WO2013002165A1 - 脆性的な部材を切断する装置、方法、および切断された脆性的な部材 - Google Patents
脆性的な部材を切断する装置、方法、および切断された脆性的な部材 Download PDFInfo
- Publication number
- WO2013002165A1 WO2013002165A1 PCT/JP2012/066118 JP2012066118W WO2013002165A1 WO 2013002165 A1 WO2013002165 A1 WO 2013002165A1 JP 2012066118 W JP2012066118 W JP 2012066118W WO 2013002165 A1 WO2013002165 A1 WO 2013002165A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- region
- gas
- baffle
- nozzle
- gap
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000002826 coolant Substances 0.000 claims abstract description 27
- 238000001816 cooling Methods 0.000 claims abstract description 22
- 239000003595 mist Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 abstract description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000007921 spray Substances 0.000 abstract 2
- 239000007789 gas Substances 0.000 description 34
- 230000035939 shock Effects 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
Definitions
- the present invention relates to an apparatus and method for cutting a brittle member such as glass, and a cut brittle member.
- a brittle member such as a glass plate can be cut by applying a thermal shock without using a cutting tool.
- a thermal shock is applied by applying heat to a glass plate by a local heating means such as a laser beam and injecting a cooling medium to the part that has received such local heating, the part that has received such a thermal shock causess cleavage. Therefore, if the region that receives the laser beam irradiation and the region that receives the jet of the cooling medium are brought close to each other appropriately and the glass plate is sent from the former region to the latter region at an appropriate speed, the region that receives the thermal shock can be obtained. Since it extends in a straight line, the glass plate is cut along the straight line.
- Patent Document 1 discloses related technology.
- Coolant splash or mist or waste liquid flowing on the glass plate absorbs the laser beam by entering the region through which the laser beam passes. In order to compensate for this, it is necessary to adjust the output of the laser oscillator, which increases the process control labor and is a factor that requires a laser oscillator with a higher output.
- an apparatus for cutting a brittle member such as glass comprises a laser oscillator configured to irradiate a first region on the member with laser light through a first space; A cooling nozzle configured to inject a cooling medium into a second region different from the first region, and a cooling nozzle arranged to have a gap with respect to the member and not to surround the first space A baffle that is directed to divert the splash and mist flow from the second region away from the first space, and a gas nozzle configured to inject gas toward the gap.
- the first region on the member is irradiated with laser light from the laser oscillator through the first space, and the first region is cooled by the cooling nozzle.
- a baffle that injects a cooling medium into a second area different from the area of the first area and that has a gap with respect to the member and does not surround the first space is formed by splashes and mist from the second area. The flow of air is directed away from the first space, and gas is injected from the gas nozzle toward the gap.
- FIG. 1A is a schematic side view of a cutting device according to an embodiment of the present invention.
- FIG. 1B is a plan view of a member to be cut, illustrating a laser irradiation region and a cooling region.
- FIG. 2 is a schematic side view of a cutting apparatus according to a modification.
- FIG. 3A is a schematic side view of a cutting device according to another modification.
- FIG. 3B is a plan view of the member to be cut, and illustrates the arrangement of the baffles overlapping the laser irradiation region and the cooling region.
- FIG. 4 is a schematic side view of a cutting device according to still another modification.
- FIG. 5A is a plan view showing an example of arrangement of a member to be cut, a laser oscillator, and a gas nozzle.
- FIG. 5B is a plan view illustrating another example of the arrangement of the member to be cut, the laser oscillator, and the gas nozzle.
- the apparatus according to the present embodiment can be suitably used for cutting a glass plate, but of course can be used for cutting other brittle members.
- a case where the glass plate 2 is cut is taken as an example, but this is only an example and is not limited to the present invention.
- the term “splash” generally means a droplet that scatters
- the term “mist” includes mist and fine droplets that are close to mist and have a floating property. Means.
- the apparatuses 1, 1A, 1B, and 1C for cutting the glass plate 2 irradiate the glass plate 2 with the table 3 on which the glass plate 2 is placed.
- a laser oscillator 4 a cooling nozzle 5 for injecting a cooling medium, baffles (6) or 6t or 8, and a gas nozzle 7 for injecting a gas.
- the baffle 6t also serves as a gas nozzle.
- the table 3 is provided with appropriate conveying means so that the glass plate 2 can be sent in the direction indicated by the arrow A, for example.
