+

WO2011058173A1 - Procédé et dispositif pour fabriquer un composant composite, composant composite - Google Patents

Procédé et dispositif pour fabriquer un composant composite, composant composite Download PDF

Info

Publication number
WO2011058173A1
WO2011058173A1 PCT/EP2010/067483 EP2010067483W WO2011058173A1 WO 2011058173 A1 WO2011058173 A1 WO 2011058173A1 EP 2010067483 W EP2010067483 W EP 2010067483W WO 2011058173 A1 WO2011058173 A1 WO 2011058173A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
curable material
adhesive layer
undercuts
liquid curable
Prior art date
Application number
PCT/EP2010/067483
Other languages
German (de)
English (en)
Inventor
Heinz KÜCK
Wolfgang Eberhardt
Volker Mayer
Original Assignee
Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. filed Critical Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
Publication of WO2011058173A1 publication Critical patent/WO2011058173A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0078—Measures or configurations for obtaining anchoring effects in the contact areas between layers
    • B29C37/0082—Mechanical anchoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B29C2045/14327—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles anchoring by forcing the material to pass through a hole in the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2709/00—Use of inorganic materials not provided for in groups B29K2703/00 - B29K2707/00, for preformed parts, e.g. for inserts
    • B29K2709/02—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B29L2009/005—Layered products coated
    • B29L2009/008—Layered products coated metalized, galvanized
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Definitions

