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WO2012165691A1 - Boîtier de capteur d'image stéréoscopique et son procédé de fabrication - Google Patents

Boîtier de capteur d'image stéréoscopique et son procédé de fabrication Download PDF

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Publication number
WO2012165691A1
WO2012165691A1 PCT/KR2011/004526 KR2011004526W WO2012165691A1 WO 2012165691 A1 WO2012165691 A1 WO 2012165691A1 KR 2011004526 W KR2011004526 W KR 2011004526W WO 2012165691 A1 WO2012165691 A1 WO 2012165691A1
Authority
WO
WIPO (PCT)
Prior art keywords
image sensor
circuit board
printed circuit
accommodating groove
transparent substrate
Prior art date
Application number
PCT/KR2011/004526
Other languages
English (en)
Korean (ko)
Inventor
강희민
박은화
Original Assignee
(주)에이직뱅크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)에이직뱅크 filed Critical (주)에이직뱅크
Publication of WO2012165691A1 publication Critical patent/WO2012165691A1/fr

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a stereoscopic image sensor package and a method of manufacturing the same. More specifically, the present invention relates to a stereoscopic image sensor package and a method of manufacturing the same, which can greatly improve the quality of the stereoscopic image output by the stereoscopic image sensor by minimizing the alignment error between the left image sensor and the right image sensor.
  • Stereoscopic imaging technology is a visual technology that enables humans to feel as if they are in a place where images are being produced. Its application fields include information communication, broadcasting, medical care, education, military, and industrial technology. .
  • two image sensors are basically required.
  • the right and left two eyes of a human see different two-dimensional images, these two images are transmitted to the brain through the retina and recognized as stereoscopic images.
  • the stereoscopic imaging system reflecting this requires two image sensors.
  • these two image sensors that is, the left image sensor and the right image sensor package, are attached to the solder ball formed on the package to the electrode pattern formed on the printed circuit board. (Surface Mounting Technology) was attached to the printed circuit board.
  • An object of the present invention is to provide a stereoscopic image sensor package and a method of manufacturing the same, which can greatly improve the quality of a stereoscopic image output by the stereoscopic image sensor by minimizing the alignment error between the left image sensor and the right image sensor.
  • the present invention is to provide a three-dimensional image sensor package and a method of manufacturing the same to reduce the thickness of the three-dimensional image sensor package that can meet the needs of light and small, particularly important in mobile devices.
  • the present invention omits the process of attaching the solder ball, thereby improving the convenience of the user who is provided with the stereoscopic image sensor package and reducing the stereoscopic image quality due to the alignment error. It is a technical problem to provide an image sensor package and a method of manufacturing the same.
  • the three-dimensional image sensor package according to the present invention for solving this problem is a transparent substrate, the left image sensor connected to the bottom surface of the transparent substrate by a flip chip bonding method, the transparent in the state spaced apart from the left image sensor
  • the right image sensor and the left accommodation groove for accommodating the left image sensor and the right accommodation groove for accommodating the right image sensor are formed on the bottom surface of the substrate, and the flip chip bonding is formed on the bottom surface of the transparent substrate.
  • a printed circuit board connected in a manner.
  • conductive patterns are formed on a lower surface of the transparent substrate, sensor bump patterns are formed on the left image sensor and the right image sensor, and a substrate electrode pattern is formed on the printed circuit board.
  • sensor bump patterns and the substrate electrode patterns are fused to the conductive patterns through conductive contact layers so that the left image sensor and the right image sensor are mechanically connected to the transparent substrate, and the printing is performed. It is characterized in that it is electrically connected to the circuit board.
  • the conductive contact layers are formed using one of anisotropic conductive paste (ACP), anisotropic conductive film (ACF), non-conductive paste (NCP), and non-conductive film (NCF). It is characterized by.
  • the printed circuit board includes a flexible printed circuit board and a flexible printed circuit board stacked on the flexible circuit board and having a left accommodating groove and a right accommodating groove. It features.
