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WO2009038069A1 - 発光装置、表示装置、発光装置の製造方法 - Google Patents

発光装置、表示装置、発光装置の製造方法 Download PDF

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Publication number
WO2009038069A1
WO2009038069A1 PCT/JP2008/066721 JP2008066721W WO2009038069A1 WO 2009038069 A1 WO2009038069 A1 WO 2009038069A1 JP 2008066721 W JP2008066721 W JP 2008066721W WO 2009038069 A1 WO2009038069 A1 WO 2009038069A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
heat
emitting device
electric conductor
respective leds
Prior art date
Application number
PCT/JP2008/066721
Other languages
English (en)
French (fr)
Inventor
Shuichi Naijo
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Priority to CN2008801075258A priority Critical patent/CN101803046B/zh
Priority to JP2009533147A priority patent/JP5437071B2/ja
Priority to US12/679,104 priority patent/US20100246213A1/en
Publication of WO2009038069A1 publication Critical patent/WO2009038069A1/ja

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/003—Lens or lenticular sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)

Abstract

　発光モジュール４０は、赤色、緑色、青色に発光する８個のＬＥＤと、各ＬＥＤと電気的に接続され、各ＬＥＤに対する給電経路を形成する電気導体部６０と、電気導体部６０とは電気的に分離して設けられ、各ＬＥＤで発生する熱の放熱経路を形成する熱導体部５０と、電気導体部６０および熱導体部５０のそれぞれ一部を含んで各ＬＥＤを封止するレンズ７０とを備えている。そして、電気導体部６０のうちレンズ７０から露出する赤用正リード電極部６１ａ等の各電極や熱導体部５０のうちレンズ７０から露出する放熱部５２等には折り曲げ加工が施される。それによって、発光素子の温度変動およびこれに伴う光量変動を抑制するとともに、発光素子を備えた発光装置の薄型化を図る。
PCT/JP2008/066721 2007-09-21 2008-09-17 発光装置、表示装置、発光装置の製造方法 WO2009038069A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008801075258A CN101803046B (zh) 2007-09-21 2008-09-17 发光装置、显示装置以及发光装置的制造方法
JP2009533147A JP5437071B2 (ja) 2007-09-21 2008-09-17 発光装置および表示装置
US12/679,104 US20100246213A1 (en) 2007-09-21 2008-09-17 Light emitting device, display device and manufacturing method of the light emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-245731 2007-09-21
JP2007245731 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009038069A1 true WO2009038069A1 (ja) 2009-03-26

Family

ID=40467880

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066721 WO2009038069A1 (ja) 2007-09-21 2008-09-17 発光装置、表示装置、発光装置の製造方法

Country Status (5)

Country Link
US (1) US20100246213A1 (ja)
JP (1) JP5437071B2 (ja)
KR (1) KR20100057841A (ja)
CN (1) CN101803046B (ja)
WO (1) WO2009038069A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011146715A (ja) * 2010-01-18 2011-07-28 Lg Innotek Co Ltd 発光素子パッケージ及びこれを備えたライトユニット
GB2478987A (en) * 2010-03-26 2011-09-28 Iti Scotland Ltd Encapsulation of an LED array forming a light concentrator for use with edge-lit light-guided back lights

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130116704A (ko) 2012-04-16 2013-10-24 삼성디스플레이 주식회사 백라이트 어셈블리 및 이를 포함한 표시장치
TWI531754B (zh) * 2012-10-12 2016-05-01 隆達電子股份有限公司 發光燈管
KR20150040414A (ko) * 2013-10-07 2015-04-15 삼성디스플레이 주식회사 백라이트 어셈블리 및 그를 포함하는 표시장치
KR101683771B1 (ko) * 2016-03-22 2016-12-21 지스마트 주식회사 발광 면적의 확장이 가능한 투명전광판

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003318445A (ja) * 2002-04-18 2003-11-07 Seiwa Electric Mfg Co Ltd 発光ダイオードランプ
JP2005005740A (ja) * 1999-03-15 2005-01-06 Gentex Corp 半導体発光エミッタパッケージ
JP2005183531A (ja) * 2003-12-17 2005-07-07 Sharp Corp 半導体発光装置
JP2005339806A (ja) * 2004-05-24 2005-12-08 Seiko Instruments Inc 照明装置およびこれを用いた表示装置
JP2007096240A (ja) * 2005-09-30 2007-04-12 Toyoda Gosei Co Ltd Ｌｅｄ発光装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02224378A (ja) * 1989-02-27 1990-09-06 Hamamatsu Photonics Kk 発光素子
JPH0779082A (ja) * 1993-09-08 1995-03-20 Nec Corp Ｉｃ実装用筐体
JPH11233904A (ja) * 1998-02-18 1999-08-27 Nec Corp 放熱構造プリント基板
US6498440B2 (en) * 2000-03-27 2002-12-24 Gentex Corporation Lamp assembly incorporating optical feedback
TWI342974B (en) * 2006-07-06 2011-06-01 Chimei Innolux Corp Liquid crystal display and backlight module thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005740A (ja) * 1999-03-15 2005-01-06 Gentex Corp 半導体発光エミッタパッケージ
JP2003318445A (ja) * 2002-04-18 2003-11-07 Seiwa Electric Mfg Co Ltd 発光ダイオードランプ
JP2005183531A (ja) * 2003-12-17 2005-07-07 Sharp Corp 半導体発光装置
JP2005339806A (ja) * 2004-05-24 2005-12-08 Seiko Instruments Inc 照明装置およびこれを用いた表示装置
JP2007096240A (ja) * 2005-09-30 2007-04-12 Toyoda Gosei Co Ltd Ｌｅｄ発光装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011146715A (ja) * 2010-01-18 2011-07-28 Lg Innotek Co Ltd 発光素子パッケージ及びこれを備えたライトユニット
US9112129B2 (en) 2010-01-18 2015-08-18 Lg Innotek Co., Ltd. Light emitting diode package and light unit having the same
GB2478987A (en) * 2010-03-26 2011-09-28 Iti Scotland Ltd Encapsulation of an LED array forming a light concentrator for use with edge-lit light-guided back lights
WO2011117649A1 (en) * 2010-03-26 2011-09-29 Iti Scotland Limited Encapsulated led array and edge light guide device comprising such an led array
US9217822B2 (en) 2010-03-26 2015-12-22 Iti Scotland Limited Encapsulated LED array and edge light guide device comprising such an LED array

Also Published As

Publication number Publication date
JP5437071B2 (ja) 2014-03-12
CN101803046A (zh) 2010-08-11
JPWO2009038069A1 (ja) 2011-01-06
US20100246213A1 (en) 2010-09-30
CN101803046B (zh) 2012-09-05
KR20100057841A (ko) 2010-06-01

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