- the glass plate 2 may be fixed, and the laser oscillator 4, the cooling nozzle 5 and other elements may be sent in the direction opposite to the arrow A. If the distance to the laser oscillator 4 is stable, a levitating conveyance device may be used.
- a levitating conveyance device may be used.
- the laser oscillator 4 for example, a carbon dioxide laser oscillator having an output of 100 to several hundred W can be suitably used, or a laser oscillator with another output range or another oscillation mechanism can be used.
- the arrangement of the laser oscillator 4 is preferably an arrangement in which the laser beam 40 is irradiated from an oblique direction that makes an appropriate angle with respect to the glass plate 2 in order to avoid the laser beam reflected by the glass plate 2.
- the laser beam 40 can be irradiated with a certain width, and therefore the region 41 (first space) through which the laser beam 40 passes is drawn with a width in the figure.
- Reference numeral 22 is a region (first region) irradiated with the laser beam 40 on the glass plate 2.
- the cooling nozzle 5 is a nozzle that injects the cooling medium 50.
- water can be used as the cooling medium 50, which is advantageous in that it is inexpensive and easily available.
- alcohol, dry ice, nitrogen, argon, or the like can be used instead of water.
- These can be used in any form of a liquid phase, a gas phase, and a mist conveyed by a gas, if possible.
- the cooling medium 50 is inevitably injected with a certain width 51 and is injected into the region 23 (second region) in the glass plate 2. Referring to FIG. 1B, the region 23 where the cooling medium 50 is ejected is appropriately separated in the direction of arrow A, unlike the region 22 where the laser beam 40 is irradiated.
- the glass plate 2 Since the glass plate 2 is fed in the direction of the arrow A, after being heated in the region 22, it is immediately cooled in the region 23, thereby giving a thermal shock. In advance, scoring is performed on the end portion of the glass plate 2 with a diamond cutter or the like as a starting point of cutting. If the glass plate 2 is sent so that the planned cutting line 20 passes through both the regions 22 and 23, a thermal shock is given to the glass plate 2 along this. Accordingly, the glass plate 2 is cut along the planned cutting line 20 as a solid line 25.
- the cooling nozzle 5 can be arrange
- ⁇ is an appropriate angle exceeding 0 degree and less than 90 degrees.
- the baffle 6 is arranged for the purpose of diverting the splash or mist flow 52 from the region 22 irradiated with the laser beam 40.
- the baffle 6 can be appropriately disposed in light of such a purpose, for example, it can be selected to be disposed between the region 22 and the region 23 or between the region 41 and the region 51 as illustrated.
- the baffle 6 can be appropriately tilted in view of the purpose of deflecting the splash or mist flow 52, but should be selected so as not to interfere with the region 41 through which the laser light 40 passes.
- the baffle 6 is, for example, a flat plate or a curved plate.
- the baffle 6 may be a cylinder closed as shown in FIG. 3B, with the curved surface going around and having one edge connected to the other edge.
- the baffle 6 may be a curved plate that is not closed all around.
- the region 41 through which the laser beam 40 passes is not surrounded by the baffle 6, and the side of the region 41 and preferably the rear side (in the direction opposite to the arrow A) are also open.
- the baffle 6 does not prevent heat from the laser light 40 from being radiated to the outside. That is, the heat generated by the laser beam 40 does not stay around the region 22, so that the heat effect is concentrated on the region 22 and is not blurred. This is advantageous in that the cutting line 25 can be accurately aligned with the planned cutting line 20.
- a means for shielding the laser beam may be provided at a position sufficiently away from the region 22 or the region 41 for the purpose of protecting surrounding workers or devices.
- the gas nozzle 7 is directed to inject the gas 70 toward the gap.
- the region in which the gas 70 is injected is between the region 22 and the region 23 and is a region denoted by reference numeral 24 in FIG. 1B.
- Ordinary air can be used as the gas ejected from the nozzle 7, but other gas such as nitrogen or argon may be used instead.
- the gas nozzle may be built in the baffle as shown in FIG.
- the hollow baffle 6t can flow the gas 70 through the internal cavity 6c, and also acts as a gas nozzle.
- the ejected gas 70 is ejected from the tip of the baffle 6t to a region between the region 22 and the region 23 in the gap below the baffle 6t, as described above.
- the gas nozzle 7 may be provided separately or may be omitted as shown.
- the gas nozzle 7 may be arranged to direct the gas 70 along the direction from the region 22 to the region 23 as shown in FIG. 5A. Such an arrangement is advantageous for keeping the splash or mist away from the region 22.
