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WO2009122765A1 - Elément optique à vision latérale et système de traitement d'images - Google Patents

Elément optique à vision latérale et système de traitement d'images Download PDF

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Publication number
WO2009122765A1
WO2009122765A1 PCT/JP2009/051284 JP2009051284W WO2009122765A1 WO 2009122765 A1 WO2009122765 A1 WO 2009122765A1 JP 2009051284 W JP2009051284 W JP 2009051284W WO 2009122765 A1 WO2009122765 A1 WO 2009122765A1
Authority
WO
WIPO (PCT)
Prior art keywords
prism
optical member
electronic component
prisms
side edge
Prior art date
Application number
PCT/JP2009/051284
Other languages
English (en)
Japanese (ja)
Inventor
潤 北村
Original Assignee
マイクロ・スクェア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008092495A external-priority patent/JP2011122820A/ja
Application filed by マイクロ・スクェア株式会社 filed Critical マイクロ・スクェア株式会社
Publication of WO2009122765A1 publication Critical patent/WO2009122765A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements

Definitions

  • the present invention relates to a side-viewing optical member for confirming a mounting portion formed between a substrate and an electronic component such as a so-called BGA (Ball Grid Array) package mounted on the substrate.
  • the present invention relates to an image processing system provided.
  • a scope is used to check the BGA package mounting part.
  • This scope includes a side-viewing prism having a reflecting surface facing a portion to be inspected of the BGA package, and an imaging unit including a CCD camera.
  • the imaging unit is disposed on the BGA package substrate via the side-viewing prism in a state where the side-viewing prism is disposed so as to face the inspection target portion of the BGA package mounted on the substrate.
  • the mounting part is imaged.
  • the imaging unit and the side viewing prism are integrally configured, and the user grasps the scope and moves it with respect to the side edge of the BGA package, thereby confirming the mounting part. It is carried out.
  • the side-viewing prism is narrower than the side edge of the BGA package, the side-viewing prism is used to inspect all the mounting parts formed over the entire width of the side edge. It is necessary to inspect each time by sequentially shifting along the side edge of the BGA package, and it is necessary to make settings such as alignment each time the inspection site is changed.
  • the side viewing prism is moved along the side edge in a state of being close to the side edge of the BGA package, if the imaging unit and the side viewing prism are displaced from the path to be moved, depending on the case. There is a risk of damaging or destroying the BGA package.
  • the side viewing prism As small as possible in consideration of movement, but if the size is reduced, the viewing angle becomes small. For this reason, it becomes difficult to image the mounting portion of the BGA package, that is, the entire ball.
  • the present invention provides a side-viewing optical member that can easily check a plurality of mounting portions formed over the entire width of a side edge of an electronic component and a part thereof.
  • An object of the present invention is to provide an image processing system including the optical member.
  • the side-viewing optical member of the first configuration of the present invention has a reflective surface that faces the side edge over the entire width of one side edge of the electronic component mounted on the substrate. It is characterized by that.
  • the optical member for side viewing according to the second configuration of the present invention includes a pair of prisms and a holder that holds the prisms at a predetermined interval, and the prisms are inclined.
  • a bottom surface and a horizontal top surface are formed, and the bottom surface is formed as a reflecting surface that is lowered toward the opposing prism side, and the reflecting surface faces the side edge over the entire width of one side edge of the electronic component.
  • the light that is formed and is incident from the upper surface of one of the pair of prisms is reflected to the other prism at the bottom surface of the prism.
  • the holder includes a fixing portion attached to each of the pair of prisms, and an adjustment portion that adjusts a distance between the fixing portions.
  • the adjustment unit includes a bar fixed to one fixing unit and slidably connected to the other fixing unit, and the other fixing unit is guided by the bar and moved, thereby separating the pair of prisms from each other. Changes.
  • the adjustment unit includes a pair of arms whose base end portions are rotatably attached to the respective fixed portions and whose tip portions are slidably connected to the other fixed portions, and the arms rotate at an intermediate portion in the longitudinal direction. It is connected via a shaft, and a pair of arms may be configured to expand and contract in a pantograph manner so that the interval between the pair of prisms is changed.
  • an image processing system includes a side-viewing optical member, an imaging unit provided on the other prism, and a processing unit that processes an image captured by the imaging unit.
  • the electronic component mounted on the substrate is disposed between the bottom surfaces of the pair of prisms, the light from the light source provided on the upper side of the one prism is reflected by the bottom surface of the one prism, and the electronic component is mounted.
  • the imaging unit takes an image of the mounting part of the electronic component while being back-lit by the light source, and the processing unit processes the image of the mounting part. It is said.
  • the image of the mounting part imaged by the imaging unit is obtained as a black and white image by back illumination with a light source, for example, and the gap between the balls is white and the ball and the foreign object are imaged black.
  • the side-viewing optical member is disposed so as to face the entire width of the side edge of the electronic component to be observed.
