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WO2011155529A1 - Elément de mesure, dispositif de platine, appareil d'exposition, procédé d'exposition, et procédé de fabrication du dispositif - Google Patents

Elément de mesure, dispositif de platine, appareil d'exposition, procédé d'exposition, et procédé de fabrication du dispositif Download PDF

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Publication number
WO2011155529A1
WO2011155529A1 PCT/JP2011/063139 JP2011063139W WO2011155529A1 WO 2011155529 A1 WO2011155529 A1 WO 2011155529A1 JP 2011063139 W JP2011063139 W JP 2011063139W WO 2011155529 A1 WO2011155529 A1 WO 2011155529A1
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WO
WIPO (PCT)
Prior art keywords
shielding film
light
exposure
liquid
substrate
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Application number
PCT/JP2011/063139
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English (en)
Japanese (ja)
Inventor
直正 白石
Original Assignee
株式会社ニコン
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Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Publication of WO2011155529A1 publication Critical patent/WO2011155529A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

Definitions

  • the present invention relates to a measurement member, a stage apparatus, an exposure apparatus, an exposure method, and a device manufacturing method.
  • an immersion exposure apparatus In an exposure apparatus used in a photolithography process, an immersion exposure apparatus has been devised that exposes a substrate with exposure light through a liquid.
  • the following patent document discloses an example of a technique related to an immersion exposure apparatus including a measurement member.
  • the measurement accuracy using the measurement member may be reduced. For example, when the measurement member has a measurement opening (pattern), if the measurement member deteriorates and the shape of the opening changes, the measurement accuracy using the measurement member may decrease.
  • the measurement accuracy using the measurement member may decrease.
  • An object of an aspect of the present invention is to provide a measurement member and a stage device that can suppress a decrease in measurement accuracy. Another object of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.
  • a measuring member used in an exposure apparatus that exposes a substrate with exposure light through a liquid, the base member being capable of transmitting the exposure light, and the liquid formed on the base material.
  • a measuring member comprising a conductive light shielding film that defines an opening through which exposure light can be incident, and a conductive member that is connected to at least a part of the light shielding film and grounds the light shielding film.
  • a stage apparatus for an exposure apparatus that exposes a substrate with exposure light through a liquid, the holding part holding the measurement member of the first aspect, and a holding part.
  • a movable part that can move the measurement member held by the holding part to a position where exposure light can be irradiated; and a ground part that contacts the conductive member of the measurement member held by the holding part to ground the light shielding film;
  • a stage apparatus is provided.
  • a stage apparatus for an exposure apparatus that exposes a substrate with exposure light through a liquid, the base material being capable of transmitting the exposure light, and formed on the base material through the liquid.
  • a measuring member having a conductive light-shielding film that defines an opening through which exposure light can be incident, a holding unit that holds the measuring member, and a holding unit, and the exposure light passes through the measuring member held by the holding unit.
  • a stage device is provided that includes a movable part that can be moved to an irradiable position and a grounding part that grounds the light shielding film of the measurement member held by the holding part.
  • an exposure apparatus that exposes a substrate with exposure light through a liquid, the exposure apparatus including the measurement member of the first aspect.
  • an exposure apparatus that exposes a substrate with exposure light through a liquid, and that includes at least one stage apparatus of the second and third aspects.
  • a device manufacturing method including exposing a substrate using at least one of the fourth and fifth exposure apparatuses and developing the exposed substrate.
  • a method for manufacturing a measuring member used in an exposure apparatus that exposes a substrate with exposure light through a liquid, wherein the first surface of a substrate that can transmit exposure light is electrically conductive.
  • Forming a light-shielding film forming an opening through which the exposure light can enter, forming a protective film so as to cover at least a part of the opening and the light-shielding film, Forming a conductive film so as to be connected to the light-shielding film on at least a part of a predetermined surface of the base material different from the first surface in a formed state, and removing the protective film Is provided.
  • a device manufacturing method including exposing a substrate using the exposure method according to the eighth aspect and developing the exposed substrate.
  • the aspect of the present invention it is possible to suppress a decrease in measurement accuracy. Moreover, according to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.
  • an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system.
  • a predetermined direction in the horizontal plane is defined as an X-axis direction
  • a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction
  • a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction.
  • the rotation (inclination) directions around the X axis, Y axis, and Z axis are the ⁇ X, ⁇ Y, and ⁇ Z directions, respectively.
  • FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment.
  • the exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ.
  • the exposure apparatus EX is an exposure apparatus having a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113. Will be described as an example.
  • the exposure apparatus EX holds a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and a measurement member C without holding the substrate P.
  • a movable measurement stage 3 an illumination system IL that illuminates the mask M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and a projection
  • the liquid immersion member 4 capable of forming the liquid immersion space LS so that the optical path of the exposure light EL emitted from the optical system PL is filled with the liquid LQ, and the control device 5 that controls the operation of the entire exposure apparatus EX. Yes.
  • the immersion space is a space filled with liquid.
  • water pure water
  • the mask M includes a reticle on which a device pattern projected onto the substrate P is formed.
  • the substrate P is a substrate for manufacturing a device.
  • the substrate P includes, for example, a semiconductor wafer and a photosensitive material film formed on the semiconductor wafer.
  • the illumination system IL irradiates the predetermined illumination area IR with the exposure light EL.
  • the illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated.
  • ArF excimer laser light is used as the exposure light EL emitted from the illumination system IL.
  • KrF excimer laser light may be used as the exposure light EL.
  • the mask stage 1 is movable on the guide surface 6G of the first surface plate 6.
  • the mask stage 1 has a holding unit 7 that holds the mask M so as to be releasable.
