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WO2011016369A1 - Pneumatic levitation-type substrate conveying device - Google Patents

Pneumatic levitation-type substrate conveying device Download PDF

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Publication number
WO2011016369A1
WO2011016369A1 PCT/JP2010/062668 JP2010062668W WO2011016369A1 WO 2011016369 A1 WO2011016369 A1 WO 2011016369A1 JP 2010062668 W JP2010062668 W JP 2010062668W WO 2011016369 A1 WO2011016369 A1 WO 2011016369A1
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WO
WIPO (PCT)
Prior art keywords
substrate
air
transport
support
state
Prior art date
Application number
PCT/JP2010/062668
Other languages
French (fr)
Japanese (ja)
Inventor
繁 川岸
泰人 池田
Original Assignee
シャープ株式会社
株式会社オーク製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社, 株式会社オーク製作所 filed Critical シャープ株式会社
Priority to JP2011525859A priority Critical patent/JP5250113B2/en
Priority to CN2010800349474A priority patent/CN102470998A/en
Publication of WO2011016369A1 publication Critical patent/WO2011016369A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present invention relates to an air floating substrate transport apparatus, and more particularly to an air floating substrate transport apparatus that rotates a substrate within the apparatus.
  • the substrate support apparatus described in Japanese Patent Application Laid-Open No. 2008-147293 includes an X-direction moving device, a ⁇ -direction rotating device, an air levitation device, and the like.
  • the temperature of the air supplied to the air levitation device is kept constant, thereby suppressing the temperature change of the substrate to prevent the expansion and contraction of the substrate and improving the processing accuracy of the substrate processing. .
  • the air levitation apparatus is disposed at a predetermined interval in a direction orthogonal to the substrate transport direction. This is because the substrate is transported by the robot arm when the substrate is carried into or out of the substrate support device.
  • the robot arm has a comb-like arm, and the air levitation device interferes with the robot arm when the substrate is loaded or unloaded by arranging the air levitation device at an interval larger than the width of the teeth. To prevent it.
  • the substrate is rotated by a ⁇ direction rotation device in order to perform alignment processing. At this time, the substrate is rotated while the substrate is levitated by the air levitation device. However, since the air levitation device is arranged at an interval as described above, air is injected onto the rotating substrate. There are places that are not attached.
  • the present invention has been made in view of the above problems, and suppresses the generation of cracks or scratches on the substrate caused by the substrate contacting the air levitation device when the substrate is rotated while the substrate is levitated.
  • An object of the present invention is to provide an air levitation type substrate transfer device capable of improving the yield of products.
  • the air levitation type substrate transport device is a device for transporting a substrate in a state of being floated by spraying air onto a rectangular substrate from below.
  • a plurality of support portions that are arranged in parallel with each other at a predetermined interval in a direction orthogonal to the transport direction, and which blows air and maintains the substrate in a levitated state.
  • a transport unit that sends the substrate floating above the support unit in the transport direction.
  • the air levitation type substrate transfer device includes a drive unit that rotates the substrate sent to a predetermined position by the transfer unit around the center of the substrate while floating above the support unit.
  • An auxiliary support portion that supports the substrate at a height when the substrate is floated at least at a part of a position between adjacent support portions through which corner portions of the substrate pass when the substrate rotates at the predetermined position. Is provided.
  • the corner portion of the substrate when the substrate is rotated in a floating state, the corner portion of the substrate can be supported by the auxiliary support portion at a position where the air between the support portions is not ejected. Therefore, it is possible to suppress the occurrence of deflection at the corner portion of the substrate and the support of the end portion of the substrate being inclined. As a result, it is possible to suppress the occurrence of cracks or scratches on the substrate due to the substrate coming into contact with the support portion, and to improve the product yield.
  • the substrate is transported at a position between the support portions and through which the corner portion of the substrate passes when the substrate rotates at the predetermined position.
  • An auxiliary support portion is provided at a position farthest from the center of the substrate in a direction orthogonal to the direction.
  • the auxiliary support portion supports the substrate at a height in a state where the substrate is levitated by the support portion. In this case, it is possible to prevent the bending of the corner portion of the substrate and to support the end portion of the substrate with an inclination.
  • the auxiliary support part is movable in the vertical direction.
  • the auxiliary support portion when the substrate is rotated, the auxiliary support portion is positioned at a height for supporting the substrate, and the auxiliary support portion is lowered so as to be separated from the substrate except when the substrate is rotated. Therefore, it is possible to prevent the robot arm that transports the substrate from interfering with the auxiliary support portion when the substrate is carried into or out of the air floating substrate transport apparatus.
  • the auxiliary support portion when the substrate is rotated, the auxiliary support portion is raised so that the auxiliary support portion is positioned at a height for supporting the substrate, and after the rotation of the substrate is completed, A control unit for lowering the auxiliary support unit so as to be separated from the control unit.
  • the control unit since the operation of the drive unit and the operation of the auxiliary support unit can be synchronized by the control unit, the substrate can be processed efficiently and the processing tact time can be shortened.
  • the auxiliary support portion may have a ball bear that supports the substrate by a sphere that can rotate in all directions.
  • the corners of the substrate can be reliably supported by supporting the lower surfaces of the corners of the substrate with the vertices of the balls of the ball bear. Therefore, even when the rotation speed when rotating the substrate increases, the substrate can be reliably prevented from coming into contact with the upper portion of the support portion.
  • the auxiliary support portion may have an air nozzle that blows air from below to support the substrate.
  • the substrate corner may bend without being in direct contact with the substrate, and the end portion of the substrate is inclined and supported. Can be prevented. Therefore, it is possible to prevent scratches or contact marks from being generated on the lower surface of the substrate.
  • the corner portion of the substrate when the substrate is rotated in a floating state, the corner portion of the substrate can be supported by the auxiliary support portion at a position where the air between the support portions is not ejected. Therefore, it is possible to suppress the occurrence of deflection at the corner portion of the substrate and the support of the end portion of the substrate being inclined. As a result, it is possible to prevent the substrate from being cracked or damaged due to the substrate coming into contact with the support portion, and to improve the product yield.
  • FIG. 1 It is a perspective view which shows the structure of the air floating type board
  • FIG. 5 is a view of an end portion on a short side of the substrate of FIG.
  • FIG. 5 is a view of the VI part of FIG. 4 as viewed from the front side in the substrate transport direction when the auxiliary support part is not provided.
  • It is a top view which shows the state in which the board
  • It is a perspective view which shows the structure of the ball bear which concerns on the same embodiment.
  • FIG. 1 is a perspective view showing a configuration of an air levitation type substrate transfer apparatus according to Embodiment 1 of the present invention.
  • FIG. 2 is a perspective view showing a state where the substrate is transferred to the processing unit in the air floating substrate transfer apparatus according to the first embodiment of the present invention.
  • the substrate 10 is transported in the direction of the arrow shown in FIG. 2 so that the state shown in FIG. 1 is changed to the state shown in FIG.
  • the air floating substrate transport apparatus 1 causes a rectangular substrate 10 to float by blowing air onto the upper surface of a base 2 having a rectangular parallelepiped shape.
  • a plurality of support portions 3 are provided to maintain the state.
  • the rectangle includes a rectangle and a square.
  • Each of the plurality of support portions 3 is spaced apart from each other in a direction orthogonal to the transport direction of the substrate 10 so as not to interfere with a robot arm (not shown) that carries the substrate 10 into the air floating substrate transport apparatus 1. They are arranged in parallel. Further, each of the plurality of support portions 3 is disposed with a slight gap therebetween in the transport direction of the substrate 10. In the present embodiment, the support portions 3 are arranged in 7 rows in the transport direction of the substrate 10 and 10 rows in the direction orthogonal to the 10 transport direction of the substrate. However, the placement of the support portions 3 is not limited thereto.
  • a guide unit 5 including a guide rail and a ball screw (not shown) that serve as a movement path of the holding unit 4 that holds the substrate 10 outside the support unit 3 arranged on the outermost side. Is formed.
  • the two guide portions 5 are formed so as to face each other and are arranged in parallel with the transport direction of the substrate 10.
  • a holding unit 4 that holds the substrate 10 is disposed on the upper surface of each guide unit 5, and in this embodiment, the corners of the substrate 10 are held and transported by the two holding units 4. Since the two holding portions 4 can translate and move in the transport direction, the substrate 10 can be transported while maintaining the alignment of the substrate 10.
  • a conveyance unit 6 is constituted by the guide unit 5 and the holding unit 4. The substrate 10 floating above the support unit 3 is sent by the transport unit 6 in the transport direction.
  • the two pillars 11 having a quadrangular prism shape are arranged so as to face both side surfaces on the long side of the base 2 on the front end side in the transport direction of the substrate 10 in the air floating substrate transport apparatus 1.
  • a transverse beam 12 having a quadrangular prism shape is disposed on the upper side of each column 11 so as to bridge between the two columns 11.
  • a processing unit 13 is provided on the side surface of the horizontal beam 12 to irradiate and expose light downward. Since the processing unit 13 is formed to be longer than the width of the substrate 10, the entire width direction of the substrate 10 conveyed below the processing unit 13 can be processed at a time.
  • the substrate 10 is sent to a predetermined position by the transport unit 6.
  • a drive unit 9 that rotates the substrate 10 around the center of the substrate 10 as a rotation center is disposed below the center position of the substrate 10 sent to a predetermined position.
  • the drive unit 9 includes a chucking 7 for attracting the lower surface of the substrate 10 to grasp the substrate 10, a shaft portion 8 in which a pipe for sucking or ejecting air from the upper surface of the chucking 7 is formed, And a drive control unit (not shown) connected to the unit 8.
  • an opening (not shown) is formed which communicates with the pipe of the shaft 8 and serves as an air passage.
  • the driving unit 9 slightly descends below the substrate 10 and stands by.
  • the drive unit 9 is controlled by the drive control unit so that the upper surface of the chucking 7 rises until it contacts the lower surface of the substrate 10.
  • the chucking 7 of the present embodiment is formed from two linear portions orthogonal to each other.
  • the shape of the chucking 7 is not limited to this, and a plane for grasping the substrate 10 may be formed on the upper surface. .
