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WO2013035717A1 - Module et procédé de fabrication associé - Google Patents

Module et procédé de fabrication associé Download PDF

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Publication number
WO2013035717A1
WO2013035717A1 PCT/JP2012/072552 JP2012072552W WO2013035717A1 WO 2013035717 A1 WO2013035717 A1 WO 2013035717A1 JP 2012072552 W JP2012072552 W JP 2012072552W WO 2013035717 A1 WO2013035717 A1 WO 2013035717A1
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WO
WIPO (PCT)
Prior art keywords
connection terminal
wiring board
connection
module
terminal
Prior art date
Application number
PCT/JP2012/072552
Other languages
English (en)
Japanese (ja)
Inventor
伸明 小川
陽一 高木
水白　雅章
福田　寛
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2013035717A1 publication Critical patent/WO2013035717A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer

Definitions

  • the present invention relates to a module using a plurality of connection terminals forming an interlayer connection conductor and a method for manufacturing the module.
  • a module 500 in which various electronic components 502 mounted on both surfaces of a wiring board 501 are sealed with a resin layer 503 is known (for example, Patent Documents). 1). Further, a metal shield layer 504 is provided on one main surface of the module 500, and a mounting terminal 505 for external connection is provided on the other main surface. The metal shield layer 504 and the mounting terminal 505 are electrically connected to the wiring layer of the wiring board 501 through interlayer connection via conductors 506, respectively.
  • the via conductor 506 is filled with a conductor paste containing Ag, Cu, or the like after a desmear treatment is performed on a via hole formed by laser processing on the resin layer 503 provided on the wiring substrate 501 or via fill plating is performed. Is formed.
  • a via hole is formed in the resin layer 503 using laser processing, there is a problem that laser output adjustment is complicated and variations in the formation accuracy of the via hole occur.
  • the via conductor 506 is formed in the resin layer 503 through a plurality of steps, it causes an increase in the manufacturing cost of the module and hinders a reduction in the manufacturing time of the module.
  • a terminal assembly 600 in which a plurality of columnar connection terminals 601 forming an interlayer connection conductor are integrally formed with a coupling body 602 is formed by using a normal surface mounting technique. Attempts have been made to reduce the manufacturing cost of the module and reduce the manufacturing time of the module by mounting it on 501 and forming the interlayer connection conductor of the module by the connection terminal 601 instead of the via conductor 506 ( For example, see Patent Document 2).
  • FIG. 14 shows an example of a conventional terminal assembly.
  • JP 2008-16729 A paragraphs 0015 to 0017, FIG. 4, etc.
  • the terminal assembly 600 shown in FIG. 14 includes a plurality of columnar connection terminals 601 and a connection body 602 that connects the connection terminals 601 by etching, cutting, or pressing a material made of Cu. Are manufactured integrally.
  • the connection terminal 601 is integrally formed with the connecting body 602 by etching, the progress of the etching differs between the base portion and the tip portion of the connection terminal 601, so that the shape of each connection terminal 601 varies.
  • the terminal assembly 600 is mounted on the wiring substrate 501 formed of LTCC or a printed circuit board and sealed with a resin layer, the terminal assembly 600 is exposed until the tip of the connection terminal 601 is exposed on the surface of the resin layer.
  • the connecting layer 602 of the module is formed by the connection terminals 601 by grinding and polishing the resin layer for sealing the body 600 and the connection body 602 of the terminal assembly 600 and removing the connection body 602 from the terminal assembly 600. Is done.
  • the terminal for external connection of a module is formed of the front end surface of the connection terminal 601 exposed on the surface of the resin layer.
  • connection terminal 601 since Cu forming the connection terminal 601 is highly ductile and easily stretched, each connection terminal 601 exposed on the surface of the resin layer when the connecting body 602 is removed from the terminal assembly 600 by grinding or polishing. A flash is likely to be formed at the tip portion of the. Therefore, the tip of each connection terminal 601 is exposed on the surface of the resin layer and functions as a terminal for external connection of the module. However, a flash is formed at the tip of the connection terminal 601, so that Each connection terminal 601 may be short-circuited. Therefore, there is a possibility that a flash is formed at the tip of the connection terminal 601.
  • connection terminals 601 mounted on the wiring board 501 must be increased, and the plurality of connection terminals 601 are connected to the wiring board 501.
  • the distance between the terminals of each connection terminal 601 (interlayer connection conductor) is shortened, which hinders miniaturization of the module.
  • the magnitude of the linear expansion coefficient (about 17 ppm / ° C.) of Cu forming the connection terminal 601 is compared with the magnitude of the linear expansion coefficient of the ceramic material forming the wiring substrate 501 or the resin material of the FR-4 standard, for example. And very big. Therefore, in a module in which an interlayer connection conductor is formed by the connection terminal 601 made of Cu, the stress generated between the wiring board 501 and the connection terminal 601 is caused by thermal expansion of the wiring board 501 and the connection terminal 601 when heated. The connection portion between the wiring board 501 and the connection terminal 601 is likely to be damaged, resulting in a decrease in module reliability.
  • the present invention has been made in view of the above-described problems, and provides a highly reliable module by forming an interlayer connection conductor by mounting columnar connection terminals formed of a Cu-Fe alloy on a wiring board.
  • the purpose is to do.
