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WO2012043995A2 - Wafer alignment-rear surface test device - Google Patents

Wafer alignment-rear surface test device Download PDF

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Publication number
WO2012043995A2
WO2012043995A2 PCT/KR2011/006719 KR2011006719W WO2012043995A2 WO 2012043995 A2 WO2012043995 A2 WO 2012043995A2 KR 2011006719 W KR2011006719 W KR 2011006719W WO 2012043995 A2 WO2012043995 A2 WO 2012043995A2
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WO
WIPO (PCT)
Prior art keywords
wafer
alignment
sensor
stage
inspection device
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Application number
PCT/KR2011/006719
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French (fr)
Korean (ko)
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WO2012043995A3 (en
Inventor
김승희
Original Assignee
주식회사보부하이테크
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Publication of WO2012043995A2 publication Critical patent/WO2012043995A2/en
Publication of WO2012043995A3 publication Critical patent/WO2012043995A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Definitions

  • the present invention configures the wafer alignment back inspection apparatus adjacent to the wafer chuck so as to enable the detection of contaminants on the wafer back while the wafer is rotated by the orient and the wafer chuck for the alignment of the wafers. Detects and removes contaminated wafers to prevent damage to the processor chamber and wafers and disruption of the process, while simultaneously detecting and aligning contaminants on the back of the wafers.
  • the present invention relates to a wafer alignment back inspection apparatus for improving productivity.
  • Wafers are used to manufacture various semiconductor devices. These wafers are isolated from external contaminants in a clean room environment and introduced into various processes.
  • 1 is an exemplary view showing an example of a wafer manufacturing apparatus.
  • a plurality of wafers are transferred to a processing apparatus as a group by a receiving means called a magazine (or a cartridge, not shown), and the transfer apparatus 50 pulls out a wafer from the magazine.
  • the wafer is transferred to the wafer processing system 10 through the load lock chamber 40.
  • the wafer is put into a transfer device (or mini-environment 50) from a pod loader 24 and loaded by a second transfer robot 21 installed in the transfer device 50. It is transferred to the lock chamber 40.
  • the wafer processing system 10 includes a load lock chamber 40 for forming a vacuum state before introducing the wafer 40 into the wafer processing system 10 and isolating external contaminants.
  • the wafer loaded in the load lock chamber 40 is withdrawn from the load lock chamber 40 by the transfer robot 20 installed in the transfer chamber 25 and transferred to the orienter 30 for alignment.
  • the orienter 30 serves to align the flat zone of the wafer before transferring the wafer to the process chamber 10, and the aligned wafer is again transferred by the transfer robot 20 to each processor chamber 10: 10a to 10c. Is transferred to the process and put into the process.
  • the orienter 30 is installed in the transfer device 50 as shown, to align the wafer transferred from the pod loader 24.
  • the orienter 30 may be installed in the transfer apparatus 50 as shown, may be installed adjacent to the process chamber 10, it is not limited to the present invention by the illustration.
  • circuits, elements, and the like are formed in the wafer in the process chamber 10, and such circuits and elements are very small and precisely formed. Therefore, the processing of the wafer is completely isolated from the external atmosphere, and thus, the clean environment, that is, is completely isolated from the contaminants causing problems in the wafer processing.
  • the wafer goes through several stages of clean process before being introduced into the wafer processing system 10, and thus, various contaminants adhered to the wafer surface are removed, and inspection is performed by various inspection equipment to determine whether contaminants are attached. Will be checked. After that, only the wafers with sufficient cleaning of contaminants are transferred to the wafer processing system to proceed with the process.
  • an object of the present invention is to configure the wafer alignment back inspection apparatus adjacent to the wafer chuck so as to enable the detection of contaminants on the back surface of the wafer while the wafer is rotated by the orient and the wafer chuck to align the wafers, before the process chamber is inserted.
  • the contamination of the processor chamber and wafers due to the introduction of contaminated wafers and the disruption of the process can be prevented, and the contaminant detection and alignment on the back of the wafers can be performed simultaneously. It is to provide a wafer alignment back inspection apparatus to improve the reliability and productivity of the process.
  • the wafer alignment back inspection apparatus is a wafer alignment back inspection apparatus for detecting an alignment of a wafer and a contaminant on the back surface of the wafer, which is put into a manufacturing process, wherein the wafer is rotated when the wafer is rotated.
  • An orienter for sensing the alignment mark formed on the wafer and creating position information for the wafer alignment;
  • a wafer chuck which is fixed to the center of the back surface of the wafer and rotates the wafer according to the position information for alignment of the fixed wafer;
  • a sensor module disposed adjacent to the wafer chuck on the rear surface of the wafer and detecting whether the contaminant adhered to the back surface of the wafer during rotation of the wafer for alignment. It is configured to include; inspection device for generating a stop command;
  • the sensor module is disposed in parallel with the normal connecting the center and the edge of the wafer,
  • the inspection apparatus is coupled to a sensor stage to which the sensor module is fixed, a stage shaft one end of which is connected to the sensor stage, and the other end of the stage shaft, and the stage shaft while the wafer is loaded or unloaded on the wafer chuck. And a cylinder for lowering the sensor stage and raising the stage shaft and the sensor stage after the loading of the wafer is completed, and determining whether the contaminant is attached to the back surface of the wafer according to a detection result from the sensor module. It further comprises a control unit for controlling the driving of.
  • the inspection device is configured to further include a lift sensor for detecting the rising or falling of the sensor stage, the stage shaft.
  • the sensor module is arranged in the normal direction and comprises a plurality of contaminant detection sensors for detecting the contaminants, and a distance detection sensor for measuring the distance between the sensor module and the wafer.
  • It is connected to any one or more of the orienter, the wafer chuck and the inspection device, and transmits an electrical signal generated from the orienter, the wafer chuck and the inspection device to the control unit, and transmits a control signal generated from the control unit. It further comprises an interface unit for transmitting to any one of the orienter, the wafer chuck and the inspection apparatus.
  • the wafer alignment back inspection apparatus comprises a wafer alignment back inspection apparatus adjacent to the wafer chuck so as to detect contaminants on the wafer back while the wafer is rotated by the orient and the wafer chuck to align the wafers. It is possible to detect and remove contaminated wafers before entering the chamber, thereby preventing contamination of the processor chamber and wafers and disruption of processing due to the introduction of contaminated wafers, and simultaneously detecting and aligning contaminants on the back of the wafer. By doing so, it is possible to improve the reliability and productivity of the process.
  • 1 is an exemplary view showing an example of a wafer manufacturing apparatus.
  • Figure 2 is an exemplary side view showing a wafer alignment back inspection apparatus according to the present invention.
  • Figure 3 is a plan view of the wafer alignment back inspection apparatus according to the present invention.
  • wafer alignment back inspection device 101 wafer
  • sensor module 211 sensor
  • sensor unit 221 sensor stage
  • stage shaft 215 stage shaft 215: cylinder
  • FIG. 2 is a side view illustrating a wafer alignment back inspection apparatus according to the present invention.
  • 3 is a plan view illustrating a wafer alignment back inspection apparatus according to the present invention.
  • the wafer alignment backside inspection apparatus 100 includes an orienter 110, a wafer chuck 120, and an inspection apparatus 200, and an inspection apparatus 200.
  • the sensor stage 221, the stage shaft 213, the sensor unit 220 including the cylinder 215 and the interface unit 230 and the control unit 222 is configured to include.
  • Orient 110 detects the position of the alignment mark 102 displayed on the wafer 101 as the wafer 101 rotates, and accordingly the position information of the alignment mark 102 to the wafer alignment back inspection device By providing it to 100, the wafer 101 is aligned.