  • the present invention relates to a concept for producing a composite component, as it may be, for example, a metal part with a plastic sheath.
  • Composite components allow the combination of different material properties in one component.
  • the encapsulation of metal parts with thermoplastic materials is therefore widely used today in a wide variety of applications. Often stamped grid are overmolded to lead out contact elements from a housing or to realize an electrical wiring structure on a plastic component.
  • plug-in elements such as e.g. Plug strips often metallic plug contacts such.
  • Connector pins and sleeves encapsulated with thermoplastics are conceivable, such as for applications in pipes and vessels for liquids and gases or mechanically stressed components, even if it depends on a good mechanical power transmission.
  • thermoplastics As a material for metallic inserts are often copper or copper alloys such. CuSn6 is used. Depending on the application, the metal inserts may still be provided with a final layer, such as tin.
  • thermoplastics often technical thermoplastics or high-performance thermoplastics such as polyamide (PA), polybutylene terephthalate (PBT), polyphenylene sulfide (PPS) or liquid crystal polymers (LCP) are used.
  • PA polyamide
  • PBT polybutylene terephthalate
  • PPS polyphenylene sulfide
  • LCP liquid crystal polymers
  • thermoplastic For many applications, a media- and / or pressure-tight connection of insert to thermoplastic is required. However, if both materials have no chemical affinity to each other, then a gap formation may occur after the encapsulation, which due to the capillary action can lead to the penetration of a medium, such as, for example, air or liquids. During mechanical or thermal stress during operation, the gap may increase due to continuous stress and eventually lead to failure of the component. If metal insert parts are overmoulded with a thermosetting plastic, eg during transfer molding (so-called "transfer molding"), a higher affinity of thermoset to metal insert can generally be assumed here These can then ideally connect directly to the metal of the insert cohesively, resulting in improved adhesion between the two components.
  • transfer molding transfer molding
  • thermoplastics In order to achieve a similar effect when encapsulating with thermoplastics, metal insert parts are often pretreated prior to encapsulation with adhesion promoters, which should enable a good cohesive connection with the thermoplastic.
  • adhesion promoters based on silanes or epoxides are used. Depending on the material combination, a specific adhesion promoter must be used.
  • the connection of thermoplastic to insert is not always sufficient, i. the adhesion between thermoplastic and insert is too low.
  • suitable copper foils are micro-roughened by brushing, but also by electrochemical processes such as pulse coating (also known as “pulse plating" in the production of multilayer printed circuit boards) in order to achieve the greatest possible adhesion of the so-called “prepreg” (unhardened thermoset Plastic matrix) on the microrough copper.
  • pulse coating also known as “pulse plating” in the production of multilayer printed circuit boards
  • prepreg unhardened thermoset Plastic matrix
  • the microrough layer causes an enlargement of the surface and thus an increase of the adhesion forces.
  • the adhesive strength can be further improved by chemical aftertreatment of the microrough copper foil, usually by oxidizing media.
  • microrough copper foils with defined brittleness are used in order to obtain a very high adhesive strength of the conductor structures hot-stamped on suitable thermoplastics.
  • a sticky and smudge-resistant coating of copper dendrites is deposited by means of "Pulse Plating"
  • Pulse Plating In this case, for example, take place from a sulfuric acid copper electrolyte, which the film to be coated passes continuously.
  • Such a pulse regimen leads to a firmly "cauliflower-like” treatment with high firmness, which has grown firmly on the surface.
  • this "flower cabbage-like” treatment can be aftertreated by means of oxidizing media (black oxidizing - so-called “black oxide”) Coated (so-called “treatment-coated”) copper foil embossed onto a thermoplastic with a heated, structured embossing stamp, it is thus possible to produce very adhesive conductor track structures on thermoplastic components.
  • the thermoplastic which causes the embossing process, claws mechanically with the microrough treatment of the copper foil, which leads to a very stable form fit between the two components and thus to a very good adhesive strength of the conductor structures.
  • a core idea of the present invention is based on the finding that a composite component with a greater adhesive strength between a shell of curable material of the composite component and a component to be joined can be created if the component is provided with an adhesive layer having a microrough surface with Having undercuts and the microrough surface is brought into contact with liquid curable material, so that the liquid curable material flows behind the undercuts.
  • An advantage of the present invention is that by using liquid curable material in conjunction with a microrough surface having undercuts, by flowing the liquid curable material of the undercuts behind, the liquid curable material can cling to the microrough surface so as to produce a cohesive and adhesive bond with the component, as this is possible from the prior art.
  • the liquid curable material can be cured for example by cooling, irradiation or chemical processes.
  • the liquid curable material may be, for example, a thermoplastic or a thermoplastic elastomer, or an elastomer or a thermoset which, using the concept of the present invention in conjunction with a component made of, for example, metal, a strong bond of the thermoplastic or thermoplastic elastomer or elastomers or duromers with the metal, comparable to an adherent bond of a thermoset with a metal. It is thus a more adhesive bond between the thermoplastic and the metal component allows as this is possible in known from the prior art adhesion promoters.
  • the component may be contacted with the liquid curable material by overmolding (e.g., completely enclosing the component with liquid curable material) or by injection molding (e.g., location-selective coating of the component with liquid curable material).
  • overmolding e.g., completely enclosing the component with liquid curable material
  • injection molding e.g., location-selective coating of the component with liquid curable material.
  • the overmolding or injection molding allows any shape and, in particular, the use of solid components for encapsulation or gating in contrast to films which are coated.
  • Another advantage of the present invention is that the shape of the composite component to be produced is freely selectable by the encapsulation of a component with liquid curable material.
  • the mold can be predetermined, for example, by an impression tool, as used in plastic injection technology.
  • contacting a liquid curable material component may be selective on the component, that is, only a selected portion of the component is coated with the curable material.
