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WO2013067945A1 - Mèche de lampe à diodes électroluminescentes et dispositif d'éclairage utilisant une diode électroluminescente comme source de lumière - Google Patents

Mèche de lampe à diodes électroluminescentes et dispositif d'éclairage utilisant une diode électroluminescente comme source de lumière Download PDF

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Publication number
WO2013067945A1
WO2013067945A1 PCT/CN2012/084280 CN2012084280W WO2013067945A1 WO 2013067945 A1 WO2013067945 A1 WO 2013067945A1 CN 2012084280 W CN2012084280 W CN 2012084280W WO 2013067945 A1 WO2013067945 A1 WO 2013067945A1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting diode
light emitting
substrate
diode unit
insulating
Prior art date
Application number
PCT/CN2012/084280
Other languages
English (en)
Chinese (zh)
Inventor
赵依军
李文雄
Original Assignee
Zhao Yijun
Li Wenxiong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhao Yijun, Li Wenxiong filed Critical Zhao Yijun
Publication of WO2013067945A1 publication Critical patent/WO2013067945A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to semiconductor lighting technology, and more particularly to a light emitting diode wick and a lighting device using a light emitting diode as a light source. Background technique
  • LEDs Light-emitting diodes
  • the semiconductor wafer includes a PN structure. When a current passes, electrons are pushed toward the P region. In the P region, electrons recombine with holes, and then emit energy in the form of photons, and the wavelength of the light is formed by the material forming the PN structure. decided.
  • LEDs Compared with incandescent lamps and fluorescent energy-saving lamps, LEDs have many advantages such as environmental protection, recyclability, high luminous efficiency, rich color and dimming. Therefore, with the improvement of manufacturing processes, LED-based illumination sources will gradually become a mainstream light source.
  • heat dissipation can generally be improved by increasing the chip size and changing the material structure.
  • Cree uses a silicon carbide substrate that is nearly 20 times more thermally conductive than sapphire.
  • the substrate is a multi-layer structure, and the intermediate layer uses an insulating layer material having a high thermal conductivity, so that the thermal energy of the LED chip passes through the lower layer.
  • the aluminum plate spreads quickly and passes out.
  • the common heat dissipation strategy is to configure the LED fixture with heat dissipation components (such as fins, heat pipes, temperature equalization plates, loop heat pipes, and piezoelectric fans), so that the heat generated by the LEDs can be quickly dissipated by its rapid heat dissipation capability. In the surrounding environment.
  • heat dissipation components such as fins, heat pipes, temperature equalization plates, loop heat pipes, and piezoelectric fans
  • the application date and application number of the Chinese patent application "Light-emitting diode lamp heat dissipation structure" of November 9, 2004 and 200410052114.7 respectively disclose a light-emitting diode lamp heat dissipation structure including a line
  • the road driving illuminating board and the line control board, the line driving illuminating board is integrated with the LED array;
  • the line driving illuminating board is provided with a heat dissipating reflective aluminum plate, the lower part of which is coupled with a guiding heat dissipating layer, and the other side of the guiding heat dissipating layer is coupled with a heat dissipating Aluminum plate.
  • the above line control board may be wrapped with a conductive heat sink to further dissipate the heat generated when the line control board operates.
  • a light-emitting diode wick comprising:
  • At least one light emitting diode unit disposed on the first surface of the substrate to form heat conduction with the substrate;
  • a driving controller disposed on the second surface of the substrate, electrically connected to the at least one light emitting diode unit to provide a required operating current or operating voltage to the at least one light emitting diode unit, wherein the first The surface is the same or opposite to the second surface.
  • the insulating and thermally conductive substrate is composed of a ceramic material or a thermally conductive insulating polymer composite material.
  • a wiring layer formed on the first and second surfaces and electrically connected to the light emitting diode unit and the drive controller is further included.
  • the wiring layer is formed on the first and second surfaces by a printed circuit process.
  • the light-emitting diode unit is a light-emitting diode die that is fixed on the first surface and passes through a bonding process or a flip-chip on board (FCOB) process with the wiring layer Achieve electrical connections.
  • FCOB flip-chip on board
  • the light-emitting diode unit is a light-emitting diode unit electrically connected to the wiring layer by soldering.
  • the wiring layer is such that a plurality of the light-emitting diode units are connected in series, parallel, hybrid or cross-array.
  • the driving controller is in the form of a semiconductor wafer, which is fixed on the second surface and is implemented by a bonding process or a flip-chip (FCOB) process with the wiring layer. Electrical connections.
  • the drive controller is in the form of a package chip that is fixed to the second surface and electrically connected to the wiring layer by soldering.
  • At least one of the following circuits is further included: a sensing circuit, a dimming control circuit, a communication circuit, and a power factor correction circuit.
  • At least one of the circuits is integrated with the drive controller in the same semiconductor wafer or packaged chip.
  • the circuit is in the form of a semiconductor wafer fixed to the first or second surface of the substrate and passed through a bonding process or a flip chip (FCOB) on the wiring layer.
  • FCOB flip chip
  • the circuit is in the form of a package chip that is fixed to the first or second surface of the substrate and electrically connected to the wiring layer by a soldering process.
  • Still another object of the present invention is to provide an illumination device using a light-emitting diode as a light source, which has the advantages of excellent heat dissipation effect and low manufacturing cost.
  • a lighting device using a light emitting diode as a light source comprising:
  • a lamp housing including a heat sink
  • LED wick including:
  • An insulated thermally conductive substrate fixed to the heat dissipating member to form heat conduction between the substrate and the heat dissipating member;
  • At least one light emitting diode unit disposed on the first surface of the substrate to form heat conduction with the substrate;
  • a driving controller disposed on the second surface of the substrate, electrically connected to the at least one light emitting diode unit to provide a required operating voltage or operating current to the at least one light emitting diode unit, wherein the first Same as the second surface Or the opposite surface.
  • the substrate is fixed to the heat sink by means of a thermal conductive adhesive or a thermally conductive double-sided film.
  • the heat dissipating member is made of metal
  • the lamp housing further includes a lamp cap, and the heat dissipating member is connected to the lamp cap via an insulating member.
  • the heat dissipating member is made of a ceramic material or a thermally conductive insulating polymer composite material.
  • the insulating and thermally conductive substrate is made of a ceramic material or a heat conductive insulating polymer composite material.
  • a wiring layer formed on the first and second surfaces and electrically connected to the light emitting diode unit and the driving controller is further included.
  • the wiring layer is formed on the first and second surfaces by a printed circuit process.
  • the light emitting diode unit is a light emitting diode die fixed to the first surface and implemented by a bonding process or a flip chip (FCOB) process with the wiring layer Electrical connections.
  • FCOB flip chip
  • the light emitting diode unit is a light emitting diode unit electrically connected to the wiring layer by soldering.
  • the wiring layer is such that a plurality of the light emitting diode units are connected in series, in parallel, in a mixture or in a cross array.
  • the driving controller is in the form of a semiconductor wafer fixed to the second surface and electrically connected to the wiring layer by a bonding process or a flip chip (FCOB) process connection.
  • FCOB flip chip
  • the drive controller is in the form of a package chip that is fixed to the second surface and electrically connected to the wiring layer by soldering.
  • At least one of the following circuits is further included: a sensing circuit, a dimming control circuit, a communication circuit, and a power factor correction circuit.
  • At least one of the circuits is integrated in the same semiconductor wafer or package chip as the drive controller.
  • the circuit is in the form of a semiconductor wafer fixed to the first or second surface of the substrate and passed through a bonding process or board with the wiring layer
  • FCOB upper flip chip
  • the circuit is in the form of a packaged chip which is fixed to the first or second surface of the substrate and is electrically connected to the wiring layer by a soldering process.