  • the orient 110 includes an image sensor or a laser sensor or a camera for recognizing the alignment mark 102 of the wafer.
  • Position information for the alignment of the wafer created by the orienter 110 is transmitted to the control unit 222 through the interface unit 230, the control unit 222 controls the rotation of the wafer chuck 120 in accordance with the position information wafer
  • the alignment of 101 is performed.
  • the control of the wafer chuck 120 is assumed to be performed by the controller 222. However, this does not limit the present invention, and the control of the wafer chuck 120 may be controlled through a separate control system.
  • the wafer chuck 120 serves to mount and align the wafer 101 to be aligned and inspected.
  • the wafer chuck 120 includes a chuck stage 121 on which the wafer 101 is mounted, a chuck shaft 122 connecting the chuck stage 120 and a driving device (not shown), and a wafer 101 to the chuck stage 121. It is configured to include a vacuum device (not shown) for fixing to.
  • the chuck stage 121 and the chuck shaft 122 of the wafer chuck 120 have a through hole formed therein, and the through hole is connected to a vacuum device to bring the wafer 101 into close contact with the chuck stage 121.
  • the chuck stage 121 is rotated under the control of the controller 222 to align the wafer 101.
  • the inspection apparatus 200 is disposed on the rear surface of the wafer 101 adjacent to the wafer chuck 120, detects the presence of contaminants on the back surface of the wafer 101, and continues or stops the process according to the contaminant detection result. Generate and output signals or alarms for The inspection apparatus 300 is arranged such that the sensor module 210 in which the plurality of sensors 211 are arranged is arranged in a normal direction from the center of the wafer 101 toward the edge of the wafer 101. The inspection apparatus 200 detects the presence of contaminants on the back surface of the wafer 101 while the wafer 101 is rotated by the wafer chuck 120 for alignment.
  • the inspection apparatus 200 includes a sensor unit 220, an interface unit 230, and a control unit 222, and the sensor unit 220 includes a sensor stage 221, a stage shaft 213, and a cylinder 215. It is configured to include).
  • the sensor unit 220 is installed on the back surface of the wafer 101 so as to be adjacent to the wafer chuck 120, and the wafer 101 is moved by the wafer chuck 120 for alignment while maintaining a constant distance from the back surface of the wafer 101. During the rotation, whether the contaminants adhere to the back surface of the wafer 101 is detected, and the detection result is transmitted to the controller 222 via the interface unit 230.
  • the sensor unit 220 is raised or lowered in a direction perpendicular to the surface of the wafer 101 to prevent damage to the wafer 101 and the transfer robot (not shown) during loading and unloading of the wafer 101. Provides an environment in which the wafer 101 can be loaded and unloaded smoothly.
  • the sensor unit 220 includes a sensor module 210, a sensor stage 221, a stage shaft 213, a cylinder 215, and lifting and lowering sensors 217 and 219.
  • the sensor module 210 faces the back surface of the wafer 101 to detect contaminants on the back surface of the wafer 101, and converts the signal into electrical signals to the interface unit 230.
  • the sensor module 210 includes a plurality of sensors 211, and the plurality of sensors 211 are arranged in a predetermined arrangement.
  • the sensor module 210 is fixedly coupled to the sensor stage 221 and is raised and lowered by the sensor stage 221, the sensor shaft 213, and the cylinder 215.
  • the sensors 211 disposed on the sensor module 210 may include a light emitting part for irradiating the back surface of the wafer 101 with light of a specific wavelength and a light receiving part for receiving light reflected by the back surface of the wafer.
  • the wavelength of the light emitted from the light emitting unit may be a single wavelength of light, but may have a different wavelength for each sensor 211, but this does not limit the present invention.
  • the sensor 211 disposed in the sensor module 210 may be configured using a camera. When using the camera as the sensor 211, it is possible to take an image of the back surface of the wafer by the camera and to detect the contaminants by image processing. To this end, when the sensor 211 is implemented as a camera, a separate image processor for image processing is included in the sensor unit 220 or the controller 222 performs image processing to detect contaminants. .
  • the camera may use a CCD (Chage Coupled Device) camera, but this does not limit the present invention.
  • the sensor module 210 may be configured to further include a distance sensor for detecting whether the sensor module 210 and the wafer 101 maintain an appropriate distance.
  • the controller 222 checks the measurement results of the elevating sensors 217 and 219 and the distance detecting sensor to determine whether the sensor module 210 is fixed at the normal position.
  • the sensor stage 221 fixes the sensor module 210 to connect the sensor module 210 and the stage shaft 213.
  • the stage shaft 213 supports the sensor stage 213 and the sensor module 210, and raises or lowers the sensor stage 213 and the sensor module 210 according to the operation of the cylinder 215.
  • the cylinder 215 is started under the control of the controller 222 to move the stage shaft 213 in a direction perpendicular to the wafer 101 surface.
  • the elevating sensors 217 and 219 allow the sensor module 210 to maintain a constant distance from the wafer 101 during the ascending operation of the sensor unit 220, and to perform a descending of an appropriate height when descending. Detects the rising and falling of and transmits the detection result to the controller 222.
  • the elevating sensors 217 and 219 are respectively configured as the first sensor 217 and the second sensor 219 is shown, but this is merely an example and does not limit the present invention, and the type and measurement of the sensor Depending on the method, the number, arrangement, and measurement targets of the sensors may be different.
  • the interface unit 230 is connected to the sensor module 210, the inspection apparatus 220 including the elevating sensors 217 and 219, the orient 110 and the wafer chuck 120 and the detection results transmitted therefrom and Converts various signals into a signal that can be processed by the controller 222, transfers the converted signal to the controller 222, and converts the control signal generated by the controller 220 into a form that can be processed by these configurations. Pass in the configuration.
  • the interface unit 230 is controlled by the control unit 222, or the configuration of performing information exchange with the control unit 222, that is, the orientation device, the driving device of the wafer chuck 120, the sensor module 210 of the inspection device ,
  • the elevating sensors 217 and 219 are connected to the cylinder 215.
  • the interface unit 230 is configured when the signal types of the signal generator and the controller 222 are different, and may be omitted depending on the type of the generated signal.
  • the control unit 222 determines whether there is a contaminant on the back surface of the wafer 101 according to the detection result transmitted from the sensor module 210, and outputs the maintenance or alarm according to the determination result.
  • the controller 222 drives the wafer chuck and the orient to continue the process of the wafer 101 when no contaminants are present on the back surface of the wafer 101 through the detection result transmitted from the sensor module 210.
  • the control unit 222 stops the alignment and movement of the wafer and informs the user of the discovery of the contaminants. As a result, the contaminant-attached wafer 101 is prevented from being transferred to the process chamber (not shown).
  • controller 222 controls the sensor unit 220 to descend and ascend by controlling the cylinder 215 when the wafer 101 is replaced, and according to the detection result of the elevation sensors 217 and 219, the sensor module 210. ) Is controlled to maintain a constant distance from the wafer 101.
  • the wafer 101 determined to be attached to the contaminants are re-received in the magazine by the user or the transfer robot, and all the wafers stored in one magazine are re-transferd to the clean process, and the contaminants are removed again. To be used.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
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Abstract

The present invention pertains to a device for wafer alignment and a rear surface test, which is provided neighboring a wafer chuck so as to detect contaminants on a rear surface of a wafer while the wafer rotates by an orientor and the wafer chuck for the alignment of the wafer, so that a contaminated wafer may be detected and removed before the contaminated wafer is injected into a processing chamber. Therefore, it is possible to prevent damage to the processing chamber and the wafer and problems in processing due to the injection of the contaminated wafer. In addition, the detection of the contaminants on the rear surface of the wafer and the alignment of the wafer are simultaneously carried out so as to improve processing reliability and productivity.

