WO2012038118A1 - Use of diamond-like carbon layers for the application of semiconductor inks free of metal ions - Google Patents
Use of diamond-like carbon layers for the application of semiconductor inks free of metal ions Download PDFInfo
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- WO2012038118A1 WO2012038118A1 PCT/EP2011/062822 EP2011062822W WO2012038118A1 WO 2012038118 A1 WO2012038118 A1 WO 2012038118A1 EP 2011062822 W EP2011062822 W EP 2011062822W WO 2012038118 A1 WO2012038118 A1 WO 2012038118A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F22/00—Means preventing smudging of machine parts or printed articles
Definitions
- the invention relates to the use of amorphous carbon-hydrogen layers in devices for applying solid and / or liquid media to fabrics.
- Amorphous carbon-hydrogen layers also known to the person skilled in the art as a: CH layers, "diamond-like hydrocarbon” layers (DLHC layers), or in the absence of hydrogen as “diamond-like carbon” (DLC layers), have long been known and used in the art.
- CH layers "diamond-like hydrocarbon” layers
- DLC layers diamond-like carbon layers
- GB 2 451 060 A discloses medical devices and implants provided with multi-layer DLCs alternating with DLC and noble or semi-precious metal layers. Such layer systems are diffusion barriers that protect the medical device or implant from the ingress of toxins and germs.
- US 2006/0286800 A1 discloses an a: C-H barrier layer into which Co and Si have been incorporated during their plasma-assisted production process. To be in the plasma
- Silicon compounds including, for example, SiH 4 , injected to protect the plasma-exposed conductors or semiconductors from depletion of charge carriers.
- JP 2010-021282 A demonstrates the use of a diamond-like carbon film to stabilize housings for products or systems of semiconductors or wafers against the diffusion of gases.
- Previously known uses of carbon-hydrogen layers aim at the aesthetic appearance of an object, are intended to protect tools against corrosion or abrasion, or serve for the emergency wear protection of moving parts in the event of friction
- Microorganisms, in electronics DLC layers are used to protect against electrostatic disturbances.
- the object of the present invention was therefore to provide further uses of carbon-hydrogen layers.
- carbon-hydrogen layers in the technique of coating fabrics are suitable for avoiding electronic band structures from interfering contaminations with molecules, atoms, and / or charge carriers, since the carbon-hydrogen layers act as a diffusion barrier.
- Contaminations in the context of the present invention are understood as meaning contaminants which alter the electronic properties of the fabrics and / or the medium to be applied.
- the invention thus relates to the use of at least one carbon-hydrogen layer on at least one surface of a device that transports fabrics and / or powdery, pasty and / or liquid media applies to these fabrics, which is characterized in that the carbon hydrogen Layer or layers has or is at least one amorphous carbon-hydrogen structure.
- the use of such layers has the advantage of avoiding contamination of the applied medium and / or the sheet with atoms and / or charge carriers. Therefore, the electronic properties of the sheet and medium system, in a semiconducting system, for example, the band structures typical of the semiconductors, are preserved during and after the device has passed.
- Another advantage is that the amorphous carbon-hydrogen layers can be applied in the simplest way, and there is neither a complicated adaptation of the device, nor the carbon-hydrogen layers themselves to the requirements of the processed reactants. It is therefore possible to make use of the materials and methods known in the art, in particular the methods of producing DLC and / or DLHC layers.
- DLC layers can be used with particular preference because of their greater hardness and diffusion-preventing effect.
- the device may have a multi-layer carbon-hydrogen barrier, for example in the manufacture of electronic semi-finished products or electronic circuits. Preferred use is further in the production of planar semiconductors, light and / or heat-sensitive resistors, photovoltaic cells, electro-optical crystals, electronic circuits, or a combination of these structures.
- the transporting of fabrics is understood to mean the transport, the unwinding and unwinding, the deflection, the turning, the reversing, as well as all the usual processes in calendering. This also includes the same or different speeds in any of the fabric transporting combinations of rollers, including their equal or opposite rotation.
- Device at least one rotating flat surface, for example, a rotating disk in the spin coating process.
- the Auföringen in the context of the claimed invention is j eder known to those skilled process of applying media to surfaces understood, for example
- a preferred mode of application is the wet film coating, more preferably the use of the wet film coating for the production of one or more layers in the manufacture of components for solar or semiconductor technology.
- the application may also include any conventional type of pre-, final and / or post-treatment of the product obtained, for example, cleaning, customary activation methods, such as corona treatment, and mixing, heating, drying, introducing electromagnetic energy, flowing with gaseous or liquid media, or Shelling with or
- the treatment may be carried out under normal conditions, inert gas atmosphere, and / or under elevated or reduced gas pressure. Even processes under vacuum conditions can be surprisingly well performed in the inventive use, but with low evacuation effort desired vacuum conditions are also achieved when the device has material with high vapor pressure.
