WO2013002424A1

WO2013002424A1 - Heat exchange units

Info

Publication number: WO2013002424A1
Application number: PCT/JP2012/067403
Authority: WO
Inventors: Hirokuni Akiyama; Hirohisa Kato
Original assignee: Kabushiki Kaisha Toyota Jidoshokki
Priority date: 2011-06-29
Filing date: 2012-06-29
Publication date: 2013-01-03
Also published as: JP2014130852A

Abstract

Embodiments of the present invention may include a heat exchange unit having a substrate with surfaces, an electronic element and a flow-channel-forming member. The electronic element is preferably provided on a first surface of the substrate. The flow-channel-forming member has one end and the other end. The one end is bonded to a second surface of the substrate, and the other end contacts on an inner surface of the case. Thus the flow-channel-forming member may form a flow channel between the second surface and the inner surface. The flow-channel-forming member further comprises a resilient portion. The resilient portion is elastically deformed while the one end is bonded to the second surface and the other end contacts on the inner surface of the case.

Description

DESCRIPTION

Title of Invention: HEAT EXCHANGE UNITS

Technical Field

[0001] Embodiments of the present invention relate to heat exchange units.

Background Art

[0002] In the related art, a heat exchange unit is known. The unit includes a case and a substrate with a Peltier element (Peltier module) in the case. The unit is configured to perform heat exchange between a fluid and the substrate in the case. A heat exchange unit described in Japanese Laid-Open Patent Publication 2007-154698 has fins provided on the substrate. The fins enhance the heat exchange efficiency between the substrate and the fluid.

[0003] However, in the related art described above, as is clear from the comparison between FIG. 7 and FIG. 8, warping of a substrate 130 may occur due to the generation of heat. When warping reduces the distance between the substrate 130 and an inner surface of a case 110, the fins 140 may be bent. In contrast, a space (marked "S" in the Figures) may be generated between distal ends 140b of the fins 140 and the inner surface of the case 110 when the distance between the substrate 130 and the inner surface of the case 110 is increased. In the interior of the case 110, the space "S" is a portion of a flow channel 112 where fluid flows and the fins 140 do not exist or alternatively do not extend to. The heat exchange performance may be lowered due to the space "S".

[0004] Therefore, there is a need for a heat exchange unit which can counteract any lowering of the heat exchange performance such as that which occurs during warping of the substrate occurs.

Summary of Invention _.

[0005] Certain embodiments of the present invention include a heat exchange unit having a substrate with surfaces, an electronic element and a flow-channel-forming member. The electronic element is preferably provided on a first surface of the substrate. The flow-channel-forming member has one end and the other end. The one end is bonded to a second surface of the substrate, and the other end contacts on an inner surface of the case. Thus the flow-channel-forming member may form a flow channel between the second surface and the inner surface. The flow-channel-forming member further comprises a resilient portion. The resilient portion is elastically deformed while the one end is bonded to the second surface and the other end contacts on the inner surface of the case.

[0006] Therefore, if heat generation leads to warping and thus a decreased distance between the substrate and the inner surface of the case, the resilient portion may be restored so as to cancel any resilient deformation. If heat generation leads to warping and thus a increased distance between the substrate and the inner surface of the case, the resilient portion may extend corresponding to the increased distance between the substrate and the inner surface of the case. Therefore, the generation of a space between the flow-channel-forming member and the inner surface of the case can be inhibited or reduced. Accordingly, the flow-channel-forming member allows heat exchange between the substrate and the case, and hence any lowering of the heat exchange performance can be inhibited.

Brief Description of Drawings

[0007] FIG. 1 is a schematic view of a case and a Peltier module in a heat exchange unit of one configuration before the module is assembled in the case;

FIG. 2 is a schematic view of the case and the Peltier module assembled in the case;

FIG. 3 is a schematic view of the case and the Peltier module when substrates are warped; FIG. 4 is a schematic view of a case and a Peltier module in a heat exchange unit of another configuration;

FIG. 5 is a schematic view of a case and a Peltier module in a heat exchange unit of the other configuration;

FIG. 6 is a schematic view of a case and a Peltier module in a heat exchange unit of the other configuration;

FIG. 7 is a schematic view of a case and a Peltier module in a heat exchange unit of a prior art; and

FIG. 8 is a schematic view of the case and the Peltier module in the heat exchange unit of the prior art when substrates are warped.

Description of Embodiments

[0008] Each of the additional features and teachings disclosed above and below may be utilized separately or in conjunction with other features and teachings to provide improved heat exchange units. Representative examples of the present invention, which utilize many of these additional features and teachings both separately and in conjunction with one another, will now be described in detail with reference to the attached drawings. This detailed description is merely intended to teach a person of ordinary skill in the art further details for practicing preferred aspects of the present teachings and is not intended to limit the scope of the invention. Only the claims define the scope of the claimed invention. Therefore, combinations of features and steps disclosed in the following detailed description may not be necessary to practice the invention in the broadest sense, and are instead taught merely to particularly describe representative examples of the invention. Moreover, various features of the representative examples and the dependent claims may be combined in ways that are not specifically enumerated in order to provide additional useful configurations of the present teachings.