Description

웨이퍼 정렬-배면 검사장치Wafer Alignment-Back Inspection

본 발명은 웨이퍼의 정렬을 위해 오리엔터 및 웨이퍼 척에 의해 웨이퍼가 회전되는 동안 웨이퍼 배면의 오염물질 검지가 가능하도록 웨이퍼 척과 이웃하여 웨이퍼 정렬 배면 검사장치를 구성함으로써, 공정챔버 투입전 오염된 웨이퍼의 검출 및 제거가 가능하도록 하여 오염된 웨이퍼의 투입으로 인해 프로세서 챔버와 웨이퍼의 소손 및 공정 진행의 차질을 미연에 방지함과 아울러, 웨이퍼 배면의 오염물질 검출과 정렬을 동시에 수행하도록 함으로써 공정의 신뢰도 및 생산성을 향상시키도록 한 웨이퍼 정렬 배면 검사장치에 관한 것이다.The present invention configures the wafer alignment back inspection apparatus adjacent to the wafer chuck so as to enable the detection of contaminants on the wafer back while the wafer is rotated by the orient and the wafer chuck for the alignment of the wafers. Detects and removes contaminated wafers to prevent damage to the processor chamber and wafers and disruption of the process, while simultaneously detecting and aligning contaminants on the back of the wafers. The present invention relates to a wafer alignment back inspection apparatus for improving productivity.

웨이퍼는 각종 반도체 소자를 제조하기 위해 사용된다. 이러한 웨이퍼는 클린룸(Clean Room) 환경 하에서 외부 오염물질과 격리되어 각종 공정에 투입된다. Wafers are used to manufacture various semiconductor devices. These wafers are isolated from external contaminants in a clean room environment and introduced into various processes.

도 1은 웨이퍼 제조 장치의 일례를 도시한 예시도이다.1 is an exemplary view showing an example of a wafer manufacturing apparatus.

도 1을 참조하면, 웨이퍼(미도시)는 매거진(또는 카트리지, 미도시)이라 불리우는 수납수단에 의해 다수가 하나의 그룹으로 공정장치에 이송되며, 이송장치(50)는 매거진으로부터 웨이퍼를 인출하여 로드록챔버(40)를 통해 웨이퍼 처리시스템(10)에 이송한다. 이를 위해, 웨이퍼는 포드로더(pod loader, 24)로부터 이송장치(또는 미니 인바이런먼트 : mini-environment, 50)에 투입되며, 이송장치(50)에 설치된 제2이송로봇(21)에 의해 로드록 챔버(40)로 이송된다. 이러한 웨이퍼 처리시스템(10)에는 웨이퍼(40)를 웨이퍼 처리 시스템(10)에 인입하기 전에 진공상태를 형성하고, 외부 오염물질과 격리를 위한 로드록 챔버(40)를 포함하여 구성된다. 로드록 챔버(40)에 로딩된 웨이퍼는 트랜스퍼 챔버(25)에 설치되는 이송로봇(20)에 의해 로드록 챔버(40)로부터 인출되고, 정렬을 위해 오리엔터(30)로 이송된다. 오리엔터(30)는 프로세스 챔버(10)로 웨이퍼를 이송하기 전에 웨이퍼의 플랫존을 정렬하는 역할을 하며, 정렬된 웨이퍼는 다시 이송로봇(20)에 의해 각 프로세서 챔버(10 : 10a 내지 10c)로 이송되어, 공정에 투입된다. 이러한 오리엔터(30)는 도시된 바와 같이 이송장치(50) 내에 설치되어, 포드로더(24)로부터 이송된 웨이퍼를 정렬하게 된다. 여기서, 오리엔터(30)는 도시된 바와 같이 이송장치(50) 내에 설치될 수도 있고, 프로세스챔버(10)와 이웃하여 설치될 수도 있으며, 도시된 바에 의해 본 발명을 한정하는 것은 아니다.Referring to FIG. 1, a plurality of wafers (not shown) are transferred to a processing apparatus as a group by a receiving means called a magazine (or a cartridge, not shown), and the transfer apparatus 50 pulls out a wafer from the magazine. The wafer is transferred to the wafer processing system 10 through the load lock chamber 40. To this end, the wafer is put into a transfer device (or mini-environment 50) from a pod loader 24 and loaded by a second transfer robot 21 installed in the transfer device 50. It is transferred to the lock chamber 40. The wafer processing system 10 includes a load lock chamber 40 for forming a vacuum state before introducing the wafer 40 into the wafer processing system 10 and isolating external contaminants. The wafer loaded in the load lock chamber 40 is withdrawn from the load lock chamber 40 by the transfer robot 20 installed in the transfer chamber 25 and transferred to the orienter 30 for alignment. The orienter 30 serves to align the flat zone of the wafer before transferring the wafer to the process chamber 10, and the aligned wafer is again transferred by the transfer robot 20 to each processor chamber 10: 10a to 10c. Is transferred to the process and put into the process. The orienter 30 is installed in the transfer device 50 as shown, to align the wafer transferred from the pod loader 24. Here, the orienter 30 may be installed in the transfer apparatus 50 as shown, may be installed adjacent to the process chamber 10, it is not limited to the present invention by the illustration.

이러한 웨이퍼에는 프로세스 챔버(10) 내에서 각종 회로, 소자 등이 형성되고, 이와 같은 회로, 소자들은 매우 작고 정교하게 형성되게 된다. 때문에 웨이퍼의 처리과정은 외부 대기와도 완벽히 격리되어 진행되고, 이를 통해 청정환경, 즉 웨이퍼 처리에 있어 문제를 야기하는 오염물과 완벽히 격리되어 진행되게 된다.Various types of circuits, elements, and the like are formed in the wafer in the process chamber 10, and such circuits and elements are very small and precisely formed. Therefore, the processing of the wafer is completely isolated from the external atmosphere, and thus, the clean environment, that is, is completely isolated from the contaminants causing problems in the wafer processing.

때문에, 웨이퍼는 웨이퍼 처리 시스템(10)에 투입되기 전 여러 단계의 클린 공정을 거치게 되며, 이를 통해 웨이퍼 표면에 부착된 각종 오염물질이 제거되고, 여러가지 검사장비에 의해 검사를 수행하여 오염물의 부착여부를 검사하게 된다. 이후 오염물의 세정이 충분히 진행된 웨이퍼만이 웨이퍼 처리 시스템에 이송되어 공정을 진행하게 된다.Therefore, the wafer goes through several stages of clean process before being introduced into the wafer processing system 10, and thus, various contaminants adhered to the wafer surface are removed, and inspection is performed by various inspection equipment to determine whether contaminants are attached. Will be checked. After that, only the wafers with sufficient cleaning of contaminants are transferred to the wafer processing system to proceed with the process.