  • the imaging unit is moved along the side edge of the electronic component above the side-viewing optical member, so that the imaging unit is provided along the side edge of the electronic component mounted on the substrate. It is possible to accurately scan all the balls that have been played.
  • the conventional scope in order to thoroughly inspect a plurality of balls of the entire width at one side edge of an electronic component, it is necessary to change the position of the scope many times.
  • the side-viewing optical member surrounds all the side edges of the electronic component and the imaging unit moves along the upper surface of the side-viewing optical member, all of the electronic components provided along all the side edges of the electronic component Since an enlarged image of the ball can be obtained, the conventional troublesome work can be eliminated.
  • the side viewing optical member facing the side edge of the electronic component is fixedly arranged.
  • the side-viewing optical member does not accidentally touch the side edge of the electronic component and damage or destroy the electronic component.
  • the imaging unit that moves during scanning does not include the side-viewing optical member, the weight of the entire imaging unit is reduced, and the driving means for moving the imaging unit can be reduced in size and the cost can be reduced. .
  • the side-viewing optical member When the side-viewing optical member is disposed so as to face two side edges of the electronic component, or when it is placed so as to face all side edges of the electronic component, the side-viewing optical The number of positioning of the member with respect to the side edge of the electronic component is reduced. Accordingly, it is possible to confirm the mounting portion of the electronic component to be observed in a shorter time.
  • An angle adjusting reflecting member that is supported so as to be swingable around a swinging axis parallel to the side edge of the corresponding electronic component, and an angle at which the reflecting member swings around the swinging axis. And an adjustment mechanism, the angle adjustment reflection member is swung by the angle adjustment mechanism, and is incident on the angle adjustment reflection member from the side edge of the electronic component through the side viewing optical member.
  • the optical axis can be shaken. Therefore, even if the viewing angle with respect to the mounting portion of the side edge of the electronic component of the imaging unit is narrow, that is, the side-viewing optical member is small, the optical axis is swung by swinging the angle-adjusting reflecting member. It is possible to observe the entire mounting part.
  • the side-viewing optical member is composed of a prism having a total reflection surface facing the side edge of the electronic component, and the exit surface facing the imaging unit of the prism corresponds to the swing of the angle-adjusting reflection member. When the angle adjustment reflecting member is enlarged, the optical axis incident on the angle adjustment reflecting member from the side edge of the electronic component through the side viewing optical member is swung by the swing of the angle adjusting reflecting member.
  • a wedge prism disposed between the side-viewing optical member and the corresponding side edge of the electronic component is provided, and the wedge prism is formed so as to gradually increase in thickness from the optical axis toward one side.
  • the optical path on the electronic component side is shifted from the wedge prism to one side.
  • the optical path on the electronic component side from the reflecting surface is opposite to the one side. It is possible to reliably observe the main part of the mounting part on the electronic component side.
  • the reflective surface of the side-viewing optical member is formed in a convex shape toward the corresponding side edge of the electronic component and the imaging unit, the viewing angle with respect to the mounting portion of the side edge of the electronic component of the imaging unit is narrow. In other words, even if the side-viewing optical member is small, the entire mounting portion can be reliably observed by enlarging the optical path on the electronic component side from the reflecting surface.
  • the mounting portion as the observation portion is imaged by the imaging portion in a back-illuminated state and obtained as a so-called binary black and white image, image processing is easy. As this image processing, it is possible to detect the pitch interval and height of the balls and the foreign matter between the balls.
  • FIG. 2 is a perspective view of a prism device in the electronic component mounting portion confirmation scope of FIG. 1.
  • A is a schematic front view which shows the optical system of the mounting part confirmation scope of the electronic component of FIG. 1
  • (B) is a schematic side view.
  • FIG. 2 is a front view showing in detail a swing mechanism of the electronic component mounting portion confirmation scope of FIG. 1.
  • FIG. 16 It is the schematic which shows the image of the mounting part observed with the usage method shown in FIG. It is a perspective view which shows the lens apparatus for mounting part confirmation of the electronic component which concerns on 6th Embodiment of this invention. It is a perspective view which shows the lens apparatus for mounting part confirmation of the electronic component which concerns on the modification of 6th Embodiment of this invention. It is a figure which shows the image processing system which concerns on 7th Embodiment of this invention. It is a figure which shows the example of an image of the observation part which the imaging part in the image processing system of FIG. 16 imaged. It is a figure which shows the example of an image of the observation part which the imaging part in the image processing system of FIG. 16 imaged. It is a figure for demonstrating operation
  • FIG. 1 shows a configuration of a scope 10 for checking a mounting portion of an electronic component according to the first embodiment of the present invention.
  • the scope 10 includes a stage 12 that supports a substrate 11a on which a BGA package 11 as an electronic component is mounted, and a prism unit (side view) for mounting portion confirmation that is disposed to face a side edge of the BGA package 11 on the substrate 11a.
