WO2013031844A1 - Encre liquide - Google Patents
Encre liquide Download PDFInfo
- Publication number
- WO2013031844A1 WO2013031844A1 PCT/JP2012/071864 JP2012071864W WO2013031844A1 WO 2013031844 A1 WO2013031844 A1 WO 2013031844A1 JP 2012071864 W JP2012071864 W JP 2012071864W WO 2013031844 A1 WO2013031844 A1 WO 2013031844A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liquid ink
- thermosetting resin
- cured
- resin composition
- acrylate
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 81
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 54
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 239000011342 resin composition Substances 0.000 claims abstract description 34
- 239000011256 inorganic filler Substances 0.000 claims abstract description 30
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 30
- 238000003860 storage Methods 0.000 claims abstract description 19
- 229920000620 organic polymer Polymers 0.000 claims abstract description 14
- 239000002904 solvent Substances 0.000 claims abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 52
- 239000004925 Acrylic resin Substances 0.000 claims description 36
- 229920000178 Acrylic resin Polymers 0.000 claims description 36
- 229920001721 polyimide Polymers 0.000 claims description 26
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 239000005011 phenolic resin Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 8
- 235000010290 biphenyl Nutrition 0.000 claims description 7
- 239000004305 biphenyl Substances 0.000 claims description 7
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 7
- 125000003277 amino group Chemical group 0.000 claims description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 5
- 239000000976 ink Substances 0.000 description 63
- 239000000047 product Substances 0.000 description 40
- 239000000178 monomer Substances 0.000 description 29
- 239000000758 substrate Substances 0.000 description 26
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- 239000000377 silicon dioxide Substances 0.000 description 18
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 17
- -1 Leolo Seal Chemical compound 0.000 description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 10
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 8
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 8
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- 239000004962 Polyamide-imide Substances 0.000 description 4
- 125000005250 alkyl acrylate group Chemical group 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000003368 amide group Chemical group 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920002312 polyamide-imide Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000012756 surface treatment agent Substances 0.000 description 4
- QQOWHRYOXYEMTL-UHFFFAOYSA-N triazin-4-amine Chemical compound N=C1C=CN=NN1 QQOWHRYOXYEMTL-UHFFFAOYSA-N 0.000 description 4
- QHZOMPOYOBGSDR-UHFFFAOYSA-N 3-(2-methyloxiran-2-yl)propyl prop-2-enoate Chemical compound C=CC(=O)OCCCC1(C)CO1 QHZOMPOYOBGSDR-UHFFFAOYSA-N 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- PHPRWKJDGHSJMI-UHFFFAOYSA-N 1-adamantyl prop-2-enoate Chemical compound C1C(C2)CC3CC2CC1(OC(=O)C=C)C3 PHPRWKJDGHSJMI-UHFFFAOYSA-N 0.000 description 2
- SZYSVVHHTCNZAZ-UHFFFAOYSA-N 2-(2-methyloxiran-2-yl)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1(C)CO1 SZYSVVHHTCNZAZ-UHFFFAOYSA-N 0.000 description 2
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920001646 UPILEX Polymers 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 2
- VDCSGNNYCFPWFK-UHFFFAOYSA-N diphenylsilane Chemical compound C=1C=CC=CC=1[SiH2]C1=CC=CC=C1 VDCSGNNYCFPWFK-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 2
- LBHPSYROQDMVBS-UHFFFAOYSA-N (1-methylcyclohexyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1(C)CCCCC1 LBHPSYROQDMVBS-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- IAXXETNIOYFMLW-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) 2-methylprop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C(=C)C)CC1C2(C)C IAXXETNIOYFMLW-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- MZVABYGYVXBZDP-UHFFFAOYSA-N 1-adamantyl 2-methylprop-2-enoate Chemical compound C1C(C2)CC3CC2CC1(OC(=O)C(=C)C)C3 MZVABYGYVXBZDP-UHFFFAOYSA-N 0.000 description 1
- MKRBAPNEJMFMHU-UHFFFAOYSA-N 1-benzylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC=C1 MKRBAPNEJMFMHU-UHFFFAOYSA-N 0.000 description 1
