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WO2012047014A2 - Ensemble écran tactile à capacité électrostatique et son procédé de production - Google Patents

Ensemble écran tactile à capacité électrostatique et son procédé de production Download PDF

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Publication number
WO2012047014A2
WO2012047014A2 PCT/KR2011/007366 KR2011007366W WO2012047014A2 WO 2012047014 A2 WO2012047014 A2 WO 2012047014A2 KR 2011007366 W KR2011007366 W KR 2011007366W WO 2012047014 A2 WO2012047014 A2 WO 2012047014A2
Authority
WO
WIPO (PCT)
Prior art keywords
sensing
sensing pattern
touch panel
panel device
film
Prior art date
Application number
PCT/KR2011/007366
Other languages
English (en)
Korean (ko)
Other versions
WO2012047014A3 (fr
Inventor
경충현
안희철
임우빈
Original Assignee
네오뷰코오롱 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 네오뷰코오롱 주식회사 filed Critical 네오뷰코오롱 주식회사
Publication of WO2012047014A2 publication Critical patent/WO2012047014A2/fr
Publication of WO2012047014A3 publication Critical patent/WO2012047014A3/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a capacitive touch panel device and a method of manufacturing the same, and more specifically, by forming an insulating film locally, the transmittance of the panel device can be improved, and the sensing pattern is formed on the upper and lower sides.
  • the present invention relates to a touch panel device having excellent stability and improved durability and a method of manufacturing the same.
  • a touch screen is an input device that can be easily used by anyone, men and women, by interactively and intuitively manipulating various multiplayers such as a computer and a mobile phone by simply touching a button displayed on a display with a finger.
  • Such a touch screen is a resistive method, a capacitive method, an infrared method, an ultrasonic method, and the like, and the resistive method is generally used in the current method, and the capacitive method is used to minimize the thickness thereof. .
  • the capacitive touch screen has an indium tin oxide (ITO) structure having a conductive floodlight plate, an electrode portion formed of silver (Ag) powder on the edge of the ITO, and an insulation of a lower portion of the electrode It is generally composed of an insulating coating.
  • ITO indium tin oxide
  • the ITO is composed of an ITO film made of a light-transmissive resin, and an ITO coating layer having a conductive material coated thereon.
  • each electrode provided at four sides according to a change in capacitance through the finger detects the touch position, thereby detecting the touch position.
  • FIG. 1 is a plan view 100 of a conventional capacitive touch panel device
  • FIG. 2 is a cross-sectional view of the touch panel device 100 of FIG. 1 cut along the direction AA ′.
  • the X-axis sensing pattern 110 and the Y-axis sensing pattern 120 are formed of one layer formed on the substrate 160.
  • the Y-axis detection pattern 120 is connected to each other in the longitudinal direction, and in the case of the X-axis detection pattern 110, they are spaced apart from each other and do not contact with the Y-axis detection pattern 120, the X In order to connect the axis sensing patterns 110, a separate contact hole 140 and a bridge 130 pattern for connecting the contact holes 140 to each other were necessary.
  • an insulating film 150 is formed on both the upper surface of the X-axis sensing pattern 110 and the inside of the bridge 130. .
  • the transmittance is lowered due to the insulating film 150, and as a result, the overall resolution of the display device is deteriorated. .
  • the bridge 130 is made of the same material as the sensing patterns 110 and 120. As described above, when the insulating film 150 is provided only in a couple, the same material may not be used. It was.
  • the bridge 130 and the sensing patterns 110 and 120 are made of different materials, and the bridge 130 is also visually identified. It acted as a problem of reducing the overall transmittance of the panel 100.
  • the sensing pattern is provided in two layers, so that the sensing sensitivity is improved to ensure operational stability, and a passivation layer is provided to further improve the durability of the touch panel device and its manufacturing method. It is done.
  • a method of manufacturing a capacitive touch panel device including preparing a transparent substrate, depositing a first conductive transparent film having a predetermined thickness on one surface of the substrate, and forming an upper portion of the first conductive transparent film.
