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WO2012039020A1 - Procédé de production d'une résistance miniature à plaque métallique et à faible résistance - Google Patents

Procédé de production d'une résistance miniature à plaque métallique et à faible résistance Download PDF

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Publication number
WO2012039020A1
WO2012039020A1 PCT/JP2010/066313 JP2010066313W WO2012039020A1 WO 2012039020 A1 WO2012039020 A1 WO 2012039020A1 JP 2010066313 W JP2010066313 W JP 2010066313W WO 2012039020 A1 WO2012039020 A1 WO 2012039020A1
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WO
WIPO (PCT)
Prior art keywords
metal plate
strip
chip resistor
resistance
protective film
Prior art date
Application number
PCT/JP2010/066313
Other languages
English (en)
Japanese (ja)
Inventor
平野　立樹
Original Assignee
釜屋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 釜屋電機株式会社 filed Critical 釜屋電機株式会社
Priority to PCT/JP2010/066313 priority Critical patent/WO2012039020A1/fr
Priority to CN201180045471.9A priority patent/CN103201801B/zh
Priority to PCT/JP2011/064966 priority patent/WO2012039175A1/fr
Priority to JP2012516242A priority patent/JPWO2012039175A1/ja
Priority to KR1020137007074A priority patent/KR101435351B1/ko
Priority to TW100126079A priority patent/TWI433170B/zh
Publication of WO2012039020A1 publication Critical patent/WO2012039020A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing

Definitions

  • the present invention relates to a method for manufacturing a chip resistor using a resistive metal plate.
  • a means for detecting current is required.
  • electronic components such as a shunt resistor are often used.
  • a chip resistor is known as a resistor applied to such a shunt resistor.
  • a resistive metal plate is mainly applied to manufacture a chip resistor having a very low resistance value such as several m ⁇ .
  • a low resistance chip resistor manufactured using such a resistance metal plate is generally called a metal plate low resistance chip resistor.
  • the metal plate low resistance chip resistor 1 has a rectangular parallelepiped appearance, and is manufactured using the resistance metal plate 2.
  • Protective films 3a and 3b are formed on the front surface 2a and the back surface 2b of the resistance metal plate 2, respectively. These protective films 3a and 3b are electrically insulating films. Further, the surfaces (that is, the width of the surface 2a) of both end portions 2e and 2f in the length direction of the resistance metal plate 2 on which the protective films 3a and 3b are not formed (the horizontal direction in FIGS. 9B and 9C).
  • Electrode plating films 4a and 4b are formed on both end portions 2a-1 and 2a-2 in the direction, both end portions 2b-1 and 2b-2 in the width direction of the back surface 2b, and both end surfaces 2c and 2d). .
  • each dimension (unit: mm) of the chip resistor 1 for example, the total length L1 of the chip resistor 1 is 1.6 ⁇ 0.1 (tolerance), and the length C of the electrode plating films 4a and 4b is 0.2. ⁇ 0.1 (tolerance), the width W of the chip resistor 1 is 0.8 ⁇ 0.1 (tolerance), and the thickness H of the chip resistor 1 is 0.3 ⁇ 0.1 (tolerance) It is prescribed.
  • Each dimension of the chip resistor 1 including these tolerances is defined based on dimensional restrictions when the chip resistor 1 is mounted on the circuit board.
  • the length L2 of the protective films 3a and 3b is a difference (L1-2 ⁇ C) between the total length L1 of the chip resistor 1 and the length (total length) 2 ⁇ C of the electrode plating films 4a and 4b on both sides. .
  • L2 is also the length of the portion of the resistance metal plate 2 covered by the protective films 3a and 3b.
  • T is the thickness of the resistance metal plate 2
  • L3 is the length of the resistance metal plate 2.
  • the metal plate low resistance chip resistor 1 having the structure as shown in FIG. 9 is formed by using a strip-like resistance metal plate cutting step (step S1) and a slit forming step (step S2) shown in the process flowchart of FIG.
  • step S1 a strip-like resistance metal plate cutting step
  • step S2 a slit forming step
  • step S3 a protective film forming step
  • step S4 a slit forming step
  • step S5 the strip portion cutting step
  • step S6 the strip portion cutting step
  • the slit forming step (step S2) and the protective film forming step (step S3) will be further described with reference to FIGS.
