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WO2011026129A3 - Agencements de retour par la terre pour radiofréquence (rf) - Google Patents

Agencements de retour par la terre pour radiofréquence (rf) Download PDF

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Publication number
WO2011026129A3
WO2011026129A3 PCT/US2010/047379 US2010047379W WO2011026129A3 WO 2011026129 A3 WO2011026129 A3 WO 2011026129A3 US 2010047379 W US2010047379 W US 2010047379W WO 2011026129 A3 WO2011026129 A3 WO 2011026129A3
Authority
WO
WIPO (PCT)
Prior art keywords
ground return
radio frequency
substrate
return arrangement
support structure
Prior art date
Application number
PCT/US2010/047379
Other languages
English (en)
Other versions
WO2011026129A2 (fr
Inventor
Rajinder Dhindsa
Akira Koshishi
Alexei Marakhtanov
Original Assignee
Lam Research Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=43628710&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2011026129(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to KR1020217000342A priority Critical patent/KR102219924B1/ko
Priority to KR1020217004951A priority patent/KR102240849B1/ko
Priority to KR1020177031995A priority patent/KR20170125419A/ko
Priority to KR1020197024878A priority patent/KR102233437B1/ko
Priority to KR1020127005375A priority patent/KR101854922B1/ko
Priority to KR1020217008661A priority patent/KR102285582B1/ko
Priority to KR1020197024870A priority patent/KR102164678B1/ko
Priority to KR1020187012209A priority patent/KR20180049208A/ko
Priority to SG2012008280A priority patent/SG178286A1/en
Priority to KR1020207028516A priority patent/KR102201934B1/ko
Application filed by Lam Research Corporation filed Critical Lam Research Corporation
Priority to JP2012527106A priority patent/JP5745519B2/ja
Priority to CN201080037830.1A priority patent/CN102484063B/zh
Publication of WO2011026129A2 publication Critical patent/WO2011026129A2/fr
Publication of WO2011026129A3 publication Critical patent/WO2011026129A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32807—Construction (includes replacing parts of the apparatus)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Cette invention concerne un agencement de retour par la terre pour radiofréquence (RF) conçu pour fournir un chemin de retour RF à faible impédance à un courant RF dans une chambre de traitement d'une chambre de traitement par plasma lors du traitement d'un substrat. L'agencement de retour par la terre pour RF comprend une série d'anneaux de confinement configurée pour entourer un volume de chambre confiné qui est configuré pour entretenir un plasma pour la gravure du substrat au cours du traitement du substrat. L'agencement de retour par la terre pour RF comprend en outre une structure de support d'électrode inférieure. L'agencement de retour par la terre pour RF comprend par ailleurs un composant à contact RF, qui fournit un contact RF entre la série d'anneaux de confinement et la structure de support d'électrode inférieure de telle sorte que le chemin de retour RF à faible impédance facilite le retour du courant RF vers une source RF.
PCT/US2010/047379 2009-08-31 2010-08-31 Agencements de retour par la terre pour radiofréquence (rf) WO2011026129A2 (fr)

Priority Applications (12)

Application Number Priority Date Filing Date Title
CN201080037830.1A CN102484063B (zh) 2009-08-31 2010-08-31 射频(rf)接地返回装置
KR1020197024870A KR102164678B1 (ko) 2009-08-31 2010-08-31 무선 주파수 (ｒｆ) 접지 복귀 장치들
KR1020177031995A KR20170125419A (ko) 2009-08-31 2010-08-31 무선 주파수 (ｒｆ) 접지 복귀 장치들
KR1020197024878A KR102233437B1 (ko) 2009-08-31 2010-08-31 무선 주파수 (ｒｆ) 접지 복귀 장치들
KR1020127005375A KR101854922B1 (ko) 2009-08-31 2010-08-31 무선 주파수 (ｒｆ) 접지 복귀 장치들
KR1020217008661A KR102285582B1 (ko) 2009-08-31 2010-08-31 무선 주파수 (ｒｆ) 접지 복귀 장치들
SG2012008280A SG178286A1 (en) 2009-08-31 2010-08-31 Radio frequency (rf) ground return arrangements
KR1020217000342A KR102219924B1 (ko) 2009-08-31 2010-08-31 무선 주파수 (ｒｆ) 접지 복귀 장치들
KR1020187012209A KR20180049208A (ko) 2009-08-31 2010-08-31 무선 주파수 (ｒｆ) 접지 복귀 장치들
KR1020207028516A KR102201934B1 (ko) 2009-08-31 2010-08-31 무선 주파수 (ｒｆ) 접지 복귀 장치들
KR1020217004951A KR102240849B1 (ko) 2009-08-31 2010-08-31 무선 주파수 (ｒｆ) 접지 복귀 장치들
JP2012527106A JP5745519B2 (ja) 2009-08-31 2010-08-31 高周波（ｒｆ）接地帰還構成

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23867009P 2009-08-31 2009-08-31
US61/238,670 2009-08-31

Publications (2)

Publication Number Publication Date
WO2011026129A2 WO2011026129A2 (fr) 2011-03-03
WO2011026129A3 true WO2011026129A3 (fr) 2011-06-16

Family

ID=43628710

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/047379 WO2011026129A2 (fr) 2009-08-31 2010-08-31 Agencements de retour par la terre pour radiofréquence (rf)

Country Status (7)

Country Link
US (4) US9779916B2 (fr)
JP (1) JP5745519B2 (fr)
KR (9) KR20180049208A (fr)
CN (1) CN102484063B (fr)
SG (1) SG178286A1 (fr)
TW (1) TWI527114B (fr)
WO (1) WO2011026129A2 (fr)

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KR102164678B1 (ko) 2020-10-12
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SG178286A1 (en) 2012-03-29
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US11791140B2 (en) 2023-10-17
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