하지만, 이러한 과정에도 불구하고, 웨이퍼 처리 시스템(10) 내부에 로딩된 웨이퍼 상에 오염물질이 존재하는 경우가 빈번하게 발생하고 있다. 이러한 오염물질이 웨이퍼와 같이 웨이퍼 처리 시스템(10)에 투입되는 경우 공정 중의 웨이퍼 손상, 정전척(Electro Static Chuck, ESC)과 같은 공정장비의 손상, 알람 발생에 의한 공정 중지와 같은 문제를 야기하게 된다. 특히, 저압 환경의 프로세서 챔버에서는 오염물질에의 전계 집중으로 인한 방전이 발생하여 고가의 정전척 및 웨이퍼의 손상이 발생하는 문제점이 있다. 특히, 이러한 문제를 야기하는 오염물질의 경우 다양한 검사를 수행하는 웨이퍼의 전면에 발생하는 경우보다, 검사가 상대적으로 부족한 웨이퍼의 뒷면에 부착되는 경우가 빈번하다.However, despite this process, contaminants are frequently present on the wafer loaded inside the wafer processing system 10. When such contaminants enter the wafer processing system 10 such as wafers, problems such as wafer damage during the process, damage to process equipment such as an electrostatic chuck (ESC), and process interruption due to an alarm are generated. do. In particular, in the processor chamber in a low pressure environment, there is a problem that discharge occurs due to electric field concentration on contaminants and expensive electrostatic chucks and wafer damage occur. In particular, contaminants that cause this problem are more frequently attached to the back side of a wafer that is relatively poor in inspection than occurs on the front side of a wafer that performs various inspections.

또한, 웨이퍼의 경우 이송장치(50)를 통해 웨이퍼 처리 시스템(10) 투입 직전에도 다양한 검사를 수행하기 때문에 검사 이후에 오염물질이 부착되는 경우 오염된 웨이퍼의 배제가 어려운 문제점이 있다. In addition, in the case of the wafer, since various inspections are performed immediately before the wafer processing system 10 is introduced through the transfer device 50, when contaminants are attached after the inspection, it is difficult to exclude the contaminated wafer.

따라서, 본 발명의 목적은 웨이퍼의 정렬을 위해 오리엔터 및 웨이퍼 척에 의해 웨이퍼가 회전되는 동안 웨이퍼 배면의 오염물질 검지가 가능하도록 웨이퍼 척과 이웃하여 웨이퍼 정렬 배면 검사장치를 구성함으로써, 공정챔버 투입전 오염된 웨이퍼의 검출 및 제거가 가능하도록 하여 오염된 웨이퍼의 투입으로 인해 프로세서 챔버와 웨이퍼의 소손 및 공정 진행의 차질을 미연에 방지함과 아울러, 웨이퍼 배면의 오염물질 검출과 정렬을 동시에 수행하도록 함으로써 공정의 신뢰도 및 생산성을 향상시키도록 한 웨이퍼 정렬 배면 검사장치를 제공하는 것이다.Accordingly, an object of the present invention is to configure the wafer alignment back inspection apparatus adjacent to the wafer chuck so as to enable the detection of contaminants on the back surface of the wafer while the wafer is rotated by the orient and the wafer chuck to align the wafers, before the process chamber is inserted. By detecting and removing contaminated wafers, the contamination of the processor chamber and wafers due to the introduction of contaminated wafers and the disruption of the process can be prevented, and the contaminant detection and alignment on the back of the wafers can be performed simultaneously. It is to provide a wafer alignment back inspection apparatus to improve the reliability and productivity of the process.

상기 목적을 달성하기 위하여 본 발명에 따른 웨이퍼 정렬 배면 검사장치는 제조 공정에 투입되는 웨이퍼의 정렬 및 상기 웨이퍼 배면의 오염물질을 검출하기 위한 웨이퍼 정렬 배면 검사 장치에 있어서, 상기 웨이퍼의 회전시 상기 웨이퍼에 형성된 얼라인마크를 감지하여 상기 웨이퍼 정렬을 위한 위치정보를 작성하는 오리엔터; 상기 웨이퍼의 배면 중앙에 맞붙어 상기 웨이퍼를 고정하고, 상기 고정된 웨이퍼의 정렬을 위해 상기 위치정보에 따라 상기 웨이퍼를 회전시키는 웨이퍼 척; 및 상기 웨이퍼 척과 이웃하여 상기 웨이퍼의 배면에 배치되며, 정렬을 위한 상기 웨이퍼의 회전시 상기 웨이퍼 배면에 부착된 상기 오염물질 부착여부를 감지는 센서모듈을 구비하고, 상기 오염물질의 감지시 알람 또는 공정중지 명령을 생성하는 검사장치;를 포함하여 구성되고, In order to achieve the above object, the wafer alignment back inspection apparatus according to the present invention is a wafer alignment back inspection apparatus for detecting an alignment of a wafer and a contaminant on the back surface of the wafer, which is put into a manufacturing process, wherein the wafer is rotated when the wafer is rotated. An orienter for sensing the alignment mark formed on the wafer and creating position information for the wafer alignment; A wafer chuck which is fixed to the center of the back surface of the wafer and rotates the wafer according to the position information for alignment of the fixed wafer; And a sensor module disposed adjacent to the wafer chuck on the rear surface of the wafer and detecting whether the contaminant adhered to the back surface of the wafer during rotation of the wafer for alignment. It is configured to include; inspection device for generating a stop command;

상기 센서모듈은 상기 웨이퍼의 중심과 가장자리의 한 점을 잇는 법선과 평행하게 배치되며,The sensor module is disposed in parallel with the normal connecting the center and the edge of the wafer,

상기 검사장치는 상기 센서모듈이 고정되는 센서 스테이지, 일단이 상기 센서 스테이지와 연결되는 스테이지 샤프트, 상기 스테이지 샤프트의 타단과 결합되고, 상기 웨이퍼가 상기 웨이퍼 척 상에 로딩되거나 언로딩되는 동안 상기 스테이지 샤프트 및 상기 센서 스테이지를 하강시키고, 상기 웨이퍼의 로딩 완료 후 상기 스테이지 샤프트 및 상기 센서 스테이지를 상승시키는 실린더, 상기 센서모듈로부터의 감지결과에 따라 상기 웨이퍼 배면의 상기 오염물질 부착여부를 판단하고, 상기 실린더의 구동을 제어하는 제어부를 더 포함하여 구성된다.The inspection apparatus is coupled to a sensor stage to which the sensor module is fixed, a stage shaft one end of which is connected to the sensor stage, and the other end of the stage shaft, and the stage shaft while the wafer is loaded or unloaded on the wafer chuck. And a cylinder for lowering the sensor stage and raising the stage shaft and the sensor stage after the loading of the wafer is completed, and determining whether the contaminant is attached to the back surface of the wafer according to a detection result from the sensor module. It further comprises a control unit for controlling the driving of.

상기 검사장치는 상기 센서 스테이지, 상기 스테이지 샤프트의 상승 또는 하강을 감지하기 위한 승하강센서를 더 포함하여 구성된다.The inspection device is configured to further include a lift sensor for detecting the rising or falling of the sensor stage, the stage shaft.

상기 센서모듈은 상기 법선 방향으로 배열되고 상기 오염물질의 감지를 위한 복수의 오염물질 감지 센서와, 상기 센서모듈과 상기 웨이퍼 간의 거리를 측정하기 위한 거리감지센서를 포함하여 구성된다.The sensor module is arranged in the normal direction and comprises a plurality of contaminant detection sensors for detecting the contaminants, and a distance detection sensor for measuring the distance between the sensor module and the wafer.