  • the strip-shaped resistance metal plate cutting step (step S1), the electrode plating film forming step (step S4), the strip-shaped portion cutting step (step S5), and the strip-shaped portion cutting step (step S6) are shown in FIG.
  • a plurality of (six in the illustrated example) slits 6 are formed in the rectangular resistance metal plate 2B.
  • the resistive metal plate 2B is cut from the strip-shaped resistive metal plate 2A (see FIG. 2) in the strip-shaped resistive metal plate cutting step (step S1).
  • the slits 6 extend in the length direction of the resistance metal plate 2B (up and down direction in FIG. 11B), and are parallel to each other in the width direction of the resistance metal plate 2B (left and right direction in FIG. 12B). ing.
  • the position where the slit 6 is formed is set with the positioning mark 5 as a reference.
  • the resistance metal plate 2 ⁇ / b> B has a plurality (four in the illustrated example) of strip-like portions 7 extending in the length direction of the resistance metal plate 2 ⁇ / b> B and the plurality of strip-like shapes. It becomes a shape which has the connection part 8 which connects the both ends of the length direction (up-down direction of FIG.12 (b)) of the part 7 respectively.
  • a plurality of (four in the illustrated example) protective films 3A and 3B are formed by screen printing or the like.
  • Each strip 7 is formed on the front surface 2B-1 and the back surface 2B-2 of the resistance metal plate 2B, respectively.
  • These protective films 3A and 3B extend in the length direction of the resistance metal plate 2B, and are parallel to each other in the width direction of the resistance metal plate 2B. The positions where the protective films 3A and 3B are formed are set with the positioning mark 5 as a reference.
  • Patent Documents 1 and 2 there are the following Patent Documents 1 and 2.
  • the slit 6 is formed before the protective films 3A and 3B. That is, after forming the strip-shaped portion 7 by forming the slit 6 in the resistive metal plate 2B, the protective films 3A and 3B are formed on the strip-shaped portion 7. Therefore, the conventional method for manufacturing a metal plate low resistance chip resistor has the following problems.
  • the protective films 3A and 3B are formed on the front surface 2B-1 and the back surface 2B-2 of the very narrow resistance metal plate 2B in the strip-shaped portion 7. I have to do it. For this reason, it is difficult to form the protective films 3A and 3B.
  • the width of the resistance metal plate 2B in the strip portion 7 is further narrowed, so that it becomes more difficult to form the protective films 3A and 3B.
  • the paste is generally patterned by a screen printing method.
  • a photolithography method is applied. And when applying this photolithography method, if the slit 6 is formed ahead of the protective films 3A and 3B, this complicates the construction method.
  • the strip-shaped resistive metal plate 2A (see FIG. 2) used for manufacturing the chip resistor 1 is manufactured by repeating the annealing process and the rolling process in order to obtain a desired thickness.
  • the thickness of the manufactured strip-shaped resistance metal plate 2A is not completely uniform, and the thickness varies particularly in the width direction of the resistance metal plate 2A. For this reason, the thickness variation in the width direction also occurs in the resistance metal plate 2B cut from the strip-shaped resistance metal plate 2A.
  • the resistance value of the chip resistor 1 is determined by the width W, the length L2, and the thickness T (see FIG. 9) of the portion of the resistive metal plate 2 covered with the protective films 3a and 3b. That is, it is determined by the later-described equation (1). For this reason, in the manufacturing process of the chip resistor 1, the widths L2 1 , L2 2 , L2 3 , L2 of the protective films 3A, 3B shown in FIG. 12 according to the thickness variation in the width direction of the resistive metal plate 2B. By adjusting 4 , it is necessary to reduce the variation in resistance value of the chip resistor 1.
  • the allowable range of adjustment for the widths L2 1 , L2 2 , L2 3 and L2 4 of the protective films 3A and 3B should be as large as possible. desirable.
  • the allowable adjustment range of the length L2 of the protective films 3a and 3b in the conventional manufacturing method is 0.4 mm. . That is, since the slit 6 is formed before the protective films 3A and 3B, the length L3 of the resistive metal plate 2 is determined before the length L2 of the protective films 3a and 3b in the chip resistor 1, The total length L1 of the chip resistor 1 is determined.
  • the variation in the resistance value of the chip resistor 1 due to the variation in the thickness in the width direction of the resistance metal plate 2B is not a method of trimming the resistance metal plate 2B, but the width L2 1 , of the protective films 3A and 3B. It is necessary to carry out the method by adjusting L2 2 , L2 3 , and L2 4 .
