+

WO2013176135A1 - Convertisseur de chemin optique et procédé de fabrication dudit convertisseur - Google Patents

Convertisseur de chemin optique et procédé de fabrication dudit convertisseur Download PDF

Info

Publication number
WO2013176135A1
WO2013176135A1 PCT/JP2013/064099 JP2013064099W WO2013176135A1 WO 2013176135 A1 WO2013176135 A1 WO 2013176135A1 JP 2013064099 W JP2013064099 W JP 2013064099W WO 2013176135 A1 WO2013176135 A1 WO 2013176135A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical path
optical
optical waveguide
base substrate
substrate
Prior art date
Application number
PCT/JP2013/064099
Other languages
English (en)
Japanese (ja)
Inventor
直樹 北村
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Publication of WO2013176135A1 publication Critical patent/WO2013176135A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Definitions

  • the present invention relates to a method for manufacturing an optical waveguide device having an optical path conversion structure, and more particularly, to an optical path converter with no damage to members during manufacturing and excellent handleability, and a method for manufacturing the same.
  • optical communication systems With the recent development of technology, the demand for optical communication systems is growing dramatically. In particular, in order to increase the utilization efficiency of optical fibers, not only the progress of technologies such as high-speed processing of optical signals and multi-wavelengths, but also the importance of new technology development related to miniaturization and high integration is increasing. In addition, devices using optical waveguides that have a higher degree of freedom of wiring than optical fibers have characteristics that are not found in other similar parts, and thus have been used in many optical communication systems in recent years.
  • an active module can be configured by optically coupling a light emitting element, a light receiving element or the like to the optical waveguide. Further, since the optical waveguide is formed on the substrate, the module can be made thin.
  • the optical element such as the light emitting element and the light receiving element described above and the optical waveguide are coupled as shown in FIG. 11 or FIG.
  • FIG. 11 shows a light propagation device in which a light emitting element 501 such as a laser diode (LD) and an optical waveguide 300 are coupled.
  • a method is employed in which the light emitting element 501 is mounted at a location where a part of the optical waveguide 300 laminated on the substrate 200 is removed. With this configuration, the optical signal emitted from the light emitting element 501 can be guided with high accuracy into the optical waveguide 300 on the same line.
  • a light emitting element 501 such as a laser diode (LD) and an optical waveguide 300 are coupled.
  • LD laser diode
  • the light propagation device shown in FIG. 12 has a configuration in which a carrier 503 on which a light receiving element 502 such as a photodiode (PD) is mounted is disposed in the vicinity of the exit surface of the optical waveguide 300.
  • a carrier 503 on which a light receiving element 502 such as a photodiode (PD) is mounted is disposed in the vicinity of the exit surface of the optical waveguide 300.
  • the optical signal emitted from the optical waveguide 300 can be received by the light receiving element 502 and converted into an electrical signal.
  • the light propagation device shown in FIG. 11 or FIG. 12 has a disadvantage that it has a large number of parts and therefore requires a lot of labor for adjustment.
  • a light propagation device in which an optical element including a light emitting element and a light receiving element is directly mounted on the upper surface of an optical waveguide.
  • an optical path changing technique is adopted in which an optical signal propagating through an optical waveguide formed on a substrate is redirected in the vertical direction.
  • a surface emitting laser (Vertical-Cavity Surface Emitting Laser: VCSEL) that has recently appeared is often used.
  • FIG. 13 or FIG. 14 shows an example according to the optical path conversion technique.
  • the optical path changer 101 shown in FIG. 13 cuts the entire substrate 200 on which the optical waveguide 300 is formed with a cross section 600 having an inclination angle of 45 degrees to the upper right with respect to the upper surface, and then cuts the left side.
  • An optical path conversion mirror 400 is formed on the surface, and an optical path is formed between the optical element and an optical element installed above.
  • the upper right end cross section of the optical waveguide 300 in FIG. 13 is processed into an acute angle shape, there is a defect that the end face of the optical waveguide 300 is likely to be chipped at the time of cutting. Further, after cutting, since the upper right end portion has a particularly sharp shape, careful handling such as avoiding contact with the outside is required.
  • the optical path changer 102 shown in FIG. 14 forms the cross-section 600 by cutting the substrate 200 on which the optical waveguide 300 is formed at an inclination angle of 45 degrees with respect to the upper surface, as in FIG.
  • the optical path conversion mirror 400 is formed on the cut surface of the member on the right side of the figure. For this reason, according to this, since the cross-sectional shape on the optical waveguide 300 side becomes an obtuse angle, the occurrence of chipping during cutting is reduced.
  • the optical path changer 102 in FIG. 14 employs a configuration in which the optical signal subjected to the optical path conversion is combined with the optical element 500 mounted on the back side of the substrate, and the optical signal passes through the inside of the substrate 200. Therefore, since the coupling loss increases by that amount, the practicality in optical coupling between the light emitting element and the optical waveguide is low.
  • Patent Documents 1 to 4 are known.
  • Patent Document 1 the technical content is shown in which a dummy substrate attached in advance is set on a jig and the end face is ground integrally. Further, in the example disclosed in Patent Document 2, after dividing the slab waveguide together with the substrate, the technical content is shown in which the wavelength is corrected by finely adjusting and fixing these positions.
  • Patent Document 3 discloses a technical content in which an optical path conversion mirror is deposited on the inner surface of a groove portion having an optical path conversion inclined surface and a side wall surface intersecting therewith, and a protective insulating layer is formed to seal the mirror. . Further, in Patent Document 4, an optical waveguide structure and an optical path conversion component are separately manufactured, and an optical path conversion component is inserted into a hole provided in the optical waveguide structure, so that light caused by the air gap can be obtained. The technical contents to suppress the spread are shown.