  • the drive unit 9 grasps the substrate 10 and rotates, the substrate 10 is rotated in a state of floating above the support unit 3.
  • the ball bear 14 which is an auxiliary support part which supports the board
  • the substrate 10 carried into the air levitation substrate transport apparatus 1 is maintained in a state of being floated by receiving the air ejected from the support portion 3 on the lower surface. As shown in FIG. 2, the substrate 10 is transported to a predetermined position below the processing unit 13 by the transport unit 6.
  • FIG. 3A is a plan view showing a state in which the substrate is processed at a predetermined position.
  • FIG. 3B is a plan view illustrating a state in which the substrate is rotated by the driving unit.
  • FIG. 3C is a plan view showing a state in which the substrate is rotated by 90 ° by the driving unit.
  • a photo-curable resist is formed on the upper surface of the substrate 10 and it is necessary to expose the peripheral portion of the substrate 10. Therefore, first, as shown in FIG. 3A, both end portions 15 on the long side of the substrate 10 are exposed by light irradiated from the processing unit 13. When exposing, both ends 15 may be exposed simultaneously, or each end may be exposed separately.
  • both ends on the short side of the substrate 10 are rotated by the drive unit 9 while being floated above the support unit 3.
  • the rotation by the drive unit 9 is completed in a state where the substrate 10 is rotated by 90 °.
  • both ends on the short side of the substrate 10 are arranged in parallel with the processing unit 13 shown in FIG. 2, both ends on the short side of the substrate 10 are irradiated by light emitted from the processing unit 13. Can be exposed.
  • both ends on the short side of the substrate 10 may be exposed simultaneously, or each end may be exposed separately.
  • FIG. 4 is a plan view showing a state in which the substrate is slightly rotated by the drive unit. As shown in FIG. 4, when the substrate 10 is slightly rotated from the state where the substrate 10 is arranged so that the longitudinal direction of the substrate 10 coincides with the direction orthogonal to the conveyance direction of the substrate 10, Two regions are generated at both ends on the short side.
  • the first region 16 is a region where the support portion 3 exists below the substrate 10 and air is blown from the support portion 3 to the lower surface of the substrate 10.
  • the second region 17 is a region where the support portion 3 does not exist below the substrate 10 and air is not sprayed from the support portion 3 to the lower surface of the substrate 10. As described above, the first region 16 and the second region 17 are generated at both ends on the short side of the substrate 10, whereby the substrate 10 is supported by blowing air at both ends on the short side of the substrate 10. Is unbalanced.
  • FIG. 5 is a view of the short side end of the substrate of FIG.
  • the height at which the substrate 10 is supported differs depending on the position and is inclined depending on the amount of air 18 ejected from the support portion 3. Yes.
  • air is not sprayed onto the lower surface of the substrate 10 in the second region 17, deflection due to the weight of the corner of the substrate 10 is likely to occur.
  • the substrate 10 having a long side length of about 3 m and a thickness of 0.7 mm is lifted by 0.5 mm by the support portion 3, a deflection of about 1 mm to 2 mm occurs.
  • FIG. 6 is a view of the VI portion of FIG. 4 as viewed from the front side in the substrate transport direction when the auxiliary support portion is not provided.
  • the substrate 10 when the substrate 10 is rotated in a state where the short-side end portion of the substrate 10 is supported while being inclined, or in a state where the corner portion of the substrate 10 is bent. First, the tip of the substrate 10 comes into contact with the upper part of the support 3. In this case, the substrate 10 is cracked or scratched on the lower surface of the substrate 10.
  • the substrate 10 rotates once from the state where the substrate 10 is transported to the predetermined position, and the longitudinal direction of the substrate 10 and the transport direction of the substrate 10 It is rotated by the drive unit 9 so that the direction orthogonal to is coincident with the direction.
  • FIG. 7 is a plan view showing a state where the substrate that has been processed is rotated. As shown in FIG. 7, the short-side end of the substrate 10 immediately before the substrate 10 is placed so that the longitudinal direction of the substrate 10 coincides with the direction orthogonal to the transport direction of the substrate 10. The first region 16 and the second region 17 are generated in each of the above.
  • the support of the substrate 10 by the blowing of air is unbalanced at both ends on the short side of the substrate 10, so that the substrate 10 is supported depending on the position. Different heights are inclined. Further, in the second region 17, since air is not sprayed on the lower surface of the substrate 10, deflection is likely to occur due to the weight of the corner of the substrate 10.
  • FIG. 8 is a plan view showing a position where the ball bear is provided. As shown in FIG. 8, in the air floating substrate transfer apparatus 1 of the present embodiment, the position of the second region 17 of the substrate 10 shown in FIG. 4 and the second region 17 of the substrate 10 shown in FIG. A ball bear 14 as an auxiliary support portion is disposed at the position.
  • the reason why the ball bear 14 is arranged at the above position is as follows. While the above position rotates the substrate 10, the air is applied to the lower surface of the corner portion of the substrate 10 in the region where the degree of unbalance of the amount of air blown to the lower surface of the end portion of the substrate 10 is the largest. This is because the position cannot be sprayed. Specifically, in the short section of the short side of the substrate 10 where the above position is located, air between the support portions 3 is ejected in a region where the buoyancy due to air changes abruptly. This is because the position is not.
  • the end of the short side of the substrate 10 is supported most inclined at the above position.
  • the short-side end of the substrate 10 is farthest from the center of the substrate 10 fixedly supported by the driving unit 9, the degree of freedom of deformation is large and bending is likely to occur.
  • the ball bear 14 is a position between the support portions 3, and the substrate 10 is among the positions through which the corners of the substrate 10 pass when the substrate 10 rotates at the predetermined position. Is disposed at a position farthest from the center of the substrate 10 in a direction perpendicular to the transport direction.
  • the ball bear 14 is a distance vector from the center of the substrate 10 when the substrate 10 is rotated at the predetermined position to the position between the support portions 3 and the corner portion of the substrate 10 passes.
  • the component in the direction orthogonal to the conveyance direction of the substrate 10 is provided at the position where it becomes the largest.
  • the ball bears 14 are arranged in the four second regions 17, but the position and quantity of the ball bears 14 are not limited to this.
  • the ball bear 14 is provided so as to support the substrate 10 at at least a part of the position between the adjacent support portions 3 through which corners of the substrate 10 pass when the substrate 10 rotates at a predetermined position. Just do it.
  • FIG. 9 is a perspective view showing the configuration of the ball bear according to the present embodiment.
  • the ball bear 14 according to the present embodiment includes a sphere 19 that contacts the lower surface of the substrate 10 to support the substrate 10, and a storage unit 20 that holds the sphere 19 so as to be rotatable in all directions. It has. The heights of the vertices of all the spheres 19 held by the storage unit 20 are arranged to be the same.
  • the sphere 19 is held by the housing portion 20 so as to be in rolling contact with the substrate 10 when it comes into contact with the rotating substrate 10.
  • the accommodating part 20 is formed on the upper surface of the flat support plate 21.
  • nine accommodating portions 20 and spheres 19 are formed on the upper surface of the support plate 21, but the number of accommodating portions 20 and spheres 19 that are formed is not limited thereto.
  • a shaft portion 22 is connected to the lower surface of the support plate 21.
  • the shaft portion 22 is connected to a guide portion 23 formed with a guide rail and a ball screw (not shown).
  • the shaft portion 22 is connected along the guide portion 23 so as to be slidable in the vertical direction.
  • the ball screw of the guide unit 23 is connected by a wiring 24 to a stepping motor 25 that is a control unit that controls driving of the ball screw.
  • FIG. 10A is a side view showing a state in which the ball bear is supporting the corner portion of the substrate.
  • FIG. 10B is a side view showing a state where the ball bear is waiting.
  • the ball bear 14 is adjusted so that the height of the top of the sphere 19 coincides with the height of the lower surface of the substrate 10 when the substrate 10 is floated. Is done.
  • the ball screw of the guide portion 23 is driven by the stepping motor 25 and the shaft portion 22 is raised.
  • the stepping motor 25 stops.
  • the ball bear 14 of the present embodiment supports the substrate 10 at a height in a state where the substrate 10 is floated.
  • the ball bear 14 stands by at a position below the lower surface of the substrate 10 in a state where the substrate 10 is lifted. In this waiting state, the ball bear 14 is adjusted so as not to be positioned in the avoidance area 26 where the robot arm or the like enters.
  • the ball screw of the guide portion 23 is driven by the stepping motor 25, and the shaft portion 22 is lowered.
  • the stepping motor 25 stops.
  • the ball bear 14 is raised so as to be disposed at the support position of the substrate 10, and after the rotation of the substrate 10 is completed, The ball bear 14 is lowered so as to be separated from the substrate 10.
  • the operation of the drive unit 9 and the operation of the ball bear 14 are synchronized.
  • the substrate 10 is processed efficiently, and the processing time of the substrate 10 is shortened.
  • the corner portion of the substrate 10 is reliably supported. Therefore, even when the rotation speed when rotating the substrate 10 is increased, the substrate 10 is reliably prevented from coming into contact with the upper portion of the support portion 3.
  • FIG. 11 is a side view showing a state in which the substrate is rotated using an air nozzle as an auxiliary support portion. Since it is the same as that of Embodiment 1 about structures other than an auxiliary
  • an air nozzle 31 is provided as an auxiliary support portion.
  • the air nozzle 31 is composed of a nozzle part 27 that is a jet outlet for ejecting air 29 and a pipe part 28 in which an air pipe is formed.
  • the piping unit 28 is connected to a pump (not shown) that supplies air 29.
  • the air nozzle 31 is disposed outside the avoidance region 26 between the adjacent support portions 3. Therefore, it is not always necessary to provide the air nozzle 31 with a moving means for moving the air nozzle 31 in the vertical direction, so that the apparatus cost can be reduced.
  • the substrate 10 can be supported without directly contacting the lower surface of the substrate 10 by spraying and supporting the air 29 on the lower surface of the substrate 10 by the air nozzle 31. Therefore, it is possible to prevent scratches and contact marks from being generated on the lower surface of the substrate 10.