- SRXJYTZCORKVNA-UHFFFAOYSA-N 1-bromoethenylbenzene Chemical compound BrC(=C)C1=CC=CC=C1 SRXJYTZCORKVNA-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- XHAFIUUYXQFJEW-UHFFFAOYSA-N 1-chloroethenylbenzene Chemical compound ClC(=C)C1=CC=CC=C1 XHAFIUUYXQFJEW-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- DAEXAGHVEUWODX-UHFFFAOYSA-N 1-fluoroethenylbenzene Chemical compound FC(=C)C1=CC=CC=C1 DAEXAGHVEUWODX-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- QHVBLSNVXDSMEB-UHFFFAOYSA-N 2-(diethylamino)ethyl prop-2-enoate Chemical compound CCN(CC)CCOC(=O)C=C QHVBLSNVXDSMEB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- DJKKWVGWYCKUFC-UHFFFAOYSA-N 2-butoxyethyl 2-methylprop-2-enoate Chemical compound CCCCOCCOC(=O)C(C)=C DJKKWVGWYCKUFC-UHFFFAOYSA-N 0.000 description 1
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- KBKNKFIRGXQLDB-UHFFFAOYSA-N 2-fluoroethenylbenzene Chemical compound FC=CC1=CC=CC=C1 KBKNKFIRGXQLDB-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- CTHJQRHPNQEPAB-UHFFFAOYSA-N 2-methoxyethenylbenzene Chemical compound COC=CC1=CC=CC=C1 CTHJQRHPNQEPAB-UHFFFAOYSA-N 0.000 description 1
- KZPMXWBRKHQGQJ-UHFFFAOYSA-N 2-methyl-4-(oxiran-2-yl)but-2-enoic acid oxiran-2-ylmethyl 2-methylprop-2-enoate Chemical compound O1C(CC=C(C(=O)O)C)C1.C(C(=C)C)(=O)OCC1CO1 KZPMXWBRKHQGQJ-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- QJWSWVAURLSCNP-UHFFFAOYSA-N 3-(2-methyloxiran-2-yl)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCC1(C)CO1 QJWSWVAURLSCNP-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- AJCWVHZUFBOMGW-UHFFFAOYSA-N 4-(2-methyloxiran-2-yl)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCC1(C)CO1 AJCWVHZUFBOMGW-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- KFDVPJUYSDEJTH-UHFFFAOYSA-N 4-ethenylpyridine Chemical compound C=CC1=CC=NC=C1 KFDVPJUYSDEJTH-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- NFERJALBLLNOMG-UHFFFAOYSA-N C(C)C=C(C(=O)O)C.C(C(=C)C)(=O)OCC Chemical compound C(C)C=C(C(=O)O)C.C(C(=C)C)(=O)OCC NFERJALBLLNOMG-UHFFFAOYSA-N 0.000 description 1
- FDSRHQVRWSFZAQ-UHFFFAOYSA-N C(C=C)(=O)OC1C(CCCC)O1 Chemical compound C(C=C)(=O)OC1C(CCCC)O1 FDSRHQVRWSFZAQ-UHFFFAOYSA-N 0.000 description 1
- DKSOMQSOSYCIDA-UHFFFAOYSA-N C1(CCCC1)C(=C(C(=O)OC(CCCCCCC)CC)C)C1CCCC1 Chemical compound C1(CCCC1)C(=C(C(=O)OC(CCCCCCC)CC)C)C1CCCC1 DKSOMQSOSYCIDA-UHFFFAOYSA-N 0.000 description 1
- FHRARVMXMZZTSN-UHFFFAOYSA-N C1(CCCC1)C(=CC(=O)OC(CCCCCCC)CC)C1CCCC1 Chemical compound C1(CCCC1)C(=CC(=O)OC(CCCCCCC)CC)C1CCCC1 FHRARVMXMZZTSN-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- IQYMRQZTDOLQHC-ZQTLJVIJSA-N [(1R,4S)-2-bicyclo[2.2.1]heptanyl] prop-2-enoate Chemical compound C1C[C@H]2C(OC(=O)C=C)C[C@@H]1C2 IQYMRQZTDOLQHC-ZQTLJVIJSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- SKKHNUKNMQLBTJ-QIIDTADFSA-N [(1s,4r)-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@H]2C(OC(=O)C(=C)C)C[C@@H]1C2 SKKHNUKNMQLBTJ-QIIDTADFSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
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- 239000000853 adhesive Substances 0.000 description 1
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- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- SQHOHKQMTHROSF-UHFFFAOYSA-N but-1-en-2-ylbenzene Chemical compound CCC(=C)C1=CC=CC=C1 SQHOHKQMTHROSF-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- ZRRKYDDLNHKSMO-UHFFFAOYSA-N butyl 2-methylprop-2-enoate Chemical compound CCCCOC(=O)C(C)=C.CCCCOC(=O)C(C)=C ZRRKYDDLNHKSMO-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- WRAABIJFUKKEJQ-UHFFFAOYSA-N cyclopentyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCC1 WRAABIJFUKKEJQ-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- RMTGISUVUCWJIT-UHFFFAOYSA-N n-[3-[3-aminopropoxy(dimethoxy)silyl]propyl]-1-phenylprop-2-en-1-amine;hydrochloride Chemical compound Cl.NCCCO[Si](OC)(OC)CCCNC(C=C)C1=CC=CC=C1 RMTGISUVUCWJIT-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- HVYCQBKSRWZZGX-UHFFFAOYSA-N naphthalen-1-yl 2-methylprop-2-enoate Chemical compound C1=CC=C2C(OC(=O)C(=C)C)=CC=CC2=C1 HVYCQBKSRWZZGX-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Definitions
- the present invention relates to a liquid ink.
- Electronic devices are aimed at lightness, thinness and smallness, and high-density mounting printed wiring boards representing lightness, thinness and shortness are especially incorporated in recent mobile phones, video cameras, and notebook computers.
- it is necessary to incorporate a plurality of printed wiring boards in a limited space in a compact manner.
- the wiring boards are connected to each other by a connector, the connection becomes difficult.
- various so-called flexible-rigid wiring boards in which a flexible substrate such as a polyimide film substrate and a rigid substrate are combined have been proposed.