  • the module of the present invention is a module in which an electronic component is mounted on at least one main surface of a wiring board, and is formed in a columnar shape that is mounted on one main surface of the wiring board to form an interlayer connection conductor. And a first resin layer provided so as to cover the electronic component and the connection terminal on one main surface of the wiring board, the connection terminal being formed of a Cu—Fe alloy, An end portion is connected to the wiring board (claim 1).
  • connection terminal is mounted by bonding the other end to a land electrode formed on the wiring board with a conductive bonding material, and the conductive bonding material includes an end surface of the other end and It is preferable that the outer peripheral surface be formed in a bowl shape (claim 2).
  • connection terminal is formed such that the diameter of the other end is larger than the diameter of the one end.
  • connection terminal may be formed such that a diameter of the one end is larger than a diameter of the other end (Claim 4).
  • an electronic component is further mounted on the other main surface of the wiring board (Claim 5).
  • the second main surface of the wiring board may further include a second resin layer provided so as to cover an electronic component (Claim 6).
  • connection terminal is further mounted on the other main surface of the wiring board, and an electronic component is further mounted on the second resin layer so as to be connected to the connection terminal mounted on the other main surface. (Claim 7).
  • the module manufacturing method of the present invention is a module manufacturing method in which a columnar connection terminal and an electronic component for forming an interlayer connection conductor are mounted on a wiring board and sealed with a resin.
  • a preparation step of preparing the connection terminal, and mounting the connection terminal so that an electronic component is mounted on one main surface of the wiring board and the other end of the connection terminal is connected to the wiring board.
  • the other end of the columnar connection terminal that is mounted together with the electronic component on one main surface of the wiring board and forms the interlayer connection conductor is connected to the wiring board.
  • the connection terminal is formed of a Cu—Fe alloy.
  • Fe having a linear expansion coefficient of about 12 ppm / ° C. is added to Cu having a linear expansion coefficient of about 17 ppm / ° C.
  • the linear expansion coefficient of the interlayer connection conductor formed by the connection terminal made of a Cu—Fe alloy is lower than that of Cu, and the wiring board formed of a ceramic material or a resin material of FR-4 standard The difference from the linear expansion coefficient can be reduced. Therefore, the columnar connection terminals formed of Cu—Fe alloy are mounted on the wiring board to form the interlayer connection conductor, so that the wiring board and the connection terminals are thermally expanded when heated, thereby being connected to the wiring board. Since the stress generated between the terminal and the terminal can be suppressed, for example, the connection portion between the wiring board and the connection terminal can be prevented from being damaged, and a highly reliable module can be provided.
  • connection terminal has, for example, a predetermined diameter and a cross-sectional shape, and is formed with a desired diameter and length by cutting a wire material made of a Cu—Fe alloy with a predetermined length.
  • the Cu—Fe alloy has higher hardness than Cu by adding Fe to Cu, and is excellent in machinability and grindability. Therefore, when the connection terminal is formed by cutting the wire, The formation of flash at the cut end is suppressed. Therefore, even if a plurality of connection terminals are mounted close to each other on the wiring board, each connection terminal can be prevented from being short-circuited by the flash formed at the cut end, so that each connection terminal can reduce the distance between the terminals.
  • a module that is reduced in size by being contracted and mounted on a wiring board can be provided.
  • connection terminal is mounted by being bonded to the land electrode formed at the other end on the wiring board by the conductive bonding material.
  • the end surface and the outer peripheral surface of the other end portion are formed in a bowl shape. Accordingly, since the conductive bonding material spreading like a bowl on the outside of the other end of the connection terminal is caught by the first resin layer, the connection terminal can be prevented from falling off from the first resin layer.
  • connection terminal is formed in a wedge shape in the first resin layer such that the diameter of the other end connected to the wiring board is larger than the diameter of the one end. Since the large-diameter portion of the other end of the connection terminal connected to the wiring board is caught by the first resin layer, it is possible to reliably prevent the connection terminal from falling off the first resin layer.
  • the connecting terminal is formed on the surface of the first resin layer so that the diameter of one end part forming the terminal for external connection is larger than the diameter of the other end part. Therefore, a large area terminal for external connection can be formed on the surface of the first resin layer. Therefore, electrical connectivity and bonding strength when the module is mounted on a mother board or the like can be improved.
  • the external connection terminal and the interlayer connection conductor having a large area are integrally formed by the connection terminal, one end of the connection terminal exposed on the surface of the first resin layer is large by screen printing or photolithography. Compared with a configuration in which a terminal for external connection having an area is formed, the connection strength between the terminal for external connection and the interlayer connection conductor can be improved.
  • the second resin layer is provided by covering the other main surface of the wiring board with the electronic component, the electronic component mounted on the other main surface of the wiring board is replaced with the second resin layer. Can be protected.
  • connection terminal is further mounted on the other main surface of the wiring board, and the electronic component is connected to the second resin layer so as to be connected to the connection terminal mounted on the other main surface. Further, by mounting, it is possible to provide a practical module in which the mounting density of electronic components is further increased.
  • connection terminal formed of a Cu—Fe alloy is prepared.
  • the connection terminal has, for example, a predetermined diameter and a cross-sectional shape, and a wire made of a Cu—Fe alloy is predetermined.
  • the Cu—Fe alloy has higher hardness than Cu by adding Fe to Cu, and is excellent in machinability and grindability. Therefore, when the connection terminal is formed by cutting the wire, Since it is suppressed that the flash is formed at the cut end, it is possible to prepare a columnar connection terminal having a very high precision shape.
