WO2013005740A1 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
- Publication number
- WO2013005740A1 WO2013005740A1 PCT/JP2012/066989 JP2012066989W WO2013005740A1 WO 2013005740 A1 WO2013005740 A1 WO 2013005740A1 JP 2012066989 W JP2012066989 W JP 2012066989W WO 2013005740 A1 WO2013005740 A1 WO 2013005740A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- locking
- lid
- cam
- locking bar
- fitted
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 42
- 230000007246 mechanism Effects 0.000 claims abstract description 80
- 230000002093 peripheral effect Effects 0.000 claims description 38
- 235000012431 wafers Nutrition 0.000 abstract description 23
- 239000004065 semiconductor Substances 0.000 abstract description 20
- 210000000078 claw Anatomy 0.000 description 15
- 238000009434 installation Methods 0.000 description 8
- 239000012778 molding material Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- PQJZHMCWDKOPQG-UHFFFAOYSA-N 2-anilino-2-oxoacetic acid Chemical compound OC(=O)C(=O)NC1=CC=CC=C1 PQJZHMCWDKOPQG-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 208000026721 nail disease Diseases 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D43/00—Lids or covers for rigid or semi-rigid containers
- B65D43/02—Removable lids or covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
Definitions
- the present invention relates to a substrate storage container for storing, storing, transporting, and transporting a substrate made of a semiconductor wafer, a glass wafer, a mask glass, or the like, and more specifically, a locking mechanism for a lid fitted in an opening of a container body. It is about improvement.
- the engaging cam surface is approximately the same height as the high-order portion of the first inclined cam surface
- the second cam portion includes a second horizontal cam surface formed on one end side of the outer flange of the second rotary operation body, and a circumferential direction of the cylindrical member continuously from the end portion of the second horizontal cam surface.
- a second inclined cam surface whose height gradually changes as it goes, and a second engagement cam surface formed on the other end side of the outer flange and continuing to the end of the second inclined cam surface, The amount of overhang can be gradually reduced from the two inclined cam surfaces toward the second engagement cam surface.
- the locking mechanism rotates the rotating operation body in the unlocking direction so that the first and second cam portions follow the locking bar, thereby covering the cover.
- the tip of the locking bar is brought into contact with the lid from the locking recess of the container body. Can be retreated.
- FIG. 1 is an overall perspective view schematically showing an embodiment of a substrate storage container according to the present invention. It is a disassembled perspective view which shows typically the cover body and locking mechanism in embodiment of the substrate storage container which concerns on this invention. It is a perspective explanatory view showing typically the lid main part in the embodiment of the substrate storage container concerning the present invention. It is a perspective explanatory view showing typically the back side of a cover plate in an embodiment of a substrate storage container concerning the present invention. It is a disassembled perspective view which shows typically the locking mechanism in embodiment of the substrate storage container which concerns on this invention. It is a perspective explanatory view showing typically the rotation operation object in the embodiment of the substrate storage container concerning the present invention.
- the container body 1, the lid body 10, and the locking mechanism 40 are each formed by combining a plurality of parts by injection molding a plurality of parts using a molding material containing a predetermined resin.
- the resin contained in the molding material include thermoplastic resins such as polycarbonate, cycloolefin polymer, polyetherimide, polyether ketone, polyether ether ketone, polybutylene terephthalate, polyacetal, and liquid crystal polymer, and alloys thereof. .
- each second cam portion 60 is formed horizontally on one end portion side of the outer flange 58 and connected to one end portion of one dividing wall 59.
- the second inclined cam 62 is formed on the other end side of the outer flange 58 and the second inclined cam 62, the height of which gradually changes in the direction of the other dividing wall 59 continuously to the end of the second horizontal cam 61.
- a second engagement cam 63 is provided between the end of the second inclined cam 62 and the other end of the other dividing wall 59.
- the lid 10 is fitted and locked to the opened front of the container body 1 in which a plurality of semiconductor wafers are aligned and stored, first, the lid 10 is placed on the opened front of the container body 1.
- the cover 10 is shallowly fitted while being held by suction by the opening / closing device 80, and the cover plate 30 side of the lid 10 protrudes slightly from the front of the container body 1 to the outside (see FIGS. 16 and 22).