- a method for manufacturing a rigid flexible wiring board has been proposed in which a rigid substrate and a flexible substrate are thermocompression bonded via an adhesive sheet, and a circuit of the rigid substrate and the flexible substrate is electrically connected through a through hole (for example, (See Patent Document 1).
- JP-A-2-39594 Japanese Patent Laid-Open No. 5-90756 JP 2006-352103 A
- the main object of the present invention is to increase the rigidity of any part that does not require flexibility while maintaining good bendability for a flexible substrate such as a flexible printed wiring board. It is to provide a liquid ink.
- the present invention relates to a liquid ink containing a thermosetting resin composition containing an organic polymer, a thermosetting resin and an inorganic filler, and a solvent for dissolving or dispersing the thermosetting resin composition.
- a thermosetting resin composition containing an organic polymer, a thermosetting resin and an inorganic filler, and a solvent for dissolving or dispersing the thermosetting resin composition.
- the flexible printed wiring board since the cured product of the thermosetting resin composition to which the inorganic filler is added has the specific storage elastic modulus and tensile elastic modulus, the flexible printed wiring board.
- the rigidity of an arbitrary portion that does not require flexibility can be increased while maintaining good bendability with respect to a substrate having flexibility such as the above.
- the thermosetting resin composition may contain 50% by mass or more of an inorganic filler based on the total solid content of the thermosetting resin composition (components other than the solvent in the liquid ink).
- the organic polymer may contain an acrylic resin.
- the acrylic resin may have a glycidyl group.
- the weight average molecular weight of the acrylic resin may be 400,000 to 1.8 million, 500,000 to 1.5 million, or 800,000 to 1.4 million.
- the inorganic filler may contain silica particles.
- the silica particles may be surface-treated with a silane coupling agent. Thereby, sedimentation of silica particles is suppressed and a more stable liquid ink can be obtained.
- the silane coupling agent may have an amino group.
- thermosetting resin may contain an epoxy resin.
- thermosetting resin composition may further contain a phenol resin.
- the epoxy resin may contain a biphenyl aralkyl type epoxy resin. Since the biphenyl aralkyl type epoxy resin is highly compatible with an organic polymer such as an acrylic resin, a liquid ink excellent in dispersion stability can be obtained by using the biphenyl aralkyl type epoxy resin.
- the liquid ink according to the present invention can be used for applying a liquid ink to a polyimide film substrate and curing the applied liquid ink to form a cured film that increases the rigidity of the polyimide film substrate.
- liquid ink according to the present invention may be used to form a cured film that increases the rigidity of the flexible printed wiring board by applying the liquid ink to the flexible printed wiring board and curing the applied liquid ink. it can.
- a liquid ink that can increase the rigidity of an arbitrary portion that does not require flexibility while maintaining good bendability for a flexible substrate such as a flexible printed wiring board.
- the cured film formed with the liquid ink according to the present invention exhibits good adhesion to the polyimide film. Therefore, by forming a cured film by applying liquid ink to a portion of the flexible printed wiring board that has a polyimide film substrate as a substrate and does not require flexibility, a cured film is formed while avoiding a decrease in reflow resistance. It is possible to increase the rigidity of the flexible wiring board in the portion thus formed and to provide rigidity. That is, a rigid-flexible printed wiring board having a rigid portion and a flexible portion can be manufactured by a simple process. Such a rigid-flexible printed wiring board can contribute to weight reduction of various electronic devices.
- the cured film formed with the liquid ink according to the present invention has high reflow resistance, the high level of reflow resistance required when using lead-free solder is easily achieved. Achieved.
- FIG. 6 is a stress-displacement curve and a tangent line of a cured product of the liquid ink obtained in Example 11.
- FIG. 1 is a cross-sectional view showing an embodiment in which a cured film 1 is provided in contact with a base material 10.
- the base material 10 is a flexible base material having flexibility such as a polyimide film.
- the rigidity of the base material 10 is increased in the portion in contact with the cured film 1 as compared with the case where the cured film 1 is not formed. In other words, the self-supporting property of the base material 10 is enhanced in the portion in contact with the cured film 1.
- the substrate 10 is a flexible printed wiring board
- the portion of the substrate 10 in contact with the cured film 1 can function as a rigid portion of a rigid-flexible wiring board, for example.
- the liquid ink according to this embodiment can be used to form the cured film 1.
- the cured film 1 is formed by applying liquid ink to the substrate 10 and curing the applied liquid ink.
- the thickness of the cured film 1 is 50 to 300 ⁇ m, 80 to 200 ⁇ m, or 100 to 150 ⁇ m.
- the liquid ink according to the present embodiment contains a thermosetting resin composition containing an organic polymer that is a polymer material, a thermosetting resin, and an inorganic filler, and a solvent that dissolves or disperses the thermosetting resin composition. .
- thermosetting resin composition in the liquid ink is cured by heating, for example, a cured product having a storage elastic modulus at 25 ° C. of 500 MPa or less and a tensile elastic modulus of 0.5 GPa to 3.0 GPa (for example, A cured film 1) is formed.
