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WO2010093069A1 - Procédé pour fabriquer une nanostructure - Google Patents

Procédé pour fabriquer une nanostructure Download PDF

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Publication number
WO2010093069A1
WO2010093069A1 PCT/KR2009/000645 KR2009000645W WO2010093069A1 WO 2010093069 A1 WO2010093069 A1 WO 2010093069A1 KR 2009000645 W KR2009000645 W KR 2009000645W WO 2010093069 A1 WO2010093069 A1 WO 2010093069A1
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WO
WIPO (PCT)
Prior art keywords
nano
manufacturing
nanoparticles
substrate
nanostructure
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Application number
PCT/KR2009/000645
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English (en)
Korean (ko)
Inventor
강신일
최준혁
Original Assignee
연세대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 연세대학교 산학협력단 filed Critical 연세대학교 산학협력단
Priority to PCT/KR2009/000645 priority Critical patent/WO2010093069A1/fr
Publication of WO2010093069A1 publication Critical patent/WO2010093069A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00031—Regular or irregular arrays of nanoscale structures, e.g. etch mask layer

Definitions

  • the present invention relates to a method for manufacturing nanostructures, and more particularly, to a method for manufacturing nanostructures using a combination of nanoparticles.
  • nanostructures are increasingly growing in applications and demand.
  • many conventional methods are known. For example, by forming a nanostructure that mimics the moth eye on a substrate to produce an antireflection film required in the display field. Even in the case of a super water-repellent functional film applied to the outer wall of a building, a nanostructure is formed on a substrate and manufactured.
  • nano / micro diameter structures can be easily created.
  • processing in large areas not only the cost and processing time are quite high, but also the processing area is limited.
  • Holographic lithography is a process that utilizes the difference in the interference between beams, which enables high speed and large area, and has been widely applied to the fabrication of periodic nanostructures.
  • Holographic lithography can serve as a breakthrough for the area limitations of electron beam lithography.
  • expensive equipment is required, and process stability is very important, and large-scale system construction is required.
  • the particles should be evenly distributed in a single layer, and for this purpose, optimization of the process conditions such as controlling the density of the particles, the rotational speed of the spin coating, and the like should be made. The optimization is very difficult and the process stability is low.
  • the present invention has been made to solve the above problems, an object of the present invention is to stably provide a nanostructure large area.
  • an object of the present invention is to provide a method for manufacturing nanostructures excellent in terms of cost and productivity by simplifying the process and reducing the cost.
  • an object of the present invention is to provide a variety of nanostructures suitable for each use by making nanostructures having excellent chemical / physical durability and from another nanostructures therefrom.
  • an object of the present invention is to provide a method for manufacturing a nanopattern of low cost and high productivity by using the fabricated nanostructure for pattern replication.
  • the present invention comprises a first step of applying nanoparticles on a substrate; And through heat treatment, it provides a nanostructure manufacturing method comprising a second step of bonding the nanoparticles on the substrate with nano irregularities.
  • the nanoparticles are metal nanoparticles.
  • the nanoparticles have a diameter of 1 to 100 nm, and the nano irregularities have a diameter of 10 to 1000 nm.
  • the nanoparticles may be mixed with a solvent and applied onto the substrate in a solution state.
  • the second step includes the step of sintering the nanoparticles above the sintering temperature of the nanoparticles.
  • the heat treatment is started at a temperature lower than the sintering temperature of the nanoparticles.
  • the substrate may be etched using the nano irregularities as a mask, and a third step of removing the nano irregularities may be included.
  • the method may include a third step of applying a target material on the substrate on which the nano-evenness is formed, and then performing a lift-off process of removing the nano-evenness.
  • It may include a third step of selectively applying a target material on the nano irregularities.
  • the present invention provides a nano-pattern manufacturing method comprising a replication step of replicating the produced nanostructures.
  • At least one of electroplating, imprinting, injection molding, and compression molding may be performed at least one time.
  • the present invention has the effect that it is possible to stably provide a nanostructure in a large area.
  • the present invention aims to simplify the process and reduce the cost, and there is an effect that a large amount of nanostructures can be manufactured with high mass production and low production cost.
  • the present invention has the effect of providing a variety of nanostructures suitable for each purpose by forming a nanostructure having a chemical / physically excellent durability, from which to produce another nanostructure.
  • the present invention has the effect of providing a low cost, high productivity nano pattern manufacturing method by using the fabricated nanostructures for pattern replication.
  • the nanostructure is replicated through electroplating, and the nano-molding using the obtained highly durable nanopattern as a mold has a very excellent advantage in terms of cost and productivity.
  • FIG. 1 is a process flowchart showing a method of manufacturing a nanostructure according to a first embodiment of the present invention.
  • FIG. 2 is a view illustrating a substrate on which a nanostructure manufactured by the method of FIG. 1 is formed.