- the application of media may further include their densification, for example, the compacting of powdery or pasty media.
- the use of the invention may also include compacting or densifying post-treated products, for example compacting applied layers after drying.
- the carbon-hydrogen layer or layers may also be formed as multi-layer systems known to those skilled in the art, for example in the form of multilayer coatings or sandwich structures.
- the phase boundaries at the contact surfaces of the multilayer or sandwich planes form a labyrinth against particles or charge carriers.
- the use according to the invention as an aid for the adsorption and / or spreading of the medium on the surface of the device. This simplifies or only allows the application of particularly fine structures, uninterrupted paths of the applied medium, or controlled thicknesses on the sheet. In addition, such an expression of the use according to the invention makes it possible to minimize the amount of medium used.
- the apparatus in the context of the use according to the invention may be selected from at least one roller, roller, stamp, caster, screen printing frame, dipping frame, doctor blade, plate, nozzle, disk, or a combination of these commissioned works.
- the device may comprise printing plates and / or all parts known to the expert for spray coating, so-called "spray coating", or parts for the
- the roller may be a sandblasted or non-sandblasted smooth roller, anilox roller, transport roller, or deflection roller
- the nozzle may be a slot nozzle, cascade nozzle , slit coating nozzle, or nozzle for
- the nozzle may also be a suitable nozzle for all other conventional methods, for example, nozzles for "zone casting”, “meniscus coating”, and / or "capillary coating.” Nozzles for the latter method are also known as
- the nozzles in the context of the use according to the invention may have manufacturing or functional tolerances known to the person skilled in the art.
- the nozzles which have a carbon-hydrogen layer or layers according to the invention can preferably be refinished in a manner known to the person skilled in the art, for example by lapping, in order to achieve the required tolerances.
- the amorphous carbon-hydrogen layers more preferably DLC layers
- this has the advantage of high stability.
- Interconnect medium dielectric, dopant, dispersion of particles and dispersants, or for producing a combination of these systems.
- the fluid may be a solution or dispersion of one or more substances which, after drying, curing or customary preliminary, working and / or finishing, is a layer, line or web with defined electronic properties.
- examples thereof are inks known in the art or masses which are conductive or semiconductive during or after drying. In these media, in prior art uses, contact with contaminating metals is particularly critical to the function of the desired semiconductor system. The use according to the invention thus just simplifies the production of semiconductor products and products which are relevant for photovoltaics.
- the fabrics may be selected in the inventive use of plate, nonwoven fabric, woven fabric, knitted fabric, metal foil, glass sheet, plastic film, or a
- the material of the sheet may also be any other material known in the art, or comprise or consist of cellulose.
- the sheet may be transparent and / or translucent.
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Abstract
The invention relates to the use of at least one carbon-hydrogen layer on at least one surface of a device which transports sheet-like structures and/or applies media in powder, paste and/or liquid form onto these sheet-like structures, which is characterized in that the carbon-hydrogen layer or layers comprise or are at least one amorphous carbon-hydrogen structure.
Description
Verwendung von Diamond Like Carbon Schichten bei der Aufbringung metallionenfreier Halbleitertinten Use of diamond like carbon layers in the application of metal ion-free semiconductor inks
Die Erfindung betrifft die Verwendung amorpher Kohlenstoff- Wasserstoff-Schichten in Vorrichtungen zum Aufbringen fester und/oder flüssiger Medien auf Flächengebilde. The invention relates to the use of amorphous carbon-hydrogen layers in devices for applying solid and / or liquid media to fabrics.
Amorphe Kohlenstoff- Wasserstoff-Schichten, dem Fachmann auch als a:CH-Schichten, „diamond-like hydrocarbon" Schichten (DLHC-Schichten), oder bei Abwesenheit von Wasserstoff als „diamond-like carbon" (DLC-Schichten) , bekannt, sind in der Technik seit langem bekannt und genutzt. Eine Beschreibung ihrer Eigenschaften und Herstellmethoden findet sich beispielsweise bei Andrew McWilliams, „Market Research Report - Diamond, Diamond-Like And CBN Films & Coating Products ", bcc Research, ISBN: 1-59623-625-6. Amorphous carbon-hydrogen layers, also known to the person skilled in the art as a: CH layers, "diamond-like hydrocarbon" layers (DLHC layers), or in the absence of hydrogen as "diamond-like carbon" (DLC layers), have long been known and used in the art. For a description of their properties and manufacturing methods, see, for example, Andrew McWilliams, "Market Research Report - Diamond, Diamond-Like And CBN Films & Coating Products," bcc Research, ISBN: 1-59623-625-6.