  • the transparent substrate uses any one selected from the group consisting of polyethylene terephthalate (PET), polyimide (PI), acryl (Acryl), polyethylene naphthalate (PEN), and glass.
  • PET polyethylene terephthalate
  • PI polyimide
  • Acryl acryl
  • PEN polyethylene naphthalate
  • the transparent substrate is in the form of a film.
  • the first and second conductive transparent films may include indium tin oxide (ITO), indium zinc oxide (IZO), AZO (Al-dopedZnO), carbon nanotubes (CNT), and conductive polymers (PEDOT; poly). (3,4-ethylenedioxythiophene)), silver (Ag) and copper (Cu) is made of any one selected from the group consisting of a transparent ink, the first and second conductive transparent film is 15nm thick using a sputter (sputter) Is deposited.
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • AZO Al-dopedZnO
  • CNT carbon nanotubes
  • PEDOT conductive polymers
  • the metal film is copper (Cu), nickel (Ni), aluminum (Al), chromium (Cr), molybdenum (Mo), silver (Ag), gold (Au), and molybdenum (Mo) / aluminum (Al).
  • Molybdenum (Mo) is made of any one selected from the group consisting of a multilayer film, the metal film is deposited to a thickness of 300nm using a sputter (sputter).
  • the first sensing pattern overlaps the fourth sensing pattern
  • the second sensing pattern is formed to overlap the third sensing pattern
  • the first sensing pattern is composed of a plurality of triangular or rectangular sensing pads, each sensing pad is connected in a lateral direction, and the second sensing pattern is a plurality of triangular or square sensing pads spaced apart from each other.
  • the first sensing pattern is arranged so as to be orthogonal to the sensing pad connection portion of the first sensing pattern.
  • the third sensing pattern includes a plurality of triangular or rectangular sensing pads, each sensing pad is connected in a longitudinal direction, and the fourth sensing pattern is a plurality of triangular or rectangular sensing pads spaced apart from each other.
  • the second sensing pattern is arranged to be orthogonal to the sensing pad connection portion of the third sensing pattern.
  • the insulating film is formed to 3 ⁇ m or less.
  • a passivation layer is further provided on the upper surfaces of the third and fourth sensing patterns.
  • the present invention has the following excellent effects.
  • the touch panel device and the method of manufacturing the same according to the present invention can maintain a high transmittance by locally forming the insulating film only in the necessary portion.
  • the sensing pattern is provided in two layers, the sensing sensitivity is improved, and thus operational stability is secured, and a passivation layer is provided to further improve durability.
  • FIG. 1 is a plan view of a conventional capacitive touch panel device.
  • FIG. 2 is a cross-sectional view of the touch panel device of FIG. 1 taken along the line AA ′.
  • 3 is an overall manufacturing process of the capacitive touch panel device according to an embodiment of the present invention.
  • FIG. 4 illustrates an electrode wiring, a first sensing pattern, and a second sensing pattern according to an embodiment of the present invention.
  • FIG. 5 illustrates a third sensing pattern and a fourth sensing pattern according to an embodiment of the present invention.
  • FIG. 6 illustrates a state in which first to fourth sensing patterns overlap with each other according to an embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of the overlapping sensing pattern illustrated in FIG. 6 taken along the direction B-B '.
  • FIG. 8 is a cross-sectional view of the overlapping sensing pattern illustrated in FIG. 6 taken in the direction of CC ′.
  • Figure 3 is an overall manufacturing process of the capacitive touch panel device according to an embodiment of the present invention.
  • a method of manufacturing a capacitive touch panel device may include preparing a transparent substrate (S100), in which case the substrate used is an insulating substrate made of a transparent material. It is not greatly restricted in kind.
  • the transparent substrate may use any one selected from the group consisting of polyethylene terephthalate (PET), polyimide (PI), acryl (Acryl), polyethylene naphthalate (PEN), and glass.
  • PET polyethylene terephthalate
  • PI polyimide
  • Acryl acryl
  • PEN polyethylene naphthalate
  • a glass substrate in the form of a film was prepared.
  • a sputter was used and deposited at 15 nm.