  • the mask stage 1 can move the mask M held by the holding unit 7 to a position where the exposure light EL emitted from the illumination system IL can be irradiated.
  • Projection optical system PL irradiates exposure light EL to a predetermined projection region PR.
  • the projection optical system PL has an exit surface 9 that emits the exposure light EL toward the image plane of the projection optical system PL.
  • the terminal optical element 10 closest to the image plane of the projection optical system PL has the exit surface 9.
  • the projection region PR includes a position where the exposure light EL emitted from the emission surface 9 can be irradiated.
  • the projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR.
  • the exposure light EL emitted from the emission surface 9 travels in the ⁇ Z direction.
  • the substrate stage 2 and the measurement stage 3 are movable on the guide surface 11G of the second surface plate 11.
  • the substrate stage 2 includes a holding unit 12 that holds the substrate P in a releasable manner.
  • the substrate stage 2 can move the substrate P held by the holding unit 12 to a position where the exposure light EL emitted from the projection optical system PL can be irradiated.
  • the measurement stage 3 includes a holding unit 13 that holds the measurement member C so as to be releasable.
  • the measurement stage 3 can move the measurement member C held by the holding unit 13 to a position where the exposure light EL emitted from the projection optical system PL can be irradiated.
  • the substrate stage 2 is disposed at least at a part around the holding unit 12 as disclosed in US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like.
  • the holding member 14 holds the plate member T so as to be releasable.
  • the measurement stage 3 includes a holding unit 15 that is disposed at least partially around the holding unit 13 and holds the plate member S in a releasable manner.
  • the substrate stage 2, the plate member T, the measurement stage 3, and the plate member S having the holding unit 14 are formed of metal, for example, conductive ceramics. Note that at least one of the substrate stage 2, the plate member T, the measurement stage 3, and the plate member S may be formed of another conductive metal such as titanium. Further, the substrate stage 2, the plate member T, the measurement stage 3, and the plate member S may not be formed of the same conductive material.
  • the mask stage 1 can be moved by the operation of the drive system 8.
  • the drive system 8 includes a planar motor having a mover 8 ⁇ / b> A disposed on the mask stage 1 and a stator 8 ⁇ / b> C disposed on the first surface plate 6.
  • the mask stage 1 can move in six directions on the guide surface 6G in the X axis, Y axis, Z axis, ⁇ X, ⁇ Y, and ⁇ Z directions by the operation of the drive system 8.
  • Each of the substrate stage 2 and the measurement stage 3 can be moved by the operation of the drive system 16.
  • the drive system 16 includes a planar motor having a mover 16 ⁇ / b> A disposed on the substrate stage 2, a mover 16 ⁇ / b> B disposed on the measurement stage 3, and a stator 16 ⁇ / b> C disposed on the second surface plate 11.
  • Each of the substrate stage 2 and the measurement stage 3 can move in six directions on the guide surface 11G in the X axis, Y axis, Z axis, ⁇ X, ⁇ Y, and ⁇ Z directions by the operation of the drive system 16.
  • An example of a flat motor is disclosed in, for example, US Pat. No. 6,452,292.
  • the positions of the mask stage 1, the substrate stage 2, and the measurement stage 3 are measured by the interferometer system 17.
  • the control device 5 When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 5 operates the drive systems 8 and 16 based on the measurement result of the interferometer system 17 to thereby perform the mask stage 1 (mask M ), Position control of the substrate stage 2 (substrate P) and the measurement stage 3 (measurement member C) is executed.
  • the exposure apparatus EX includes an aerial image measurement system 18 capable of measuring an aerial image (imaging characteristic) of the projection optical system PL as disclosed in, for example, US Patent Application Publication No. 2002/0041377. I have.
  • the measurement member C constitutes a part of the aerial image measurement system 18.
  • FIG. 2 is a perspective view showing an example of the measuring member C according to the present embodiment
  • FIG. 3 is a side sectional view.
  • the measuring member C has a base material 21 that can transmit the exposure light EL, and a conductivity that is formed on the base material 21 and that defines the opening 22 through which the exposure light EL can enter through the liquid LQ.
  • a conductive member 24 that is connected to at least a part of the light shielding film 23 and grounds (grounds) the light shielding film 23.
  • the conductive member 24 is formed of the same metal material as the plate member S, for example.
  • the plate member S may be made of a different metal material, or may be made of the same metal material as the light shielding film.
  • the base material 21 is made of quartz glass. Quartz glass can transmit the exposure light EL.
  • the base material 21 may be formed of a meteorite capable of transmitting the exposure light EL.
  • the base material 21 is substantially a rectangular parallelepiped. 2 and 3, the base material 21 includes an upper surface 25 facing the + Z direction, a lower surface 26 facing the ⁇ Z direction opposite to the upper surface 25, and a side surface 27 connecting the edge of the upper surface 25 and the edge of the lower surface 26.
  • the side surface 27 includes a first side surface 27A facing the + Y direction, a second side surface 27B facing the ⁇ Y direction, a third side surface 27C facing the + X direction, and a fourth side surface 27D facing the ⁇ X direction.
  • the light shielding film 23 is provided on the upper surface 25 of the substrate 21.
  • the light shielding film 23 is conductive.
  • the light shielding film 23 is light shielding with respect to the exposure light EL.
  • the light shielding film 23 is made of chromium (Cr).
  • the light shielding film 23 is disposed so that the lower surface 23B and the upper surface 25 of the light shielding film 23 are in contact with each other.
  • the light shielding film 23 blocks the passage of the exposure light EL irradiated to the upper surface 23A of the light shielding film 23.