  • connection terminals are sealed with the first resin layer. Then, by polishing or grinding one end of the first resin layer and the connection terminal, one end of the connection terminal is exposed on the surface of the first resin layer, but the Cu—Fe alloy forming the connection terminal is Since the hardness is high and the machinability and grindability are excellent, it is possible to suppress the formation of flash at one end of the connection terminal when the one end is polished or ground.
  • each connection terminal is exposed on the surface of the first resin layer and functions as a terminal for external connection of the module, but is formed on one end of the connection terminal exposed on the surface of the first resin layer. Since each connection terminal is prevented from being short-circuited by the emitted flash, a column-shaped connection terminal formed of a Cu—Fe alloy is mounted on a wiring board to form an interlayer connection conductor, thereby providing a highly reliable module Can be provided.
  • the Cu—Fe alloy forming the connection terminal has a lower linear expansion coefficient than Cu, and the linear expansion coefficient of the interlayer connection conductor formed by the connection terminal made of the Cu—Fe alloy, and the linear expansion coefficient of the wiring board Can be reduced. Therefore, the columnar connection terminals formed of Cu—Fe alloy are mounted on the wiring board to form the interlayer connection conductor, so that the wiring board and the connection terminals are thermally expanded when heated, thereby being connected to the wiring board. Since the stress generated between the terminal and the terminal can be suppressed, for example, the connection portion between the wiring board and the connection terminal can be prevented from being damaged, and a highly reliable module can be provided.
  • connection terminal is formed of a Cu—Fe alloy, it is possible to suppress the formation of a flash at one end of the connection terminal in the polishing or grinding process. Since short-circuiting is prevented, the distance between the multiple connection terminals mounted on the wiring board can be reduced, and each connection terminal is mounted close to the wiring board and the distance between the terminals is reduced. Thus, a module with a reduced size can be provided.
  • FIG. 1 is a diagram showing a terminal assembly used in a module according to the first embodiment of the present invention.
  • FIG. 2 is a bottom view of the terminal assembly used in the module according to the first embodiment of the present invention.
  • FIG. 3 is a diagram showing a module manufacturing method according to the first embodiment of the present invention, and (a) to (d) show different processes.
  • FIG. 4 is an enlarged view of a main part of the module according to the first embodiment of the present invention.
  • Bluetooth (registered trademark) is mounted on a mother board of a communication portable terminal by mounting various electronic components 102 on at least one main surface of the wiring board 101.
  • Various communication modules such as modules and wireless LAN modules, high-frequency circuit modules such as antenna switch modules and power supply modules are manufactured.
  • a terminal assembly 10 that includes a plurality of columnar connection terminals 11 that form interlayer connection conductors of the module 100 shown in FIG. As shown in FIG. 1 and FIG. 2, the terminal assembly 10 includes a columnar connection terminal 11 and a plate-like support 12 that form an interlayer connection conductor of the module 100 by being mounted on a wiring board 101.
  • the connection terminal 11 is supported at a predetermined position on one surface of the support 12 via a support layer 13.
  • connection terminal 11 is formed of a Cu—Fe alloy in which Fe is added to Cu at a ratio of 0.1% to 20%.
  • connection terminal 11 by forming the connection terminal 11 from a Cu—Fe alloy in which Fe is mixed with Cu and the hardness is increased, it is possible to suppress the occurrence of flash or the like when the connection terminal 11 is cut, ground, polished, or the like. Therefore, the processing accuracy when the connection terminal 11 is cut, ground, polished, or the like can be improved.
  • connection terminal 11 can be formed as follows, for example. That is, the connection terminal 11 is formed with a predetermined length by shearing a wire made of a Cu—Fe alloy having a predetermined diameter and a circular or polygonal cross-sectional shape with a predetermined length. It is formed in a cylindrical shape or a polygonal column shape.
  • connection terminal 11 While improving the machinability, grindability, and polishing accuracy of the connection terminal 11, the wet state of the conductive bonding material such as solder or metal brazing to the connection terminal 11, or when the connection terminal 11 is plated. In order not to deteriorate the plating state, it is more preferable to employ a Cu—Fe alloy in which 1 to 10% Fe is added to Cu.
  • the material of the plate-like member that forms the support 12 may be any material.
  • the support 12 may be formed of a plate-like member made of a material that does not deform due to heating.
  • the support layer 13 of the support 12 may be formed by applying a liquid adhesive or pressure-sensitive adhesive to one surface of the plate-shaped member, or a sheet-shaped adhesive sheet or pressure-sensitive adhesive sheet may be formed on one side of the plate-shaped member. You may stick to the direction and form. Further, the thickness of the support layer 13 prevents an error from occurring in the height of the connection terminal 11 when the connection terminal 11 is mounted on the wiring substrate 101 of the module 100, and prevents the connection terminal 11 from tilting. In order to achieve this, it is preferable that the support layer 13 is as thin as possible.
  • the adhesive or pressure-sensitive adhesive forming the support layer 13 an epoxy type or acrylic type can be used as the adhesive or pressure-sensitive adhesive forming the support layer 13.
  • the adhesive layer softens when heated to a predetermined temperature or more and hardens when cooled. It is preferable to form the support layer 13 with an adhesive.
