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WO2012001999A1 - Dispositif d'éclairage et dispositif d'affichage d'images doté de celui-ci - Google Patents

Dispositif d'éclairage et dispositif d'affichage d'images doté de celui-ci Download PDF

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Publication number
WO2012001999A1
WO2012001999A1 PCT/JP2011/052442 JP2011052442W WO2012001999A1 WO 2012001999 A1 WO2012001999 A1 WO 2012001999A1 JP 2011052442 W JP2011052442 W JP 2011052442W WO 2012001999 A1 WO2012001999 A1 WO 2012001999A1
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WO
WIPO (PCT)
Prior art keywords
light source
heat
light
substrate
plate
Prior art date
Application number
PCT/JP2011/052442
Other languages
English (en)
Japanese (ja)
Inventor
浩文 神田
住川　雅人
武史 高山
酒井　宏祐
満 竹島
和彦 根来
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010150275A external-priority patent/JP2012014947A/ja
Priority claimed from JP2010150273A external-priority patent/JP2012014946A/ja
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012001999A1 publication Critical patent/WO2012001999A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means

Definitions

  • the present invention relates to an illumination device used for an image display device such as a liquid crystal display device.
  • an image display device such as a liquid crystal display device includes a display panel for controlling brightness, chromaticity, and the like of a pixel, a backlight device (illumination device) that emits light toward the display panel, and these It consists of a control circuit and a circuit board for controlling.
  • the backlight device diffuses light rays in the image display device and emits light toward the display panel.
  • backlight devices There are two types of backlight devices: a direct-light type in which light sources are distributed on the back side of the backlight device, and an edge light method in which the light source is installed to allow light to enter from the side of the backlight device (“side light method”). Also called).
  • the edge light method has an advantage that the thickness of the backlight device can be reduced compared with the direct type and the commercial value can be increased.
  • LEDs light-emitting diodes
  • a light source generates heat together with light. Even in the case of an LED, heat is generated by causing a current to flow to emit light. When the LED becomes high temperature due to the heat, the luminous efficiency is lowered, and the lifetime of the element in the image display device is shortened. In the worst case, the element is destroyed and there is a possibility that the element does not emit light.
  • the light source serving as a heat source is not distributed on the back surface of the backlight device, and is installed in the edge portion around the backlight device, which is a disadvantageous configuration from the viewpoint of heat dissipation. Yes. This is because heat is most likely to be conducted and released when it has a uniform distribution, and heat becomes less likely to be conducted and emitted when it has a non-uniform distribution.
  • the edge light system has been used not only for small screens (displays) such as mobile phones but also for large screens (displays) such as televisions.
  • the luminance on the screen cannot usually be reduced. Therefore, the total amount of light required for the light source must be increased in proportion to the area. That is, it is necessary to increase the amount of light in proportion to the square of the length in the vertical direction or the horizontal direction on the screen.
  • the amount of increase in the space where the light source can be installed is proportional to the length of the periphery of the screen (display). That is, only an increase proportional to the first power of the length in the vertical or horizontal direction on the screen can be obtained. Therefore, in principle, the amount of light required per LED increases, and the amount of heat generation increases.
  • This situation is a general rule related to the light source when the screen size is increased from the direct type to the edge light method.
  • heat generation from the light source is larger in the light incident method from the upper and lower two sides or the left and right sides of the screen than the light incident method from the four sides of the screen.
  • LCD TVs, personal computer displays, etc. are generally used in a horizontally long shape, so that heat generation is greater when light enters from the left and right sides instead of the upper and lower sides, and conventional heat dissipation methods cannot cope with it. A situation has arisen.
  • Patent Document 2 discloses a heat dissipation method for dissipating heat by attaching a substrate 222 mounted with LEDs 221 directly to a heat sink (heat dissipation member) 223 on the back surface of the liquid crystal display device 210 (backlight 211). Has been. According to this heat dissipation method, the substrate 222 on which the LED 221 is mounted and the heat sink 223 are in direct contact, and the heat conduction path is shortened.
  • a cylindrical housing portion formed by one end surface of the light guide plate 122, the frame 104, and the heat radiating plate 105 includes a light source unit (backlight device) 101.
  • the light source unit 101 is configured to be detachable in the first direction, the light source unit 101 includes a light emitting diode 102, a film substrate 103 on which a plurality of light emitting diodes 102 are mounted side by side in the first direction, a support unit that supports the film substrate 103, and A heat dissipation member 106 having a reflective portion extending in a second direction orthogonal to the first direction from the support portion, and an adhesive tape that adheres the film substrate 103 to the support portion and has heat dissipation properties, and is inserted into the accommodating portion In this state, the light emitting surface of the light emitting diode 102 faces the one end surface of the light guide plate 122, and the reflecting portion of the heat radiating member 106 and the heat radiating plate 105
  • the liquid crystal display device disclosed in Patent Document 1 since heat concentrates in the vicinity of the LED that is a point light source, the heat distribution becomes non-uniform, and the rear frame and the front frame function as heat dissipation members. The heat conduction to becomes worse. As a result, there is a problem that the heat dissipation performance is degraded. In addition, the liquid crystal display device has a problem in that the structural strength of the rear frame and the front frame is reduced when the liquid crystal display device is enlarged.
  • the liquid crystal display device disclosed in Patent Document 2 heat is transmitted to the lower part of the LED because the heat conduction of the substrate on which the LED is mounted is poor, but the heat sink temperature is too low in the portion without the LED. Does not rise. As a result, in the heat sink, there is a problem that heat distribution becomes uneven and heat dissipation performance is deteriorated. In addition, the liquid crystal display device has a problem in that the structural strength of the heat sink decreases when the liquid crystal display device is enlarged.