- the storage elastic modulus at 25 ° C. of the cured product is measured by measuring the dynamic viscoelasticity of the film-like cured product. More specifically, the storage elastic modulus at 25 ° C. of the cured product is the dynamic viscoelasticity of a film-like cured product having a width of 5 mm and a length of 30 mm, a tensile mode, a distance between chucks of 20 mm, a period of 10 Hz, and a rate of temperature increase. It can obtain
- the cured product as the measurement sample is formed, for example, by drying a liquid ink film having a thickness of 125 ⁇ m by heating at 110 ° C. for 10 minutes and then curing by heating at 185 ° C. for 30 minutes.
- the tensile modulus is the maximum value of the tangential slope of the stress-displacement curve (elastically deformed part) obtained when a strip-shaped cured product is prepared as a measurement sample and tensile stress is applied to it at a pulling speed of 50 mm / min. Is the initial elastic modulus obtained from The tensile test is usually performed in an atmosphere of about 23 ° C.
- the tensile elastic modulus of the cured product of the thermosetting resin composition according to the present embodiment mainly varies depending on the content of the inorganic filler having a high elastic modulus.
- a thermosetting resin composition containing an organic polymer, a thermosetting resin, and an inorganic filler if the content of the inorganic filler is 50% by mass or more based on the mass of the thermosetting resin composition, 0.5 GPa to There is a high possibility that a cured product having a tensile elastic modulus of 3.0 GPa is formed.
- the tensile elastic modulus of the cured product of liquid ink When the tensile elastic modulus of the cured product of liquid ink is in the range of 0.5 GPa to 3.0 GPa, cracks are hardly generated in the cured film when the substrate is bent together with the cured film. That is, the cured film 1 can be formed while maintaining the high flexibility of the substrate 10. From the same viewpoint, the tensile modulus of the cured product of the liquid ink material may be 0.7 GPa to 2.0 GPa.
- the storage elastic modulus of the cured product of the thermosetting resin composition according to the present embodiment is not affected by the inorganic filler so much as the tensile elastic modulus, and the comparison mainly reflects the low elastic modulus of the resin component. Is maintained at a low value.
- the storage elastic modulus at 25 ° C. of the cured product may be 500 MPa or less, or 120 MPa or less. Particularly excellent bending property and reflow resistance are achieved by the low storage elastic modulus of the cured product.
- the lower limit of the storage elastic modulus is usually about 10 MPa and may be 25 MPa.
- thermosetting resin composition that forms a cured film having the above characteristics will be described in detail below.
- thermosetting resin composition according to the present embodiment has an inorganic content of 50% by mass or more based on the mass of the total solid content of the thermosetting resin composition (components other than the solvent in the liquid ink).
- a filler may be included. 70 mass% or more may be sufficient as the content rate of an inorganic filler.
- the content of the inorganic filler may be 90% by mass or less, or 80% by mass or less from the viewpoint of tensile elastic modulus.
- the inorganic filler may be composed of one kind of particle or may be composed of a combination of two or more kinds of particles.
- the average particle size of the inorganic filler may be 1 to 100 ⁇ m, 1 to 50 ⁇ m, 1 to 20 ⁇ m, or 1.5 to 10 ⁇ m.
- the inorganic filler may be a mixture of plural kinds of fillers having different average particle diameters. Thereby, the space filling rate by an inorganic filler can be raised.
- the inorganic filler may be silica particles.
- the silica particles may be, for example, spherical silica obtained by a sol-gel method, crushed silica refined by pulverization, dry silica, or wet silica.
- MSR-2212 MSR-SC3, MSR-SC4, MSR-3512, MSR-FC208 (above, trade name manufactured by Tatsumori Co., Ltd.), Excelica (trade name manufactured by Tokuyama Corporation), SO -E1, SO-E2, SO-E3, SO-E5, SO-E6, SO-C1, SO-C2, SO-C3, SO-C5, SO-C6 (above, product names manufactured by Admatechs Co., Ltd.) Etc.
- crushed silica Commercially available products of crushed silica include Crystallite 3K-S, NX-7, MCC-4, CMC-12, A1, AA, CMC-1, VX-S2, VX-SR (above, manufactured by Tatsumori Co., Ltd.) Name), F05, F05-30, F05-12 (above, product names manufactured by Fukushima Ceramics Co., Ltd.), and the like. Dry silica such as Leolo Seal, and wet silica such as Toku Seal and Fine Seal (trade name, manufactured by Tokuyama Corporation) can also be used.
- Silica particles may be surface-treated with a silane coupling agent. Thereby, sedimentation of silica particles is suppressed and a liquid ink with higher dispersion stability can be obtained.
- silane coupling agent as a surface treating agent used for surface treating silica particles examples include vinyltrimethoxysilane, vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3- Glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3 Acryloxypropyltrimethoxysilane, n-2- (aminoethoxy
- the organic polymer constituting the thermosetting resin composition may be an acrylic resin or a polyamide-imide resin from the viewpoints of adhesion to the polyimide film substrate and heat resistance.
- the polyamide-imide resin may have a siloxane group and / or an aliphatic group in addition to the amide group and the imide group.
- the weight average molecular weight of the polyamideimide resin may be 10,000 to 150,000, 30,000 to 100,000, or 50,000 to 80,000.
