WO2013167569A1

WO2013167569A1 - Apparatus for moulding a housing structure for a plurality of electronic components, and a housing structure of this kind for a plurality of electronic components

Info

Publication number: WO2013167569A1
Application number: PCT/EP2013/059450
Authority: WO
Inventors: Markus Boss; Tobias Gebuhr
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2012-05-09
Filing date: 2013-05-07
Publication date: 2013-11-14
Also published as: DE102012207678A1

Abstract

The invention discloses an apparatus for moulding a housing structure for a plurality of electronic components, and a housing structure for a plurality of electronic components. An apparatus for moulding a housing structure for a plurality of electronic components (7), wherein the apparatus has: a cavity plate (15) which is moulded in such a way that a respective housing frame (5) is formed during moulding for each electronic component (7), wherein the cavity plate (15) has at least one opening (14) for feeding a moulding composition (2); and a distributor structure (9) which is moulded in such a way that, during moulding, the moulding composition (2) is routed to at least one injection point by means of at least one feed channel (16), wherein the at least one injection point (8) is oriented to the at least one opening (14) in the cavity plate (15).

Description

Besehreibung

DEVICE FOR FORMING A HOUSING STRUCTURE FOR A MULTIPLE OF ELECTRONIC COMPONENTS AND SUCH A HOUSING STRUCTURE FOR A MULTIPLE OF ELECTRONIC COMPONENTS

The invention relates to an apparatus for molding a housing structure for a plurality of electronic

Components and a housing structure for a plurality of 10 electronic components.

Components can be produced by means of a matrix-field-housing-molding process (MAP molding, matrix array packaging molding), which is based on FIG. 1 and FIG

15 Figure 2 is described. FIG. 1 shows a plan view of a housing structure for components 7, which are arranged in matrix form in a component field. FIG. 2 shows a

Cross section through two adjacent components 7. A

Molding compound 2 is applied to a support frame

20 frame) 1 applied. The application of the molding compound 2 can

thereby by an injection molding process (English: injection molding) or a transfer molding process (English: transfer molding) done. The molding compound 2 has arranged in a first direction X and a second direction Y.

25 recesses 3 for components 18. Components 7, which are adjacent in the first direction X and the second direction Y, initially share a common housing wall. Of the

Support frame 1 is generally made of metal and has receiving structures 11 for the components 18 and

30 connection structures 6 on. The connection structures 6

connect the receiving structures 11 in the first direction X and the second direction Y. Subsequently, the components 7 must be removed by means of separation processes, such as sawing, punching or lasing, along the

Dividing lines 4, on the common housing walls

run, be isolated. These separation processes are complex because, as shown in FIG. 2, the different materials of the molding compound 2 and of the carrier frame 1

have to be severed. If only one cutting tool is used for both materials, the result is a high one

Wear of the cutting tool. The use of

Different cutting tools, which are optimal for the different materials, is time consuming.

The object of the invention is therefore to reduce the costs and time for separation processes.

The invention achieves this object by a device for forming a housing structure for a plurality of

electronic device, the device comprising: a cavity plate shaped such that when

Shapes for each electronic component a respective one

Housing frame is formed, wherein the cavity plate has at least one opening for supplying molding material; and a manifold structure shaped such that, during molding, the molding compound is directed to at least one injection point by at least one feed channel, the at least one injection point being aligned with the at least one aperture of the cavity plate.

By the device for molding the package structure, a plurality of packages for electronic components can be formed simultaneously. The cavity plate contains cavities, that is, recesses for the electronic components. The cavity plate is further configured that each electronic component receives its own housing frame, wherein the housing frame surrounds the electronic component. The case frames are over openings in the

Cavity plate filled with molding compound. The molding compound is guided via feed channels of the distributor structure to injection points which are aligned at the openings. Since each electronic component has its own housing frame, the dividing lines between the components are largely free of molding compound. To separate the components, it is thus no longer necessary to cut through common housing walls between adjacent components. The effort to

Separating the components is thus greatly reduced.

Advantageously, the housing frames are arranged in a first direction and a second direction.