  • the present invention can easily form a protective film without being affected by the width of the resistive metal plate in the strip-shaped portion, and according to the thickness variation in the width direction of the resistive metal plate.
  • the width of the protective film (the length of the protective film in the chip resistor) can be adjusted, and further, the allowable range of adjustment of the width of the protective film (the length of the protective film in the chip resistor) can be increased. It is an object of the present invention to provide a method for manufacturing a metal plate low resistance chip resistor.
  • the manufacturing method of the metal plate low resistance chip resistor of the first invention that solves the above problem is a manufacturing method of a chip resistor using a rectangular or strip-shaped resistance metal plate, A protective film forming step of forming a plurality of protective films extending in the length direction of the resistive metal plate in the width direction of the resistive metal plate with respect to each of the front and back surfaces of the resistive metal plate; Forming a slit extending in the length direction of the resistive metal plate between the adjacent protective films in the width direction and outside the protective film located on both sides of the width direction in the resistive metal plate; The plurality of strip-shaped portions having a width wider than the protective film and extending in the length direction of the resistance metal plate, and both ends in the length direction of the plurality of strip-shaped portions, respectively.
  • a slit forming step to form a connecting portion to be connected An electrode plating film forming step for forming an electrode plating film on the surfaces of both end portions in the width direction of the strip-shaped part where the protective metal plate is not formed and the resistance metal plate is exposed;
  • a strip-shaped portion cutting step of cutting the strip-shaped portion from the connecting portion A strip-shaped portion cutting step for cutting the strip-shaped portion into a plurality of pieces, The chip resistor is manufactured by performing sequentially.
  • the manufacturing method of the metal plate low resistance chip resistor of the second invention is the manufacturing method of the metal plate low resistance chip resistor of the first invention, Conducting a resistance metal plate thickness measurement step of measuring the thickness at each position in the width direction of the resistance metal plate forming the plurality of protective films before the protective film formation step, In the protective film forming step, the width of each of the plurality of protective films is set according to the thickness at each position in the width direction of the resistive metal plate measured in the resistive metal plate thickness measuring step.
  • a chip resistor manufacturing method using a rectangular or strip-shaped resistance metal plate for each of the front surface and the back surface of the resistance metal plate.
  • a slit forming step for forming a shape having a plurality of strip-shaped portions extending in the length direction of the resistance metal plate and connecting portions respectively connecting both ends in the length direction of the plurality of strip-shaped portions, and the protection A film is formed
  • An electrode plating film forming step for forming an electrode plating film on the surfaces of both end portions in the width direction of the strip-shaped portion where the resistance metal plate is exposed, and a strip-shaped configuration in which the strip-shaped portion is cut from the connecting portion. Since the chip resistor is manufactured by sequentially performing a part cutting process and a strip part cutting process for cutting the strip part into a plurality of pieces, a slit (that is, a strip shape) The protective film is formed before the part.
  • a protective film can be formed.
  • the allowable range of adjustment of the width of the protective film (the length of the protective film in the chip resistor) can be increased (see FIG. 8: details will be described later).
  • the metal plate low resistance chip resistor manufacturing method of the second invention in the metal plate low resistance chip resistor manufacturing method of the first invention, in the width direction of the resistance metal plate forming the plurality of protective films
  • the resistance metal plate thickness measurement step for measuring the thickness at each position is performed before the protective film formation step, and the resistance metal plate measured in the resistance metal plate thickness measurement step in the protective film formation step Since the width of each of the plurality of protective films is set according to the thickness at each position in the width direction, the thickness of the resistance metal plate in the width direction is added to the effect of the first invention.
  • the width of the protective film (the length of the protective film in the chip resistor) can also be adjusted according to the variation in thickness. For this reason, the variation in the resistance value of the chip resistor due to the variation in the thickness in the width direction of the resistance metal plate can be reduced.
  • A is a perspective view of the strip
  • (b) is a top view of the rectangular-shaped resistance metal plate for demonstrating a strip
  • (A) is a perspective view of a resistance metal plate for explaining the resistance metal plate thickness measurement step
  • (b) is a plan view of the resistance metal plate for explaining the resistance metal plate thickness measurement step
  • (c) is a plan view of the resistance metal plate.