  • the liquid crystal display device disclosed in Patent Document 3 has a problem that the cost cannot be reduced.
  • the backlight device disclosed in Patent Document 4 has a problem that heat dissipation performance cannot be improved while maintaining structural strength.
  • the present invention has been made in view of the above-described conventional problems, and the object thereof is to improve the heat dissipation performance while maintaining the structural strength, and to suppress the luminance unevenness of the light source.
  • An object of the present invention is to provide a lighting device that can be used and an image display device including the same.
  • the inventors have uniquely found that by providing a heat conductive member separately from the heat radiating member and the light source holding member, it is possible to improve the heat radiating performance while maintaining the structural strength. It came to complete.
  • a light source in order to solve the above problems, a light source, a light guide member having a light incident surface and a light emitting surface perpendicular to the light incident surface, and the light source as a light incident surface.
  • a light source holding member that is disposed toward the light guide member, and a heat radiating member that is disposed on the back surface of the light guide member so as to be opposed to the light emitting surface.
  • a surface facing the heat radiating member and a surface facing the heat radiating member is connected to a surface of the heat radiating member facing the light guide member, and the light source Is disposed on a surface of the light source holding member facing the light guide member via a heat conductive member, and the heat conductive member is a surface of the heat radiating member facing the light guide member. It is characterized by being in contact with.
  • the lighting device of the present invention can improve the heat dissipation performance.
  • the heat conductive member is provided separately from the light source holding member, the heat radiation performance can be improved while maintaining the structural strength.
  • the illumination device of the present invention can suppress uneven brightness of the light source.
  • the illuminating device of the present invention has a light source, a light guide member having a light incident surface and a light emitting surface perpendicular to the light incident surface, and the light source disposed toward the light incident surface.
  • a light source holding member, and a heat dissipating member disposed on the back surface of the light guide member so as to face the light emitting surface, the light source holding member facing the light guide member,
  • a surface facing the heat dissipation member, a surface facing the heat dissipation member is connected to a surface of the heat dissipation member facing the light guide member, and the light source is the light source holding member
  • the heat conductive member is disposed on the surface facing the light guide member via the heat conductive member, and the heat conductive member is in contact with the surface of the heat radiating member facing the light guide member. It is.
  • the lighting device of the present invention can improve the heat dissipation performance while maintaining the structural strength, and can suppress the luminance unevenness of the light source.
  • Embodiment 1 (I) Configuration of Illumination Device in the Present Embodiment
  • a light source a light guide member having a light incident surface and a light emitting surface perpendicular to the light incident surface, and light incident on the light source.
  • a light source holding member arranged toward the surface, and a heat radiating member arranged opposite to the light emitting surface on the back surface of the light guide member, the light source holding member comprising the heat radiating member
  • the light source is disposed on a surface facing the light incident surface of the light source holding member via a heat conductive member, and the heat conductive member is in contact with the heat dissipation member.
  • the light guide member causes light from the light source disposed on the light source holding member to enter the light guide member from the light incident surface of the light guide member, and enters the light guide member. Light is emitted from the light exit surface.
  • the illuminating device in the present embodiment includes a light source and a light guide member, makes light from the light source enter from the light incident surface of the light guide member, and emit light from the light output surface of the light guide member.
  • the back surface of the light guide member viewed from the light emitting surface side has a function of releasing the amount of heat generated by the light source to the outside of the apparatus.
  • the light source is provided on the light source holding member connected to the heat radiating member, which has a surface perpendicular to the light emitting surface of the light guide member, and its optical axis is directed to the inside of the light guide member. Yes.
  • the light source is disposed on the light source holding member via a heat conductive member, and the heat conductive member and the heat radiating member are in contact, that is, the heat conductive member and the heat radiating member Is connected, the amount of heat generated by the light source is successfully transmitted to the heat radiating member, and the amount of heat is released from the heat radiating member to the outside of the apparatus.
  • the lighting device in the present embodiment may include a housing made of a heat radiating member. Moreover, in the illuminating device in this embodiment, the light source holding member is arrange
  • the cross-sectional shape of the thermally conductive member on a plane perpendicular to both the light incident surface and the light emitting surface is L-shaped or U-shaped. preferable.
  • the thermal resistance per unit length in the direction along the contact surface between the heat conductive member and the heat dissipation member in the heat conductive member is It is preferably smaller than the thermal resistance per unit length in the direction along the contact surface between the heat conductive member and the heat dissipation member.
  • FIGS. 1 and 2 are schematic cross-sectional views showing a configuration of a liquid crystal display device (image display device) 10 including a backlight device (illumination device) 1 according to this embodiment.
  • 3 and 4 are perspective views showing a configuration in the vicinity of the light source 7 of the backlight device 1 in the present embodiment.
  • 5 and 6 are cross-sectional views showing the configuration in the vicinity of the light source 7.
  • the backlight device 1 in this embodiment mainly includes a light source 7 (a plurality of point light sources (light emitting elements) 2 and a substrate 3 on which the point light sources 2 are mounted), and a light source 7.
  • a light source 7 a plurality of point light sources (light emitting elements) 2 and a substrate 3 on which the point light sources 2 are mounted
  • a light source 7 From the frame (light source holding member) 4 to be fixed, the chassis (heat radiating member) 5 connected to the frame 4, the heat conductive plate 6 disposed between the light source 7 and the frame 4 and connected to the chassis 5, and the light source 7
  • a light guide plate (light guide member) 22 for emitting incident light is provided.
  • the liquid crystal display device 10 in this embodiment mainly includes a backlight device 1, a reflection sheet 21, an optical sheet 23, a liquid crystal panel 24, and a bezel (outer frame) 25. Yes.