  • a further advantage of the present invention is that a composite component can be produced with an adherent connection of a component to a jacket of the component made of hardenable material, in which only a part of the component is enclosed by a hardenable material.
  • FIG. 1 is a flowchart according to an embodiment of the present invention
  • Fig. 2a is a schematic representation of a device according to an embodiment of the present invention
  • 2b shows a schematic illustration of a device for providing a component or a partial region of a component with an adhesive layer which is part of the device shown in FIG. 2a;
  • Fig. 3 is a sectional view of a composite component according to an embodiment of the present invention.
  • FIG. 1 shows a flowchart 100 according to an embodiment of the present invention.
  • the flowchart 100 includes a first step 110 of providing a component or portion of a component with an adhesive layer having a microrough surface with undercuts, the undercuts being configured to be backed by a liquid curable material. Further, the flowchart 100 includes a step 120 of contacting the microrough surface with the liquid curable material such that the liquid curable material backs up the undercuts. Furthermore, the flowchart 100 may include a step 130 of curing the curable material.
  • the curable material may preferably be a thermoplastic or a thermoplastic elastomer and is therefore also referred to below as a thermoplastic.
  • the step 110 of providing a component or a partial region of a component with an adhesive layer can be effected, for example, by chemical or electrochemical deposition of an adhesive layer (so-called treatment layer).
  • the component is here preferably a metal part and is therefore referred to below as a metal part or metal component.
  • all metal components are suitable which have a surface on which an adhesive layer ("treatment layer") can be produced by means of chemical or electrochemical deposition can be deposited, for example electrochemically by means of the method of the "Pulse Plating" already described by the parts, ie the metal parts, for example in an acidic copper electrolyte, either individually in the frame or in a drum or similar to a belt electroplating on a Tape be processed from roll to roll.
  • the metal parts are immersed in a bath of copper electrolytes, wherein the metal parts act as a cathode and, for example, a copper electrode acts as an anode.
  • the pulse regime ie the properties of the applied current between anode and cathode, such as pulse height, pulse length and pulse spacing, is selected such that an adherent and smear-resistant adhesive layer ("treatment layer”), for example of copper dendrites, is deposited on all sides on the metal parts
  • Adhesive layer coating ("treatment coating") is ensured by a corresponding arrangement of the anodes.
  • the term on all sides is to be understood here merely as an example and not restricting, since in further embodiments it may also be possible that by appropriate design of the anode geometry and coverage of the cathode, the adhesive coating (“treatment coating”) is also selective.
  • a ceramic component or another, for example non-conductive component can be used in which an adhesive layer ("treatment layer") either directly on the surface or on an intermediate layer on the surface of chemical or
  • the component could be provided with an adhesive layer having a microrough surface with undercuts, for example by purely chemical processes such as acid etching or the like, or by purely mechanical processes such as grinding, milling or the like
  • Other embodiments can be used, in which the component can be provided with an adhesive layer with a micro-rough surface with undercuts by other, not shown here processes.
  • the adhesive layer (“treatment layer”) and its micro-rough surface produced on the component in step 110 may be, for example, in a further step of the method 100, by a further chemical treatment, such as oxidation, in their properties, for example in terms of strength Temperature resistance, resistance to external influences or substances, or the like
  • the step 120 of bringing the microrough surface into contact with the liquid curable material can be carried out, for example, by overmolding the metal part with a liquid thermoplastic
  • the encapsulation 120 of the pretreated metal parts with thermoplastic materials subsequent to the step 110 can thus form a conclusive clawing between the two materials, that is to say the metal part and the thermoplastic, which, viewed macroscopically, appears to be a cohesive connection.
  • the thermoplastic can be, for example, a melt-shaped thermoplastic or else a plastic melt made of thermoplastic, which connects positively to the microrough surface of the adhesive layer ("treatment layer") during the encapsulation of the metal part
  • the metal part is heated by the plastic melt when the metal part is overmoulded with a plastic melt.
  • the contacting of the microrough surface with a liquid hardenable material as described in step 120 may be equated with impinging the microrough surface with a liquid curable material, providing the microrough surface with a liquid curable material, and supplying the microrough surface microrough surface of a curable material, with the microrough surface overmoulding with a liquid curable material, with the micro rough surface being back-injected with a liquid curable material, with immersion of the microrough surface in liquid curable material, such as a plastic melt or also with a flow around the microrough surface with a liquid curable material.
  • the described contacting can take place here under high pressure so as to produce an even better connection of the liquid curable material, that is, for example, the thermoplastic with the microrough surface of the adhesive layer of the component, that is, for example, of the metal part.
  • the curing 130 of the curable material, so for example of the thermoplastic can be done by cooling the curable material.
  • the liquid curable material is formed as a thermoplastic or a thermoplastic elastomer
  • the liquid curable material is a thermoset or a UV polymer.
  • a UV polymer as a liquid curable material curing does not take place by cooling, but by irradiation of the liquid curable material with UV light.
  • the irradiation For example, in step 130, selective or floodlighting can take place optionally over the entire composite component in order to enable a selective hardening and thus a selective coating of the component.
  • FIG. 2 a shows a device 200 according to an exemplary embodiment of the present invention.
  • the apparatus 200 comprises means for providing a component or portion of a component with an adhesive layer having a microrough surface with undercuts, the undercuts being adapted to be backed by a liquid curable material. Further, the apparatus 200 includes means 220 for contacting the microrough surface with the liquid curable material so that the liquid curable material flows behind the undercuts. Furthermore, the apparatus 200 shown in Fig. 2a may comprise a means 230 for curing the curable material.
  • the device 210 for providing a component or a partial region of a component with an adhesive layer is designed, for example, to carry out a step 110 as described in the flow diagram 100 in FIG. 1.
  • the means 220 for contacting the microrough surface with the liquid curable material is configured to perform, for example, a step 120 as described in the flowchart 100 shown in FIG. 1.