- the lid opening / closing device 80 fits the lid 10 shallowly, but does not lock the locking mechanism 40, so the first horizontal cam 52 of the first cam portion 51 and the second cam portion 60 of the second cam portion 60 are not operated.
- the end portion of the locking bar 64 is sandwiched between the two engagement cams 63, and the end portion of the locking bar 64 is located on the cover plate 30 side of the lid body 10. Since the distal end portion is located on the cover plate 30 side of the lid body 10 in this way, the locking bar 64 has the distal end portion 65 located on the lid main body 11 side, and a virtual line connecting the distal end portion 65 and the distal end portion is illustrated. At 16, the state is obliquely downward.
- the locking bar 64 slides in the direction of the peripheral wall 12 of the lid 10 while sliding the fulcrum portion 67 against the guide rib 26 of the lid body 10, and uses the contact portion between the fulcrum portion 67 and the guide rib 26 as a fulcrum. Then, it swings toward the cover plate 30 and the front end portion 65 comes into pressure contact with the front side wall surface 4 of the locking hole 3 (see FIGS. 18 and 24). By this pressure contact, the cover body 10 that is shallowly fitted into the front surface of the container body 1 is drawn deeply, and the cover body 10 is fitted and locked appropriately and firmly.
- the locking bar 64 only needs to be sandwiched between the first and second rotating operation bodies 42 and 42A, the relationship between the first and second rotating operation bodies 42 and 42A and the locking bar 64 is complicated. It becomes possible to prevent becoming. Therefore, the operation of forming the first and second rotary operation bodies 42 and 42A and the locking bar 64 with high accuracy is really easy, and the assembly operation of the locking mechanism 40 is not delayed or complicated. Further, since the locking mechanism 40 does not require a locking claw, the number of parts can be reduced and the locking mechanism 40 can be quickly assembled.
- Locking hole (Locking recess) 4 Front side wall surface (wall surface on the opening side) DESCRIPTION OF SYMBOLS 10 Lid body 11 Lid body 12 Perimeter wall 13 Intrusion hole 15 Enclosing rib 16 Rib 19 for rotation operation bodies Support rib (support member) 21 positioning protrusion 22 long positioning protrusion 23 short positioning protrusion 24 locking bar rib 25 linear rib 26 guide rib (guide protrusion) 30 Cover plate 32 Key slot 34 Rotation restricting piece (Rotation restricting member) 35 Triangular