  • Optical member) 100 and an imaging unit 14 supported so as to be relatively movable with respect to the upper surface of the prism device 100.
  • an imaging signal captured by the imaging unit 14 is displayed on the display unit. 15 to display the image.
  • the stage 12 has a known configuration, and moves the substrate 11a, the BGA package 11 mounted on the substrate 11a, and the prism device 100 mounted on the substrate 11a in two horizontal directions orthogonal to each other, that is, the X direction and the Y direction. It is configured to let you.
  • the illustrated stage 12 includes an X stage 12A movable in the X direction, a Y stage 12B mounted on the X stage 12A and movable in the Y direction, and a first drive mechanism 12C for moving the X stage. And a second drive mechanism 12D for moving the Y stage.
  • the stage is not limited to that of the present embodiment.
  • the prism device 100 is formed so as to face all the side edges of the BGA package 11. That is, the prism device 100 is configured in a frame shape by combining the four prisms 101 so as to surround the BGA package 11 whose outer shape in plan view is a quadrangle.
  • One prism 101 is formed to face one side edge of the BGA package 11.
  • each prism 101 is formed in a trapezoidal shape with a cross section being vertically long, and a mounting portion between the side edge of the BGA package 11 and the substrate 11a, that is, a ball 11b.
  • the reflecting surface 101A and the horizontal upper surface 101B are disposed so as to be inclined at an angle of 40 to 50 degrees, for example, 45 degrees.
  • each prism 101 is formed wide so as to face the entire width of one side edge of the BGA package 11.
  • These prisms 101 are made of a transparent material such as quartz, transparent resin, or glass.
  • the imaging unit 14 includes an imaging element 14a and an optical system 14b.
  • the image sensor 14a is composed of, for example, a CCD, and accumulates light incident on the imaging surface and converts it into an electrical signal, thereby capturing an image formed on the imaging surface and outputting it as an image signal.
  • the optical system 14b includes a lens 14c made of, for example, a zoom lens, and a pair of relay prisms 14d and 14e for bending the optical path.
  • the optical system 14b guides light incident from the BGA package 11 through the prism device 100 to the image sensor 14a.
  • the relay prisms 14d and 14e of the optical system 14b are selected so that the width W2 along the width direction of the prism 101 covers the optical path of the lens 14c, as shown in FIG. 3B. Therefore, these relay prisms 14 d and 14 e are formed narrower than the width W 1 of the prism 101.
  • the optical system 14b is opposed to the upper surface 101B of the prism 101, and has a pair of light sources 14f on both sides of the relay prism 14d in a direction parallel to the side edge of the BGA package 11 (in the direction of arrow A in FIG. 3B). It has.
  • These light sources 14f are composed of, for example, one or more LEDs, and illuminate the vicinity of the ball 11b on the side edge of the BGA package 11 to be observed via the prism 101.
  • Each of the light sources 14f is disposed so as to be inclined inward so that the optical axis thereof intersects with the optical axis of the imaging unit 14 at the side edge of the BGA package 11. Thereby, the side edge area
  • the imaging unit 14 moves the upper surfaces 101B of the four prisms 101 arranged to face the four side edges of the BGA package 11 in the A direction (FIG. 3B) as the stage 12 moves in the XY direction. ))).
  • the imaging element 14a of the imaging unit 14 is mounted on the side edge of the BGA package 11 via the optical system 14b and the prism 101, that is, Each mounting portion can be imaged over the entire width of one side edge of the BGA package 11 by scanning in the longitudinal direction (A direction).
  • the relay prism 14d of the image pickup unit 14 is supported so as to be swingable around a swing shaft 14g (see FIG. 5) extending in the A direction, that is, in the B direction (see FIG. 3 (A)). It functions as a reflective member.
  • the relay prism 14d is swung by a swing mechanism 16 as an angle adjusting mechanism described below.
  • the swing mechanism 16 includes a lever 17 attached to the swing shaft 14 g, a tension spring 18, and a push screw 19.
  • the lever 17 is configured in an L shape from a first arm 17a extending upward from the swing shaft 14g and a second arm 17b extending from the swing shaft 14g to one side in the horizontal direction (rightward in FIG. 5). Has been.
  • the tension spring 18 has one end 18a fixed to the inner wall of the housing 25 and the other end 18b locked to the tip of the second arm 17b so as to pull the tip of the second arm 17b upward.
  • the push screw 19 is screwed into the housing 25 of the imaging unit 14, and by screwing, the tip of the push screw 19 protrudes from the inner wall of the housing 25 to resist the tension of the tension spring 18.
  • One arm 17a is rotated around the swing shaft 14g in the direction of arrow C in FIG.
  • the push screw 19 is loosened, the upper end of the first arm 17 a follows the tip of the push screw 19 by the tension of the tension spring 18.
  • the scope 10 according to the first embodiment of the present invention is configured as described above, and when checking the mounting state of the BGA package 11 mounted on the substrate 11a, the following operation is performed.
  • the substrate 11 a is set on the stage 12.
