so as to surround the outer peripheral surface of the sensor substrate 21 provided in the frame portion 11c. In the case of the configuration shown in FIG. 8, the inner wall surface 12 a of the frame portion 11 c may be in contact with at least a part of the outer peripheral surface of the sensor substrate 21. In such a configuration, the sensor substrate 21 can be easily aligned when the sensor substrate 21 is fitted in the frame portion 11c of the glass substrate 11, and the manufacturing efficiency of the sensor module can be improved. .

Further, as shown in FIG. 6A, in a state where the sensor glass substrate 21 is fitted in the frame portion 11c, the front end surface 11b of the frame portion 11c and the surface of the sensor glass substrate 21 are flush with each other. The protruding height of the frame part 11c is determined. Furthermore, as shown in FIG. 6B, in the case where the shielding part 13 is formed on the distal end surface 11b of the frame part 11c, the shielding part is fitted with the sensor glass substrate 21 fitted in the frame part 11c. The protruding height of the frame portion 11c is determined so that the surface 13a and the surface of the sensor glass substrate 21 are flush with each other.

(3) Manufacturing method of cover glass of embodiment Next, the manufacturing method of the cover glass 10 of this embodiment is demonstrated. The manufacturing method of the cover glass 10 of this embodiment has a plate-shaped glass preparation process, a shape processing process, a chemical strengthening process, and a printing process.
(3-1) Sheet Glass Production Process The sheet glass production process is a process for producing a sheet glass from molten glass, and for example, a float method can be adopted. The float process is a method in which molten glass melted in a melting furnace is supplied to a float bath in which molten tin is stored, and the molten glass is drawn on the molten tin in the float bath in the horizontal direction and molded. According to the float method, the molten glass floats on the molten tin of the float bath, and the molten glass naturally spreads to a stable thickness. Molded.
And a glass ribbon is cut | disconnected so that a plate-shaped glass of a desired magnitude | size may be obtained, after being conveyed to the slow cooling furnace provided in the downstream of the float bath and being cooled slowly.

In addition to the float method, a downdraw method, a press method, or the like may be used as a method for producing the plate glass, but for the point that plate glass with good surface accuracy can be obtained and for mass production of plate glass. From the viewpoint of suitability, the float method is preferably used.

(3-2) Shape processing step Next, a shape processing step is performed. The shape processing step is a step of processing the plate glass obtained in the plate glass manufacturing step into a glass substrate having a desired shape according to the outer shape of the cover glass. Hereinafter, a method using etching as the shape processing step will be described. The shape processing step using etching includes the following (a-1) etching resistant film forming step, (a-2) patterning step, and (a-3) cutting step. By using etching in the shape processing step, it is possible to suppress the occurrence of minute scratches, cracks, etc. on the cut surface of the cover glass compared to the case of using a cutting method by machining in the shape processing step. It can prevent that the intensity | strength of a cover glass falls resulting from a crack, etc.

(A-1) Etching-resistant film forming step In the etching-resistant film forming step, an etching-resistant film is formed on at least one surface of the sheet glass. This etching resistant film is usually formed on both sides of the sheet glass, but when only one side is brought into contact with the etching solution in the subsequent cutting step, the etching resistant film is formed only on the one side. Good. In the following description, it is assumed that the etching resistant film is formed on both surfaces of the sheet glass.

The etching-resistant film can be appropriately selected as long as it can be partially removed by a patterning process in a later patterning process and has a property that is not dissolved / removed in an etching solution used in a cutting process. . As such an etching resistant film, it is preferable to use a resist film that is hardly soluble or insoluble in at least a hydrofluoric acid aqueous solution. In this case, in the patterning process, the resist film can be patterned by an exposure process using a photomask and a development process using a developer, and can be cut using an etching solution in the cutting process.

(A-2) Patterning Step In the patterning step, at least the etching resistant film is patterned. Thereby, the etching resistant film other than the region corresponding to the shape in the planar direction of the finally produced glass substrate 11 is removed from the etching resistant film covering the entire surface of the plate glass. As a patterning method for the etching-resistant film, photolithography that is performed by combining the above-described exposure and development can be typically used. The patterning step may be performed on at least one side of the plate-like glass having an etching resistant film formed on both sides, or may be performed on both sides.