  • FIG. 12A is a side view showing a state where the substrate is supported by a modified air nozzle.
  • FIG. 12B is a side view showing a state in which the modified air nozzle is on standby.
  • the air nozzle 32 which is a modification includes a nozzle portion 27 which is an ejection port for ejecting air 29 and a piping portion 28 in which an air piping is formed.
  • the piping unit 28 is connected to a pump (not shown) that supplies air 29.
  • the piping part 28 is connected to a guide part 30 in which a guide rail and a ball screw (not shown) are formed.
  • the piping part 28 is slidably connected along the guide part 30 and is moved in the vertical direction by a stepping motor 25 which is a control part.
  • the modified air nozzle 32 is arranged in the vicinity of the side surface of the support portion 3 through which the substrate 10 passes first in the rotation direction of the substrate 10. Further, the nozzle portion 27 is directed upward in the middle between the support portions 3. In this manner, by arranging the air nozzle 32, the air 29 can be sprayed to a location where the buoyancy due to the air ejected from the support portion 3 is minimized. Therefore, it is possible to effectively prevent the bending of the corner portion of the substrate 10 and the tilted support of the short side end portion of the substrate 10.
  • the air nozzle 32 is moved down away from the substrate 10. Specifically, the pipe part 28 slides along the guide part 30 by the stepping motor 25 which is a control part, and is lowered until the tip of the nozzle part 27 is located outside the avoidance region 26. At this time, the ejection of the air 29 from the nozzle part 27 is stopped. Thus, except when the substrate 10 is rotated, the air nozzle 32 is kept on standby, so that the robot arm and the air nozzle 32 can be prevented from interfering with each other.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

A pneumatic levitation-type substrate conveying device (1) comprises: support sections (3) arranged side-by-side with predetermined spacings therebetween in the direction perpendicular to the conveyance direction and jetting air to maintain a substrate (10) in a levitated position; and a conveyance section (6) for conveying in the conveyance direction the substrate (10) which is being levitated above the support sections (3). The pneumatic levitation-type substrate conveying device (1) is provided with a drive section (9) which , while the substrate (10) having been sent to a predetermined position by the conveyance section (6) is being levitated above the support sections (3), rotates the substrate (10) about the center thereof. Ball-equipped supports (14) for supporting the substrate (10) are provided to at least some of the positions between adjacent support sections (3), said positions being those through which the corners of the substrate (10) pass when the substrate (10) is rotated at the predetermined position. The configuration prevents the substrate (10) from being cracked or damaged, and, as a result, the throughput of products is improved.

Description

エア浮上式基板搬送装置Air floating substrate transfer device
　本発明は、エア浮上式基板搬送装置に関し、特に、装置内で基板を回転させるエア浮上式基板搬送装置に関する。 The present invention relates to an air floating substrate transport apparatus, and more particularly to an air floating substrate transport apparatus that rotates a substrate within the apparatus.
　近年、液晶パネルに使用されるガラス基板などを処理する装置には、ガラス基板の下方から高圧のエアを噴付けることによりガラス基板を浮上させた状態で支持するエア浮上式基板支持装置が使用されている。このような基板支持装置を開示した先行文献として、特開２００８－１４７２９３号公報がある。 In recent years, an air levitation type substrate support device that supports a glass substrate in a floating state by spraying high-pressure air from below the glass substrate has been used as an apparatus for processing a glass substrate used in a liquid crystal panel. ing. As a prior document disclosing such a substrate support apparatus, there is JP 2008-147293 A.
　特開２００８－１４７２９３号公報に記載された基板支持装置は、Ｘ方向移動装置、θ方向回転装置およびエア浮上装置などを備えている。この基板支持装置においては、エア浮上装置に供給されるエアの温度を一定に維持することにより、基板の温度変化を抑制して基板の伸縮を防止し、基板処理の加工精度を向上させている。 The substrate support apparatus described in Japanese Patent Application Laid-Open No. 2008-147293 includes an X-direction moving device, a θ-direction rotating device, an air levitation device, and the like. In this substrate support device, the temperature of the air supplied to the air levitation device is kept constant, thereby suppressing the temperature change of the substrate to prevent the expansion and contraction of the substrate and improving the processing accuracy of the substrate processing. .
特開２００８－１４７２９３号公報JP 2008-147293 A
　一般に、エア浮上装置は、特開２００８－１４７２９３号公報の図１に記載されているように、基板の搬送方向に対して直交する方向において、所定の間隔を置いて配置されている。これは、基板が基板支持装置に搬入、または基板支持装置から払出される際に、基板がロボットアームにより搬送されるためである。ロボットアームは、櫛歯状のアームを有しており、その歯の幅より大きな間隔でエア浮上装置を配置することにより、基板の搬入または払出しの際に、エア浮上装置とロボットアームとが干渉することを防止している。 Generally, as described in FIG. 1 of Japanese Patent Application Laid-Open No. 2008-147293, the air levitation apparatus is disposed at a predetermined interval in a direction orthogonal to the substrate transport direction. This is because the substrate is transported by the robot arm when the substrate is carried into or out of the substrate support device. The robot arm has a comb-like arm, and the air levitation device interferes with the robot arm when the substrate is loaded or unloaded by arranging the air levitation device at an interval larger than the width of the teeth. To prevent it.
　特許文献１に記載の基板支持装置においては、アライメント処理するために、θ方向回転装置により基板が回転させられている。このとき、エア浮上装置により基板が浮上させられた状態で回転させらているが、上記のようにエア浮上装置が間隔を置いて配置されているため、回転中の基板には、エアが噴付けられていない箇所が存在する。 In the substrate support device described in Patent Document 1, the substrate is rotated by a θ direction rotation device in order to perform alignment processing. At this time, the substrate is rotated while the substrate is levitated by the air levitation device. However, since the air levitation device is arranged at an interval as described above, air is injected onto the rotating substrate. There are places that are not attached.
　基板の角部周辺にエアが噴付けられていないときには、基板の角部周辺に、基板の自重によるたわみが発生する。また、基板の端部において、エアの噴き付けがアンバランスになっている場合、基板の端部は傾斜して支持される。基板の角部にたわみが発生している、または、基板の端部が傾斜して支持されている状態において、基板が回転させられると、基板の角部とエア浮上装置の上部とが接触する場合がある。この場合、基板に割れまたは傷が発生して不良品となるため、製品の歩留まりが低下する問題があった。 When the air is not sprayed around the corner of the substrate, deflection due to the weight of the substrate occurs around the corner of the substrate. Further, when the air spraying is unbalanced at the end portion of the substrate, the end portion of the substrate is supported while being inclined. When the substrate is rotated in a state where the corner of the substrate is bent or when the end of the substrate is inclined and supported, the corner of the substrate contacts the upper part of the air levitation device. There is a case. In this case, since the substrate is cracked or scratched and becomes a defective product, there is a problem that the yield of the product is lowered.
　本発明は、上記の問題点に鑑みなされたものであって、基板を浮上させた状態で基板を回転させる際に基板がエア浮上装置に接触することによる、基板の割れまたは傷の発生を抑制して製品の歩留まりの向上を図れる、エア浮上式基板搬送装置を提供することを目的とする。 The present invention has been made in view of the above problems, and suppresses the generation of cracks or scratches on the substrate caused by the substrate contacting the air levitation device when the substrate is rotated while the substrate is levitated. An object of the present invention is to provide an air levitation type substrate transfer device capable of improving the yield of products.
　本発明に基づくエア浮上式基板搬送装置は、矩形状の基板に下方からエアを噴きつけることにより浮上させた状態で、基板を搬送する装置である。このエア浮上式基板搬送装置においては、搬送方向に対して直交する方向に所定の間隔を置いて互いに並列に配置され、エアを噴出して基板を浮上させた状態に維持する複数の支持部と、支持部の上方に浮上している基板を搬送方向に送る搬送部とを備えている。また、エア浮上式基板搬送装置は、搬送部により所定の位置に送られた基板を、支持部の上方に浮上させた状態で、基板の中心を回転中心として回転させる駆動部を備えている。上記所定の位置において基板が回転する際の基板の角部が通過する、隣り合う支持部同士の間の位置の少なくとも一部に、基板の浮上した状態における高さに基板を支持する補助支持部が設けられている。 The air levitation type substrate transport device according to the present invention is a device for transporting a substrate in a state of being floated by spraying air onto a rectangular substrate from below. In this air levitation type substrate transport apparatus, a plurality of support portions that are arranged in parallel with each other at a predetermined interval in a direction orthogonal to the transport direction, and which blows air and maintains the substrate in a levitated state. A transport unit that sends the substrate floating above the support unit in the transport direction. In addition, the air levitation type substrate transfer device includes a drive unit that rotates the substrate sent to a predetermined position by the transfer unit around the center of the substrate while floating above the support unit. An auxiliary support portion that supports the substrate at a height when the substrate is floated at least at a part of a position between adjacent support portions through which corner portions of the substrate pass when the substrate rotates at the predetermined position. Is provided.
　上記の構成によると、基板を浮上させた状態で回転させる際に、支持部同士の間のエアが噴出されない位置において、基板の角部を補助支持部で支持することができる。よって、基板の角部にたわみが発生すること、および、基板の端部が傾斜して支持されることを抑制することができる。その結果、基板が支持部に接触することによる基板の割れまたは傷の発生を抑制して、製品の歩留まりの向上を図ることができる。 According to the above configuration, when the substrate is rotated in a floating state, the corner portion of the substrate can be supported by the auxiliary support portion at a position where the air between the support portions is not ejected. Therefore, it is possible to suppress the occurrence of deflection at the corner portion of the substrate and the support of the end portion of the substrate being inclined. As a result, it is possible to suppress the occurrence of cracks or scratches on the substrate due to the substrate coming into contact with the support portion, and to improve the product yield.
　好ましくは、エア浮上式基板搬送装置には、支持部同士の間の位置であって、上記の所定の位置において基板が回転する際に基板の角部が通過する位置の中で、基板の搬送方向に直交する方向において、基板の中心から最も離れた位置に補助支持部が設けられている。 Preferably, in the air levitation type substrate transport apparatus, the substrate is transported at a position between the support portions and through which the corner portion of the substrate passes when the substrate rotates at the predetermined position. An auxiliary support portion is provided at a position farthest from the center of the substrate in a direction orthogonal to the direction.