  • the light shielding film 23 may or may not block the irradiated exposure light EL. That is, the transmittance of the light shielding film 23 with respect to the exposure light EL may be 0%, or the light shielding film 23 may slightly transmit the exposure light EL as long as the exposure light EL can be measured with a desired accuracy. .
  • the opening 22 is defined by the light shielding film 23.
  • the opening 22 is a portion where the light shielding film 23 is not provided on the upper surface 25.
  • the opening 22 is disposed substantially at the center of the upper surface 25.
  • the shape of the opening 22 in the XY plane parallel to the upper surface 25 is a slit shape that is long in the X-axis direction.
  • a part of the base material 21 is exposed inside the opening 22.
  • a part of the base material 21 may be covered with a member (film) that can transmit the exposure light EL inside the opening 22.
  • the conductive member 24 is connected to the light shielding film 23.
  • the conductive member 24 is a member for grounding the light shielding film 23.
  • the conductive member 24 includes a protruding portion 28 that at least partially protrudes to the outside of the base material 21.
  • the conductive member 24 includes a pin member connected to the light shielding film 23 so that at least a part protrudes outside the light shielding film 23.
  • a plurality of conductive members 24 are arranged. In the present embodiment, a plurality of conductive members 24 are arranged around the opening 22. In the present embodiment, four conductive members 24 are arranged.
  • the conductive member 24 is connected to the upper surface 23A. Note that at least a part of the conductive member 24 may be disposed between the upper surface 25 and the lower surface 23B. That is, at least a part of the conductive member 24 may be disposed so as to be sandwiched between the base material 21 and the light shielding film 23.
  • FIG. 4 is a perspective view illustrating an example of the substrate stage 2 and the measurement stage 3 according to the present embodiment
  • FIG. 5 is a perspective view illustrating the vicinity of the measurement member C held by the holding unit 13
  • the holding unit 13 includes a so-called pin chuck mechanism, and holds the measuring member C so as to be releasable.
  • the holding unit 13 holds the measurement member C so that the upper surface FC of the measurement member C faces the + Z direction.
  • the upper surface FC includes the upper surface 23 ⁇ / b> A and the upper surface 25 in the opening 22.
  • the holding unit 13 holds the measurement member C so that the upper surface FC and the XY plane are substantially parallel.
  • the holding unit 15 includes a so-called pin chuck mechanism and holds the plate member S so as to be releasable.
  • the holding unit 15 holds the plate member S so that the upper surface FS of the plate member S and the XY plane are substantially parallel to each other.
  • the upper surface FC (upper surface 23A) of the measurement member C held by the holding unit 13 and the upper surface FS of the plate member S held by the holding unit 15 are arranged in substantially the same plane. (It is the same). Note that at least a part of the upper surface FS may be non-parallel to the XY plane or may include a curved surface. Further, at least a part of the upper surface FC may be non-parallel to the XY plane, or may include a curved surface.
  • the measurement member C is held by the holding unit 13 and mounted on the measurement stage 3.
  • the plate member S held by the holding unit 15 is disposed around the measurement member C held by the holding unit 13.
  • the plate member S has an opening 29 in which the measuring member C can be disposed.
  • the measuring member C held by the holding unit 13 is disposed inside the opening 29 of the plate member S held by the holding unit 15.
  • the conductive member 24 comes into contact with at least a part of the measurement stage 3.
  • the conductive member 24 comes into contact with the plate member S held by the holding unit 15.
  • the protruding portion 28 of the conductive member 24 is in contact with the plate member S.
  • the light shielding film 23 is grounded when the conductive member 24 contacts at least a part of the measurement stage 3 (plate member S).
  • the measurement stage 3 is grounded via the second surface plate 11. Further, the plate member S is in contact with the holding unit 15 of the measurement stage 3.
  • the light shielding film 23 is grounded.
  • the base member 21 and the light shielding film 23 of the measuring member C held by the holding unit 13 and the plate member S held by the holding unit 15 are separated from each other. That is, a gap is formed between the side surface 27 of the base material 21 held by the holding unit 13 and the inner side surface 30 of the opening 29 of the plate member S held by the holding unit 15. Similarly, a gap is also formed between the light shielding film 23 and the plate member S. Note that at least a part of the substrate 21 and the plate member S may be in contact with each other, or at least a part of the light shielding film 23 and the plate member S may be in contact with each other.
  • the conductive member 24 is in contact with the upper surface FS, but may be in contact with the inner surface 30, for example.
  • the exposure light EL emitted from the emission surface 9 is applied to the measuring member C via the liquid LQ in the immersion space LS.
  • the liquid LQ is held between the last optical element 10 and the liquid immersion member 4 and the measurement member C. With the held liquid LQ, an immersion space LS is formed so that the optical path of the exposure light EL emitted from the emission surface 9 is filled with the liquid LQ.
  • the immersion member 4 is disposed at least at a part around the terminal optical element 10.
  • the liquid immersion member 4 includes an opening 31 through which the exposure light EL emitted from the emission surface 9 can pass, and a lower surface 32 that is disposed around the opening 31 and can face the upper surface FC.
  • the liquid immersion member 4 can hold the liquid LQ between the lower surface 32 and the upper surface FC facing the lower surface 32.
  • the liquid immersion member 4 is made of a conductive metal such as titanium.
  • the liquid immersion member 4 includes a supply port 33 capable of supplying the liquid LQ and a recovery port 34 capable of recovering the liquid LQ.
  • the supply port 33 can supply the liquid LQ to the optical path of the exposure light EL emitted from the emission surface 9.
  • the supply port 33 is disposed at a predetermined position of the liquid immersion member 4 so as to face the optical path of the exposure light EL.
