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WO2013033032A3 - Method and apparatus for release-assisted microcontact printing of mems - Google Patents

Method and apparatus for release-assisted microcontact printing of mems Download PDF

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Publication number
WO2013033032A3
WO2013033032A3 PCT/US2012/052549 US2012052549W WO2013033032A3 WO 2013033032 A3 WO2013033032 A3 WO 2013033032A3 US 2012052549 W US2012052549 W US 2012052549W WO 2013033032 A3 WO2013033032 A3 WO 2013033032A3
Authority
WO
WIPO (PCT)
Prior art keywords
diaphragms
mems
release
microcontact printing
external bias
Prior art date
Application number
PCT/US2012/052549
Other languages
French (fr)
Other versions
WO2013033032A2 (en
Inventor
Apoorva Murarka
Vladimir Bulovic
Sarah Paydavosi
Original Assignee
Massachusetts Institute Of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Massachusetts Institute Of Technology filed Critical Massachusetts Institute Of Technology
Priority to US13/604,613 priority Critical patent/US10570005B2/en
Publication of WO2013033032A2 publication Critical patent/WO2013033032A2/en
Publication of WO2013033032A3 publication Critical patent/WO2013033032A3/en
Priority to US15/956,736 priority patent/US20180352338A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00373—Selective deposition, e.g. printing or microcontact printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0183—Selective deposition
    • B81C2201/0185—Printing, e.g. microcontact printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
    • B81C2201/0194—Transfer of a layer from a carrier wafer to a device wafer the layer being structured

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)

Abstract

The disclosure provides methods and apparatus for release-assisted microcontact printing of MEMS. Specifically, the principles disclosed herein enable patterning diaphragms and conductive membranes on a substrate having articulations of desired shapes and sizes. Such diaphragms deflect under applied pressure or force (e.g., electrostatic, electromagnetic, acoustic, pneumatic, mechanical, etc.) generating a responsive signal. Alternatively, the diaphragm can be made to deflect in response to an external bias to measure the external bias/phenomenon. The disclosed principles enable transferring diaphragms and/or thin membranes without rupturing.
PCT/US2012/052549 2008-12-16 2012-08-27 Method and apparatus for release-assisted microcontact printing of mems WO2013033032A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/604,613 US10570005B2 (en) 2008-12-16 2012-09-05 Method and apparatus for release-assisted microcontact printing of MEMS
US15/956,736 US20180352338A1 (en) 2008-12-16 2018-04-18 Electrostatic acoustic transducer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161528148P 2011-08-27 2011-08-27
US61/528,148 2011-08-27

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US12/636,757 Continuation-In-Part US8739390B2 (en) 2008-12-16 2009-12-13 Method for microcontact printing of MEMS

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/604,613 Continuation US10570005B2 (en) 2008-12-16 2012-09-05 Method and apparatus for release-assisted microcontact printing of MEMS

Publications (2)

Publication Number Publication Date
WO2013033032A2 WO2013033032A2 (en) 2013-03-07
WO2013033032A3 true WO2013033032A3 (en) 2013-07-18

Family

ID=47172858

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/052549 WO2013033032A2 (en) 2008-12-16 2012-08-27 Method and apparatus for release-assisted microcontact printing of mems

Country Status (1)

Country Link
WO (1) WO2013033032A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9352959B1 (en) 2008-12-16 2016-05-31 Massachusetts Institute Of Technology Method and applications of thin-film membrane transfer
US9217755B2 (en) 2012-02-15 2015-12-22 Massachusetts Institute Of Technology Method and apparatus for building three-dimensional MEMS elements
US9573802B2 (en) 2012-02-15 2017-02-21 Massachusetts Institute Of Technology Method and apparatus for building three-dimensional MEMS elements
US9511995B2 (en) 2012-02-15 2016-12-06 Massachusetts Institute Of Technology Method and apparatus for building three-dimensional MEMS elements
WO2014035486A1 (en) * 2012-08-31 2014-03-06 Massachusetts Institute Of Technology Contact -transfer printed membranes
WO2015073734A1 (en) * 2013-11-13 2015-05-21 Massachusetts Institute Of Technology Thin-film parylene membrane transfer
US10986435B2 (en) 2017-04-18 2021-04-20 Massachusetts Institute Of Technology Electrostatic acoustic transducer utilized in a hearing aid or audio processing system
CN113973245B (en) * 2020-07-24 2023-04-04 华为技术有限公司 Headset, wireless charging device and headset charging system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060066640A1 (en) * 2004-09-27 2006-03-30 Manish Kothari Display region architectures
US20090320274A1 (en) * 2008-06-24 2009-12-31 Canon Kabushiki Kaisha Electromechanical transducer and fabrication method of electromechanical transducing apparatus
US20100188796A1 (en) * 2008-12-16 2010-07-29 Massachusetts Institute Of Technology Method And Apparatus for Microcontact Printing of MEMS

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060066640A1 (en) * 2004-09-27 2006-03-30 Manish Kothari Display region architectures
US20090320274A1 (en) * 2008-06-24 2009-12-31 Canon Kabushiki Kaisha Electromechanical transducer and fabrication method of electromechanical transducing apparatus
US20100188796A1 (en) * 2008-12-16 2010-07-29 Massachusetts Institute Of Technology Method And Apparatus for Microcontact Printing of MEMS

Also Published As

Publication number Publication date
WO2013033032A2 (en) 2013-03-07

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