  • FIG. 3 is an enlarged plan view illustrating an arrangement state of nanostructures manufactured by the fabrication method of FIG. 1.
  • FIG. 4 is an enlarged perspective view illustrating an arrangement state of the nanostructure of FIG. 3.
  • 5 to 8 are process flowcharts showing a method for manufacturing nanostructures according to the second to fifth embodiments of the present invention.
  • FIG. 9 is a process flowchart showing a method of manufacturing a nano pattern according to a sixth embodiment of the present invention.
  • nanostructures in FIGS. 1 to 8 in order to name an array of three-dimensional structures such as nano pillars, nano holes, and the like, they are referred to as nano structures in FIGS. 1 to 8 and nano patterns in FIG. 9.
  • the nanostructure and the nanopattern may have the same geometric shape.
  • the nanostructure of Figure 1 is referred to in particular as nano irregularities, this is also to clarify the indication in the claims.
  • FIG. 1 is a process flowchart showing a method of manufacturing a nanostructure according to a first embodiment of the present invention.
  • the nanostructure fabrication method of Figure 1 is uniformly applying the nanoparticles on the substrate 10, through the heat treatment, the nanoparticles are bonded to the nano-concave (23) on the substrate 10 ( aggregation).
  • the substrate 10 includes at least one of silicon, quartz, glass, plastic, oxide, and metal. According to the heat treatment process conditions to be described later, a plastic substrate to be heat treated at a low temperature, a substrate such as glass, quartz, silicon, which can be heat treated at a high temperature is possible.
  • Oxides, metals, and the like may be formed in the form of a film on the surface of the substrate 10.
  • the oxide film having an antireflection effect is formed in a single layer or multiple layers on the surface of the substrate 10 and the antireflection nanostructure is formed thereon, the antireflection effect can be doubled.
  • a metal film may be formed on the surface of the substrate 10 to be used as a seed layer for electroplating described later.
  • the substrate 10 may be a two-dimensional flat surface, or may be a three-dimensional solid surface on which an optical lens, a flow channel, and the like are formed.
  • nanoparticles are applied to these substrates 10, where the present invention may be distinguished from the prior art described above.
  • the nanostructures formed by dewetting have a disadvantage in that they are very vulnerable to dry etching, etc., thereby limiting subsequent processes.
  • the nanostructures of the present invention have excellent chemical / physical durability and can be applied to various subsequent processes. Has an advantage.
  • metal nanoparticles are preferably used.
  • the metal nanoparticles include at least one of silver, aluminum, copper, iron, platinum, lead, gold, and mercury.
  • Nanoparticles may comprise a single or two or more materials.
  • silica (SiO 2 ) nanoparticles, and the like may also be used.
  • the nanoparticles are 1-100 nm in diameter.
  • the nanoparticles may be mixed with an organic solvent or a polymer resin solvent and applied to the substrate 10 in a solution state. That is, the solution 21 in which the nanoparticles are mixed may be applied to the substrate 10. However, the nanoparticle solution 21 is already dried at the time when the heat treatment starts, the heat treatment can be started in a solid state.
  • the nanoparticles are applied according to the conditions such as the rotation speed and rotation time of the spin coating (when using spin coating), the temperature, the size of the nanoparticles, the concentration of the solution 21, the type of the solution 21, and the like. Uniformity is determined, which affects the size and distribution of the nano irregularities 23 formed after the heat treatment.
  • the nanoparticles are thinly coated on the substrate 10 and then heat treated, the nanoparticles are combined by thermal energy to form nanoconvex and convexities 23.
  • the size of the nano-concave-convex 23 is determined according to the process conditions, such as the heat treatment temperature, the type of nanoparticles, the surrounding environment.
  • the diameter of the nano irregularities 23 is 10 to 1000 nm.
  • the heat treatment includes sintering the nanoparticles above the sintering temperature of the nanoparticles.
  • the heat treatment is preferably started at a temperature lower than the sintering temperature of the nanoparticles.
  • the mechanism by which nanoparticles are aggregated is as follows. If the heat treatment is started at a temperature lower than the sintering temperature, the isolation phenomenon is started. Subsequently, when the temperature is increased to a sintering temperature or higher, the isolated particles are sintered to form nano irregularities.
  • the heat treatment is started at 200 ° C to raise the temperature to 250 ° C, the heat treatment is started at 180 ° C and the temperature is increased to 250 ° C, and the heat treatment is started at 150 ° C.
  • the size of the nano irregularities obtained is different. Starting the heat treatment at a lower temperature will result in a larger nano bumps. Because enough time is given for isolation. These characteristics can be used to control the size of the nano irregularities.
  • the heat treatment may be performed at an extremely low temperature as compared to the heat treatment of the metal thin film described above.
  • the 20-30 nm Ag nanoparticles may be heat-treated at 250 ° C. for 10 minutes to obtain nano irregularities 23 as illustrated in FIG. 1B.
  • the melting point of Ag is 961 ° C., by using Ag in a fine particle state, the Ag can be produced at a temperature much lower than the melting point, thereby producing the nanoconcave-convex (23).
  • a method using an oven a method using a hot plate, a method using a sintering furnace, a method using an infrared heater, and the like can be used.
  • a vacuum atmosphere a nitrogen atmosphere, an argon atmosphere, a general atmospheric atmosphere, or the like can be used as the process atmosphere.