  • the above object of the present invention can also be achieved by the following technical solutions:
  • a lighting device using a light emitting diode as a light source comprising:
  • a lamp housing including a heat sink
  • An insulating thermally conductive substrate fixed to the heat dissipating member to form heat conduction between the substrate and the heat dissipating member;
  • At least one light emitting diode unit disposed on a surface of the substrate to form heat conduction with the substrate;
  • a driving power supply module disposed in the lamp housing
  • the substrate is fixed to the heat sink by means of a thermal conductive adhesive or a thermally conductive double-sided film.
  • the substrate and the heat sink are integrally formed.
  • the heat dissipating member is made of metal
  • the lamp housing further includes a lamp cap, and the heat dissipating member is connected to the lamp cap via an insulating member.
  • the heat dissipating member is made of a ceramic material or a thermally conductive insulating polymer composite material.
  • the substrate is composed of a ceramic material or a thermally conductive insulating high molecular composite material.
  • the wiring layer is formed on a surface of the heat sink by a printed circuit process.
  • the light emitting diode unit is a light emitting diode die that is fixed on a surface of the heat sink and passes through a bonding process or a flip chip (FCOB) process with the wiring layer. Achieve electrical connections.
  • FCOB flip chip
  • the light emitting diode unit is a light emitting diode unit electrically connected to the wiring layer by soldering.
  • the wiring layer is such that a plurality of the light emitting diode units are connected in series, in parallel, in a hybrid or in a cross array.
  • the driving power supply module includes a power conversion circuit and a drive control circuit.
  • the driving power supply module further includes a dimming control circuit and a power factor correction circuit.
  • the above lighting device further comprising a sensing circuit and a communication circuit disposed inside the lamp housing or on the surface of the substrate.
  • a sensing circuit and a communication circuit disposed inside the lamp housing or on the surface of the substrate.
  • a lighting device using a light emitting diode as a light source comprising:
  • a lamp housing comprising an insulated heat conducting portion
  • At least one light emitting diode unit disposed on an outer surface of the insulated thermally conductive portion to form heat conduction with the insulated thermally conductive portion;
  • a drive power module disposed within the lamp housing
  • the insulating and thermally conductive portion is composed of a ceramic material or a heat conductive insulating polymer composite material.
  • the light emitting diode unit is a light emitting diode die fixed to an outer surface of the insulating heat conducting portion and passed through a bonding process or a flip chip (FCOB) on the wiring layer The process achieves an electrical connection.
  • FCOB flip chip
  • the light emitting diode unit is a light emitting diode unit electrically connected to the wiring layer by soldering.
  • the wiring layer is such that a plurality of the light emitting diode units are connected in series, in parallel, in a mixture or in a cross array.
  • the driving power supply module includes a power conversion circuit and a drive control circuit.
  • the driving power supply module further includes a dimming control circuit and a power factor correction circuit.
  • the above lighting device further comprising a sensing circuit and a communication circuit disposed inside the lamp housing or on an outer surface of the insulating and thermally conductive portion.
  • a sensing circuit and a communication circuit disposed inside the lamp housing or on an outer surface of the insulating and thermally conductive portion.
  • a lighting device using a light emitting diode as a light source comprising:
  • a lamp housing including a heat sink
  • a columnar body extending along a longitudinal axis of the lamp envelope, which is composed of an insulating and thermally conductive material and one of which is fixed to the heat dissipating member to form heat conduction between the columnar body and the heat dissipating member;
  • At least one light emitting diode unit disposed on an outer surface of the columnar body to form heat conduction with the columnar body;
  • a drive power module disposed within the lamp housing
  • a wiring layer formed on the outer surface of the columnar body electrically connects the light emitting diode unit to the driving power source module.
  • the insulating heat conductive material is a ceramic material or a heat conductive insulating polymer composite material.
  • one of the ends of the columnar body is adhered to the heat sink by a heat transfer adhesive.
  • the columnar body is integrally formed with the heat sink.
  • the light emitting diode unit is a light emitting diode die that is fixed on an outer surface of the column and passes through a bonding process or a flip chip (FCOB) on the wiring layer. The process achieves an electrical connection.
  • the light emitting diode unit is a light emitting diode unit electrically connected to the wiring layer by soldering.
  • the wiring layer is such that a plurality of the light emitting diode units are connected in series, in parallel, in a mixture or in a cross array.
  • the driving power supply module includes a power conversion circuit and a drive control circuit.
  • the driving power supply module further includes a dimming control circuit and a power factor correction circuit.
  • the above lighting device further comprising a sensing circuit and a communication circuit disposed inside the lamp housing or the columnar body to the outer surface. It is still another object of the present invention to provide a light emitting diode wick suitable for use with a light
  • the shells are assembled together to provide a lighting device that is excellent in heat dissipation and low in manufacturing cost.
  • a light-emitting diode wick comprising:
  • a printed wiring board comprising an insulating layer and a wiring layer formed on the first and second surfaces of the insulating layer;
  • At least one light emitting diode unit disposed on the first surface of the insulating layer and electrically connected to the wiring layer;
  • a drive controller disposed on the second surface of the substrate, electrically coupled to the at least one light emitting diode unit via the wiring layer to provide a desired operating voltage or operating current to the at least one light emitting diode unit.
  • the light-emitting diode unit is a light-emitting diode die that is fixed on the first surface and passes through a bonding process or a flip-chip on board (FCOB) process with the wiring layer Achieve electrical connections.
  • FCOB flip-chip on board
  • the light-emitting diode unit is a light-emitting diode unit that is fixed to the first surface and electrically connected to the wiring layer by soldering.
  • the wiring layer is such that a plurality of the light-emitting diode units are connected in series, parallel, hybrid or cross-array.
  • the driving controller is in the form of a semiconductor wafer, which is fixed on the second surface and is implemented by a bonding process or a flip-chip (FCOB) process with the wiring layer. Electrical connections.
  • the drive controller is in the form of a package chip that is fixed to the second surface and electrically connected to the wiring layer by soldering.
  • At least one of the following circuits is further included: a sensing circuit, a dimming control circuit, a communication circuit, and a power factor correction circuit.
  • At least one of the circuits is integrated with the drive controller in the same semiconductor wafer or packaged chip.
  • the circuit is in the form of a semiconductor wafer, which is fixed on the first or second surface and is implemented by a bonding process or a flip-chip (FCOB) process with the wiring layer. Electrical connections.
  • the circuit is in the form of a package chip, It is fixed to the first or second surface and is electrically connected to the wiring layer by a soldering process.
  • Still another object of the present invention is to provide an illumination device using a light-emitting diode as a light source, which has the advantages of excellent heat dissipation effect and low manufacturing cost.
  • a lighting device using a light emitting diode as a light source comprising:
  • a lamp housing including a heat sink
  • LED wick including:
  • a printed wiring board comprising an insulating layer and a wiring layer formed on the first and second surfaces of the insulating layer, the insulating layer being fixed to the heat sink to be between the substrate and the heat sink Forming heat conduction;
  • At least one light emitting diode unit disposed on the first surface of the insulating layer and electrically connected to the wiring layer;
  • a drive controller disposed on the second surface of the insulating layer is electrically coupled to the at least one light emitting diode unit through the wiring layer to provide a desired operating voltage or operating current to the at least one light emitting diode unit.
  • the insulating layer is fixed to the heat sink by means of a thermal conductive adhesive or a thermally conductive double-sided film.
  • the heat dissipating member is made of metal
  • the lamp housing further includes a lamp cap, and the heat dissipating member is connected to the lamp cap via an insulating member.
  • the heat dissipating member is made of a ceramic material or a thermally conductive insulating polymer composite material.
  • the light emitting diode unit is a light emitting diode die fixed to the first surface and implemented by a bonding process or a flip chip (FCOB) process with the wiring layer Electrical connections.
