+

WO2011090364A3 - 경화성 조성물 - Google Patents

경화성 조성물 Download PDF

Info

Publication number
WO2011090364A3
WO2011090364A3 PCT/KR2011/000523 KR2011000523W WO2011090364A3 WO 2011090364 A3 WO2011090364 A3 WO 2011090364A3 KR 2011000523 W KR2011000523 W KR 2011000523W WO 2011090364 A3 WO2011090364 A3 WO 2011090364A3
Authority
WO
WIPO (PCT)
Prior art keywords
curable composition
present
whitening
workability
hardness
Prior art date
Application number
PCT/KR2011/000523
Other languages
English (en)
French (fr)
Other versions
WO2011090364A2 (ko
Inventor
고민진
문명선
정재호
최범규
강대호
김민균
Original Assignee
(주)Lg화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)Lg화학 filed Critical (주)Lg화학
Priority to EP11734913.4A priority Critical patent/EP2530123B1/en
Priority to CN201180006993.8A priority patent/CN102712812B/zh
Priority to JP2012549952A priority patent/JP5792193B2/ja
Publication of WO2011090364A2 publication Critical patent/WO2011090364A2/ko
Publication of WO2011090364A3 publication Critical patent/WO2011090364A3/ko
Priority to US13/557,916 priority patent/US8729208B2/en
Priority to US14/143,815 priority patent/US9299896B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Epoxy Resins (AREA)

Abstract

본 발명은 경화성 조성물에 관한 것이다. 본 발명은, 우수한 가공성 및 작업성을 나타내면서, 경화되어 뛰어난 광추출 효율, 균열 내성, 경도, 내열 충격성 및 접착성을 보이고, 백탁 등을 유발하지 않으며, 표면에서의 끈적임도 방지되는 경화물을 제공할 수 있다.
PCT/KR2011/000523 2010-01-25 2011-01-25 경화성 조성물 WO2011090364A2 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP11734913.4A EP2530123B1 (en) 2010-01-25 2011-01-25 Curable composition
CN201180006993.8A CN102712812B (zh) 2010-01-25 2011-01-25 可固化组合物
JP2012549952A JP5792193B2 (ja) 2010-01-25 2011-01-25 硬化性組成物
US13/557,916 US8729208B2 (en) 2010-01-25 2012-07-25 Curable composition
US14/143,815 US9299896B2 (en) 2010-01-25 2013-12-30 Curable composition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20100006700 2010-01-25
KR10-2010-0006700 2010-01-25
KR10-2011-0007455 2011-01-25
KR1020110007455A KR101152869B1 (ko) 2010-01-25 2011-01-25 경화성 조성물

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/557,916 Continuation US8729208B2 (en) 2010-01-25 2012-07-25 Curable composition

Publications (2)

Publication Number Publication Date
WO2011090364A2 WO2011090364A2 (ko) 2011-07-28
WO2011090364A3 true WO2011090364A3 (ko) 2011-12-22

Family

ID=44926083

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/000523 WO2011090364A2 (ko) 2010-01-25 2011-01-25 경화성 조성물

Country Status (7)