  • the depth of the left accommodating groove is 0.8 times or more and 1.2 times less than the thickness of the left image sensor
  • the depth of the right accommodating groove is 0.8 times or more of the thickness of the right image sensor. It is characterized by being 1.2 times or less.
  • a driving chip accommodating groove for accommodating and mounting a driving chip for driving the stereoscopic image sensor is formed in a central region between the left accommodating groove and the right accommodating groove of the printed circuit board. It is characterized by being.
  • a driving chip for driving the stereoscopic image sensor is flip-bonded to a central region of the lower surface of the transparent substrate.
  • passive elements are mounted on the outer periphery of the central region between the left accommodating groove and the right accommodating groove of the printed circuit board.
  • a conductive pattern forming step of forming conductive patterns on a lower surface of a transparent substrate, a conductive contact layer forming step of forming conductive contact layers on the conductive patterns, and sensor bump patterns are formed. Bonding the left image sensor and the right image sensor to the transparent substrate by heat-treating the left image sensor and the right image sensor in a state in which the sensor bump patterns and the conductive contact layers are in contact with each other; And a substrate bonding step of bonding the printed circuit board to the transparent substrate by heat-treating the printed circuit board on which the patterns are formed so that the substrate electrode patterns and the conductive contact layers are in contact with each other.
  • the printed circuit board is formed with a left accommodating groove for accommodating the left image sensor and a right accommodating groove for accommodating the right image sensor.
  • the printed circuit board is bonded to the transparent substrate.
  • the sensor bump patterns and the substrate electrode patterns are fused to the conductive patterns through the conductive contact layers, thereby making the left image sensor and the right image sensor transparent. And mechanically connected to the substrate and at the same time electrically connected to the printed circuit board.
  • the conductive contact layers may be formed using one of anisotropic conductive paste (ACP), anisotropic conductive film (ACF), non-conductive paste (NCP), and non-conductive film (NCF). It is characterized by being formed.
  • ACP anisotropic conductive paste
  • ACF anisotropic conductive film
  • NCP non-conductive paste
  • NCF non-conductive film
  • the printed circuit board includes a flexible printed circuit board and a rigid printed circuit board stacked on the flexible circuit board and having the left accommodating groove and the right accommodating groove formed therein. Characterized in that.
  • the depth of the left accommodating groove is 0.8 times or more and 1.2 times less than the thickness of the left image sensor, and the depth of the right accommodating groove is 0.8 of the thickness of the right image sensor. It is characterized by being more than 1.2 times.
  • a driving chip receiving groove for accommodating and mounting a driving chip for driving a stereoscopic image sensor in a central region between the left receiving groove and the right receiving groove of the printed circuit board. It is characterized by being formed.
  • a driving chip for driving the stereoscopic image sensor is flip-bonded in the central region of the lower surface of the transparent substrate.
  • passive elements are mounted on the outer periphery of the central region between the left accommodating groove and the right accommodating groove of the printed circuit board.
  • an alignment error between the left image sensor and the right image sensor is minimized, thereby providing a stereoscopic image sensor package and a method of manufacturing the same, which can greatly improve the quality of the stereoscopic image output by the stereoscopic image sensor.
  • the thickness of the three-dimensional image sensor package is reduced, there is an effect that the three-dimensional image sensor package and a method of manufacturing the same that can meet the needs of the light and thin, which is particularly important in mobile devices.
  • a consumer who received a stereoscopic image sensor package had to attach a solder ball formed on the package to an electrode pattern formed on a printed circuit board through a reflow process.
  • the solder ball attachment process is omitted, the convenience of the user who is provided with the stereoscopic image sensor package is improved and the deterioration of the stereoscopic image quality due to the alignment error is minimized.
  • the three-dimensional image sensor package and a method of manufacturing the same can be provided.
  • FIG. 1 is a cross-sectional view of a stereoscopic image sensor package according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a printed circuit board included in a three-dimensional image sensor package according to an embodiment of the present invention.