Verschiedenste Materialien sind mit Oberflächenbeschichtungen aus DLHC oder DLC vor Korrosion oder Abrasion geschützt. Various materials are protected against corrosion or abrasion with surface coatings made of DLHC or DLC.
GB 2 451 060 A offenbart medizinische Geräte und Implantate, die mit DLC aus mehreren Schichten versehen sind, wobei sich DLC und Edel- oder Halbedelmetallschichten abwechseln. Solche Schichtsysteme sind Diffusionsbarrieren, die das medizinische Gerät bzw. Implantat vor dem Eindringen von Giften und Keimen schützen. GB 2 451 060 A discloses medical devices and implants provided with multi-layer DLCs alternating with DLC and noble or semi-precious metal layers. Such layer systems are diffusion barriers that protect the medical device or implant from the ingress of toxins and germs.
US 2006/0286800 AI offenbart eine a:C-H-Barriereschicht, in die während ihres Plasma gestützten Herstellprozesses Co und Si eingelagert wurden. In das Plasma werden US 2006/0286800 A1 discloses an a: C-H barrier layer into which Co and Si have been incorporated during their plasma-assisted production process. To be in the plasma
Siliziumverbindungen, darunter zum Beispiel SiH4, injiziert, um dem Plasma ausgesetzte Leiter oder Halbleiter vor dem Verarmen von Ladungsträgern zu schützen. Silicon compounds, including, for example, SiH 4 , injected to protect the plasma-exposed conductors or semiconductors from depletion of charge carriers.
JP 2010-021282 A belegt den Einsatz eines diamantartigen Carbonfilms zur Stabilisierung von Gehäusen für Produkte oder Systeme aus Halbleitern oder Wafern gegen die Diffusion von Gasen.
Bisher bekannte Verwendungen von Kohlenstoff- Wasserstoff-Schichten zielen auf das ästhetische Erscheinungsbild eines Objektes, sollen Werkzeug vor Korrosion bzw. Abrasion schützen, oder dienen dem Notverschleißschutz bewegter Teile bei reibungsbedingter JP 2010-021282 A demonstrates the use of a diamond-like carbon film to stabilize housings for products or systems of semiconductors or wafers against the diffusion of gases. Previously known uses of carbon-hydrogen layers aim at the aesthetic appearance of an object, are intended to protect tools against corrosion or abrasion, or serve for the emergency wear protection of moving parts in the event of friction
Überhitzung, um zum Beispiel das Fressen von Lagern zu vermeiden, dienen ferner als Overheating, for example, to avoid the seizure of bearings, are also used as
Barriere Schicht gegen Gase, oder als Antihaftmittel. In biologisch/medizinischen Anwendungen blockieren Kohlenstoff- Wasserstoff-Schichten das unerwünschte Vordringen von Barrier layer against gases, or as an antiblocking agent. In biological / medical applications, carbon-hydrogen layers block the unwanted penetration of
Mikroorganismen, in der Elektronik verwendet man DLC-Schichten zum Schutz gegen elektrostatische Störungen. Aufgabe der vorliegenden Erfindung war es daher, weitere Verwendungen von Kohlenstoff- Wasserstoff-Schichten bereit zu stellen. Microorganisms, in electronics DLC layers are used to protect against electrostatic disturbances. The object of the present invention was therefore to provide further uses of carbon-hydrogen layers.
Es wurde gefunden, dass Kohlenstoff- Wasserstoff-Schichten in der Technik der Beschichtung von Flächengebilden geeignet sind, elektronische Bandstrukturen störende Kontaminationen mit Molekülen, Atomen, und/oder Ladungsträgern zu vermeiden, da die Kohlenstoff- Wasserstoff- Schichten als Diffusionsbarriere wirken. Unter Kontaminationen werden im Rahmen der vorliegenden Erfindung solche Kontaminationen verstanden, die elektronische Eigenschaften der Flächengebilde und/oder des aufzubringenden Mediums verändern. Gegenstand der Erfindung ist also die Verwendung zumindest einer Kohlenstoff- Wasserstoff- Schicht auf zumindest einer Oberfläche einer Vorrichtung, die Flächengebilde transportiert und/oder pulvrige, pastöse und/oder flüssige Medien auf diese Flächengebilde aufbringt, welche dadurch gekennzeichnet ist, dass die Kohlenstoff- Wasserstoff-Schicht oder -Schichten zumindest eine amorphe Kohlenstoff- Wasserstoff Struktur aufweist oder ist. It has been found that carbon-hydrogen layers in the technique of coating fabrics are suitable for avoiding electronic band structures from interfering contaminations with molecules, atoms, and / or charge carriers, since the carbon-hydrogen layers act as a diffusion barrier. Contaminations in the context of the present invention are understood as meaning contaminants which alter the electronic properties of the fabrics and / or the medium to be applied. The invention thus relates to the use of at least one carbon-hydrogen layer on at least one surface of a device that transports fabrics and / or powdery, pasty and / or liquid media applies to these fabrics, which is characterized in that the carbon hydrogen Layer or layers has or is at least one amorphous carbon-hydrogen structure.
