+

WO2012000371A1 - Bloc d'alimentation de module continu-continu - Google Patents

Bloc d'alimentation de module continu-continu Download PDF

Info

Publication number
WO2012000371A1
WO2012000371A1 PCT/CN2011/075364 CN2011075364W WO2012000371A1 WO 2012000371 A1 WO2012000371 A1 WO 2012000371A1 CN 2011075364 W CN2011075364 W CN 2011075364W WO 2012000371 A1 WO2012000371 A1 WO 2012000371A1
Authority
WO
WIPO (PCT)
Prior art keywords
power supply
circuit board
module power
patch
board
Prior art date
Application number
PCT/CN2011/075364
Other languages
English (en)
Chinese (zh)
Inventor
张滨
陈丽霞
张洋
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2012000371A1 publication Critical patent/WO2012000371A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Definitions

  • the present invention relates to a direct current/direct current (DC/DC) module power supply, and more particularly to a vertical DC/DC module power supply.
  • DC/DC direct current/direct current
  • DC/DC module power supplies are widely used in the fields of switching equipment, access equipment, mobile communications, microwave communications, optical transmission, and routers, automotive electronics, and aerospace. In the communications field, communication systems are typically powered by -48V or +24V. There will be one or more DC/DC module power supplies in the system that convert the DC-powered voltage to the required operating voltage on the board. With the increasing demand for power density and conversion efficiency of DC/DC module power supplies in the communication field, it is very urgent to provide a miniaturized, high-efficiency, and reliable DC/DC module power supply, and DC/DC modules. The change in the package structure of the power supply is a solution for achieving miniaturization and high efficiency.
  • a common DC/DC module power supply consists of a set of printed circuit boards, circuit device layouts, and pins for electrical connections.
  • the DC/DC module power supply package mainly has two structures: plug-in package and chip package.
  • the connection between the DC/DC module power supply of the plug-in package and the system board requires the use of through holes, and the DC/DC module power supply
  • the system board and the module power supply are connected through the soldering through holes on the system board.
  • the current main structure of the chip package DC/DC module power supply is a horizontally placed structure, and the horizontally placed structure is mainly used with a ball grid. Ball Grid Array (BGA) package or single-terminal soldered structure.
  • BGA Ball Grid Array
  • the DC/DC module power supply of the chip package structure is structurally prone to problems such as flatness of soldering and strength after soldering.
  • the technical problem to be solved by the present invention is to provide a DC/DC module power supply to improve the system.
  • the degree of integration In order to solve the above problem, the present invention considers that the DC/DC module power supply can be connected to the system board in a patch connection manner, wherein the connection between the DC/DC module power supply and the system is connected by a vertical patch, wherein Solder pads are provided on the connection plane between the circuit board of the DC/DC module power supply and the system board, which is used to increase the connection strength between the DC/DC module power supply and the system board, and is also used as a heat sink member.
  • the present invention discloses a DC/DC module power supply, which includes a circuit board, and further includes one or more positioning members, the positioning member has an insert at one end and a patch at the other end, wherein The insert of the positioning member corresponds to a through hole connecting the circuit board; the patch of the positioning member is connected to the system board.
  • the insert of the positioning member is correspondingly connected to the through hole of the circuit board by welding; the patch of the positioning member is connected to the system board by reflow soldering.
  • the power source further includes a positioning card, wherein the positioning card is used to connect one or more of the positioning members into one body according to a distance between the through holes of the circuit board.
  • the circuit board is vertically connected to the system board.
  • the circuit board includes a connection plane, and the connection plane is provided with a solder pad;
  • the circuit board is vertically connected to the system board through the solder pads.
  • the DC/DC module power supply also includes a patch member, wherein the patch member is coupled to the top of the circuit board.
  • the patch member is in the form of a sheet or a flap.
  • the patch member is bonded to the top of the circuit board by a thermally conductive insulating paste.
  • FIG. 1 is a schematic diagram of a connection between a DC/DC module power supply and a system board according to an embodiment of the present invention
  • FIG. 2 is a component diagram of a DC/DC module power supply according to an embodiment of the present invention
  • FIG. 3 is a DC/DC according to an embodiment of the present invention.