The arrangement in the first direction and the second direction can process steps, such as

Assembly processes or separation processes to apply more effectively to the components.

Advantageously, the distributor structure has a respective injection point for each housing frame. Since each housing frame has its own injection point, the distribution paths for the molding compound can be minimized and no complicated distribution structures for the molding compound between the components necessary. The

Dividing lines between the components can thus be completely kept free of molding compound or distributor structures. It must be separated to singulate only the connection structures of the support frame. These can be, for example, by a punching step, an etching step, a sawing step or be severed by lasers. The separation processes can thus be optimized for the material of the connection structures of the support frame. In an advantageous manner, the distributor structure has a respective common one for every four components

Injection point, wherein the common injection point

between the respective four components. Pooling multiple injection points from multiple components to a common injection point simplifies the manifold structure because the number of channels required in the mold can be reduced. Advantageously, the distributor structure has a

Injection point on a first component and has manifolds between the components, which are arranged such that the molding compound is forwarded during molding of a component to an adjacent component.

Advantageously, a distributor is heated to the injection point.

Heated distributors (English: hot runner) make it possible to save on molding compound, as the sprue throw can be reduced and the production cycles shortened.

Advantageously, the device further comprises a support for holding a support frame, wherein the

Support frame is set up for receiving and connecting the electronic components. Advantageously, the support frame

Connection structures that extend in the first direction and the second direction.

Advantageously, the distributor and the connection structures do not intersect.

Because the manifold and interconnect structures do not intersect, parting lines between the components have either material of the manifold or interconnect structures of the support frame. For each material can thus without

Considering the other material of each optimal separation process can be used.

Advantageously, the arrangement comprises a plate on which a sealing film is arranged, wherein the support frame is arranged on the sealing film.

The sealing film prevents mold from flowing out between the support frame and the plate during molding. The sealing film may be an elastic layer.

The invention further provides a housing structure for a plurality of electronic components, wherein the

Housing structure comprising: a support frame, the one

A plurality of receiving structures, each configured to receive at least one electronic component, and a plurality of interconnect structures, the interconnect structures mechanically interconnecting a plurality of susceptor structures; and a molding compound frame having a plurality of recesses formed on the

Receiving structures are formed, for receiving the electronic components and wherein the molding compound frame Forming compound is formed, wherein at least a part of a

Area between two adjacent receiving structures is free of molding material of the molding material frame.

Because at least part of the area is between two

adjacent receiving structures free of molding material of the

Molding compound frame, can be the electronic

Separate components more easily. In particular, the entire area between two adjacent receiving structures may be free of molding compound, so that only the connecting structures have to be separated for the separation. If only part of the area between the adjacent

Receiving structures of molding material is free, so there is less effort when separating as if adjacent components share a common housing wall, since less material must be severed.

Advantageously, the molding compound in the region between two adjacent receiving structures more

Openings in the area of the connection structures

The further recesses in the area of

Connection structures serve to accommodate burrs that arise during a separation process, for example a stamping process, during the severing of the connection structures.

Embodiments of the invention are illustrated in the figures and are explained in more detail below.

Show it:

FIG. 1 shows a matrix-field-housing molding process

produced component field from the prior art; FIG. 2 shows a cross-section through a prior art component field produced by means of a matrix-field-housing molding method;

FIG. 3 shows a first exemplary embodiment of a housing structure;

Figure 4 shows a first cross section through a

Embodiment of an apparatus for molding a housing structure;

Figure 5 shows a second cross section through a

Embodiment of an apparatus for molding a housing structure;

6 shows a second embodiment of a

Case structure;

Figure 7 shows a third embodiment of a

Housing structure;

8 shows a cross section through a first

Embodiment of a housing frame; 9 shows a cross section through a second

Embodiment of a housing frame.

In the following detailed description, reference is made to the accompanying drawings, which are part of this

In the description, specific embodiments are shown in which the invention may be practiced. In this regard will

Directional terminology such as "top", "bottom", "front", "Back", "front", "rear", etc. with respect to the orientation of the figure (s) described

Components of embodiments in number

different orientations can be positioned, the directional terminology is illustrative and is in no way limiting. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various exemplary embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be construed in a limiting sense, and the

Scope of the present invention is defined by the appended claims.