  • the dummy substrate according to the example disclosed in Patent Document 1 contributes effectively when polishing the light input / output surface of the optical waveguide, and is not involved in the cutting process of the optical waveguide.
  • the examples disclosed in Patent Documents 2 to 4 there is no disclosure of the technical contents for preventing the optical waveguide from being damaged in the manufacturing process, which was a problem of the related art.
  • the technical contents for preventing the optical waveguide from being damaged in each of the above-described light propagation devices (FIGS. 11 to 14), there is no disclosure about the technical contents for preventing the optical waveguide from being damaged.
  • the present invention improves the inconveniences of the related art, and in particular, an optical path changer that effectively prevents damage to the end face of the optical waveguide during manufacturing and improves productivity, and a method for manufacturing the same.
  • the purpose is to provide.
  • a base substrate having an end portion of the optical waveguide on one surface, and disposed on the base substrate so as to face the end surface of the optical waveguide, and A light reflection film configured to set an optical path of the optical waveguide toward an optical element located outside one surface of the base substrate, wherein the light reflection film is an optical waveguide on the base substrate.
  • the base substrate integrally mounted on the base substrate in a state of being sandwiched between one and the other inclined sections obtained by obliquely cutting at a specific angle, and the one and the other inclined sections are It is formed by processing including a dummy substrate previously laminated on the outer surface of the optical waveguide.
  • a dummy substrate is laminated on a base substrate provided with an optical waveguide via the optical waveguide, and the optical waveguide is cut obliquely together with the base substrate and the dummy substrate.
  • a light reflecting film is formed between the one cut surface and the other cut surface.
  • the present invention employs the configuration in which the optical waveguide whose strength is reinforced by the lamination of the dummy substrates is cut together with the base substrate, and according to this, the damage of the end surface of the optical waveguide at the time of manufacturing is effectively prevented. As a result, it is possible to provide an excellent optical path changer capable of improving productivity and a manufacturing method thereof.
  • optical path converter provided with the optical waveguide which comprises the acute angle cross-sectional shape in related technology.
  • optical path changer provided with the optical waveguide which comprises the obtuse angle cross-sectional shape in related technology.
  • Embodiment An optical path converter 10 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 9.
  • FIG. 1 shows an optical path converter 10 according to an embodiment of the present invention.
  • An optical path changer 10 that converts an optical path of an optical signal includes a thin base substrate 20, an optical waveguide 30 that is formed on the upper surface of the base substrate 20, and includes a lower clad 30A, a core 30B, and an upper clad 30C.
  • 1 shows an optical element including an optical path conversion mirror 40 as a light reflecting film that reflects and outputs an optical signal propagating in a waveguide 30 in a direction opposite to the optical waveguide 30 lamination surface of the base substrate 20.
  • Reference numeral 80 denotes an optical element such as a light emitting element or a light receiving element mounted on the optical path changer 10.
  • a light emitting portion or a light receiving portion 81 is provided on the surface of the optical element 80 that faces the optical path conversion mirror 40.
  • the optical element 80 is bonded and mounted by a bonding material 70 such as Au—Sn alloy solder.
  • the optical waveguide 30, which is a thin plate as a whole, is laminated in the order of a lower clad 30A, a single core 30B, and an upper clad 30C. Moreover, since the shape of the laminated surface of the optical waveguide 30 is the same shape and the same area as the upper surface of the base substrate 20 which is a rectangle, the optical path changer 10 has a thin plate shape as a whole.
  • the configuration of the optical waveguide 30 includes a quartz optical waveguide formed on a Si substrate or a quartz substrate, a polymer waveguide, a Ti diffusion waveguide formed by thermal diffusion on a lithium niobate substrate, or an InP substrate. Each of these optical semiconductor waveguides is employed.
  • the lower clad 3A is formed on the upper surface of the base substrate 2 that is a quartz substrate or an Si substrate, and the core 3B having a rectangular cross section having a higher refractive index than the lower clad 3A is formed on the upper layer clad 3A.
  • a quartz optical waveguide produced by covering with an upper cladding 3C having a refractive index lower than that of the core 3B was employed.
  • the desired waveguide shape (rectangular section) of the core 3B is formed by processing the core film (glass film) formed on the lower clad 3A by photolithography (semiconductor integrated circuit manufacturing technology) and reactive ion etching. (Patterning process).
  • the optical path conversion mirror 40 reflects and outputs an optical signal propagating in the optical waveguide 30 in a direction opposite to the optical waveguide 30 lamination surface of the base substrate 20.
  • the optical path conversion mirror 40 can also reflect and output an optical signal transmitted from the upper clad 30C side by the optical element 80 as a light emitting element into the core 30B.
  • the optical path conversion mirror 40 is a dielectric multilayer film or a metal film.
  • optical path changer 10 Since the optical path changer 10 is manufactured by a series of steps described later (FIG. 9: S101 to S105), its optical waveguide formation surface (surface on which the optical element 80 is mounted) is smooth and has no irregularities.
  • FIG. 2A shows a thin base substrate 2 having an optical waveguide 3, a temporary adhesive 61 having a specific peeling method, and a surface facing the base substrate 2 (base substrate facing surface).
  • the thin-plate-like dummy substrate 5 to which the temporary adhesive 61 is applied is shown.