  • the deposition thickness is not necessarily limited to 15 nm, of course, can be variously adjusted according to the use state.
  • the first conductive transparent film may use various materials, in an embodiment of the present invention, indium tin oxide (ITO), indium zinc oxide (IZO), AZO (Al-dopedZnO), and carbon nanotubes ( CNT), a conductive polymer (PEDOT; poly (3,4-ethylenedioxythiophene)), silver (Ag) and copper (Cu) transparent ink may be used.
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • AZO Al-dopedZnO
  • CNT carbon nanotubes
  • PEDOT polymer
  • silver (Ag) and copper (Cu) transparent ink may be used.
  • the first conductive transparent film uses indium tin oxide (ITO).
  • ITO indium tin oxide
  • the metal film is the same as the deposition method of the first conductive transparent film described above.
  • the metal film may be deposited using metals of various materials, but in one embodiment of the present invention, copper (Cu), nickel (Ni), aluminum (Al), chromium (Cr), molybdenum (Mo), and silver Deposition was carried out using any one of (Ag), gold (Au), and molybdenum (Mo) / aluminum (Al) / molybdenum (Mo) multilayer film.
  • an electrode wiring is formed by exposing or etching the deposited metal film (S400), and the electrode wiring is connected to first and second sensing patterns, which will be described later.
  • the method of forming the electrode wiring can be formed through a variety of methods, in one embodiment of the present invention used a general photolithography (Photolithography).
  • the first conductive transparent film is exposed or etched to form a first sensing pattern and a second sensing pattern (S500).
  • the first and second sensing patterns serve to sense a touched part of the touch panel device of the capacitance type and to determine a touched position.
  • the first and second sensing patterns may be patterned in various forms, but in a preferred embodiment of the present invention, the first sensing pattern is composed of a plurality of triangular or rectangular sensing pads, and each sensing pad is horizontal. Connected in the direction.
  • the second sensing pattern includes a plurality of triangular or rectangular sensing pads spaced apart from each other, and is arranged to form orthogonal to the sensing pad connection portion of the first sensing pattern between the first sensing patterns.
  • the method of forming the first and second winding patterns may be formed through various methods.
  • general photolithography is used.
  • the insulating film is preferably made of a transparent material to increase the transmittance of the touch panel device.
  • the insulating film is not limited in kind as long as it is a material capable of ensuring insulation of a transparent material.
  • the thickness to be formed is not significantly limited, but in the preferred embodiment of the present invention, the thickness is formed to be 3 ⁇ m or less, which is intended to reduce the overall thickness of the touch panel device to reduce the thickness of the panel device. .
  • the insulating film according to a preferred embodiment of the present invention is characterized in that the portion of the first sensing pattern or the second sensing pattern, that is, is formed locally, through the touch panel device as before.
  • the third and fourth sensing patterns are formed by exposing or etching the second conductive transparent layer (S800), and the method of forming the third and fourth sensing patterns is formed using various methods.
  • the general photolithography is used in the same manner as the first and second sensing patterns.
  • the third sensing pattern and the fourth sensing pattern may be patterned in various shapes.
  • the third sensing pattern includes a plurality of triangular or rectangular sensing pads. The sensing pads are connected in the longitudinal direction.
  • the fourth sensing pattern includes a plurality of triangular or rectangular sensing pads spaced apart from each other, and is arranged so as to be orthogonal to the sensing pad connection portion of the third sensing pattern between the third sensing patterns.
  • the first sensing pattern overlaps the fourth sensing pattern
  • the second sensing pattern overlaps the third sensing pattern
  • the first sensing pattern connected in the lateral direction and the fourth sensing pattern overlapping the first sensing pattern serve to determine the position in the horizontal axis direction when the panel element is touched, and the first sensing pattern connected in the longitudinal direction.