  • the backlight device 1 diffuses heat in the heat path and makes the heat distribution uniform in order to improve the heat conduction performance when the heat generated from the light source 7 is transmitted to the heat radiating member 5. This is realized by using a configuration that can Details of each member will be described below.
  • the light source 7 used in the backlight device 1 of the present embodiment may be only the point light source (light emitting element) 2 or may be one in which the point light source 2 is carried on the substrate 3. In FIGS. 1 to 7 and FIGS. 9 to 12, the light source 7 is shown as having the point light source 2 carried on the substrate 3.
  • the light source 7 serves as a heat source, and the necessity of heat dissipation arises.
  • Examples of the point light source 2 used in the backlight device 1 of the present embodiment include a light emitting diode (LED) and a cold cathode tube (CCFL).
  • LED light emitting diode
  • CCFL cold cathode tube
  • any of white LED light source, RGB-LED (light emitting diode in which R, G, B chips are molded in one package) light source, multi-color LED light source, and laser light source are preferable. Can be used.
  • the substrate (light source substrate, light emitting substrate) 3 used in the backlight device 1 of the present embodiment is not particularly limited as long as the point light source 2 can be mounted.
  • a metal substrate based on aluminum (Al), copper (Cu), or the like having high thermal conductivity can be preferably used.
  • mounting refers to mounting electronic components such as a light source on a substrate.
  • substrate is not specifically limited, For example, the method of attaching by soldering etc. are mentioned.
  • the frame 4 used in the backlight device 1 of the present embodiment is not particularly limited as long as it has structural strength. Further, as the frame 4 used in the backlight device 1 of the present embodiment, for example, an aluminum alloy, a steel plate, stainless steel or the like can be preferably used.
  • the aluminum alloy include materials such as A5052 (tensile strength 195 N / mm 2 , thermal conductivity 138 W / m ⁇ K) and A6063 (tensile strength 185 N / mm 2 , thermal conductivity 209 W / m ⁇ K).
  • Examples of the steel plate include SECC (thermal conductivity 70 W / m ⁇ K).
  • stainless steel include materials such as SUS (thermal conductivity 15 W / m ⁇ K).
  • the shape of the frame 4 used in the backlight device 1 of this embodiment has a quadrangular prism shape having a rectangular or square cross section (the surface shown in FIGS. 5 and 6), an L-shaped or a U-shaped cross section. It is a polygonal column shape or the like.
  • the shape of the frame 4 will be specifically described below as “another embodiment”.
  • the frame 4 has a surface perpendicular to the light emitting surface of the light guide plate 22. Further, the frame 4 may or may not surround the light guide plate 22 with a surface perpendicular to the light emitting surface. Further, the frame 4 is preferably disposed as a structural reinforcing column at both ends of the chassis 5 so as to face two surfaces of the light guide plate 22 that are not adjacent to each other.
  • the chassis 5 used in the backlight device 1 of the present embodiment is not particularly limited as long as it has heat dissipation performance and structural strength.
  • an aluminum alloy, a steel plate, stainless steel, or the like can be preferably used as the chassis 5 used for the backlight device 1 of the present embodiment.
  • the aluminum alloy include materials such as A5052 (tensile strength 195 N / mm 2 , thermal conductivity 138 W / m ⁇ K) and A6063 (tensile strength 185 N / mm 2 , thermal conductivity 209 W / m ⁇ K).
  • Examples of the steel plate include SECC (thermal conductivity 70 W / m ⁇ K).
  • stainless steel include materials such as SUS (thermal conductivity 15 W / m ⁇ K).
  • Heat conductive plate 6 used in the backlight device 1 of the present embodiment a plate having high thermal conductivity is used.
  • the thermal conductivity of the heat conductive plate 6 is preferably in the range of 200 W / m ⁇ K to 1000 W / m ⁇ K.
  • the thermal conductivity of the heat conducting plate 6 is less than 200 W / m ⁇ K, the heat conduction becomes insufficient and the heat does not spread to the heat radiating member, so the area contributing to heat radiation becomes small and the heat radiation performance is insufficient. It is not preferable for the reason.
  • the thermal conductivity of the heat conductive plate 6 is larger than 1000 W / m ⁇ K, it is not preferable because of its high price, softness and difficulty in use, and deterioration over time.
  • the “thermal conductivity” is a value obtained by dividing the amount of heat flowing in a unit time through a unit area perpendicular to the heat flow by a temperature difference (temperature gradient) per unit length in heat conduction. (W / m ⁇ K).
  • thermal resistance is a value representing the difficulty of transmitting temperature, and means a temperature rise amount (° C./W) with respect to a heat generation amount per unit time.
  • heat conduction plate 6 used in the backlight device 1 of the present embodiment structural strength is not required, so a material having high heat conductivity may be selected.
  • a material having high heat conductivity may be selected.
  • aluminum, copper, carbon, silver or the like can be preferably used.
  • pure aluminum include materials such as A1050 (thermal conductivity 225 W / m ⁇ K).
  • pure copper include materials such as C1100 (thermal conductivity 391 W / m ⁇ K).
  • materials such as a sheet containing a filler such as carbon and silver, and a metal flat plate with a built-in heat pipe can be used.
  • the thermal conductivity of the heat conductive plate 6 used in the backlight device 1 of the present embodiment is larger than the thermal conductivity of the frame 4 and the chassis 5. Further, the thickness of the heat conductive plate 6 is preferably about 0.5 to 2 mm.
  • the shape of the heat conductive plate 6 used in the backlight device 1 of the present embodiment is not particularly limited, and examples thereof include a planar shape shown in FIG. 5 and an L-shaped shape shown in FIG.
  • the chassis 5 and the heat conduction plate 6 are in contact with each other over a wide area. Therefore, the heat dissipation performance can be further improved.