  • FIG. 5 is an enlarged cross-sectional view of a resistance metal plate and the like (for example, an enlarged cross-sectional view taken along line BB in FIG. 5B).
  • FIG. 5 is an enlarged cross-sectional view of the resistance metal plate and the like (a cross-sectional enlarged view taken along the line CC in FIG. 5B).
  • (A) is a perspective view of a resistance metal plate or the like for explaining the electrode plating film forming step
  • (b) is a plan view of the resistance metal plate or the like for explaining the electrode plating film forming step
  • (c) is an electrode plating.
  • FIG. 6 is an enlarged cross-sectional view of a resistive metal plate and the like for explaining the film forming process (cross-sectional enlarged view taken along the line DD in FIG. 5B).
  • A is a perspective view of a resistance metal plate or the like for explaining the strip-shaped portion cutting step
  • (b) is a perspective view of the strip-shaped portion for explaining the strip-shaped portion cutting step and the strip-shaped portion cutting step
  • ( c) is a perspective view of a metal plate low resistance chip resistor (individual piece) for explaining a strip portion cutting step. It is a table
  • FIG. 6 is a cross-sectional view taken along line EE in (b) showing the structure. It is a flowchart which shows the manufacturing process of the conventional metal plate low resistance chip resistor.
  • A) is a perspective view of a resistive metal plate for explaining the slit forming step
  • (b) is a plan view of the resistive metal plate for explaining the slit forming step
  • (c) is for explaining the slit forming step.
  • FIG. 6 is an enlarged cross-sectional view of the resistance metal plate (an enlarged cross-sectional view taken along line FF in FIG. 5B).
  • A is a perspective view of a resistance metal plate or the like for explaining the protective film forming step
  • (b) is a plan view of the resistor metal plate or the like for explaining the protective film forming step
  • (c) is a protective film forming step.
  • FIG. 6 is an enlarged cross-sectional view of a resistance metal plate and the like (a cross-sectional enlarged view taken along the line GG in FIG. 5B). It is a table
  • FIGS. A method for manufacturing a chip resistor according to an embodiment of the present invention will be described with reference to FIGS. Note that the structure of the metal plate low resistance chip resistor manufactured by the chip resistor manufacturing method of the present embodiment is as already described with reference to FIG. 10, and therefore detailed description thereof is omitted here. To do.
  • a metal plate low resistance chip resistor 1 having a structure as shown in FIG. 10 is used in a strip-like resistance metal plate cutting step (step S11) shown in the process flowchart of FIG. 1 and resistance metal plate thickness measurement.
  • Step S12 protective film formation step (Step S13), slit formation step (Step S14), electrode plating film formation step (Step S15), strip portion cutting step (Step S16), strip shape It manufactures by implementing a partial cutting process (step S17) in order.
  • the strip-shaped resistive metal plate 2A conveyed in the direction of arrow J by the transport device (not shown) is converted into a laser. It cut
  • the strip-shaped resistance metal plate 2A is made of a material such as FeCrAl-based, CuNi-based or CuMn-based, and in order to obtain a desired thickness, the material in the slab state is subjected to various processes, an annealing process and a rolling process. It is manufactured by repeating the process.
  • a rectangular resistance metal plate 2B as shown in FIG. 2B is obtained.
  • positioning marks 5 are provided on the strip-shaped resistive metal plate 2A at regular intervals in the length direction on both sides in the width direction. As shown in FIG. 2B, these positioning marks 5 are located on both sides in the width direction at the front end in the length direction of the rectangular resistance metal plate 2B.
  • the positioning mark 5 is not limited to this, and may be only on one side in the width direction, or may be on the rear end portion or the center portion in the length direction of the resistance metal plate 2B.
  • a plurality of (four in the illustrated example) protective films 3A, 3B (virtual lines (one point) Thicknesses T 1 , T 2 , T 3 , T 4 at respective positions in the width direction (left and right direction in FIG. 3B) of the resistance metal plate 2B forming (Omitted)
  • Each position in the width direction of the resistance metal plate 2B where the plate thickness is measured is set with the positioning mark 5 as a reference.
  • each position in the width direction of the resistance metal plate 2B where the plate thickness is measured is set for each of the protective films 3A and 3B one by one.
  • the present invention is not limited to this.