  • FCOB flip chip
  • the light emitting diode unit is a light emitting diode unit that is fixed to the first surface and electrically connected to the wiring layer by soldering.
  • the wiring layer is such that a plurality of the light emitting diode units are connected in series, in parallel, in a hybrid or in a cross array.
  • the driving controller is in the form of a semiconductor wafer fixed to the second surface and electrically connected to the wiring layer by a bonding process or a flip chip (FCOB) process connection.
  • FCOB flip chip
  • the drive controller is in the form of a package chip that is fixed to the second surface and electrically connected to the wiring layer by soldering.
  • At least one of the following circuits is further included: a sensing circuit, a dimming control circuit, a communication circuit, and a power factor correction circuit.
  • At least one of the circuits is integrated with the drive controller in the same semiconductor wafer or packaged chip.
  • the circuit is in the form of a semiconductor wafer fixed to the first or second surface and electrically connected to the wiring layer by a bonding process or a flip chip (FCOB) process connection.
  • FCOB flip chip
  • the circuit is in the form of a packaged chip which is fixed to the first or second surface and is electrically connected to the wiring layer by a soldering process. It is still another object of the present invention to provide an LED wick that is adapted to be assembled with a lamp housing to provide a lighting device that is excellent in heat dissipation and low in manufacturing cost.
  • a light-emitting diode wick comprising:
  • a printed wiring board comprising first and second insulating layers, a metal layer between the first and second insulating layers, and a wiring layer formed on surfaces of the first and second insulating layers; at least one light emitting diode unit Provided on the surface of the first insulating layer and electrically connected to the wiring layer;
  • a driving controller disposed on a surface of the second insulating layer is electrically connected to the at least one light emitting diode unit through the wiring layer to supply a required operating current or operating voltage to the at least one light emitting diode unit.
  • the light-emitting diode unit is a light-emitting diode die, which is fixed on the surface of the first insulating layer and is bonded to the wiring layer by a bonding process or a flip chip on the board (FCOB) The process achieves an electrical connection.
  • FCOB flip chip on the board
  • the light-emitting diode unit is a light-emitting diode unit that is fixed on a surface of the first insulating layer and is soldered to the wiring layer Connection mode is electrically connected.
  • the wiring layer is such that a plurality of the light-emitting diode units are connected in series, parallel, hybrid or cross-array.
  • the driving controller is in the form of a semiconductor wafer which is fixed on the surface of the second insulating layer and passes through a bonding process or a flip chip (FCOB) on the wiring layer. The process achieves an electrical connection.
  • FCOB flip chip
  • the drive controller is in the form of a package chip which is fixed to the surface of the second insulating layer and electrically connected to the wiring layer by soldering.
  • At least one of the following circuits is further included: a sensing circuit, a dimming control circuit, a communication circuit, and a power factor correction circuit.
  • At least one of the circuits is integrated with the drive controller in the same semiconductor wafer or packaged chip.
  • the circuit is in the form of a semiconductor wafer fixed to the surface of the first or second insulating layer and passed through a bonding process or a flip chip (FCOB) on the wiring layer.
  • FCOB flip chip
  • the circuit is in the form of a package chip which is fixed to the surface of the first or second insulating layer and electrically connected to the wiring layer by a soldering process.
  • Still another object of the present invention is to provide an illumination device using a light-emitting diode as a light source, which has the advantages of excellent heat dissipation effect and low manufacturing cost.
  • a lighting device using a light emitting diode as a light source comprising:
  • a lamp housing including a heat sink
  • LED wick including:
  • a printed wiring board comprising first and second insulating layers, a metal layer between the first and second insulating layers, and a wiring layer formed on surfaces of the first and second insulating layers, the metal layer and The heat dissipating members are fixed together to form heat conduction between the printed wiring board and the heat dissipating member;
  • At least one light emitting diode unit disposed on a surface of the first insulating layer and electrically connected to the wiring layer; a driving controller disposed on a surface of the second insulating layer, electrically connected to the at least one light emitting diode unit through the wiring layer to provide a required operating voltage or operating current to the at least one light emitting diode unit.
  • the edge of the metal layer is fixed to the heat sink by means of a thermal conductive adhesive or a heat-conductive double-sided film.
  • the heat dissipating member is made of metal
  • the lamp housing further includes a lamp cap, and the heat dissipating member is connected to the lamp cap via an insulating member.
  • the heat dissipating member is made of a ceramic material or a thermally conductive insulating polymer composite material.
  • the light emitting diode unit is a light emitting diode die that is fixed on the surface of the first insulating layer and passes through a bonding process or a flip chip (FCOB) on the wiring layer. The process achieves an electrical connection.
  • FCOB flip chip
  • the light emitting diode unit is a light emitting diode unit fixed to a surface of the first insulating layer and electrically connected to the wiring layer by soldering.
  • the wiring layer is such that a plurality of the light emitting diode units are connected in series, in parallel, in a mixture or in a cross array.
  • the driving controller is in the form of a semiconductor wafer which is fixed on the surface of the second insulating layer and passes through a bonding process or a flip chip (FCOB) process with the wiring layer. Achieve electrical connections.
  • FCOB flip chip
  • the drive controller is in the form of a package chip that is fixed to the surface of the second insulating layer and electrically connected to the wiring layer by soldering.
  • At least one of the following circuits is further included: a sensing circuit, a dimming control circuit, a communication circuit, and a power factor correction circuit.
  • At least one of the circuits is integrated with the drive controller in the same semiconductor wafer or packaged chip.
  • the circuit is in the form of a semiconductor wafer fixed to the surface of the first or second insulating layer and passed through a bonding process or a flip chip (FCOB) process with the wiring layer Achieve electrical connections.
  • FCOB flip chip
  • the circuit is in the form of a packaged chip, which is fixed on the surface of the first or second insulating layer and is electrically connected to the wiring layer by a soldering process Gas connection.
  • the LED wick includes a light emitting diode unit, a drive controller and other circuits (such as a sensing circuit, a dimming control circuit, a communication circuit, and a power factor correction circuit) disposed on an insulating thermally conductive substrate.
  • a sensing circuit such as a dimming control circuit, a communication circuit, and a power factor correction circuit
  • Such as) or components such as capacitors and inductors, etc.
  • this highly integrated structure is very advantageous for large-scale production, can greatly reduce assembly and logistics costs in the luminaire manufacturing process, and also saves future upgrades and maintenance costs. .
  • the LED unit is integrated into the insulating and thermally conductive substrate in the form of an unpackaged die, and the insulating and thermally conductive substrate is directly connected to the heat sink of the lamp housing, and the die ⁇ bracket ⁇ aluminum substrate
  • the wiring layer ⁇ the insulating and thermally conductive material layer of the aluminum substrate ⁇ the metal plate of the aluminum substrate ⁇ the heat conduction path of the heat sink significantly reduces the heat conduction interface, thereby improving the heat conduction efficiency of the lighting device on the one hand, and reducing the manufacturing on the other hand. cost.
  • the insulating thermally conductive substrate and the heat sink are integrally formed, the heat transfer efficiency is further improved.
  • the insulating thermally conductive substrate is made of a ceramic material, and the structure has been improved because of good bonding between the wiring layer and the ceramic material, between the LED unit and the ceramic material and the wiring. reliability. Moreover, the low price of ceramic materials further drives down costs.
  • the wiring layer can be formed by a silver paste sintering process, which can avoid environmental pollution caused by the copper etching process.
  • the light emitting diode unit is directly disposed on the outer surface of the insulating and heat conducting portion of the lamp housing, so that the heat dissipation problem of the light emitting diode can be effectively solved without an additional heat sink, which greatly reduces the material cost. And manufacturing costs.