　この場合、基板の端部に最もアンバランスにエアが噴きつけられる位置において、エアが噴き付けられていない基板の角部を補助支持部により支持することができるため、基板の角部にたわみが発生すること、および、基板の端部を傾斜して支持することを効果的に抑制することができる。 In this case, since the corner of the substrate where air is not sprayed can be supported by the auxiliary support portion at the position where the air is sprayed most unbalanced to the edge of the substrate, the corner of the substrate is not bent. Generation | occurrence | production and tilting and supporting the edge part of a board | substrate can be suppressed effectively.
　好ましくは、補助支持部は、支持部により基板が浮上させられた状態における高さで基板を支持する。この場合、基板の角部にたわみが発生すること、および、基板の端部を傾斜して支持することを防止することができる。 Preferably, the auxiliary support portion supports the substrate at a height in a state where the substrate is levitated by the support portion. In this case, it is possible to prevent the bending of the corner portion of the substrate and to support the end portion of the substrate with an inclination.
　好ましくは、補助支持部は上下方向に移動可能である。この場合、基板を回転させる際には、基板を支持する高さに補助支持部は位置し、基板を回転させる際以外には、基板から離れるように補助支持部は下降している。よって、基板がエア浮上式基板搬送装置に搬入または装置から払出される際に、基板を搬送するロボットアームと補助支持部とが干渉することを防止することができる。 Preferably, the auxiliary support part is movable in the vertical direction. In this case, when the substrate is rotated, the auxiliary support portion is positioned at a height for supporting the substrate, and the auxiliary support portion is lowered so as to be separated from the substrate except when the substrate is rotated. Therefore, it is possible to prevent the robot arm that transports the substrate from interfering with the auxiliary support portion when the substrate is carried into or out of the air floating substrate transport apparatus.
　好ましくは、エア浮上式基板搬送装置においては、基板を回転させる際に、基板を支持する高さに補助支持部が位置するように補助支持部を上昇させ、基板の回転が完了した後に、基板から離れるように補助支持部を下降させる、制御部を備えている。この場合、制御部により駆動部の動作と補助支持部の動作とを同期させることができるため、効率よく基板を処理して、処理タクトを短くすることができる。 Preferably, in the air levitation type substrate transport apparatus, when the substrate is rotated, the auxiliary support portion is raised so that the auxiliary support portion is positioned at a height for supporting the substrate, and after the rotation of the substrate is completed, A control unit for lowering the auxiliary support unit so as to be separated from the control unit. In this case, since the operation of the drive unit and the operation of the auxiliary support unit can be synchronized by the control unit, the substrate can be processed efficiently and the processing tact time can be shortened.
　本発明に基づくエア浮上式基板搬送装置においては、補助支持部が、全方向に回転可能な球により基板を支持するボールベアを有するようにしてもよい。この場合、基板の角部の下面をボールベアの球の頂点で支持することにより、確実に基板の角部を支持することができる。よって、基板を回転させる際の回転速度が大きくなった場合にも、基板が支持部の上部に接触することを確実に防止することができる。 In the air levitation type substrate transport apparatus according to the present invention, the auxiliary support portion may have a ball bear that supports the substrate by a sphere that can rotate in all directions. In this case, the corners of the substrate can be reliably supported by supporting the lower surfaces of the corners of the substrate with the vertices of the balls of the ball bear. Therefore, even when the rotation speed when rotating the substrate increases, the substrate can be reliably prevented from coming into contact with the upper portion of the support portion.
　または、補助支持部が、前記基板に下方からエアを噴きつけて前記基板を支持するエアノズルを有するようにしてもよい。この場合、エアノズルからエアを基板の角部の下面に噴きつけることにより、基板に直接接触することなく、基板の角部にたわみが発生すること、および、基板の端部が傾斜して支持されることを防止することができる。よって、基板の下面に傷または接触痕が発生することを防止することができる。 Alternatively, the auxiliary support portion may have an air nozzle that blows air from below to support the substrate. In this case, by blowing air from the air nozzle onto the lower surface of the corner portion of the substrate, the substrate corner may bend without being in direct contact with the substrate, and the end portion of the substrate is inclined and supported. Can be prevented. Therefore, it is possible to prevent scratches or contact marks from being generated on the lower surface of the substrate.
　本発明により、基板を浮上させた状態で回転させる際に、支持部同士の間のエアが噴出されない位置において、基板の角部を補助支持部で支持することができる。よって、基板の角部にたわみが発生すること、および、基板の端部が傾斜して支持されることを抑制することができる。その結果、基板が支持部に接触することによる基板の割れまたは傷の発生を防止して、製品の歩留まりの向上を図ることができる。 According to the present invention, when the substrate is rotated in a floating state, the corner portion of the substrate can be supported by the auxiliary support portion at a position where the air between the support portions is not ejected. Therefore, it is possible to suppress the occurrence of deflection at the corner portion of the substrate and the support of the end portion of the substrate being inclined. As a result, it is possible to prevent the substrate from being cracked or damaged due to the substrate coming into contact with the support portion, and to improve the product yield.
本発明の実施の形態１に係るエア浮上式基板搬送装置の構成を示す斜視図である。It is a perspective view which shows the structure of the air floating type board | substrate conveyance apparatus which concerns on Embodiment 1 of this invention. 同実施の形態に係るエア浮上式基板搬送装置において、基板が処理部に搬送された状態を示す斜視図である。It is a perspective view which shows the state by which the board | substrate was conveyed by the process part in the air levitation type substrate conveying apparatus which concerns on the embodiment. 基板が所定の位置で処理された状態を示す平面図である。It is a top view which shows the state by which the board | substrate was processed in the predetermined position. 駆動部により基板が回転させられている状態を示す平面図である。It is a top view which shows the state in which the board | substrate is rotated by the drive part. 駆動部により基板が９０°回転させられた状態を示す平面図である。It is a top view which shows the state by which the board | substrate was rotated 90 degrees by the drive part. 基板が駆動部により僅かに回転させられた状態を示す平面図である。It is a top view which shows the state in which the board | substrate was rotated slightly by the drive part. 図４の基板の短手側の端部を矢印Ｖから見た図である。FIG. 5 is a view of an end portion on a short side of the substrate of FIG. 補助支持部を設けていない場合における、図４のＶＩ部を基板の搬送方向の手前側から見た図である。FIG. 5 is a view of the VI part of FIG. 4 as viewed from the front side in the substrate transport direction when the auxiliary support part is not provided. 処理が完了した基板が回転させられている状態を示す平面図である。It is a top view which shows the state in which the board | substrate which completed the process is rotated. ボールベアを設ける位置を示した平面図である。It is the top view which showed the position which provides a ball bear. 同実施形態に係るボールベアの構成を示す斜視図である。It is a perspective view which shows the structure of the ball bear which concerns on the same embodiment. 基板の角部をボールベアが支持している状態を示す側面図である。It is a side view which shows the state in which the ball bear is supporting the corner | angular part of a board | substrate. ボールベアが待機している状態を示す側面図である。It is a side view which shows the state in which the ball bear is waiting. 補助支持部としてエアノズルを用いて、基板が回転させられている状態を示す側面図である。It is a side view which shows the state in which the board | substrate is rotated using an air nozzle as an auxiliary | assistant support part. 変形例のエアノズルにより基板が支持されている状態を示す側面図である。It is a side view which shows the state by which the board | substrate is supported by the air nozzle of a modification. 変形例のエアノズルが待機している状態を示す側面図である。It is a side view which shows the state which the air nozzle of a modification is waiting.
　以下、本発明の実施の形態１に係るエア浮上式基板搬送装置について、図を参照しながら説明する。 Hereinafter, an air levitation type substrate transfer apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings.
　実施の形態１
　図１は、本発明の実施の形態１に係るエア浮上式基板搬送装置の構成を示す斜視図である。図２は、本発明の実施の形態１に係るエア浮上式基板搬送装置において、基板が処理部に搬送された状態を示す斜視図である。本実施形態のエア浮上式基板搬送装置においては、図１に示す状態から図２に示す状態になるように、図２に示す矢印方向に基板１０が搬送される。 Embodiment 1
FIG. 1 is a perspective view showing a configuration of an air levitation type substrate transfer apparatus according to Embodiment 1 of the present invention. FIG. 2 is a perspective view showing a state where the substrate is transferred to the processing unit in the air floating substrate transfer apparatus according to the first embodiment of the present invention. In the air floating substrate transport apparatus of the present embodiment, the substrate 10 is transported in the direction of the arrow shown in FIG. 2 so that the state shown in FIG. 1 is changed to the state shown in FIG.
　図１，２に示すように、本発明の実施の形態１に係るエア浮上式基板搬送装置１は、直方体形状を有する土台２の上面に、エアを噴出して矩形状の基板１０を浮上させた状態に維持する複数の支持部３が設けられている。矩形には、長方形および正方形も含まれる。 As shown in FIGS. 1 and 2, the air floating substrate transport apparatus 1 according to the first embodiment of the present invention causes a rectangular substrate 10 to float by blowing air onto the upper surface of a base 2 having a rectangular parallelepiped shape. A plurality of support portions 3 are provided to maintain the state. The rectangle includes a rectangle and a square.
　複数の支持部３の各々は、エア浮上式基板搬送装置１に基板１０を搬入する図示しないロボットアームと干渉しないために、基板１０の搬送方向に直交する方向において、互いに所定の間隔を置いて並列に配置されている。また、複数の支持部３の各々は、基板１０の搬送方向において、互いに僅かな隙間をあけて配置されている。本実施形態においては、基板１０の搬送方向において７列、基板の１０搬送方向に直交する方向において１０行の支持部３を配置したが、支持部３の配置はこれに限られない。 Each of the plurality of support portions 3 is spaced apart from each other in a direction orthogonal to the transport direction of the substrate 10 so as not to interfere with a robot arm (not shown) that carries the substrate 10 into the air floating substrate transport apparatus 1. They are arranged in parallel. Further, each of the plurality of support portions 3 is disposed with a slight gap therebetween in the transport direction of the substrate 10. In the present embodiment, the support portions 3 are arranged in 7 rows in the transport direction of the substrate 10 and 10 rows in the direction orthogonal to the 10 transport direction of the substrate. However, the placement of the support portions 3 is not limited thereto.
