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WO2010076990A3 - Compositions pour un film conducteur anisotrope, et film conducteur anisotrope les utilisant - Google Patents

Compositions pour un film conducteur anisotrope, et film conducteur anisotrope les utilisant Download PDF

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Publication number
WO2010076990A3
WO2010076990A3 PCT/KR2009/007519 KR2009007519W WO2010076990A3 WO 2010076990 A3 WO2010076990 A3 WO 2010076990A3 KR 2009007519 W KR2009007519 W KR 2009007519W WO 2010076990 A3 WO2010076990 A3 WO 2010076990A3
Authority
WO
WIPO (PCT)
Prior art keywords
compositions
anisotropic conductive
conductive film
variety
film
Prior art date
Application number
PCT/KR2009/007519
Other languages
English (en)
Korean (ko)
Other versions
WO2010076990A2 (fr
Inventor
황자영
어동선
박진성
강정구
이태현
김현영
배상식
Original Assignee
제일모직 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제일모직 주식회사 filed Critical 제일모직 주식회사
Publication of WO2010076990A2 publication Critical patent/WO2010076990A2/fr
Publication of WO2010076990A3 publication Critical patent/WO2010076990A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/445—Block-or graft-polymers containing polysiloxane sequences containing polyester sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)

Abstract

L'invention concerne des compositions pour un film conducteur anisotrope qui comprend des résines formant liant, des ingrédients thermodurcissables et des particules conductrices, dans lesquelles les résines formant liant contiennent des copolymères polyester-polysiloxane. Les compositions de film conducteur anisotrope possèdent une fluidité et une adhérence initiale supérieures, et empêchent le film d'être détaché de divers d'objets, ce qui maintient l'apparence extérieure initiale même lorsque le film est utilisé sur une longue période de temps dans des conditions d'impact thermique et de température élevée/d'humidité élevée. Les compositions de la présente invention possèdent une fiabilité élevée contre la résistance de connexion. Par conséquent, les compositions selon la présente invention améliorent la fiabilité de toute une gamme de dispositifs d'affichage, et peuvent être largement utilisées en tant que compositions pour divers adhésifs.
PCT/KR2009/007519 2008-12-29 2009-12-16 Compositions pour un film conducteur anisotrope, et film conducteur anisotrope les utilisant WO2010076990A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0135835 2008-12-29
KR1020080135835A KR101131163B1 (ko) 2008-12-29 2008-12-29 신뢰성이 향상된 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름

Publications (2)

Publication Number Publication Date
WO2010076990A2 WO2010076990A2 (fr) 2010-07-08
WO2010076990A3 true WO2010076990A3 (fr) 2010-09-23

Family

ID=42310319

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/007519 WO2010076990A2 (fr) 2008-12-29 2009-12-16 Compositions pour un film conducteur anisotrope, et film conducteur anisotrope les utilisant

Country Status (3)

Country Link
KR (1) KR101131163B1 (fr)
TW (1) TWI410474B (fr)
WO (1) WO2010076990A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101351617B1 (ko) * 2010-12-23 2014-01-15 제일모직주식회사 이방 도전성 필름
KR101397690B1 (ko) * 2010-12-31 2014-05-22 제일모직주식회사 이방 전도성 필름
TWI504073B (zh) * 2013-01-10 2015-10-11 Pioneer Material Prec Tech Co Ltd 導電連接件、其製造方法與使用方法
WO2015102320A1 (fr) * 2014-01-06 2015-07-09 주식회사 동진쎄미켐 Composition permettant de former un film conducteur, et film conducteur
WO2021034144A1 (fr) * 2019-08-21 2021-02-25 주식회사 아모그린텍 Plastique dissipateur de chaleur
CN114149264A (zh) * 2021-12-14 2022-03-08 福建臻璟新材料科技有限公司 一种原位聚合成型氮化硅陶瓷薄片的制备工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001248A1 (fr) * 1991-07-12 1993-01-21 Minnesota Mining And Manufacturing Company Film adhesif conducteur anisotrope
WO2000060614A1 (fr) * 1999-04-01 2000-10-12 Mitsui Chemicals, Inc. Pate a conduction anisotrope
JP2001291431A (ja) * 2000-04-10 2001-10-19 Jsr Corp 異方導電性シート用組成物、異方導電性シート、その製造方法および異方導電性シートを用いた接点構造
JP2005126569A (ja) * 2003-10-23 2005-05-19 Sumitomo Bakelite Co Ltd 異方導電性接着剤、異方導電性接着フィルムおよび表示装置
KR100722121B1 (ko) * 2006-07-21 2007-05-25 제일모직주식회사 고신뢰성 이방 전도성 필름용 조성물
KR100787740B1 (ko) * 2006-12-19 2007-12-24 제일모직주식회사 고신뢰성 이방 전도성 필름용 조성물

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6166722A (ja) * 1984-09-11 1986-04-05 Univ Tohoku 熱可塑性ポリエステル−ポリシロキサンブロック共重合体
DE102005051579A1 (de) 2005-10-27 2007-05-03 Wacker Chemie Ag Polyester-Polysiloxan-Copolymere und Verfahren zu deren Herstellung
KR100787727B1 (ko) * 2006-10-31 2007-12-24 제일모직주식회사 스티렌-아크릴로니트릴 공중합체를 이용한 고신뢰성 이방전도성 필름용 조성물

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001248A1 (fr) * 1991-07-12 1993-01-21 Minnesota Mining And Manufacturing Company Film adhesif conducteur anisotrope
WO2000060614A1 (fr) * 1999-04-01 2000-10-12 Mitsui Chemicals, Inc. Pate a conduction anisotrope
JP2001291431A (ja) * 2000-04-10 2001-10-19 Jsr Corp 異方導電性シート用組成物、異方導電性シート、その製造方法および異方導電性シートを用いた接点構造
JP2005126569A (ja) * 2003-10-23 2005-05-19 Sumitomo Bakelite Co Ltd 異方導電性接着剤、異方導電性接着フィルムおよび表示装置
KR100722121B1 (ko) * 2006-07-21 2007-05-25 제일모직주식회사 고신뢰성 이방 전도성 필름용 조성물
KR100787740B1 (ko) * 2006-12-19 2007-12-24 제일모직주식회사 고신뢰성 이방 전도성 필름용 조성물

Also Published As

Publication number Publication date
TW201035276A (en) 2010-10-01
KR101131163B1 (ko) 2012-03-28
KR20100077793A (ko) 2010-07-08
TWI410474B (zh) 2013-10-01
WO2010076990A2 (fr) 2010-07-08

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