  • a columnar body extending along the longitudinal axis of the lamp envelope and composed of an insulating and thermally conductive material is used to carry the light emitting diode unit, so that a light-emitting space angle of approximately 360 degrees can be formed to meet special application requirements.
  • FIG. 1 is a schematic view showing an illumination device using a light-emitting diode as a light source according to a first embodiment of the present invention, showing the structure of a lamp envelope.
  • Figure 2 is an exploded perspective view of the lighting device of Figure 1.
  • Fig. 3 is a schematic view of an illumination device using a light emitting diode as a light source in accordance with a second embodiment of the present invention.
  • Fig. 4 is a schematic view of an illumination device using a light emitting diode as a light source in accordance with a third embodiment of the present invention.
  • Fig. 5 is a schematic view showing an illumination device using a light emitting diode as a light source in accordance with a fourth embodiment of the present invention.
  • Figure 6 is a schematic view of an illumination device using a light emitting diode as a light source in accordance with a fifth embodiment of the present invention.
  • FIG. 7A and 7B are schematic views of a light-emitting diode wick according to a sixth embodiment of the present invention, wherein Fig. 7A is a view of one surface of the light-emitting diode wick, and Fig. 7B is a view of the other surface of the light-emitting diode wick.
  • Fig. 8 is a schematic view of a substrate comprising a metal core material applicable to an embodiment of the present invention.
  • Fig. 9 is a schematic view of a substrate comprising a core material of an insulating material applicable to an embodiment of the present invention.
  • Figure 10 is a schematic view of a light-emitting diode wick in accordance with a seventh embodiment of the present invention.
  • Figure 11 is an exploded perspective view showing an illumination device using a light emitting diode as a light source in accordance with an eighth embodiment of the present invention.
  • Fig. 12 is an exploded perspective view showing an illumination device using a light emitting diode as a light source according to a ninth embodiment of the present invention. detailed description
  • the term "lighting device” should be understood broadly to mean all devices capable of providing practical or aesthetic effects by providing light, including but not limited to table lamps, wall lamps, spotlights, chandeliers, ceiling lamps, street lamps, flashlights. , stage set lights and city lights.
  • the term "light envelope” should be understood broadly to mean a physical structure for carrying or accommodating a light source, for example, which may be arranged in a completely enclosed or semi-closed space surrounded by a lamp housing or in a lamp housing. External or internal surface.
  • semiconductor wafer refers to a plurality of individual single circuits formed on a semiconductor material (eg, silicon, gallium arsenide, etc.), "semiconductor wafer” or “die” “refers to such a single circuit, and "packaged chip” refers to a physical structure formed by packaging a semiconductor wafer. In a typical such physical structure, a semiconductor wafer is mounted, for example, on a support and encapsulated with a sealing material.
  • semiconductor material eg, silicon, gallium arsenide, etc.
  • die refers to such a single circuit
  • packaged chip refers to a physical structure formed by packaging a semiconductor wafer. In a typical such physical structure, a semiconductor wafer is mounted, for example, on a support and encapsulated with a sealing material.
  • light emitting diode unit refers to a unit comprising an electroluminescent material, examples of which include, but are not limited to, P-N junction inorganic semiconductor light emitting diodes and organic light emitting diodes (OLEDs and polymer light emitting diodes (PLEDs)).
  • OLEDs organic light emitting diodes
  • PLEDs polymer light emitting diodes
  • the P-N junction inorganic semiconductor light emitting diodes can have different structural forms, such as, but not limited to, light emitting diode dies and light emitting diode cells.
  • light-emitting diode die refers to a semiconductor wafer having a PN structure and having electroluminescence capability
  • light-emitting diode cell refers to a physical structure formed by packaging a die, which is typical In a physical configuration, the die is mounted, for example, on a bracket and encapsulated with a sealing material.
  • wiring refers to conductive patterns disposed on an insulating surface for electrical connection between components, including but not limited to traces and holes (eg pads, Component holes, fastening holes, metallized holes, etc.).
  • traces and holes eg pads, Component holes, fastening holes, metallized holes, etc.
  • thermal conduction refers to the way heat is transferred from a higher temperature part to a lower temperature part in a solid.
  • the heat generated by the light emitting diode unit can be mainly transferred to the lamp housing in a thermally conductive manner and then to the outside of the lighting device (e.g., in the form of heat conduction, convection, and heat radiation).
  • ceramic material generally refers to non-metallic inorganic materials that require high temperature treatment or densification, including but not limited to silicates, oxides, carbides, nitrides, sulfides, borides, and the like.
  • thermally conductive insulating polymer composite material refers to a polymer material which has a high thermal conductivity by forming a thermally conductive network chain inside a metal or inorganic filler filled with a high thermal conductivity.
  • the thermally conductive insulating polymer composite material includes, for example, but not limited to, a polypropylene material to which alumina is added, a polycarbonate to which alumina, silicon carbide, and cerium oxide are added, and an acrylonitrile-butadiene-styrene terpolymer.
  • thermally conductive insulating polymer composite material For a detailed description of the thermally conductive insulating polymer composite material, see Li Li et al., "Research on Thermal Conductive and Insulating Polymer Materials of Polycarbonate and Polycarbonate Alloys” (Journal of Materials Heat Treatment, August 2007, Vol. 28, No.4, pp51-54 ) And Li Shui et al., “Application of Alumina in Thermal Conductive Insulating Polymer Composites"("PlasticAdditives", 2008, No. 3, ppl 4-16), these documents are hereby incorporated by reference in their entirety. .
  • Electrode connection should be understood to include situations where electrical energy or electrical signals are transmitted directly between two units, or where electrical energy or electrical signals are transmitted indirectly via one or more third units.
  • Drive power supply or “LED drive power supply” refers to an “electronic control device” between an alternating current (AC) or direct current (DC) power supply connected to the outside of the lighting device and a light emitting diode as a light source for providing the light emitting diode
  • AC alternating current
  • DC direct current
  • the current or voltage required eg constant current, constant voltage or constant power, etc.
  • Figure 1 is a schematic view of an illumination device using a light-emitting diode as a light source according to a first embodiment of the present invention, showing the structure of a lamp envelope.
  • the lamp housing 1 of the lighting device includes a lamp cap 110, a heat radiating member 120 (a cup-shaped member in Fig. 1), and a lamp army 130.
  • the base 110 can be used in the form of a threaded screw interface similar to an ordinary incandescent lamp and an energy-saving lamp to provide an electrical connection to an external power source (for example, a 220 volt AC power source), but can also be rotated.
  • the heat dissipating member 120 is disposed between the lamp cap 110 and the lamp arm 130, and can be made of various insulating heat dissipating materials, such as ceramic materials or thermally conductive insulating polymer composite materials, etc., which are used for carrying or The light source and various functional circuits are accommodated, and on the other hand, the heat generated by the light source and the functional circuit is transmitted to the outside of the lamp housing; the lamp army 130 is made of a light-transmitting material, and is mainly used for protecting the light source and the functional circuit and The light is softer and more evenly diverging into the space.
  • the heat sink is made of insulating and heat conductive materials, It is also possible to use a metal material.
  • an insulating member for example, ceramic or plastic may be added between the base 110 and the heat sink 120 to electrically insulate them.
  • FIG. 2 is an exploded perspective view of the lighting device of Figure 1.
  • the lamp housing 1 of the lighting device includes a lamp cap 110, a heat sink 120, and a lamp army 130.
  • the inner cavity of the heat dissipating member 120 is provided with a substrate 20 perpendicular to the longitudinal axis of the lamp housing and separating the inner space of the lamp housing.
  • the substrate is also made of an insulating and heat conductive material (for example, ceramic material or thermal insulation).
  • the molecular composite material or the like is configured to be integrally formed with the heat dissipating member 120, or the periphery thereof may be assembled by means of a thermal conductive adhesive, a thermally conductive double-sided film or a notch and a heat dissipating member 120 formed on an inner surface of the heat dissipating member 120.