  • the respective positions in the width direction of the resistance metal plate 2B where the thickness is measured are set at a plurality of locations, and the thickness of the resistance metal plate 2B measured at these plurality of locations. May be the thicknesses T 1 , T 2 , T 3 , T 4 at each position in the width direction of the resistive metal plate 2B.
  • a plurality of (four in the illustrated example) protective films 3A and 3B are formed by screen printing or photolithography. By the method or the like, it is formed on the front surface 2B-1 and the back surface 2B-2 of the resistance metal plate 2B, respectively.
  • These protective films 3A and 3b extend in the length direction of the resistance metal plate 2B and are parallel to each other in the width direction of the resistance metal plate 2B. The positions where the protective films 3A and 3B are formed are set with the positioning mark 5 as a reference.
  • the widths of the protective films 3A and 3B (that is, the lengths of the protective films 3a and 3b in the chip resistor 1) L2 1 , L2 2 , L2 3 and L2 4
  • the resistance metal plate thickness is measured according to the thicknesses T 1 , T 2 , T 3 , and T 4 at the respective positions in the width direction of the resistance metal plate 2B measured in the resistance metal plate thickness measurement step (step S12).
  • the widths L2 1 , L2 2 , L2 3 , L2 4 of the protective films 3A, 3B are calculated based on the following equation (2). Equation (2) is a modification of Equation (1).
  • R is the resistance value (target resistance value) of the chip resistor 1
  • L2 is the length of the protective films 3a and 3b in the chip resistor 1 (that is, the protective film 3a of the resistive metal plate 2).
  • W is the width (target value) of the chip resistor 1 (ie, the width of the resistive metal plate 2)
  • T n is the thickness of the resistive metal plate 2
  • ⁇ is the resistive metal plate. 2 volume resistivity. That is, the resistance value R of the chip resistor 1 is the width W, length L2, and thickness Tn (L2 / (W ⁇ Tn )) of the portion of the resistive metal plate 2 covered with the protective films 3a and 3b. , Determined by the volume resistivity ⁇ of the resistive metal plate 2.
  • the resistance value R (target resistance value), the width W (target value) determined in the strip portion cutting step (step 17), and the volume resistivity ⁇ are known, and the thickness T n (that is, the anti-metal plate 2B).
  • the thicknesses T 1 , T 2 , T 3 , and T 4 ) at the respective positions in the width direction are also measured and known in the previous resistance metal plate thickness measurement step (step S12), and these values are used.
  • each protective film 3A, 3B according to the thickness T 1 , T 2 , T 3 , T 4 at each position in the width direction of the anti-metal plate 2B (that is, the chip resistor 1) L2 1 , L2 2 , L2 3 , and L2 4 can be calculated.
  • the protective film 3A, 3B is formed by printing the paste of the epoxy resin on the front surface 2B-1 and the back surface 2B-2 of the resistance metal plate 2B and baking the screen-printed paste.
  • a pattern corresponding to the calculated values of the widths L2 1 , L2 2 , L2 3 , and L2 4 of the protective films 3A and 3B is set, and the protective films 3A and 3B are set.
  • a plurality of (six in the illustrated example) slits 6 are formed in the resistance metal plate 2B. These slits 6 extend in the length direction of the resistance metal plate 2B (vertical direction in FIG. 5B), and are adjacent protective films in the width direction of the resistance metal plate 2B (left and right direction in FIG. 5B).
  • 3A and 3B that is, between the protective films 3A and 3A on the front surface 2B-1 side and between the protective films 3B and 3B on the back surface 2B-2 side) and on both sides in the width direction of the resistive metal plate 2B It is formed outside 3A and 3B (that is, outside the protective film 3A on both sides in the width direction on the surface 2B-1 side and outside the protective film 3B on both sides in the width direction on the back surface 2B-2 side).
  • the position where the slit 6 is formed is set with the positioning mark 5 as a reference.
  • the resistance metal plate 2 ⁇ / b> B has a plurality of (four in the illustrated example) strip-like portions 7 extending in the length direction of the resistance metal plate 2 ⁇ / b> B and the plurality of strip-like shapes. It becomes a shape which has the connection part 8 which connects the both ends of the length direction (up-down direction of FIG.5 (b)) of the part 7 respectively.
  • L4 1 , L4 2 , L4 3 , L4 4 , and L4 5 are the widths of the slits 6, and L3 1 , L3 2 , L3 3 , and L3 4 are the widths of the resistance metal plate 2 B in the strip-shaped portion 7. (The length L3 of the resistance metal plate 2 in the chip resistor 1).