  • the curable material curing device 230 is configured to perform, for example, a step 130 as described in the flowchart 100 shown in FIG. 1.
  • FIG. 2b shows a schematic illustration of the device 210 for providing a component or a partial region of a component with an adhesive layer, which is part of the device 200 shown in FIG. 2a.
  • the device 210 may, for example, have a galvanic bath 240 with a solution of acid copper electrolytes and an anode or an anode arrangement 250 into which the components 260 to be coated as a cathode either individually in the frame or in a drum or similar be processed in a strip electroplating on a strip from roll to roll.
  • a voltage for example a DC voltage or a pulsed voltage
  • the anode or the anode arrangement 250 and the cathode that is to say the components 260 to be coated
  • positively charged copper ions deposit on the components 260 to be coated.
  • copper is deposited on the components to be coated 260.
  • the device 220 may, for example, comprise a plastic melt which is brought into contact with a component coated with an adhesive layer having a microrough surface which has undercuts.
  • the bringing into contact can take place here, for example, by immersing the component coated with an adhesive layer in the plastic melt or by encapsulating, injecting or injecting the component coated with an adhesive layer with the plastic melt or else by other similar methods.
  • the device 220 may, for example, comparable to a plastic injection molding machine, a tool for producing the shape of the composite component to be produced.
  • the curable material curing means 230 may include, for example, a cooling chamber for cooling the curable material or, when using a UV polymer curable material, a UV irradiator that hardens the UV polymer.
  • the composite component 300 may be fabricated based on the method 100 shown in FIG. 1 with a device 200.
  • the composite component 300 comprises a first component 310, for example a metal component, which has on one surface an adhesion layer 320 with a microrough surface with undercuts 330.
  • the micro-rough surface of the adhesive layer 330 is enclosed with cured hardenable material 340, such as a cooled thermoplastic.
  • the microraue surface and the undercuts 330 are shown here greatly enlarged for clarity.
  • the undercuts 330 which are produced, for example, by deposited copper dendrites, typically have a height of from 3 ⁇ m to 100 ⁇ m.
  • the cauliflower-like micro-rough surface of the adhesive layer 320 and the undercuts 330 formed by the cauliflower-like shape of the surface can be clearly seen in FIG. 3.
  • the hardened material 340 has flowed behind these undercuts 330 and thus forms a firmly adhering connection to the component 310.
  • the hardened material 340 has thus firmly adhered to the microrough surface of the adhesive layer 320.
  • the micro-rough surface has an enlarged surface with respect to a surface of the component 310, resulting in addition to the undercuts 330, due to adhesion forces in a still increased adhesive strength of the cured material with the component 310.
  • the adhesion layer 320 extends only over a partial area of the surface of the component 310. It is also possible, of course, for the adhesion layer 320 to completely enclose the component 310 in order to allow complete encapsulation of the component 310 with curable material 340.
  • the composite component 300 shown in Figure 3 may be, for example, a die-coated ("treatment-coated") die-cast with a high performance thermoplastic 340 such as polyamide, polybutylene terephthalate, polyphenylene sulfide, or liquid crystal polymer ”) Be plug contact with an overmolded technical or high performance thermoplastics 340, such as polyamide, polybutylene terephthalate, polyphenylene sulfide or liquid crystal polymer.
  • a die-coated such as polyamide, polybutylene terephthalate, polyphenylene sulfide, or liquid crystal polymer
  • the component 310 can be, for example, a stamped grid, a plug, a vessel, a line element or even a mechanical element.
  • FIG. 1 Further exemplary embodiments of the present invention can show a method for adhering metallic components to a thermoplastic or thermoset, wherein the surface of the metal component is at least in areas where contact between metal and thermoplastic takes place before an encapsulation process a chemically or electrochemically produced adhesive layer ("treatment layer") which is similar to that provided by the hot stamping foils of the prior art an oxidation, to be improved in their properties.
  • treatment layer chemically or electrochemically produced adhesive layer
  • the metal component when the metal component is brought into contact with liquid-curable material, ie, for example, during an extrusion coating process, the metal component can be heated and pressed by the plastic melt, while in a printed circuit board production after joining prepreg with metal foil, a lamination process with heat input and pressure he follows.
  • the metal components in methods according to embodiments of the present invention are generally and preferably no films, but three-dimensionally distinct components with significantly greater thickness. Another difference is that the plastic is melted during hot stamping mainly by the hot foil, while in embodiments of the present invention in contacting the component with the curable material, that is, for example, in a Umspritzvorgang the metal part is heated by the plastic melt.
  • FIG. 1 Further exemplified embodiments of the present invention may also comprise a coated with an adhesive layer ("treatment-coated”) metal foil (for example, copper foil), which on the adhesive layer side ("treatment side") behind a molten thermoplastic, ie liquid curable material behind, ie in Contact is brought.
  • treatment-coated an adhesive layer
  • aspects have been described in the context of a device, it will be understood that these aspects also constitute a description of the corresponding method, so that a block or a component of a device is also to be understood as a corresponding method step or as a feature of a method step. Similarly, aspects described in connection with or as a method step also represent a description of a corresponding block or detail or feature of a corresponding device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention décrit un procédé (100) pour fabriquer un composant composite sur lequel un composant ou une zone partielle d'un composant sont composés d'une couche adhésive (110), qui présente une surface micro-rugueuse avec des contre-dépouilles, les contre-dépouilles étant conçues pour être traversées par un matériau liquide durcissable. La surface micro-rugueuse est mise en contact (120) avec le matériau liquide durcissable, de sorte que le matériau liquide durcissable coule à l'arrière des contre-dépouilles. L'invention concerne également un dispositif pour fabriquer un composant composite et un composant composite.
PCT/EP2010/067483 2009-11-16 2010-11-15 Procédé et dispositif pour fabriquer un composant composite, composant composite WO2011058173A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009053512.8 2009-11-16
DE200910053512 DE102009053512A1 (de) 2009-11-16 2009-11-16 Verfahren und Vorrichtung zur Herstellung eines Verbundbauteils, Verbundbauteil