  • a substrate made of a ceramic material can be produced by a die pressing method, and the substrate produced by this method is thick (e.g., 1.5-3 mm) and has a high hardness.
  • the light emitting diode unit 30 is disposed on the substrate 20.
  • a wiring 202 is formed on the surface 201A by a printed circuit process (for example, by forming a wiring layer by sintering a silver paste pattern on a ceramic material), which is divided into two segments, each of which is connected to the LED unit 30.
  • One of the electrodes is welded together.
  • Each trace contains a leading end, denoted by reference numerals 202A and 202B, respectively.
  • One end of the wire 203A is connected to the terminal 202A, and the other end is connected to the driving power module (not shown) provided in the inner space of the lamp housing through the through hole 204A, or is connected to the surface of the substrate 20 (for example, the same as the surface 201A or The driving power module on the opposite side; likewise, one end of the wire 203B is connected to the leading end 202B, and the other end is connected to the driving power supply module disposed in the inner space of the lamp housing through the through hole 204B, or is connected to the surface mounted on the substrate 20 The upper drive power module, thereby achieving an electrical connection between the LED unit 30 and the drive power module.
  • soldering is performed at the periphery where the wires 203A and 203B are in contact with the terminals 202A and 202B.
  • the LED unit 30 can be adhered to the surface 201A of the substrate 20 by means of an adhesive such as epoxy or silica gel. If it is necessary to adjust the wavelength of the light, the phosphor may be mixed in an epoxy resin or a silica gel, or the LED monomer 30 may be adhered to the surface 201A of the substrate 20 by means of an adhesive after the phosphor layer is coated on the surface of the LED unit 30. .
  • the embodiment shown in Figure 2 can also include a drive power source (not shown).
  • the driving power source of the embodiment includes a power conversion circuit and a driving circuit, wherein the power conversion circuit converts high-voltage alternating current (for example, 100-220 volts alternating current) into low-voltage direct current, and the driving circuit utilizes The low voltage direct current supplies a suitable current or voltage to the light emitting diode (eg constant voltage, constant current or constant power).
  • Appropriate buck mode can be adopted in the power conversion circuit according to actual application requirements, including but not limited to resistor and capacitor buck, resistor buck, conventional transformer buck, electronic transformer buck, RCC buck mode switching power supply, PWM Control mode switching power supply, etc.
  • the driving circuit can adopt various driving methods, such as constant voltage power supply, constant current power supply, and constant voltage constant current power supply.
  • the driving power supply may further include a control circuit for implementing luminous flux and optical tone control, power factor correction, and timing switching, and implementing overvoltage protection, overheat protection, short circuit protection, output open circuit protection, low voltage latching, electromagnetic interference suppression, Protection circuit for conducting noise, anti-static, lightning protection, surge protection, anti-harmonic oscillation, etc.
  • a control circuit for implementing luminous flux and optical tone control, power factor correction, and timing switching, and implementing overvoltage protection, overheat protection, short circuit protection, output open circuit protection, low voltage latching, electromagnetic interference suppression, Protection circuit for conducting noise, anti-static, lightning protection, surge protection, anti-harmonic oscillation, etc.
  • the driving power source may be implemented in the form of a physically independent circuit module (for example, molded as a separate component) disposed in the inner space of the lamp housing surrounded by the heat sink 120 and associated with the light emitting diode
  • the cells 30 are electrically connected together.
  • FIG. 2 only shows the electrical connection between the wiring 202 and the LED unit 30, alternatively, the substrate 20 may be used as a printed wiring board to form a certain wiring pattern or wiring on the surface thereof.
  • Layers and electrical components of various components are connected through a wiring layer to form Circuits that implement various functions, such as, but not limited to, power conversion, drive control, intelligent lighting control, communication, environmental state sensing, and dimming.
  • a suitable wiring pattern can be formed on one or both surfaces of the substrate 20 by a printed circuit process as in the case of a printed circuit board, and then the corresponding components are mounted on the surface.
  • the light emitting diode unit is shown in the form of a light emitting diode unit 30, a die form can also be used.
  • the LED die can be directly connected to the wiring 202 by means of a bonding machine in a gold or silver wire or alloy wire soldering process (i.e., a bonding process). More preferably, the LED die is electrically connected to the wiring using a flip-chip on board (FCOB) process.
  • FCOB flip-chip on board
  • FIG. 3 is a schematic illustration of an illumination device employing a light emitting diode as a light source in accordance with a second embodiment of the present invention, employing a plurality of light emitting diode units as a light source arrangement.
  • Fig. 3 only shows a heat sink made of an insulating heat conductive material or a metal material, and a member such as a substrate.
  • the inner cavity of the heat dissipating member 120 (the cup-shaped member in FIG. 3) is also provided with a substrate 20 perpendicular to the axial direction thereof, and the substrate may also be integrally formed with the heat dissipating member 120 or adhered thereto.
  • the mixture or notch is fixed together.
  • a plurality of LED cells 30 connected in series are disposed on the surface of the substrate 20.
  • a transparent epoxy or silicone paste is adhered to the surface 201A of the substrate 20 by means of a transparent epoxy or silicone paste.
  • the wiring 202 is divided into a plurality of segments, through which the individual LED cells 30 are sequentially connected in series.
  • a through hole 204 is defined in the center of the substrate 20, and two terminals 202A and 202B of the wiring 202 are disposed near the through hole 204, wherein one end of the wire 203A is soldered to the leading end 202A, and the other end passes through the through hole 204 and is disposed.
  • the driving power supply module is electrically connected in the inner space of the lamp housing or on the other surface of the substrate 20; likewise, one end of the wire 203B is soldered to the leading end 202B, and the other end passes through the through hole 204 and is disposed in the inner space of the lamp housing or is mounted on The drive power module on the surface of the substrate 20 is electrically connected.
  • the LED units are connected in series and then connected to the driving power supply module or circuit
  • the plurality of LED units may also adopt other connection methods, such as parallel, string. Connection methods such as parallel, hybrid or cross array.
  • Fig. 4 is a schematic view of an illumination device using a light emitting diode as a light source in accordance with a third embodiment of the present invention.
  • the lamp housing 1 of the lighting device according to the present embodiment also includes a lamp cap 110, a heat dissipating member 120, and a lamp army (not shown).
  • a lamp cap 110 As shown in Fig. 4, the lamp housing 1 of the lighting device according to the present embodiment also includes a lamp cap 110, a heat dissipating member 120, and a lamp army (not shown).
  • the difference between this embodiment and the above-mentioned embodiments shown in Figs. 1-3 is mainly in the structure of the heat sink that carries the light source and various functional circuits, which will be further described below.
  • a columnar body 40 is disposed inside the lamp housing, and the columnar body 40 extends along the longitudinal axis of the lamp housing and And also composed of an insulating heat conductive material, which can be integrally formed with the heat sink 120, or a support base 401 as shown in FIG. 4, which is assembled by means of a thermal conductive adhesive, a thermally conductive double-sided film or an inner surface of the heat sink 120.
  • the notch secures the support base 401 to the heat sink 120.
  • the interior of the columnar body 40 may have a cavity, and its cross section may be various shapes including, for example, but not limited to, a polygon, a circle, an ellipse, and the like.
  • a plurality of LED cells 30 are adhered to the outer surface of the column 40, for example, by means of a transparent epoxy resin or silica gel.
  • the silver paste pattern is formed in the columnar body 40 to form a wiring layer) which is divided into a plurality of traces to connect the light emitting diode cells 30 in series, parallel, hybrid or cross array.
  • a through hole 204 is formed in the top of the columnar body 40. One ends of the wires 203A and 203B are soldered to the leading end of the wiring 202, and the other end is electrically connected to the driving power source through the through hole 204.