  • FIG. 2B shows a state in which the dummy substrate 5 is pasted to the base substrate 2 via the optical waveguide 30 using the temporary pasting adhesive 61.
  • the base substrate facing surface of the dummy substrate 5 has the same shape and the same area as the laminated surface of the rectangular optical waveguide 30, and these are bonded together without causing a positional shift.
  • Such a state formed in a thin plate shape is referred to as a laminated base substrate 22.
  • the optical path conversion mirror 40 when the optical path conversion mirror 40 is formed, the optical waveguide 3 whose strength is reinforced by the lamination of the dummy substrates 5 is cut along with the base substrate 2.
  • One and the other cut surfaces can be formed without causing damage (or breakage) to the end face.
  • the optical path conversion mirror 40 can be formed on a cut surface having no unevenness, and the optical path converter 10 that accurately realizes optical path conversion of an optical signal can be manufactured with high yield.
  • the temporary adhesive 61 is peeled off in a dummy substrate peeling step (FIG. 9: S105) described later. Therefore, as the temporary adhesive 61, an adhesive that can be peeled even after curing is selected.
  • thermoplastic adhesive when a thermoplastic adhesive is selected, it can be peeled off by applying heat.
  • an adhesive having a dedicated stripping solution is selected, stripping using the stripping solution is possible.
  • Some of these stripping solutions are designated with a temperature range suitable for use. Therefore, the stripping solution is used after adjusting to an appropriate temperature as necessary.
  • a polymer waveguide, a Ti diffusion waveguide, an optical semiconductor waveguide, or the like may be employed as a constituent material of the dummy substrate 5.
  • a material that does not hinder cutting at least is selected in consideration of hardness and the like.
  • FIG. 3A shows a cross section 60 common to the three of the base substrate 2, the optical waveguide 3, and the dummy substrate 5.
  • FIG. 3B shows a state in which the base substrate 2 is divided together with the dummy substrate 5 and the optical waveguide 3 by a cross section 60 common to the three.
  • the cross section 60 common to all three forms an inclination angle ⁇ with respect to the light propagation direction and the laminated surface of the optical waveguide 3 of the base substrate 2.
  • the two cut surfaces formed here are referred to as one cut surface 41 and the other cut surface 42, respectively.
  • the member having one cut surface 41 is referred to as an optical path member 22A
  • the member having the other cut surface 42 is referred to as an adjustment member 22B.
  • the optical path conversion mirror 40 is formed on one cut surface 41 of the optical path member 22A, and this state is referred to as an optical path conversion member.
  • the optical path conversion mirror 40 made of a dielectric multilayer film or a metal film provided on the optical path conversion member 23A is thinly and uniformly formed by the method of directly depositing the mirror material on the one cut surface 41 described above. .
  • FIG. 5A shows the optical path conversion member 23A, the adjustment member 22B, and the fixing adhesive 62 for joining them together.
  • FIG. 5B shows an optical path conversion member in which one cut surface 41 and the other cut surface 42 having the same shape and the same area are brought into contact with each other via a fixing adhesive 62 so as not to be displaced. 23A and adjustment member 22B are joined. Such a state is referred to as a laminated reflective base substrate 23.
  • This laminated reflection base substrate 23 is obtained by dividing the thin plate-like laminated base substrate 22, depositing the optical path conversion mirror 40 on one cut surface 61, and abutting and joining it again to the state before the cut surface is formed. Therefore, the whole is similarly thin.
  • the step of joining the optical path conversion member 23A and the adjustment member 22B having the same height in the stacking direction, which was originally integrated, is adopted in the height direction at the time of joining ( This is to avoid problems in handling the optical path converter due to misalignment in the stacking direction) and problems in mounting the optical element in the optical path converter.
  • the optical path conversion member 23A and the adjustment member 22B are juxtaposed so that one surface of each of them (for example, the surface on the base substrate 20 side in FIG. 5) is flush with each other and via the fixing adhesive 62. Since these are in contact with each other, the other surface (for example, the surface on the side of the dummy substrate 5A in FIG. 5) is inevitably formed. Therefore, no positional deviation occurs in each layer of the optical waveguide 30 in the laminated reflective base substrate 23.
  • the fixing adhesive 62 an adhesive having a peeling method different from that of at least the temporary adhesive 61 is employed. This is to prevent the fixing adhesive 62 from being peeled when the dummy substrate 5A is peeled off together with the upper portion of the optical path conversion mirror 40. Therefore, as the fixing adhesive 62, an adhesive that does not have a specific peeling method and is difficult to peel may be employed.
  • FIG. 6A shows a state where the temporary adhesive 61 cured at the interface between the dummy substrate 5A and the optical waveguide 30 in the laminated reflective base substrate 23 (FIG. 5) is peeled off by a specific peeling method. Is.
  • the optical path changer 10 according to the present embodiment shown in FIG. 6B is produced in this way.
  • the optical path conversion mirror 40 is formed on one cut surface 41 that is not damaged, and each member (23A, 22B) is abutted and joined so as to be in a state before the cut surface is formed. Therefore, the surface of the optical waveguide 30 on which the optical path conversion mirror 40 is interposed is smoothly formed without unevenness. Therefore, according to the optical path changer 10, it is possible to accurately realize the optical path conversion of the optical signal and solve the problem in mounting the optical element.
  • FIG. 2 shows a process of attaching the dummy substrate 5 to the base substrate 2 via the optical waveguide 3 (FIG. 9: S101).
  • an appropriate amount of temporary bonding adhesive 61 is applied to the base substrate facing surface of the dummy substrate 5.
  • the appropriate amount is an amount that does not cause displacement of the adhesive surface when the cut surface forming step (FIG. 9: S102) is performed after the temporary adhesive 61 is cured.