  • the supply port 33 is connected to the liquid supply device 35 via a supply channel.
  • the liquid supply device 35 can deliver the liquid LQ.
  • the supply port 33 supplies the liquid LQ supplied from the liquid supply device 35 to the optical path of the exposure light EL.
  • the recovery port 34 can recover at least a part of the liquid LQ on the measurement member C facing the lower surface 32.
  • the recovery port 34 is disposed at a predetermined position of the liquid immersion member 4 so as to face the upper surface FC.
  • a porous member 36 is disposed in the recovery port 34.
  • the porous member 36 has a plurality of holes (openings or pores) through which the liquid LQ can pass.
  • the liquid LQ on the measurement member C is collected through the hole of the porous member 36.
  • the porous member 36 is a plate-like member.
  • the lower surface 32 includes a flat surface disposed around the opening 31 and a lower surface of the porous member 36 disposed around the flat surface.
  • the porous member 36 may not be disposed in the recovery port 34.
  • the recovery port 34 is connected to a liquid recovery device 37 via a recovery channel.
  • the liquid recovery device 37 includes a vacuum system and can suck the liquid LQ.
  • the liquid LQ recovered from the recovery port 34 is recovered by the liquid recovery device 37.
  • the recovery operation of the liquid LQ from the recovery port 34 is executed in parallel with the supply operation of the liquid LQ from the supply port 33, whereby the last optical element 10, the liquid immersion member 4, and the measurement member An immersion space LS is formed between C and C.
  • the object that can form the immersion space LS by holding the liquid LQ between the terminal optical element 10 and the immersion member 4 is not limited to the measurement member C.
  • An object that can move to a position facing the emission surface 9 and the lower surface 32 can hold the liquid LQ between the last optical element 10 and the liquid immersion member 4 to form the liquid immersion space LS.
  • at least one of the plate member T (substrate stage 2), the substrate P held on the substrate stage 2, and the plate member S (measurement stage 3) is formed by the terminal optical element 10 and the liquid immersion member 4.
  • the liquid immersion space LS can be formed while holding the liquid LQ therebetween.
  • the liquid LQ is held between the terminal optical element 10 and the liquid immersion member 4 and the substrate P so that the optical path of the exposure light EL emitted from the emission surface 9 is filled with the liquid LQ.
  • the immersion space LS is formed.
  • the exposure apparatus EX employs a local liquid immersion method.
  • the interface (meniscus, edge) LG of the liquid LQ in the immersion space LS is formed between the lower surface 32 and the upper surface FC.
  • the size of the immersion space LS in the XY plane is smaller than the measurement member C, but may be larger.
  • the interface LG may be disposed between the lower surface 32 and the upper surface FS in a state where the immersion space LS is formed so that the optical path between the emission surface 9 and the opening 22 is filled with the liquid LQ. .
  • the control device 5 arranges the measurement member C at a position facing the emission surface 9.
  • the liquid immersion space LS is formed by holding the liquid LQ supplied from the supply port 33 between the injection surface 9 and the lower surface 32 and the measurement member C.
  • the liquid LQ in the immersion space LS contacts the emission surface 9, the lower surface 32, and the upper surface FC.
  • the control device 5 emits the exposure light EL from the illumination system IL, and projects the projection optics.
  • a measurement pattern arranged on the object plane side of the system PL is illuminated.
  • the exposure light EL irradiated to the measurement pattern and passed through the projection optical system PL is emitted from the emission surface 9.
  • the exposure light EL emitted from the emission surface 9 is applied to the opening 22 of the measurement member C through the liquid LQ in the immersion space LS.
  • the exposure light EL that has entered the opening 22 via the liquid LQ passes through the substrate 21 and is emitted from the lower surface 26.
  • the optical element 38 of the aerial image measurement system 18 is disposed so as to contact the lower surface 26.
  • the exposure light EL emitted from the lower surface 26 and passing through the optical element 38 is received by the light receiving element 39 of the aerial image measurement system 18.
  • the control device 5 obtains an aerial image (imaging characteristic) of the projection optical system PL via the liquid LQ based on the light reception result of the light receiving element 39.
  • the light shielding film 23 is grounded, deterioration of at least one of the light shielding film 23 and the opening 22 defined by the light shielding film 23 can be suppressed.
  • the deterioration (damage) of the light shielding film 23 in the vicinity of the opening 22 can be suppressed, and the change in the shape of the opening 22 can be suppressed.
  • electric charges static electricity
  • electric charges are generated when the measuring member C and the liquid LQ come into contact with each other.
  • electric charges are generated due to friction between the base material 21 exposed in the opening 22 and the liquid LQ.
  • electric charges may be generated due to friction between the light shielding film 23 and the liquid LQ.
  • the generated charge is stored in the light-shielding film 23, that is, the state where the light-shielding film 23 is charged is left unattended, at least a part of the light-shielding film 23 may be damaged by, for example, discharge.
  • the shape of the opening 22 changes or a hole is formed in a part of the light shielding film 23, the measurement accuracy using the measurement member C may be reduced.
  • the present embodiment it is possible to suppress the measurement member C (light shielding film 23) from being charged by grounding the light shielding film 23. Therefore, it is possible to suppress the deterioration (damage) of the light shielding film 23.
  • components such as the liquid immersion member 4 formed of the metal material of the exposure apparatus EX are grounded, the components and the light shielding film 23 are grounded by grounding the light shielding film 23 as in the present embodiment. And the discharge between the components and the light shielding film 23 can be suppressed. Note that not all of the components formed of the metal material of the exposure apparatus EX may be grounded. For example, the liquid immersion member 4 may not be grounded.