  • the driving power supply for supplying power to the light emitting diode is not shown in the embodiment shown in FIG.
  • the driving power source may be implemented in the form of a physically separate circuit module (for example, molded as a separate component) disposed in the interior of the lamp envelope or in the cavity of the column 40 and illuminated
  • the diode cells 30 are electrically connected together.
  • the support substrate 401 as a printed wiring board, form a certain wiring pattern or wiring layer on one or both surfaces thereof, and place various components (for example, a microcontroller chip, a resistor) through the wiring layer. , capacitors, RF signal transceivers, temperature sensors, light intensity sensors and signal modulators/demodulators, etc.) Electrical components are connected to form circuits capable of performing various functions, such as but not limited to power conversion, driving Control, intelligent lighting control, communication, environmental status sensing and dimming.
  • a suitable wiring pattern can be formed on one or both surfaces of the support substrate 401 by a printed circuit process as in the case of a printed circuit board, and then the corresponding components are mounted on the surface. This will greatly increase integration, reduce manufacturing costs, and facilitate assembly and maintenance of LED lights.
  • the light emitting diode units can be uniformly distributed on the outer surface of the columnar body, an omnidirectional illumination of approximately 360 degrees can be realized, and the illumination light lines are more evenly hooked and soft.
  • Figure 5 is a lighting diagram using a light emitting diode as a light source in accordance with a fourth embodiment of the present invention. Schematic diagram of the device. In this embodiment, the illumination device is presented in the form of a spotlight.
  • the lamp housing 1 of the lighting device includes a lamp cap 110, a heat radiating member 120, and a lamp army 130.
  • the heat dissipating member 120 is disposed between the lamp cap 110 and the lamp body 130 and is also disposed in the inner cavity thereof with a substrate 20 perpendicular to the axial direction thereof.
  • the substrate is also composed of an insulating and heat conductive material, which is integrally formed with the heat dissipating member 120 or is thermally conductive.
  • a glue, a thermally conductive double-sided film or a notch formed on the inner surface of the heat sink 120 is fixed to the heat sink 120.
  • the heat sink may be made of an insulating heat conductive material or a metal material.
  • an insulating member such as ceramic or plastic may be added between the lamp cap 110 and the heat sink 120 to electrically insulate therebetween. .
  • three LED cells 30 are adhered to the surface 201A of the substrate 20 by means of a transparent epoxy or silica gel.
  • the wiring 202 is divided into a plurality of segments, and a plurality of LED cells 30 are sequentially connected in series by a plurality of them.
  • a through hole 204 is formed in the center of the substrate 20, and two terminals 202A and 202B of the wiring 202 are disposed near the through hole 204, wherein one end of the wire 203A is soldered to the leading end 202A, and the other end passes through the through hole 204 and is driven.
  • the power supply is electrically connected; likewise, one end of the wire 203B is soldered to the terminal 202B, and the other end is electrically connected to the driving power source through the through hole 204.
  • the driving power source can be implemented in the form of a physically independent circuit module (for example, molded as a separate component), the circuit module being disposed in the inner space of the lamp housing surrounded by the heat sink 120 and emitting light
  • the diode cells 30 are electrically connected together.
  • the power conversion circuit can be omitted, and the drive circuit supplies the external power source with a low voltage direct current output from the external power source to supply a constant current or voltage to the light emitting diode.
  • the dimming circuit and the corrected power factor circuit can also be integrated into the drive power source.
  • the substrate 20 can also be used as a printed wiring board, and a wiring layer is formed on a surface thereof (for example, a surface opposite to the surface 201A) and a component for driving the power source can be used. Mounted on the surface.
  • a wiring layer is formed on a surface thereof (for example, a surface opposite to the surface 201A) and a component for driving the power source can be used. Mounted on the surface.
  • Figure 6 is a schematic illustration of a lighting device using a light emitting diode as a light source in accordance with yet another embodiment of the present invention.
  • the lamp housing 1 of the illumination device includes a lamp cap 110, which is composed of an insulating heat conductive material (for example, a ceramic material and a thermally conductive insulating polymer composite material).
  • the heat sink 120 and the cover plate 140 are used for sealing the inner cavity of the lamp housing 1 to protect against dust, moisture, and the like.
  • This kind of lampless lighting method is more suitable for outdoor lighting applications such as landscape lighting and street lighting.
  • a plurality of LED cells 30 are adhered to the outer surface of the heat sink 120, for example, by means of a transparent epoxy or silicone.
  • a wiring 202 is also formed by a printed circuit process (for example, by forming a wiring layer by sintering a silver paste pattern on a ceramic material), which is divided into a plurality of traces to separate the light emitting diodes.
  • the 30s are connected in series, in parallel, in a hybrid or cross array, and are connected via wires 203 to a driving power source disposed inside the heat sink 120.
  • the driving power source can be implemented in the form of a physically independent circuit module (for example, molded as a separate component), the circuit module being disposed in the inner space of the lamp housing and electrically connected to the LED unit 30 connected.
  • a physically independent circuit module for example, molded as a separate component
  • the light emitting diode units are uniformly distributed on the outer surface of the heat sink 120, 360 degree omnidirectional illumination can be realized.
  • the light-emitting diode unit can directly dissipate heat to the external environment by means of heat radiation, in addition to transferring heat to the lamp housing portion of the heat-conductive insulating material by heat conduction.
  • FIG. 7A and 7B are schematic views of a light-emitting diode wick according to a sixth embodiment of the present invention, wherein Fig. 7A is a view of one surface of the light-emitting diode wick, and Fig. 7B is a view of the other surface of the light-emitting diode wick.
  • the light-emitting diode wick 2 includes a substrate 20, a plurality of light-emitting diode units 30, and a driving power source 50.
  • the substrate 20 is made of an insulating heat conductive material such as a ceramic material or a thermally conductive insulating polymer composite. Referring to FIG. 7A, wiring is formed on one surface 201A of the substrate 20 (for example, a wiring layer is formed by sintering a silver paste pattern on a ceramic material). Therefore, in the present embodiment, the substrate 20 is equivalent to a printed wiring board.
  • a support platform and an electrical connection are provided for the light emitting diode unit 30 and the driving power source 50, and on the other hand, it also functions to transfer heat generated by the light emitting diode unit 30 and the driving power source 50 to the outside.
  • the substrate made of a ceramic material can be produced by a die pressing method, and the substrate produced by this method is thick (e.g., 1.5-3 mm) and has a high hardness.
  • the substrate 20 described above is made of high insulation such as ceramics and heat conduction It is made of an insulating and heat conductive material such as a molecular composite material, but a metal core printed circuit board (MCPCB) including a metal base layer (for example, an aluminum substrate) and a substrate including an insulating core material (for example, a paper substrate, a glass fiber cloth) may also be used.
  • MCPCB metal core printed circuit board
  • a substrate and a composite substrate using a glass fiber cloth as a surface reinforcing material or the like are used as a substrate.
  • a substrate 20 having a multilayer structure includes a first insulating layer 207A, a metal base layer 208, and a second insulating layer 207B which are sequentially stacked, wherein the first and second insulating layers 207A, 207B are composed of a low thermal resistance thermally conductive insulating material.
  • a special polymer filled with a special ceramic which has excellent thermal resistance, excellent viscoelasticity and ability to withstand mechanical and thermal stresses, and is suitable for bonding to the metal base layer 208.
  • the metal base layer 208 can be made of a metal having good thermal conductivity such as aluminum, copper, iron, and an alloy containing at least two of these metals.
  • the wiring 202 may be formed on the surfaces of the first and second insulating layers 207A and 207B by a printed circuit process, thereby providing electrical connection between the light emitting diode unit 30 and the driving power source 50 on the one hand, and the light emitting diode unit 30 on the other hand.