상기 오리엔터, 상기 웨이퍼 척 및 상기 검사장치 중 어느 하나 이상과 연결되며, 상기 오리엔터, 상기 웨이퍼 척 및 상기 검사장치로부터 발생된 전기신호를 상기 제어부에 전달하고, 상기 제어부로부터 발생된 제어신호를 상기 오리엔터, 상기 웨이퍼 척 및 상기 검사장치 중 어느 하나에 전달하는 인터페이스부를 더 포함하여 구성된다.It is connected to any one or more of the orienter, the wafer chuck and the inspection device, and transmits an electrical signal generated from the orienter, the wafer chuck and the inspection device to the control unit, and transmits a control signal generated from the control unit. It further comprises an interface unit for transmitting to any one of the orienter, the wafer chuck and the inspection apparatus.

본 발명에 따른 웨이퍼 정렬 배면 검사장치는 웨이퍼의 정렬을 위해 오리엔터 및 웨이퍼 척에 의해 웨이퍼가 회전되는 동안 웨이퍼 배면의 오염물질 검지가 가능하도록 웨이퍼 척과 이웃하여 웨이퍼 정렬 배면 검사장치를 구성함으로써, 공정챔버 투입전 오염된 웨이퍼의 검출 및 제거가 가능하도록 하여 오염된 웨이퍼의 투입으로 인해 프로세서 챔버와 웨이퍼의 소손 및 공정 진행의 차질을 미연에 방지함과 아울러, 웨이퍼 배면의 오염물질 검출과 정렬을 동시에 수행하도록 함으로써 공정의 신뢰도 및 생산성을 향상시키는 것이 가능하다.The wafer alignment back inspection apparatus according to the present invention comprises a wafer alignment back inspection apparatus adjacent to the wafer chuck so as to detect contaminants on the wafer back while the wafer is rotated by the orient and the wafer chuck to align the wafers. It is possible to detect and remove contaminated wafers before entering the chamber, thereby preventing contamination of the processor chamber and wafers and disruption of processing due to the introduction of contaminated wafers, and simultaneously detecting and aligning contaminants on the back of the wafer. By doing so, it is possible to improve the reliability and productivity of the process.

도 1은 웨이퍼 제조 장치의 일례를 도시한 예시도.1 is an exemplary view showing an example of a wafer manufacturing apparatus.

도 2는 본 발명에 따른 웨이퍼 정렬 배면 검사장치를 도시한 측면 예시도.Figure 2 is an exemplary side view showing a wafer alignment back inspection apparatus according to the present invention.

도 3은 본 발명에 따른 웨이퍼 정렬 배면 검사장치의 평면 예시도.Figure 3 is a plan view of the wafer alignment back inspection apparatus according to the present invention.

<부호의 설명><Description of the code>

100 : 웨이퍼 정렬 배면 검사장치 101 : 웨이퍼100: wafer alignment back inspection device 101: wafer

102 : 얼라인 마크 110 : 오리엔터102: Align Mark 110: Orient

120 : 웨이퍼 척 121 : 척 스테이지120: wafer chuck 121: chuck stage

122 : 척 샤프트 200 : 검사장치122: chuck shaft 200: inspection device

210 : 센서모듈 211 : 센서210: sensor module 211: sensor

220 : 센서부 221 : 센서스테이지220: sensor unit 221: sensor stage

213 : 스테이지 샤프트 215 : 실린더213: stage shaft 215: cylinder

217, 219 : 승하강센서 230 : 인터페이스217, 219: elevation sensor 230: interface

222 : 제어부222 control unit

이하, 본 발명의 바람직한 실시예를 첨부한 도면을 참조하여 당해 분야의 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 설명하기로 한다. 첨부된 도면들에서 구성에 표기된 참조번호는 다른 도면에서도 동일한 구성을 표기할 때에 가능한 한 동일한 도면번호를 사용하고 있음에 유의해야 한다. 또한, 본 발명을 설명함에 있어 관련된 공지의 기능 또는 공지의 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략하기로 한다. 그리고 도면에 제시된 어떤 특징들은 설명의 용이함을 위해 확대 또는 축소 또는 단순화된 것이고, 도면 및 그 구성요소들이 반드시 적절한 비율로 도시되어 있지는 않다. 그러나 당업자라면 이러한 상세 사항들을 쉽게 이해할 것이다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. In the accompanying drawings, it should be noted that the same reference numerals are used in the drawings to designate the same configuration in other drawings as much as possible. In addition, in describing the present invention, when it is determined that a detailed description of a related known function or known configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. And certain features shown in the drawings are enlarged or reduced or simplified for ease of description, the drawings and their components are not necessarily drawn to scale. However, those skilled in the art will readily understand these details.

도 2는 본 발명에 따른 웨이퍼 정렬 배면 검사장치를 도시한 측면 예시도이다. 또한, 도 3은 본 발명에 따른 웨이퍼 정렬 배면 검사장치의 평면 예시도이다.2 is a side view illustrating a wafer alignment back inspection apparatus according to the present invention. 3 is a plan view illustrating a wafer alignment back inspection apparatus according to the present invention.

도 2 및 도 3을 참조하면, 본 발명에 따른 웨이퍼 정렬 배면 검사장치(100)는 오리엔터(110), 웨이퍼 척(120), 검사장치(200)를 포함하여 구성되고, 검사장치(200)는 센서스테이지(221), 스테이지 샤프트(213), 실린더(215)를 포함하는 센서부(220) 및 인터페이스부(230)와 제어부(222)를 포함하여 구성된다.2 and 3, the wafer alignment backside inspection apparatus 100 according to the present invention includes an orienter 110, a wafer chuck 120, and an inspection apparatus 200, and an inspection apparatus 200. The sensor stage 221, the stage shaft 213, the sensor unit 220 including the cylinder 215 and the interface unit 230 and the control unit 222 is configured to include.

오리엔터(110)는 웨이퍼(101)의 회전에 따라 웨이퍼(101)에 표시되는 얼라인 마크(102)의 위치를 감지하고, 이에 따라 얼라인마크(102)의 위치정보를 웨이퍼 정렬 배면 검사장치(100)에 제공함으로써, 웨이퍼(101)의 정렬이 이루어지게 한다. 이를 위해, 오리엔터(110)는 웨이퍼의 얼라인마크(102)를 인식하기 위한 이미지 센서 또는 레이저 센서 또는 카메라를 포함하여 구성된다. 오리엔터(110)에 의해 작성된 웨이퍼 정렬을 위한 위치정보는 인터페이스부(230)를 통해 제어부(222)에 전달되고, 제어부(222)는 위치정보에 따라 웨이퍼 척(120)의 회전을 제어하여 웨이퍼(101)의 정렬을 수행하게 된다. 여기서, 본 발명을 설명함에 있어 웨이퍼 척(120)의 제어를 제어부(222)에서 수행하는 것으로 가정하여 설명하기로 한다. 하지만, 이로써 본 발명을 한정하는 것은 아니며, 웨이퍼 척(120)의 제어는 별도의 제어시스템을 통해 제어될 수 있다.Orient 110 detects the position of the alignment mark 102 displayed on the wafer 101 as the wafer 101 rotates, and accordingly the position information of the alignment mark 102 to the wafer alignment back inspection device By providing it to 100, the wafer 101 is aligned. To this end, the orient 110 includes an image sensor or a laser sensor or a camera for recognizing the alignment mark 102 of the wafer. Position information for the alignment of the wafer created by the orienter 110 is transmitted to the control unit 222 through the interface unit 230, the control unit 222 controls the rotation of the wafer chuck 120 in accordance with the position information wafer The alignment of 101 is performed. In the following description, the control of the wafer chuck 120 is assumed to be performed by the controller 222. However, this does not limit the present invention, and the control of the wafer chuck 120 may be controlled through a separate control system.