  • the slit 6 is formed on the front and back sides 2B- of the resistance metal plate 2B by a dry film exposed and developed so as to leave a portion corresponding to the connecting portion 8 and the strip-like portion 7 wider than the protective films 3A and 3B. 1 and 2B-2 including the protective films 3A and 3B are covered, and in this state, an etching solution suitable for each type (various materials) of the resistance metal plate 2B is applied to both the front and back surfaces 2B-1, 2B- of the resistance metal plate 2B.
  • the resistance metal plate 2B is formed by etching with an etching method of spraying to 2.
  • the side surface (surface on the slit 6 side) 2B-5 of the resistive metal plate 2B in the strip-shaped portion 7 becomes the front and back both surfaces 2B-1 and 2B-2 of the resistive metal plate 2B. It becomes a flat surface perpendicular to the rectangular shape, and the width L3 1 , L3 2 , L3 3 , L3 4 (the length L3 of the resistive metal plate 2 in the chip resistor 1) of the resistive metal plate 2B in the strip portion 7 is set with high accuracy. can do.
  • the means for forming the slit 6 is not necessarily limited to the etching method, and means such as laser processing can also be used.
  • the connecting portions 8 are formed at both ends of the strip-shaped portion 7 in the length direction. However, the present invention is not limited thereto, and the connecting portions 8 are formed only at one end in the length direction of the strip-shaped portion 7. May be.
  • Electrode plating films 4A and 4B are formed by electroplating on the surfaces of both end portions 2B-3 and 2B-4 in the width direction of the resistance metal plate 2B (left and right direction in FIG. 6C).
  • a plating film 4C (shown in a perspective view of a one-dot chain line for convenience of explanation) is also formed on the peripheral edge portion of the resistance metal plate 2B such as the connecting portion 8.
  • a nickel plating film and a tin plating film are formed as the electrode plating films 4A and 4B.
  • the electrode plating films 4A and 4B may be formed by forming nickel strike plating, copper plating, nickel plating, and tin plating film in this order.
  • step S16 the resistance metal plate 2A is cut at a cutting position M indicated by a one-dot chain line (virtual line).
  • the strip portion 7 is cut out from the connecting portion 8.
  • FIG. 7B shows an enlarged view of one of the plurality of strip-like portions 7 cut out from the connecting portion 8.
  • a plurality of strip portions 7 are cut at the cutting position N indicated by the alternate long and short dash line (virtual line). Cut into 10 pieces in the illustrated example.
  • the metal plate low resistance chip resistor 1 as shown in FIG. 16C is manufactured. That is, by cutting the strip-shaped portion 7 into a plurality of pieces, the resistance metal plate 2B in the strip-shaped portion 7, the protective films 3A and 3B, and the electrode plating films 4A and 4B are used to form the resistance metal in the chip resistor 1. A plate 2, protective films 3a and 3b, and electrode plating films 4a and 4b are formed, respectively.
  • the width L1 of the resistive metal plate 2B and the electrode plating films 4B and 4B in the strip-shaped portion 7 corresponds to the total length L1 of the chip resistor 1.
  • the width C of the electrode plating films 3A and 3B in the strip portion 7 corresponds to the length C of the electrode plating film 3a in the chip resistor 1
  • the width L2 of the protective films 3A and 3B in the strip portion 7 is This corresponds to the length L2 of the protective films 3a and 3b in the chip resistor 1
  • the width L3 of the resistive metal plate 2B in the strip portion 7 corresponds to the length L3 of the resistive metal plate 2 in the chip resistor 1.
  • the chip resistor manufacturing process including the resistance metal plate thickness measurement process as described above is performed on any of the rectangular resistance metal plates 2B sequentially cut from the strip-like resistance metal plate 2A. This is because the thickness variation may occur in the length direction of the strip-shaped resistance metal plate 2A. In this case, the thickness variation in the width direction is different for each resistance metal plate 2B.
  • the thickness measurement is performed only on the rectangular resistive metal plate 2B that is first cut from the strip-shaped resistive metal plate 2A.
  • the protective film 3A is formed on the rectangular resistive metal plate 2B which is cut out from the strip-shaped resistive metal plate 2A on the second and subsequent widths. , 3B may be applied.