  • the control device 5 After the measurement using the measurement member C is completed, the control device 5 starts exposure of the substrate P.
  • the controller 5 exposes the exposure light EL emitted from the illumination system IL in a state where the immersion space LS is formed so that the optical path of the exposure light EL between the last optical element 10 and the substrate P is filled with the liquid LQ.
  • the mask M is illuminated with.
  • the exposure light EL that passes through the mask M illuminates the projection optical system PL and the liquid LQ in the immersion space LS.
  • the exposure light EL that has passed through the mask M and the projection optical system PL is emitted from the emission surface 9.
  • the exposure light EL emitted from the emission surface 9 is applied to the substrate P through the liquid LQ in the immersion space LS. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.
  • the exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while moving the mask M and the substrate P synchronously in a predetermined scanning direction.
  • the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction
  • the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction.
  • the control device 5 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction.
  • the substrate P is exposed by irradiating the substrate P with the exposure light EL through the projection optical system PL and the liquid LQ while moving the mask M in the Y-axis direction.
  • the control device 5 exposes the substrate P through the liquid LQ based on the measurement result using the measurement member C.
  • the control device 5 adjusts the exposure condition based on the measurement result of the aerial image of the projection optical system PL measured using the measurement member C, and exposes the substrate P under the adjusted exposure condition.
  • the exposure conditions include, for example, at least one of irradiation conditions of the exposure light EL and movement conditions of the substrate stage 2 (substrate P) with respect to the projection region PR.
  • the grounding of the light shielding film 23 can suppress the deterioration of the light shielding film 23 or the change in the shape of the opening 22 defined by the light shielding film 23. Therefore, it is possible to suppress a decrease in measurement accuracy using the measurement member C, and it is possible to suppress the occurrence of defective exposure and the generation of defective devices.
  • the measurement members Cb and Cc mounted on the measurement stage 3 may be grounded.
  • the measurement member Cb constitutes a part of the illuminance unevenness measurement system 19 that can measure the illuminance unevenness of the exposure light EL as disclosed in, for example, US Pat. No. 4,465,368.
  • the measurement member Cc has a reference mark measured by the alignment system 20 capable of measuring the alignment mark of the substrate P as disclosed in, for example, US Pat. No. 5,493,403.
  • the measurement member Cb is a wavefront as disclosed in, for example, an irradiation measurement system (illuminance measurement system) disclosed in, for example, US Patent Application Publication No. 2002/0061469, and in, for example, European Patent No. 1079223. It may constitute a part of a measurement system that measures the exposure light EL of the exposure light EL, such as an aberration measurement system.
  • the shape of the measurement member Cb in the XY plane is substantially circular.
  • the measurement member Cb includes a base material that can transmit the exposure light EL, and a conductive light shielding film 41 that is formed on the base material and defines an opening 40 through which the exposure light EL can enter through the liquid LQ. .
  • the opening 40 is substantially circular.
  • the measurement stage 3 has the holding portion 15 that holds the plate member S so as to be releasable, and the conductive member 24 contacts the plate member S.
  • the measurement stage 3 and the plate member S may be integrated. In this case, for example, as shown in FIG. 7, the conductive member 24 may come into contact with the upper surface F3 of the measurement stage 3B.
  • the conductive member 24B may be provided on at least a part of the side surface 27, for example, like the measurement member C2 shown in FIG. In FIG. 8, the protrusion 28B of the conductive member 24B protrudes from the side surface 27 in each of the + Y direction and the ⁇ Y direction. Further, like the measurement member C3 illustrated in FIG. 9, the conductive member 24C may be provided on at least a part of the lower surface 26. In FIG. 9, the protruding portion 28C of the conductive member 24C protrudes from the lower surface 26 in the ⁇ Z direction.
  • the light shielding film 23 is grounded by the projections 28B and 28C coming into contact with the measurement stage 3 (plate member S).
  • the light shielding film 23 is provided so as to be in contact with the upper surface 25 of the base material 21, but a predetermined film may be disposed between the base material 21 and the light shielding film 23.
  • the predetermined film may be, for example, a film for improving the adhesion between the base material 21 and the light shielding film 23, or may be a light shielding film different from the light shielding film 23.
  • a predetermined film may be disposed between the base material 21 and the conductive members 24B and 24C.
  • the surface of the base material 21 may be a surface of quartz glass (or fluorite), or a surface of quartz glass (or fluorite). It may be a concept including the surface of a predetermined film covering the film.
  • FIG. 10 is a perspective view showing an example of the measuring member C4 according to the second embodiment.
  • the measuring member C4 is connected to at least a part of the base material 21, the conductive light shielding film 23 that is formed on the base material 21 and defines the opening 22, and the light shielding film 23 is grounded.
  • a conductive member 24D is a conductive film provided on the base material 21.
  • the conductive member 24D is appropriately referred to as a conductive film 24D.
  • the conductive film 24D is provided on at least a part of the side surface 27. In the present embodiment, the conductive film 24D is disposed on the first side surface 27A and the second side surface 27B. In the present embodiment, the conductive film 24 ⁇ / b> D is in contact with the base material 21. A predetermined film may be disposed between the conductive film 24D and the base material 21.
  • the conductive film 24D may be disposed on at least one of the third side surface 27C and the fourth side surface 27D.
  • the conductive film 24E may be provided on a part of the second side surface 27B, or may be provided on a part of the fourth side surface 27D.
  • the conductive film 24E may be provided not on the entire first side surface 27A but on a part of the first side surface 27A, or not on the entire surface of the third side surface 27C but on a part of the third side surface 27C. May be.
  • FIG. 12 is a side sectional view showing a state in which the measurement member C4 (C5) is held by the holding unit 13.