protrusion 40 Locking mechanism 41 Rotating operation body 42 First rotating operation body 42A Second rotating operation body 43 Disk 44 Operation hole 46 Arc groove (engaging portion) 48 Position control piece 49 Cylindrical rib (cylindrical member) 50 Alignment cutout (first positioning part) 51 1st cam part 52 1st horizontal cam (1st horizontal cam surface) 53 First inclined cam (first inclined cam surface) 54 First engagement cam (first engagement cam surface) 55 Cylindrical rib (cylindrical
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Closures For Containers (AREA)
Abstract
Description
施錠機構は、蓋体の外部から操作される回転操作体と、この回転操作体の回転によりスライドして容器本体の開口部内周の施錠凹部に先端部を接離させる施錠バーとを含み、回転操作体を第一、第二の回転操作体に分割してこれらの相対する対向面にはカム形成用の第一、第二のカム部をそれぞれ形成し、これら第一、第二のカム部に施錠バーを揺動可能に支持させ、
蓋体を施錠する場合に、回転操作体を施錠方向に回転させてその第一、第二のカム部に施錠バーを追従させることにより、蓋体から容器本体の施錠凹部内に施錠バーの先端部を略非接触で突出させた後、蓋体の厚さ方向に施錠バーを移動させてその先端部を施錠凹部を形成する壁面に接触させるようにしたことを特徴としている。
また、蓋体に、施錠機構の施錠バー用の誘導突起を内蔵し、施錠バーの誘導突起に対向する対向部に支点部を形成し、これら誘導突起と支点部との接触部分を支点にして、施錠バーの先端部を蓋体の厚さ方向に傾斜させることができる。
第二の回転操作体は、第一の回転操作体の円筒形部材に嵌め合わされる円筒部材と、この円筒部材から張り出す外側フランジとを含み、円筒部材に、支持部材の複数の位置決め突起に接触する内側フランジを形成し、この内側フランジには、第一の回転操作体の第一の位置決め部に嵌め合わされる第二の位置決め部を設け、
施錠バーの末端部を第一、第二のカム部の間に揺動可能に挟み持たせ、この施錠バーの末端部に、第一の回転操作体の係合部にスライド可能に嵌まる嵌合部を設けることが可能である。
第二のカム部は、第二の回転操作体の外側フランジの一端部側に形成される第二水平カム面と、この第二水平カム面の端部に連続して円筒部材の周方向に向かうにしたがい徐々に高さが変化する第二傾斜カム面と、外側フランジの他端部側に形成されて第二傾斜カム面の端部に連続する第二係合カム面とを含み、第二傾斜カム面から第二係合カム面に向かうにしたがい張り出し量を徐々に小さくすることが可能である。
また、請求項3記載の発明によれば、誘導突起と支点部との接触部分を施錠バーの支点にするので、施錠バーの先端部を蓋体のカバープレート方向や蓋本体方向に容易に傾けることができる。
3 施錠穴(施錠凹部)
4 正面側壁面(開口部側の壁面)
10 蓋体
11 蓋本体
12 周壁
13 出没孔
15 包囲リブ
16 回転操作体用リブ
19 支持リブ(支持部材)
21 位置決め突起
22 長い位置決め突起
23 短い位置決め突起
24 施錠バー用リブ
25 直線リブ
26 誘導リブ(誘導突起)
30 カバープレート
32 キースロット
34 回転規制片(回転規制部材)
35 三角突起
40 施錠機構
41 回転操作体
42 第一の回転操作体
42A 第二の回転操作体
43 円板
44 操作孔
46 円弧溝(係合部)
48 位置制御片
49 円筒形リブ(円筒形部材)
50 位置合わせ切り欠き(第一の位置決め部)
51 第一のカム部
52 第一水平カム(第一水平カム面)
53 第一傾斜カム(第一傾斜カム面)
54 第一係合カム(第一係合カム面)
55 円筒リブ(円筒部材)
56 内側フランジ
57 位置合わせリブ(第二の位置決め部)
58 外側フランジ
60 第二のカム部
61 第二水平カム(第二水平カム面)
62 第二傾斜カム(第二傾斜カム面)
63 第二係合カム(第二係合カム面)
64 施錠バー
65 先端部
66 補強リブ
67 支点部
69 嵌合ピン(嵌合部)
80 蓋体開閉装置
81 操作キー
Claims (6)
- 基板を収納する容器本体と、この容器本体の開口部に嵌め合わされる蓋体と、容器本体の開口部に嵌め合わされた蓋体を施錠する施錠機構とを備えた基板収納容器であって、
施錠機構は、蓋体の外部から操作される回転操作体と、この回転操作体の回転によりスライドして容器本体の開口部内周の施錠凹部に先端部を接離させる施錠バーとを含み、回転操作体を第一、第二の回転操作体に分割してこれらの相対する対向面にはカム形成用の第一、第二のカム部をそれぞれ形成し、これら第一、第二のカム部に施錠バーを揺動可能に支持させ、
蓋体を施錠する場合に、回転操作体を施錠方向に回転させてその第一、第二のカム部に施錠バーを追従させることにより、蓋体から容器本体の施錠凹部内に施錠バーの先端部を略非接触で突出させた後、蓋体の厚さ方向に施錠バーを移動させてその先端部を施錠凹部を形成する壁面に接触させるようにしたことを特徴とする基板収納容器。 - 蓋体は、容器本体の開口部に嵌め合わされる蓋本体と、この蓋本体の開口面を被覆するカバープレートとを含み、これら蓋本体とカバープレートのいずれかに、施錠機構の回転操作体用の回転規制部材を設け、蓋本体の周壁に、容器本体の施錠凹部に対向する施錠バー用の出没孔を設けた請求項1記載の基板収納容器。