  • the resistance metal plate 2B By forming the resistance metal plate 2B on the metal plate 2B, the plurality of strip portions 7 having a width wider than the protective films 3A and 3B and extending in the length direction of the resistance metal plate 2B, and the plurality of strips
  • the protective films 3A and 3B are formed before the slit 6 (that is, the strip-shaped portion 7).
  • the width of the resistive metal plate 2B in the strip portion 7 is reduced.
  • the protective films 3A and 3B can be easily formed without being affected by L3. That is, it is easy to form the protective films 3A and 3B by screen printing or photolithography.
  • the allowable range of adjustment of the width L2 of the protective films 3A and 3B (the length of the protective films 3a and 3b in the chip resistor 1) L2 can be increased.
  • L2 the width of the protective films 3A and 3B
  • a description will be given based on FIG. 8, for example, when the length L2 of the protective films 3a and 3b is set to 0.9 mm, the total length of the electrode plating films 4a and 4b.
  • the chip resistor 1 The total length L1 is 1.5 mm and 1.1 mm, respectively.
  • the chip resistor 1 is used when the total length 2 ⁇ C of the electrode plating films 4a and 4b is 0.6 mm at the longest and 0.2 mm at the shortest.
  • the total length L1 is 1.8 mm and 1.4 mm, respectively. Therefore, the total length L1 of the chip resistor 1 may be set in the range of 1.5 to 1.7 mm.
  • the chip resistor 1 When the length L2 of the protective films 3a and 3b is set to 1.5 mm, the chip resistor 1 is used when the total length 2 ⁇ C of the electrode plating films 4a and 4b is 0.6 mm at the longest and 0.2 mm at the shortest.
  • the total length L1 is 2.1 mm and 1.7 mm, respectively. Therefore, the total length L1 of the chip resistor 1 may be set in a range of 1.7 mm which is the longest allowable dimension. Therefore, the adjustment allowable range of the length L2 of the protective films 3a and 3b is 0.6 mm, which is larger than the adjustment allowable range of 0.4 mm (see FIG. 13) in the conventional manufacturing method.
  • the thicknesses T 1 and T 2 at the respective positions in the width direction of the resistance metal plate 2B forming the plurality of protective films 3A and 3B. , T 3 and T 4 are measured before the protective film forming step (step S13), and the resistance metal plate thickness measuring step (step S13) is performed.
  • the respective protective films 3A, 3B Since the widths L2 1 , L2 2 , L2 3 , and L2 4 are set, the widths of the protective films 3A and 3B (in the chip resistor 1 in accordance with the thickness variation in the width direction of the resistive metal plate 2B). Adjusting the length of the protective films 3a, 3b) It can be. For this reason, variation in the resistance value of the chip resistor 1 due to variation in the thickness in the width direction of the resistive metal plate 2B can be reduced.
  • the rectangular resistive metal plate 2B is cut from the strip-shaped resistive metal plate 2A, and the protective films 3A and 3B are applied to the rectangular resistive metal plate 2B.
  • the strip-shaped portion 7 is cut out, but the present invention is not necessarily limited thereto. That is, the rectangular resistive metal plate 2B is not cut, and the protective films 3A and 3B, the slit 6 (strip-shaped portion 7), and the electrode plating films 4A and 4B are formed on the strip-shaped resistive metal plate 2B.
  • the strip portion 7 may be cut out.
  • the present invention relates to a method of manufacturing a chip resistor using a resistance metal plate, and is particularly useful when applied to a case where the width of the resistance metal plate of the strip-shaped portion becomes very narrow in the manufacturing process of the chip resistor. is there.