Die Verwendung solcher Schichten hat den Vorteil, Kontaminationen des aufgebrachten Mediums und/oder des Flächengebildes mit Atomen und/oder Ladungsträgern zu vermeiden. Deshalb bleiben die elektronischen Eigenschaften des Systems aus Flächengebilde und Medium, bei einem halbleitendem System zum Beispiel die für die Halbleiter typischen Bandstrukturen, während und nach dem Passieren der Vorrichtung erhalten. Ein weiterer Vorteil ist, dass die amorphen Kohlenstoff- Wasserstoff-Schichten auf einfachste Weise angewendet werden können,
und es besteht weder ein aufwendiger Anpassungsbedarf der Vorrichtung, noch der Kohlenstoff- Wasserstoff-Schichten selbst an die Erfordernisse der verarbeiteten Edukte. Es kann also auf die im Stand der Technik bekannten Materialien und Verfahren zurückgegriffen werden, insbesondere auf die Verfahren, DLC- und/oder DLHC-Schichten zu erzeugen. The use of such layers has the advantage of avoiding contamination of the applied medium and / or the sheet with atoms and / or charge carriers. Therefore, the electronic properties of the sheet and medium system, in a semiconducting system, for example, the band structures typical of the semiconductors, are preserved during and after the device has passed. Another advantage is that the amorphous carbon-hydrogen layers can be applied in the simplest way, and there is neither a complicated adaptation of the device, nor the carbon-hydrogen layers themselves to the requirements of the processed reactants. It is therefore possible to make use of the materials and methods known in the art, in particular the methods of producing DLC and / or DLHC layers.
DLC-Schichten können wegen ihrer größeren Härte und diffusionsverhindernden Wirkung besonders bevorzugt verwendet werden. DLC layers can be used with particular preference because of their greater hardness and diffusion-preventing effect.
In der erfindungsgemäßen Verwendung kann die Vorrichtung eine mehrschichtige Kohlenstoff- Wasserstoff- Schi cht aufweisen, zum Beispiel bei der Herstellung elektronischer Halbzeuge oder elektronischer Schaltungen. Bevorzugte Verwendung ist weiterhin bei der Herstellung flächiger Halbleiter, licht- und/oder wärmeempfindlicher Widerstände, photovoltaischer Zellen, elektroopti scher Kristalle, elektronischer Schaltungen, oder einer Kombination dieser Gebilde. Unter dem Transportieren von Flächengebilden werden im Rahmen der vorliegenden Erfindung der Transport, das Auf- und Abwickeln, Umlenken, Wenden, Umlegen, sowie alle fachüblichen Vorgänge beim Kalandrieren verstanden. Dies umfasst ebenfalls gleiche oder unterschiedliche Drehzahlen in beliebigen das Flächengebilde transportierenden Kombinationen aus Walzen, einschließlich deren gleich- oder gegensinnige Rotation. In the use according to the invention, the device may have a multi-layer carbon-hydrogen barrier, for example in the manufacture of electronic semi-finished products or electronic circuits. Preferred use is further in the production of planar semiconductors, light and / or heat-sensitive resistors, photovoltaic cells, electro-optical crystals, electronic circuits, or a combination of these structures. In the context of the present invention, the transporting of fabrics is understood to mean the transport, the unwinding and unwinding, the deflection, the turning, the reversing, as well as all the usual processes in calendering. This also includes the same or different speeds in any of the fabric transporting combinations of rollers, including their equal or opposite rotation.
In einer weiteren Ausprägung der erfindungsgemäßen Verwendung umfasst oder ist die In a further embodiment of the use according to the invention comprises or is the
Vorrichtung zumindest eine rotierende ebene Fläche, zum Beispiel eine rotierende Scheibe im Rahmen des Spin Coating Verfahrens. Unter dem Auföringen im Rahmen der beanspruchten Erfindung wird j eder dem Fachmann bekannte Prozess des Aufbringens von Medien auf Flächen verstanden, zum Beispiel Device at least one rotating flat surface, for example, a rotating disk in the spin coating process. The Auföringen in the context of the claimed invention is j eder known to those skilled process of applying media to surfaces understood, for example
Beschichten, Tauchen, Rakeln, und/oder Drucken. Coating, dipping, knife coating, and / or printing.
Eine bevorzugte Art der Aufbringung ist die Nassfilmbeschichtung, besonders bevorzugt die Verwendung der Nassfilmbeschichtung für die Erzeugung einer oder mehrerer Schichten bei der Herstellung von Bauteilen für die Solar- bzw. Halbleitertechnik.