  • the heat treatment may improve the bonding properties of the nanoparticles through multiple conditions, rather than a single condition to form a uniform nano irregularities (23).
  • FIG. 2 is a diagram illustrating a state in which nanostructures are formed by the fabrication method of FIG. 1 on the substrate 10, and
  • FIG. 3 is an enlarged plan view illustrating an arrangement state of the nanostructures fabricated by the fabrication method of FIG. 1.
  • 4 is an enlarged perspective view illustrating an arrangement state of the nanostructure of FIG. 3.
  • uniform nano irregularities 23 can be obtained by the nanostructure fabrication method of the present invention.
  • Various nanostructures may be obtained by using the nano-concave-convex 23 manufactured in FIG. 1 in a subsequent process.
  • FIG. 5 is a process flowchart showing a method of manufacturing a nanostructure according to a second embodiment of the present invention.
  • the nanostructures 23 may be etched using the nanoconcave-convex 23 manufactured as shown in FIG. 1 as a mask, and the nanoconcave-convex 23 may be removed. Dry etching, wet etching, and the like can be used.
  • a chemical substance that reacts only with the substrate 10 without reacting with the nano irregularities 23 or a chemical substance having a difference in reaction speed between the nano irregularities 23 and the substrate 10 is used. Can be etched.
  • nano-concave-convex (23) and etching can be produced a variety of nanostructures, such as nanostructures, triangular nanostructures of high-grade equipment.
  • FIG. 6 is a process flowchart showing a method of manufacturing a nanostructure according to a third embodiment of the present invention.
  • the nano-structure may be manufactured through a lift-off process of removing the nano-concave-convex 23. .
  • the target material is coated with a material different from the nano-concave-convex (23) such as oxide, metal, polymer, etc., and then the nano-convex (23) is melted to manufacture a nano-hole.
  • a material different from the nano-concave-convex (23) such as oxide, metal, polymer, etc.
  • the manufacturing method of FIG. 6 is used to make the nanostructure having the lower end or the upper end of the flat surface by removing the upper end of the nano-concave-convex 23.
  • FIG. 7 is a process flowchart showing a method of manufacturing a nanostructure according to a fourth embodiment of the present invention
  • Figure 8 is a process flowchart showing a method of manufacturing a nanostructure according to a fifth embodiment of the present invention.
  • the target material may be selectively coated on the nano-convexities 23 or the substrate 10 of FIG. 1 to impart a special effect.
  • the nano unevenness 23 functions as a mask to selectively apply the target material 26 to substrate portions other than the nano unevenness 23 and remove the nano unevenness 23.
  • Nanostructures coated with TiO 2 on silver nano irregularities absorb ultraviolet rays and can be applied to keypads of mobile phones.
  • the metal nano bumps may be coated with metals, oxides, polymers, and the like having different dielectric constants to impart desired optical properties.
  • Biochips require nanostructures to attach / grow cells. Depending on the size, cycle, height, material, etc. of the nanostructures, various applications are possible by changing the attachment and growth mechanisms of the cells.
  • the nanostructures may be selectively coated on the nano-concave-convex 23 to manufacture nanostructures, and may be used as filters by inducing a selective reaction by the fabricated nanostructures.
  • the target materials 26 and 27 may be selectively coated on the nano irregularities 23 or the substrate 10 by using the surface energy difference, and then the secondary reaction may be induced using the target materials 26 and 27.
  • the self-assembled monolayer may be selectively coated on the substrate 10 or the nano unevenness 23.
  • thiol-based materials are coated on materials such as gold, platinum, nickel, copper, etc., but not coated on silicon, glass, quartz, and polymer materials, and have reactive nano irregularities 23 such as gold or platinum.
  • the thiol-based organic material may be coated and applied to a bio device.
  • the substrate 10 may be selectively reacted with the target material 26 which does not react with the nano unevenness 23, and the nano unevenness 23 may be removed to form nano holes at a portion thereof.
  • the nanostructures may be manufactured by duplicating the nanostructures manufactured by the method of FIGS. 5 to 8.
  • various replication methods such as electroplating, imprinting, injection molding, compression molding, and the like may be used, and one or more replication may be performed.
  • the nanostructures having the opposite shape as the nanostructures may be manufactured by imprinting the fabricated nanostructures, or the nanostructures having the same shape as the nanostructures may be manufactured by two imprinting, or the nanostructures may be formed by preplating and imprinting. It can be applied to various applications, such as manufacturing a nano pattern of the same shape.
  • the process speed may be greatly improved.
  • the nanopattern can be mass produced at low cost.
  • FIG. 9 is a process flowchart showing a method of manufacturing a nano pattern according to a sixth embodiment of the present invention.
  • FIG. 9 shows an embodiment in which electroplating is performed as a subsequent process of the manufacturing method of FIG. 5.
  • the electroplating may be performed as a subsequent process of the other manufacturing method.
  • the seed layer 31 is formed on the nanostructure, and then electroplating is performed.
  • Nano pattern 33 produced by electroplating is very excellent in durability, it is suitable for use as a mold for manufacturing other nano patterns. In this case, it brings the advantage of mass-producing nanopatterns at even lower cost.
  • nanostructures or nanopatterns can be manufactured at low cost in large areas such as biochips, optical filters for display devices, optical devices for solar cells, and the like.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