- the gas nozzle 7 may be arranged to direct the gas 70 in a direction having an angle of more than 0 degree and less than 90 degrees with respect to the direction from the area 22 to the area 23 as shown in FIG. 5B.
- Such an arrangement is advantageous for the waste liquid treatment of the cooling medium 50 because the gas 70 flows so as to push the cooling medium 50 on the glass plate 2 to the side and eliminate it.
- the gas 70 is unlikely to enter the lower side of the glass plate 2. This arrangement is advantageous in that the gas 70 that has entered the lower side of the glass plate 2 does not disturb the flying height of the glass plate 2 particularly when a levitating conveyance device is used as the conveying means.
- end 60 facing the glass plate 2 in the baffle 6 or the end 82 facing the glass plate 2 in the cylindrical body 8 may be provided with tapers 61 and 84 as shown in FIGS.
- the tapers 61 and 84 guide the gas 70 in the direction toward the region 23, and particularly guide the gas so as to exclude the cooling medium 50 from the glass plate 2.
- the baffle When the baffle is a closed cylindrical body 8 as shown in FIGS. 3A and 3B, the upper part thereof may be closed. Even in this case, the lower part is opened as shown, and a gap is secured between the lower end 83 and the glass plate 2.
- the cooling nozzle 5 and the cylindrical body 8 When the upper part is closed, the cooling nozzle 5 and the cylindrical body 8 may be in close contact with each other.
- a through hole 81 may be provided in the side wall 80 or other part.
- the through hole 81 is useful for discharging splash or mist to the outside. Or you may connect with the through-hole 81 and provide a suction device. Both are effective in preventing the splash or mist flow 52 from leaking into the region 22.
- the positions and inclinations of the laser oscillator 4, the cooling nozzle 5, the baffle 6 and the gas nozzle 7 do not have to be fixed, and appropriate adjusting means such as a micrometer may be provided to adjust them.
- an appropriate recovery circuit may be provided so that the cooling medium can be reused.
- the procedure for cutting the glass plate 2 is as follows.
- the glass plate 2 to be cut is provided with the scoring 21 as described above at one end of the planned cutting line 20 or at any point on the line.
- the glass plate 2 is fixed on the table 3, and the laser beam 40 is irradiated to the region 22 on the glass plate 2 while being sent in the direction of arrow A at a controlled speed.
- a cooling medium 50 is injected into the region 23.
- the gas 70 is injected toward the gap below the baffle 6 in synchronization with the irradiation of the laser light 40 or the injection of the cooling medium 50.
- the splash or mist of the cooling medium does not enter the region where the laser beam passes or is irradiated. Therefore, the laser beam is not absorbed by the cooling medium. It is not necessary to adjust the output of the laser oscillator in order to compensate for the loss of the laser light, reducing the labor for process management, and does not require a laser oscillator with a higher output.
- An apparatus that cuts a brittle member and that reduces the loss of laser light is provided.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