  • the heat generated by the driving power source 50 is efficiently transferred to the metal base layer 208, and the heat is efficiently transferred from the metal base layer 208 to the outside of the substrate 20.
  • the edge of the metal substrate 208 can be bonded to the heat sink of the illumination device with an adhesive to dissipate heat to the exterior of the illumination device.
  • the substrate 20 can also use a printed circuit board including a core material of an insulating material.
  • Fig. 9 is a schematic view of a substrate comprising a core material of an insulating material which can be applied to an embodiment of the present invention.
  • the substrate 20 includes an insulating substrate 207 whose both surfaces can be formed into a wiring 202 by a printed circuit process to provide an electrical connection between the LED unit 30 and the driving power source 50.
  • the light emitting diode units 30 are in the form of a die which are disposed on the surface 201A of the substrate 20 by adhesion to form better heat conduction between the LED unit 30 and the substrate 20.
  • the wiring includes a plurality of pads 202C, and the LED units 30 are directly connected to the pads 202C through leads 206 (for example, gold wires, silver wires or alloy wires) to form a series of light emitting diode groups.
  • the terminal light emitting diode unit 30 is connected to the wiring traces 202D and 202E through the wiring 206, and the wiring lines 202D and 202E are connected to the driving power source 50 on the other surface of the substrate 20 via the wires 203A and 203B passing through the through hole 204.
  • the bonding of the LED die via the lead to the wiring can be achieved using a bonding process.
  • the light-emitting diode unit 30 may be adhered to the surface 201A by epoxy or silica gel mixed with phosphor, or the phosphor layer may be coated on the surface of the light-emitting diode unit 30, and then It is bonded to the surface 201A by means of epoxy or silica gel.
  • a driving power source 50 is disposed on the other surface 201B of the substrate 20.
  • the driving power supply can adopt various topology circuits, including but not limited to non-isolated buck topology circuit structure, flyback topology circuit structure and half bridge LLC topology circuit structure.
  • topology circuits including but not limited to non-isolated buck topology circuit structure, flyback topology circuit structure and half bridge LLC topology circuit structure.
  • a detailed description of the driving power supply circuit can be found in the book "LED Lighting Driver Power Supply and Luminaire Design", First Edition, May 201, 2011, which is included in the present specification.
  • the drive power supply can provide a suitable current or voltage to the LED unit 30 in a variety of drive modes (e.g., constant voltage supply, constant current supply, and constant voltage constant current supply), which can be comprised of one or more separate components.
  • one or more components of the driving power source are implemented in the form of a wafer or a packaged chip, and a component implemented in the form of a wafer or a packaged chip in the driving power source is hereinafter referred to as a "driving controller".
  • circuits for implementing other functions such as a dimming control circuit, a sensing circuit, a power factor correction circuit, an intelligent lighting control circuit, a communication circuit, and a protection circuit may be integrated in the driving power source 50.
  • These circuits may be integrated in the same semiconductor wafer or packaged chip as the drive controller, or these circuits may be provided separately in the form of semiconductor wafers or packaged chips, or some or all of these circuits may be combined together and on a semiconductor wafer or Available in the form of a packaged chip.
  • the external power source is connected to the rectifying circuit 520 via the terminals 510A and 510B (here implemented in the form of an integrated circuit package chip), and the driving circuit 530 (here implemented in the form of an integrated circuit package chip, for example, It is the MAX16820 LED driver manufactured by Maxim Integrated Products, the flyback driver SSL series control IC manufactured by NXP Semiconductors, the HB LED driver MXHV9910 manufactured by Clare, and the NCP1351 LED driver manufactured by ON Semiconductor.
  • the LED driver ACT355A manufactured by Active Semiconductor Co., Ltd., etc. is electrically connected to the rectifier circuit 520 via the wiring 202.
  • Driver 530 is also electrically coupled via wiring 202 to capacitors 540A and 540B and circuitry that implements other functions, here exemplified by wireless communication transceiver chip 550.
  • the output of the driving power source 50 is electrically connected to the light emitting diode unit 30 on the substrate surface 201A via the wires 203A and 203B that traverse the via 204.
  • a drive controller in the form of a packaged chip and a circuit for realizing other functions for example, it can be directly connected to the wiring 202 of the surface 201B by a soldering process, and the drive controller and other functions for the wafer form are realized.
  • the circuit for example, can be directly connected to the wiring 202 of the surface 201B using a bonding process or a flip-chip on board (FCOB) process. Further, alternatively, a configuration in which a power conversion component such as the rectifier circuit 520 is disposed outside the wick 2 or integrated in a package chip with the driver may be employed.
  • FCOB flip-chip on board
  • the LED unit 30 in the form of a die is directly connected to the wiring 202 by a bonding process.
  • the on-board flip chip (FCOB) process can also be used to electrically connect the LED die to the wiring.
  • the light emitting diode units 30 are connected together in series, they may be connected in parallel, hybrid or cross array.
  • the light emitting diode unit 30 and the driving power source 50 are disposed on different surfaces of the substrate 20, they may be disposed on the same surface. Seventh embodiment
  • Figure 10 is a schematic view of a light-emitting diode wick in accordance with a seventh embodiment of the present invention.
  • the main difference of the present embodiment is the form of the light emitting diode unit 30 as compared with the above-described embodiment shown by Figs. 7A, 7B, 8 and 9, and therefore only the view of the substrate surface on which the light emitting diode unit is disposed is shown here.
  • a wiring 202 is formed on the surface 201A of the substrate 20, and the light emitting diode unit 30 in the form of a package chip is soldered on the wiring 202 to form heat conduction with the substrate 20.
  • the LED unit 30 may be bonded to the surface 201A with an adhesive.
  • the wiring 202 is divided into a plurality of sections to sequentially connect the plurality of LED units 30 in series.
  • a through hole 204 is opened in the center of the substrate 20, and the wiring 202 is electrically connected to a drive controller of a driving power source provided on the other surface of the substrate 20 by wires 203A and 203B passing through the through hole 204.
  • Figure 11 is a perspective view of an illumination using a light emitting diode as a light source in accordance with an eighth embodiment of the present invention. An exploded view of the device.
  • the lighting device includes a lamp housing 1 and a light-emitting diode wick 2 disposed in the lamp housing 1.
  • the lamp housing 1 includes a lamp cap 110, a heat dissipating member 120 (a cup-shaped member in Fig. 11), and a lamp army 130.
  • the base 110 can be used in the form of a threaded screw interface similar to an ordinary incandescent lamp and an energy-saving lamp to provide an electrical connection to an external power source (for example, a 220 volt AC power source), but can also be rotated. Bayonet and other forms.
  • the heat dissipating member 120 is disposed between the lamp cap 110 and the lamp arm 130, and can be made of various insulating and heat conductive materials, such as a ceramic material or a thermally conductive insulating polymer composite material, etc., which is used for accommodating the LED wick 2 on the one hand, and the other
  • the aspect also functions to transfer heat generated by the light emitting diode and the driving power source to the outside of the lamp housing.
  • a plurality of ribs extending in the longitudinal direction of the lamp housing are disposed on the inner wall of the heat dissipation member 120 to increase the heat dissipation area.
  • the heat dissipation member 120 is made of an insulating and heat conductive material, the ribs can be in contact with the components of the driving power source. Increase the heat transfer area.
  • the Light Army 130 is made of a light-transmitting material and is mainly used to protect the light source and functional circuits and to make the light spread more gently and evenly to the space.
  • the heat dissipating material is made of an insulating and heat conductive material, it is also possible to use a metal material.
  • an insulating member such as ceramic or plastic may be added between the lamp cap 110 and the heat dissipating member 120 to make them Electrically insulated.