- a weight average molecular weight is a standard polystyrene conversion value calculated
- the acrylic resin is generally a copolymer composed of a polymerizable monomer containing two or more kinds of acrylic monomers. Acrylic resins can be combined in a wide range by combining various commercially available acrylic monomers, and can be manufactured at low cost. In addition, the acrylic resin is excellent in that the printed liquid ink can be easily dried because it has good solubility in a low-boiling ketone solvent.
- the acrylic monomer constituting the acrylic resin is not particularly limited.
- dec-8-yl (dicyclopentanyl acrylate), tricycloacrylate [5.2.1. O2,6 ] dec-4-methyl, adamantyl acrylate, isobornyl acrylate, norbornyl acrylate, tricyclohexyl acrylate [5.2.1. O2,6 ] dec-8-yl, tricyclohexyl acrylate [5.2.1.
- Acrylic acid esters such as O 2,6 ] dec-4-methyl and adamantyl acrylate, and ethyl methacrylate (ethyl methacrylate), n-propyl methacrylate, i-propyl methacrylate, n-butyl methacrylate (butyl) Methacrylate), i-butyl methacrylate, t-butyl methacrylate, pentyl methacrylate, n-hexyl methacrylate, 2-ethylhexyl methacrylate, n-octyl methacrylate, dodecyl methacrylate, octadecyl methacrylate, butoxyethyl methacrylate, Phenyl methacrylate and naphthyl methacrylate such as cyclopentyl methacrylate, cyclohexyl methacrylate, methyl cyclohexyl methacrylate, tricyclo
- the acrylic monomer constituting the acrylic resin is from the group consisting of carboxyl group, hydroxyl group, acid anhydride group, amino group, amide group and epoxy group. It may contain a functional group-containing monomer having at least one selected functional group and at least one (meth) acryl group.
- the functional group-containing monomer examples include carboxyl group-containing monomers such as acrylic acid, methacrylic acid and itaconic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, methacrylic acid Hydroxyl group-containing monomers such as 2-hydroxypropyl, N-methylolmethacrylamide and (o-, m-, p-) hydroxystyrene, acid anhydride group-containing monomers such as maleic anhydride, diethylaminoethyl acrylate and diethylamino methacrylate Amino group-containing monomers such as ethyl, glycidyl acrylate, glycidyl methacrylate (glycidyl methacrylate), glycidyl ⁇ -ethyl acrylate, glycidyl ⁇ -n-propyl acrylate, 3,4-epoxybutyl acrylate Methacrylic
- the acrylic resin may further contain another monomer copolymerized with the acrylic monomer.
- Other monomers include, for example, 4-vinylpyridine, 2-vinylpyridine, ⁇ -methylstyrene, ⁇ -ethylstyrene, ⁇ -fluorostyrene, ⁇ -chlorostyrene, ⁇ -bromostyrene, fluorostyrene, chlorostyrene, bromostyrene
- Aromatic vinyl compounds such as methylstyrene, methoxystyrene and styrene, and N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, Ni-propylmaleimide, N-butylmaleimide, Ni-butylmaleimide , Nt-butylmaleimide, N-laurylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-phenylmaleimide and the like, and
- the acrylic resin may have a glycidyl group, particularly when the thermosetting resin is an epoxy resin.
- the acrylic resin may contain glycidyl methacrylate or glycidyl acrylate, which is a functional group-containing monomer, as a monomer unit. Based on the amount of all polymerizable monomers constituting the acrylic resin, the content of glycidyl methacrylate may be 0.5 to 10% by mass, 1 to 8% by mass, or 2 to 5% by mass.
- the acrylic resin may contain alkyl acrylate as a monomer from the viewpoint of adhesiveness with a flexible wiring board when a cured film is used.
- the alkyl group of the alkyl acrylate may have 1 to 12 or 2 to 10 carbon atoms. Based on the amount of all polymerizable monomers constituting the acrylic resin, the content of the alkyl acrylate may be 50 to 99% by mass, 60 to 98% by mass, or 70 to 96% by mass.
- the alkyl acrylate is selected from, for example, ethyl acrylate and butyl acrylate.
- the acrylic resin may contain acrylonitrile or methacrylonitrile as a monomer from the viewpoint of toughness and adhesiveness. Based on the amount of all polymerizable monomers constituting the acrylic resin, the content of acrylonitrile or methacrylonitrile may be 0.5 to 10% by mass, 1 to 8% by mass, or 2 to 5% by mass. Good.
- acrylic resins include copolymers of glycidyl methacrylate and alkyl (meth) acrylate, glycidyl methacrylate, copolymers of alkyl (meth) acrylate and (meth) acrylonitrile, glycidyl methacrylate, alkyl (meth) acrylate and dicyclopentanyl. It is a copolymer of (meth) acrylate.
- the weight average molecular weight of the acrylic resin may be 400,000 to 1.8 million, 500,000 to 1.5 million, or 800,000 to 1.4 million. If the weight average molecular weight is less than 400,000, the viscosity of the liquid ink is low, so that the dispersion stability of the inorganic filler may be lowered, or the liquid ink may not be able to exhibit thixotropy. Further, when the weight average molecular weight of the acrylic resin is low, the cured film becomes brittle and the bending property of the cured film tends to be lowered.