  • the measurement stage 3 has a holding portion 15 that holds the plate member Sb.
  • the measurement stage 3 having the holding unit 13 and the holding unit 15 and the plate member Sb are formed of metal, for example, conductive ceramics. Further, the measurement stage 3 and the plate member Sb may be formed of other conductive metals such as titanium. Further, the measurement stage 3 and the plate member Sb may be formed of different metal materials.
  • the plate member Sb has a grounding portion 45 for grounding the light shielding film 23 of the measuring member C4 (C5) held by the holding portion 15.
  • the ground portion 45 is disposed on the inner side surface 30b of the plate member Sb.
  • the ground portion 45 is disposed so as to protrude from the inner side surface 30b toward the center of the opening 29b of the plate member Sb.
  • the ground part 45 is in contact with the conductive film 24D (24E). Thereby, the light shielding film 23 is grounded.
  • the measurement stage 3 and the plate member Sb may be integrated.
  • the ground portion 45B may be arranged on the inner surface 47 of the opening 46 of the measurement stage 3C on which the measurement member C4 (C5) can be arranged.
  • a process of forming a light shielding film 23 on the upper surface 25 of the substrate 21 is executed.
  • a chromium (Cr) film having light shielding properties and conductivity is formed on the upper surface 25 by, for example, sputtering.
  • a process of forming the opening 22 in the light shielding film 23 is executed. For example, a part of the light shielding film 23 is removed by using a photolithography method and an etching method. Thereby, an opening 22 is formed in the light shielding film 23.
  • a protective film (mask member) 48 is formed so as to cover at least part of the opening 22 and the light shielding film 23.
  • the conductive film 24 ⁇ / b> D is connected to the light shielding film 23 on at least a part of the side surface 27 of the base material 21. It is formed.
  • a conductive film 24D is formed by forming a chromium film on the side surface 27 by at least one of a vapor deposition method and a sputtering method.
  • the protective film 48 is removed, whereby the measuring member C4 is manufactured.
  • the conductive film 24 ⁇ / b> F may be formed on at least a part of the lower surface 26 of the base material 21 as in the measurement member C ⁇ b> 6 illustrated in FIG.
  • the holding part 13 functions as a ground part in contact with the conductive film 24F.
  • the protrusion part 28F is provided in at least one part of the base material 21F, and the electrically conductive film 24F may be arrange
  • FIG. 17 is a perspective view showing an example of the measuring member C8 according to the third embodiment
  • FIG. 18 is a side sectional view. 17 and 18, the measurement member C8 includes a base material 21, a light shielding film 23 formed on the base material 21 to define the opening 22, a conductive member 24 for grounding the light shielding film 23, and the light shielding film 23. And a liquid repellent film 50 that is liquid repellent with respect to the liquid LQ.
  • the liquid repellent film 50 is insulative. In the present embodiment, the liquid repellent film 50 can transmit the exposure light EL. In the present embodiment, the liquid repellent film 50 is disposed so as to cover at least a part of the upper surface 23 ⁇ / b> A of the light shielding film 23 and the opening 22. The liquid repellent film 50 may not be disposed in the opening 22.
  • the liquid repellent film 50 includes an amorphous fluororesin as disclosed in, for example, International Publication No. 2005/055296.
  • the liquid repellent film 50 is formed by “Cytop” manufactured by Asahi Glass Co., Ltd.
  • the liquid-repellent film 50 is, for example, “Vertrel® NC”, “Teflon® AF”, “Zonyl® TC” manufactured by Dupont, “Novec® EGC” manufactured by 3M, “Substance” manufactured by Merck, “Fluorosurf” manufactured by Fluoro Technology, It can also be formed by “Marvel Coat” manufactured by Hishoe Chemical Co., Ltd.
  • the liquid repellent film 50 may not be able to transmit the exposure light EL.
  • the liquid repellent film 50 may not transmit the exposure light EL.
  • the liquid repellent film 50 is disposed so as not to cover the conductive member 24, but may be disposed so as to cover the conductive member 24.
  • At least a part of the upper surface FCh of the measurement member C8 includes the surface of the liquid repellent film 50.
  • the surface of the liquid repellent film 50 is in contact with the liquid LQ in the immersion space LS. Since at least a part of the upper surface FCh is the surface of the liquid repellent film 50, the measuring member C8 can satisfactorily form the immersion space LS between the upper surface FCh and the last optical element 10 and the liquid immersion member 4. . Further, after the immersion space LS has retreated from the upper surface FCh, the liquid LQ is suppressed from remaining on the upper surface FCh.
  • a measuring member C9 shown in FIG. 19 is a modification of the measuring member C8.
  • the measurement member C9 includes the conductive film 24D described with reference to FIG. 10, and the liquid repellent film 50 is disposed so as to cover the light shielding film 23 connected to the conductive film 24D.
  • the upper surface FCh of the measurement member C8 (C9) that can face the emission surface 9 may include both the surface of the light shielding film 23 and the surface of the liquid repellent film 50.
  • the liquid repellent film 50 may be disposed on at least a part of the periphery of the opening 22 or may be disposed so as to surround the opening 22. Further, the liquid repellent film 50 is applied to at least a part of the periphery of the opening 22 so that the exposure light EL emitted from the emission surface 9 is not irradiated to the liquid repellent film 50 and is irradiated to the light shielding film 23 including the opening 22. It may be arranged.
  • FIG. 20 is a side sectional view showing an example of the measuring member C10 according to the fourth embodiment.
  • the measuring member C10 has a light shielding film 23J formed on the base material 21.