Das Aufbringen kann außerdem jede übliche Art der Vor-, End- und/oder Nachbehandlung des erhaltenen Produktes umfassen, beispielsweise Reinigung, fachübliche Aktivierungsmethoden, z.B. Coronabehandlung, sowie Mischen, Erwärmen, Trocknen, Eintragen elektromagnetischer Energie, Beströmen mit gasförmigen oder flüssigen Medien, oder Beschuss mit oder A preferred mode of application is the wet film coating, more preferably the use of the wet film coating for the production of one or more layers in the manufacture of components for solar or semiconductor technology. The application may also include any conventional type of pre-, final and / or post-treatment of the product obtained, for example, cleaning, customary activation methods, such as corona treatment, and mixing, heating, drying, introducing electromagnetic energy, flowing with gaseous or liquid media, or Shelling with or
Implantieren von Teilchen j edweder Art. Implantation of particles of any kind.
Die Behandlung kann unter Normalbedingungen, Inertgasatmosphäre, und/oder unter erhöhtem oder erniedrigtem Gasdruck vorgenommen werden. Auch Prozesse unter Vakuumbedingungen lassen sich bei der erfindungsgemäßen Verwendung überraschend gut führen, werden doch mit geringem Evakuierungsaufwand gewünschte Vakuumbedingungen auch dann erreicht, wenn die Vorrichtung Material mit hohem Dampfdruck aufweist. The treatment may be carried out under normal conditions, inert gas atmosphere, and / or under elevated or reduced gas pressure. Even processes under vacuum conditions can be surprisingly well performed in the inventive use, but with low evacuation effort desired vacuum conditions are also achieved when the device has material with high vapor pressure.
Das Aufbringen von Medien kann des Weiteren deren Verdichtung mit einschließen, zum Beispiel das Kompaktieren pulvriger oder pastöser Medien. Ebenso kann die erfindungsgemäße Verwendung auch das Kompaktieren oder Verdichten nachbehandelter Produkte einschließen, zum Beispiel das Verdichten von aufgebrachten Schichten nach deren Trocknung. The application of media may further include their densification, for example, the compacting of powdery or pasty media. Likewise, the use of the invention may also include compacting or densifying post-treated products, for example compacting applied layers after drying.
Weiterhin vorteilhaft ist die erfindungsgemäße Verwendung als Diffusionsbarriere gegen Atome und/oder Ladungsträger des Materials der Vorrichtung gegen den Kontakt dieser Teilchen mit dem Flächengebilde, gegen das Eindringen dieser Teilchen in das Flächengebilde und/oder in das aufgebrachte Medium. Aufgrund der Ladungsträgerdiffusion verhindernden Eigenschaft erfindungsgemäß verwendeter Kohlenstoff- Wasserstoff-Schichten erspart dies das aufwendige Vermessen oder Kontrollieren der halbleitenden Charakteristika des geplanten Produktes, zum Beispiel aufwendige Stichprobennahme, denn die elektronische Struktur des erhaltenen Also advantageous is the use according to the invention as a diffusion barrier against atoms and / or charge carriers of the material of the device against the contact of these particles with the sheet, against the penetration of these particles into the sheet and / or in the applied medium. Due to the charge carrier diffusion-preventing property used according to the invention carbon-hydrogen layers this saves the laborious measuring or controlling the semiconducting characteristics of the planned product, for example, elaborate sampling, because the electronic structure of the obtained
Produktes bleibt unverändert erhalten. Product remains unchanged.
Die Kohlenstoff- Wasserstoff-Schicht oder -Schichten können außerdem als dem Fachmann bekannte Mehrschichtsysteme ausgeprägt sein, zum Beispiel in Form von Multilayer- Beschichtungen oder Sandwich-Strukturen. Die Phasengrenzen an den Kontaktflächen der Multilayer- oder Sandwich-Ebenen bilden gegen Teilchen oder Ladungsträger ein Labyrinth.
Weiterhin vorteilhaft ist die erfindungsgemäße Verwendung als Hilfsmittel zur Adsorption und/oder Spreitung des Mediums auf der Oberfläche der Vorrichtung. Dies vereinfacht oder ermöglicht erst das Aufbringen besonders feiner Strukturen, unterbrechungsfreier Bahnen des aufgebrachten Mediums, oder kontrollierter Dicken auf dem Flächengebilde. Außerdem lässt sich durch eine solche Ausprägung der erfindungsgemäßen Verwendung die Menge an eingesetztem Medium minimieren. The carbon-hydrogen layer or layers may also be formed as multi-layer systems known to those skilled in the art, for example in the form of multilayer coatings or sandwich structures. The phase boundaries at the contact surfaces of the multilayer or sandwich planes form a labyrinth against particles or charge carriers. Also advantageous is the use according to the invention as an aid for the adsorption and / or spreading of the medium on the surface of the device. This simplifies or only allows the application of particularly fine structures, uninterrupted paths of the applied medium, or controlled thicknesses on the sheet. In addition, such an expression of the use according to the invention makes it possible to minimize the amount of medium used.