  • the shape of the heat conductive plate 6 will be specifically described below as “another embodiment”.
  • the light guide plate 22 used in the backlight device 1 of the present embodiment has a light incident surface and a light emitting surface perpendicular to the light incident surface, and can emit light incident from the light source 7. There is no particular limitation as long as it is possible.
  • the liquid crystal display device 10 As the reflection sheet 21, the optical sheet 23, the liquid crystal panel 24, and the bezel 25, those provided in a conventionally known liquid crystal display device can be used.
  • the frame 4 must have both the structural strength and the heat conductivity. No longer.
  • the thermal conductivity of A5052 which is a general aluminum alloy (excellent in structural strength) as a structural member, is higher than that of SUS or the like, but is less than half that of C1100, which is pure copper.
  • A1050 which is pure aluminum excellent in thermal conductivity, has insufficient strength to use as a structural member (inferior in structural strength).
  • A1050 is inferior to A5052 in all respects: tensile strength, shear strength and yield strength.
  • the heat conductive plate 6 is essential in addition to the frame 4.
  • the frame 4 is omitted and the structural strength is secured by the chassis 5 and only the heat conductive plate 6 is adopted from the viewpoint of thermal conductivity, it is a small and medium size panel such as a mobile phone and a car navigation system. Since the total amount of light required for the light source is small, there is a possibility that the two performances can be compatible. However, in large displays such as liquid crystal televisions and digital signage displays, the weight increases in terms of area. Therefore, if the structural strength can be maintained only by the chassis 5, the thickness of the chassis 5 is increased in proportion to the increase in size. Need to increase. In that case, it is not realistic in terms of weight, material cost, workability and the like. Therefore, the frame 4 is indispensable separately from the chassis 5 in order to achieve the structural strength by setting the chassis 5 to about 2 mm or less which is a realistic thickness.
  • the structural strength is assigned to the frame 4, and the thermal conductivity is assigned to the heat conductive plate 6, respectively, and the best performance as a whole can be exhibited by using optimal members for each.
  • the thickness of the substrate 3 is generally about 1 to 2 mm in the case of a metal substrate, and the length in the longitudinal direction of the substrate 3 is the length of one side of the screen. Generally, it is about 300 mm to 1200 mm.
  • a plurality of point light sources 2 are arranged in the longitudinal direction of the substrate 3.
  • the size of the point light source 2 is generally rectangular (rectangular, square, etc.) having a side of about 3 mm to 10 mm.
  • the heat conduction in the thickness direction of the substrate 3 is relatively good because heat is transferred in the range of the size of the point light source 2.
  • the heat conduction in the longitudinal direction of the substrate 3 proceeds only in the range of the thickness direction of the substrate 3, it is inferior to the heat conduction in the thickness direction. For this reason, distribution arises in heat by arrangement
  • the LEDs near the center are crowded because other LEDs exist on both sides and are dense.
  • the LED arranged at the end has no heat source next to it, heat is likely to diffuse.
  • the heat generated by the point light source 2 has a heat distribution in the longitudinal direction of the substrate 3.
  • the luminous efficiency of an LED varies depending on the temperature. If all the LEDs are operated in a state where the heat generation state varies depending on each LED, the light emission state is different, which leads to occurrence of luminance unevenness in the backlight device 1, and this state is not preferable.
  • the present embodiment can eliminate this state.
  • the principle is as follows.
  • the substrate 3 is in contact with the frame 4 via the heat conducting plate 6.
  • the heat conductive plate 6 is formed of a material having high heat conductivity as described above.
  • the frame 4 is a member that maintains structural strength, and thus has a larger cross-sectional area than the substrate 3. Therefore, the thermal resistance in the longitudinal direction of the frame 4 is smaller than that of the substrate 3, and sufficient thermal diffusion is performed in the heat conductive plate 6 and the frame 4. As a result, an effect of making the temperature of the substrate 3 uniform is produced, and variations in the operating temperature of the LEDs are reduced, so that uneven brightness in the backlight device 1 can be suppressed.
  • heat uniformity has the effect of reducing thermal resistance.
  • the mechanism by which heat conduction deteriorates when the heat distribution is uneven is explained as follows.
  • FIGS. 8A and 8B are cross-sectional views when heat sources 12 and 13 having different sizes are mounted on a certain heat conductor 11.
  • FIG. The thermal conductor 11 is the same in FIGS. 8A and 8B and has the same thermal conductivity, so that the thermal resistance per unit area is also the same.
  • the heat conduction of the heat conductor 11 is improved when the same amount of heat is input per unit time, it is better to conduct the heat after expanding the heat in terms of area. I understand. It can also be seen that the heat conduction is best when the heat distribution is uniform.
  • the heat transmitted from the substrate 3 to the heat conducting plate 6 and the frame 4 is transmitted to the chassis 5 in a state of uniform distribution. For this reason, heat conduction is performed to the chassis 5 in a state with good heat conduction. And if the heat conduction to the chassis 5 is good, the temperature of the chassis 5 becomes high and the temperature difference from the atmospheric temperature is widened, so that the efficiency of heat exchange increases. As a result, the heat dissipation performance of the backlight device 1 is improved. Furthermore, the heat distribution in the planar direction of the chassis 5 is made uniform by adopting a configuration in which the thermal resistance in the planar direction of the heat conducting plate 6 is smaller than the thermal resistance in the planar direction of the chassis 5. Therefore, the heat dissipation performance can be improved.
  • a heat conduction auxiliary material such as a resin sheet, a metal sheet, or grease is inserted between the members in the backlight device 1 because the thermal resistance of the interface can be further lowered.
  • the heat conductive member includes a first plate-like portion that contacts a surface of the light source holding member facing the light guide member, and the light guide member of the heat dissipation member.