  • the imaging unit 14 is arranged to face each side edge of the BGA package 11 supported on the stage 12, that is, the upper surface of each prism 101. Scan along 101B.
  • the light source 14f emits light, so that the light from the light source 14f enters the prism 101 from the upper surface 101B, is reflected by the reflecting surface 101A, and is irradiated on the mounting portion on the side edge of the BGA package 11.
  • region which should be imaged with the imaging part 14 among the balls 11b of the mounting part of the side edge of the BGA package 11 is illuminated.
  • the light reflected by the ball 11b on the mounting portion on the side edge of the BGA package 11 by this illumination light is incident on the prism 101 again, reflected by the reflecting surface 101A, traveled upward, and emitted from the upper surface 101B.
  • An image is formed on the imaging surface of the imaging device 14a via the relay prisms 14d and 14e and the lens 14c.
  • the image sensor 14 a captures an image formed on the imaging surface, generates an image signal, and sends the image signal to the display unit 15.
  • the ball 11b of the mounting portion on the side edge of the BGA package 11 is enlarged and displayed on the screen of the display unit 15. Therefore, the user can easily confirm the mounting state.
  • the imaging unit 14 moves in the longitudinal direction along the prism device 100, that is, the upper surface 101 ⁇ / b> B of each prism 101, so that the mounting portions on all side edges of the BGA package 11 can be confirmed.
  • the prism device 100 surrounds all the side edges of the BGA package 11 and the imaging unit 14 moves along the upper surface 101B of the prism device 100, the prism device 100 is provided along all the side edges of the BGA package 11. Since the enlarged images of all the balls can be obtained, the conventional troublesome work can be eliminated. Further, since the prism device 100 is fixedly arranged with respect to the BGA package 11 during scanning, the prism device 100 does not accidentally hit the BGA package 11 to be damaged or broken.
  • the relay prism 14d swings around the swing shaft 14g.
  • the optical axis of the imaging unit 14 is swung from the relay prism 14d on the BGA package 11 side, and the ball 11b on the mounting portion at the side edge of the BGA package 11 is. Is aligned vertically near the upper end or the lower end of the ball 11b. Therefore, an image near the upper end or near the lower end of the ball 11b can be formed on the image pickup surface of the image pickup device 14a in a good state and reliably observed.
  • the prism device 100 has the side surface 101C opposite to the BGA package 11 formed vertically, but is indicated by a chain line in FIG. Thus, it may be formed to be inclined so as to become thicker upward. In this case, when the optical axis is swung by the swing of the relay prism 14d, more light flux around the optical axis emitted from the prism device 100 is guided to the relay prism 14d, so that a brighter and easier-to-view image can be obtained. Become.
  • FIG. 6 shows a main part of a scope 20 for checking a mounting portion of an electronic component according to the second embodiment of the present invention.
  • the scope 20 has the same configuration as that of the scope 10 according to the first embodiment shown in FIG. 1, and instead of the prism device 100 and the relay prisms 14 d and 14 e, the side view mirror 21, the angle adjustment mirror 22, and the fixed mirror 23.
  • the configuration differs only in that In this case, the side viewing mirror 21 is selected such that the inclination angle ⁇ with respect to the side edge of the BGA package 11 is greater than 45 degrees (45 degrees + ⁇ ).
  • the light from the lower side of the ball 11b which is the mounting portion of the substrate 11a of the BGA package 11 is more favorably transmitted through the side view mirror 21, the angle adjustment mirror 22, and the fixed mirror 23.
  • the imaging unit 14 Guided to the imaging unit 14. Therefore, the lower side of the ball 11b is imaged well, and the mounting state can be confirmed more reliably.
  • FIG. 7 shows a main part of a scope 30 for checking a mounting portion of an electronic component according to the third embodiment of the present invention.
  • the scope 30 is provided with a wedge prism 31 on the BGA package 11 side at the lower end of the prism device 100 while omitting the swing mechanism 16. Only the configuration is different.
  • the wedge prism 31 is provided on the lower side from the height of almost half of the ball 11b on the side edge of the BGA package 11, and is formed so as to gradually increase in thickness downward.
  • the inclination angle of the total reflection surface 101A of the prism device 100 is set so that the optical axis reflected by the total reflection surface 101A is on the upper side of the ball 11b, which is the mounting portion of the side edge of the BGA package 11.
  • the upper side of the ball 11b is well guided to the imaging unit 14, and the light transmitted through the lower wedge prism 31 is refracted by the angle ⁇ , so that the ball 11b
  • the lower side is satisfactorily guided to the imaging unit 14 via the wedge prism 31. Therefore, the upper side and the lower side of the ball 11b are well imaged by the imaging unit 14.
  • FIG. 8 shows a main part of a scope 40 for checking a mounting portion of an electronic component according to the fourth embodiment of the present invention.
  • the scope 40 has the swing mechanism 16 omitted, and the total reflection surface 101A of the prism device 100 faces the BGA package 11 side and the upper surface 101B.