  • the wick 2 can adopt the structure of the embodiment described above with reference to Figs. 7-10.
  • the LED wick 2 includes a substrate 20, a plurality of light emitting diode units 30 in a die form disposed on one surface of the substrate, and a driving power source disposed on the other surface of the substrate.
  • the substrate 20 is composed of an insulating and heat conductive material (for example, a ceramic material or a thermally conductive insulating polymer composite material), and the periphery thereof can be assembled by means of a thermal conductive adhesive, a thermally conductive double-sided film or a notch formed on the inner surface of the heat dissipating member 120 and dissipating heat.
  • the pieces 120 are fixed together, whereby the heat generated by the LED wick 2 is better transmitted to the heat sink 120 and then to the surrounding environment.
  • a substrate made of a ceramic material can be produced by a die pressing method, and the substrate produced by this method is thick (e.g., 1.5-3 mm) and has a high hardness.
  • the substrate 20 described above is made of an insulating heat conductive material such as a ceramic and a thermally conductive insulating polymer composite
  • a metal core printed circuit board including a metal base layer (for example, aluminum) may also be used.
  • a substrate) and a printed circuit board comprising an insulating core material (eg, a paper substrate, a fiberglass cloth substrate, and a fiberglass cloth)
  • an insulating core material eg, a paper substrate, a fiberglass cloth substrate, and a fiberglass cloth
  • a composite substrate or the like which is a surface reinforcing material is used as a substrate.
  • a plurality of light emitting diode units disposed on the surface of the substrate are disposed on the surface of the substrate by adhesion to form better heat conduction between the LED unit and the substrate.
  • the light emitting diode unit can be connected to the wiring by a bonding process (e.g., by forming a wiring layer by sintering a silver paste pattern on the ceramic material) and thereby electrically connected to a driving power source disposed on the other surface.
  • the light-emitting diode unit can be adhered to the surface with epoxy or silica gel mixed with phosphor, or the fluorescent layer can be coated on the surface of the light-emitting diode unit, and then epoxy resin can be applied thereto. Or silica gel is bonded to the surface.
  • the driving power source can adopt the structures and principles described in the embodiments described with reference to Figs. 7A, 7B, 8 and 9, and will not be described again.
  • circuits for realizing other functions may be integrated in the driving power source.
  • These circuits may be integrated in the same semiconductor wafer or packaged chip as the drive controller, or these circuits may be provided separately in the form of semiconductor wafers or packaged chips, or some or all of these circuits may be combined together and on a semiconductor wafer or Available in the form of a packaged chip.
  • the drive controller in the form of a wafer and the circuit for realizing other functions can be directly connected to the wiring on the surface of the substrate by a bonding process or a flip-chip on board (FCOB) process.
  • FCOB flip-chip on board
  • the drive controller in the form of a packaged chip and the circuit for realizing other functions for example, it can be directly connected to the wiring on the surface of the substrate by a soldering process.
  • a structure in which a power conversion component such as a rectifier circuit is disposed outside the wick 2 (for example, in the lamp housing 1) may be used, or when a DC voltage is supplied from an external power source, the rectification may be omitted. The structure of the circuit.
  • the LED unit in the form of a die is directly connected to the wiring by a bonding process.
  • the on-board flip chip (FCOB) process can also be used to electrically connect the LED die to the wiring.
  • the light emitting diode units 30 are connected in series in the present embodiment, they may be connected in parallel, in a hybrid or in a cross array.
  • the light emitting diode unit and the driving power source are disposed on different surfaces of the substrate 20, they may be disposed on the same surface.
  • Fig. 12 is an exploded perspective view showing an illumination device using a light emitting diode as a light source according to a ninth embodiment of the present invention.
  • the heat dissipating member 120 of the lamp housing 1 is made of a metal material.
  • an insulating member 150 (for example, ceramic or plastic) is added between the lamp cap 110 and the heat dissipating member 120. Etc.) to electrically insulate them.
  • the lighting device includes a lamp housing 1 and a light-emitting diode wick 2 disposed in the lamp housing 1.
  • the lamp housing 1 includes a lamp cap 110, a heat dissipating member 120 (a cup-shaped member in Fig. 12), a lamp body 130, and an insulating member 150 disposed between the lamp cap 110 and the heat dissipating member 120.
  • a plurality of fins are disposed on the outer surface of the heat dissipation member 120 to increase the heat dissipation area.
  • the components and wiring on the substrate 20 should maintain a sufficient gap with the edge of the substrate.
  • the lamp cap 110 can be used in the form of a threaded screw interface similar to an ordinary incandescent lamp and an energy-saving lamp to provide an electrical connection to an external power source (for example, a 220 volt AC power source), but other forms such as a rotary bayonet can be used.
  • the heat dissipating member 120 is disposed between the lamp cap 110 and the lamp army 130, and can be made of various insulating heat dissipating materials, such as a ceramic material or a thermally conductive insulating polymer composite material, etc., which is used for accommodating the LED wick 2 on the one hand.
  • the lamp army 130 is made of a light-transmitting material, mainly for protecting the light source and the functional circuit and making the light softer and more uniform. Divergence to space.
  • the wick 2 can adopt the structure and principle described in the embodiment described with reference to Figs. 7-10, and details are not described herein again. While some aspects of the present invention have been shown and described, it will be appreciated by those skilled in the art that Equivalent content is limited.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention porte sur une mèche de lampe à diodes électroluminescentes (2) et sur un dispositif d'éclairage utilisant une diode électroluminescente comme source de lumière. La mèche de lampe à diodes électroluminescentes comprend un substrat conduisant la chaleur isolant (20), au moins une unité de diode électroluminescente (30) disposée sur la première surface (201A) du substrat (20) de façon à être en relation de transfert thermique avec le substrat (20), et un dispositif de commande d'attaque disposé sur la seconde surface du substrat (20). La première surface et la seconde surface sont la même surface ou sont les surfaces opposées. La mèche de lampe à diodes électroluminescentes est apte à être assemblée avec une enveloppe de lampe (1), de façon à produire un dispositif d'éclairage présentant un effet de dissipation de chaleur fin et un faible coût de fabrication.
PCT/CN2012/084280 2011-11-11 2012-11-08 Mèche de lampe à diodes électroluminescentes et dispositif d'éclairage utilisant une diode électroluminescente comme source de lumière WO2013067945A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201120447845 2011-11-11
CN201110357803.9 2011-11-11
CN201120447845.7 2011-11-11
CN201110357803 2011-11-11
CN201110462220.2 2011-12-12
CN2011104622202A CN103104828A (zh) 2011-11-11 2011-12-12 发光二极管灯芯和采用发光二极管作为光源的照明装置

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US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop

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CN104180202B (zh) * 2013-05-23 2019-03-01 赵依军 Led灯芯和包含其的led球泡灯
CN103528010A (zh) * 2013-09-22 2014-01-22 上海俪德照明科技股份有限公司 一种led光电模组
CN104235649A (zh) * 2014-08-19 2014-12-24 宁波爱科电气实业有限公司 一种改进型led灯
CN105135237A (zh) * 2015-08-06 2015-12-09 苏州晶雷光电照明科技有限公司 一种带过热保护的led照明灯
WO2017107081A1 (fr) * 2015-12-23 2017-06-29 苏文藏 Lampe à del comprenant un coussin d'amortissement
CN105423188A (zh) * 2015-12-23 2016-03-23 苏文藏 一种带缓冲垫的led灯
CN106287258A (zh) * 2016-09-26 2017-01-04 苏州圣咏电子科技有限公司 一种发光模块及具有该发光模块的灯具
CN109519728B (zh) * 2018-11-13 2024-09-27 漳州立达信光电子科技有限公司 一种智能灯
CN109922573B (zh) * 2019-04-09 2020-01-14 上海大学 一种深海照明装置

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