웨이퍼 척(120)은 정렬 및 검사 대상 웨이퍼(101)의 거치 및 정렬을 위한 역할을 한다. 이 웨이퍼 척(120)은 웨이퍼(101)가 거치되는 척 스테이지(121), 척 스테이지(120)와 구동장치(미도시)를 연결하는 척 샤프트(122) 및 웨이퍼(101)를 척 스테이지(121)에 고정하기 위한 진공장치(미도시)를 포함하여 구성된다. 웨이퍼 척(120)의 척 스테이지(121)와 척 샤프트(122)는 내부에 통공이 형성되며, 통공은 진공장치와 연결되어 웨이퍼(101)를 척 스테이지(121)에 밀착시키게 된다. 아울러, 척스테이지(121)는 제어부(222)의 제어에 따라 회전하여 웨이퍼(101)를 정렬하게 된다.The wafer chuck 120 serves to mount and align the wafer 101 to be aligned and inspected. The wafer chuck 120 includes a chuck stage 121 on which the wafer 101 is mounted, a chuck shaft 122 connecting the chuck stage 120 and a driving device (not shown), and a wafer 101 to the chuck stage 121. It is configured to include a vacuum device (not shown) for fixing to. The chuck stage 121 and the chuck shaft 122 of the wafer chuck 120 have a through hole formed therein, and the through hole is connected to a vacuum device to bring the wafer 101 into close contact with the chuck stage 121. In addition, the chuck stage 121 is rotated under the control of the controller 222 to align the wafer 101.

검사장치(200)는 웨이퍼 척(120)과 이웃하여 웨이퍼(101)의 배면에 배치되며, 웨이퍼(101) 배면의 오염물질 존재 여부를 검지하고, 오염물질 검지 결과에 따라 공정의 속행 또는 중지를 위한 신호 또는 알람을 생성 및 출력한다. 검사장치(300)는 복수의 센서(211)가 나열된 센서모듈(210)이 웨이퍼(101)의 중심으로 부터 웨이퍼(101)의 가장자리를 향하는 법선방향으로 배열되도록 배치된다. 이러한 검사장치(200)는 웨이퍼(101)가 정렬을 위해 웨이퍼 척(120)에 의해 회전하는 동안 웨이퍼(101) 배면의 오염물질 존재 여부를 검지하게 된다.The inspection apparatus 200 is disposed on the rear surface of the wafer 101 adjacent to the wafer chuck 120, detects the presence of contaminants on the back surface of the wafer 101, and continues or stops the process according to the contaminant detection result. Generate and output signals or alarms for The inspection apparatus 300 is arranged such that the sensor module 210 in which the plurality of sensors 211 are arranged is arranged in a normal direction from the center of the wafer 101 toward the edge of the wafer 101. The inspection apparatus 200 detects the presence of contaminants on the back surface of the wafer 101 while the wafer 101 is rotated by the wafer chuck 120 for alignment.

이러한 검사장치(200)는 센서부(220), 인터페이스부(230) 및 제어부(222)를 포함하여 구성되며, 센서부(220)는 센서스테이지(221), 스테이지샤프트(213) 및 실린더(215)를 포함하여 구성된다.The inspection apparatus 200 includes a sensor unit 220, an interface unit 230, and a control unit 222, and the sensor unit 220 includes a sensor stage 221, a stage shaft 213, and a cylinder 215. It is configured to include).

센서부(220)는 웨이퍼(101) 배면에 웨이퍼 척(120)과 이웃하도록 설치되고, 웨이퍼(101) 배면과 일정한 거리를 유지하면서, 웨이퍼(101)가 정렬을 위해 웨이퍼 척(120)에 의해 회전하는 동안 웨이퍼(101) 배면의 오염물질 부착여부를 검지하게 되고, 검지결과를 인터페이스부(230)를 거쳐 제어부(222)에 전달하게 된다. 특히, 센서부(220)는 웨이퍼(101)의 로딩 및 언로딩시 웨이퍼(101) 및 이송로봇(미도시)의 손상을 방지하기 위해 웨이퍼(101) 면에 대해 수직인 방향으로 상승 또는 하강하여 웨이퍼(101)가 원활하게 로딩 및 언로딩 될 수 있는 환경을 마련한다. 이를 위해 센서부(220)는 센서모듈(210), 센서스테이지(221), 스테이지 샤프트(213), 실린더(215) 및 승하강센서(217, 219)를 포함하여 구성된다.The sensor unit 220 is installed on the back surface of the wafer 101 so as to be adjacent to the wafer chuck 120, and the wafer 101 is moved by the wafer chuck 120 for alignment while maintaining a constant distance from the back surface of the wafer 101. During the rotation, whether the contaminants adhere to the back surface of the wafer 101 is detected, and the detection result is transmitted to the controller 222 via the interface unit 230. In particular, the sensor unit 220 is raised or lowered in a direction perpendicular to the surface of the wafer 101 to prevent damage to the wafer 101 and the transfer robot (not shown) during loading and unloading of the wafer 101. Provides an environment in which the wafer 101 can be loaded and unloaded smoothly. To this end, the sensor unit 220 includes a sensor module 210, a sensor stage 221, a stage shaft 213, a cylinder 215, and lifting and lowering sensors 217 and 219.

센서모듈(210)은 웨이퍼(101) 배면과 마주하여 웨이퍼(101) 배면의 오염물질을 검출하고, 이를 전기신호화 하여 인터페이스부(230)에 전달한다. 이를 위해 센서모듈(210)은 복수의 센서(211)를 포함하여 구성되며, 복수의 센서(211)가 일정한 배열에 의해 나열되어 구성된다. 이러한 센서모듈(210)은 센서스테이지(221)에 고정결합되며, 센서스테이지(221), 센서 샤프트(213) 및 실린더(215)에 의해 상승 및 하강하게 된다. 여기서, 센서모듈(210)에 배치되는 센서(211)들은 특정 파장의 광을 웨이퍼(101) 배면에 조사하는 발광부와 웨이퍼 배면에 의해 반사되는 광을 수광하는 수광부로 구성될 수 있다. 특히, 발광부로부터 방출되는 광의 파장은 단일 파장의 광일 수도 있으나, 센서(211)별로 서로 다른 파장을 가지도록 할 수도 있으나, 이로써 본 발명을 한정하는 것은 아니다. 또한, 센서모듈(210)에 배치되는 센서(211)는 카메라를 이용하여 구성될 수 있다. 센서(211)로써 카메라를 이용하는 경우, 카메라에 의해 웨이퍼 배면의 영상을 촬영하고 이를 영상처리하여 오염물질을 검출하는 것이 가능하다. 이를 위해, 카메라로 센서(211)를 구현하는 경우 영상처리를 위한 별도의 영상처리부가 센서부(220)에 포함되어 구성되거나, 제어부(222)가 영상처리를 수행하도록 하여 오염물질을 검출하게 된다. 카메라는 CCD(Chage Coupled Device) 카메라를 이용할 수 있으나, 이로써 본 발명을 한정하는 것은 아니다. 또한, 센서(211) 들의 배열을 법선과 평행하게 일렬로 배열되도록 할 수 있으나, 정교한 검지를 위해 복수의 센서(211)를 지그재그로 배열하는 것도 가능하다. 하지만, 이로써 본 발명을 한정하는 것은 아니다. 아울러, 이러한 센서모듈(210)에는 센서모듈(210)과 웨이퍼(101)가 적절한 거리를 유지하는지의 여부를 감지하기 위한 거리감지센서가 더 포함되어 구성될 수 있다. 이러한 경우 제어부(222)는 승하강센서(217, 219)와 거리감지센서의 측정결과를 모두 확인하여 센서모듈(210)이 정상 위치에서 고정되는지 판단하게 된다.The sensor module 210 faces the back surface of the wafer 101 to detect contaminants on the back surface of the wafer 101, and converts the signal into electrical signals to the interface unit 230. To this end, the sensor module 210 includes a plurality of sensors 211, and the plurality of sensors 211 are arranged in a predetermined arrangement. The sensor module 210 is fixedly coupled to the sensor stage 221 and is raised and lowered by the sensor stage 221, the sensor shaft 213, and the cylinder 215. Here, the sensors 211 disposed on the sensor module 210 may include a light emitting part for irradiating the back surface of the wafer 101 with light of a specific wavelength and a light receiving part for receiving light reflected by the back surface of the wafer. In particular, the wavelength of the light emitted from the light emitting unit may be a single wavelength of light, but may have a different wavelength for each sensor 211, but this does not limit the present invention. In addition, the sensor 211 disposed in the sensor module 210 may be configured using a camera. When using the camera as the sensor 211, it is possible to take an image of the back surface of the wafer by the camera and to detect the contaminants by image processing. To this end, when the sensor 211 is implemented as a camera, a separate image processor for image processing is included in the sensor unit 220 or the controller 222 performs image processing to detect contaminants. . The camera may use a CCD (Chage Coupled Device) camera, but this does not limit the present invention. In addition, although the arrangement of the sensors 211 can be arranged in a line parallel to the normal, it is also possible to arrange a plurality of sensors 211 in a zigzag for precise detection. However, this does not limit the present invention. In addition, the sensor module 210 may be configured to further include a distance sensor for detecting whether the sensor module 210 and the wafer 101 maintain an appropriate distance. In this case, the controller 222 checks the measurement results of the elevating sensors 217 and 219 and the distance detecting sensor to determine whether the sensor module 210 is fixed at the normal position.