In the context of this description, the terms

"connected", "connected" and "coupled" used to describe both a direct and indirect connection, a direct or indirect connection and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.

FIG. 3 shows a plan view of a first one

Embodiment of a housing structure for a plurality of electronic components 7. To get a better overview, a section of a component field with four components 7 is shown. However, the housing structure may also be designed for more or fewer than four components. The

Components 7 may extend in the first direction X and in the second direction Y. The component 18 in the component 7 may be an electronic component, in particular an opto-electrical component. It may be a light-emitting component, in particular a light-emitting diode (English: light emitting diode, LED). In addition, a device for protection against damage by electrostatic

Discharge (English: electrostatic discharge, ESD) be provided. The device 18 may also include electronics, such as a driver IC. After loading and connecting the components 18, the recesses 3 can be filled with a potting compound. The potting compound may be transparent to visible or infrared radiation so that the visible or infrared radiation from the device 18 may be received or transmitted.

The housing structure can be produced by means of a matrix-field housing molding process (MAP molding, matrix array packaging molding). A molding compound 2 is applied to a support frame (lead frame) 1. The support frame 1 will be described in more detail in connection with Figures 4 and 5. The application of the molding compound 2 can by injection molding (English: injection molding) with a pressure of 1000 to 1800 bar or by transfer molding (English: transfer molding) with a pressure of 60 to 130 bar

respectively. The molding composition may be a thermosetting or a thermoplastic molding compositions.

The molding compound 2 can be structured by a cavity plate 15, which is described in more detail in connection with Figures 4 and 5, to form a molding compound frame, so that the housing structure along the first direction X and the second direction Y arranged housing frame 5 for components 18th having. Each housing frame 5 has a recess 3, in which a component 18 can be arranged. Everyone Case frame 5 has its own injection point 8 (English: gate). The entire area 20 between the housing frame 5 can thus be kept free in the first direction X and the second direction Y of molding compound 2. In order to separate the components 7, only the connecting structures 6

be separated. The separation step may be, for example, a punching step or a sawing step. Lying the

Connection structures 6 on the back of the component 7 free, that is, that they are not covered with molding compound 2, you can also with the help of a laser or a

Etching process to be separated. When singling it is not necessary to separate molding compound 2, so that the

Separation process can be optimized for the material of the connection structures 6.

FIG. 4 shows a first cross section through an apparatus for forming a housing structure. The cut can be guided along the lines "A-A" through the first exemplary embodiment of the housing structure shown in FIG. Two components 7 are shown later along the

Dividing line 4 are separated. On a plate 12, a sealing film 10 can be arranged. On the sealing film 10, a support frame 1 can be arranged. The support frame 1 can receive structures 11 for components 18 and

Have connecting structures 6. The connecting structures 6 connect the receiving structures 11 in the first direction X and the second direction Y of adjacent components 7. The carrier frame 1 is used inter alia for electrical

Contacting the components 18 and is usually made of copper. A cavity plate 15 rests on the

Carrier frame 1 from. The cavity plate 15 is such

designed that for each electronic component 7 a

Case frame 5 is formed. The cut leads through two side walls of a housing frame 5, which are shown non-hatched. The molding compound 2 will fill the non-hatched area after application or injection. The sealing film 10 may be made elastic and is used in molding for sealing the plate 12, the

Cavity plate 15 and the support frame 1 relative to the molding compound 2. On the cavity plate 15 is a

Distributor structure 9 arranged to supply the

Molding 2 to the cavity plate 15 is used. The

Distributor structure 9 will be further described in connection with FIG. As FIG. 4 shows, with separation of the components 7 there is no molding compound 2 along the parting line 4. Only the connecting structures 6 of the

Support frame 1 are severed.