2 ガラス板
3 テーブル
4 レーザ発振器
5 冷却ノズル
6,6t バッフル
6c 空洞
7 気体ノズル
8 円筒体
22 領域(第1の領域)
23 領域(第2の領域)
41 領域(第1の空間)
51 領域
61,84 テーパ
Claims (13)
- 脆性的な部材を切断する装置であって、
前記部材上の第1の領域にレーザ光を第1の空間を通して照射するべく構成されたレーザ発振器と、
前記第1の領域とは異なる第2の領域に冷却媒体を噴射するべく構成された冷却ノズルと、
前記部材に対して間隙を有するべく且つ前記第1の空間を囲まない状態に置くべく配置され、前記第2の領域からの飛沫及びミストの流れを前記第1の空間から逸らすように向けられたバッフルと、
前記間隙に向けて気体を噴射するべく構成された気体ノズルと、
を備えた装置。 - 請求項1に記載された装置であって、前記バッフルは前記間隙に向いたテーパ端を備える装置。
- 請求項1に記載された装置であって、前記バッフルは、平板、閉じていない曲面板、および前記冷却ノズルを囲むべく寸法づけられた円筒板、よりなる群より選択された一である装置。
- 請求項1に記載された装置であって、前記第1の領域から前記第2の領域へ向かう方向に沿って前記気体を方向づける配置と、前記第1の領域から前記第2の領域へ向かう方向に対して0度を越えて90度未満の角度を有する方向に前記気体を方向づける配置と、よりなる群より選択された何れかの配置に、前記気体ノズルが置かれている装置。
- 請求項1に記載された装置であって、前記気体ノズルは前記バッフルに内蔵されている装置。
- 請求項1に記載された装置であって、前記冷却ノズルは、前記部材の表面に対して直交する方向と、前記部材の表面に対して前記第1の領域へ0度を越えて90度未満に傾いた方向と、よりなる群より選択された何れかの方向から前記冷却媒体を噴射するべく配置されている装置。
- 脆性的な部材を切断する方法であって、
レーザ発振器より前記部材上の第1の領域にレーザ光を第1の空間を通して照射し、
冷却ノズルより前記第1の領域とは異なる第2の領域に冷却媒体を噴射し、
前記部材に対して間隙を有し且つ前記第1の空間を囲まない状態に置くバッフルを、前記第2の領域からの飛沫及びミストの流れを前記第1の空間から逸らすように向け、
気体ノズルより前記間隙に向けて気体を噴射する、
ことよりなる方法。 - 請求項7に記載された方法であって、前記バッフルに前記間隙に向いたテーパ端を設けることを、さらに含む方法。
- 請求項7に記載された方法であって、前記バッフルを、平板、閉じていない曲面板、および前記冷却ノズルを囲むべく寸法づけられた円筒板、よりなる群より選択された一とすることを、さらに含む方法。
- 請求項7に記載された方法であって、前記第1の領域から前記第2の領域へ向かう方向に沿って前記気体を方向づける配置と、前記第1の領域から前記第2の領域へ向かう方向に対して0度を越えて90度未満の角度を有する方向に前記気体を方向づける配置と、よりなる群より選択された何れかの配置に、前記気体ノズルを置くことを、さらに含む方法。
- 請求項7に記載された方法であって、前記気体ノズルを前記バッフルに内蔵することを、さらに含む方法。
- 請求項7に記載された方法であって、前記冷却ノズルを、前記部材の表面に対して直交する方向と、前記部材の表面に対して前記第1の領域へ0度を越えて90度未満に傾いた方向と、よりなる群より選択された何れかの方向から前記冷却媒体を噴射するべく配置することを、さらに含む方法。
- 請求項7乃至12の何れかに記載された方法により切断された脆性的な部材。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020137026869A KR101519867B1 (ko) | 2011-06-28 | 2012-06-25 | 취성적인 부재를 절단하는 장치 및 방법 |
JP2013522838A JP5765421B2 (ja) | 2011-06-28 | 2012-06-25 | 脆性的な部材を切断する装置、方法、および切断された脆性的な部材 |
CN201280031417.3A CN103619528B (zh) | 2011-06-28 | 2012-06-25 | 切断脆性构件的装置、方法以及被切断的脆性构件 |
US14/139,950 US20140113797A1 (en) | 2011-06-28 | 2013-12-24 | Device and method for cutting brittle member and cut-out brittle member |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-143035 | 2011-06-28 | ||
JP2011143035 | 2011-06-28 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/139,950 Continuation US20140113797A1 (en) | 2011-06-28 | 2013-12-24 | Device and method for cutting brittle member and cut-out brittle member |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013002165A1 true WO2013002165A1 (ja) | 2013-01-03 |
Family
ID=47424059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/066118 WO2013002165A1 (ja) | 2011-06-28 | 2012-06-25 | 脆性的な部材を切断する装置、方法、および切断された脆性的な部材 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20140113797A1 (ja) |
JP (1) | JP5765421B2 (ja) |
KR (1) | KR101519867B1 (ja) |
CN (1) | CN103619528B (ja) |
TW (1) | TWI496644B (ja) |
WO (1) | WO2013002165A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103803485A (zh) * | 2013-12-29 | 2014-05-21 | 北京工业大学 | 激光直写玻璃表面制备光学微结构的方法 |
JP2015047678A (ja) * | 2013-09-03 | 2015-03-16 | 昭和電工ガスプロダクツ株式会社 | 溶断装置 |
JP2018515411A (ja) * | 2015-03-27 | 2018-06-14 | ショット アクチエンゲゼルシャフトSchott AG | ガラスを連続的に分断するための方法と装置 |
WO2021107168A1 (ko) * | 2019-11-26 | 2021-06-03 | 이석준 | 레이저 절단 장치 및 방법 |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