  • the light shielding film 23 ⁇ / b> J includes a first light shielding film 231 disposed on the upper surface 25 of the substrate 21 and a second light shielding film 232 that covers at least a part of the first light shielding film 231.
  • the first light shielding film 231 defines the first opening 221 and the second light shielding film 232 defines the second opening 222.
  • the second opening 222 is larger than the first opening 221.
  • the second opening 222 may be substantially the same size as the first opening 221 or may be smaller than the first opening 221.
  • the exposure light EL emitted from the emission surface 9 is incident on the first and second openings 221 and 222.
  • the exposure light EL that has entered the first and second openings 221 and 222 can pass through the substrate 21.
  • the first light shielding film 231 includes a material different from that of the second light shielding film 232.
  • the first light shielding film 231 is made of chromium (Cr).
  • the second light shielding film 232 is made of platinum (Pt).
  • the first light shielding film 231 may be formed of platinum, and the second light shielding film 232 may be formed of chromium. Note that the first light shielding film 231 and the second light shielding film 232 may be formed of the same material.
  • the light shielding film 23J is formed of two light shielding films, the first light shielding film 231 and the second light shielding film 232, the transmission of light can be sufficiently suppressed.
  • the conductive member 24 is connected to the second light shielding film 232, but may be connected to the first light shielding film 231. Further, at least a part of the conductive member 24 may be sandwiched between the first light shielding film 231 and the second light shielding film 232.
  • the conductive film 24K may be formed so as to be connected to the first light shielding film 231 as in the measurement member C11 illustrated in FIG.
  • the conductive film 24 ⁇ / b> L may be formed so as to be connected to the second light shielding film 232.
  • a liquid repellent film may be formed so as to cover the first light shielding film 231 and the second light shielding film 232.
  • a liquid repellent film may be formed so as to cover the openings 221 and 222, or a liquid repellent film may be formed so that the exposure light EL is not irradiated.
  • FIG. 23 is a diagram illustrating an example of the measurement member C13 according to the third embodiment.
  • the measuring member C13 includes a base material 21, a light shielding film 23 formed on the base material 21, a liquid repellent film 50, and an insulating film 70 provided between the light shielding film 23 and the liquid repellent film 50. And have. At least a part of the upper surface FCm of the measuring member C13 includes the surface of the liquid repellent film 50.
  • An opening 71 is formed in a part of the insulating film 70.
  • the insulating film 70 defines the opening 71.
  • the opening 22 of the light shielding film 23 is disposed inside the opening 71 of the insulating film 70.
  • the insulating film 70 may cover the opening 22.
  • the liquid repellent film 50 is disposed inside the opening 22, but the liquid repellent film 50 is not disposed inside the opening 22, and the insulating film 70 is disposed inside the opening 22. May be.
  • the insulating film 70 may be disposed inside the opening 22 so as to be in contact with the base material 21.
  • the upper surface FCm of the measurement member C13 that can face the emission surface 9 may include both the surface of the insulating film 70 and the surface of the liquid repellent film 50.
  • the liquid repellent film 50 is formed so that the exposure light EL from the emission surface 9 is irradiated to the opening 22 (light shielding film 23) through the insulating film 70 and the liquid repellent film 50 is not irradiated with the exposure light EL. May be.
  • the insulating film 70 includes silicon dioxide (SiO 2 ).
  • silicon dioxide includes SiO 2 formed by a wet film forming method.
  • the adhesion between the liquid repellent film 50 and the insulating film 70 is high.
  • the adhesion between the light shielding film 23 and the insulating film 70 is high. Adhesion to the liquid repellent film 50 can be enhanced by the insulating film 70 containing fine particles made of SiO 2 . Even if the insulating film 70 includes fine particles made of magnesium fluoride (MgF 2 ) or calcium fluoride (CaF 2 ), the adhesion to the liquid repellent film 50 can be improved.
  • the liquid repellent film 50 may not be provided on the insulating film 70.
  • the light transmissive film 70 formed on the light shielding film 23 may not be insulating. In the first to fourth embodiments described above, the light transmissive film 70 may be formed on the light shielding film so as to cover the light shielding film.
  • the light shielding film 23 is formed of chromium.
  • a material other than chromium may be used.
  • the light shielding film 23 may be formed of at least one of gold, platinum, palladium, rhodium, ruthenium, iridium, tantalum, niobium, titanium, hafnium, zirconium, and nickel.
  • one of the first light-shielding film 231 and the second light-shielding film 232 is chromium and the other is platinum. Of course, it is made of another conductive material. May be.
  • at least one of the first light-shielding film 231 and the second light-shielding film 232 may be formed of at least one of gold, palladium, rhodium, ruthenium, iridium, tantalum, niobium, titanium, hafnium, zirconium, and nickel. Good.
  • the light shielding film 23 may include a plurality of metals having light shielding properties.
  • the light shielding film 23 may be made of an alloy.
  • the light shielding film 23 may include an insulating material such as a synthetic resin as long as it is light-shielding with respect to the exposure light EL and conductive.
  • the light shielding film 23 may include a so-called conductive resin.
  • FIG. 24 is a side sectional view showing an example of the measurement stage 3 that holds the plate member Sc according to the sixth embodiment.
  • the measurement stage 3 having the holding part 13 and the holding part 15 and the plate member Sc are formed of metal, for example, conductive ceramics.
  • the measurement stage 3 and the plate member Sc may be formed of other conductive metals such as titanium.
  • the measurement stage 3 and the plate member Sc may be formed of different metal materials.
  • a conductive member (24 or the like) that contacts the light shielding film 23 is provided, and the light shielding film 23 is grounded by contacting the conductive member and the measurement stage 3 (plate member S). It was decided. As shown in FIG. 24, the conductive member of the measurement member C14 may be omitted.
