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WO2012019044A3 - Techniques for matching measured spectra to reference spectra for in-situ optical monitoring - Google Patents

Techniques for matching measured spectra to reference spectra for in-situ optical monitoring Download PDF

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Publication number
WO2012019044A3
WO2012019044A3 PCT/US2011/046646 US2011046646W WO2012019044A3 WO 2012019044 A3 WO2012019044 A3 WO 2012019044A3 US 2011046646 W US2011046646 W US 2011046646W WO 2012019044 A3 WO2012019044 A3 WO 2012019044A3
Authority
WO
WIPO (PCT)
Prior art keywords
spectra
spectrum
best matching
sequence
polishing
Prior art date
Application number
PCT/US2011/046646
Other languages
French (fr)
Other versions
WO2012019044A2 (en
Inventor
Xiaoyuan Hu
Zhihong Wang
Harry Q. Lee
Zhize Zhu
Jeffrey Drue David
Dominic J. Benvegnu
Jimin Zhang
Wen-Chiang Tu
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020137005721A priority Critical patent/KR20130135241A/en
Priority to CN2011800479788A priority patent/CN103155110A/en
Publication of WO2012019044A2 publication Critical patent/WO2012019044A2/en
Publication of WO2012019044A3 publication Critical patent/WO2012019044A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B24B49/045—Specially adapted gauging instruments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
PCT/US2011/046646 2010-08-06 2011-08-04 Techniques for matching measured spectra to reference spectra for in-situ optical monitoring WO2012019044A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020137005721A KR20130135241A (en) 2010-08-06 2011-08-04 Techniques for matching measured spectra to reference spectra for in-situ optical monitoring
CN2011800479788A CN103155110A (en) 2010-08-06 2011-08-04 Techniques for matching measured spectra to reference spectra for in-situ optical monitoring

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37140510P 2010-08-06 2010-08-06
US61/371,405 2010-08-06

Publications (2)

Publication Number Publication Date
WO2012019044A2 WO2012019044A2 (en) 2012-02-09
WO2012019044A3 true WO2012019044A3 (en) 2012-05-18

Family

ID=45556483

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/046646 WO2012019044A2 (en) 2010-08-06 2011-08-04 Techniques for matching measured spectra to reference spectra for in-situ optical monitoring

Country Status (5)

Country Link
US (1) US20120034845A1 (en)
KR (1) KR20130135241A (en)
CN (1) CN103155110A (en)
TW (1) TW201223702A (en)
WO (1) WO2012019044A2 (en)

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US8747189B2 (en) * 2011-04-26 2014-06-10 Applied Materials, Inc. Method of controlling polishing
US8755928B2 (en) * 2011-04-27 2014-06-17 Applied Materials, Inc. Automatic selection of reference spectra library
WO2013133974A1 (en) * 2012-03-08 2013-09-12 Applied Materials, Inc. Fitting of optical model to measured spectrum
US9168630B2 (en) * 2012-04-23 2015-10-27 Applied Materials, Inc. User-input functions for data sequences in polishing endpoint detection
US9482610B2 (en) 2012-11-12 2016-11-01 Applied Materials, Inc. Techniques for matching spectra
US20140224425A1 (en) * 2013-02-13 2014-08-14 Kabushiki Kaisha Toshiba Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
US20140242877A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Spectrographic metrology with multiple measurements
US9679823B2 (en) 2013-03-15 2017-06-13 Applied Materials, Inc. Metric for recognizing correct library spectrum
WO2014149330A1 (en) * 2013-03-15 2014-09-25 Applied Materials, Inc. Dynamic residue clearing control with in-situ profile control (ispc)
JP6105371B2 (en) 2013-04-25 2017-03-29 株式会社荏原製作所 Polishing method and polishing apparatus
US10012494B2 (en) 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
CN104778181B (en) * 2014-01-14 2018-08-10 睿励科学仪器（上海）有限公司 A kind of method and its equipment measuring spectrum and library Spectral matching
US10399203B2 (en) 2014-04-22 2019-09-03 Ebara Corporation Polishing method and polishing apparatus
US9754846B2 (en) * 2014-06-23 2017-09-05 Applied Materials, Inc. Inductive monitoring of conductive trench depth
US9362186B2 (en) 2014-07-18 2016-06-07 Applied Materials, Inc. Polishing with eddy current feed meaurement prior to deposition of conductive layer
TW201822953A (en) 2016-09-16 2018-07-01 美商應用材料股份有限公司 Overpolishing based on electromagnetic inductive monitoring of trench depth
CN111886686B (en) * 2018-09-26 2024-08-02 应用材料公司 Compensation of substrate doping in edge reconstruction for in-situ electromagnetic induction monitoring
US20220406578A1 (en) * 2019-11-21 2022-12-22 Lam Research Corporation Detection and location of anomalous plasma events in fabrication chambers
CN111276414A (en) * 2020-02-03 2020-06-12 长江存储科技有限责任公司 Detection method and device
CN111208063A (en) * 2020-03-03 2020-05-29 度亘激光技术（苏州）有限公司 Reflectance spectrum monitoring device and method
CN111446179B (en) * 2020-03-31 2022-11-01 中国科学院微电子研究所 Method and device for testing wafers
JP7447284B2 (en) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド Determination of substrate layer thickness by polishing pad wear compensation
WO2022187146A1 (en) 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters during substrate polishing using cost function or expected future parameter changes
CN113295090A (en) * 2021-04-08 2021-08-24 睿励科学仪器（上海）有限公司 Method and device for comparing spectra
US20220371152A1 (en) * 2021-05-20 2022-11-24 Applied Materials, Inc. Fourier filtering of spectral data for measuring layer thickness during substrate processing

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WO2012051121A2 (en) * 2010-10-15 2012-04-19 Applied Materials, Inc. Building a library of spectra for optical monitoring
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Also Published As

Publication number Publication date
CN103155110A (en) 2013-06-12
KR20130135241A (en) 2013-12-10
US20120034845A1 (en) 2012-02-09
WO2012019044A2 (en) 2012-02-09
TW201223702A (en) 2012-06-16

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