　基板１０の搬送方向に直交する方向において、最も外側に配置された支持部３の外側に、基板１０を保持する保持部４の移動経路となる図示しないガイドレールおよびボールねじなどを含む案内部５が形成されている。２本の案内部５は、互いに対向するように形成され、基板１０の搬送方向に平行に配置されている。 In a direction orthogonal to the transport direction of the substrate 10, a guide unit 5 including a guide rail and a ball screw (not shown) that serve as a movement path of the holding unit 4 that holds the substrate 10 outside the support unit 3 arranged on the outermost side. Is formed. The two guide portions 5 are formed so as to face each other and are arranged in parallel with the transport direction of the substrate 10.
　それぞれの案内部５の上面に、基板１０を保持する保持部４が配置され、本実施形態では、２つの保持部４により基板１０の角部を保持して搬送している。２つの保持部４は、並進して搬送方向に移動することができるため、基板の１０のアライメントを維持しつつ、基板１０を搬送することができる。案内部５と保持部４とから搬送部６が構成されている。搬送部６により、支持部３の上方に浮上している基板１０が搬送方向に送られる。 A holding unit 4 that holds the substrate 10 is disposed on the upper surface of each guide unit 5, and in this embodiment, the corners of the substrate 10 are held and transported by the two holding units 4. Since the two holding portions 4 can translate and move in the transport direction, the substrate 10 can be transported while maintaining the alignment of the substrate 10. A conveyance unit 6 is constituted by the guide unit 5 and the holding unit 4. The substrate 10 floating above the support unit 3 is sent by the transport unit 6 in the transport direction.
　エア浮上式基板搬送装置１における基板１０の搬送方向先端側において、土台２の長辺側の両方の側面に対向するように、四角柱の形状を有する２本の支柱１１が配置されている。２本の支柱１１の間を橋渡しするように、四角柱の形状を有する横梁１２が、それぞれの支柱１１の上部に配置されている。 The two pillars 11 having a quadrangular prism shape are arranged so as to face both side surfaces on the long side of the base 2 on the front end side in the transport direction of the substrate 10 in the air floating substrate transport apparatus 1. A transverse beam 12 having a quadrangular prism shape is disposed on the upper side of each column 11 so as to bridge between the two columns 11.
　横梁１２の側面には、下方に向けて光を照射して露光させる処理部１３が設けられている。処理部１３は、基板１０の幅より長くなるように形成されているため、処理部１３の下方に搬送された基板１０の幅方向全体を一度に処理することができる。 A processing unit 13 is provided on the side surface of the horizontal beam 12 to irradiate and expose light downward. Since the processing unit 13 is formed to be longer than the width of the substrate 10, the entire width direction of the substrate 10 conveyed below the processing unit 13 can be processed at a time.
　処理部１３により基板１０を処理するために、基板１０は、搬送部６により所定の位置に送られる。所定の位置に送られた基板１０の中心位置の下方には、基板１０を基板１０の中心を回転中心として回転させる駆動部９が配置されている。駆動部９は、基板１０の下面を吸着して基板１０を把握するチャッキング７と、チャッキング７の上面からエアを吸引または噴射させるための配管が内部に形成された軸部８と、軸部８に接続された図示しない駆動制御部とから構成されている。 In order to process the substrate 10 by the processing unit 13, the substrate 10 is sent to a predetermined position by the transport unit 6. A drive unit 9 that rotates the substrate 10 around the center of the substrate 10 as a rotation center is disposed below the center position of the substrate 10 sent to a predetermined position. The drive unit 9 includes a chucking 7 for attracting the lower surface of the substrate 10 to grasp the substrate 10, a shaft portion 8 in which a pipe for sucking or ejecting air from the upper surface of the chucking 7 is formed, And a drive control unit (not shown) connected to the unit 8.
　チャッキング７の上面には、軸部８の上記配管と連通してエア用通過口となる図示しない開口部が形成されている。基板１０を吸引する際には、基板１０の下面とチャッキング７の上面が接触した状態で、開口部からエアが吸引される。基板１０の吸引を外す際には、開口部からエアが噴射される。基板１０の回転が終了した後、駆動部９は、僅かに基板１０の下方に下降して待機する。次に基板１０を回転させる際には、チャッキング７の上面が基板１０の下面に接触するまで上昇するように、駆動部９が駆動制御部により制御される。 On the upper surface of the chucking 7, an opening (not shown) is formed which communicates with the pipe of the shaft 8 and serves as an air passage. When the substrate 10 is sucked, air is sucked from the opening while the lower surface of the substrate 10 and the upper surface of the chucking 7 are in contact with each other. When removing the suction of the substrate 10, air is injected from the opening. After the rotation of the substrate 10 is completed, the driving unit 9 slightly descends below the substrate 10 and stands by. Next, when the substrate 10 is rotated, the drive unit 9 is controlled by the drive control unit so that the upper surface of the chucking 7 rises until it contacts the lower surface of the substrate 10.
　本実施形態のチャッキング７は、互いに直交する２本の直線部から形成されているが、チャッキング７の形状はこれに限られず、基板１０を把握する平面が上面に形成されていればよい。駆動部９が基板１０を把握して回転することにより、基板１０は、支持部３の上方に浮上した状態で回転させられる。 The chucking 7 of the present embodiment is formed from two linear portions orthogonal to each other. However, the shape of the chucking 7 is not limited to this, and a plane for grasping the substrate 10 may be formed on the upper surface. . When the drive unit 9 grasps the substrate 10 and rotates, the substrate 10 is rotated in a state of floating above the support unit 3.
　上記の所定の位置において基板１０が回転する際の基板１０の角部が通過する、隣り合う支持部３同士の間の位置の少なくとも一部に、基板１０を支持する補助支持部であるボールベア１４が設けられている。本実施形態におけるボールベア１４の配置については、後述する。 The ball bear 14 which is an auxiliary support part which supports the board | substrate 10 in at least one part of the position between adjacent support parts 3 through which the corner | angular part of the board | substrate 10 at the time of the board | substrate 10 rotating in said predetermined position passes. Is provided. The arrangement of the ball bears 14 in this embodiment will be described later.
　以下、本実施形態のボールベア１４を配置する目的を説明するために、エア浮上式基板搬送装置の動作について説明する。 Hereinafter, in order to explain the purpose of disposing the ball bear 14 of the present embodiment, the operation of the air floating substrate transfer apparatus will be described.
　図１に示すように、エア浮上式基板搬送装置１に搬入された基板１０は、支持部３から噴出されるエアを下面に受けて浮上した状態で維持される。図２に示すように、基板１０は、搬送部６により処理部１３の下方の所定の位置に搬送される。 As shown in FIG. 1, the substrate 10 carried into the air levitation substrate transport apparatus 1 is maintained in a state of being floated by receiving the air ejected from the support portion 3 on the lower surface. As shown in FIG. 2, the substrate 10 is transported to a predetermined position below the processing unit 13 by the transport unit 6.
　図３Ａは、基板が所定の位置で処理された状態を示す平面図である。図３Ｂは、駆動部により基板が回転させられている状態を示す平面図である。図３Ｃは、駆動部により基板が９０°回転させられた状態を示す平面図である。 FIG. 3A is a plan view showing a state in which the substrate is processed at a predetermined position. FIG. 3B is a plan view illustrating a state in which the substrate is rotated by the driving unit. FIG. 3C is a plan view showing a state in which the substrate is rotated by 90 ° by the driving unit.
　本実施形態では、基板１０の上面に光硬化性のレジストが形成されており、基板１０の周囲の端部を露光させる必要がある。そのため、まず、図３Ａに示すように、処理部１３から照射される光により、基板１０の長手側の両端部１５を露光する。露光する際には、両端部１５を同時に露光してもよいし、それぞれの端部を別々に露光してもよい。 In this embodiment, a photo-curable resist is formed on the upper surface of the substrate 10 and it is necessary to expose the peripheral portion of the substrate 10. Therefore, first, as shown in FIG. 3A, both end portions 15 on the long side of the substrate 10 are exposed by light irradiated from the processing unit 13. When exposing, both ends 15 may be exposed simultaneously, or each end may be exposed separately.
　両端部１５の露光が完了した後は、露光されていない短手側の両端部を露光する必要がある。そのため、図３Ｂに示すように、基板１０は、支持部３の上方に浮上させられた状態で、駆動部９により回転させられる。図３Ｃに示すように、基板１０が９０°回転させられた状態で、駆動部９による回転が終了する。この状態において、基板１０の短手側の両端部は、図２に示す処理部１３と平行に配置されているため、処理部１３から照射される光により、基板１０の短手側の両端部を露光することができる。露光する際に、基板１０の短手側の両端部を同時に露光してもよいし、それぞれの端部を別々に露光してもよい。 After the exposure of both ends 15 is completed, it is necessary to expose both ends on the short side that are not exposed. Therefore, as shown in FIG. 3B, the substrate 10 is rotated by the drive unit 9 while being floated above the support unit 3. As shown in FIG. 3C, the rotation by the drive unit 9 is completed in a state where the substrate 10 is rotated by 90 °. In this state, since both ends on the short side of the substrate 10 are arranged in parallel with the processing unit 13 shown in FIG. 2, both ends on the short side of the substrate 10 are irradiated by light emitted from the processing unit 13. Can be exposed. When exposing, both ends on the short side of the substrate 10 may be exposed simultaneously, or each end may be exposed separately.
　図４は、基板が駆動部により僅かに回転させられた状態を示す平面図である。図４に示すように、基板１０の長手方向と基板１０の搬送方向に直交する方向とが一致するように基板１０が配置されている状態から、僅かに基板１０を回転させると、基板１０の短手側の両端部には、それぞれ２つの領域が発生する。 FIG. 4 is a plan view showing a state in which the substrate is slightly rotated by the drive unit. As shown in FIG. 4, when the substrate 10 is slightly rotated from the state where the substrate 10 is arranged so that the longitudinal direction of the substrate 10 coincides with the direction orthogonal to the conveyance direction of the substrate 10, Two regions are generated at both ends on the short side.