[0009] Embodiments of the present invention will be described with reference to FIGS. 1 to 3. A heat exchange unit 1 preferably includes a case 10 and a Peltier module 20 positioned in the case 10.

[0010] The case 10 may be formed into a box shape so as to allow positioning of the Peltier module 20 in the case 10. The case 10 preferably includes a flow channel 12 which allows fluid to flow therein.

[0011] As shown in FIG. 1, the Peltier module 20 may include a pair of substrates 30, a plurality of Peltier elements 32 and a plurality of fins 40. The Peltier elements (electronic elements) 32 may be placed so as to be clamped between the inner surfaces of the pair of substrates 30. The fins 40 are preferably bonded in an upright manner on the outer surfaces of the pair of substrates 30.

[0012] In the Peltier module 20, when a DC current is allowed to flow through the Peltier elements 32, a heat absorbing action occurs in one of the upper or lower surfaces of the substrates 30 (for example, an upper surface), while a heat radiating action occurs on the other surface (for example, a lower surface). Accordingly, the Peltier module 20 is capable of heating or cooling a fluid by exchanging heat with the fluid flowing in the flow channel 12 in the case 10. The fins 40 improve heat exchange performance.

[0013] Each of the fins 40 may include a proximal end 40a, a distal end 40b and a bent portion 42 as shown in FIGS. 1 to 3. The proximal end 40a is preferably attached to the substrates 30. The distal end 40b is preferably placed near an inner surface of the case 10. The bent portion 42 may be formed at a midpoint between the proximal end 40a and the distal end 40b. The upper and lower fins 40 may be bent in the direction opposite from each other. In other words, the upper fins 40 may be bent so that the bent portion 42 projects toward the left and the lower fins 40 may be bent so that the bent portion 42 projects toward the right. [0014] The upper and lower fins 40 preferably include a length, which is a distance L between the proximal end 40a and the distal end 40b in a free state as shown in FIG. 1. In the free state any force isn't applied to the fin 40. Distance L is longer than a distance LI shown in FIG. 2 (distance L > distance LI). LI is obtained by subtracting a thickness T (a thickness of the substrates 30 and the Peltier elements 32) from a distance D (an inner diameter of the case 10) and then divided in half. The inner diameter of the case 10 is a distance between the inner surfaces of the case 10. The inner surfaces face each other. Each of the inner surfaces is contacted with each distal ends 40b of the fins 40.

[0015] As shown in FIG. 2, the heat exchange unit 1 is completed by positioning the Peltier module 20 in the case 10. The distal ends 40b of the fins 40 in the case 10 are preferably pressed by the inner surface of the case 10 because of the fact that the distance L is greater than the distance LI . Therefore, the fins 40 can be bent starting at the bent portions 42 between the proximal ends 40a and the distal ends 40b. In other words, the fins 40 may be resiliently deformed when a pressing force is applied, resulting in the substrates 30 and the inner surface of the case 10 being sandwiched together.

[0016] As shown in FIGS. 2, and 3 and described above, the heat exchange unit 1 preferably includes substrates 30, Peltier elements (electronic elements) 32 and fins 40 as a flow-channel-forming member. The Peltier elements 32 may be provided on a first surface of the substrates 30. The fins 40 (flow-channel-forming member) may have one end (proximal end) 40a and the other end (distal end) 40b. The one end 40a is bonded to a second surface of the substrate 30, and the other end 40b contacts on an inner surface of the case 10. Thus the fins 40 may form a flow channel 12 between the second surface and the inner surface as the flow-channel-forming member. Each of the fins 40 further comprises a bent portion 42 as a resilient portion. The resilient portion is elastically deformed while the one end 40a is bonded to the second surface and the other end 40b contacts on the inner surface of the case 10.

[0017] The generation of heat can cause warping of the substrates 30. If this warping leads to a decreased distance between the substrate 30 and the inner surface of the case 10, the resilient portion (bent portion 42) can resist the resilient deformation. If this warping leads to an increased distance between the substrate 30 and the inner surface of the case 10, the resilient portion (bent portion 42) may extend corresponding to the increased distance between the substrate 30 and the inner surface of the case 10. In this manner, the generation of a potential space "S" between the fins 40 and the inner surface of the case 10 can be inhibited or reduced. Accordingly, the resilient portion (bent portion 42) can continue to enhance the heat exchange between the substrate and the case 10 and the performance of the heat exchange unit can be maintained.

[0018] The resilient portions may be included as a part of the fins 40. Their composition may take many configurations. For example, the resilient portions may be included as a whole of the fins 40. Alternatively, the elastic portion may be included other flow-channel-forming member than fins 40. The flow-channel-forming member extends from one surface of the substrate 30 to an inner surface of the case 10 so as to form a flow channel. The elastic portion may be included as a part of the other flow-channel-forming member or a whole of the other flow-channel- forming member.