  • the temporary adhesive 61 needs to be peeled off in the dummy substrate removing step (FIG. 9: S105), it can be easily peeled off as long as the above-described requirement that the displacement does not occur is satisfied. It is set as an amount (FIG. 9: S101).
  • the optical waveguide 3 forming surface of the base substrate 2 and the base substrate facing surface (the surface on which the temporary adhesive 61 is applied) of the dummy substrate 5 are opposed to each other, and the dummy substrate 5 is moved straight toward the base substrate 2. Then, it is brought into contact with the optical waveguide 3 via the temporary adhesive 61. At that time, as described above, adjustment is made so that positional deviation does not occur on both contact surfaces having the same shape and the same area (FIG. 9: S101).
  • FIG. 2B shows a laminated base substrate 22 in which a dummy substrate 5 is attached to the base substrate 2.
  • the intervening temporary adhesive 61 is cured, and both are pasted.
  • the temporary adhesive 61 due to the effectiveness of the temporary adhesive 61, at the time of cutting in the cut surface forming step (FIG. 9: S102) described later, at least the position of the bonding surface is not displaced (FIG. 9: S101).
  • a transparent substrate material is used for the dummy substrate 5 in order to maintain a desired cutting position with high accuracy when the base substrate 2 on which the optical waveguide 3 and the dummy substrate 5 are laminated is cut.
  • This facilitates confirmation of the cutting position in the cut surface forming step (FIG. 9: S102), and is flexible even when an electrode pattern for optical element bonding is formed in the optical waveguide 30 in advance. Positioning becomes possible.
  • FIG. 2A shows a state where the temporary adhesive 61 is applied only to the surface of the dummy substrate 5 facing the base substrate.
  • this dummy substrate affixing step may be performed in the same manner after applying the temporary adhering adhesive 61 to the surface of the base substrate 2 where the optical waveguide 3 is formed.
  • the temporary bonding adhesive 61 may be applied to both the base substrate facing surface of the dummy substrate 5 and the optical waveguide 3 forming surface of the base substrate 2 (FIG. 9: S101).
  • FIG. 3 shows a process of dividing the laminated base substrate 22 into an optical path member 22A and an adjustment member 22B to form one and the other cut surfaces (FIG. 9: S102).
  • the optical path changer 10 Since the purpose of the optical path changer 10 according to the present embodiment is to change the optical path, here, the three that form a predetermined inclination angle ⁇ with respect to the laminated surface of the optical waveguide 3 of the base substrate 2 and the light propagation direction. Cut along the common cross section 60 (FIG. 9: S102).
  • the laminated base substrate 22 is held in a state inclined from the horizontal state (FIG. 2) by the inclination angle ⁇ , and this is shared by the three from the dummy substrate 5 side by a cutting machine.
  • the optical path conversion member 22A and the adjustment member 22B are separated by cutting along the cross section 60. Thereby, one cut surface 41 and the other cut surface 42 shown in FIG. 3B are formed (FIG. 9: S102).
  • the inclination angle ⁇ is set so that the optical signal propagating in the optical waveguide 3 is reflected and output in the direction opposite to the base substrate 2 (the direction of the optical signal toward the upper cladding 3C). According to this setting, it is also possible to reflect and output an optical signal transmitted from the light emitting element (not shown) from the upper layer cladding 30C side into the core 30B.
  • the laminated base substrate 22 is cut in a state of being inclined 45 degrees (the inclination angle ⁇ is set to 45 degrees). And cut).
  • This inclination angle ⁇ may be finely adjusted as appropriate in consideration of whether the configuration of the optical path changer 10 is adopted on the light emitting element side or the light receiving element side, or in consideration of the installation environment.
  • the base substrate 2 including the optical waveguide 3 can be cut in a state where the surface of the optical waveguide 3 is not exposed. According to this, when the base substrate 2 is cut at the cross section 60 common to the three, the dicing blade or the like does not directly contact the exposed optical waveguide 3, so that the optical waveguide 3 is not chipped. Can be prevented.
  • the cutting edge of the dicing blade or the like moves along the cut surface of the dummy substrate 5 without being shaken, the cut surface of the optical waveguide 3 reinforced by the lamination of the dummy substrate 5 is smoothly formed without unevenness.
  • the dummy substrate 5 and the optical waveguide 3 are in close contact with each other at least in the vicinity of the cross section 60 common to the three (FIG. 9: S102).
  • the optical path conversion mirror 40 is formed on one cut surface 41 in a light reflecting film forming step (FIG. 9: S103) described later, this one cut surface 41 is finished as flat as possible. . This is because, if the optical path conversion mirror 40 is formed on one of the cut surfaces 41 having a large surface roughness, the same small irregularities appear on the surface, and this is used to propagate an optical signal. This is because when the direction is changed, a desired coupling efficiency cannot be obtained due to irregular reflection.
  • the one cut surface 41 is polished prior to the light reflecting film forming step (FIG. 9: S103). You may make it do. By doing so, it is possible to prevent the coupling efficiency from being lowered due to the irregular reflection as described above, and thus it is possible to perform suitable optical path conversion by the optical path conversion mirror 40 (mirror forming slope polishing process).
  • the other cut surface 42 may be polished. Since the optical path conversion mirror 40 according to the present embodiment is formed thin by vapor deposition of a mirror material, it is possible to perform optical path conversion with higher accuracy by smoothing the back surface.
  • the optical path conversion mirror 40 was formed by employing a method of directly depositing a mirror material on one cut surface 41. Such a state is shown as an optical path conversion member 23A in FIG. In this way, it is possible to form a thin and uniform optical path conversion mirror 40.
  • the temporary adhesive 61 is peeled off in the dummy substrate removing process described later, a part of it is easily combined with the dummy substrate 50. It can be removed (FIG. 9: S103).