Publications (1)

Publication Number Publication Date
WO2011058173A1 true WO2011058173A1 (fr) 2011-05-19

Family

ID=43431837

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/067483 WO2011058173A1 (fr) 2009-11-16 2010-11-15 Procédé et dispositif pour fabriquer un composant composite, composant composite

Country Status (2)

Country Link
DE (1) DE102009053512A1 (fr)
WO (1) WO2011058173A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103158226B (zh) * 2011-12-15 2015-11-25 鸿富锦精密工业（深圳）有限公司 金属与塑料的复合体的制备方法及复合体
DE102013215246A1 (de) 2013-08-02 2015-02-05 Robert Bosch Gmbh Elektronikmodul mit Leiterplatten und anspritzbarem Kunststoff-Dichtring, insbesondere für ein Kfz-Getriebesteuergerät, und Verfahren zum Fertigen desselben
DE102014210480A1 (de) * 2014-06-03 2015-12-03 Robert Bosch Gmbh Kunststoff umspritztes Stanzgitter mit Haftmaterial
DE102014211298A1 (de) * 2014-06-13 2015-12-17 Robert Bosch Gmbh Substrat mit einer Oberflächenbeschichtung und Verfahren zum Beschichten einer Oberfläche eines Substrates
FR3035347B1 (fr) * 2015-04-21 2017-12-22 Orelec Procede de fabrication d'un moule de thermoformage, d'un moule de rotomoulage
CN109093926A (zh) * 2018-07-12 2018-12-28 歌尔股份有限公司 一种陶瓷与塑胶的复合件及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293109A (en) * 1961-09-18 1966-12-20 Clevite Corp Conducting element having improved bonding characteristics and method
JPS6464391A (en) * 1987-09-04 1989-03-10 Shinko Electric Ind Co Manufacture of circuit board
WO1998000293A1 (fr) * 1994-12-09 1998-01-08 Olin Corporation Couche de revetement de surface pour conducteurs electriques
JP2003103563A (ja) * 2001-07-25 2003-04-09 Taisei Plas Co Ltd 金属と樹脂の複合体とその製造方法
JP2007313750A (ja) * 2006-05-25 2007-12-06 Tosoh Corp 金属と樹脂の複合体及びその製造方法
WO2009012171A2 (fr) * 2007-07-13 2009-01-22 Apple Inc. Procédés et systèmes pour former un logement à deux couches