- 蓋体に、施錠機構の施錠バー用の誘導突起を内蔵し、施錠バーの誘導突起に対向する対向部に支点部を形成し、これら誘導突起と支点部との接触部分を支点にして、施錠バーの先端部を蓋体の厚さ方向に傾斜させるようにした請求項2記載の基板収納容器。
- 蓋体の蓋本体に、回転操作体を支持する支持部材を設けてその周面には長さの異なる複数の位置決め突起を形成し、長い位置決め突起を支持部材の高さと略同じ長さとするとともに、短い位置決め突起を支持部材の高さよりも短くした請求項2又は3記載の基板収納容器。
- 第一の回転操作体は、蓋体の蓋本体に内蔵されてカバープレートに対向する円板と、この円板の第二の回転操作体に対向する対向面に設けられる円筒形部材とを含み、円板の中心部に、カバープレートのキースロットに対向する操作孔を設けるとともに、円板の周縁部付近には、施錠バー用の係合部を形成し、円筒形部材の内周面を複数の位置決め突起のうち長い位置決め突起にのみ接触可能とし、円筒形部材の周壁には第一の位置決め部を設け、
第二の回転操作体は、第一の回転操作体の円筒形部材に嵌め合わされる円筒部材と、この円筒部材から張り出す外側フランジとを含み、円筒部材に、支持部材の複数の位置決め突起に接触する内側フランジを形成し、この内側フランジには、第一の回転操作体の第一の位置決め部に嵌め合わされる第二の位置決め部を設け、
施錠バーの末端部を第一、第二のカム部の間に揺動可能に挟み持たせ、この施錠バーの末端部に、第一の回転操作体の係合部にスライド可能に嵌まる嵌合部を設けた請求項4記載の基板収納容器。 - 第一のカム部は、第一の回転操作体の円板対向面に形成されて係合部に隣接する第一水平カム面と、係合部の周縁側部に設けられて係合部の一端部から他端部方向に向かうにしたがい徐々に高くなる第一傾斜カム面と、係合部の周縁他端部付近に設けられて第一傾斜カム面と一体化する第一係合カム面とを含み、第一傾斜カム面の最も低い低位部分を係合部の変曲点付近に位置させるとともに、最も高い高位部分を係合部の他端部近傍付近に位置させ、第一係合カム面を第一傾斜カム面の高位部分と略同じ高さとし、
第二のカム部は、第二の回転操作体の外側フランジの一端部側に形成される第二水平カム面と、この第二水平カム面の端部に連続して円筒部材の周方向に向かうにしたがい徐々に高さが変化する第二傾斜カム面と、外側フランジの他端部側に形成されて第二傾斜カム面の端部に連続する第二係合カム面とを含み、第二傾斜カム面から第二係合カム面に向かうにしたがい張り出し量を徐々に小さくした請求項5記載の基板収納容器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/131,120 US9387960B2 (en) | 2011-07-06 | 2012-07-03 | Substrate storing container |
KR1020137034467A KR101594235B1 (ko) | 2011-07-06 | 2012-07-03 | 기판 수납 용기 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-150284 | 2011-07-06 | ||
JP2011150284A JP5715898B2 (ja) | 2011-07-06 | 2011-07-06 | 基板収納容器 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013005740A1 true WO2013005740A1 (ja) | 2013-01-10 |
Family
ID=47437088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/066989 WO2013005740A1 (ja) | 2011-07-06 | 2012-07-03 | 基板収納容器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9387960B2 (ja) |
JP (1) | JP5715898B2 (ja) |
KR (1) | KR101594235B1 (ja) |
TW (1) | TWI599526B (ja) |
WO (1) | WO2013005740A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015033411A1 (ja) * | 2013-09-04 | 2015-03-12 | ミライアル株式会社 | 基板収納容器 |
WO2023017591A1 (ja) * | 2021-08-11 | 2023-02-16 | ミライアル株式会社 | 基板収納容器 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015025410A1 (ja) | 2013-08-22 | 2015-02-26 | ミライアル株式会社 | 基板収納容器 |
WO2015037083A1 (ja) * | 2013-09-11 | 2015-03-19 | ミライアル株式会社 | 基板収納容器 |
JP6326330B2 (ja) * | 2014-09-05 | 2018-05-16 | 株式会社Screenホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
WO2016046985A1 (ja) * | 2014-09-26 | 2016-03-31 | ミライアル株式会社 | 基板収納容器 |
SG11201707411QA (en) * | 2015-04-10 | 2017-10-30 | Shinetsu Polymer Co | Substrate storage container |