(A-3) Cutting step In the cutting step, the plate glass is cut into small pieces by etching the surface of the plate glass on which the patterned etching-resistant film is provided in contact with the etching solution. The etching process is usually performed by immersing plate glass in an etching solution. The etching solution is not particularly limited as long as it contains at least hydrofluoric acid. If necessary, other acids such as hydrochloric acid and various additives such as a surfactant may be added.
In this way, a glass substrate 11 having a desired shape is obtained.

Next, a method for forming the recess 12 in the glass substrate 11 using etching will be described. FIG. 9 is a cross-sectional view for sequentially illustrating the steps of forming the recess 12 using etching on the glass substrate 11.
First, a resist (photosensitive organic material) layer 16 is applied and formed on the second main surface 11b of the glass substrate 11 (see step S1 in FIG. 9), subjected to predetermined exposure and development, and a recess is formed on the second main surface 11b. A resist pattern having 12 patterns 16a (that is, the resist layer in the region for forming the recess 12 is removed) is formed (see step S2 in FIG. 9).

Then, by using this resist pattern as a mask, wet etching is performed using an etching solution capable of dissolving the glass material (for example, an acidic solution containing hydrofluoric acid), thereby forming the recess 12 in the second main surface 11b ( (See step S3 in FIG. 9). Examples of the acidic solution containing hydrofluoric acid include a hydrofluoric acid aqueous solution, a mixed solution of hydrofluoric acid and hydrochloric acid, a mixed solution of hydrofluoric acid and sulfuric acid, and an aqueous solution containing ammonium fluoride.
Then, the remaining resist pattern is peeled off, and the glass substrate 11 is washed (see step S4 in FIG. 9).

In the shape processing by wet etching using a resist, the intervening surface 12c having a rounded shape with respect to the boundary between the second main surface 11b and the side surface portion 12a of the recess 12 may be formed. Here, the radius of curvature of the boundary between the bottom surface portion 12b of the concave portion 12 and the side surface portion 12a which is a wall surface is preferably 10 μm or more.

In order to make the intervening surface 12c rounded, a resist having a polymerization degree gradient in the thickness direction of the glass substrate 11 on the main surface of the glass substrate 11 so that the main surface side has the smallest degree of polymerization. A pattern is formed, and the above wet etching is performed using this resist pattern as a mask. The smaller the degree of polymerization of the resist on the main surface side of the cover glass, the smaller the adhesion between the glass and the resist.

Here, in order for the resist pattern to have a polymerization degree gradient in the thickness direction of the glass substrate 11, for example, the resist thickness, the exposure amount, the post-bake conditions, and the like may be controlled. Control of these conditions is performed by appropriately changing the type of resist used and the energy of exposure light. By controlling the adhesion between the glass and the resist in this way, the etching solution can easily enter the interface between the resist and the glass (main surface), and as a result, the interposition surface 12c is rounded. It is formed in a shape with For this reason, it is possible to prevent chipping and the like from occurring when the touch sensor 20 is fitted into the recess 12 of the glass substrate 11.

In this way, the recess 12 is formed in the second main surface 11b of the glass substrate 11. When the recess 12 is formed by using etching, it is possible to suppress generation of minute scratches, microcracks, and the like on the side surface portion 12a and the bottom surface portion 12b of the recess 12, so that, for example, chemicals can be used without impairing the strength of the cover glass. Since the high intensity | strength of the cover glass obtained by a reinforcement | strengthening process can be maintained, it is preferable.

In the shape processing step, the plate glass may be cut or the recesses 12 may be formed by mechanical processing such as scribe processing or laser processing. Here, the scribing means that a cutting line (linear scratch) having a desired shape is provided on the surface of the plate-like glass or glass substrate 11 by a scriber made of super steel alloy or diamond. By forming the glass substrate 11 or the recess 12 by machining, the manufacturing efficiency of the cover glass 10 can be improved. In this case, when the cross section of the glass substrate 11 is viewed, an angle formed by a line extending along the side surface portion 12a and a line extending along the bottom surface portion 12b may be 85 degrees or more and 90 degrees or less. It is desirable that this angle does not exceed 90 degrees.