  • Figure 4 is a schematic view of a heat dissipating patch structure according to an embodiment of the present invention
  • Figure 5 is a schematic view of a connector according to an embodiment of the present invention
  • Figure 6 is a schematic view of an application example.
  • This embodiment discloses a DC/DC module power supply, the DC/DC module power supply including at least a circuit board and one or more positioning members. The functions of each part are described below.
  • the circuit board comprises a printed circuit board and a device for implementing the circuit function; wherein the circuit board is vertically connected to the system board, preferably, the connection plane connecting the circuit board and the system board may also be provided with one or more solder pads (eg, Copper), in this way, the DC/DC module power supply of the present invention can be soldered to the corresponding pad window on the system board through the solder pad, thereby enhancing the welding strength of the DC/DC module power supply and the system board, and connecting the plane
  • the solder pads on the board (such as copper) can also achieve heat dissipation, which increases the efficiency of the module power supply.
  • the positioning component is used for realizing a reliable connection between the power supply of the DC/DC module and the system board, and one end is a plug-in and the other end is a patch, wherein the plug-in of the positioning component is connected by means of plug-in welding Connected to the through hole on the circuit board, the patch of the positioning member is connected to the system board by means of chip reflow soldering; preferably, a positioning card can be used, and the positioning card can be according to the distance between the through holes on the circuit board
  • One or more locating members are united for ease of assembly, in which case the positioning card and its associated one or more locating members may be integrally formed as a connector.
  • the positioning card connects one or more positioning members as a unitary finger according to the distance between the through holes on the circuit board, and the positioning card sets the distance between the positioning members as the distance between the through holes of the circuit board, or The distance between the positioning members is set to an integral multiple of the distance between the through holes of the board.
  • the DC/DC module power supply may further include a patch member connected to the top of the circuit board to ensure the planarity of the top of the DC/DC module power supply, so that the placement machine sucks
  • the DC/DC module power supply can be assembled to the system board by sucking the top of the DC/DC module power supply.
  • the patch member can be pasted on the top of the DC/DC module power supply through a thermal paste.
  • the chip member can use a material with good heat dissipation, so that heat dissipation can be performed on the device that needs heat dissipation in the DC/DC module power supply, thereby improving the efficiency of the module power supply.
  • the shape of the patch member may be a sheet shape and pasted on the top surface of the circuit board.
  • the shape of the patch member may be a flap, the main body of the flap is pasted on the top surface of the circuit board to realize the patch function, and the folded portion of the flap is pasted on the device for realizing the circuit function on the side of the circuit board, Achieve heat dissipation bonding.
  • Embodiment 1 A DC/DC module power supply in this embodiment, as shown in FIG. 1, a DC/DC module power supply 12 is applied to a system board, and a DC/DC module power supply 12 is provided by a circuit board (ie, a printed circuit board 121 and implemented).
  • the circuit function device 122) and the connector 13 are composed of two parts, wherein the connector 13 is reliably soldered to the printed circuit board 121 by via reflow soldering, and the DC/DC module power supply is realized by the connector 13 to realize the DC/DC module. A reliable connection between the power supply and the system board.
  • connection plane of the DC/DC module power supply and the system is provided with a copper-clad pad, which can enhance the connection between the DC/DC module power supply and the system board, and achieve the function of heat dissipation.
  • the DC//DC module power supply 12 satisfies the requirements of the heat dissipation of the device, and can directly borrow the plane of the device on the DC//DC module power supply 12 (for example, the top surface of the circuit board) when the chip is mounted, so there is no application sticker. Sheet member.
  • Embodiment 2 This embodiment proposes a preferred DC/DC module power supply that is vertically mounted on a system board to form a system product, as shown in FIG.
  • the system product 10 includes a motherboard (i.e., system board) 11 of a system to which one or more vertically mounted DC/DC module power supplies 12 of the present embodiment are soldered. Among them, the connection between the DC/DC module power supply and the system board is reflow soldered with a patch.