센서스테이지(221)는 센서모듈(210)을 고정하여, 센서모듈(210)과 스테이지샤프트(213)를 연결한다.The sensor stage 221 fixes the sensor module 210 to connect the sensor module 210 and the stage shaft 213.

스테이지샤프트(213)는 센서스테이지(213) 및 센서모듈(210)을 지지하며, 실린더(215)의 기동에 따라 센서스테이지(213) 및 센서모듈(210)을 상승 또는 하강시킨다.The stage shaft 213 supports the sensor stage 213 and the sensor module 210, and raises or lowers the sensor stage 213 and the sensor module 210 according to the operation of the cylinder 215.

실린더(215)는 제어부(222)의 제어에 따라 기동하여 스테이지샤프트(213)를 웨이퍼(101) 면에 대해 수직인 방향으로 이동시킨다.The cylinder 215 is started under the control of the controller 222 to move the stage shaft 213 in a direction perpendicular to the wafer 101 surface.

승하강센서(217, 219)는 센서부(220)의 상승 동작시 센서모듈(210)이 웨이퍼(101)와 일정한 간격을 유지하도록 하고, 하강시 적정한 높이의 하강을 수행하도록 스테이지 샤프트(213)의 상승 및 하강을 감지하고, 감지결과를 제어부(222)에 전달한다. 여기서, 승하강센서(217, 219)가 각각 제1센서(217)와 제2센서(219)로 구성된 예가 도시되어 있으나, 이는 일례일 뿐 이로써 본 발명을 한정하는 것은 아니며, 센서의 종류 및 측정 방식에 따라 센서의 수, 배치, 측정 대상은 상이해질 수 있다.The elevating sensors 217 and 219 allow the sensor module 210 to maintain a constant distance from the wafer 101 during the ascending operation of the sensor unit 220, and to perform a descending of an appropriate height when descending. Detects the rising and falling of and transmits the detection result to the controller 222. Here, an example in which the elevating sensors 217 and 219 are respectively configured as the first sensor 217 and the second sensor 219 is shown, but this is merely an example and does not limit the present invention, and the type and measurement of the sensor Depending on the method, the number, arrangement, and measurement targets of the sensors may be different.

인터페이스부(230)는 센서모듈(210), 승하강센서(217, 219)를 포함하는 검사장치(220), 오리엔터(110) 및 웨이퍼척(120)와 연결되어 이들로부터 전달되는 검지결과 및 각종 신호를를 제어부(222)에서 처리가 가능한 형태의 신호로 변환하고, 변환된 신호를 제어부(222)에 전달하며, 제어부(220)에서 발생된 제어신호를 이들 구성에서 처리 가능한 형태로 변환하여 각 구성에 전달한다. 이를 위해 인터페이스부(230)는 제어부(222)에 의해 제어되거나, 제어부(222)와 정보 교환을 수행하는 구성 즉, 오리엔터, 웨이퍼 척(120)의 구동장치, 검사장치의 센서모듈(210), 승하강센서(217, 219), 실린더(215)와 연결된다. 이러한 인터페이스부(230)는 신호발생부와 제어부(222)의 신호 형태가 상이한 경우에 구성되며, 발생 신호의 형태에 따라 생략될 수도 있다.The interface unit 230 is connected to the sensor module 210, the inspection apparatus 220 including the elevating sensors 217 and 219, the orient 110 and the wafer chuck 120 and the detection results transmitted therefrom and Converts various signals into a signal that can be processed by the controller 222, transfers the converted signal to the controller 222, and converts the control signal generated by the controller 220 into a form that can be processed by these configurations. Pass in the configuration. To this end, the interface unit 230 is controlled by the control unit 222, or the configuration of performing information exchange with the control unit 222, that is, the orientation device, the driving device of the wafer chuck 120, the sensor module 210 of the inspection device , The elevating sensors 217 and 219 are connected to the cylinder 215. The interface unit 230 is configured when the signal types of the signal generator and the controller 222 are different, and may be omitted depending on the type of the generated signal.

제어부(222)는 센서모듈(210)로부터 전달되는 검지결과에 따라 웨이퍼(101) 배면의 오염물질 존재여부를 판단하고, 판단결과에 따라 공정의 유지 또는 알람을 출력한다. 제어부(222)는 센서모듈(210)로부터 전달되는 감지결과를 통해 웨이퍼(101) 배면에 오염물질이 존재하지 않는 경우 웨이퍼(101)의 공정이 지속되도록 웨이퍼 척 및 오리엔터를 구동시킨다. 반면에 제어부(222)는 센서모듈(210)로부터 전달되는 감지결과를 통해 웨이퍼(101) 배면에 오염물질이 존재한다고 판단되는 경우 정렬 및 웨이퍼의 이동을 중지하고, 오염물질의 발견을 사용자에게 알리게 되며, 이를 통해 오염물질이 부착된 웨이퍼(101)가 프로세스챔버(미도시)로 이송되는 것을 방지하게 된다. 아울러 제어부(222)는 웨이퍼(101)의 교체시 실린더(215)를 제어하여 센서부(220)가 하강 및 상승하도록 제어하며, 승하강센서(217, 219)의 감지결과에 따라 센서모듈(210)이 웨이퍼(101)와 일정한 간격을 유지하도록 제어하게 된다.The control unit 222 determines whether there is a contaminant on the back surface of the wafer 101 according to the detection result transmitted from the sensor module 210, and outputs the maintenance or alarm according to the determination result. The controller 222 drives the wafer chuck and the orient to continue the process of the wafer 101 when no contaminants are present on the back surface of the wafer 101 through the detection result transmitted from the sensor module 210. On the other hand, if it is determined that contaminants exist on the back surface of the wafer 101 through the detection result transmitted from the sensor module 210, the control unit 222 stops the alignment and movement of the wafer and informs the user of the discovery of the contaminants. As a result, the contaminant-attached wafer 101 is prevented from being transferred to the process chamber (not shown). In addition, the controller 222 controls the sensor unit 220 to descend and ascend by controlling the cylinder 215 when the wafer 101 is replaced, and according to the detection result of the elevation sensors 217 and 219, the sensor module 210. ) Is controlled to maintain a constant distance from the wafer 101.