Die Vorrichtung im Rahmen der erfindungsgemäßen Verwendung kann ausgewählt sein aus zumindest einer Walze, Rolle, Stempel, Gießer, Siebdruckrahmen, Tauchrahmen, Rakel, Platte, Düse, Scheibe, oder eine Kombination dieser Auftragswerke. Weiterhin kann die Vorrichtung im Rahmen der erfindungsgemäßen Verwendung Druckplatten und/oder alle dem Fachmann bekannten Teile für Sprühbeschichtung, sogenannt„Spray Coating", oder Teile für die The apparatus in the context of the use according to the invention may be selected from at least one roller, roller, stamp, caster, screen printing frame, dipping frame, doctor blade, plate, nozzle, disk, or a combination of these commissioned works. Furthermore, within the scope of the use according to the invention, the device may comprise printing plates and / or all parts known to the expert for spray coating, so-called "spray coating", or parts for the
Tintenstrahl-Beschichtung, sogenannt„Ink-Jet", aufweisen oder aus solchen Teilen bestehen. Die Walze kann im Rahmen der erfindungsgemäßen Verwendung eine sandgestrahlte oder nicht sandgestrahlte Glattwalze, Rasterwalze, Transportwalze, oder Umlenkwalze sein. Des Weiteren kann die Düse eine Schlitzdüse, Kaskadendüse, slit coating Düse, oder eine Düse zur In the context of the use according to the invention, the roller may be a sandblasted or non-sandblasted smooth roller, anilox roller, transport roller, or deflection roller, and the nozzle may be a slot nozzle, cascade nozzle , slit coating nozzle, or nozzle for
Vorhangbeschichtung sein. Weiterhin kann die Düse auch eine für alle weiteren fachüblichen Verfahrensweisen geeignete Düse sein, zum Beispiel Düsen für das„Zone Casting",„Meniscus- Coating", und/oder„Capillary Coating". Düsen für letzteres Verfahren sind auch als Be curtain coating. Furthermore, the nozzle may also be a suitable nozzle for all other conventional methods, for example, nozzles for "zone casting", "meniscus coating", and / or "capillary coating." Nozzles for the latter method are also known as
„Kapillardüsen" bekannt. "Capillary nozzles" known.
Die Düsen im Rahmen der erfindungsgemäßen Verwendung können dem Fachmann bekannte Fertigungs- bzw. Funktionstoleranzen aufweisen. Die Düsen, die eine verwendungsgemäße Kohlenstoff- Wasserstoff-Schicht oder -schichten aufweisen, können vorzugsweise auf eine dem Fachmann bekannte Weise nachgearbeitet sein, beispielsweise durch Läppen, um geforderte Toleranzen zu erzielen. Wegen der großen Härte der amorphen Kohlenstoff- Wasserstoff- Schichten, besonders bevorzugt DLC-Schichten, hat dies den Vorteil großer Standfestigkeit. Es können aber auch alle weiteren fachüblichen Hilfsmittel im Rahmen der erfindungsgemäßen Verwendung mit DLC- und/oder DLHC-Schichten ausgestattet und in fachüblicher Weise nachgearbeitet sein. Des Weiteren können ganz oder teilweise die Hilfsmittel in allen weiteren
dem Fachmann bekannten Auftragsverfahren mit DLC- und/oder DLHC-Schichten ausgestattet und in fachüblicher Weise nachgearbeitet sein. The nozzles in the context of the use according to the invention may have manufacturing or functional tolerances known to the person skilled in the art. The nozzles which have a carbon-hydrogen layer or layers according to the invention can preferably be refinished in a manner known to the person skilled in the art, for example by lapping, in order to achieve the required tolerances. Because of the high hardness of the amorphous carbon-hydrogen layers, more preferably DLC layers, this has the advantage of high stability. However, it is also possible to equip all further customary auxiliaries in the context of the use according to the invention with DLC and / or DLHC layers and to work them up in a customary manner. Furthermore, all or part of the aids in all other equipped with DLC and / or DLHC layers known in the art and refinished in the usual way.