  • the terminal assembly 10 in the storage state is in a state where the support layer 13 of the support 12 is cured in the state in which the terminal assembly 10 is stored. It is possible to prevent dust and dirt from adhering to the support layer 13 of the 10 support bodies 12.
  • the terminal aggregates 10 may be individually manufactured so as to correspond to the respective modules 100. However, after forming the aggregates of the plurality of terminal aggregates 10, the individual terminal aggregates 10 are The terminal assembly 10 may be manufactured by dividing into pieces.
  • Module manufacturing method A method of manufacturing the module 100 in which the columnar connection terminals 11 and the electronic components 102 forming the interlayer connection conductor are mounted on the wiring substrate 101 and sealed with resin will be described.
  • a terminal assembly 10 is prepared in which a plurality of columnar connection terminals 11 forming interlayer connection conductors of the module 100 are supported by a support 12 (preparation step). Then, as shown in FIG. 3A, the terminal assembly 10 and various electronic components 102 such as chip components and ICs are solder reflowed and ultrasonic vibration bonded at a predetermined position on one main surface of the wiring board 101. It is mounted by a general surface mounting technique such as (mounting process). The terminal assembly 10 is mounted on the wiring board 101 so that the other end of the connection terminal 11 is connected to the wiring board 101. Further, the connection terminal 11 and the electronic component 102 may be mounted on the wiring board 101 using a conductive adhesive.
  • land electrodes 101 a are provided on one main surface of the wiring board 101 with substantially the same area as the cross-sectional area of the connection terminals 11. Then, the connection terminal 11 is covered with a conductive bonding material S such as solder so that the end surface and the outer peripheral surface of the other end of the connection terminal 11 are spread out on the outside of the mounting electrode 101a. has been implemented.
  • the wiring substrate 101 is a multilayer ceramic substrate formed by laminating and firing a plurality of ceramic green sheets.
  • a ceramic green sheet is a sheet in which a mixed powder of alumina and glass is mixed with an organic binder and solvent.
  • a via hole is formed at a predetermined position of the ceramic green sheet by laser processing or the like. The formed via hole is filled with a conductor paste containing Ag, Cu or the like to form a via conductor for interlayer connection, and various electrode patterns are formed by printing with the conductor paste.
  • the ceramic green sheets are laminated and pressure-bonded to form a ceramic laminate, and the wiring substrate 101 is formed by so-called low-temperature firing at a low temperature of about 1000 ° C.
  • the wiring board 101 is provided with various electrode patterns such as an internal wiring pattern, a mounting electrode on which the terminal assembly 10 and the electronic component 102 are mounted, and an external connection electrode.
  • an internal wiring pattern a mounting electrode on which the terminal assembly 10 and the electronic component 102 are mounted
  • an external connection electrode can be formed of a printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc., using a resin or a polymer material.
  • the wiring board 101 may be formed by selecting an optimal material as appropriate.
  • connection terminal 11 the support 12 of the terminal assembly 10 mounted on one main surface of the wiring board 101 is removed from the connection terminal 11.
  • one end of the connection terminal 11 is supported on the support layer 13 of the support 12 by adhesion or adhesion, and the adhesive force or adhesion of the support layer 13 of the support 12 is reduced.
  • the support 12 is removed from the connection terminal 11.
  • the adhesive strength of the support layer 13 is increased by heating the support layer 13 to a glass transition temperature (Tg) or higher.
  • Tg glass transition temperature
  • the support 12 may be removed from the connection terminal 11 by reducing the adhesive strength.
  • the glass transition of the support layer 13 is prevented so that the solder that joins the terminal assembly 10 and the electronic component 102 to the wiring board 101 does not melt when heating to reduce the adhesive force or adhesive strength of the support layer 13.
  • the temperature is desirably about 200 ° C. or less, which is the melting temperature of the solder.
  • the adhesive force or pressure-sensitive adhesive force of the support layer 13 is reduced by using an alkaline surfactant or ethyl acetate.
  • the support 12 may be removed from the connection terminal 11.
  • the first resin layer 103 is formed of a composite resin formed by mixing an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide with a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. can do.
  • the first resin layer 103 is formed using a resin sheet obtained by molding and semi-curing a composite resin on a PET film, a spacer (mold) having a desired thickness is arranged around After covering the wiring board 101 with a resin sheet and heat-pressing the resin sheet so that the thickness of the resin becomes the thickness of the spacer, the wiring board 101 is heated in an oven to cure the resin.
  • One resin layer 103 can be formed.
  • the first resin layer 103 may be formed using a general molding technique for forming a resin layer, such as a potting technique using a liquid resin, a transfer molding technique, or a compression molding technique.
  • the first resin layer 103 is used.
  • the height of the connection terminal 11 from the wiring board 101 can be made uniform by cutting one end of the connection terminal 11 together. Further, for example, Ni / Au plating may be applied to one end portion of the connection terminal 11 exposed on the surface of the first resin layer 103.
  • the step of polishing or grinding the surface of the first resin layer 103 includes: It does not necessarily have to be executed.
  • the first resin layer 103 may be formed by filling one main surface of the wiring substrate 101 without removing the support 12 of the terminal assembly 10 from the connection terminal 11.
  • the support 12 of the terminal assembly 10 may be removed together with the first resin layer 103 by grinding or polishing.