  • the plate member Sc includes a ground portion 45 ⁇ / b> C that contacts the light shielding film 23 of the measurement member C ⁇ b> 14 held by the holding portion 13. By doing so, the light shielding film 23 can be grounded.
  • the measurement member (C or the like) is mounted on the measurement stage 3, but may be mounted on the substrate stage 2.
  • some measurement members may be mounted on the substrate stage 2 and some measurement members may be mounted on the measurement stage 3.
  • the optical path on the exit side (image plane side) of the terminal optical element 10 of the projection optical system PL is filled with the liquid LQ.
  • this is disclosed in International Publication No. 2004/019128.
  • liquid LQ water is used as the liquid LQ, but a liquid other than water may be used.
  • the liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable.
  • a fluorine-based liquid such as hydrofluoroether (HFE), perfluorinated polyether (PFPE), or fomblin oil can be used.
  • various fluids such as a supercritical fluid can be used as the liquid LQ.
  • the substrate P in each of the above embodiments not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.
  • the exposure apparatus EX in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.
  • stepper step-and-repeat type projection exposure apparatus
  • a reduced image of the second pattern may be partially exposed to the first pattern using the projection optical system and may be collectively exposed on the substrate P (stitch method). Lump exposure equipment).
  • the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially overlapped and transferred on the substrate P, and the substrate P is sequentially moved.
  • two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is substantially formed by one scanning exposure.
  • the present invention can be applied to an exposure apparatus that performs double exposure simultaneously.
  • the present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.
  • the exposure apparatus EX may be a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in, for example, US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like.
  • the type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD).
  • the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.
  • the position information of each stage is measured using an interferometer system including a laser interferometer.
  • an interferometer system including a laser interferometer.
  • the present invention is not limited to this.
  • a scale diffiffraction grating provided in each stage You may use the encoder system which detects this.
  • a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used.
  • a variable shaping mask also called an electronic mask, an active mask, or an image generator
  • a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.
  • the exposure apparatus provided with the projection optical system PL has been described as an example.
  • the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL.
  • an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.
  • an exposure apparatus (lithography system) that exposes a line-and-space pattern on a substrate P by forming interference fringes on the substrate P.
  • the present invention can also be applied.
  • the exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including the above-described components so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy.
  • various optical systems are adjusted to achieve optical accuracy
  • various mechanical systems are adjusted to achieve mechanical accuracy
  • various electrical systems are Adjustments are made to achieve electrical accuracy.
  • the assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus.
  • the exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.
  • a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device.
  • Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

La présente invention concerne un élément de mesure utilisé pour un appareil d'exposition servant à exposer un substrat à de la lumière d'exposition à travers un liquide. L'élément de mesure comprend : une base, pouvant transmettre la lumière d'exposition ; un film conducteur de blocage de lumière, qui est formé sur la base, et qui définit une ouverture dans laquelle peut entrer la lumière d'exposition à travers le liquide ; et un élément conducteur, qui est connecté à au moins une partie du film de blocage de lumière dans le but de mettre à la masse le film de blocage de lumière.
PCT/JP2011/063139 2010-06-10 2011-06-08 Elément de mesure, dispositif de platine, appareil d'exposition, procédé d'exposition, et procédé de fabrication du dispositif WO2011155529A1 (fr)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2015025637A1 (fr) * 2013-08-23 2015-02-26 シャープ株式会社 Dispositif de conversion photoélectrique et procédé permettant de fabriquer ce dernier
JP2017083913A (ja) * 2017-02-14 2017-05-18 株式会社ニコン 液浸露光装置の部材およびその製造方法

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Publication number Priority date Publication date Assignee Title
JP2005268759A (ja) * 2004-02-19 2005-09-29 Nikon Corp 光学部品及び露光装置
JP2006019585A (ja) * 2004-07-02 2006-01-19 Advanced Lcd Technologies Development Center Co Ltd 露光装置およびその方法ならびに基板処理装置
WO2006115186A1 (fr) * 2005-04-25 2006-11-02 Nikon Corporation Procédé d’exposition, appareil d’exposition et procédé de fabrication de dispositif
JP2007165852A (ja) * 2005-10-14 2007-06-28 Taiwan Semiconductor Manufacturing Co Ltd 液浸リソグラフィ方法及びそのシステム
JP2007180450A (ja) * 2005-12-28 2007-07-12 Canon Inc 露光装置

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Publication number Priority date Publication date Assignee Title
JP2005268759A (ja) * 2004-02-19 2005-09-29 Nikon Corp 光学部品及び露光装置
JP2006019585A (ja) * 2004-07-02 2006-01-19 Advanced Lcd Technologies Development Center Co Ltd 露光装置およびその方法ならびに基板処理装置
WO2006115186A1 (fr) * 2005-04-25 2006-11-02 Nikon Corporation Procédé d’exposition, appareil d’exposition et procédé de fabrication de dispositif
JP2007165852A (ja) * 2005-10-14 2007-06-28 Taiwan Semiconductor Manufacturing Co Ltd 液浸リソグラフィ方法及びそのシステム
JP2007180450A (ja) * 2005-12-28 2007-07-12 Canon Inc 露光装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015025637A1 (fr) * 2013-08-23 2015-02-26 シャープ株式会社 Dispositif de conversion photoélectrique et procédé permettant de fabriquer ce dernier
US9876125B2 (en) 2013-08-23 2018-01-23 Sharp Kabushiki Kaisha Photoelectric conversion device and method for manufacturing same
JP2017083913A (ja) * 2017-02-14 2017-05-18 株式会社ニコン 液浸露光装置の部材およびその製造方法

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