Es kann weiterhin vorteilhaft sein, das Medium in der erfindungsgemäßen Verwendung auszuwählen aus Fluid zur Herstellung von leitenden oder halbleitenden Schichten, It may furthermore be advantageous to select the medium in the use according to the invention from fluid for the production of conductive or semiconductive layers,
Interconnectmedium, Dielektrikum, Dotiermittel, Dispersion aus Partikeln und Dispergiermittel, oder zur Herstellung einer Kombination dieser Systeme. Interconnect medium, dielectric, dopant, dispersion of particles and dispersants, or for producing a combination of these systems.
Das Fluid kann eine Lösung oder Dispersion einer oder mehrerer Substanzen sein, die nach dem Auftrocknen, Härten, oder fachüblichem Vor-, Be- und/oder Nacharbeiten eine Schicht, Linie oder Bahn mit definierten elektronischen Eigenschaften ist. Beispiele dafür sind dem Fachmann bekannte Tinten oder Massen, die während oder nach dem Auftrocknen leitfähig oder halbleitfähig sind. Bei diesen Medien ist bei Stand der Technik gemäßen Verwendungen der Kontakt mit kontaminierenden Metallen besonders kritisch für die Funktion des gewünschten Halbleitersystems. Die erfindungsgemäße Verwendung vereinfacht also gerade die Herstellung von Halbleiterprodukten und Produkten, die für die Photovoltaik relevant sind. The fluid may be a solution or dispersion of one or more substances which, after drying, curing or customary preliminary, working and / or finishing, is a layer, line or web with defined electronic properties. Examples thereof are inks known in the art or masses which are conductive or semiconductive during or after drying. In these media, in prior art uses, contact with contaminating metals is particularly critical to the function of the desired semiconductor system. The use according to the invention thus just simplifies the production of semiconductor products and products which are relevant for photovoltaics.
Außerdem können die Flächengebilde in der erfindungsgemäßen Verwendung ausgewählt sein aus Platte, Vlies, Gewebe, Gewirke, Metallfolie, Glasfolie, Kunststofffolie, oder eine In addition, the fabrics may be selected in the inventive use of plate, nonwoven fabric, woven fabric, knitted fabric, metal foil, glass sheet, plastic film, or a
Kombination dieser Flächengebilde. Das Material des Flächengebildes kann auch jedes andere im Stand der Technik bekannte Material sein, oder Zellulose aufweisen oder daraus bestehen. Das Flächengebilde kann transparent und/oder durchscheinend sein.
Combination of these fabrics. The material of the sheet may also be any other material known in the art, or comprise or consist of cellulose. The sheet may be transparent and / or translucent.
Claims
1. Verwendung zumindest einer Kohlenstoff- Wasserstoff-Schicht auf zumindest einer 1. Use of at least one carbon-hydrogen layer on at least one
Oberfläche einer Vorrichtung, die Flächengebilde transportiert und/oder pulvrige, pastöse und/oder flüssige Medien auf diese Flächengebilde aufbringt, Surface of a device that transports fabrics and / or applies powdery, pasty and / or liquid media to these fabrics,
dadurch gekennzeichnet, characterized,
dass die Kohlenstoff- Wasserstoff-Schicht oder -Schichten zumindest eine amorphe Kohlenstoff- Wasserstoff Struktur aufweist oder ist. the carbon-hydrogen layer or layers has or is at least one amorphous carbon-hydrogen structure.
2. Verwendung nach Anspruch 1 als Diffusionsbarriere gegen Atome und/oder Ladungsträger des Materials der Vorrichtung gegen den Kontakt dieser Teilchen mit dem Flächengebilde, gegen das Eindringen dieser Teilchen in das Flächengebilde und/oder in das aufgebrachte Medium. 2. Use according to claim 1 as a diffusion barrier to atoms and / or charge carriers of the material of the device against the contact of these particles with the sheet, against the penetration of these particles into the sheet and / or in the applied medium.
3. Verwendung nach Anspruch 1 als Hilfsmittel zur Adsorption und/oder Spreitung des 3. Use according to claim 1 as an aid for adsorption and / or spreading of
Mediums auf der Oberfläche der Vorrichtung. Medium on the surface of the device.
4. Verwendung nach zumindest einem der vorhergehenden Ansprüche, wobei die Vorrichtung ausgewählt ist aus zumindest einer Walze, Rolle, Stempel, Gießer, Siebdruckrahmen, Tauchrahmen, Rakel, Platte, Düse, Scheibe, oder eine Kombination dieser Auftragswerke. 4. Use according to at least one of the preceding claims, wherein the device is selected from at least one roller, roller, punch, caster, screen printing frame, dipping frame, doctor blade, plate, nozzle, disc, or a combination of these commissioned works.