[0019] The fins 40 may each have a bent portion 42 between the proximal end 40a and the distal end 40b as the resilient portion. The bent portion 42 facilitates the resilient deformation of the fins 40. As shown in FIG. 3, the fins 40 can be bent about the bent portion 42. The extension of the fins 40 can be restored about the bent portion 42 so as to resist the warping. Alternatively the fins 40 may extend corresponding to the increased distance between the substrate 30 and the inner surface of the case 10. In this way, generation of any space "S" between the distal end 40b of the fins 40 and the inner surface of the case 10 can be inhibited or reduced.

[0020] While the embodiments of invention have been described with reference to specific configurations, it will be apparent to those skilled in the art that many alternatives, modifications and variations may be made without departing from the scope of the present invention. Accordingly, embodiments of the present invention are intended to embrace all such alternatives, modifications and variations that may fall within the spirit and scope of the appended claims. For example, embodiments of the present invention should not be limited to the representative configurations, but may be modified, for example, as described below.

[0021] The heat exchange unit may have a configuration shown in FIG. 4 instead of the configurations shown in FIGS. 2, and 3. The heat exchange unit 2 shown in FIG 4 preferably has fins 40. The fins 40 each preferably have an arc shape portion as a resilient portion. The arc shape portion locates between the proximal end 40a and the distal end 40b. The distal ends 40b of the fins 40 are pressed by the inner surface of the case 10 in a similar manner as the fins 40 shown in FIG. 3. As a result, the arc shape portions of fins 40 are elastically deformed. [0022] Similar to the heat exchange unit 1 shown in FIG. 3, the heat exchange unit 2 shown in FIG. 4 inhibits a decrease in the performance of the heat exchange unit. It also allows for easy assembly of the Peltier module 20 into the case 10.

[0023] As shown in FIG. 4, the fins 40 of the Peltier module 20 preferably each have an arc shape between the proximal end 40a and the distal end 40b. Fluid flowing in the flow channel 12 in the case 10 can flow smoothly through the arced passageways.

[0024] As shown in FIG. 4, the arc shape portions (resilient portions) may be included as a whole of the fins 40. Their composition may take many configurations. For example, the arc shape portions may be included as a part of the fins 40. Alternatively, the arc shape portions may be included other flow-channel-forming member than fins 40. The flow-channel-forming member extends from one surface of the substrate 30 to an inner surface of the case 10 so as to form a flow channel. The arc shape portion may be included as a part of the other flow-channel-forming member or a whole of the other flow-channel-forming member.

[0025] A heat exchange unit 3 may have a configuration as shown in FIG. 5. The heat exchange unit 3 preferably has fins 40, with a substantially linear shape between the proximal end 40a and the distal end 40b. When the Peltier module 20 is inserted into the case, the distal ends 40b of the fins 40 are pressed by the inner surface of the case 10. As a result, the fins 40 are elastically deformed at the proximal ends 40a. The fins 40 are preferably resiliently inclined with respect to the substrate 30. In other words, the fins 40 have the proximal ends 40a as resilient portions.

[0026] The heat exchange unit 3 shown in FIG. 5 also inhibits any decrease in the performance of the heat exchange unit and allows for easy positioning of the Peltier module 20 into the case 10.

[0027] A heat exchange unit 4 may have a configuration as shown in FIG. 6. The heat exchange unit 4 shown in FIG. 6 preferably has plurality of bent fins 40 as resilient portions. The fins 40 may bend in alternating left and right directions in FIG. 6. In other words, the fins 40 may bend in the direction that a bent inner surface of first fin 40 is apart from a bent inner surface of second fin 40 locating next to the first fin 40.

[0028] The heat exchange unit 4 shown in FIG. 6 inhibits any decrease in performance of the heat exchange unit and allows for easy positioning of the Peltier module 20 into the case 10.

[0029] The bent portions 42 of the fms 40 shown in FIGS. 2 and 3, the curved portions of the fins 40 shown in FIG. 4, the proximal ends 40a of the fins 40 shown in FIG. 5, and the bent portions 42 of the fins 40 shown in FIG. 6 may be configured in various manners. For example, they may be bent or curved prior to the reception of the pressing force. Alternatively, they may stand straight before any pressing force is applied and then thereafter bent or curved by the pressing force.

Claims

[Claim 1] A heat exchange unit comprising:

a substrate having a first surface and a second surface;

an electronic element provided on the first surface;

a case configured to accommodate the substrate; and

a flow-channel-forming member having one end bonded to the second surface and the other end contacting on an inner surface of the case so as to form a flow channel between the second surface and the inner surface;

wherein the flow-channel-forming member comprises a resilient portion, and the resilient portion is elastically deformed while the one end is bonded to the second surface and the other end contacts on the inner surface of the case.

[Claim 2] A heat exchange unit as in claim 1, wherein the resilient portion is a bent portion or a curve shape portion provided between the one end bonded to the second surface and the other end contacting on the inner surface of the case.