  • one and the other cut surfaces (41, 42) are abutted and bonded to the state before the cut surface is formed in a cut surface abutting and joining step (FIG. 9: S104) described later. That is, in view of such a situation, in the light reflecting film forming step, the other cut surface 42 may be adopted as the slope for forming the optical path conversion mirror (FIG. 9: S103).
  • the other cut surface 42 may be polished (a slope forming step for mirror formation). Further, one of the cut surfaces 41 directly interposed during the optical path conversion of the optical signal propagating through the optical waveguide 30 may be polished regardless of whether or not it is adopted as a slope for forming an optical path conversion mirror.
  • a dielectric multilayer film or a metal film is formed as the optical path conversion mirror 40.
  • other mirror materials may be used.
  • FIG. 5 shows a process of joining the optical path conversion member 23A and the joining member 22B via the fixing adhesive 62 (FIG. 9: S104).
  • the fixing adhesive 62 must be selected based on the fact that the temporary adhesive 61 is peeled off in a dummy substrate removing step (FIG. 9: S105) described later. That is, in this cut surface contact joining step, an adhesive that does not peel off by the peeling method applied to the temporary adhesive 61 (an adhesive having a characteristic that does not change) is used as the fixing adhesive 62 (FIG. 9: S104).
  • an appropriate amount of fixing adhesive 62 is applied to the joining slope 42.
  • the appropriate amount here means that when the optical path changer 10 produced through the dummy substrate removal step (FIG. 9: S105) after the fixing adhesive 62 is cured is used as usual, the joint surface peels off. Refers to the amount that is not.
  • the one cut surface 41 on which the optical path conversion mirror 40 is formed and the other cut surface 42 to which the fixing adhesive 62 is applied face each other, and the adjustment member 22B is straightened toward the optical path conversion member 23A.
  • the other cut surface 42 is brought into contact with the one cut surface 41 via the fixing adhesive 62.
  • adjustment is made so that positional deviation does not occur between one cut surface 41 and the other cut surface 42 having the same shape and the same area.
  • the fixing adhesive 62 interposed between the optical path conversion member 23A and the adjustment member 22B is cured, and the laminated reflective base substrate 23 is joined. That is, due to the effect of the temporary adhesive 61, the optical path changer 10 completed through the dummy substrate removal step (FIG. 9: S105) is in a state where the joint surface is not peeled at least as long as it is handled in a normal use state. (FIG. 9: S104).
  • the optical path changers 11 (FIG. 7) and 12 (FIG. 8) have completed the dummy substrate removal step (FIG. 9: S105) through this cut surface abutting and joining step (FIG. 9: S104). Is in a state of being removed.
  • the present embodiment employs a process of joining the optical path conversion member 23A and the adjustment member 22B, which are originally integrated and have the same height in the stacking direction, so that the surface is not stepped.
  • the laminated reflective base substrate 23 thus obtained can be easily obtained (FIG. 9: S104).
  • the surface of the optical waveguide 30 of the optical path converter 10 manufactured through the dummy substrate removing step (FIG. 9: S105) is also flushed by adjusting the position in the height direction easily and accurately.
  • the yield can be improved and the productivity can be improved.
  • FIG. 5A shows a state where the optical path conversion member 23A and the joining member 22B are joined after the fixing adhesive 62 is applied only to the joining slope 42.
  • the member joining step according to the present embodiment may be performed in the same manner after applying the fixing adhesive 62 on the optical path conversion mirror 40 formed on the mirror forming slope 41.
  • the fixing adhesive 62 may be applied to both the joining slope 42 and the optical path conversion mirror 40, and the same may be performed (FIG. 9: S104).
  • FIG. 6 shows a process of removing the dummy substrate 5A from the laminated reflective base substrate 23 (FIG. 5).
  • the dummy substrate 5A is removed by temporarily sticking and bonding between the surface of the upper clad 30A side (upper clad surface 10A) in the optical waveguide 30 of the laminated reflective base substrate 23 and the base substrate facing surface of the dummy substrate 5A. It is performed by peeling the agent 61 (FIG. 9: S105).
  • the temporary adhesive 61 As the temporary adhesive 61, as described above, an adhesive that can be peeled off by a specific method even after curing is employed. Therefore, in this dummy substrate peeling step, if the adhesive used as the temporary bonding adhesive 61 is thermoplastic, it is peeled off by applying heat, and the dummy substrate 51 is removed. Similarly, if the adhesive used as the temporary sticking adhesive 61 has a special stripping solution, it is stripped using the stripping solution and the dummy substrate 51 is removed (FIG. 9: S105). .
  • the optical path conversion mirror 40 according to the present embodiment is formed sufficiently thin by vapor deposition of the mirror material in the above-described light reflecting film forming step (FIG. 9: S103), as shown in FIG. While being included in the substrate 5A, it is removed together with the substrate 5A.
  • the temporary adhesive 61 may remain on the upper clad surface 10A depending on the type of adhesive used, the bonding time, the bonding environment, and the like.
  • the temporary adhesive 61 that has not been completely removed not only hinders smooth mounting of the optical element on the optical path converter 10, but also the optical path-converted light during optical coupling with the optical element. It can also cause optical loss and diffuse reflection of signals.
  • the upper clad surface 10A may be cleaned after the dummy substrate peeling step.
  • a cleaning agent suitable for the temporary adhesive 61 used is used (cladding surface cleaning step).
  • a method of polishing the surface is adopted. That is, one or both of the cladding surface polishing process and the cladding surface cleaning process may be performed. In this polishing process / cleaning process, care should be taken not to damage the upper clad surface 10A.
  • the optical path converter 10 shown in FIG. 6B is manufactured. Further, as part of the contents of each of these series of steps, a mirror forming slope polishing step, a clad surface cleaning step, and a clad surface polishing step are executed as necessary.
  • FIG. 1 shows a configuration in which an optical element 80 is mounted on the optical path changer 10.