  • the structure of the DC/DC module power supply 12, as shown in FIG. 3, includes a circuit board 121 (including a printed circuit board and devices for realizing circuit functions), a connector 13 and a patch member 14.
  • the circuit board 121 is provided with a through hole for connecting with the plug end of the connector 13 by means of plug-in soldering to realize the connection between the connector 13 and the circuit board 121.
  • the circuit board A plurality of solder pads (ie, copper clad) 1211 are disposed on the connection plane 1212 soldered to the system board, as shown in FIG.
  • the solder pads are soldered to the corresponding patch pad windows on the system board to improve the reliability of the DC/DC module power supply on the system board.
  • the solder pads on the connection plane can also increase the heat dissipation area of the DC/DC module power supply.
  • the chip member 14 is bonded to the top of the circuit board 121 by a thermal conductive adhesive, so that when the DC/DC module power supply is assembled, the nozzle of the placement machine sucks the plane to serve as a patch, and in this embodiment, the sticker
  • the sheet member is a flap which is shaped like an N shape, that is, the patch member extends from the top of the circuit board to the device in the circuit board for realizing the circuit function, thereby dissipating heat for the device functioning.
  • the patch member 14 in this embodiment is as shown in FIG.
  • the patch member is mainly divided into two segments, wherein a patch function surface 141 as a DC/DC module power supply 12 is connected to the top surface of the circuit board, and the other portion serves as a heat dissipation bonding function surface 142, which is bonded by thermal conductive insulation.
  • a power device that needs to dissipate heat on a circuit board ie, a device that implements circuit functions in a circuit board
  • the chip member also has a section on the other side of the board (ie, there is no circuit function in the board)
  • the connecting device 13 is a device that connects the electrical and mechanical connections between the DC/DC module power supply and the system board. As shown in FIG. 6, one or more positioning members 131 and positioning cards 132 are included.
  • one end (1311) of the positioning member 131 is a cylindrical insert, which is used for welding with a through hole connected to the DC/DC module power supply printed circuit board, and the other end (1312) is a square patch for DC
  • the /DC module power supply is connected to the system board.
  • Positioning the cards connects the plurality of positioning members in one piece according to the distance between the through holes of the printed circuit board to facilitate assembly.
  • the distance between the positioning members is equal to the distance between the through holes of the printed circuit board, or the distance between the positioning members is equal to an integral multiple of the distance between the through holes of the printed circuit board.
  • the through-hole soldering end 1311 is soldered to the through hole 1211 of the printed circuit board, and the patch soldering end 1312 is soldered to the system board.
  • the DC/DC module power supply of the vertical patch proposed by the present invention is characterized by miniaturization and vertical mounting. Due to its chip package structure, reliability and heat dissipation area are increased when copper is soldered on the side of the printed circuit board.
  • the patch structure of the DC/DC module power supply proposed by the present invention is compatible with heat dissipation for the device.
  • the technical solution of the present invention can improve the power density and heat dissipation capability of the DC/DC module power supply, increase the density of the layout of the system board, and enhance the reliability of welding of the DC/DC module power supply on the system board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention a trait à un bloc d'alimentation de module continu-continu (12) qui inclut une carte de circuit imprimé (121) et un ou plusieurs éléments d'orientation (13). Une borne de chacun des éléments d'orientation (13) est un élément enfichable, et une autre borne est une plage de connexion de montage en surface. Les éléments enfichables des éléments d'orientation (13) sont connectés en conséquence avec les trous traversants de la carte de circuit imprimé (121), et les plages de connexion de montage en surface des éléments d'orientation (13) sont connectées à une carte de système (11). Cette construction permet d'améliorer la densité de puissance et la capacité de dissipation thermique du bloc d'alimentation de module continu-continu (12) ainsi que d'améliorer également la densité de topologie de la carte de système (11) et d'améliorer la fiabilité de brasage tendre du bloc d'alimentation de module continu-continu (12) sur la carte de système (11).
PCT/CN2011/075364 2010-06-29 2011-06-07 Bloc d'alimentation de module continu-continu WO2012000371A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010215030.6A CN101867286B (zh) 2010-06-29 2010-06-29 一种dc/dc模块电源
CN201010215030.6 2010-06-29