FIG. 5 shows a second cross section through one

Device for molding the housing structure. The cut can be guided along the lines "B-B" through the first exemplary embodiment of the housing structure shown in FIG. Except for the following differences apply

Embodiments to Figure 4 also for Figure 5. The section shows of the support frame 1, only the receiving structures 11, since the connection structures 6 are tapered with respect to the receiving structures 11. The cavity plate 15 is therefore supported directly on the sealing film 10. The cut leads through in each case one side wall of the respective housing frame 5, wherein the molding compound 2 after application or injection will fill out the region not shown hatched. The distributor structure 9 may be formed as a plate and has supply channels 16 which lead to the injection points 8 of the distributor structure 9. The injection points 8 are aligned with respective openings 14 of the cavity plate 15. Since each component 7 has its own injection point 8, are not filled with molding compound 2 distributor in the

Area 20 between the components 7 and between

Receiving structures 11 or housing frame 5 along the

Dividing lines 4.

FIG. 6 shows a plan view of a second one

Embodiment of a housing structure for a plurality of electronic components 7. The housing structure

corresponds to that of Figure 3, so that the description of Figure 3 applies to the following deviations on Figure 6. In contrast to FIG. 3, not every housing frame 5 in FIG. 6 has its own injection point 8. Rather, a single injection point 8 can be provided for the frame housing 5 by four components 7 each. The injection point 8 can be located centrally between the four components 7. The distributor structure 9 therefore has a smaller number of supply channels 16, so that it can be simplified. The distributor to the injection points 8 can be heated (English: hot runner). The injection point 8 lies in a part of the region 20, so that it is not completely free of molding compound 2. When singling are therefore two

Steps necessary, one for the connection structures 6 of the support frame 1 and one for the molding compound 2 in the

Injection point 8. However, since a large part of the area 20 between adjacent receiving structures 11, or between the housing frame 5 and the components 7 is free of molding compound 2, costs and time for the separation process of the components 7 can be reduced. Figure 7 shows a plan view of a third

corresponds to that of Figure 6, so that the description of Figure 6 applies to the following deviations on Figure 7. In contrast to Figure 6, the molding material 2 in Figure 7 does not have a central distributor the

Housing frame 5 of the four components 7 supplied. The molding compound 2 is supplied in FIG. 7 to a first component, in this case the upper left, via a distributor 17. At the

Applying or injecting fills the molding compound 2 the

Case frame 5 of the first component and then flows through a further distributor 17 to an adjacent component 7. There, it fills the housing frame 5 of this

Component 7 and then flows to the next adjacent

Component 7. The molding compound 2 flows through all the components 7 and manifold 17 along the X direction to the right until it reaches a last component. In time and space parallel to the distribution of the molding compound 2 from the first component to the last component, the molding compound 2 can also be distributed along the X direction from left to right in further rows of components 7. The distributor 17 lies in the X direction in a part of the region 20 between the housing frame 5, so that it is not completely free of molding compound 2. When singling therefore two steps are necessary, one for the connecting structures 6 of the support frame 1 and one for the molding compound 2 in the manifold 17. However, since a large part of the area 20 between the housing frame 5 of the components 7 is free of molding compound 2, can be Reduce costs and time for the separation process of the components 7. The distributor 17 may also be in the Y direction instead of in the X direction. In FIGS. 3, 6 and 7, the connecting structures 6 of the carrier frame 1 extend both in the X direction and in the Y direction. However, the connecting structures 6 run only in one of the directions, so eliminates the separation process

Connection structures 6 in the other direction.

In Figure 6 or 7, the receiving structures 11 may be connected by the connecting structures 6 only in the Y direction and the distributor for the molding compound 2 between the

Body frame 5 only in the X direction. There is thus only one kind of material in the X-direction, here the plastic of the molding compound 2, and only one kind of material in the Y-direction, here the metal of the connection structures 6. Each material can then be separated with the optimal separation process become.

FIG. 8 shows a cross section through a first

Embodiment of a housing frame 5 of a component 7. A housing frame 5 may be formed on a receiving structure 11 of a support frame 1 with molding compound 2. The

Receiving structure 11 can be made in two parts and the

Connection of a arranged in the housing frame 5

Component 18 serve. In the X direction to the left and to the right of the housing frame 5, residues of connecting structures 6 can be seen, which have remained after a separation process, for example a punching process. The remains of the

Connection structures 6 can be used in handling the

Disturb component. The same applies to remnants of

Connecting structures 6, which extend in the Y direction.