　第１の領域１６は、基板１０の下方に支持部３が存在して、基板１０の下面に支持部３からエアが噴きつけられている領域である。第２の領域１７は、基板１０の下方に支持部３が存在せず、基板１０の下面に支持部３からエアが噴きつけられていない領域である。このように、第１領域１６と第２領域１７とが基板１０の短手側の両端部に発生することにより、基板１０の短手側の両端部において、エアの噴きつけによる基板１０の支持がアンバランスになっている。 The first region 16 is a region where the support portion 3 exists below the substrate 10 and air is blown from the support portion 3 to the lower surface of the substrate 10. The second region 17 is a region where the support portion 3 does not exist below the substrate 10 and air is not sprayed from the support portion 3 to the lower surface of the substrate 10. As described above, the first region 16 and the second region 17 are generated at both ends on the short side of the substrate 10, whereby the substrate 10 is supported by blowing air at both ends on the short side of the substrate 10. Is unbalanced.
　図５は、図４の基板の短手側の端部を矢印Ｖから見た図である。図５に示すように、基板１０の短手側の両端部においては、支持部３から噴出されるエア１８を受ける量の違いにより、位置によって基板１０が支持される高さが異なり傾斜している。また、第２領域１７には、基板１０の下面にエアが噴きつけられていないため、基板１０の角部の自重によるたわみが発生しやすい。たとえば、長辺の長さが約３ｍ、厚さが０．７ｍｍの基板１０を支持部３により０．５ｍｍ浮上させている場合、１ｍｍ～２ｍｍ程度のたわみが発生する。 FIG. 5 is a view of the short side end of the substrate of FIG. As shown in FIG. 5, at both ends of the short side of the substrate 10, the height at which the substrate 10 is supported differs depending on the position and is inclined depending on the amount of air 18 ejected from the support portion 3. Yes. Further, since air is not sprayed onto the lower surface of the substrate 10 in the second region 17, deflection due to the weight of the corner of the substrate 10 is likely to occur. For example, when the substrate 10 having a long side length of about 3 m and a thickness of 0.7 mm is lifted by 0.5 mm by the support portion 3, a deflection of about 1 mm to 2 mm occurs.
　図６は、補助支持部を設けていない場合における、図４のＶＩ部を基板の搬送方向の手前側から見た図である。図６に示すように基板１０の短手側の端部が傾斜して支持されている状態、または、基板１０の角部にたわみが発生している状態で、基板１０が回転させられた場合には、基板１０の先端部が支持部３の上部に接触する。この場合、基板１０に割れ、または、基板１０の下面に傷が発生する。 FIG. 6 is a view of the VI portion of FIG. 4 as viewed from the front side in the substrate transport direction when the auxiliary support portion is not provided. As shown in FIG. 6, when the substrate 10 is rotated in a state where the short-side end portion of the substrate 10 is supported while being inclined, or in a state where the corner portion of the substrate 10 is bent. First, the tip of the substrate 10 comes into contact with the upper part of the support 3. In this case, the substrate 10 is cracked or scratched on the lower surface of the substrate 10.
　基板１０の短手側の両端部の処理が終了した後、基板１０は、上記の所定の位置に基板１０が搬送された状態から１回転して、基板１０の長手方向と基板１０の搬送方向に直交する方向とが一致するように、駆動部９により回転させられる。 After the processing of both ends on the short side of the substrate 10 is completed, the substrate 10 rotates once from the state where the substrate 10 is transported to the predetermined position, and the longitudinal direction of the substrate 10 and the transport direction of the substrate 10 It is rotated by the drive unit 9 so that the direction orthogonal to is coincident with the direction.
　図７は、処理が完了した基板が回転させられている状態を示す平面図である。図７に示すように、基板１０の長手方向と基板１０の搬送方向に直交する方向とが一致するように、基板１０が配置される状態になる直前において、基板１０の短手側の端部のそれぞれには、第１領域１６および第２領域１７が発生する。 FIG. 7 is a plan view showing a state where the substrate that has been processed is rotated. As shown in FIG. 7, the short-side end of the substrate 10 immediately before the substrate 10 is placed so that the longitudinal direction of the substrate 10 coincides with the direction orthogonal to the transport direction of the substrate 10. The first region 16 and the second region 17 are generated in each of the above.
　この場合も図４に示した場合と同様に、基板１０の短手側の両端部においては、エアの噴きつけによる基板１０の支持がアンバランスになっているため、位置によって基板１０が支持される高さが異なり傾斜している。また、第２領域１７においては、基板１０の下面にエアが噴きつけられていないため、基板１０の角部の自重によりたわみが発生しやすい。 Also in this case, as in the case shown in FIG. 4, the support of the substrate 10 by the blowing of air is unbalanced at both ends on the short side of the substrate 10, so that the substrate 10 is supported depending on the position. Different heights are inclined. Further, in the second region 17, since air is not sprayed on the lower surface of the substrate 10, deflection is likely to occur due to the weight of the corner of the substrate 10.
　図８は、ボールベアを設ける位置を示した平面図である。図８に示すように、本実施形態のエア浮上式基板搬送装置１においては、図４に示した基板１０の第２領域１７の位置と、図７に示した基板１０の第２領域１７の位置に、補助支持部であるボールベア１４が配置されている。 FIG. 8 is a plan view showing a position where the ball bear is provided. As shown in FIG. 8, in the air floating substrate transfer apparatus 1 of the present embodiment, the position of the second region 17 of the substrate 10 shown in FIG. 4 and the second region 17 of the substrate 10 shown in FIG. A ball bear 14 as an auxiliary support portion is disposed at the position.
　上記の位置に、ボールベア１４が配置されている理由は、以下の通りである。上記の位置が、基板１０を回転させる間において、基板１０の端部の下面に噴きつけられるエア量のアンバランスの度合いが最も大きくなる領域の中で、基板１０の角部の下面にエアが噴きつけられない位置となるためである。具体的には、上記の位置が、基板１０の短手側の端部という短い区間において、エアによる浮力が急激に変化している領域の中で、支持部３同士の間のエアが噴出されていない位置となるからである。 The reason why the ball bear 14 is arranged at the above position is as follows. While the above position rotates the substrate 10, the air is applied to the lower surface of the corner portion of the substrate 10 in the region where the degree of unbalance of the amount of air blown to the lower surface of the end portion of the substrate 10 is the largest. This is because the position cannot be sprayed. Specifically, in the short section of the short side of the substrate 10 where the above position is located, air between the support portions 3 is ejected in a region where the buoyancy due to air changes abruptly. This is because the position is not.
　このため、基板１０の短手側の端部は、上記の位置において最も傾斜して支持されることになる。また、基板１０の短手側の端部は、駆動部９により固定支持されている基板１０の中心から最も離れているため、変形自由度が大きくたわみが発生しやすい。 For this reason, the end of the short side of the substrate 10 is supported most inclined at the above position. In addition, since the short-side end of the substrate 10 is farthest from the center of the substrate 10 fixedly supported by the driving unit 9, the degree of freedom of deformation is large and bending is likely to occur.
　よって本実施形態では、ボールベア１４が、支持部３同士の間の位置であって、上記の所定の位置において基板１０が回転する際に基板１０の角部が通過する位置の中で、基板１０の搬送方向に直交する方向において基板１０の中心から最も離れた位置に配置されている。 Therefore, in the present embodiment, the ball bear 14 is a position between the support portions 3, and the substrate 10 is among the positions through which the corners of the substrate 10 pass when the substrate 10 rotates at the predetermined position. Is disposed at a position farthest from the center of the substrate 10 in a direction perpendicular to the transport direction.
　言い換えると、ボールベア１４は、上記の所定の位置において基板１０が回転する際の基板１０の中心から、支持部３同士の間の位置でかつ基板１０の角部が通過する位置までの距離ベクトルにおいて、基板１０の搬送方向に直交する方向における成分が、最も大きくなる位置に設けられている。 In other words, the ball bear 14 is a distance vector from the center of the substrate 10 when the substrate 10 is rotated at the predetermined position to the position between the support portions 3 and the corner portion of the substrate 10 passes. The component in the direction orthogonal to the conveyance direction of the substrate 10 is provided at the position where it becomes the largest.
　ボールベア１４を上記の位置に配置することにより、基板１０の角部にたわみが発生すること、および、基板１０の短手側の端部が傾斜して支持されることを効果的に抑制することができる。その結果、基板１０の角部と支持部３の上部とが接触することを防ぐことができる。 By disposing the ball bear 14 at the above position, it is possible to effectively suppress the occurrence of deflection at the corner of the substrate 10 and the support of the substrate 10 in an inclined manner on the short side. Can do. As a result, it is possible to prevent the corner portion of the substrate 10 from contacting the upper portion of the support portion 3.
　本実施形態では、４箇所の第２領域１７にボールベア１４が配置されているが、ボールベア１４が配置される位置および数量はこれに限られない。ボールベア１４は、所定の位置において基板１０が回転する際の基板１０の角部が通過する、隣り合う支持部３同士の間の位置の少なくとも一部に、基板１０を支持するように設けられていればよい。 In the present embodiment, the ball bears 14 are arranged in the four second regions 17, but the position and quantity of the ball bears 14 are not limited to this. The ball bear 14 is provided so as to support the substrate 10 at at least a part of the position between the adjacent support portions 3 through which corners of the substrate 10 pass when the substrate 10 rotates at a predetermined position. Just do it.
　図９は、本実施形態に係るボールベアの構成を示す斜視図である。図９に示すように、本実施形態に係るボールベア１４は、基板１０の下面に接触して基板１０を支持する球１９と、球１９を全方向に回転可能なように保持する収容部２０とを備えている。収容部２０により保持された全ての球１９の頂点の高さは、同一になるように配置されている。また、球１９は、回転している基板１０と接触した際に、基板１０と転がり接触するように、収容部２０により保持されている。 FIG. 9 is a perspective view showing the configuration of the ball bear according to the present embodiment. As shown in FIG. 9, the ball bear 14 according to the present embodiment includes a sphere 19 that contacts the lower surface of the substrate 10 to support the substrate 10, and a storage unit 20 that holds the sphere 19 so as to be rotatable in all directions. It has. The heights of the vertices of all the spheres 19 held by the storage unit 20 are arranged to be the same. In addition, the sphere 19 is held by the housing portion 20 so as to be in rolling contact with the substrate 10 when it comes into contact with the rotating substrate 10.