  • the configuration differs only in that the reflective surface 43A is formed in a convex shape (as viewed from the inside).
  • the total reflection surface 43A has the same shape in the A direction (direction perpendicular to the paper surface in FIG. 8), and forms a convex cylindrical surface as a whole.
  • the reflected light from the total reflection surface 43A of the prism device 100 is diffused based on the convex shape, so that the ball 11b, which is the mounting portion on the side edge of the BGA package 11, is viewed from above.
  • Light from a wide angle range up to the lower side is reflected by the total reflection surface 43 ⁇ / b> A and is well guided to the imaging unit 14. Therefore, the upper side and the lower side of the ball 11b are well imaged by the imaging unit 14.
  • FIG. 9 is a perspective view showing a mounting portion checking prism device 100A according to a fifth embodiment of the present invention.
  • This prism device 100A is a device for observing a mounting state of a BGA package as an electronic component mounted on a substrate, specifically, ball-shaped solder formed between the substrate and the BGA package.
  • the prism device 100A includes a pair of prisms 110A and 110B and a holder 120 that holds the prisms at a predetermined interval.
  • FIG. 10 is a diagram showing prisms 110A and 110B according to the fifth embodiment, in which (A) is a plan view, (B) is a side view, and (C) is a front view.
  • the prisms 110 ⁇ / b> A and 110 ⁇ / b> B have a rectangular bottom surface 111, a side surface 112 standing up from each side of the bottom surface 111, and a horizontal top surface 113 defined by the upper edge of each side surface 112. And it is composed as a hexahedron.
  • These prisms 110A and 110B are made of a transparent material such as quartz, transparent resin, or glass.
  • the bottom surfaces 111 of the prisms 110A and 110B are formed to be inclined.
  • the bottom surface 11 is formed when one side of the BGA package 11 formed in a rectangular shape, specifically, when the outline of the BGA package 11 is defined by the long side L1 and the short side L2. Is formed in a long rectangular shape along the long side L1.
  • the prisms 110A and 110B of this embodiment do not have a length over the entire width of one side edge of the electronic component, and are set to about 10 mm to 20 mm, for example. In addition, you may provide the length over the full width of the one side edge of an electronic component.
  • the prisms 110A and 110B have a flat plate shape as a whole, and the lower portion forming the tip is formed at an acute angle. Yes.
  • the pair of prisms 110A and 110B configured in this way is supported by the holder 120 so that the lower portion of the acute angle faces downward, the horizontal upper surface faces upward, and the distance between the prisms is constant.
  • the holder 120 includes a pair of fixing parts 121A and 121B attached to the prisms 110A and 110B, and connecting parts 122A and 122B that connect the fixing parts 121A and 121B.
  • the fixing portions 121 ⁇ / b> A and 121 ⁇ / b> B are formed in a rectangular parallelepiped shape along the long side 111 ⁇ / b> A of the prism bottom surface, and have prism insertion holes 123 that penetrate vertically.
  • the prism insertion hole 123 is formed so that the upper portions of the prisms 110A and 110B are inserted.
  • the prisms 110A and 110B are aligned so that the upper surfaces 113 of the prisms 110A and 110B are flush with the upper surfaces 124 of the fixing portions 121A and 121B in a state where they are attached to the prism insertion holes 123 of the fixing portions 121A and 121B. It is desirable to leave.
  • the fixing portions 121A and 121B to which the prisms 110A and 110B are attached are connected to each other by a first connecting portion 122A in which one end portion of one fixing portion 121A and one end portion of the other fixing portion 121B are configured as a bar.
  • the other end portion of one fixing portion 121A and the other end portion of the other fixing portion 121B are connected by a second connecting portion 122B configured similarly as a bar.
  • the holder 120 is configured to have a rectangular shape as a whole.
  • the prisms 110A and 110B are attached to the fixing portions 121A and 121B so that the widest side surfaces are opposed to each other and the bottom surface 111 is lowered toward the opposed prism side.
  • the set of the left prism 110A and the fixing portion 121A that supports it in FIG. 9 is referred to as a first prism unit U1
  • the set of the right prism 110B and the fixing portion 121B that supports it is a second prism. This is referred to as unit U2.
  • the prism device 100A includes the first illumination unit 130 above the upper surface of the prism of the second prism unit U2.
  • the first illumination unit 130 is disposed so as to face the upper surface 113 of the prism 110 ⁇ / b> B, and light from the first illumination unit 130 propagates through the prism 110 ⁇ / b> B toward the bottom surface 111 through the upper surface 113.
  • a pair of second illumination units 131 is provided beside the upper surface of the prism of the first prism unit U1 so as not to cover the upper surface 113 of the prism 110A.
  • the second illumination unit 131 faces the upper surface 113 of the prism 110A, and light from the second illumination unit 131 propagates through the prism 110A toward the bottom surface 111 via the upper surface 113.