  • the light source is disposed on the surface of the light source holding member facing the light incident surface via the first plate portion.
  • the light source holding member faces the light guide member of the first plate portion, the third plate portion contacting the back surface of the surface facing the light guide member, and the heat radiating member.
  • a second plate-like portion and a fourth plate-like portion are formed adjacent to the first plate-like portion and the third plate-like portion, respectively, by bending. It is preferable.
  • the heat conductive member has a second plate-like portion that is coupled to the heat dissipation member, and a first plate-like portion that is raised from the second plate-like portion by bending.
  • the light source holding member includes a fourth plate-like portion that is coupled to the heat dissipation member, and a third plate-like portion that is raised from the fourth plate-like portion by bending.
  • the shape of the cross section of the light source holding member on a plane perpendicular to both the light incident surface and the light emitting surface is preferably L-shaped or U-shaped. Moreover, as for the illuminating device in this embodiment, it is preferable that the 3rd plate-shaped part is contacting the said light source.
  • the cross-sectional shape of the thermally conductive member on a plane perpendicular to both the light incident surface and the light emitting surface is L-shaped or U-shaped. preferable.
  • another example of the backlight device 1 in the present embodiment is one in which the shape of the frame 4 is changed. Specifically, this will be specifically described with reference to FIGS.
  • the frame 4 has a U-shaped cross section (surface shown in FIGS. 5 and 6).
  • the shape of the frame 4 is changed to a polygonal column shape having an L-shaped cross section, etc., and compared with a rectangular column shape having a rectangular or square cross section.
  • the material cost can be reduced, and the mechanical strength can be increased by bending the flat plate like a U-shape or L-shape.
  • FIG. 9 is a schematic cross-sectional view showing a configuration of a liquid crystal display device (image display device) 10 including a backlight device (illumination device) 1 in another embodiment (see FIG. 10B). It is. In FIG. 9, the description is made using the backlight device 1 shown in FIG. 10B, but instead of “the backlight device 1 shown in FIG. 10B”, “FIG. 10A, The backlight device 1 ”shown in FIG. 11 or FIGS. 12A to 12C is also included in this embodiment.
  • the frame 4 used in the backlight device 1 of the present embodiment is a third plate-like portion that is in contact with the back surface of the first plate-like portion of the heat conducting plate 6 that faces the light guide plate 22. And a fourth plate-like portion in contact with the surface of the chassis 5 facing the light guide plate 22, and the fourth plate-like portion is formed adjacent to the third plate-like portion by bending. Yes.
  • the frame 4 used in the backlight device 1 of the present embodiment has a cross-sectional shape (surface shown in FIGS. 10 to 12) in a plane perpendicular to both the light incident surface and the light emitting surface of the light guide plate 22.
  • the frame 4 used in the backlight device 1 of the present embodiment is partially cut from the shape shown in FIGS. 5 and 6.
  • the shape of the frame 4 By making the shape of the frame 4 into a polygonal column shape having an L-shaped or U-shaped cross section, material costs can be reduced compared to a rectangular column shape having a rectangular or square cross section.
  • the mechanical strength can be increased by bending a flat plate such as an L shape.
  • the frame 4 used in the backlight device 1 of the present embodiment may be wavy. Thereby, intensity
  • the cross-sectional shape of the light source holding member is preferably rectangular or square.
  • the plane is perpendicular to both the first surface where the light source holding member and the heat conductive member are in contact and the second surface where the light source holding member and the heat dissipation member are in contact. It is also preferable that the shape of the cross section of the light source holding member is L-shaped or U-shaped.
  • the heat conductive plate 6 used in the backlight device 1 of the present embodiment is provided on the first plate-like portion in contact with the surface of the frame 4 facing the light guide plate 22 and the light guide plate 22 of the chassis 5. It has the 2nd plate-shaped part which touches the surface which has countered.
  • the heat conducting plate 6 used in the backlight device 1 of the present embodiment has a cross-sectional shape (surface shown in FIGS. 10 to 12) in a plane perpendicular to both the light incident surface and the light emitting surface of the light guide plate 22.
  • the length of the upper side is the length of the lower side (chassis 5 side). It may be shorter or the same as the length.
  • the heat conducting plate 6 used in the backlight device 1 of the present embodiment may be subjected to wave processing. Thereby, intensity
  • (II) Manufacturing method of lighting device in the present embodiment connects the light source 7 (the point light source 2 and the substrate 3), the heat conduction plate 6, the frame 4 and the chassis 5 in order. I will do it. Thereafter, the light guide plate 22 is disposed.
  • the light guide plate 22 is disposed.
  • As a means for connecting each member in addition to screwing, for example, fixing with an adhesive tape, an adhesive or the like; fitting; pressing;
  • a light source In the illuminating device according to the present embodiment, a light source, a light guide member having a light incident surface and a light emitting surface perpendicular to the light incident surface, and a light source holding member for arranging the light source toward the light incident surface And a heat radiating member disposed on the back surface of the light guide member so as to face the light emitting surface, the light source holding member is connected to the heat radiating member, and the light source is The light source holding member is disposed on a surface facing the light incident surface via a heat conductive member, the heat conductive member is in contact with the heat dissipation member, and the light source carries a light emitting element.
  • a substrate is included, the substrate is made of a heat conductive material, and the substrate is in contact with the heat dissipation member, that is, the substrate is connected to the heat dissipation member.
  • the cross-sectional shape of the substrate in a plane perpendicular to both the light incident surface and the light emitting surface is preferably L-shaped.
  • the thermal resistance per unit length in the direction along the contact surface between the substrate and the heat dissipation member in the substrate is such that the substrate and the heat dissipation member in the heat dissipation member The thermal resistance per unit length in the direction along the contact surface is preferably smaller.