  • a bonding material 70 such as AuSn solder. Therefore, an electrode pattern for joining optical elements may be formed on the optical waveguide 30 as needed.
  • a marker for performing alignment may be formed on the optical waveguide 30 in advance as necessary.
  • the optical path changer in the related art described above forms an optical path conversion mirror on the cut surface in a state in which a part of the optical waveguide is chipped after cutting the substrate on which the optical waveguide is provided.
  • the dummy substrate 5 is pasted prior to the cut surface forming step (FIG. 9: S102)
  • the dummy substrate pasting step (FIG. 9: S101)
  • the optical path changer as shown in FIG. 13 or FIG. 14 since the end of the cut surface on the optical waveguide side has an acute angle shape, it is necessary to be careful in order to prevent damage such as chipping even when handling the finished product. was there.
  • the process of joining the optical path conversion member 23A and the adjustment member 22B, which were originally integrated, is employed, it is easy to make the surface of the optical waveguide 30 flush (with no step). It was. According to this, since the finally produced optical path changer 10 has no pointed portion exposed, it is excellent in handleability.
  • the height adjustment in the stacking direction at the time of bonding can be performed with high accuracy, the problem of mounting the optical element can be solved.
  • the gap between the optical path conversion mirror 40 and the mounted optical element 80 can be suppressed to the thickness of the upper clad 30C. That is, the coupling loss due to the optical coupling can be reduced to the maximum by the gap that is significantly narrower than that of the existing optical path changer.
  • optical path conversion of the optical signal has been described for the optical path converter 10 provided with the optical waveguide 30 having one core 30B for convenience.
  • the optical waveguide 35 in which a plurality of cores 35 ⁇ / b> B are arranged with respect to the optical path conversion mirror 45 is employed.
  • optical path conversion of a plurality of optical signals can be performed at once.
  • the dummy substrate pasting step (FIG. 9: FIG. 9) is applied to the base substrate 25 on which the optical waveguide 35 having a plurality of cores 35B is formed, in the same manner as in the above-described embodiment.
  • S101 cut surface forming step (FIG. 9: S102), light reflecting film forming step (FIG. 9: S103), cut surface contact joining step (FIG. 9: S104), and dummy substrate removing step (FIG. 9: S105).
  • the mirror forming slope polishing step, the clad surface polishing step, and the clad surface cleaning step described above may be performed as necessary.
  • optical path changer 15 produced by such a series of process contents (FIG. 9: S101 to S105, etc.), it is possible to obtain the same effect as that of the above-described embodiment, and further, a plurality of optical signals. Since optical path conversion is possible, it has excellent expandability.
  • the number of cores 35B shown in FIG. 10 may be increased or decreased as necessary.
  • an optical path converter (10, 15) in which a wavelength filter is formed on one cut surface 41 or the like is used.
  • an optical signal having a desired wavelength can be reflected and coupled to the optical waveguide (30, 35).
  • a photodiode (PD) is mounted as the optical element 80 to the optical converter (10, 15) in which the wavelength filter is formed, a plurality of optical signals having different wavelengths propagating through the optical waveguide are used. Only an optical signal having a desired wavelength can be converted into an optical path and incident on a photodiode (PD).
  • An optical path changer comprising: a light reflecting film set toward the optical element to be The light reflecting film is sandwiched between one and the other inclined sections obtained by integrally cutting the optical waveguide on the base substrate and the base substrate obliquely at a specific angle. It is equipped with The one and the other inclined cross sections are formed by processing including a dummy substrate previously laminated on the outer surface of the optical waveguide.
  • (Appendix 2) Laminating a dummy substrate on the base substrate provided with the optical waveguide via the optical waveguide, Forming one and the other cut surface common to the three formed by obliquely cutting the optical waveguide together with the base substrate and the dummy substrate; After forming a light reflecting film between the one and the other cut surface and bringing them into contact with each other before the cut surface is formed, the dummy substrate is removed from the base substrate, In forming the cut surface, an inclination angle of the cut surface is set so that an optical signal propagating in the optical waveguide is reflected and output in a direction opposite to the base substrate. Manufacturing method of optical path changer.
  • Appendix 3 In the method for manufacturing an optical path converter according to Appendix 2, Prior to forming the light reflecting film, the one cut surface is polished and processed.
  • Appendix 4 In the method for manufacturing an optical path converter according to Appendix 3, When laminating the dummy substrate, a temporary adhesive is used, A method of manufacturing an optical path changer, wherein a fixing adhesive is used for the contact bonding after the light reflecting film is formed.
  • Appendix 6 In the method for manufacturing an optical path converter according to appendix 5, A method for manufacturing an optical path changer comprising polishing the surface of the optical waveguide instead of cleaning the surface of the optical waveguide.
  • Appendix 8 In the method of manufacturing an optical path converter according to any one of appendices 2 to 6, A method of manufacturing an optical path changer, characterized in that a wavelength filter that reflects and outputs only an optical signal having a specific wavelength out of the optical signal is formed between the cut surfaces instead of the optical reflection film.
  • the present invention can be applied to an optical communication multiplexer / demultiplexer, an optical transmitter using the same, an optical receiver, and the like.
  • Optical waveguide 3A 30A Lower layer cladding 3B, 30B, 35B Core 3C, 30C Upper layer cladding 5, 5A Dummy substrate 10, 15 Optical path converter 22A Optical path member 22B Adjustment member 23A Optical path conversion member 40, 45, 400 Optical path conversion mirror 41 One cut surface 42 The other cut surface 60 Common cross section 61 Temporary bonding adhesive 62 Fixing adhesive 80, 500 Optical element 501 Light emitting element 502 Light receiving element