  • FIG. 3 is a schematic plan view of a stereoscopic image sensor package according to an exemplary embodiment.
  • 4 to 14 are views showing a three-dimensional image sensor package manufacturing method according to an embodiment of the present invention.
  • 15 and 16 are cross-sectional views of a stereoscopic image sensor package according to modified embodiments of an embodiment of the present invention.
  • 17 is a cross-sectional view illustrating a structure in which passive devices are mounted on a printed circuit board according to an exemplary embodiment of the present invention.
  • FIG. 1 is a cross-sectional view of a stereoscopic image sensor package according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view of a printed circuit board included in a stereoscopic image sensor package according to an embodiment of the present invention
  • FIG. 3 is a cross-sectional view of the present invention.
  • a stereoscopic image sensor package according to an embodiment of the present invention includes a transparent substrate 10, a left image sensor 20, a right image sensor 30, and a printed circuit board 40. It is configured by.
  • the transparent substrate 10 may be made of a material having excellent light transmittance such as glass or plastic, and functions as a frame to which the left image sensor 20 and the right image sensor 30, which will be described later, are attached and fixed.
  • Conductive patterns 11, 12, 13, and 14 for connecting the left image sensor 20 and the right image sensor 30 to the printed circuit board 40 are formed on the bottom surface of the transparent substrate 10.
  • the left image sensor 20 and the right image sensor 30 are connected to the bottom surface of the transparent substrate 10 by flip chip bonding.
  • sensor bump patterns may be formed on the left image sensor 20 and the right image sensor 30. 21, 22, 31, and 32 are formed.
  • the sensor bump patterns 21, 22, 31, and 32 formed in the left image sensor 20 and the right image sensor 30 are formed in the conductive contact layers 111, 112, 121, 122, 131, 132, 141, By fusion to the conductive patterns 11, 12, 13, and 14 formed on the transparent substrate 10 via the 142, the left image sensor 20 and the right image sensor 30 are attached to the transparent substrate 10. Mechanically connected and fixed at the same time electrically connected. As described above, according to the conventional method of surface-mounting the left image sensor and the right image sensor on the printed circuit board, misalignment occurring in the process of surface-mounting the image sensors, and the bending of the printed circuit board on which the image sensors are mounted.
  • the quality of the stereoscopic image output by the stereoscopic image sensor is greatly reduced due to the alignment error generated.
  • the transparent substrate 10 Since the second is connected to the printed circuit board 40, the alignment error between the left image sensor 20 and the right image sensor 30 is minimized, thereby greatly improving the quality of the stereoscopic image output from the stereoscopic image sensor. It works.
  • the conductive contact layers 111, 121, 131, and 141 may be formed using a photolithography process.
  • anisotropic conductive paste ACP
  • anisotropic conductive film ACF
  • NCP NCP
  • the printed circuit board 40 has a left accommodating groove G1 for accommodating the left image sensor 20 and a right accommodating groove G2 for accommodating the right image sensor 30.
  • the printed circuit board 40 is connected to the bottom surface of the transparent substrate 10 by flip chip bonding.
  • substrate electrode patterns 43, 44, 45, and 46 are formed on the printed circuit board 40.
  • the substrate electrode patterns 43, 44, 45, and 46 formed on the printed circuit board 40 may be formed on the transparent substrate 10 through the conductive contact layers 112, 122, 132, and 142. By fusion to the patterns 11, 12, 13, and 14, the printed circuit board 40 is mechanically connected and fixed to the transparent substrate 10 and electrically connected at the same time.
  • the conductive contact layers 112, 122, 132, and 142 may also be formed using a photolithography process.
  • anisotropic conductive paste ACP
  • anisotropic conductive film ACF
  • NCP NCP
  • the printed circuit board 40 may have a structure in which the flexible printed circuit board 41 and the rigid printed circuit board 42 are stacked in order to improve installation convenience in a small mobile device such as a smartphone. Can be.