  • the thermal resistance per unit length in the direction along the contact surface between the light source holding member and the substrate in the light source holding member is the same as the light source holding member in the substrate. It is preferably smaller than the thermal resistance per unit length in the direction along the contact surface with the substrate.
  • the illuminating device in the present embodiment has a “substrate 33 (thermal conductivity) included in the“ light source 8 ”as a thermally conductive member instead of the“ thermal conductive plate 6 ”.
  • a material made of a conductive material is provided with thermal conductivity (similar to the thermal conductivity plate 6).
  • FIG. 13 is a schematic cross-sectional view showing a configuration of a liquid crystal display device (image display device) 30 including a backlight device (illumination device) 31 in the present embodiment.
  • FIG. 14 is a perspective view showing a configuration in the vicinity of the light source 8 of the backlight device 31 in the present embodiment.
  • 15 and 16 are cross-sectional views showing the configuration in the vicinity of the light source 8.
  • the backlight device 31 in this embodiment mainly includes a light source 8 (a plurality of point light sources (light emitting elements) 2 and a substrate 33 on which the point light sources 2 are mounted), and a light source 8.
  • a frame (light source holding member) 4 to be fixed, a chassis (heat radiating member) 5 connected to the frame 4, and a light guide plate (light guide member) 22 that emits light incident from the light source 8 are provided.
  • the substrate 33 is connected to the chassis 5.
  • the point light source 2 can be mounted and the thermal conductivity is high. Use expensive ones.
  • the thermal conductivity of the substrate 33 is preferably in the range of 200 W / m ⁇ K to 1000 W / m ⁇ K. When the thermal conductivity of the substrate 33 is less than 200 W / m ⁇ K, the heat conduction is insufficient and the heat does not spread to the heat dissipation member, so that the area contributing to heat dissipation is reduced and the heat dissipation performance is insufficient. It is not preferable for the reason. On the other hand, when the thermal conductivity of the substrate 33 is larger than 1000 W / m ⁇ K, it is not preferable because it is expensive, soft and difficult to use, and causes deterioration over time.
  • a material having high thermal conductivity may be selected.
  • aluminum, copper, carbon, silver or the like can be preferably used.
  • pure aluminum include materials such as A1050 (thermal conductivity 225 W / m ⁇ K).
  • pure copper include materials such as C1100 (thermal conductivity 391 W / m ⁇ K).
  • materials such as a sheet containing a filler such as carbon and silver, and a metal flat plate with a built-in heat pipe can be used.
  • the thermal conductivity of the substrate 33 used in the backlight device 31 of this embodiment is larger than the thermal conductivity of the frame 4 and the chassis 5.
  • the shape of the substrate 33 used in the backlight device 1 of the present embodiment is not particularly limited, and examples thereof include a planar shape shown in FIG. 15 and an L-shaped shape shown in FIG.
  • the chassis 5 and the substrate 33 are in contact with each other over a wide area. Therefore, the heat dissipation performance can be further improved.
  • the present embodiment is different from the first embodiment described above in that the substrate 33 also serves as the heat conduction plate 6.
  • the principle of improving the performance of heat conduction is basically the same as in the first embodiment. However, compared with Embodiment 1 mentioned above, since there is no heat conductive board 6, the number of interfaces reduces and heat conductivity can be improved more.
  • the thermal resistance in the longitudinal direction of the frame 4 is smaller than the thermal resistance in the longitudinal direction of the substrate 33
  • the heat distribution in the longitudinal direction of the substrate 33 can be made uniform.
  • variation in the temperature in LED can be suppressed.
  • heat is transmitted to the chassis 5 in a state where the heat distribution in the longitudinal direction of the substrate 33 is made uniform, so that good heat conduction and heat dissipation can be performed.
  • the manufacturing method of the lighting device in the present embodiment uses the “substrate 33” instead of the “substrate 3”, and uses the “heat conduction plate 6”. Except for this, it is the same as the manufacturing method of the lighting device in the first embodiment described above.
  • the illumination device of the present embodiment is, for example, an edge light type backlight device that enters from the side, and includes a point light source, a substrate on which the point light source is mounted, a frame, a chassis, and heat conduction. Even if the board and the frame are in contact with each other through the heat conduction plate, the heat conduction plate and the frame are in contact, and the heat conduction plate and the chassis are in contact with each other. Good.
  • the lighting device of the present embodiment has a configuration in which, for example, the thermal resistance per unit length in the planar direction of the heat conducting plate is smaller than the thermal resistance per unit length in the planar direction of the chassis. May be.
  • the illumination device of the present embodiment includes, for example, an edge light type backlight device that enters from the side, and includes a point light source, a substrate on which the point light source is mounted, a frame, and a chassis.
  • a configuration in which the substrate and the frame are in contact with each other and the substrate and the chassis are in contact with each other may be employed.
  • the lighting device of the present embodiment may be configured such that, for example, the thermal resistance per unit length in the longitudinal direction of the frame is smaller than the thermal resistance per unit length in the longitudinal direction of the substrate. Good.
  • the illumination device of the present embodiment may have a configuration in which the frame has a rectangular or square cross section in the longitudinal direction, for example.
  • the lighting device of the present embodiment may have a configuration in which the frame has an L-shaped or U-shaped cross section in a longitudinal section.
  • the illumination device of the present embodiment may be configured such that, for example, a member that supports the light emitting substrate of the sidelight type backlight is configured by two L-shaped members.
  • the lighting device of the present embodiment may have a configuration in which a light emitting substrate is sandwiched between L-shaped members, for example.
  • the lighting device of the present embodiment may have a configuration in which an L-shaped member is created by bending, for example.