5. Verwendung nach zumindest einem der vorhergehenden Ansprüche, wobei das Medium ausgewählt ist aus Fluid zur Herstellung von leitenden oder halbleitenden Schichten, Interconnectmedium, Dielektrikum, Dotiermittel, Dispersion aus Partikeln und 5. Use according to at least one of the preceding claims, wherein the medium is selected from fluid for the production of conductive or semiconducting layers, interconnect medium, dielectric, dopants, dispersion of particles and
Dispergiermittel, oder zur Herstellung einer Kombination dieser Systeme. Dispersant, or to produce a combination of these systems.
6. Verwendung nach zumindest einem der vorhergehenden Ansprüche, wobei das 6. Use according to at least one of the preceding claims, wherein the
Flächengebilde ausgewählt ist aus Platte, Vlies, Gewebe, Gewirke, Metallfolie, Glasfolie, Kunststofffolie, oder eine Kombination dieser Flächengebilde. Sheet is selected from plate, nonwoven fabric, woven fabric, knitted fabric, metal foil, glass sheet, plastic film, or a combination of these fabrics.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE201010041230 DE102010041230A1 (en) | 2010-09-23 | 2010-09-23 | Use of diamond like carbon layers in the application of metal ion-free semiconductor inks |
| DE102010041230.9 | 2010-09-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012038118A1 true WO2012038118A1 (en) | 2012-03-29 |
Family
ID=44629758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2011/062822 WO2012038118A1 (en) | 2010-09-23 | 2011-07-26 | Use of diamond-like carbon layers for the application of semiconductor inks free of metal ions |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE102010041230A1 (en) |
| TW (1) | TW201228741A (en) |
| WO (1) | WO2012038118A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8889092B2 (en) | 2010-10-01 | 2014-11-18 | Evonik Degussa Gmbh | Method for producing higher hydridosilane compounds |
| US9464099B2 (en) | 2012-11-27 | 2016-10-11 | Evonik Degussa Gmbh | Method for producing hydrosilanes containing carbon |
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|---|---|---|---|---|
| JPH03266874A (en) * | 1990-03-16 | 1991-11-27 | Canon Inc | Fixing device |
| GB2257986A (en) * | 1991-07-23 | 1993-01-27 | Flouroware Inc | Diamond coated carrier for carrying wafers requiring chemical processing |
| JPH06244592A (en) * | 1993-02-17 | 1994-09-02 | Matsushita Electric Ind Co Ltd | Chip parts mounting machine |
| US6335098B1 (en) * | 1996-10-25 | 2002-01-01 | Koenig & Bauer Aktiengesellschaft | Rotary press doctor |
| US20060286800A1 (en) | 2005-06-15 | 2006-12-21 | Dominguez Juan E | Method for adhesion and deposition of metal films which provide a barrier and permit direct plating |
| GB2451060A (en) | 2007-07-11 | 2009-01-21 | Anthony Walter Anson | Dual coatings applied to medical devices |
| JP2010021282A (en) | 2008-07-09 | 2010-01-28 | Dan Takuma:Kk | Case for semiconductor |
-
2010
- 2010-09-23 DE DE201010041230 patent/DE102010041230A1/en not_active Withdrawn
-
2011
- 2011-07-26 WO PCT/EP2011/062822 patent/WO2012038118A1/en active Application Filing
- 2011-09-20 TW TW100133795A patent/TW201228741A/en unknown
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|---|---|---|---|---|
| JPH03266874A (en) * | 1990-03-16 | 1991-11-27 | Canon Inc | Fixing device |
| GB2257986A (en) * | 1991-07-23 | 1993-01-27 | Flouroware Inc | Diamond coated carrier for carrying wafers requiring chemical processing |
| JPH06244592A (en) * | 1993-02-17 | 1994-09-02 | Matsushita Electric Ind Co Ltd | Chip parts mounting machine |
| US6335098B1 (en) * | 1996-10-25 | 2002-01-01 | Koenig & Bauer Aktiengesellschaft | Rotary press doctor |
| US20060286800A1 (en) | 2005-06-15 | 2006-12-21 | Dominguez Juan E | Method for adhesion and deposition of metal films which provide a barrier and permit direct plating |
| GB2451060A (en) | 2007-07-11 | 2009-01-21 | Anthony Walter Anson | Dual coatings applied to medical devices |
| JP2010021282A (en) | 2008-07-09 | 2010-01-28 | Dan Takuma:Kk | Case for semiconductor |
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| ANDREW MCWILLIAMS: "Market Research Report - Diamond, Diamond-Like And CBNFilms & Coating Products", BCC RESEARCH |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8889092B2 (en) | 2010-10-01 | 2014-11-18 | Evonik Degussa Gmbh | Method for producing higher hydridosilane compounds |
| US9464099B2 (en) | 2012-11-27 | 2016-10-11 | Evonik Degussa Gmbh | Method for producing hydrosilanes containing carbon |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102010041230A1 (en) | 2012-03-29 |
| TW201228741A (en) | 2012-07-16 |
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