  • the modules 100 may be manufactured individually. However, after the assembly of a plurality of modules 100 is formed, the modules 100 may be manufactured by dividing them into individual modules 100. . In this case, when mounting the plurality of terminal assemblies 10 on the assembly of the wiring boards 101, the assembly of the terminal assemblies 10 before being separated may be mounted on the assembly of the wiring boards 101. In this way, the time for mounting the terminal assembly 10 on the wiring board 101 can be shortened, so that the manufacturing time of the module 100 can be shortened.
  • the plurality of individual terminal assemblies 10 individually correspond to the individual modules 100 of the assembly of the wiring boards 101. It may be mounted at a position. In this way, the terminal assembly 10 can be mounted on the wiring board 101 with higher positional accuracy than when the terminal assembly 10 is mounted on the wiring board 101.
  • the columnar connection terminal 11 that is mounted together with the electronic component 102 on one main surface of the wiring board 101 and forms an interlayer connection conductor has the other end connected to the wiring board 101.
  • the one end of the connection terminal 11 is exposed on the surface of the first resin layer 103 that covers the electronic component 102 and the connection terminal 11 and is provided on one main surface of the wiring board 101.
  • a terminal (land) for external connection is formed.
  • connection terminal 11 is made of a Cu—Fe alloy, and the Cu—Fe alloy has a coefficient of linear expansion of about 17 ppm / ° C. and a coefficient of linear expansion of about 12 ppm / ° C. lower than that of Cu.
  • the coefficient of linear expansion is lower than that of Cu, and the coefficient of linear expansion of the interlayer connection conductor formed by the connection terminal 11 made of a Cu—Fe alloy and the ceramic material or FR-4 standard resin material are used. The difference from the linear expansion coefficient of the wiring board 101 can be reduced.
  • the columnar connection terminals 11 formed of a Cu—Fe alloy are mounted on the wiring board 101 to form an interlayer connection conductor, whereby the wiring board 101 and the connection terminals 11 are thermally expanded when heated. Since the stress generated between the wiring board 101 and the connection terminal 11 can be suppressed, for example, the connection portion between the wiring board 101 and the connection terminal 11 can be prevented from being damaged, and the highly reliable module 101 can be prevented. Can be provided.
  • connection terminal 11 formed of a Cu—Fe alloy is prepared.
  • the connection terminal 11 has a predetermined diameter and a cross-sectional shape, and a wire made of a Cu—Fe alloy has a predetermined length. By being cut at, it is prepared with a desired diameter and length. Since the Cu—Fe alloy has higher hardness than Cu by adding Fe to Cu and is excellent in machinability and grindability, the connection terminal 11 is formed when the connection material 11 is formed by cutting the wire. Since it is suppressed that a flash is formed at the cut end of 11, the columnar connection terminal 11 having a very high precision shape can be prepared.
  • the electronic component 102 is mounted on one main surface of the wiring board 101 and the connection terminal 11 is mounted so that the other end of the connection terminal 11 is connected to the wiring board 101.
  • the electronic component 102 and the connection terminal 11 mounted on are sealed with the first resin layer 103. Then, by polishing or grinding one end of the first resin layer 103 and the connection terminal 11, the one end of the connection terminal 11 is exposed on the surface of the first resin layer 103, but the connection terminal 11 is formed. Since the Cu—Fe alloy has high hardness and is excellent in machinability and grindability, it is possible to suppress the formation of a flash at one end of the connection terminal 11 when the one end is polished or ground. .
  • each connection terminal 11 is exposed on the surface of the first resin layer 103 and functions as a terminal for external connection of the module 100, but the connection terminal 11 exposed on the surface of the first resin layer 103 is exposed. Since the connection terminals 11 are prevented from being short-circuited by the flash formed at one end, the columnar connection terminals 11 formed of a Cu—Fe alloy are mounted on the wiring substrate 101 to form an interlayer connection conductor. Thus, the module 100 with high reliability can be provided.
  • connection terminal 11 is formed of a Cu—Fe alloy, it is possible to suppress the formation of a flash at one end of the connection terminal 11 in the polishing or grinding process. 11 is prevented from being short-circuited, the distance between the plurality of connection terminals 11 mounted on the wiring board 101 can be reduced, and each connection terminal 11 is mounted close to the wiring board 101 and mounted between the terminals. Thus, the module 100 can be provided with a reduced size. In addition, since the plurality of connection terminals 11 can be mounted close to the wiring substrate 101, the degree of freedom in designing the module 100 can be increased.
  • a terminal assembly 10 is prepared in which a plurality of columnar connection terminals 11 forming interlayer connection conductors are supported by a support body 12, and a conventional terminal assembly in which the support body and connection terminals are integrally formed;
  • each connection terminal 11 supported by the support is formed separately from the support 12. Therefore, when compared with the conventional connection terminals integrally formed on the support, each connection terminal 11 is formed separately from the support 12, so that the terminal assembly 10 prepared in the preparation process is very
  • a plurality of columnar connection terminals 11 having a highly accurate shape are supported and formed by a support 12.
  • the terminal assembly 10 has a simple configuration in which a plurality of connection terminals 11 are supported by a support 12 and is etched or scraped when preparing the terminal assembly 10 as in the prior art. Since there is no material to be discarded, the cost for preparing the terminal assembly 10 is reduced. Therefore, the simple structure in which the plurality of connection terminals 11 are supported by the support body 12 is highly accurate and inexpensive, and the terminal assembly 10 and the electronic component 102 having a new structure are mounted on one main surface of the wiring board 101.