  • the cross-sectional shape of the thermally conductive member in a plane perpendicular to both the light incident surface and the light emitting surface is L-shaped or U-shaped.
  • the lighting device of the present invention can transmit heat to the heat radiating member more efficiently, and can further improve the heat radiating performance.
  • the thermal resistance per unit length in the direction along the contact surface between the heat conductive member and the heat radiating member in the heat conductive member is the heat resistance in the heat radiating member. It is preferably smaller than the thermal resistance per unit length in the direction along the contact surface between the conductive member and the heat radiating member.
  • the heat conductive member can assist heat conduction in the direction in the heat radiating member.
  • the heat distribution in the heat radiating member is made more uniform, and the heat radiating performance can be further improved.
  • the light source includes a substrate carrying a light emitting element.
  • the light source is easily disposed on the light source holding member via the heat conductive member.
  • the substrate is made of a heat conductive material, and the substrate is in contact with the heat dissipation member.
  • the lighting device of the present invention can improve the heat dissipation performance.
  • the substrate which is a heat conductive material is provided separately from the light source holding member, the heat radiation performance can be improved while maintaining the structural strength.
  • the illumination device of the present invention can suppress uneven brightness of the light source.
  • the cross-sectional shape of the substrate in a plane perpendicular to both the light incident surface and the light emitting surface is preferably L-shaped.
  • the lighting device of the present invention can transmit heat to the heat radiating member more efficiently, and can further improve the heat radiating performance.
  • the thermal resistance per unit length in the direction along the contact surface between the substrate and the heat dissipation member in the substrate is such that the substrate and the heat dissipation member in the heat dissipation member It is preferably smaller than the thermal resistance per unit length in the direction along the contact surface.
  • the substrate can assist heat conduction in the direction in the heat dissipation member.
  • the heat distribution in the heat radiating member is made more uniform, and the heat radiating performance can be further improved.
  • a thermal resistance per unit length in a direction along a contact surface between the light source holding member and the heat conductive member or the substrate is It is preferable that the thermal resistance per unit length in the direction along the contact surface between the light source holding member and the thermally conductive member or the substrate is smaller.
  • the light source holding member can assist heat conduction in the direction in the substrate.
  • the heat distribution on the substrate is made more uniform, and the unevenness in luminance of the light source can be further suppressed.
  • the lighting device of the present invention is in a plane perpendicular to both the first surface where the light source holding member and the heat conductive member are in contact and the second surface where the light source holding member and the heat dissipation member are in contact.
  • the cross-sectional shape of the light source holding member is preferably rectangular or square.
  • the illumination device of the present invention can increase the area of the surface of the light source holding member.
  • the illumination device of the present invention can reduce the thermal resistance per unit length in the direction along the contact surface between the light source holding member and the thermally conductive member or the substrate in the light source holding member.
  • the heat conduction performance in can be improved.
  • the present inventors diligently studied why the cost cannot be reduced in the liquid crystal display device disclosed in Patent Document 3.
  • the cross-sectional shape includes a T-shaped prismatic frame, extrusion molding is required for manufacturing the prismatic frame, and screw holes are formed. It has been found that the manufacturing cost increases because it is post-processing.
  • the inventors of the present invention use a frame formed by bending a flat plate (sheet metal processing) to bring the frame into contact with a heat radiating member and a heat conductive member while maintaining structural strength. It was found uniquely that the heat dissipation performance can be improved and the cost can be reduced.
  • the thermally conductive member includes a first plate-like portion that contacts a surface of the light source holding member facing the light guide member, and And a second plate-like portion in contact with the surface of the heat dissipation member facing the light guide member, and the light source is arranged on the surface of the light source holding member facing the light incident surface.
  • the light source holding member is disposed through a plate-like portion, and the light source holding member is a third plate-like portion that is in contact with the back surface of the first plate-like portion facing the light guide member, and the heat dissipation member.
  • the fourth plate-like portion is in contact with the surface facing the light guide member, and the second plate-like portion and the fourth plate-like portion are respectively bent by a first plate-like portion and a third plate. Preferably, it is formed adjacent to the shape portion.
  • the second plate-shaped portion is formed adjacent to the first plate-shaped portion by bending, and in the light source holding member, the fourth plate-shaped portion is formed by bending. It is formed adjacent to the three plate portions.
  • the cross-sectional shape of the light source holding member in a plane perpendicular to both the light incident surface and the light emitting surface is L-shaped or U-shaped.
  • the lighting device of the present invention can reduce the volume of the light source holding member while maintaining the structural strength.
  • the lighting device of the present invention can achieve weight reduction and further cost reduction.
  • the illuminating device of the present invention can further improve the heat dissipation performance by the L-shaped or U-shaped space portion.
  • the third plate-like portion is in contact with the light source.
  • the illumination device of the present invention can conduct heat from a plurality of surfaces of the light source, and can improve heat conduction from the light source to the heat radiating member.
  • the thermal conductivity of the thermal conductive member is in a range of 200 W / m ⁇ K or more and 1000 W / m ⁇ K or less.
  • the lighting device of the present invention can efficiently diffuse heat by the heat conductive member.
  • the lighting device of the present invention can transfer heat to the heat dissipation member more efficiently.
  • the image display device of the present invention is characterized by including the above-described illumination device.
  • the image display apparatus of the present invention can suppress the uneven brightness of the light source and improve the heat dissipation performance while maintaining the structural strength, so the temperature of the light source can be lowered and the luminous efficiency can be improved. Can be made.
  • the image display device of the present invention can suppress the temperature rise of the element even when operated at high brightness to illuminate a large screen, and the operation of a large and thin image display device due to side incident light. Enable.