JP6584654B2 (ja) * | 2015-10-01 | 2019-10-02 | インテグリス・インコーポレーテッド | 改善された基板保持体およびドアラッチアシスト機構を備えた基板容器 |
JP6591297B2 (ja) * | 2016-01-20 | 2019-10-16 | 信越ポリマー株式会社 | 基板収納容器 |
TWM528296U (zh) * | 2016-05-02 | 2016-09-11 | Chung King Entpr Co Ltd | 閂鎖機構及具有該閂鎖機構的晶圓盒 |
CN107323990B (zh) * | 2017-08-28 | 2019-08-13 | 大连佳峰自动化股份有限公司 | 一种晶元盒运输车及其晶圆盒自动定位机构 |
CN112074944B (zh) * | 2018-04-25 | 2024-07-05 | 未来儿股份有限公司 | 基板收纳容器 |
JP6653788B1 (ja) * | 2018-06-12 | 2020-02-26 | ミライアル株式会社 | 基板収納容器 |
KR102253060B1 (ko) | 2019-05-07 | 2021-05-18 | 한국기계연구원 | 태양전지용 기능성 커버 |
TWI760258B (zh) * | 2020-08-12 | 2022-04-01 | 大立鈺科技有限公司 | 可伸縮收納機構以及可供該可伸縮收納機構容置的收納盒 |
KR20220129900A (ko) | 2021-03-17 | 2022-09-26 | 엘지전자 주식회사 | 태양 전지 패널 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08191100A (ja) * | 1995-01-09 | 1996-07-23 | Shinko Electric Co Ltd | 密閉コンテナ |
JP2001512288A (ja) * | 1997-08-01 | 2001-08-21 | フルオロウェア・インコーポレーテッド | ドア付きウェハーエンクロージャ |
WO2003010069A1 (fr) * | 2001-07-23 | 2003-02-06 | Kakizaki Manufacturing Co., Ltd. | Couvercle pour contenant de feuilles et contenant de feuilles |
JP2005101518A (ja) * | 2003-05-19 | 2005-04-14 | Miraial Kk | 薄板支持容器用蓋体 |
JP2007019328A (ja) * | 2005-07-08 | 2007-01-25 | Shin Etsu Polymer Co Ltd | 基板収納容器の蓋体開閉方法 |
JP2007191205A (ja) * | 2006-01-20 | 2007-08-02 | Shin Etsu Polymer Co Ltd | 収納容器の蓋体及び収納容器 |
JP2008098236A (ja) * | 2006-10-06 | 2008-04-24 | Shin Etsu Polymer Co Ltd | 蓋体及び基板収納容器 |
JP2010010598A (ja) * | 2008-06-30 | 2010-01-14 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8503232A (nl) * | 1984-12-11 | 1986-07-01 | Microtechnic Sa | Vergrendelingssysteem voor een verpakking. |
US4995430A (en) | 1989-05-19 | 1991-02-26 | Asyst Technologies, Inc. | Sealable transportable container having improved latch mechanism |
JP4115115B2 (ja) | 2001-10-29 | 2008-07-09 | 信越ポリマー株式会社 | 基板収納容器の蓋体係止機構 |
US6955382B2 (en) | 2002-01-15 | 2005-10-18 | Entegris, Inc. | Wafer carrier door and latching mechanism with c-shaped cam follower |
TWI239931B (en) * | 2003-05-19 | 2005-09-21 | Miraial Co Ltd | Lid unit for thin plate supporting container and thin plate supporting container |
US7624861B2 (en) * | 2004-10-14 | 2009-12-01 | Autotronic Plastics, Inc. | Benefit denial system for securing an asset within a container and method of use |
JP4540529B2 (ja) * | 2005-04-18 | 2010-09-08 | 信越ポリマー株式会社 | 収納容器 |
-
2011
- 2011-07-06 JP JP2011150284A patent/JP5715898B2/ja active Active
-
2012
- 2012-07-03 US US14/131,120 patent/US9387960B2/en active Active
- 2012-07-03 WO PCT/JP2012/066989 patent/WO2013005740A1/ja active Application Filing