- the glass transition temperature (Tg) of the acrylic resin may be ⁇ 50 to 100 ° C., ⁇ 45 to 20 ° C., or ⁇ 40 ° C. to 5 ° C. When the glass transition temperature of the acrylic resin is within these numerical ranges, the storage elastic modulus and tensile elastic modulus of the cured film can be easily controlled while suppressing stickiness of the cured film.
- Tg i (K) shows a glass transition temperature of the homopolymer of each monomer
- W i represents the weight fraction of each monomer
- W 1 + W 2 + ... + W i + ... W n 1.
- thermosetting resin constituting the thermosetting resin composition is a compound having a curable functional group (for example, an epoxy group).
- the thermosetting resin is, for example, one or more selected from epoxy resins, polyimide resins, polyamideimide resins, triazine resins, phenol resins, melamine resins, polyester resins, cyanate ester resins, and modified systems of these resins. .
- the thermosetting resin may contain a high molecular weight component for the purpose of improving the flexibility and heat resistance of the cured film.
- the molecular weight of the thermosetting resin is usually 3000 or less.
- the epoxy resin is, for example, a polyglycidyl ether obtained by reacting a polyhydric alcohol such as bisphenol A, a novolac-type phenol resin, and an ortho-cresol novolac-type phenol resin or a polyhydric alcohol such as 1,4-butanediol with epichlorohydrin.
- Polyglycidyl esters obtained by reacting polybasic acids such as phthalic acid and hexahydrophthalic acid with epichlorohydrin, N-glycidyl derivatives of compounds having amino groups, amide groups or heterocyclic nitrogen bases, and alicyclic rings It is 1 type, or 2 or more types chosen from a formula epoxy resin.
- polyglycidyl ethers selected from biphenyl aralkyl type epoxy resins and naphthalene type tetrafunctional epoxy resins, and N-glycidyl derivatives of compounds having an amide group or a heterocyclic nitrogen base are organic polymers (particularly acrylics). Resin).
- phenol resin examples include phenol type, bisphenol A type, cresol novolac type, and aminotriazine novolac type phenol resins. From the point of compatibility with the acrylic resin, one or both of the cresol novolak type and aminotriazine novolak type phenol resins can be selected.
- the amine triazine novolac type phenol resin has a structural unit represented by the following structural formula (I). When combined with an epoxy resin, the phenolic resin may function as a curing agent for the epoxy resin.
- R represents a hydrogen atom or a methyl group
- n represents an integer of 1 to 30.
- the thermosetting resin composition may contain a curing agent usually used for curing the thermosetting resin.
- a curing agent usually used for curing the thermosetting resin.
- the curing agent is selected from dicyandiamide, diaminodiphenylmethane, diaminodiphenylsulfone, phthalic anhydride, pyromellitic anhydride, and polyfunctional phenols such as phenol novolac and cresol novolac. be able to.
- an accelerator is used for the purpose of promoting the reaction between the thermosetting resin and the curing agent.
- the kind and compounding quantity of an accelerator are not specifically limited.
- an imidazole compound, an organic phosphorus compound, a tertiary amine, or a quaternary ammonium salt is used, and two or more kinds may be used in combination.
- Total mass of organic polymer (acrylic resin, etc.), thermosetting resin (epoxy resin, etc.) and curing agent (phenolic resin, etc.) (may correspond to the total mass of components other than inorganic filler of thermosetting resin composition) )),
- the organic polymer content may be 40-90% by weight, 50-85% by weight, or 60-80% by weight.
- the total of the glycidyl group of the acrylic resin and the epoxy group of the epoxy resin and the amount of hydroxyl group of the phenol resin may be substantially equivalent.
- the ratio between the thermosetting resin and the curing agent is appropriately set within a range usually employed in consideration of their reactivity and the like.
- the solvent constituting the liquid ink for example, ketone solvents such as methyl ethyl ketone and cyclohexanone can be used. From the viewpoint of printability, cyclohexanone can be selected.
- the concentration of the thermosetting resin composition (components other than the solvent) in the liquid ink may be 40 to 70% by mass based on the mass of the liquid ink.
- the liquid ink can be prepared by mixing each component constituting the thermosetting resin composition and a solvent, and stirring if necessary.
- the inorganic filler may be dispersed and slurried in advance in an organic solvent containing a surface treatment agent.
- the solid content concentration (inorganic filler concentration) of the slurry containing the inorganic filler and the solvent is not particularly limited, but is 50 to 90 mass%, 60 to 80 mass%, or 65 to 75 mass% based on the mass of the slurry. There may be.
- a mixture of an organic polymer, a thermosetting resin and a curing agent may be prepared in advance.
- a liquid ink can be obtained by mixing the mixture and the slurry of the inorganic filler.
- the liquid ink according to this embodiment is applied to a predetermined portion of the base material in order to form a cured film.
- the coating method may be continuous coating such as bar coating, comma coating, and roll coating, or may be printing such as screen printing and metal mask printing.
- the applied liquid ink (coating film) is cured after drying if necessary.
- the drying temperature may be 50-150 ° C, 80-130 ° C, or 100-120 ° C.
- a coating film is hardened
- the curing temperature may be 150-250 ° C, 160-200 ° C, or 180 ° C-190 ° C.