  • a connector terminal for connecting a connector for electrically connecting the stereoscopic image sensor package to an external circuit is provided at the side of the flexible printed circuit board 41.
  • the rigid printed circuit board 42 is stacked on the flexible printed circuit board.
  • the rigid printed circuit board 42 has a left accommodating groove G1 and a right image for accommodating the left image sensor 20.
  • the right receiving groove G2 for accommodating the sensor 30 is formed. 2 indicates the depth of the left accommodating groove G1 and the right accommodating groove G2, and W indicates the width of the left accommodating groove G1 and the right accommodating groove G2.
  • the printed circuit board 40 is connected to the transparent substrate 10 while the left image sensor 20 is accommodated in the left accommodating groove G1 and the right image sensor 30 is accommodated in the right accommodating groove G2.
  • the thickness of the entire stereoscopic image sensor package can be reduced by the thickness corresponding to the thickness of the image sensors, so that the applicability to a small mobile device can be improved.
  • the depth of the left accommodating groove G1 is 0.8 to 1.2 times the thickness of the left image sensor 20, and the depth of the right accommodating groove G2 is 0.8 of the thickness of the right image sensor 30. It can be set to more than 1.2 times.
  • the standard of the stereoscopic image sensor package manufactured according to the present embodiment is displayed.
  • W1 is 32.5 mm
  • W2 is 31.85 mm
  • W3 is 5.85 mm
  • W4 is 24 mm
  • H1 is 8.5 mm
  • H2 is 6.3 mm
  • H3 is 4.3 mm.
  • the driving chip is a means for performing operations related to driving a stereoscopic image sensor such as an ISP (Image Signal Processing) and a USB control.
  • ISP Image Signal Processing
  • the driving chip may be flip-bonded to a central region of the lower surface of the transparent substrate.
  • passive elements may be mounted outside the center area between the left accommodating groove and the right accommodating groove of the printed circuit board.
  • 4 to 14 are views showing a three-dimensional image sensor package manufacturing method according to an embodiment of the present invention.
  • a method of manufacturing a stereoscopic image sensor package according to an embodiment of the present invention includes a conductive pattern forming step, a conductive contact layer forming step, a sensor bonding step, and a substrate bonding step.
  • a process of forming the conductive patterns 11, 12, 13, and 14 on the lower surface of the transparent substrate 10 is performed.
  • a photolithography process will be described as an example.
  • the first conductive material layer 100 for forming the conductive patterns 11, 12, 13, and 14 is formed on the bottom surface of the transparent substrate 10.
  • the first conductive material layer 100 and the second conductive material layer 200 to be described later may be formed by screen printing, deposition, sputtering, or the like.
  • a photoresist (PR) having a pattern corresponding to the conductive patterns 11, 12, 13, and 14 is formed on the first conductive material layer 100.
  • the photoresist may be a positive photosensitive material or a negative photosensitive material, but in this embodiment, a positive photosensitive material is adopted.
  • an ultraviolet exposure and development process is performed to remove the photoresist and the photoresist that are not formed in the first conductive material layer 100.
  • the conductive patterns 11, 12, 13, and 14 are formed.
  • the conductive contact layers 111, 112, 121, 122, 131, 132, 141, and 142 are formed on the conductive patterns 11, 12, 13, and 14 formed on the bottom surface of the transparent substrate 10. ) Is carried out.
  • a second conductive material layer 200 for forming a conductive contact layer is formed on the bottom surface of the transparent substrate 10 on which the conductive patterns 11, 12, 13, and 14 are formed.
  • a photoresist having a pattern for forming conductive contact layers 111, 112, 121, 122, 131, 132, 141, and 142 is formed on the second conductive material layer 200.
  • the photoresist may be a positive photosensitive material.
  • the photoresist may be formed at both sides of each of the conductive patterns 11, 12, 13, and 14, that is, the conductive patterns 11 formed on the bottom surface of the transparent substrate 10. , 12, 13, 14 are formed to be aligned so as to span a portion of the left and right edges.