  • the present invention is suitably used for a surface emitting backlight device provided in a liquid crystal display device such as a mobile phone, a notebook personal computer, and a television, particularly a side edge type large backlight device using a point light source such as an LED as a light source. can do.
  • Backlight device 2 Point light source (light emitting element, light source) 3 Substrate 4 Frame (Light source holding member) 5 Chassis (heat dissipation member) 6 Thermal conductive plate (thermal conductive member) 7 Light source 8 Light source 10 Liquid crystal display device (image display device) DESCRIPTION OF SYMBOLS 11 Heat conductor 12 Heat source 13 Heat source 21 Reflection sheet 22 Light guide plate (light guide member) 23 Optical sheet 24 Liquid crystal panel 25 Bezel (outer frame) 30 Liquid crystal display device (image display device) 31 Backlight device (lighting device) 33 Substrate

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)

Abstract

L'invention concerne un dispositif d'éclairage permettant d'améliorer la performance de dissipation thermique tout en préservant la résistance structurale, et de supprimer l'irrégularité de luminance d'une source lumineuse. L'invention concerne également un dispositif d'affichage d'images comprenant le dispositif d'éclairage. Le dispositif d'éclairage (1) comprend : la source lumineuse (7) ; un élément de guidage de lumière (22), qui comprend une surface d'entrée de lumière et une surface de sortie de lumière qui est perpendiculaire à la surface d'entrée de lumière ; un élément de support de source lumineuse (4) destiné à la disposition de la source lumineuse (7) de sorte que la source lumineuse fasse face à la surface d'entrée de lumière ; et un élément de dissipation thermique (5), qui est disposé sur la surface arrière de l'élément de guidage de lumière (22) de sorte que l'élément de dissipation thermique fasse face à la surface de sortie de lumière. L'élément de support de source lumineuse (4) comprend une surface qui fait face à l'élément de guidage de lumière (22) et une surface qui fait face à l'élément de dissipation thermique (5), et la surface faisant face à l'élément de dissipation thermique (5) est raccordée à la surface d'élément de dissipation thermique (5) qui fait face à l'élément de guidage de lumière (22). La source lumineuse (7) est disposée sur la surface d'élément de support de source lumineuse (4) qui fait face à l'élément de guidage de lumière (22) tout en comprenant un élément thermoconducteur (6) entre eux, et l'élément thermoconducteur (6) est en contact avec une surface d'élément de dissipation thermique (5) qui fait face à l'élément de guidage de lumière (22).
PCT/JP2011/052442 2010-06-30 2011-02-04 Dispositif d'éclairage et dispositif d'affichage d'images doté de celui-ci WO2012001999A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010-150273 2010-06-30
JP2010150275A JP2012014947A (ja) 2010-06-30 2010-06-30 照明装置及びそれを備えた画像表示装置
JP2010-150275 2010-06-30
JP2010150273A JP2012014946A (ja) 2010-06-30 2010-06-30 照明装置及びそれを備えた画像表示装置

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013164618A (ja) * 2012-01-12 2013-08-22 Sharp Corp 表示装置およびテレビジョン受像機
CN103439831A (zh) * 2013-08-05 2013-12-11 青岛海信电器股份有限公司 侧光式液晶模组、直下式液晶模组及电视机
CN104040413A (zh) * 2012-02-13 2014-09-10 夏普株式会社 显示装置和电视接收装置
CN105805612A (zh) * 2014-12-31 2016-07-27 许孙 承载重压高防水led照明系统
WO2019031233A1 (fr) * 2017-08-10 2019-02-14 シャープ株式会社 Dispositif d'affichage et récepteur de télévision

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JP2007193946A (ja) * 2006-01-17 2007-08-02 Nippon Seiki Co Ltd 発光装置
JP2007208150A (ja) * 2006-02-04 2007-08-16 Nichia Chem Ind Ltd サブマウント基板及びこれを備える発光装置
JP2007287463A (ja) * 2006-04-17 2007-11-01 Sharp Corp 照明装置
JP2008089944A (ja) * 2006-10-02 2008-04-17 Hitachi Displays Ltd 液晶表示装置
JP2009238733A (ja) * 2007-12-07 2009-10-15 Mabuchi Shomei Seisakusho:Kk 導光式照明器具

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007193946A (ja) * 2006-01-17 2007-08-02 Nippon Seiki Co Ltd 発光装置
JP2007208150A (ja) * 2006-02-04 2007-08-16 Nichia Chem Ind Ltd サブマウント基板及びこれを備える発光装置
JP2007287463A (ja) * 2006-04-17 2007-11-01 Sharp Corp 照明装置
JP2008089944A (ja) * 2006-10-02 2008-04-17 Hitachi Displays Ltd 液晶表示装置
JP2009238733A (ja) * 2007-12-07 2009-10-15 Mabuchi Shomei Seisakusho:Kk 導光式照明器具

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013164618A (ja) * 2012-01-12 2013-08-22 Sharp Corp 表示装置およびテレビジョン受像機
CN104040413A (zh) * 2012-02-13 2014-09-10 夏普株式会社 显示装置和电视接收装置
CN104040413B (zh) * 2012-02-13 2016-03-23 夏普株式会社 显示装置和电视接收装置
CN103439831A (zh) * 2013-08-05 2013-12-11 青岛海信电器股份有限公司 侧光式液晶模组、直下式液晶模组及电视机
CN105805612A (zh) * 2014-12-31 2016-07-27 许孙 承载重压高防水led照明系统
WO2019031233A1 (fr) * 2017-08-10 2019-02-14 シャープ株式会社 Dispositif d'affichage et récepteur de télévision
JP2019036779A (ja) * 2017-08-10 2019-03-07 シャープ株式会社 表示装置及びテレビジョン受信機

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