Publications (1)

Publication Number Publication Date
WO2012000371A1 true WO2012000371A1 (fr) 2012-01-05

Family

ID=42958879

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/075364 WO2012000371A1 (fr) 2010-06-29 2011-06-07 Bloc d'alimentation de module continu-continu

Country Status (2)

Country Link
CN (1) CN101867286B (fr)
WO (1) WO2012000371A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101867286B (zh) * 2010-06-29 2015-05-13 中兴通讯股份有限公司 一种dc/dc模块电源
CN102569223B (zh) * 2012-01-11 2016-09-14 华为技术有限公司 一种功率器件绝缘散热结构及电路板、电源设备
CN103943581B (zh) * 2013-01-23 2017-07-07 中兴通讯股份有限公司 功率器件封装结构及封装方法
CN103596365B (zh) * 2013-11-28 2017-04-19 上海空间电源研究所 一种功率管与印制电路板的安装结构
CN107367803A (zh) * 2017-08-28 2017-11-21 华进半导体封装先导技术研发中心有限公司 一种光模块封装结构及制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5245509A (en) * 1991-09-05 1993-09-14 Telefunken Electronic Gmbh Printed circuit board arrangement with surface-mounted connector strip and a method for manufacturing the arrangement
US20020041506A1 (en) * 2000-08-29 2002-04-11 Kun-Feng Chen Power supply device for enhancing heat-dissipating effect
JP2006050891A (ja) * 2004-07-08 2006-02-16 Toshiba Tec Corp マルチフェーズ型ｄｃ／ｄｃコンバータ装置
JP2007135336A (ja) * 2005-11-11 2007-05-31 Matsushita Electric Ind Co Ltd 高圧電源装置
CN200962689Y (zh) * 2006-10-18 2007-10-17 中控科技集团有限公司 印制板连接结构
CN101867286A (zh) * 2010-06-29 2010-10-20 中兴通讯股份有限公司 一种dc/dc模块电源

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100585848C (zh) * 2007-04-30 2010-01-27 华为技术有限公司 一种模块和电子装置
CN101052273B (zh) * 2007-05-16 2010-05-26 艾默生网络能源有限公司 Pcb板连接结构及连接方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5245509A (en) * 1991-09-05 1993-09-14 Telefunken Electronic Gmbh Printed circuit board arrangement with surface-mounted connector strip and a method for manufacturing the arrangement
US20020041506A1 (en) * 2000-08-29 2002-04-11 Kun-Feng Chen Power supply device for enhancing heat-dissipating effect
JP2006050891A (ja) * 2004-07-08 2006-02-16 Toshiba Tec Corp マルチフェーズ型ｄｃ／ｄｃコンバータ装置
JP2007135336A (ja) * 2005-11-11 2007-05-31 Matsushita Electric Ind Co Ltd 高圧電源装置
CN200962689Y (zh) * 2006-10-18 2007-10-17 中控科技集团有限公司 印制板连接结构
CN101867286A (zh) * 2010-06-29 2010-10-20 中兴通讯股份有限公司 一种dc/dc模块电源

Also Published As

Publication number Publication date
CN101867286A (zh) 2010-10-20
CN101867286B (zh) 2015-05-13

Similar Documents

Publication Publication Date Title
CN101415297B (zh) 一种印制板组件及其加工方法
US8004070B1 (en) Wire-free chip module and method
CN110431664B (zh) 将led元件安装在平的载体上
CN108370142A (zh) 电路结构体及电气接线盒
US7688591B2 (en) Electronic-component-mounting board
JP2011108924A (ja) 熱伝導基板及びその電子部品実装方法
CN108432073A (zh) 电路结构体及电气接线盒
WO2012000371A1 (fr) Bloc d'alimentation de module continu-continu
JP5169800B2 (ja) 電子装置
KR101115403B1 (ko) 발광 장치
CN214672591U (zh) 一种功率器件封装结构
JP2013065887A (ja) 電子装置
CN105848415B (zh) 侧边具有表面黏着型接脚的电路模块以及电路板与系统
CN217037538U (zh) 一种电路板及电子设备
WO2018131385A1 (fr) Module convertisseur continu-continu
TWI268589B (en) Electronic apparatus with thermal module
US5260602A (en) Hybrid integrated-circuit device having an asymmetrical thermal dissipator
CN216437553U (zh) 一种pcb板
CN216354179U (zh) 一种具有双面焊盘的半导体
CN214544925U (zh) 一种陶瓷基板
JP4735088B2 (ja) サーボアンプモジュール
CN106612587B (zh) 封装结构及光模块
CN206907765U (zh) 一种高功效二极管
JPS58210686A (ja) 電子回路装置
CN106163234B (zh) 移动设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11800116

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11800116

Country of ref document: EP

Kind code of ref document: A1

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载