  • LED and a light bulb can be used as these 1st illumination part 130 and the 2nd illumination part 131.
  • the prism device 100A according to the fifth embodiment is configured as described above, and when used, as shown in FIG. 12, the BGA package 11 is positioned between the tip portions of the pair of prisms 110A and 110B.
  • the light emitted from the first illumination unit 130 of the second prism unit U2 propagates through the prism 110B of the second prism unit U2, is reflected by the inclined bottom surface 111 of the prism 110B, and becomes BGA. Irradiation is performed toward a ball 11b formed between the package 11 and the substrate 11a.
  • the light passes between the balls 11b or is reflected and travels, enters the acute tip portion of the first prism unit U1 on the opposite side, and enters the inclined bottom surface 111 of the prism 110A of the first prism unit U1.
  • the light is reflected and propagates toward the upper surface 113 through the prism 110A.
  • the light emitted from the upper surface 113 to the outside of the prism enters the imaging unit 14, an observation unit 140 such as a loupe or a microscope.
  • the light from the second prism unit U2 functions as a backlight.
  • the user can mount the side edge of the BGA package 11 as shown in FIG. 13, for example, by the imaging unit 14 or the observation unit 140 such as a magnifying glass or a microscope disposed above the first prism unit U1. Part of the ball 11b can be confirmed.
  • the mounting portion on the side edge of the BGA package 11 can be confirmed.
  • the imaging unit such as a CCD is moved along the side edge of the BGA package 11 above the prism, so that the imaging unit is provided along the side edge of the BGA package 11 with respect to the substrate. All balls can be scanned accurately.
  • the prism device 100A is disposed to face the entire width of one side edge of the BGA package 11, and the observation unit 140 such as a loupe or a microscope moves along the upper surface 113 of the prism device 100A, the BGA package 11 is provided. Since it is possible to obtain enlarged images of all the balls 11b provided along the side edges, the conventional troublesome work can be eliminated.
  • the prisms 110A and 110B are fixedly arranged with respect to the BGA package 11, there is no possibility that the prisms 110A and 110B hit the BGA package 11 accidentally during scanning and are damaged or destroyed.
  • FIG. 14 is a perspective view showing a prism device 100B according to the sixth embodiment of the present invention. Unlike the prism device 100A according to the fifth embodiment, this prism device 100B is second with respect to the first prism unit U1. The position of the prism unit U2 can be changed, that is, the interval D between the prisms 110A and 110B can be adjusted.
  • the prism device 100B includes the adjustment unit 150.
  • the adjustment unit 150 includes connection portions 122A and 122B as the pair of bars and a lock screw 151.
  • One end of each of the rod-shaped connecting portions 122A and 122B is fixed to both ends of the fixing portion 121A of the first prism unit U1, and a portion other than the one end is formed on the fixing portion 121B of the second prism unit U2. Is inserted into the through-hole 125.
  • the fixing portion 121B of the second prism unit U2 is slidable with respect to the connecting portions 122A and 122B, and the movement of the fixing portion 121B along the longitudinal direction of the connecting portions 122A and 122B is restricted.
  • a lock screw 151 is provided at the end of the fixed portion 121B of the second prism unit U2. By tightening the lock screw 151, the tip of the lock screw 151 hits the connecting portion 122A, and the fixing portion 121B is locked at a fixed position.
  • the interval between the prisms 110A and 110B can be adjusted, so that the mounting state of the BGA package 11 having different dimensions can be confirmed with one prism device 100B. .
  • FIG. 15 is a perspective view showing a prism device 100C according to a modification of the sixth embodiment of the present invention.
  • This prism device 100C is different in the configuration of the adjustment unit 150 from the prism device 100B according to the sixth embodiment.
  • the adjustment unit 150A of the present embodiment is configured in a pantograph manner.
  • the adjustment unit 150A is a pair of arms in which the base end portion is rotatably attached to each of the fixing portions 121A and 121B and the distal end portion is slidably connected to the other fixing portions.
  • 153A and 153B are provided.
  • rail members 155A and 155B are attached to the inner surfaces of the fixed portions 121A and 121B.
  • a base end portion of one arm 153A is rotatably attached to an end portion of the rail member 155A, and a distal end portion of the other arm 153B is slidably attached to the rail member 155A.
  • the base end portion of one arm 153B is rotatably attached to the end portion of another rail member 155B, and the tip end portion of the other arm 153A slides on the rail member 155B. It is attached movably.
  • a lock pin 154 is attached to the tip of one arm 153A, and the movement of the arm tip is regulated by tightening the lock pin 154.
  • These arms 153A and 153B are connected to each other via a rotation shaft 156 at an intermediate portion in the longitudinal direction.
  • the distance D between the prisms 110A and 110B can be adjusted by expanding and contracting the pair of arms 153A and 153B in a pantograph type.
  • the mounting state of the BGA package 11 having different dimensions can be confirmed by the prism device 100C.