  • the module 100 can be accurately manufactured by sealing the electronic component 102 and the terminal assembly 10 mounted on one main surface of the wiring board 101 with the first resin layer 103.
  • connection terminals 11 are only supported by the support body 12, and the connection terminals 11 and the support body 12 are formed separately. Therefore, as compared with the conventional terminal assembly having an integral structure, the support 12 can be easily removed from the plurality of connection terminals 11, and the interlayer connection conductor of the module 100 can be formed by the connection terminals 11. The manufacturing time can be shortened.
  • the resin is filled in the one main surface of the wiring substrate 101 in a state where the support 12 of the terminal assembly 10 on the one main surface of the wiring substrate 101 is removed from the connection terminal 11, the first resin layer 103 is formed. Therefore, the filling property of the resin filling one main surface of the wiring board 101 is improved. Further, when the resin is filled into the one main surface of the wiring substrate 101, the support 12 of the terminal assembly 10 mounted on the one main surface is removed, so that the air can easily escape and the first resin layer The generation of voids in 103 can be suppressed.
  • the first resin layer 103 can be easily formed by various generally known methods.
  • each connection terminal 11 is supported on the support 12 by adhesion or adhesion, and the support 12 is connected by reducing the adhesion or adhesion by the support 12 by heating or the like. It can be easily removed from the terminal 11.
  • the surface of the first resin layer 103 can be flattened by grinding or polishing after the sealing step, and the height of the module 100 can be reduced.
  • the external connection is formed on the surface of the first resin layer 103 by the one end of the connection terminal 11.
  • the terminal can be easily formed.
  • the terminal assembly 10 in which a plurality of columnar connection terminals 11 having a highly accurate shape is supported by a support 12 has a simple configuration in which the plurality of connection terminals 11 are supported by the support 12.
  • the support 12 made of a plate-like member that is highly accurate and inexpensive and has a support layer 13 formed of an adhesive layer or an adhesive layer on one surface, It has a practical configuration.
  • FIG. 6 is a diagram showing a module according to the second embodiment of the present invention.
  • the module according to this embodiment is different from the first embodiment described above in that an electronic component 102 is further mounted on the other main surface of the wiring board 101 of the module 100a as shown in FIG. Since other configurations are the same as those in the first embodiment described above, description of the configurations is omitted by giving the same reference numerals.
  • a terminal for external connection of the module 100 a is formed by the end face of one end of the connection terminal 11.
  • the mounting density of the electronic component 102 mounted on the module 100a can be increased, and the mounting density of the electronic component 102 is increased.
  • a module 100a having a typical configuration can be provided.
  • FIG. 7 is a diagram showing a module according to the third embodiment of the present invention.
  • the module according to this embodiment differs from the second embodiment described above in that the electronic component 102 mounted on the other main surface of the wiring board 101 of the module 100b covers the electronic component 102 as shown in FIG.
  • the second resin layer 104 is sealed by the second resin layer 104. Since other configurations are the same as those in the first and second embodiments described above, the description of the configurations is omitted by giving the same reference numerals.
  • the electronic component 102 is mounted on the other main surface of the wiring board 101, and the electronic component 102 mounted on the other main surface of the wiring board 101 is the second resin layer 104.
  • the mounting density of the electronic components 102 mounted on the module 100b can be increased, which is practical.
  • the second resin layer 104 is provided so as to cover the other main surface of the wiring substrate 101 with the electronic component 102, the electronic component 102 mounted on the other main surface of the wiring substrate 101 is formed by the second resin layer 104. Can be protected.
  • FIG. 8 is a diagram showing a module according to the fourth embodiment of the present invention.
  • the module according to this embodiment differs from the third embodiment described above in that the metal shield layer 105 is formed on the second resin layer 104 provided on the other main surface of the wiring substrate 101 of the module 100c as shown in FIG. Is a point provided. Since other configurations are the same as those in the first to third embodiments, description thereof will be omitted by assigning the same reference numerals. Note that the metal shield layer 105 is preferably electrically connected to the GND wiring provided on the wiring board 101.
  • the metal shield layer 105 is provided in the 2nd resin layer 104, it is prevented especially that a noise propagates from the exterior to the electronic component 102 sealed by the 2nd resin layer 104. At the same time, electromagnetic waves and the like are prevented from radiating from the electronic component 102 sealed in the second resin layer 104.
  • FIG. 9 is a diagram showing a module according to the fifth embodiment of the present invention.
  • the module according to this embodiment differs from the third embodiment described with reference to FIG. 7 in that the terminal assembly 10 is mounted on the other main surface of the wiring board 101 of the module 100d as shown in FIG.
  • an interlayer connection conductor by the connection terminal 11 is provided on the second resin layer 104.
  • the second resin layer 104 is formed by filling the resin after the support 12 of the terminal assembly 10 mounted on the other main surface of the wiring substrate 101 is removed from the connection terminal 11.
  • an electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the interlayer connection conductor formed by the connection terminals 11 provided on the second resin layer 104. Since other configurations are the same as those in the first to fourth embodiments described above, description of the configurations is omitted by giving the same reference numerals.