- 2012-07-03 KR KR1020137034467A patent/KR101594235B1/ko active Active
- 2012-07-05 TW TW101124268A patent/TWI599526B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08191100A (ja) * | 1995-01-09 | 1996-07-23 | Shinko Electric Co Ltd | 密閉コンテナ |
JP2001512288A (ja) * | 1997-08-01 | 2001-08-21 | フルオロウェア・インコーポレーテッド | ドア付きウェハーエンクロージャ |
WO2003010069A1 (fr) * | 2001-07-23 | 2003-02-06 | Kakizaki Manufacturing Co., Ltd. | Couvercle pour contenant de feuilles et contenant de feuilles |
JP2005101518A (ja) * | 2003-05-19 | 2005-04-14 | Miraial Kk | 薄板支持容器用蓋体 |
JP2007019328A (ja) * | 2005-07-08 | 2007-01-25 | Shin Etsu Polymer Co Ltd | 基板収納容器の蓋体開閉方法 |
JP2007191205A (ja) * | 2006-01-20 | 2007-08-02 | Shin Etsu Polymer Co Ltd | 収納容器の蓋体及び収納容器 |
JP2008098236A (ja) * | 2006-10-06 | 2008-04-24 | Shin Etsu Polymer Co Ltd | 蓋体及び基板収納容器 |
JP2010010598A (ja) * | 2008-06-30 | 2010-01-14 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015033411A1 (ja) * | 2013-09-04 | 2015-03-12 | ミライアル株式会社 | 基板収納容器 |
JPWO2015033411A1 (ja) * | 2013-09-04 | 2017-03-02 | ミライアル株式会社 | 基板収納容器 |
WO2023017591A1 (ja) * | 2021-08-11 | 2023-02-16 | ミライアル株式会社 | 基板収納容器 |
Also Published As
Publication number | Publication date |
---|---|
KR20140041591A (ko) | 2014-04-04 |
TWI599526B (zh) | 2017-09-21 |
TW201328947A (zh) | 2013-07-16 |
KR101594235B1 (ko) | 2016-02-15 |
US20140138279A1 (en) | 2014-05-22 |
JP2013016743A (ja) | 2013-01-24 |
US9387960B2 (en) | 2016-07-12 |
JP5715898B2 (ja) | 2015-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5715898B2 (ja) | 基板収納容器 | |
KR101213373B1 (ko) | 수납 용기 | |
JP4573566B2 (ja) | 収納容器 | |
JP5361805B2 (ja) | 基板収納容器 | |
TWI691445B (zh) | 基板收納容器 | |
JP2014093381A (ja) | 基板収納容器 | |
KR101437351B1 (ko) | 박판수납용기용 도어 | |
JP4647417B2 (ja) | 基板収納容器の蓋体開閉方法 | |
JP5120668B2 (ja) | 精密基板収納容器およびその製造方法 | |
JP5918936B2 (ja) | 基板収納容器 | |
JP4592449B2 (ja) | 基板収納容器 | |
JP5268858B2 (ja) | 基板収納容器 | |
JP5268860B2 (ja) | 基板収納容器 | |
JP6591297B2 (ja) | 基板収納容器 | |
JP2004140395A (ja) | 精密基板収納容器 | |
JP5921371B2 (ja) | 基板収納容器 | |
JP2010182949A (ja) | 基板収納容器及び基板の取り出し方法 | |
TWM607246U (zh) | 閂鎖機構及具有該閂鎖機構的容器門與薄板容器 | |
JP2008112799A (ja) | ウエハ搬送容器の蓋体構造 | |
JP4917580B2 (ja) | 基板収納容器 | |
JP5912960B2 (ja) | 基板収納容器 | |
CN119110987A (zh) | 基板收纳容器 | |
JP2014093307A (ja) | 基板収納容器 | |
JP2018098320A (ja) | 基板収納容器用蓋体及び基板収納容器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12807758 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20137034467 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14131120 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12807758 Country of ref document: EP Kind code of ref document: A1 |