  • 1 metal plate low resistance chip resistor 2 resistance metal plate, 2A strip-shaped resistance metal plate, 2B rectangular resistance metal plate, 2B-1 front surface, 2B-2 back surface, 2B-3, 2B-4 end, 2B -5 side, 2a front, 2a-1, 2a-2 end, 2b back, 2b-1, 2b-2 end, 2c, 2d end, 2e, 2f end, 3a, 3b protective film, 3A, 3B Protective film, 4a, 4b electrode plating film, 4A, 4B electrode plating film, 5 positioning mark, 6 slit, 7 strip-shaped part, 8 connecting part

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

L'invention vise à proposer un procédé de production d'une résistance miniature à plaque métallique et à faible résistance pour laquelle un film de protection peut être formé facilement sans être affecté par la largeur de la résistance à plaque métallique au niveau des pièces en forme de bande et pour laquelle la largeur du film de protection peut être ajustée en fonction des variations d'épaisseur dans la direction de la largeur de la résistance à plaque métallique. L'invention vise également à proposer une résistance miniature à plaque métallique et à faible résistance offrant une plus grande liberté dans l'ajustement de la largeur du film de protection. À cet effet, une étape de formation de film de protection (étape S13) qui consiste à former un film de protection sur la surface avant et la surface arrière d'une résistance à plaque métallique est d'abord exécutée, puis est exécutée une étape de formation de fente (étape S14) qui consiste à former une fente dans la résistance à plaque métallique et à mettre en forme la résistance à plaque métallique en une forme ayant les parties en forme de bande et les parties de connexion. En outre, une étape de mesure d'épaisseur de résistance à plaque métallique (étape 12), qui consiste à mesurer l'épaisseur dans différents positions sur la largeur de la résistance à plaque métallique pour laquelle le film de protection est formé, est exécutée avant l'étape de formation de film de protection (étape S13) et, dans l'étape de formation de film de protection (étape S13), la largeur du film de protection est définie en fonction de l'épaisseur qui a été mesurée dans chacune des positions sur la largeur de la résistance à plaque métallique.
PCT/JP2010/066313 2010-09-21 2010-09-21 Procédé de production d'une résistance miniature à plaque métallique et à faible résistance WO2012039020A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
PCT/JP2010/066313 WO2012039020A1 (fr) 2010-09-21 2010-09-21 Procédé de production d'une résistance miniature à plaque métallique et à faible résistance
CN201180045471.9A CN103201801B (zh) 2010-09-21 2011-06-29 金属板低电阻芯片电阻器的制造方法
PCT/JP2011/064966 WO2012039175A1 (fr) 2010-09-21 2011-06-29 Procédé de production d'une résistance miniature à plaque métallique à faible résistance
JP2012516242A JPWO2012039175A1 (ja) 2010-09-21 2011-06-29 金属板低抵抗チップ抵抗器の製造方法
KR1020137007074A KR101435351B1 (ko) 2010-09-21 2011-06-29 금속판 저저항 칩 저항기의 제조 방법
TW100126079A TWI433170B (zh) 2010-09-21 2011-07-22 A method for producing a metal plate chip resistor of a low resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/066313 WO2012039020A1 (fr) 2010-09-21 2010-09-21 Procédé de production d'une résistance miniature à plaque métallique et à faible résistance

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PCT/JP2011/064966 WO2012039175A1 (fr) 2010-09-21 2011-06-29 Procédé de production d'une résistance miniature à plaque métallique à faible résistance

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KR (1) KR101435351B1 (fr)
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CN103400674B (zh) * 2013-07-31 2016-06-29 南京萨特科技发展有限公司 超薄合金片感测电阻的制造方法
TWI718971B (zh) * 2020-07-07 2021-02-11 旺詮股份有限公司 大批量產生微型電阻元件的製作方法

Citations (2)

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JP2007049070A (ja) * 2005-08-12 2007-02-22 Rohm Co Ltd チップ抵抗器の製造方法
JP2009218552A (ja) * 2007-12-17 2009-09-24 Rohm Co Ltd チップ抵抗器およびその製造方法

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CN1433030A (zh) * 2002-01-14 2003-07-30 陈富强 金属板型电阻的制法及结构
CN100421190C (zh) * 2002-06-19 2008-09-24 罗姆股份有限公司 低电阻值片状电阻器及其制造方法
TWI430293B (zh) * 2006-08-10 2014-03-11 Kamaya Electric Co Ltd Production method of corner plate type chip resistor and corner plate type chip resistor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007049070A (ja) * 2005-08-12 2007-02-22 Rohm Co Ltd チップ抵抗器の製造方法
JP2009218552A (ja) * 2007-12-17 2009-09-24 Rohm Co Ltd チップ抵抗器およびその製造方法

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KR20130073951A (ko) 2013-07-03
JPWO2012039175A1 (ja) 2014-02-03
CN103201801B (zh) 2016-03-30
KR101435351B1 (ko) 2014-08-27
TWI433170B (zh) 2014-04-01
CN103201801A (zh) 2013-07-10
TW201230081A (en) 2012-07-16
WO2012039175A1 (fr) 2012-03-29

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