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

L'invention vise à proposer un convertisseur de chemin optique qui puisse empêcher un endommagement du guide d'onde optique pendant la fabrication, qui assure une excellente manipulation et qui réduise la perte de couplage dans la communication optique, et à proposer un procédé de fabrication dudit convertisseur de chemin optique. A cet effet, le convertisseur de chemin optique (10) est muni d'un substrat de base (20) sur lequel est stratifié un guide d'onde optique (30), et d'un miroir de conversion de chemin optique (40) qui est interposé sans interstice dans un seul interstice incliné traversant à la fois le guide d'onde optique (30) et le substrat de base (20). La fabrication dudit convertisseur de chemin optique (10) comporte une étape qui consiste à coller un substrat factice au substrat de base (20) à travers le guide d'onde optique (30), à pratiquer une coupe à travers le substrat de base (20), le guide d'onde optique (30) et le substrat factice, à déposer un matériau réfléchissant sur la surface de coupe commune à ces trois éléments, et à mettre le guide d'onde optique (30) et le substrat de base (20) en contact et à les assembler dans l'état précédant la formation de la surface de coupe. Le miroir de conversion de chemin optique (40) forme un angle d'inclinaison tel que le signal optique transmis à travers le guide d'onde optique (30) est réfléchi et émis dans la direction opposée au substrat de base (20). Par ailleurs, la surface du guide d'onde optique (30) est formée pour être lisse et sans irrégularités au point où la surface d'extrémité du miroir de conversion de chemin optique (40) est interposée.
PCT/JP2013/064099 2012-05-22 2013-05-21 Convertisseur de chemin optique et procédé de fabrication dudit convertisseur WO2013176135A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-116140 2012-05-22
JP2012116140 2012-05-22