In the shape processing step, the intervening surface 12c may be formed by chamfering the boundary between the second main surface 11b and the side surface portion 12a of the recess 12. A chamfering process is a shape process which chamfers using a diamond grindstone. When the interposition surface 12c is formed in a planar shape, the chamfering angle is, for example, 10 to 40 degrees with respect to the second main surface 11b. For this reason, when fitting the touch sensor 20 into the recess 12 of the glass substrate 11, it is possible to prevent chipping and the like from occurring.

(3-3) Chemical Strengthening Step Next, a chemical strengthening step is performed on the glass substrate 11 obtained by the shape processing step.
In the chemical strengthening step, a plurality of glass substrates 11 are loaded into a cassette (holder), and the cassette is immersed in a chemical strengthening treatment liquid containing a molten salt. Thereby, one or more types of alkali metals contained in the glass substrate 11 are subjected to ion exchange treatment with the alkali metal of the molten salt, and a compressive stress layer is formed on the surface layer portion of the glass substrate 11.

The composition and temperature of the molten salt, and the immersion time can be appropriately selected according to the glass composition of the glass substrate 11, the thickness of the compressive stress layer formed on the surface layer portion of the glass substrate 11, and the like. If it is the aluminosilicate glass mentioned above, it is preferable to use the low temperature type ion exchange method which makes the process temperature of a chemical strengthening process liquid normally 300 to 500 degreeC. This is because the high-temperature ion exchange method in which ion exchange is performed in the temperature range above the annealing point of the glass does not provide as much strength as the low-temperature ion exchange method, and the glass surface is eroded by the molten salt during the strengthening treatment. Since transparency is easily impaired, it is difficult to obtain a glass substrate 11 suitable for the cover glass 10. For example, in the chemical strengthening step of the present embodiment, the composition and temperature of the molten salt and the immersion time are preferably selected from the ranges exemplified below.
-Molten salt composition: Single salt of potassium nitrate (KNO3), single salt of sodium nitrate (NaNO3), or mixed salt in which potassium nitrate and sodium nitrate are mixed at an arbitrary weight ratio-Temperature of molten salt: 350 ° C to 450 ° C
・ Immersion time: 1-8 hours

The thickness of the compressive stress layer formed on each of the

main surfaces

11a and 11b by this chemical strengthening process is 40 to 80 μm. In this embodiment, since the glass composition of the glass substrate 11 is an aluminosilicate glass, the thickness of the compression stress layer formed is increased when compared with, for example, soda lime float glass having the same plate thickness as the glass substrate 11. can do.
The mechanical strength of the glass substrate 11 obtained by the chemical strengthening step is preferably 5000 kgf / cm 2 or more, more preferably 7000 kgf / cm 2 or more, most preferably 3 point bending strength (3 point bending strength). 10,000 kgf / cm 2 or more.

(3-4) Printing Step Next, a printing step is performed on the chemically strengthened glass substrate 11 to form the shielding portion 13 extending from the second main surface 11b to the peripheral edge portion of the bottom surface portion 12b of the concave portion 12. . For the printing method, various known methods such as screen printing can be used according to the paint constituting the printing layer and the thickness of each layer of the printing layer. Here, as the paint, for example, various inks using carbon as a pigment can be used.
Thus, the cover glass 10 of this embodiment is obtained.

As described above, according to the cover glass 10 of the present embodiment, the mechanical strength is improved because the cover glass 10 has the compressive stress layer formed by the chemical strengthening treatment. In the cover glass 10 of the present embodiment, the thickness of the portion of the glass substrate 11 where the recess 12 is provided is small. However, by incorporating the touch sensor 20 in the recess 12, the mechanical properties of the cover glass 10 are reduced. Strength can be supplemented.

Moreover, according to the cover glass 10 of this embodiment, the recessed part 12 for fitting with the touch sensor 20 is formed in the 2nd main surface 11b. Thereby, since it can suppress that the thickness of the module 30 increases, thickness reduction of a portable apparatus can be achieved.

Furthermore, according to the cover glass 10 of this embodiment, when the touch sensor 20 is fitted into the recess 12, the touch sensor 20 is formed on the outer periphery of a portion protruding from the second main surface 11b of the glass substrate 11 to the outside. The size of the void S to be formed can be reduced. Thereby, when combining the module 30 with the display apparatus of a portable apparatus, structural design can be made easy.