Country Link
US (1) US8729208B2 (ko)
EP (1) EP2530123B1 (ko)
JP (1) JP5792193B2 (ko)
KR (1) KR101152869B1 (ko)
CN (1) CN102712812B (ko)
DE (1) DE202011110489U1 (ko)
WO (1) WO2011090364A2 (ko)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202011110490U1 (de) * 2010-01-25 2014-04-15 Lg Chem, Ltd. Silikonharz
CN105670294B (zh) * 2011-05-04 2018-02-02 Lg化学株式会社 可固化组合物
EP2784104B1 (en) * 2011-11-25 2020-06-17 LG Chem, Ltd. Production method of an organopolysiloxane
EP2784124B1 (en) * 2011-11-25 2016-06-29 LG Chem, Ltd. Curable composition
JP5805883B2 (ja) * 2011-11-25 2015-11-10 エルジー・ケム・リミテッド 硬化性組成物
CN104066771B (zh) * 2011-11-25 2016-12-28 Lg化学株式会社 制备有机聚硅氧烷的方法
KR101562091B1 (ko) * 2011-11-25 2015-10-21 주식회사 엘지화학 경화성 조성물
TWI473841B (zh) * 2011-11-25 2015-02-21 Lg Chemical Ltd 可固化之組成物
CN103987787B (zh) * 2011-11-25 2016-08-24 Lg化学株式会社 可固化组合物
WO2013077708A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
WO2013077707A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
WO2014017883A1 (ko) 2012-07-27 2014-01-30 주식회사 엘지화학 경화성 조성물
CN104487518B (zh) * 2012-07-27 2017-05-17 Lg化学株式会社 可固化组合物
KR101591146B1 (ko) * 2012-07-27 2016-02-02 주식회사 엘지화학 경화성 조성물
CN104487517B (zh) * 2012-07-27 2017-06-13 Lg化学株式会社 可固化组合物
JP5893212B2 (ja) * 2012-07-27 2016-03-23 エルジー・ケム・リミテッド 硬化性組成物
KR101560046B1 (ko) 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물
WO2014088370A1 (ko) 2012-12-07 2014-06-12 제일모직 주식회사 광학기기용 경화형 폴리실록산 조성물, 봉지재 및 광학기기
JP5985981B2 (ja) 2012-12-28 2016-09-06 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6059010B2 (ja) * 2012-12-28 2017-01-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
US9909007B2 (en) * 2013-08-29 2018-03-06 Dow Corning Corporation Curable silicone composition, cured product thereof, and optical semiconductor device
CN103525095A (zh) * 2013-09-30 2014-01-22 瑞金市瑞谷科技发展有限公司 一种可固化的有机基聚硅氧烷组合物
WO2015115812A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
WO2015115811A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
WO2015115810A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
EP3067382B1 (en) * 2014-01-28 2020-12-23 LG Chem, Ltd. Cured product
WO2015115808A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
JP6616305B2 (ja) * 2014-07-28 2019-12-04 住友化学株式会社 シリコーン系封止材組成物及び半導体発光装置
CN106687530B (zh) * 2014-08-06 2020-05-05 美国陶氏有机硅公司 有机硅氧烷组合物及其用途
TWI600686B (zh) * 2016-08-31 2017-10-01 明基材料股份有限公司 矽樹脂薄膜、可固化矽樹脂組成物、光學半導體裝置及光學半導體裝置之封裝方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040116640A1 (en) * 2002-11-29 2004-06-17 Kei Miyoshi Silicone resin composition for LED devices
KR20060096429A (ko) * 2003-10-01 2006-09-11 다우 코닝 도레이 캄파니 리미티드 경화성 오가노폴리실록산 조성물 및 반도체 장치
KR20080104279A (ko) * 2006-02-24 2008-12-02 다우 코닝 코포레이션 실리콘으로 캡슐화된 발광 장치 및 실리콘 제조용의 경화성실리콘 조성물

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5164461A (en) * 1991-03-14 1992-11-17 General Electric Company Addition-curable silicone adhesive compositions
US5756598A (en) * 1996-12-30 1998-05-26 Dow Corning Corporation Resin-containing organosiloxane compositions curable to silicone elastomers having low weep
JP3241338B2 (ja) 1998-01-26 2001-12-25 日亜化学工業株式会社 半導体発光装置
JP2001196151A (ja) 2000-01-12 2001-07-19 Takazono Sangyo Kk 発熱体装置及び発熱体温度制御方法
JP2002226551A (ja) 2001-01-31 2002-08-14 Matsushita Electric Ind Co Ltd 発光ダイオード
JP4198091B2 (ja) * 2004-06-02 2008-12-17 旭化成株式会社 発光素子封止用樹脂組成物
JP5202822B2 (ja) * 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
TWI434890B (zh) * 2007-04-06 2014-04-21 Shinetsu Chemical Co 加成可硬化聚矽氧樹脂組成物及使用彼之聚矽氧鏡片
JP5972512B2 (ja) * 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040116640A1 (en) * 2002-11-29 2004-06-17 Kei Miyoshi Silicone resin composition for LED devices
KR20060096429A (ko) * 2003-10-01 2006-09-11 다우 코닝 도레이 캄파니 리미티드 경화성 오가노폴리실록산 조성물 및 반도체 장치
KR20080104279A (ko) * 2006-02-24 2008-12-02 다우 코닝 코포레이션 실리콘으로 캡슐화된 발광 장치 및 실리콘 제조용의 경화성실리콘 조성물