한편, 오염물질이 부착된 것으로 판단된 웨이퍼(101)는 사용자 또는 이송로봇에 의해 매거진에 재 수납되고, 하나의 매거진에 수납된 모든 웨이퍼가 클린공정으로 재이송되어, 오염물질을 제거한 후 다시 공정에 이용되게 된다.On the other hand, the wafer 101 determined to be attached to the contaminants are re-received in the magazine by the user or the transfer robot, and all the wafers stored in one magazine are re-transferd to the clean process, and the contaminants are removed again. To be used.

이상에서 본 발명의 기술적 사상을 예시하기 위해 구체적인 실시 예로 도시하고 설명하였으나, 본 발명은 상기와 같이 구체적인 실시 예와 동일한 구성 및 작용에만 국한되지 않고, 여러가지 변형이 본 발명의 범위를 벗어나지 않는 한도 내에서 실시될 수 있다. 따라서, 그와 같은 변형도 본 발명의 범위에 속하는 것으로 간주해야 하며, 본 발명의 범위는 후술하는 특허청구범위에 의해 결정되어야 한다.Although illustrated and described in the specific embodiments to illustrate the technical spirit of the present invention, the present invention is not limited to the same configuration and operation as the specific embodiment as described above, within the limits that various modifications do not depart from the scope of the invention It can be carried out in. Therefore, such modifications should also be regarded as belonging to the scope of the present invention, and the scope of the present invention should be determined by the claims below.

Claims (4)

제조 공정에 투입되는 웨이퍼의 정렬 및 상기 웨이퍼 배면의 오염물질을 검출하기 위한 웨이퍼 정렬 배면 검사 장치에 있어서,In the wafer alignment back inspection apparatus for detecting the alignment of the wafer to be introduced into the manufacturing process and the contamination of the back surface of the wafer, 상기 웨이퍼의 회전시 상기 웨이퍼에 형성된 얼라인마크를 감지하여 상기 웨이퍼 정렬을 위한 위치정보를 작성하는 오리엔터; An orienter which detects an alignment mark formed on the wafer when the wafer is rotated and creates position information for the wafer alignment; 상기 웨이퍼의 배면 중앙에 맞붙어 상기 웨이퍼를 고정하고, 상기 고정된 웨이퍼의 정렬을 위해 상기 위치정보에 따라 상기 웨이퍼를 회전시키는 웨이퍼 척; 및A wafer chuck which is fixed to the center of the back surface of the wafer and rotates the wafer according to the position information for alignment of the fixed wafer; And 상기 웨이퍼 척과 이웃하여 상기 웨이퍼의 배면에 배치되며, 정렬을 위한 상기 웨이퍼의 회전시 상기 웨이퍼 배면에 부착된 상기 오염물질 부착여부를 감지는 센서모듈을 구비하고, 상기 오염물질의 감지시 알람 또는 공정중지 명령을 생성하는 검사장치;를 포함하여 구성되고, A sensor module disposed adjacent to the wafer chuck and disposed on the back surface of the wafer and detecting whether the contaminant adhered to the back surface of the wafer during rotation of the wafer for alignment; It is configured to include; inspection device for generating a stop command; 상기 센서모듈은 상기 웨이퍼의 중심과 가장자리의 한 점을 잇는 법선과 평행하게 배치되며,The sensor module is disposed in parallel with the normal connecting the center and the edge of the wafer, 상기 검사장치는The inspection device 상기 센서모듈이 고정되는 센서 스테이지,A sensor stage to which the sensor module is fixed; 일단이 상기 센서 스테이지와 연결되는 스테이지 샤프트,A stage shaft having one end connected to the sensor stage, 상기 스테이지 샤프트의 타단과 결합되고, 상기 웨이퍼가 상기 웨이퍼 척 상에 로딩되거나 언로딩되는 동안 상기 스테이지 샤프트 및 상기 센서 스테이지를 하강시키고, 상기 웨이퍼의 로딩 완료 후 상기 스테이지 샤프트 및 상기 센서 스테이지를 상승시키는 실린더, 및Coupled to the other end of the stage shaft, lowering the stage shaft and the sensor stage while the wafer is loaded or unloaded on the wafer chuck, and raising the stage shaft and the sensor stage after completion of loading of the wafer. Cylinder, and 상기 센서모듈로부터의 감지결과에 따라 상기 웨이퍼 배면의 상기 오염물질 부착여부를 판단하고, 상기 실린더의 구동을 제어하는 제어부를 더 포함하여 구성되는 것을 특징으로 하는 웨이퍼 정렬 배면 검사장치.Wafer alignment back inspection device characterized in that it further comprises a control unit for determining whether to attach the contaminant on the back of the wafer according to the detection result from the sensor module, and controls the driving of the cylinder. 제 1 항에 있어서,The method of claim 1, 상기 검사장치는The inspection device 상기 센서 스테이지, 상기 스테이지 샤프트의 상승 또는 하강을 감지하기 위한 승하강센서를 더 포함하여 구성되는 것을 특징으로 하는 웨이퍼 정렬 배면 검사장치.Wafer alignment back inspection device, characterized in that it further comprises a lifting sensor for detecting the rising or falling of the sensor stage, the stage shaft. 제 1 항에 있어서,The method of claim 1, 상기 센서모듈은 The sensor module 상기 법선 방향으로 배열되고 상기 오염물질의 감지를 위한 복수의 오염물질 감지 센서와,A plurality of contaminant detection sensors arranged in the normal direction and for detecting the contaminants; 상기 센서모듈과 상기 웨이퍼 간의 거리를 측정하기 위한 거리감지센서를 포함하여 구성되는 것을 특징으로 하는 웨이퍼 정렬 배면 검사장치.Wafer alignment back inspection device comprising a distance sensor for measuring the distance between the sensor module and the wafer. 제 1 항에 있어서,The method of claim 1, 상기 오리엔터, 상기 웨이퍼 척 및 상기 검사장치 중 어느 하나 이상과 연결되며,Is connected to any one or more of the orienter, the wafer chuck and the inspection device, 상기 오리엔터, 상기 웨이퍼 척 및 상기 검사장치로부터 발생된 전기신호를 상기 제어부에 전달하고, 상기 제어부로부터 발생된 제어신호를 상기 오리엔터, 상기 웨이퍼 척 및 상기 검사장치 중 어느 하나에 전달하는 인터페이스부를 더 포함하여 구성되는 것을 특징으로 하는 웨이퍼 정렬 배면 검사장치.The interface unit for transmitting the electrical signal generated from the orienter, the wafer chuck and the inspection device to the control unit, and the control signal generated from the control unit to any one of the orienter, the wafer chuck and the inspection device. Wafer alignment back inspection device, characterized in that further comprises.
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