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4381319A (en) * 1980-10-03 1983-04-26 Honeywell Inc. Method of bonding rotating bands on projectiles
DE10234122A1 (de) * 2002-07-26 2004-02-05 Mir-Chem Gmbh Vorrichtung und Verfahren zum elektrochemischen Bearbeiten eines Werkstücks

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293109A (en) * 1961-09-18 1966-12-20 Clevite Corp Conducting element having improved bonding characteristics and method
JPS6464391A (en) * 1987-09-04 1989-03-10 Shinko Electric Ind Co Manufacture of circuit board
WO1998000293A1 (fr) * 1994-12-09 1998-01-08 Olin Corporation Couche de revetement de surface pour conducteurs electriques
JP2003103563A (ja) * 2001-07-25 2003-04-09 Taisei Plas Co Ltd 金属と樹脂の複合体とその製造方法
JP2007313750A (ja) * 2006-05-25 2007-12-06 Tosoh Corp 金属と樹脂の複合体及びその製造方法
WO2009012171A2 (fr) * 2007-07-13 2009-01-22 Apple Inc. Procédés et systèmes pour former un logement à deux couches

Also Published As

Publication number Publication date
DE102009053512A1 (de) 2011-05-19

Similar Documents

Publication Publication Date Title
WO2011058173A1 (fr) Procédé et dispositif pour fabriquer un composant composite, composant composite
EP3028551B1 (fr) Module électronique avec circuits imprimés et bague d'étanchéité en matière plastique pulvérisable, notamment pour un contrôleur de boîte de vitesses de véhicule automobile, et procédé pour sa fabrication
EP1383360B1 (fr) Support de circuit imprimé moulé par injection et son procédé de fabrication
DE102013212254A1 (de) MID-Bauteil, Verfahren zur Herstellung
EP0324352A2 (fr) Procédé de fabrication d'une plaquette de circuit à âme métallique
DE102008015853A1 (de) Beheizbare Kunststoffscheibe und Verfahren zu deren Herstellung
DE4432966A1 (de) Verfahren zum Herstellen eines Bauteils aus thermoplastischem Kunststoff mit wenigstens einem integrierten, elektrisch leitenden Abschnitt sowie nach diesem Verfahren hergestelltes Bauteil
DE69111003T2 (de) Verfahren unter Verwendung einer permanenten Matrize zur Herstellung von elektrischen Schaltungen.
DE102015121857A1 (de) Verfahren zum Herstellen eines Leitfähigkeitssensors
EP2952320B1 (fr) Grillage enrobé de plastique comprenant un matériau d'adhesif
DE102017217985B4 (de) Verfahren zum Herstellen einer elektronischen Komponente
DE102018208491A1 (de) Kontaktierungssystem für eine modular aufgebaute Batterie
EP3479664B1 (fr) Procédé de fabrication d'une unité appareil de commande, en particulier pour un véhicule, et unité appareil de commande, en particulier pour un véhicule
DE102010041121A1 (de) Schaltungsträger sowie Verfahren zur Herstellung eines Schaltungsträgers
DE102008003372B4 (de) Verfahren zur Herstellung eines mehrlagigen zwei- oder dreidimensionalen Schaltungsträgers
DE102013003542B4 (de) Verfahren zur Herstellung einer funktionalisierten und umgeformten thermoplastischen Kunststofffolie und gemäß diesem Verfahren bearbeitete Kunststofffolie
EP1501341B1 (fr) Aménagement de positionnement de pistes conductrices
DE102020203390A1 (de) Elektrische heizeinrichtung und verfahren zu deren herstellung
DE102015223978B4 (de) Verfahren zur Herstellung eines Encoders
DE202013100463U1 (de) Polymerkabelbaum
WO2014135415A1 (fr) Procédé de fabrication d'une feuille de matière thermoplastique fonctionnalisée avec des structures stratifiées hybrides et feuille de matière plastique façonnée par ce procédé
DE1282757B (de) Verfahren zur Herstellung elektrischer Baugruppen
DE102018114801A1 (de) Diffusionsbarriere für implantierbare Elektrodenleitungen
AT526302A1 (de) Schutzabdeckung für Sensoren der Fahrzeugtechnik
DE2329052C3 (de) Verfahren zur Herstellung von Schaltungsmoduln

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10779778

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10779778

Country of ref document: EP

Kind code of ref document: A1

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载