Further, since the size of the gap formed on the outer periphery of the sensor glass substrate 21 can be reduced, it is possible to almost eliminate the need to provide an adhesive or the like for filling the gap on the outer periphery of the sensor glass substrate 21. Thereby, since the increase in a number of parts and a manufacturing process can be suppressed, the manufacturing cost of the module 30 can be reduced and the manufacturing cost of a portable apparatus can be reduced by extension.

In addition, according to the cover glass 10 of this embodiment, since it is comprised so that the touch sensor 20 may be integrated in the recessed part 12 of the glass substrate 11, the well-known structure (for example, touch sensor is liquid crystal in a liquid crystal panel). The size of the region detectable by the touch sensor 20 can be freely formed as compared with an in-cell configuration configured in the pixel of FIG. 6 or an on-cell configuration in which the touch sensor is configured between the color filter substrate and the polarizing plate. There is an advantage that you can. This advantage will be described with reference to FIGS. 10A and 10B.
FIG. 10A is a diagram illustrating a schematic configuration of a display device including a module according to the present embodiment, and FIG. 10B is a diagram illustrating a schematic configuration of a display device including a module of a known technology.

For example, as shown in FIG. 10A, when the cover glass 10 of this embodiment is used, the touch sensor 20 and the liquid crystal panel 40 are separated by forming the recess 12 so as to be fitted to the touch sensor 20. can do. For this reason, the size of the region R1 that can be detected by the touch sensor 20 can be formed independently of the size of the display region R2 of the display screen. Here, the region R1 corresponds to the region of the glass substrate 11 that overlaps the transparent conductive film 22, and the display region R2 is the portion of the glass substrate 11 that overlaps the liquid crystal panel 40 except for the shielding portion 13. Corresponds to the region.

Thereby, in the present embodiment, the degree of freedom in designing the touch sensor 20 can be improved, for example, by forming the size of the region R1 larger than the size of the display region R2. Therefore, the module 30 of the present embodiment can be applied to a plurality of portable devices having different sizes of the region R1 and the display region R2, so that the versatility of the module 30 can be improved.

On the other hand, as shown in FIG. 10B, in the case of a known configuration in which the touch sensor is incorporated into the liquid crystal panel 40, the size of the region R2 is formed to be the same as the size of the display region R1. In this case, the design freedom of the touch sensor cannot be improved as compared with the module 30 of the present embodiment. Accordingly, when the touch sensor is configured to be incorporated in the liquid crystal panel 40, the module cannot be applied to a plurality of portable devices having different sizes of the region R1 and the display region R2, thereby improving the versatility of the module. I can't let you.
As described above, the advantages of the cover glass 10 and the module 30 of this embodiment are clear.

As mentioned above, although embodiment of this invention was described in detail, the cover glass for portable devices of this invention, its manufacturing method, and the touch sensor module for portable devices are not limited to the said embodiment, and do not deviate from the main point of this invention. Of course, various improvements and changes may be made in the range.

In particular, in the embodiment of the present invention, for the transparent conductive film, the electrical characteristics of the cover glass for portable devices are changed, for example, as an electromagnetic wave shielding film, by appropriately changing the film thickness, resistance value, and the like. It can be used as a functional film.

As a modification of the configuration of the above-described embodiment, a configuration in which at least a part of a display module such as a liquid crystal module or an organic EL module fits in the frame portion 11c of the glass substrate 11 together with the sensor base material may be employed. . That is, the protruding height of the frame part 11c may be determined so that at least a part of the display module can be fitted together with the sensor base material in the frame part 11c of the glass substrate 11. For example, the protruding height of the frame portion 11c with respect to the main surface 12b may be set to 2 to 20 mm.

Furthermore, the present invention can also be used as a cover glass for the rear surface of a casing of an electronic device. In this case, the shape of the frame portion 11c is determined so that at least a part (lens part) of an internal component, for example, a camera module, or at least a part of the printed wiring board (a protruding part such as an IC) can be fitted. Good. That is, the shape of the frame portion 11c is not limited to a square shape in plan view, and may be a circular shape in plan view. Moreover, the area of the internal space of the frame part 11c can also be determined according to the fitting object.