- Example 1 7 g of N-phenyl-3-aminopropyltrimethoxysilane (KBM573, trade name manufactured by Shin-Etsu Silicon Co., Ltd.) as a surface treatment agent is dissolved in 300 g of methyl ethyl ketone, and F05-12 (Fukushima Ceramics), which is crushed silica, is dissolved therein. (Product name) 700 g was added with stirring, and then further stirred at room temperature for 1 hour. A 200-mesh nylon cloth was used to filter the crushed silica agglomerates, and a slurry-like filtrate (silica slurry) was obtained.
- KBM573 trade name manufactured by Shin-Etsu Silicon Co., Ltd.
- MEK methyl ethyl ketone
- a copolymer of glycidyl methacrylate, ethyl acrylate and butyl acrylate weight average molecular weight 1,300,000, epoxy equivalent 7800, Tg-45 ° C.
- a biphenyl aralkyl type 34.2 g of MEK solution concentration 50% by mass of epoxy resin (NC-3000H, Nippon Kayaku Co., Ltd.) and MEK solution of phenol resin (LA-3018, trade name of Dainippon Ink Co., Ltd.) 25.8 g (concentration 50% by mass) and 0.5 g of 1-cyanoethyl-2-phenylimidazole (2PZ-CN, trade name, manufactured by Shikoku Kasei Co., Ltd.) were mixed and stirred to obtain a resin solution.
- 430 g of silica slurry was added and stirred for
- Examples 2 to 11, Reference Examples 1 to 4 and Comparative Examples 5 to 8 Liquid inks were prepared in the same manner as in Example 1 except that the materials shown in Tables 1 and 2 were used in the mixing ratios shown in the tables.
- the blending ratio of the organic polymer, the thermosetting resin and the curing agent is based on the mass other than the inorganic filler of the thermosetting resin composition, and the blending ratio of the inorganic filler is the total solid of the thermosetting resin composition. This is based on the mass of components (components other than the solvent in the liquid ink).
- Example 12 In 300 g of cyclohexanone, 7 g of N-phenyl-3-aminopropyltrimethoxysilane (KBM573, trade name, manufactured by Shin-Etsu Silicon Co., Ltd.) as a surface treatment agent was dissolved, and SO-25R (ADMATEX), which is spherical silica, was dissolved therein. (Product name) 700 g was added with stirring, and then further stirred at room temperature for 1 hour. A 200-mesh nylon cloth was used to filter out the agglomerates of spherical silica to obtain a slurry-like filtrate (silica slurry).
- KBM573 trade name, manufactured by Shin-Etsu Silicon Co., Ltd.
- a cyclohexanone solution (concentration 20% by mass) of a copolymer of glycidyl methacrylate, acrylonitrile, ethyl acrylate and butyl acrylate (weight average molecular weight 450,000, Tg-14.7 ° C.), which is an acrylic resin, and a biphenylaralkyl type epoxy resin ( NC-3000H, Nippon Kayaku Co., Ltd. trade name) cyclohexanone solution (concentration 50 mass%) 34.2 g and phenol resin (LA-3018, Dainippon Ink Co., Ltd.
- propylene glycol monomethyl ether solution 25.8 g (concentration 50% by mass) and 0.5 g of 1-cyanoethyl-2-phenylimidazole (2PZ-CN, trade name, manufactured by Shikoku Kasei Co., Ltd.) were mixed and stirred to obtain a resin solution.
- 430 g of the silica slurry inorganic filler concentration: 70% by mass was added and stirred for 1 hour to obtain a liquid ink.
- Epoxy resin / NC-3000H Biphenyl aralkyl type epoxy resin (trade name, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 290)
- EXA4710 Naphthalene type tetrafunctional epoxy resin (Dainippon Ink Co., Ltd. trade name, epoxy equivalent 170)
- N770 phenol novolac epoxy resin (Dainippon Ink Co., Ltd., epoxy equivalent 188) 3.
- KA-1165 Cresol novolac type phenolic resin (trade name, hydroxyl equivalent 119 manufactured by Dainippon Ink Co., Ltd.)
- LA-1356 Aminotriazine novolak type phenolic resin (Dainippon Ink Co., Ltd. trade name, hydroxyl equivalent 146, nitrogen content 19%) 4).
- ⁇ F05-30 Crushed silica, product name manufactured by Fukushima Ceramics Co., Ltd.
- SO-C6 / SO-E3 Spherical silica, products manufactured by Admatex Co., Ltd.
- DMDS / TEMOS Dimethyl Polysiloxane oligomer formed from dimethoxysilane (DMDS) and tetramethoxysilane (TEMOS)
- This sample was measured for viscoelasticity using a dynamic viscoelasticity measuring device (REOGEL 4000 manufactured by Rheology) at a distance between chucks of 20 mm, a period of 10 Hz, and a temperature rising rate of 5 ° C./min.
- the storage elastic modulus and Tg at 25 ° C. were determined from the obtained viscoelastic curve.
- FIG. 2 shows the stress-displacement curve of the cured liquid ink obtained in Example 11.
- the tensile elastic modulus was calculated from the slope of the tangent line T having the maximum slope among the tangent lines of the stress-displacement curve of FIG.