  • the UV patterns and the photoresist are removed from the second conductive material layer 200 by performing ultraviolet exposure and development processes, thereby removing the conductive patterns 11, 12, 13 and 14 form conductive contact layers 111, 112, 121, 122, 131, 132, 141, and 142.
  • the conductive contact layers 111, 112, 121, 122, 131, 132, 141, and 142 are formed by using a photolithography process.
  • anisotropic conductive paste ACP
  • ACF anisotropic conductive film
  • NCP non-conductive paste
  • NCF non-conductive film
  • the transparent substrate 10 and the printed circuit board 40 may be configured to conduct in the vertical direction.
  • the sensor bump pattern is formed by using the left image sensor 20 and the right image sensor 30 on which the sensor bump patterns 21, 22, 31, and 32 are formed.
  • the left image sensor 20 and the right image sensor 30 by heat-treating and pressing in a state in which the fields 21, 22, 31, 32 and the conductive contact layers 111, 121, 131, and 141 are aligned to contact each other. Bonding to the substrate 10 is performed.
  • the sensor bump patterns 21, 22, 31, and 32 formed on the left image sensor 20 and the right image sensor 30 may be formed on the conductive contact layers 111, 121, 131, and 141.
  • the left image sensor 20 and the right image sensor 30 is mechanically bonded to the transparent substrate 10 Connected and fixed at the same time electrically connected.
  • the conventional method of surface-mounting the left image sensor 20 and the right image sensor 30 on a printed circuit board alignment errors occurring during the surface-mounting of the image sensors and the image sensors are mounted.
  • the quality of the stereoscopic image output by the stereoscopic image sensor is greatly deteriorated due to the addition of alignment errors and the like that occur in the bending of the printed circuit board.
  • the transparent substrate 10 Since the second is connected to the printed circuit board 40, the alignment error between the left image sensor 20 and the right image sensor 30 is minimized, thereby greatly improving the quality of the stereoscopic image output from the stereoscopic image sensor. It works.
  • the printed circuit board 40 on which the substrate electrode patterns 43, 44, 45, and 46 are formed may be formed on the substrate electrode patterns 43, 44, and 45.
  • , 46 and the conductive contact layers 112, 122, 132, and 142 are heat-treated and pressurized while being aligned so as to contact the printed circuit board 40 to the transparent substrate 10. That is, the substrate electrode patterns 43, 44, 45, and 46 formed on the printed circuit board 40 are formed on the transparent substrate 10 through the conductive contact layers 112, 122, 132, and 142.
  • the printed circuit board 40 is mechanically connected and fixed to the transparent substrate 10 and electrically connected thereto.
  • the printed circuit board 40 is connected to the bottom surface of the transparent substrate 10 by flip chip bonding.
  • the substrate electrode patterns 43, 44, 45, and 46 formed on the printed circuit board 40 are means for connecting the printed circuit board 40 to the transparent substrate 10 by flip chip bonding.
  • the printed circuit board 40 has a left accommodating groove G1 for accommodating the left image sensor 20 and a right accommodating groove G2 for accommodating the right image sensor 30.
  • the left image sensor 20 is accommodated in the left accommodating groove G1 and the right image sensor 30 is accommodated in the right accommodating groove G2. 10).
  • the thickness of the entire stereoscopic image sensor package can be reduced as much as the thickness of the image sensors, so that the applicability to a small mobile device can be improved.
  • the depth of the left accommodating groove G1 is 0.8 to 1.2 times the thickness of the left image sensor 20, and the depth of the right accommodating groove G2 is 0.8 of the thickness of the right image sensor 30. It can be set to more than 1.2 times.
  • the printed circuit board 40 may have a structure in which the flexible printed circuit board 41 and the rigid printed circuit board 42 are stacked in order to improve installation convenience in a small mobile device such as a smartphone. Can be.
  • a connector terminal for connecting a connector for electrically connecting the stereoscopic image sensor package to an external circuit may be provided at the side of the flexible printed circuit board 41.