  • the second sensing pattern overlapping the third sensing pattern and the third sensing pattern serves to determine the position in the longitudinal direction when the touch is performed, and as a result, the touch position of the touch panel device is determined through the first to fourth sensing patterns. You can decide.
  • the insulating film described above is locally formed only at the intersection of the first sensing pattern and the third sensing pattern, and as a result, there is no need to form an insulating film on the entire surface of the panel element as in the prior art, thereby improving transmittance of the panel element. Can be improved.
  • a passivation layer may be further provided on the upper surfaces of the third and fourth sensing patterns S900 to protect the panel device, thereby improving durability of the panel device.
  • FIG. 4 is a diagram illustrating an electrode wiring, a first sensing pattern, and a second sensing pattern according to an embodiment of the present invention
  • FIG. 5 is a third sensing pattern and a fourth sensing pattern according to an embodiment of the present invention. To show.
  • the electrode wirings 220 formed by the metal film are formed on the periphery of the first sensing pattern 230a and the second sensing pattern 230b, respectively, and the first sensing pattern 230a is provided.
  • the second sensing pattern 230b includes a plurality of triangular or rectangular sensing pads spaced apart from each other, and forms an orthogonal shape with a sensing pad connection portion of the first sensing pattern 230a between the first sensing patterns. Are arranged.
  • the third sensing pattern 240b is the second sensing pattern 230b.
  • the third sensing pattern 240b is connected to each other in the longitudinal direction, unlike the second sensing pattern 230b.
  • the fourth sensing pattern 240a has the same position and the same shape as the first sensing pattern 230a, but the first sensing pattern 230a is different from each other.
  • the third and fourth sensing patterns may be formed on the first and second sensing patterns 230a and 230b. 240a and 240b overlap.
  • the fourth sensing pattern 240a overlaps the upper portion of the first sensing pattern 230a
  • the third sensing pattern 240b overlaps the upper portion of the second sensing pattern 230b.
  • the fourth sensing patterns 240a are spaced apart from each other, the fourth sensing patterns 240a are also connected in the lateral direction by overlapping the first sensing patterns 230a connected in the lateral direction.
  • the second sensing patterns 230b are spaced apart from each other, but overlap with the third sensing patterns 240b connected in the longitudinal direction, so that the second sensing patterns 230b are also connected to each other in the longitudinal direction.
  • the first to fourth sensing patterns overlap each other at the connecting portion of the first sensing pattern 230a and the connecting portion of the third sensing pattern 240b, the capacitive touch panel device according to the present invention In order to prevent this, an insulating film 250 is formed locally at the connection portion.
  • FIG. 7 is a cross-sectional view cut along the overlapping sensing pattern shown in FIG. 6 in the B-B 'direction
  • FIG. 8 is a cross-sectional view cut in the C-C' direction.
  • the insulating layer 250 has only an intersection point between the first sensing pattern 230a connected in the lateral direction and the third sensing pattern 240b connected in the longitudinal direction. It can be seen that it is formed locally.
  • the present invention does not need to form the insulating film 250 in the entire panel device, unlike the prior art, thereby maximizing the transmittance of the panel device.
  • a contact hole and a bridge which are essential components of the prior art, may be provided. Since the manufacturing process is simple, economical, and each sensing pattern performs the role of the bridge and the sensor at the same time, the sensing sensitivity is excellent.
  • the present invention can be used as a touch panel device of a touch screen provided in a computer or a mobile phone, in particular, a capacitive touch panel device, improves the transmittance and durability of the touch panel device and excellent in operation stability, It is possible to provide a touch panel device that can simplify the manufacturing process and reduce the production cost.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Manufacture Of Switches (AREA)