　本実施形態では、球１９として、基板１０に傷が付きにくくするために、鋼球の表面に樹脂コーティングされているものが用いられているが、球１９として樹脂製の球が用いられてもよい。 In this embodiment, in order to make the board | substrate 10 hard to get a damage | wound as the sphere 19, what is resin-coated on the surface of a steel ball is used, but even if a resin sphere is used as the sphere 19 Good.
　収容部２０は、平板状の支持板２１の上面に形成されている。本実施形態では、収容部２０および球１９は、支持板２１の上面に９つ形成されているが、形成される収容部２０および球１９の数は、これに限られない。 The accommodating part 20 is formed on the upper surface of the flat support plate 21. In the present embodiment, nine accommodating portions 20 and spheres 19 are formed on the upper surface of the support plate 21, but the number of accommodating portions 20 and spheres 19 that are formed is not limited thereto.
　支持板２１の下面には、軸部２２が接続されている。軸部２２は、図示しないガイドレールおよびボールねじなどが形成された案内部２３に接続されている。軸部２２は、案内部２３に沿って、上下方向にスライドすることが可能なように接続されている。案内部２３のボールねじは、ボールねじの駆動を制御する制御部であるステッピングモータ２５と配線２４により接続されている。 A shaft portion 22 is connected to the lower surface of the support plate 21. The shaft portion 22 is connected to a guide portion 23 formed with a guide rail and a ball screw (not shown). The shaft portion 22 is connected along the guide portion 23 so as to be slidable in the vertical direction. The ball screw of the guide unit 23 is connected by a wiring 24 to a stepping motor 25 that is a control unit that controls driving of the ball screw.
　図１０Ａは、基板の角部をボールベアが支持している状態を示す側面図である。図１０Ｂは、ボールベアが待機している状態を示す側面図である。図１０Ａに示すように、基板１０が回転させられる際には、ボールベア１４は、基板１０の浮上した状態における基板１０の下面の高さに、球１９の頂点の高さが一致するように調節される。 FIG. 10A is a side view showing a state in which the ball bear is supporting the corner portion of the substrate. FIG. 10B is a side view showing a state where the ball bear is waiting. As shown in FIG. 10A, when the substrate 10 is rotated, the ball bear 14 is adjusted so that the height of the top of the sphere 19 coincides with the height of the lower surface of the substrate 10 when the substrate 10 is floated. Is done.
　具体的には、基板１０を回転させる際に、ステッピングモータ２５により案内部２３のボールねじが駆動され、軸部２２が上昇させられる。球１９の頂点の高さが、支持部３により浮上させられている基板１０の下面の高さと一致した時点で、ステッピングモータ２５が停止する。本実施形態のボールベア１４は、基板１０の浮上した状態における高さに基板１０を支持する。 Specifically, when the substrate 10 is rotated, the ball screw of the guide portion 23 is driven by the stepping motor 25 and the shaft portion 22 is raised. When the height of the apex of the sphere 19 coincides with the height of the lower surface of the substrate 10 that is levitated by the support portion 3, the stepping motor 25 stops. The ball bear 14 of the present embodiment supports the substrate 10 at a height in a state where the substrate 10 is floated.
　よって、基板１０の角部にたわみが発生すること、および、基板１０の短手側の端部を傾斜して支持することを防止することができる。ただし、ボールベア１４により基板１０の角部を支持して、基板１０と支持部３の上部とが接触することが防止できればよく、ボールベア１４により基板１０を必ずしも基板１０の浮上した状態における高さに支持する必要はない。 Therefore, it is possible to prevent the bending of the corner portion of the substrate 10 and the support of the substrate 10 with the inclined end on the short side. However, it is only necessary to support the corner portion of the substrate 10 with the ball bear 14 and prevent the substrate 10 and the upper portion of the support portion 3 from coming into contact with each other. There is no need to support it.
　図１０Ｂに示すように、基板１０が回転させられていないときには、ボールベア１４は、基板１０が浮上した状態における基板１０の下面より下方の位置において待機している。この待機している状態においては、ロボットアームなどが侵入してくる領域である回避領域２６にボールベア１４が位置しないように調整されている。 As shown in FIG. 10B, when the substrate 10 is not rotated, the ball bear 14 stands by at a position below the lower surface of the substrate 10 in a state where the substrate 10 is lifted. In this waiting state, the ball bear 14 is adjusted so as not to be positioned in the avoidance area 26 where the robot arm or the like enters.
　具体的には、基板１０の回転が完了した後に、ステッピングモータ２５により案内部２３のボールねじが駆動され、軸部２２が下降させられる。球１９の頂点の位置が、回避領域２６から外れた時点で、ステッピングモータ２５が停止する。 Specifically, after the rotation of the substrate 10 is completed, the ball screw of the guide portion 23 is driven by the stepping motor 25, and the shaft portion 22 is lowered. When the position of the apex of the sphere 19 deviates from the avoidance area 26, the stepping motor 25 stops.
　上記のように、制御部であるステッピングモータ２５によって、基板１０を回転させる際には、ボールベア１４が基板１０の支持位置に配置されるように上昇させされ、基板１０の回転が完了した後に、ボールベア１４が基板１０から離れるように下降させられる。このように、駆動部９の動作とボールベア１４の動作とが同期されている。その結果、効率よく基板１０が処理されて、基板１０の処理時間が短縮される。 As described above, when the substrate 10 is rotated by the stepping motor 25 which is the control unit, the ball bear 14 is raised so as to be disposed at the support position of the substrate 10, and after the rotation of the substrate 10 is completed, The ball bear 14 is lowered so as to be separated from the substrate 10. Thus, the operation of the drive unit 9 and the operation of the ball bear 14 are synchronized. As a result, the substrate 10 is processed efficiently, and the processing time of the substrate 10 is shortened.
　また、基板１０の角部の下面がボールベア１４の球１９の頂点で支持されるため、基板１０の角部は確実に支持される。よって、基板１０を回転させる際の回転速度が大きくなった場合にも、基板１０が支持部３の上部に接触することが確実に防止される。 Further, since the lower surface of the corner portion of the substrate 10 is supported by the apex of the sphere 19 of the ball bear 14, the corner portion of the substrate 10 is reliably supported. Therefore, even when the rotation speed when rotating the substrate 10 is increased, the substrate 10 is reliably prevented from coming into contact with the upper portion of the support portion 3.
　以下、本発明の実施の形態２に係るエア浮上式基板搬送装置について、図を参照しながら説明する。 Hereinafter, an air floating substrate transport apparatus according to Embodiment 2 of the present invention will be described with reference to the drawings.
　実施の形態２
　図１１は、補助支持部としてエアノズルを用いて、基板が回転させられている状態を示す側面図である。補助支持部以外の構成については、実施の形態１と同様であるため、説明を繰り返さない。図１１に示すように、本発明の実施の形態２に係るエア浮上式基板搬送装置では、補助支持部としてエアノズル３１が設けられている。 Embodiment 2
FIG. 11 is a side view showing a state in which the substrate is rotated using an air nozzle as an auxiliary support portion. Since it is the same as that of Embodiment 1 about structures other than an auxiliary | assistant support part, description is not repeated. As shown in FIG. 11, in the air floating substrate transport apparatus according to Embodiment 2 of the present invention, an air nozzle 31 is provided as an auxiliary support portion.
　エアノズル３１は、エア２９を噴出する噴出口であるノズル部２７と、内部にエア用配管が形成された配管部２８とから構成されている。配管部２８は、エア２９を供給する図示しないポンプに接続されている。エアノズル３１は、隣り合う支持部３同士の間において、回避領域２６の外に配置されている。そのため、エアノズル３１には、必ずしも、エアノズル３１を上下方向に移動させる移動手段を設ける必要がないため、装置コストを削減することができる。 The air nozzle 31 is composed of a nozzle part 27 that is a jet outlet for ejecting air 29 and a pipe part 28 in which an air pipe is formed. The piping unit 28 is connected to a pump (not shown) that supplies air 29. The air nozzle 31 is disposed outside the avoidance region 26 between the adjacent support portions 3. Therefore, it is not always necessary to provide the air nozzle 31 with a moving means for moving the air nozzle 31 in the vertical direction, so that the apparatus cost can be reduced.
　基板１０が回転させられる際には、エアノズル３１のノズル部２７からエア２９が上方に噴出される。基板１０が回転させられていないときは、エア２９の噴出は停止されている。この構成により、エアノズル３１は、基板１０の角部がエアノズル３１の上方を通過する際に、基板１０の下面にエア２９を噴きつけることができる。よって、図４または図７に示す第２領域１７において、基板１０の下面にエア２９を噴きつけることにより、エアの噴きつけのアンバランスを解消することができる。その結果、基板１０の角部にたわみが発生すること、および、基板１０の短手側の端部が傾斜して支持されることを抑制することができる。 When the substrate 10 is rotated, air 29 is jetted upward from the nozzle portion 27 of the air nozzle 31. When the substrate 10 is not rotated, the ejection of the air 29 is stopped. With this configuration, the air nozzle 31 can spray the air 29 onto the lower surface of the substrate 10 when the corner portion of the substrate 10 passes above the air nozzle 31. Therefore, in the second region 17 shown in FIG. 4 or FIG. 7, the air 29 can be sprayed onto the lower surface of the substrate 10 to eliminate the unbalance of the air spraying. As a result, it is possible to suppress the occurrence of deflection at the corners of the substrate 10 and the tilted support of the short side end of the substrate 10.