  • FIG. 16 is a diagram showing an image processing system 200 according to the seventh embodiment of the present invention.
  • This image processing system 200 includes the prism device 100A (or 100B to 100C) as the side-viewing optical member, and one of them.
  • An imaging unit 210 provided on the upper side of the prism 110 ⁇ / b> A, and a processing unit 220 configured as a computer that processes an image captured by the imaging unit 210.
  • the electronic component 11 mounted on the substrate 11a is disposed between the bottom surfaces of the pair of prisms 110A and 110B.
  • the imaging unit 210 captures an image of the mounting portion of the electronic component 11 in a state of being back illuminated by the light source 230, as shown in FIG. That is, the image of the mounting part imaged by the imaging unit 210 is obtained as a black and white image by the back illumination by the light source 230, and the gap between the balls 11b is white, and the balls 11b and foreign matter are imaged black.
  • the processing unit 220 Based on the image thus created, the processing unit 220 performs image processing to measure and detect the ball height H, the ball interval W, and the BGA internal foreign matter X as shown in FIG. Specifically, as shown in FIG. 19A, the processing unit 220 includes a template that shows a black and white silhouette image between good balls, and the acquired image as shown in FIG. It is determined how many parts match the silhouette image. As a result, when the detected number is equal to or less than the set value, it is determined that there is a defect such as a foreign object defect. For the ball height H and the ball interval W, an area that matches the silhouette image is extracted. If the height is based on the center of the area, the average height in the range of ⁇ ⁇ in the horizontal direction is obtained.
  • the processing unit 220 determines that the ball 11b is defective or the like when the height or interval of the balls 11b is equal to or less than a set value.
  • the prism device 100A or 100B to 100C
  • the mounting portion of the BGA package to be observed that is, the solder Since the ball 11b is back illuminated by the light source 230 and can be imaged
  • a substantially binarized image can be obtained.
  • an image with a clear ball shape can be acquired. Therefore, it is possible to easily determine whether the mounting state is good or bad. Specifically, it is possible to accurately measure the ball interval and the ball height.
  • the prism device 100 is disposed so as to face all the side edges of the BGA package 11.
  • the present invention is not limited to this.
  • two side edges or only one edge of the BGA package 11 is provided.
  • the prism device 100 may be composed of two or one prisms 101 so as to have two or one reflecting surfaces 11B so as to face the side edges.
  • the side-viewing mirror 21 as the side-viewing optical member has an inclination angle larger than 45 degrees with respect to the side edge of the BGA package 11.
  • the reflective surface 101A of the prism device 100 may similarly have an inclination angle greater than 45 degrees with respect to the side edge of the BGA package 11.
  • the scope is configured to swing the relay prism 14e, which is a reflection member in the housing 25, but the housing 25 itself on the imaging unit 14a side, more specifically, the housing 25,
  • the scope main body 26 itself formed by combining the lens 14c and the imaging unit 14a may be configured to swing.
  • a shaft for swingably supporting the scope main body 26 is provided on the bracket 12F protruding upward from the upper end of the support column 12E provided attached to the stage 12 shown in FIG.
  • the prism device is moved in the XY direction on the stage 12 so that the imaging unit 14a moves relatively on the prism device.
  • the imaging unit 14a and the scope main body 26 may be supported by a robot arm and moved on the prism device.
  • the ball 11b as the mounting portion of the side edge of the BGA package 11 is observed as an electronic component.
  • the present invention is not limited to this, and mounting of the side edge of another electronic component is performed. Obviously, the part may be observed.
  • the prism device of the present invention may be configured by omitting the first illumination unit 130 and / or the second illumination unit 131.
  • the pair of prisms 110A and 110B are formed in a flat plate shape, the surface facing the other prism and the back surface thereof are formed in parallel, and the surface facing the prism and the bottom surface 111 have sharp edges.
  • the pair of prisms of the present invention may be configured as follows, for example.
  • FIG. 20A is a front view showing a prism 110C according to another embodiment of the present invention
  • FIG. 20B is a side view.
  • the prism 110C includes a bottom surface 111 that is inclined in the same manner as the prisms 110A and 110B described above, but is further inclined downward from the surface P1 facing the other prism toward the back surface P2.
  • the lower surface of the inclined surface 115 and the lower surface of the bottom surface 111 are joined together to form an edge E.
  • the upper surface 113 is formed wider than the bottom surface 111 in the horizontal direction.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

L'invention concerne un élément optique à vision latérale (21, 100, 101) qui permet de vérifier facilement plusieurs portions montées formées sur la largeur totale du bord latéral d'un composant électronique qui comprend une surface réfléchissante (101A) faisant face à un bord latéral d'un composant électronique (11) monté sur un substrat (11a) sur toute la largeur du bord latéral. L'élément optique à vision latérale est muni d'un élément réfléchissant (14d) pour ajuster l'angle, qui est supporté avec faculté de pivotement autour d'un arbre pivotant (14g), et un mécanisme d'ajustement de l'angle (16) pour faire pivoter l'élément réfléchissant (14d) autour de l'arbre pivotant (14g), et il peut changer une région d'imagerie des portions montées par pivotement de l'élément réfléchissant (14d).