- Tensile modulus (Pa) maximum value of tangential slope of stress-displacement curve (N / m) ⁇ [displacement (m) / cross-sectional area of cured product (m 2 )]
- Self-supporting A liquid ink having a thickness of 125 ⁇ m after drying was applied to a polyimide film (Upilex 50S) using a bar coater. The applied liquid ink was dried by heating at 110 ° C. for 10 minutes, and then cured by heating at 185 ° C. for 30 minutes to form a cured film (cured product). The cured film was punched into a size of 10 mm width and 100 mm length together with the polyimide film to obtain a sample. The obtained sample was placed on two platforms installed with an interval of 80 mm so as to span the platforms, and the amount of subsidence at the center of the sample at that time was measured. When the sinking amount was 10 mm or less, it was determined that there was self-supporting property.
- Bending property A sample composed of a polyimide film and a cured film laminated thereon was applied with a 0.3 mm pin gauge, and the sample was bent to about 180 degrees while being wound around it, and the presence or absence of cracks at that time was observed. A polyimide film was placed outside or inside the pin gauge, and the same evaluation was performed. When the generation of cracks was not recognized, it was determined that the bendability was good.
- Reflow resistance A sample composed of a polyimide film and a cured film laminated thereon was sandwiched between two metal meshes, and a conveyor type reflow test was performed. That is, the sample was processed three times with a heating profile in which the maximum temperature of the sample surface was 260 ° C. at a speed of 1.2 m / min and the temperature was maintained for 10 seconds. After the treatment, the presence or absence of blistering and peeling between the polyimide film and the cured film was confirmed by visual observation of the appearance. When blistering and peeling were not recognized, it was determined that the reflow resistance was good.
- the liquid inks of the examples had excellent dispersion stability, and no aggregation of silica was observed after standing for 2 weeks.
- the cured film formed with these liquid inks could give the polyimide film self-supporting properties.
- the adhesiveness with respect to the polyimide of a cured film was also favorable, and there was no problem also in reflow resistance.
- the liquid ink of Reference Example 1 had a problem in stability because silica aggregated.
- the liquid inks of Reference Examples 2 and 3 had a problem in stability because the resin separated.
- the cured film formed with the liquid ink of Comparative Example 5 could not give self-supporting property to the polyimide film.
- the cured film formed with the liquid ink of Comparative Example 6 could not be folded together with the polyimide film without generating cracks.
- the storage elastic modulus at 25 ° C. of the cured product formed from the liquid ink of Reference Example 4 having a composition obtained by removing silica particles from the liquid ink of Example 3 is substantially the same value as the cured product of Example 3. Met. From this, it was confirmed that the storage elastic modulus at 25 ° C. of the cured product is a value mainly reflecting the elastic modulus of the resin component excluding the inorganic filler.
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Abstract
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KR (1) | KR102036135B1 (fr) |
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JP2016004818A (ja) * | 2014-06-13 | 2016-01-12 | 日立化成株式会社 | 印刷用樹脂組成物及びプリント配線板 |
JP2017206614A (ja) * | 2016-05-18 | 2017-11-24 | 日立化成株式会社 | 塗料用樹脂およびそれを用いた塗膜 |
WO2022054874A1 (fr) * | 2020-09-11 | 2022-03-17 | 富士フイルム株式会社 | Composition de résine durcissable, matériau thermoconducteur, feuille thermoconductrice, et dispositif à couche thermoconductrice |
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JP6454416B2 (ja) * | 2016-12-07 | 2019-01-16 | 日立化成株式会社 | 樹脂ワニス、プリプレグ、積層板及びプリント配線板 |
JP7327402B2 (ja) * | 2018-08-03 | 2023-08-16 | 三菱ケミカル株式会社 | 積層体及びエポキシ樹脂シートの製造方法 |
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- 2012-08-29 WO PCT/JP2012/071864 patent/WO2013031844A1/fr active Application Filing
- 2012-08-29 KR KR1020147006244A patent/KR102036135B1/ko not_active Expired - Fee Related
- 2012-08-29 CN CN201280041600.1A patent/CN103781860B/zh not_active Expired - Fee Related
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016004818A (ja) * | 2014-06-13 | 2016-01-12 | 日立化成株式会社 | 印刷用樹脂組成物及びプリント配線板 |
JP2017206614A (ja) * | 2016-05-18 | 2017-11-24 | 日立化成株式会社 | 塗料用樹脂およびそれを用いた塗膜 |
WO2022054874A1 (fr) * | 2020-09-11 | 2022-03-17 | 富士フイルム株式会社 | Composition de résine durcissable, matériau thermoconducteur, feuille thermoconductrice, et dispositif à couche thermoconductrice |
JPWO2022054874A1 (fr) * | 2020-09-11 | 2022-03-17 |
Also Published As
Publication number | Publication date |
---|---|
JP6007910B2 (ja) | 2016-10-19 |
JPWO2013031844A1 (ja) | 2015-03-23 |
TWI606096B (zh) | 2017-11-21 |
CN103781860A (zh) | 2014-05-07 |
KR20140068946A (ko) | 2014-06-09 |
CN103781860B (zh) | 2016-08-17 |
KR102036135B1 (ko) | 2019-10-24 |
TW201319180A (zh) | 2013-05-16 |
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