La présente invention porte sur un procédé pour fabriquer une nanostructure, lequel procédé comprend une première étape pour appliquer des nanoparticules sur un substrat et une seconde étape pour lier les nanoparticules sur le substrat afin de créer une irrégularité de taille nanométrique par un traitement thermique. En particulier, les nanoparticules sont métalliques. Plus particulièrement, les nanoparticules ont un diamètre de 1 à 100 nm et le diamètre d'irrégularité de taille nanométrique est compris entre 10 et 1000 nm. De plus, la présente invention porte sur un procédé de fabrication de nanomotifs, lequel procédé comprend : la fabrication de la nanostructure à l'aide du procédé de fabrication de la nanostructure ; et la réplication de la nanostructure fabriquée.
PCT/KR2009/000645 2009-02-12 2009-02-12 Procédé pour fabriquer une nanostructure WO2010093069A1 (fr)

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PCT/KR2009/000645 WO2010093069A1 (fr) 2009-02-12 2009-02-12 Procédé pour fabriquer une nanostructure

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130078750A1 (en) * 2010-08-02 2013-03-28 Gwangju Institute Of Science And Technology Fabricating method of nano structure for antireflection and fabricating method of photo device integrated with antireflection nano structure
KR101994666B1 (ko) * 2018-01-02 2019-09-30 한국세라믹기술원 선택적 식각 공정을 이용하여 제조된 초발수 구조체, 및 그 제조 방법

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2004119790A (ja) * 2002-09-27 2004-04-15 Harima Chem Inc ナノ粒子の超臨界流体中分散液を用いる微細配線パターンの形成方法
KR20070025519A (ko) * 2005-09-02 2007-03-08 삼성전자주식회사 나노닷 메모리 및 그 제조 방법
KR20080020827A (ko) * 2006-09-01 2008-03-06 삼성전자주식회사 고밀도 패턴 미디어용 나노 템플릿의 형성 방법 및 이를이용한 고밀도 자기 저장매체

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119790A (ja) * 2002-09-27 2004-04-15 Harima Chem Inc ナノ粒子の超臨界流体中分散液を用いる微細配線パターンの形成方法
KR20070025519A (ko) * 2005-09-02 2007-03-08 삼성전자주식회사 나노닷 메모리 및 그 제조 방법
KR20080020827A (ko) * 2006-09-01 2008-03-06 삼성전자주식회사 고밀도 패턴 미디어용 나노 템플릿의 형성 방법 및 이를이용한 고밀도 자기 저장매체

Non-Patent Citations (1)

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Title
CHOU, KAN-SEN ET AL.: "Fabrication and sintering effect on the morphologies and conductivity of nano-Ag particle films by the spin coating method", NANOTECHNOLOGY, vol. 16, 2005, pages 779 - 784, XP020091084, DOI: doi:10.1088/0957-4484/16/6/027 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130078750A1 (en) * 2010-08-02 2013-03-28 Gwangju Institute Of Science And Technology Fabricating method of nano structure for antireflection and fabricating method of photo device integrated with antireflection nano structure
US9123832B2 (en) * 2010-08-02 2015-09-01 Gwangju Institute Of Science And Technology Fabricating method of nano structure for antireflection and fabricating method of photo device integrated with antireflection nano structure
KR101994666B1 (ko) * 2018-01-02 2019-09-30 한국세라믹기술원 선택적 식각 공정을 이용하여 제조된 초발수 구조체, 및 그 제조 방법

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