  • the terminal assembly 10 is further mounted on the other main surface of the wiring board 101, an interlayer connection conductor using the connection terminals 11 can be formed on the second resin layer 104. Further, before the electronic component 102 and the terminal assembly 10 mounted on the other main surface of the wiring board 101 are sealed by the second resin layer 104, the support body for the terminal assembly 10 on the other main surface of the wiring board 101. Since 12 is removed from the connection terminal 11, the resin for forming the second resin layer 104 can be efficiently filled into the other main surface of the wiring substrate 101.
  • the electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the connection terminal 11 provided on the second resin layer 104, the mounting density of the electronic component 102 mounted on the module 100d This is practical because it can be further increased.
  • FIG. 10 is an enlarged view of a main part showing a modified example of the connection terminal, and (a) to (c) show modified examples of different connection terminals.
  • FIGS. 10 (a) to 10 (c) are enlarged views of main parts, and the same components as those in the first to fifth embodiments are denoted by the same reference numerals, and the description of the components is omitted.
  • the modification example of the connection terminal described below can achieve the same effect regardless of whether it is mounted on one of the main surface and the other main surface of the wiring board 101. Only the case where it is mounted on one main surface of the wiring board 101 will be described.
  • a land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11 is provided on one main surface of the wiring board 101.
  • the connection terminal 11 is made of a bonding material S such as solder. Is mounted on the land electrode 101b. With this configuration, the bonding material S is spread over the entire land electrode 101b having a larger area than the cross-sectional area of the connection terminal 11, and the end surface of the other end of the connection terminal 11 is spread over the entire mounting electrode 101a. Further, since the bonding material S formed so as to cover the outer peripheral surface in a bowl shape is caught by the first resin layer 103, it is possible to prevent the connection terminal 11 from falling off from the first resin layer 103.
  • a bonding agent S such as solder may be disposed between the connection terminal 11 and the mounting electrode 101b.
  • connection terminal 11b is formed in a tapered shape by forming the other end portion with a diameter larger than the diameter of the one end portion. Further, a land electrode 101b having a larger area than the cross-sectional area on the large diameter side of the connection terminal 11b is provided on one main surface of the wiring board 101. Then, the other end portion on the large diameter side of the connection terminal 11b is mounted on the land electrode 101b with a bonding material S such as solder.
  • connection terminal 11b is provided in wedge shape in the 1st resin layer 103, while the large diameter part of the connection terminal 11b is hooked on the 1st resin layer 103, sectional area of the large diameter side of the connection terminal 11b Since the bonding material S formed so as to cover the end surface and the outer peripheral surface of the other end portion of the connection terminal 11b in a hook shape is caught by the resin layer 103 by spreading over the entire land electrode 101b having a larger area than the land electrode 101b. It is possible to reliably prevent the resin layer 103 from falling off.
  • a bonding agent S such as solder may be disposed between the connection terminal 11b and the mounting electrode 101b.
  • the area of the mounting electrode 101b may be equal to the cross-sectional area on the large diameter side of the connection terminal 11b.
  • connection terminal 11b is formed in a tapered shape by forming the diameter of one end portion larger than the diameter of the other end portion.
  • a land electrode 101b having a larger area than the cross-sectional area of the other end portion on the small diameter side of the connection terminal 11b is provided on one main surface of the wiring board 101.
  • the small diameter side of the connection terminal 11b is mounted on the land electrode 101b by a bonding material S such as solder. If comprised in this way, the junction formed so that the end surface and outer peripheral surface of the other end part of the connection terminal 11b may be covered with a bowl shape by spreading over the land electrode 101b of a larger area than the cross-sectional area of the small diameter side of the connection terminal 11b. Since the material S is caught by the resin layer 103, the connection terminal 11b is prevented from coming off from the resin layer 103.
  • a bonding agent S such as solder may be disposed between the connection terminal 11b and the mounting electrode 101b.
  • connection terminal 11b since one end portion on the large-diameter side of the connection terminal 11b is exposed to the first resin layer 103, a land-shaped external connection terminal having a large area can be easily formed in the module. Electrical connectivity and bonding strength when mounted on a substrate or the like can be improved.
  • FIGS. 11 and 12 are diagrams showing modifications of the terminal assembly. Note that the same components as those in the first to fifth embodiments described above are denoted by the same reference numerals, and the description of the components is omitted.
  • a terminal assembly 10a shown in FIG. 11B is a support 12a in which holes 12a1 for inserting the connection terminals 11 at predetermined intervals are formed in a lattice shape in a resin plate.
  • the columnar connection terminal 11 is provided at one end of the hole 12a1 at a required position according to the design of the module. It is formed by being inserted from the part side.
  • the terminal assembly 10a can be easily manufactured at low cost simply by inserting the columnar connection terminals 11 into the holes 12a1 provided in the plate-like support 12a.
  • the terminal aggregate 10a according to the kind of module can be formed by inserting the connection terminal 11 in the required hole 12a1 among the plurality of holes 12a1 provided in the support 12a. Therefore, since it is not necessary to design the support body 12a for each type of module, the manufacturing cost of the terminal assembly 10a can be reduced.
  • the support body 12a may form the support body 12a by forming the hole 12a1 only in the required position of a resin board according to the design aspect of a module.
  • the support 12a can be formed by, for example, injection molding using a resin or by forming a hole in a resin plate.
  • the terminal assembly 10b shown in FIG. 12B is formed by punching or etching a metal plate made of a Cu—Fe alloy, so that one end of the plurality of connection terminals 11c.