FIG. 9 shows a cross section through a second one

Embodiment of a housing frame 5 of a component 7. The second embodiment corresponds to the first

Embodiment of Figure 8, so that the description of Figure 8 applies to the following deviations on Figure 9. So that the remainders of the connection structures 6 after Do not disturb the separation process, a further recess 19 in the molding compound 2 of the housing frame 5 is provided. The further recess 19 is located in the region of

Connection structures 6 and is dimensioned so that the connection structures 6 can be separated even closer to the center of the component 7. The remains of the

Connection structures 6, which then remain after the separation process, for example a punching process, find space in the further recess 19, so that they do not project beyond the housing frame 5. The further recesses 19 can also be provided in the Y direction, if

Connecting structures 6 extend in the Y direction. In a soldering of the component 7, for example by means of a reflow soldering, the connecting structures 6 are wetted. If solder is visible on the sides of the component 7, the soldering process was successful. If no solder is visible, the soldering process should be checked.

LIST OF REFERENCE NUMBERS

1 support frame

2 molding material

3 recess

4 dividing line

5 case frame

6 connection structure

7 component

8 Ansprit point

9 distribution structure

10 sealing film

11 Aufnähmestruktur

12 plate

13 molding compound frame

14 opening

15 cavity plate

16 feed channel

17 distributors

18 component

19 more recesses

20 area

X first direction

Y second direction

Claims

claims

A device for molding a housing structure for a plurality of electronic components (7), wherein the

Device comprising:

- A cavity plate (15) which is shaped so that when molding for each electronic component (7) a

respective housing frame (5) is formed, wherein the

Cavity plate (15) at least one opening (14) for

Supplying molding compound (2); and

- A distribution structure (9) which is shaped such that during molding, the molding compound (2) by means of at least one

Feed channel (16) is guided to at least one injection point (8), wherein the at least one injection point (8) on the at least one opening (14) of the cavity plate (15) is aligned.

2. Device according to claim 1, wherein

the housing frames (5) are arranged in a first direction (X) and a second direction (Y).

3. A device according to claim 1 or 2, wherein

the distributor structure (9) has a respective injection point (8) for each component (7).

4. Device according to one of claims 1 to 3, wherein the distributor structure (9) for each four components (7) has a respective common injection point (8), wherein the common injection point (8) between the respective four components (7).

5. Device according to one of claims 1 to 4, wherein the distributor structure (9) has an injection point (8) on a first component (7) and distributor (17) between the components (7), which are arranged such that the Mold compound (2) is forwarded in the molding of a component (7) to an adjacent component (7).

6. Apparatus according to claim 5, wherein

a distributor is heated to the injection point (8).

7. The device according to one of claims 1 to 6, further comprising

a support for holding a support frame (1), wherein the support frame (1) is arranged to receive and

Connecting electronic components (18).

8. Apparatus according to claim 7, wherein

the support frame (1) has connecting structures (6) extending in the first direction (X) and the second direction (Y).

9. Apparatus according to claim 8, wherein

the distributor (17) and the connection structures (6) do not intersect.

10. The device according to one of claims 7 to 9, further comprising:

a plate (12) on which a sealing film (10) is arranged, wherein the support frame (1) is arranged on the sealing film (10).

11. Housing structure for a plurality of electronic components (7), wherein the housing structure comprises:

- A support frame (1) having a plurality of

Receiving structures (11), each for receiving at least one electronic component (18) are formed, and a plurality of connecting structures (6), wherein the connecting structures (6) more

Mechanically connect receiving structures (11) with each other; and

- A molding compound frame (13), with a plurality of

Recesses (3) formed on the receiving structures (11) for receiving the electronic

Components (18) and wherein the molding compound frame (13) of molding compound (2) is formed;

- Wherein at least a portion of a region (20) between two adjacent receiving structures (11) is free of molding compound (2) of the molding compound frame (13).

12. Housing structure according to claim 11, wherein

the molding compound (2) in the region (20) between two adjacent receiving structures (11) has further recesses (19) in the region of the connecting structures (6).