Publications (1)

Publication Number Publication Date
WO2013176135A1 true WO2013176135A1 (fr) 2013-11-28

Family

ID=49623824

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/064099 WO2013176135A1 (fr) 2012-05-22 2013-05-21 Convertisseur de chemin optique et procédé de fabrication dudit convertisseur

Country Status (1)

Country Link
WO (1) WO2013176135A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5983109A (ja) * 1982-09-29 1984-05-14 シ−メンス・アクチエンゲゼルシヤフト 光導波路分岐器およびマルチ／デマルチプレクサの製造方法
JPH05264870A (ja) * 1992-03-18 1993-10-15 Fujitsu Ltd 光導波路の光入出力部の製造方法及び該光入出力部と光半導体素子の結合構造
JPH1039153A (ja) * 1996-07-24 1998-02-13 Shin Etsu Chem Co Ltd 光導波路の製造方法
JP2002506227A (ja) * 1998-03-06 2002-02-26 テレフオンアクチーボラゲツト エル エム エリクソン（パブル） ポリマ導波管に鏡を製造する方法
JP2003156645A (ja) * 2001-11-20 2003-05-30 Matsushita Electric Ind Co Ltd 光電子部品の製造方法
JP2006039231A (ja) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd 光電気配線混載基板の製造方法
JP2008158221A (ja) * 2006-12-22 2008-07-10 Matsushita Electric Works Ltd 光電複合基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5983109A (ja) * 1982-09-29 1984-05-14 シ−メンス・アクチエンゲゼルシヤフト 光導波路分岐器およびマルチ／デマルチプレクサの製造方法
JPH05264870A (ja) * 1992-03-18 1993-10-15 Fujitsu Ltd 光導波路の光入出力部の製造方法及び該光入出力部と光半導体素子の結合構造
JPH1039153A (ja) * 1996-07-24 1998-02-13 Shin Etsu Chem Co Ltd 光導波路の製造方法
JP2002506227A (ja) * 1998-03-06 2002-02-26 テレフオンアクチーボラゲツト エル エム エリクソン（パブル） ポリマ導波管に鏡を製造する方法
JP2003156645A (ja) * 2001-11-20 2003-05-30 Matsushita Electric Ind Co Ltd 光電子部品の製造方法
JP2006039231A (ja) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd 光電気配線混載基板の製造方法
JP2008158221A (ja) * 2006-12-22 2008-07-10 Matsushita Electric Works Ltd 光電複合基板の製造方法

Similar Documents

Publication Publication Date Title
KR100713498B1 (ko) 광도파로 장치 및 광도파로 장치의 제조 방법
JP5109982B2 (ja) ミラー付き光伝送体の製造方法
US8639073B2 (en) Fiber coupling technique on a waveguide
WO2011049087A1 (fr) Substrat de guide d'ondes optique ayant une structure de positionnement, son procédé de fabrication et procédé de fabrication d'un substrat hybride opto-électrique
JP2006209068A (ja) 光導波路、光導波路モジュール及び光導波路モジュールの製造方法
JP6228064B2 (ja) 光モジュール
JP2012132971A (ja) ２層光導波路及びその製造方法
JP2006171173A (ja) 光モジュール及びその製造方法
WO2013176135A1 (fr) Convertisseur de chemin optique et procédé de fabrication dudit convertisseur
JP2000131543A (ja) 光送受信モジュール及びその製造方法
JP5039523B2 (ja) 光導波回路チップ
WO2016147300A1 (fr) Guide d'ondes optiques, son procédé de fabrication et dispositif optique utilisant ledit guide d'ondes optiques
JPH10300956A (ja) 光分岐導波路および光導波路回路
JP2006039255A (ja) 光結合装置及びその製造方法
JP2012058683A (ja) フィルム光導波路及びその製造方法
JP2016001286A (ja) 光ファイバ接続部品
JP2004177882A (ja) 光導波路装置
JP2006251046A (ja) 光導波路基板、光表面実装導波路素子およびそれらの製造方法
CN115980935B (zh) 一种光电复合电路板及其制作方法
JP7185165B2 (ja) 光導波路チップ
WO2023084610A1 (fr) Module optique et son procédé de production
JP2006184758A (ja) 光導波路及び光導波路モジュール
JP2010060653A (ja) 光デバイスおよび光信号選択方法
JP2003287637A (ja) 光導波路付きプリント基板及びその製造方法
JP2004046020A (ja) 光導波路及び光導波路装置の製造方法、光導波路装置及び光導波路、並びに光導波路装置を用いた光通信用装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13793068

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13793068

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载