EP3166895B1 (en) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Methods and apparatuses for laser processing materials |
EP3169635B1 (en) | 2014-07-14 | 2022-11-23 | Corning Incorporated | Method and system for forming perforations |
EP3536440A1 (en) | 2014-07-14 | 2019-09-11 | Corning Incorporated | Glass article with a defect pattern |
WO2016010954A2 (en) * | 2014-07-14 | 2016-01-21 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
WO2016010991A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
KR20170105562A (ko) | 2015-01-12 | 2017-09-19 | 코닝 인코포레이티드 | 다중 광자 흡수 방법을 사용한 열적 템퍼링된 기판의 레이저 절단 |
HUE055461T2 (hu) | 2015-03-24 | 2021-11-29 | Corning Inc | Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása |
DE102015104802A1 (de) | 2015-03-27 | 2016-09-29 | Schott Ag | Verfahren zum Trennen von Glas mittels eines Lasers, sowie verfahrensgemäß hergestelltes Glaserzeugnis |
KR20170131638A (ko) | 2015-03-27 | 2017-11-29 | 코닝 인코포레이티드 | 가스 투과성 유리창 및 이의 제작방법 |
DE102015104815A1 (de) | 2015-03-27 | 2016-09-29 | Schott Ag | Verfahren und Vorrichtung zum kontinuierlichen Trennen von Glas |
KR102499697B1 (ko) | 2015-07-10 | 2023-02-14 | 코닝 인코포레이티드 | 유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품 |
US11111170B2 (en) | 2016-05-06 | 2021-09-07 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
EP3490945B1 (en) | 2016-07-29 | 2020-10-14 | Corning Incorporated | Methods for laser processing |
JP2019532908A (ja) | 2016-08-30 | 2019-11-14 | コーニング インコーポレイテッド | 強度マッピング光学システムによる材料のレーザー切断 |
CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
JP6852572B2 (ja) * | 2017-06-01 | 2021-03-31 | トヨタ自動車株式会社 | レーザ溶接装置 |
US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
US20190062196A1 (en) * | 2017-08-25 | 2019-02-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using an afocal beam adjustment assembly |
US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
DE102018200030B3 (de) * | 2018-01-03 | 2019-05-09 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Abschwächen oder Verstärken von laserinduzierter Röntgenstrahlung |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
CN112828474B (zh) * | 2020-12-31 | 2022-07-05 | 武汉华工激光工程有限责任公司 | 用于透明脆性材料的斜向切割补偿方法及系统 |
KR102791467B1 (ko) * | 2022-11-25 | 2025-04-08 | 한국원자력연구원 | 시트빔 기반 레이저 절단 헤드 |
KR102741591B1 (ko) * | 2023-02-09 | 2024-12-12 | 계명대학교 산학협력단 | 레이저와 냉각장치를 이용한 열처리 장치 및 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005247600A (ja) * | 2004-03-01 | 2005-09-15 | Shibaura Mechatronics Corp | 脆性材料の割断加工システム及びその方法 |
JP2008503355A (ja) * | 2004-06-21 | 2008-02-07 | アプライド フォトニクス,インク. | 基板材料の切断、分断または分割装置、システムおよび方法 |
JP2008049375A (ja) * | 2006-08-25 | 2008-03-06 | Shibaura Mechatronics Corp | 割断装置および割断方法 |
JP2010173316A (ja) * | 2009-02-02 | 2010-08-12 | Institute Of National Colleges Of Technology Japan | スクライブ加工装置及びスクライブ加工方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1284082B1 (it) * | 1996-06-27 | 1998-05-08 | Calp Spa | Metodo e dispositivo per il taglio mediante un raggio laser di articoli cavi in vetro |
US6407360B1 (en) * | 1998-08-26 | 2002-06-18 | Samsung Electronics, Co., Ltd. | Laser cutting apparatus and method |
AU1096701A (en) * | 1999-11-12 | 2001-06-06 | P.T.G. Precision Technology Center Llc | Laser glass cutting with super cooled gas chill |