  • the alignment error between the left image sensor and the right image sensor is minimized, thereby improving the quality of the stereoscopic image output by the stereoscopic image sensor.
  • the thickness of the three-dimensional image sensor package is reduced to meet the needs of light and thin, particularly important in mobile devices.
  • a consumer who received a stereoscopic image sensor package had to attach a solder ball formed on the package to an electrode pattern formed on a printed circuit board through a reflow process.
  • the solder ball attaching process is omitted, the convenience of the consumer provided with the stereoscopic image sensor package is improved and the deterioration of the stereoscopic image quality due to the alignment error is minimized.
  • the three-dimensional image sensor package and a method of manufacturing the same can be provided.
  • the driving chip is a means for performing operations related to driving a stereoscopic image sensor such as an ISP (Image Signal Processing) and a USB control.
  • ISP Image Signal Processing
  • the driving chip may be flip-bonded to a central region of the lower surface of the transparent substrate.
  • passive elements may be mounted outside the center area between the left accommodating groove and the right accommodating groove of the printed circuit board.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

La présente invention porte sur un boîtier de capteur d'image stéréoscopique et sur un procédé de fabrication de celui-ci. Le boîtier de capteur d'image stéréoscopique selon la présente invention comprend : un substrat transparent ; un capteur d'image gauche relié à une surface inférieure du substrat transparent d'une manière à collage à puce retournée ; un capteur d'image droit espacé du capteur d'image gauche et relié à la surface inférieure du substrat transparent d'une manière à collage à puce retournée ; une carte de circuits imprimés ayant une rainure de réception gauche destinée à recevoir le capteur d'image gauche et une rainure de réception droite destinée à recevoir le capteur d'image droit, la carte de circuits imprimés étant reliée à la surface inférieure du substrat transparent de la manière à collage à puce retournée. Selon la présente invention, une erreur d'alignement entre le capteur d'image gauche et le capteur d'image droit peut être rendue minimale pour améliorer la qualité d'une image stéréoscopique délivrée en sortie par le capteur d'image stéréoscopique. De plus, l'épaisseur du boîtier de capteur d'image stéréoscopique peut être réduite pour satisfaire les exigences importantes pour les dispositifs mobiles qui doivent être de poids léger, minces, petits et compacts.
PCT/KR2011/004526 2011-06-03 2011-06-21 Boîtier de capteur d'image stéréoscopique et son procédé de fabrication WO2012165691A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0053929 2011-06-03
KR1020110053929A KR101084689B1 (ko) 2011-06-03 2011-06-03 입체 이미지 센서 패키지 및 그 제조방법

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WO2012165691A1 true WO2012165691A1 (fr) 2012-12-06

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JP2005292242A (ja) * 2004-03-31 2005-10-20 Matsushita Electric Ind Co Ltd 撮像装置および撮像装置の製造方法
JP2008124923A (ja) * 2006-11-14 2008-05-29 Matsushita Electric Works Ltd カメラモジュール
KR20110052256A (ko) * 2009-11-12 2011-05-18 삼성전자주식회사 유기 광전변환막을 이용한 입체용 컬러 이미지센서

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108780801A (zh) * 2016-03-25 2018-11-09 索尼公司 半导体装置、固体摄像元件、摄像装置和电子设备
EP3435415A4 (fr) * 2016-03-25 2019-03-20 Sony Corporation Dispositif à semi-conducteurs, élément d'imagerie solide, dispositif d'imagerie et appareil électronique
US11031429B2 (en) 2016-03-25 2021-06-08 Sony Corporation Semiconductor device, solid-state image pickup element, image pickup device, and electronic apparatus
CN108780801B (zh) * 2016-03-25 2023-05-12 索尼公司 半导体装置、固体摄像元件、摄像装置和电子设备
US11923395B2 (en) 2016-03-25 2024-03-05 Sony Group Corporation Semiconductor device, solid-state image pickup element, image pickup device, and electronic apparatus

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