　このように、エアノズル３１によりエア２９を基板１０の下面に噴きつけて支持することにより、基板１０の下面に直接的に接触することなく基板１０を支持することができる。よって、基板１０の下面に傷および接触痕が発生することを防止することができる。 Thus, the substrate 10 can be supported without directly contacting the lower surface of the substrate 10 by spraying and supporting the air 29 on the lower surface of the substrate 10 by the air nozzle 31. Therefore, it is possible to prevent scratches and contact marks from being generated on the lower surface of the substrate 10.
　図１２Ａは、変形例のエアノズルにより基板が支持されている状態を示す側面図である。図１２Ｂは、変形例のエアノズルが待機している状態を示す側面図である。図１２Ａに示すように、変形例であるエアノズル３２は、エア２９を噴出する噴出口であるノズル部２７と、内部にエア用配管が形成された配管部２８とを備えている。配管部２８は、エア２９を供給する図示しないポンプに接続されている。 FIG. 12A is a side view showing a state where the substrate is supported by a modified air nozzle. FIG. 12B is a side view showing a state in which the modified air nozzle is on standby. As shown in FIG. 12A, the air nozzle 32 which is a modification includes a nozzle portion 27 which is an ejection port for ejecting air 29 and a piping portion 28 in which an air piping is formed. The piping unit 28 is connected to a pump (not shown) that supplies air 29.
　配管部２８は、図示しないガイドレールおよびボールねじが形成された案内部３０に接続されている。配管部２８は、案内部３０に沿って、スライド可能なように接続されており、制御部であるステッピングモータ２５により、上下方向に移動させられる。 The piping part 28 is connected to a guide part 30 in which a guide rail and a ball screw (not shown) are formed. The piping part 28 is slidably connected along the guide part 30 and is moved in the vertical direction by a stepping motor 25 which is a control part.
　変形例のエアノズル３２は、基板１０の回転方向において、先に上方を基板１０が通過する支持部３の側面近傍に配置される。また、ノズル部２７は、支持部３同士の間の中間の上方に向けられている。このように、エアノズル３２を配置することにより、支持部３から噴出されるエアによる浮力が最も少なくなる箇所にエア２９を噴きつけることができる。よって、基板１０の角部にたわみが発生すること、および、基板１０の短手側の端部が傾斜して支持されることを効果的に防止することができる。 The modified air nozzle 32 is arranged in the vicinity of the side surface of the support portion 3 through which the substrate 10 passes first in the rotation direction of the substrate 10. Further, the nozzle portion 27 is directed upward in the middle between the support portions 3. In this manner, by arranging the air nozzle 32, the air 29 can be sprayed to a location where the buoyancy due to the air ejected from the support portion 3 is minimized. Therefore, it is possible to effectively prevent the bending of the corner portion of the substrate 10 and the tilted support of the short side end portion of the substrate 10.
　図１２Ｂに示すように、基板１０の回転が完了した後に、エアノズル３２は、基板１０から離れるように下降させされる。具体的には、制御部であるステッピングモータ２５により配管部２８が案内部３０に沿ってスライドして、ノズル部２７の先端が回避領域２６の外に位置するまで下降させられる。このとき、ノズル部２７からのエア２９の噴出は停止されている。このように、基板１０が回転させられているとき以外には、エアノズル３２が待機させられていることにより、ロボットアームとエアノズル３２とが干渉することが防止できる。 As shown in FIG. 12B, after the rotation of the substrate 10 is completed, the air nozzle 32 is moved down away from the substrate 10. Specifically, the pipe part 28 slides along the guide part 30 by the stepping motor 25 which is a control part, and is lowered until the tip of the nozzle part 27 is located outside the avoidance region 26. At this time, the ejection of the air 29 from the nozzle part 27 is stopped. Thus, except when the substrate 10 is rotated, the air nozzle 32 is kept on standby, so that the robot arm and the air nozzle 32 can be prevented from interfering with each other.
　なお、今回開示した上記実施の形態はすべての点で例示であって、限定的な解釈の根拠となるものではない。したがって、本発明の技術的範囲は、上記した実施の形態のみによって解釈されるものではなく、請求の範囲の記載に基づいて画定される。また、請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become the basis of a limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. In addition, meanings equivalent to the claims and all modifications within the scope are included.
　１　エア浮上式基板搬送装置、２　土台、３　支持部、４　保持部、５　案内部、６　搬送部、７　チャッキング、８　軸部、９　駆動部、１０　基板、１１　支柱、１２　横梁、１３　処理部、１４　ボールベア、１５　両端部、１６　第１領域、１７　第２領域、１８，２９　エア、１９　球、２０　収容部、２１　支持板、２２　軸部、２３，３０
　案内部、２４　配線、２５　ステッピングモータ、２６　回避領域、２７　ノズル部、２８　配管部、３１，３２　エアノズル。 DESCRIPTION OF SYMBOLS 1 Air floating type board | substrate conveyance apparatus, 2 base, 3 support part, 4 holding | maintenance part, 5 guide part, 6 conveyance part, 7 chucking, 8 axial part, 9 drive part, 10 board | substrate, 11 support | pillar, 12 cross beam, 13 process Part, 14 ball bear, 15 both end parts, 16 1st field, 17 2nd field, 18, 29 air, 19 ball, 20 receiving part, 21 support plate, 22 shaft part, 23, 30
Guide part, 24 wiring, 25 stepping motor, 26 avoidance area, 27 nozzle part, 28 piping part, 31, 32 air nozzle.

Claims (7)

  1. 　矩形状の基板(１０)に該基板(１０)の下方からエアを噴きつけることにより浮上させた状態で、前記基板(１０)を搬送するエア浮上式基板搬送装置(１)であって、
    　前記搬送方向に対して直交する方向に所定の間隔を置いて互いに並列に配置され、エアを噴出して前記基板(１０)を浮上させた状態に維持する複数の支持部(３)と、
    　前記支持部(３)の上方に浮上している前記基板(１０)を搬送方向に送る搬送部(６)と、
    　前記搬送部(６)により所定の位置に送られた前記基板(１０)を、前記支持部(３)の上方に浮上させた状態で、前記基板(１０)の中心を回転中心として回転させる駆動部(９)と
    を備え、
    　前記所定の位置において前記基板(１０)が回転する際の前記基板(１０)の角部が通過する、隣り合う前記支持部(３)同士の間の位置の少なくとも一部に、前記基板(１０)を支持する補助支持部が設けられた、エア浮上式基板搬送装置(１)。     An air levitation type substrate transport apparatus (1) for transporting the substrate (10) in a state of being floated by blowing air from below the substrate (10) to a rectangular substrate (10),
    A plurality of support portions (3) arranged in parallel to each other at a predetermined interval in a direction perpendicular to the transport direction, and maintaining the substrate (10) in a floating state by blowing out air;
    A transport section (6) for sending the substrate (10) floating above the support section (3) in the transport direction;
    Drive for rotating the substrate (10) sent to a predetermined position by the transport unit (6) around the center of the substrate (10) in a state of floating above the support unit (3) Part (9),
    At least part of the position between the adjacent support portions (3) through which the corner portion of the substrate (10) passes when the substrate (10) rotates at the predetermined position, is placed on the substrate (10). ) Is provided with an auxiliary support part for supporting the air floating substrate transport device (1).
  2. 　前記支持部(３)同士の間の位置であって、前記所定の位置において前記基板(１０)が回転する際に前記基板(１０)の角部が通過する位置の中で、前記基板(１０)の搬送方向に直交する方向において前記基板(１０)の中心から最も離れた位置に前記補助支持部が設けられている、請求の範囲第１項に記載のエア浮上式基板搬送装置(１)。 Among the positions between the support portions (3), the corners of the substrate (10) pass when the substrate (10) rotates at the predetermined position. The air levitation type substrate transport apparatus (1) according to claim 1, wherein the auxiliary support portion is provided at a position farthest from the center of the substrate (10) in a direction perpendicular to the transport direction of .
  3. 　前記補助支持部は、前記支持部(３)により前記基板(１０)が浮上させられた状態における高さで前記基板(１０)を支持する、請求の範囲第１項または第２項に記載のエア浮上式基板搬送装置(１)。 The said auxiliary | assistant support part supports the said board | substrate (10) by the height in the state by which the said board | substrate (10) was levitated by the said support part (3), The range of Claim 1 or 2 Air floating substrate transfer device (1).
  4. 　前記補助支持部は、上下方向に移動可能である、請求の範囲第１項から第３項のいずれかに記載のエア浮上式基板搬送装置。 The air floating substrate transfer apparatus according to any one of claims 1 to 3, wherein the auxiliary support part is movable in a vertical direction.
  5. 　前記基板(１０)を回転させる際に、前記基板(１０)を支持する高さに前記補助支持部が位置するように前記補助支持部を上昇させ、前記基板(１０)の回転が完了した後に、前記基板(１０)から離れるように前記補助支持部を下降させる、制御部(２５)を備えた、請求の範囲第４項に記載のエア浮上式基板搬送装置(１)。 When rotating the substrate (10), the auxiliary support portion is raised so that the auxiliary support portion is positioned at a height to support the substrate (10), and the rotation of the substrate (10) is completed. The air levitation type substrate transport device (1) according to claim 4, further comprising a control unit (25) for lowering the auxiliary support portion so as to be separated from the substrate (10).
  6. 　前記補助支持部が、全方向に回転可能な球により前記基板(１０)を支持するボールベア(１４)を有する、請求の範囲第１項から第５項のいずれかに記載のエア浮上式基板搬送装置。 The air floating substrate transport according to any one of claims 1 to 5, wherein the auxiliary support portion has a ball bear (14) for supporting the substrate (10) by a sphere rotatable in all directions. apparatus.
  7. 　前記補助支持部が、前記基板(１０)に下方からエアを噴きつけて前記基板(１０)を支持するエアノズル(３１，３２)を有する、請求の範囲第１項から第６項のいずれかに記載のエア浮上式基板搬送装置。 The said auxiliary support part has an air nozzle (31, 32) which sprays air on the said board | substrate (10) from the downward direction, and supports the said board | substrate (10), In any one of Claims 1-6 The air levitation type substrate transfer device described.
PCT/JP2010/062668 2009-08-07 2010-07-28 Pneumatic levitation-type substrate conveying device WO2011016369A1 (en)

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