Further, in the above-described embodiment, the shape of the frame portion 11c is a quadrangular shape in plan view, and as shown in FIG. 2, the four sides of the glass substrate 11 are connected. However, the configuration of the frame portion 11c is not limited to this example, and may be a configuration in which only two sides parallel to each other among the four sides of the glass substrate 11 may be used. Furthermore, as a configuration of the frame portion 11c, a spacer that is a member different from the glass substrate 11 may be used.

Furthermore, in the above-described embodiment, the example of the etching process or the machining process has been described as the method for forming the recess 12 or the frame part 11c. However, the concave portion 12 or the frame portion 11c can be formed together with the outer shape of the glass substrate by appropriately setting the shape of the transfer surface of the (direct) press mold as shown in International Publication 2012/132293. In this case, a glass substrate having a complicated shape can be easily manufactured, and the manufacturing efficiency can be improved. In addition, the glass substrate can be bent in the thickness direction, and the design of the electronic device can be improved.

DESCRIPTION OF SYMBOLS 10 ... Cover glass for portable devices 11 ... Glass substrate 11a ... 1st main surface 11b ... 2nd main surface 12 ... Recessed part 12a ... Side surface part 12b ... Bottom surface part 12c ... Interposition surface 13 ... Shielding part 13a ... Shielding part surface 14 ... Adhesive 15 ... Film 20 ... Touch sensor 21 ... Glass substrate for touch sensor 22 ... Transparent conductive film 30 ... Touch sensor module for portable device

Claims

An electronic device cover glass for protecting a display screen of an electronic device,
It has a pair of main surfaces, and one main surface side of the pair of main surfaces protrudes outward in the thickness direction and forms a space for fitting a sensor base material for detecting a user operation. Having a glass substrate provided with a frame part to be
The cover glass for electronic devices characterized by the above-mentioned.
The cover glass for an electronic device according to claim 1, wherein the frame portion is formed so as to correspond to an outer peripheral shape of the sensor base material for alignment of the sensor base material.
3. The cover glass for an electronic device according to claim 1, wherein an inner wall surface of the frame portion is formed to be inclined with respect to a plate thickness direction.
The electronic device cover glass according to any one of claims 1 to 3, wherein an interposition surface is provided between a front end surface and an inner wall surface of the frame portion.
In the state where the sensor base material is fitted in the frame part, the protruding height of the frame part is determined so that the front end surface of the frame part and the surface of the sensor base material are flush with each other. The cover glass for an electronic device according to any one of claims 1 to 4.
A shielding part for shielding light is formed on the front end surface of the frame part, and the surface of the shielding part and the surface of the sensor substrate are in the state where the sensor base material is fitted in the frame part. The cover glass for an electronic device according to any one of claims 1 to 4, wherein a protruding height of the frame portion is determined so as to be flush with a main surface.
The projecting height of the frame portion is determined so that at least a part of a display module for an electronic device together with the sensor base material fits in the frame portion. Cover glass for electronic equipment.
The electronic apparatus cover glass according to any one of claims 1 to 7, wherein the frame portion is formed of the same material as the glass substrate and is configured integrally with the glass substrate. *
An electronic device touch sensor module for generating an electrical signal according to a user's operation provided in an electronic device,
A cover glass for electronic equipment according to any one of claims 1 to 8,
An electronic device touch sensor module comprising: the sensor base material provided on the electronic device cover glass so as to be fitted into the frame portion.
A cover glass for an electronic device used for at least a part of the exterior of the electronic device for protection of internal components of the electronic device,
A frame portion that has a pair of main surfaces and protrudes outward in the thickness direction on one main surface side of the pair of main surfaces, and forms a space for fitting at least a part of the internal components. Having a glass substrate provided,
The cover glass for electronic devices characterized by the above-mentioned.
A method of manufacturing a cover glass for an electronic device for protecting a display screen of the electronic device,
A frame part is formed on one main surface side of the pair of main surfaces of the glass substrate so as to protrude outward in the thickness direction and form a space for fitting a sensor base material for detecting a user operation. The manufacturing method of the cover glass for electronic devices characterized by these.
The manufacturing method of the cover glass for electronic devices according to claim 11, wherein the frame portion is formed by performing an etching process from one main surface side of the glass substrate.
The manufacturing method of the cover glass for electronic devices of Claim 11 which forms the said frame part with a pair of main surface of a glass substrate by the direct press method.