  • a member is formed by bending the connecting terminals 11c on both sides of the connecting portion 12b.
  • the metal plate will be punched or etched to form an assembly in which a plurality of connecting terminals 11c are connected via the connecting part 12b, and the connecting part between the connecting terminal 11c and the connecting part 12b
  • the terminal assembly 10b can be easily formed at low cost simply by bending the wire.
  • connection layer 11 is supported by providing the support layer 13 on the support 12 of the terminal assembly 10.
  • the support layer 13 is provided on the support 12.
  • the support 12 may be formed of a plate member made of a magnetic material. If it does in this way, the connection terminal 11 can be supported by the support body 12 by adsorb
  • the support body 12 can be easily removed from the connection terminal 11.
  • the terminal assembly 10, 10a, 10b is mounted on the wiring board 101, and the interlayer connection conductor by the connection terminals 11, 11b, 11c is formed in the module.
  • the interlayer connection conductors may be formed in the module by individually mounting the connection terminals formed individually on the wiring board 101.
  • the present invention can be widely applied to a technique for forming an interlayer connection conductor of a module by mounting columnar connection terminals on the circuit board of the module using surface mounting technology, and various electronic components can be applied to the wiring board. By mounting, modules having various functions can be configured.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un module présentant une grande fiabilité grâce au montage sur une carte de circuits imprimés d'une borne de connexion cylindrique formée d'un alliage Cu-Fe et à la formation d'un conducteur de connexion inter-couches. Plus spécifiquement, une borne de connexion (11) est constituée d'un alliage Cu-Fe dont le coefficient d'expansion linéaire est inférieur à celui de Cu, et la différence entre le coefficient d'expansion linéaire du conducteur de connexion inter-couches formé de la borne de connexion (11) et le coefficient d'expansion linéaire de la carte (101) de circuits imprimés constituée d'un matériau céramique, d'un matériau de résine de norme FR-4 ou similaire peut être réduite. Ainsi, la borne de connexion (11) cylindrique formée de l'alliage Cu-Fe est montée sur la carte (101) de circuits imprimés et grâce à la formation d'un conducteur de connexion inter-couches, lorsque la carte (101) de circuits imprimés et la borne de connexion (11) sont chauffées, ces dernières se dilatent et il est alors possible de supprimer la tension qui apparaît entre la carte (101) de circuits imprimés et la borne de connexion (11), ce qui permet d'obtenir un module (100) d'une grande fiabilité.
PCT/JP2012/072552 2011-09-07 2012-09-05 Module et procédé de fabrication associé WO2013035717A1 (fr)

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JP2011194572 2011-09-07
JP2011-194572 2011-09-07

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
WO2014188760A1 (fr) * 2013-05-21 2014-11-27 株式会社村田製作所 Module
JPWO2016047316A1 (ja) * 2014-09-26 2017-07-13 株式会社村田製作所 高周波部品
CN112447359A (zh) * 2019-09-03 2021-03-05 株式会社村田制作所 电子部件及其制造方法

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JPH0637414A (ja) * 1992-07-14 1994-02-10 Toshiba Corp セラミックス回路基板
JP2000261152A (ja) * 1999-03-11 2000-09-22 Fuji Xerox Co Ltd プリント配線組立体
JP2001118876A (ja) * 1999-08-12 2001-04-27 Fujitsu Ltd 半導体装置及びその製造方法
JP2004031476A (ja) * 2002-06-24 2004-01-29 Victor Co Of Japan Ltd 電子部品内蔵多層プリント基板及びその製造方法
JP2007258397A (ja) * 2006-03-23 2007-10-04 Ngk Spark Plug Co Ltd 配線基板
JP2008263121A (ja) * 2007-04-13 2008-10-30 Nec Corp 半導体装置およびその製造方法
WO2010067508A1 (fr) * 2008-12-12 2010-06-17 株式会社村田製作所 Substrat multicouche et son procédé de fabrication

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JPH0637414A (ja) * 1992-07-14 1994-02-10 Toshiba Corp セラミックス回路基板
JP2000261152A (ja) * 1999-03-11 2000-09-22 Fuji Xerox Co Ltd プリント配線組立体
JP2001118876A (ja) * 1999-08-12 2001-04-27 Fujitsu Ltd 半導体装置及びその製造方法
JP2004031476A (ja) * 2002-06-24 2004-01-29 Victor Co Of Japan Ltd 電子部品内蔵多層プリント基板及びその製造方法
JP2007258397A (ja) * 2006-03-23 2007-10-04 Ngk Spark Plug Co Ltd 配線基板
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Publication number Priority date Publication date Assignee Title
WO2014188760A1 (fr) * 2013-05-21 2014-11-27 株式会社村田製作所 Module
JPWO2014188760A1 (ja) * 2013-05-21 2017-02-23 株式会社村田製作所 モジュール
US9832871B2 (en) 2013-05-21 2017-11-28 Murata Manufacturing Co, Ltd. Module
JPWO2016047316A1 (ja) * 2014-09-26 2017-07-13 株式会社村田製作所 高周波部品
CN112447359A (zh) * 2019-09-03 2021-03-05 株式会社村田制作所 电子部件及其制造方法
CN112447359B (zh) * 2019-09-03 2023-03-10 株式会社村田制作所 电子部件及其制造方法

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