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2530123A4 *

Also Published As

Publication number Publication date
CN102712812B (zh) 2015-09-16
EP2530123A4 (en) 2013-09-18
WO2011090364A2 (ko) 2011-07-28
US8729208B2 (en) 2014-05-20
CN102712812A (zh) 2012-10-03
JP5792193B2 (ja) 2015-10-07
EP2530123B1 (en) 2015-11-11
KR20110087244A (ko) 2011-08-02
KR101152869B1 (ko) 2012-06-12
DE202011110489U1 (de) 2014-04-17
JP2013518144A (ja) 2013-05-20
CN103772997A (zh) 2014-05-07
US20130009201A1 (en) 2013-01-10
EP2530123A2 (en) 2012-12-05

Similar Documents

Publication Publication Date Title
WO2011090364A3 (ko) 경화성 조성물
WO2011090361A3 (ko) 경화성 조성물
WO2013015591A3 (ko) 경화성 조성물
PL2150582T3 (pl) Kompozycja o zwiększonej odporności na pękanie naprężeniowe
EP2373704A4 (en) FLUOROELASTOMER, CURABLE COMPOSITION, AND CURED RUBBER ARTICLE
WO2011047123A3 (en) Anaerobically curable compositions
WO2009011777A3 (en) Curable silicon-containing compositions possessing high translucency
EP2223969A4 (en) RESIN COMPOSITION, TRANSPARENT ELEMENT DERIVED FROM THE RESIN COMPOSITION AND USE
EP2725632B8 (en) Use of compositions comprising polymeric inert binders for the fabrication of light-emitting diode
TWI347337B (en) Resin composition and heat resistant adhesive
TWI367394B (en) Curable resin composition, cured article using the same and various object derived thereof
HK1123816A1 (en) Curable resin composition, curable film and their cured products
EP2113532A4 (en) RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED FROM THE COMPOSITION
ZA201304523B (en) Adhesion promoter resin compositions and coating compositions having the adhesion promoter resin compositions
EP2594616A3 (en) Coating composition and sheet using same
WO2011115721A3 (en) Silane moisture curable hot melts
EP2231777B8 (en) Chemical and impact resistant thermoplastic resin composition having improved extrudability.
SI2150581T1 (sl) Obarvan sestavek z izboljšano lomno trdnostjo
WO2012024091A3 (en) Curable acrylate based printing medium
WO2011126265A3 (ko) 터치 패널용 점착 필름 및 터치 패널
BRPI1013162A2 (pt) composições de policarbonato de resistência ao impacto modificada para a fabricação de artigos moldados metalizados com brilho de superfície homogêneo.
WO2012093907A3 (ko) 경화성 조성물
WO2008118567A3 (en) Polythioether amine resins and compositions comprising same
BRPI0911753A2 (pt) resinas epóxi e materiais de compósito com propriedades de queima melhoradas.
WO2009139590A3 (ko) 우수한 가공성, 내열성 및 내식성을 갖는 프리코트 강판용 수지조성물, 이를 이용하여 제조된 프리코트 강판

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201180006993.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11734913

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2011734913

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2012549952

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载