Abstract

L'invention concerne un ensemble écran tactile à capacité électrostatique et un procédé de production correspondant, et de manière plus spécifique, un procédé de production comprenant les étapes qui consistent : à préparer un substrat transparent; à déposer en phase vapeur une première couche conductrice transparente présentant une épaisseur fixe sur une surface du substrat; à déposer en phase vapeur une couche métallique présentant une épaisseur fixe sur la partie supérieure de la couche conductrice transparente; à former un câblage d'électrode par exposition ou attaque de la couche métallique; à former un premier tracé de détection et un deuxième tracé de détection par exposition ou attaque de la première couche conductrice transparente; à former une couche isolante sur une zone de la partie supérieure du premier tracé de détection ou sur le deuxième tracé de détection; à déposer en phase vapeur une deuxième couche conductrice transparente sur la partie supérieure de la couche isolante, le premier tracé de détection et le deuxième tracé de détection; à former un troisième tracé de détection et un quatrième tracé de détection par exposition ou attaque de la deuxième couche conductrice transparente. Cette invention se rapporte en outre à un ensemble écran tactile produit selon ce procédé.
PCT/KR2011/007366 2010-10-05 2011-10-05 Ensemble écran tactile à capacité électrostatique et son procédé de production WO2012047014A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20100096818 2010-10-05
KR10-2010-0096818 2010-10-05

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WO2012047014A2 true WO2012047014A2 (fr) 2012-04-12
WO2012047014A3 WO2012047014A3 (fr) 2012-06-21

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013176518A1 (fr) * 2012-05-25 2013-11-28 크루셜텍 주식회사 Dispositif tactile capacitif contenant des sous-groupes de motifs de capteur dans lesquels sont agencées une pluralité de surfaces de contact de capteur
WO2016159501A1 (fr) * 2015-03-30 2016-10-06 동우화인켐 주식회사 Capteur tactile
KR20160116495A (ko) * 2015-03-30 2016-10-10 동우 화인켐 주식회사 터치 센서
CN108228014A (zh) * 2018-01-03 2018-06-29 京东方科技集团股份有限公司 触控模组及其制备方法、触控屏

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100746269B1 (ko) * 2007-02-02 2007-08-03 (주)에이엠피테크놀로지 등전위 형성을 위한 폐로 전극을 가지는 터치 패널 및 그제조 방법
KR101022087B1 (ko) * 2009-01-16 2011-03-17 삼성모바일디스플레이주식회사 터치 스크린 패널
KR101025023B1 (ko) * 2009-02-23 2011-03-25 (주)이엔에이치 정전용량 방식의 터치스크린 패널

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013176518A1 (fr) * 2012-05-25 2013-11-28 크루셜텍 주식회사 Dispositif tactile capacitif contenant des sous-groupes de motifs de capteur dans lesquels sont agencées une pluralité de surfaces de contact de capteur
WO2016159501A1 (fr) * 2015-03-30 2016-10-06 동우화인켐 주식회사 Capteur tactile
KR20160116495A (ko) * 2015-03-30 2016-10-10 동우 화인켐 주식회사 터치 센서
KR20160116494A (ko) * 2015-03-30 2016-10-10 동우 화인켐 주식회사 터치 센서
CN107533410A (zh) * 2015-03-30 2018-01-02 东友精细化工有限公司 触控传感器
US10606383B2 (en) 2015-03-30 2020-03-31 Dongwoo Fine-Chem Co., Ltd. Touch sensor comprising mesh pattern
TWI703475B (zh) * 2015-03-30 2020-09-01 南韓商東友精細化工有限公司 觸控感測器
KR102255415B1 (ko) * 2015-03-30 2021-05-21 동우 화인켐 주식회사 터치 센서
KR102255445B1 (ko) * 2015-03-30 2021-05-21 동우 화인켐 주식회사 터치 센서
CN108228014A (zh) * 2018-01-03 2018-06-29 京东方科技集团股份有限公司 触控模组及其制备方法、触控屏
CN108228014B (zh) * 2018-01-03 2020-12-01 京东方科技集团股份有限公司 触控模组及其制备方法、触控屏

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