PCT/JP2009/051284 2008-03-31 2009-01-27 Elément optique à vision latérale et système de traitement d'images WO2009122765A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008092495A JP2011122820A (ja) 2008-03-31 2008-03-31 電子部品の実装部分確認用スコープ
JP2008-092495 2008-03-31
JP2008-321662 2008-12-17
JP2008321662 2008-12-17

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WO2009122765A1 true WO2009122765A1 (fr) 2009-10-08

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3435136A4 (fr) * 2016-03-31 2019-11-13 Hirosaki University Système d'acquisition d'image multi-surfaces, dispositif d'observation, procédé d'observation, procédé de criblage et procédé de reconstruction stéréoscopique d'un sujet
CN119310009A (zh) * 2024-12-19 2025-01-14 昆山市兴凯胜智能科技有限公司 一种用于风扇拉伸马达壳的检测装置

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JPH06273339A (ja) * 1993-03-19 1994-09-30 N T T Data Tsushin Kk 外観検査装置
JPH0798216A (ja) * 1993-01-26 1995-04-11 Sony Corp 半導体装置の外観検査装置とその検査方法
JPH07110305A (ja) * 1993-10-08 1995-04-25 Tanaka Kikinzoku Kogyo Kk 光沢のある金属面の画像処理検査方法
JPH1175955A (ja) * 1997-09-09 1999-03-23 Takahashi Kanamono Corp クローゼット
JPH11230728A (ja) * 1998-02-10 1999-08-27 Ntt Fanet Systems Kk 検査対象物の外観検査方法とその装置
JPH11304721A (ja) * 1998-04-23 1999-11-05 Sony Corp 外観検査装置
JP2000171224A (ja) * 1998-12-09 2000-06-23 Sony Corp 外観検査装置
JP2003254726A (ja) * 2002-02-28 2003-09-10 Shibuya Kogyo Co Ltd 半導体素子の外観検査装置
WO2005083398A1 (fr) * 2004-02-27 2005-09-09 Technical Co.,Ltd. Système optique d’observation multidirectionnelle simultanée, lecteur d’images, procédé de lecteur d’images et ensemble système optique d’observation multidirectionnelle simultanée
WO2005083399A1 (fr) * 2004-02-27 2005-09-09 Technical Co., Ltd Système optique d’observation simultanée multidirectionnelle, lecteur d’image, procédé de lecture d’image, corps composite à système optique d’observation simultanée multidirectionnelle
JP2008113891A (ja) * 2006-11-06 2008-05-22 Sanyo Electric Co Ltd 光学測定ユニット

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0798216A (ja) * 1993-01-26 1995-04-11 Sony Corp 半導体装置の外観検査装置とその検査方法
JPH06273339A (ja) * 1993-03-19 1994-09-30 N T T Data Tsushin Kk 外観検査装置
JPH07110305A (ja) * 1993-10-08 1995-04-25 Tanaka Kikinzoku Kogyo Kk 光沢のある金属面の画像処理検査方法
JPH1175955A (ja) * 1997-09-09 1999-03-23 Takahashi Kanamono Corp クローゼット
JPH11230728A (ja) * 1998-02-10 1999-08-27 Ntt Fanet Systems Kk 検査対象物の外観検査方法とその装置
JPH11304721A (ja) * 1998-04-23 1999-11-05 Sony Corp 外観検査装置
JP2000171224A (ja) * 1998-12-09 2000-06-23 Sony Corp 外観検査装置
JP2003254726A (ja) * 2002-02-28 2003-09-10 Shibuya Kogyo Co Ltd 半導体素子の外観検査装置
WO2005083398A1 (fr) * 2004-02-27 2005-09-09 Technical Co.,Ltd. Système optique d’observation multidirectionnelle simultanée, lecteur d’images, procédé de lecteur d’images et ensemble système optique d’observation multidirectionnelle simultanée
WO2005083399A1 (fr) * 2004-02-27 2005-09-09 Technical Co., Ltd Système optique d’observation simultanée multidirectionnelle, lecteur d’image, procédé de lecture d’image, corps composite à système optique d’observation simultanée multidirectionnelle
JP2008113891A (ja) * 2006-11-06 2008-05-22 Sanyo Electric Co Ltd 光学測定ユニット

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3435136A4 (fr) * 2016-03-31 2019-11-13 Hirosaki University Système d'acquisition d'image multi-surfaces, dispositif d'observation, procédé d'observation, procédé de criblage et procédé de reconstruction stéréoscopique d'un sujet
CN119310009A (zh) * 2024-12-19 2025-01-14 昆山市兴凯胜智能科技有限公司 一种用于风扇拉伸马达壳的检测装置

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