CN1976778A (zh) * | 2004-06-21 | 2007-06-06 | 应用光电技术公司 | 用于切割、分裂或分离衬底材料的装置、系统和方法 |
CN101563184A (zh) * | 2007-03-16 | 2009-10-21 | 夏普株式会社 | 塑料基板的切割方法及塑料基板的切割装置 |
JP2010089143A (ja) * | 2008-10-10 | 2010-04-22 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の割断方法及び割断装置 |
-
2012
- 2012-06-25 JP JP2013522838A patent/JP5765421B2/ja active Active
- 2012-06-25 WO PCT/JP2012/066118 patent/WO2013002165A1/ja active Application Filing
- 2012-06-25 CN CN201280031417.3A patent/CN103619528B/zh active Active
- 2012-06-25 KR KR1020137026869A patent/KR101519867B1/ko active Active
- 2012-06-28 TW TW101123275A patent/TWI496644B/zh active
-
2013
- 2013-12-24 US US14/139,950 patent/US20140113797A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005247600A (ja) * | 2004-03-01 | 2005-09-15 | Shibaura Mechatronics Corp | 脆性材料の割断加工システム及びその方法 |
JP2008503355A (ja) * | 2004-06-21 | 2008-02-07 | アプライド フォトニクス,インク. | 基板材料の切断、分断または分割装置、システムおよび方法 |
JP2008049375A (ja) * | 2006-08-25 | 2008-03-06 | Shibaura Mechatronics Corp | 割断装置および割断方法 |
JP2010173316A (ja) * | 2009-02-02 | 2010-08-12 | Institute Of National Colleges Of Technology Japan | スクライブ加工装置及びスクライブ加工方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015047678A (ja) * | 2013-09-03 | 2015-03-16 | 昭和電工ガスプロダクツ株式会社 | 溶断装置 |
CN103803485A (zh) * | 2013-12-29 | 2014-05-21 | 北京工业大学 | 激光直写玻璃表面制备光学微结构的方法 |
JP2018515411A (ja) * | 2015-03-27 | 2018-06-14 | ショット アクチエンゲゼルシャフトSchott AG | ガラスを連続的に分断するための方法と装置 |
WO2021107168A1 (ko) * | 2019-11-26 | 2021-06-03 | 이석준 | 레이저 절단 장치 및 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2013002165A1 (ja) | 2015-02-23 |
TW201332693A (zh) | 2013-08-16 |
CN103619528B (zh) | 2015-09-09 |
TWI496644B (zh) | 2015-08-21 |
US20140113797A1 (en) | 2014-04-24 |
JP5765421B2 (ja) | 2015-08-19 |
CN103619528A (zh) | 2014-03-05 |
KR101519867B1 (ko) | 2015-05-13 |
KR20130133865A (ko) | 2013-12-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5765421B2 (ja) | 脆性的な部材を切断する装置、方法、および切断された脆性的な部材 | |
JP6255595B2 (ja) | 割断装置 | |
EP1018395B1 (en) | Laser machining apparatus | |
TWI406828B (zh) | Method for processing brittle material substrates | |
JP2000084686A (ja) | レーザピアシング方法およびレーザ加工用ノズルおよびレーザ切断装置 | |
JP2001287076A (ja) | レーザ切断機のピアシング装置 | |
JP2013063863A (ja) | ガラス板切断方法およびガラス板切断装置 | |
WO2018008400A1 (ja) | レーザ加工装置およびレーザ加工方法 | |
JP2012192420A (ja) | レーザ加工方法およびレーザ加工装置 | |
KR20130094173A (ko) | 취성 재료 기판의 할단 방법 | |
JP2008183599A (ja) | 高脆性非金属材料製の被加工物の加工方法及びその装置 | |
JP2013063864A (ja) | ガラス板切断方法およびガラス板切断装置 | |
JP2010173316A (ja) | スクライブ加工装置及びスクライブ加工方法 | |
JP2001062652A (ja) | レーザとウォータジェットの複合加工方法及び装置 | |
JP2019198885A (ja) | ハイブリッド溶接装置 | |
JP2008049375A (ja) | 割断装置および割断方法 | |
JP2010253752A (ja) | 脆性材料の割断装置および脆性材料の割断方法 | |
JP2846297B2 (ja) | レーザ切断方法 | |
JP5554158B2 (ja) | 脆性材料基板の割断方法 | |
JP5309890B2 (ja) | 溶接装置及び溶接方法 | |
KR20100007949A (ko) | 레이저 가공 방법 및 오일링용 선재 | |
JP2001113384A (ja) | レーザ切断方法及びレーザ切断装置 | |
JP2013166160A (ja) | レーザ溶接におけるシールドガスの噴出方法 | |
JP7272041B2 (ja) | レーザ切断方法、および、レーザ切断装置 | |
JP6512685B2 (ja) | レーザ切断方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12804699 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013522838 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20137026869 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12804699 Country of ref document: EP Kind code of ref document: A1 |