WO2009038069A1 - 発光装置、表示装置、発光装置の製造方法 - Google Patents
発光装置、表示装置、発光装置の製造方法 Download PDFInfo
- Publication number
- WO2009038069A1 WO2009038069A1 PCT/JP2008/066721 JP2008066721W WO2009038069A1 WO 2009038069 A1 WO2009038069 A1 WO 2009038069A1 JP 2008066721 W JP2008066721 W JP 2008066721W WO 2009038069 A1 WO2009038069 A1 WO 2009038069A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- heat
- emitting device
- electric conductor
- respective leds
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 7
- 238000005452 bending Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/003—Lens or lenticular sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801075258A CN101803046B (zh) | 2007-09-21 | 2008-09-17 | 发光装置、显示装置以及发光装置的制造方法 |
JP2009533147A JP5437071B2 (ja) | 2007-09-21 | 2008-09-17 | 発光装置および表示装置 |
US12/679,104 US20100246213A1 (en) | 2007-09-21 | 2008-09-17 | Light emitting device, display device and manufacturing method of the light emitting device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-245731 | 2007-09-21 | ||
JP2007245731 | 2007-09-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009038069A1 true WO2009038069A1 (ja) | 2009-03-26 |
Family
ID=40467880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/066721 WO2009038069A1 (ja) | 2007-09-21 | 2008-09-17 | 発光装置、表示装置、発光装置の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100246213A1 (ja) |
JP (1) | JP5437071B2 (ja) |
KR (1) | KR20100057841A (ja) |
CN (1) | CN101803046B (ja) |
WO (1) | WO2009038069A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011146715A (ja) * | 2010-01-18 | 2011-07-28 | Lg Innotek Co Ltd | 発光素子パッケージ及びこれを備えたライトユニット |
GB2478987A (en) * | 2010-03-26 | 2011-09-28 | Iti Scotland Ltd | Encapsulation of an LED array forming a light concentrator for use with edge-lit light-guided back lights |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130116704A (ko) | 2012-04-16 | 2013-10-24 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 이를 포함한 표시장치 |
TWI531754B (zh) * | 2012-10-12 | 2016-05-01 | 隆達電子股份有限公司 | 發光燈管 |
KR20150040414A (ko) * | 2013-10-07 | 2015-04-15 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 그를 포함하는 표시장치 |
KR101683771B1 (ko) * | 2016-03-22 | 2016-12-21 | 지스마트 주식회사 | 발광 면적의 확장이 가능한 투명전광판 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003318445A (ja) * | 2002-04-18 | 2003-11-07 | Seiwa Electric Mfg Co Ltd | 発光ダイオードランプ |
JP2005005740A (ja) * | 1999-03-15 | 2005-01-06 | Gentex Corp | 半導体発光エミッタパッケージ |
JP2005183531A (ja) * | 2003-12-17 | 2005-07-07 | Sharp Corp | 半導体発光装置 |
JP2005339806A (ja) * | 2004-05-24 | 2005-12-08 | Seiko Instruments Inc | 照明装置およびこれを用いた表示装置 |
JP2007096240A (ja) * | 2005-09-30 | 2007-04-12 | Toyoda Gosei Co Ltd | Led発光装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02224378A (ja) * | 1989-02-27 | 1990-09-06 | Hamamatsu Photonics Kk | 発光素子 |
JPH0779082A (ja) * | 1993-09-08 | 1995-03-20 | Nec Corp | Ic実装用筐体 |
JPH11233904A (ja) * | 1998-02-18 | 1999-08-27 | Nec Corp | 放熱構造プリント基板 |
US6498440B2 (en) * | 2000-03-27 | 2002-12-24 | Gentex Corporation | Lamp assembly incorporating optical feedback |
TWI342974B (en) * | 2006-07-06 | 2011-06-01 | Chimei Innolux Corp | Liquid crystal display and backlight module thereof |
-
2008
- 2008-09-17 WO PCT/JP2008/066721 patent/WO2009038069A1/ja active Application Filing
- 2008-09-17 JP JP2009533147A patent/JP5437071B2/ja not_active Expired - Fee Related
- 2008-09-17 CN CN2008801075258A patent/CN101803046B/zh not_active Expired - Fee Related
- 2008-09-17 KR KR1020107005296A patent/KR20100057841A/ko not_active Ceased
- 2008-09-17 US US12/679,104 patent/US20100246213A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005005740A (ja) * | 1999-03-15 | 2005-01-06 | Gentex Corp | 半導体発光エミッタパッケージ |
JP2003318445A (ja) * | 2002-04-18 | 2003-11-07 | Seiwa Electric Mfg Co Ltd | 発光ダイオードランプ |
JP2005183531A (ja) * | 2003-12-17 | 2005-07-07 | Sharp Corp | 半導体発光装置 |
JP2005339806A (ja) * | 2004-05-24 | 2005-12-08 | Seiko Instruments Inc | 照明装置およびこれを用いた表示装置 |
JP2007096240A (ja) * | 2005-09-30 | 2007-04-12 | Toyoda Gosei Co Ltd | Led発光装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011146715A (ja) * | 2010-01-18 | 2011-07-28 | Lg Innotek Co Ltd | 発光素子パッケージ及びこれを備えたライトユニット |
US9112129B2 (en) | 2010-01-18 | 2015-08-18 | Lg Innotek Co., Ltd. | Light emitting diode package and light unit having the same |
GB2478987A (en) * | 2010-03-26 | 2011-09-28 | Iti Scotland Ltd | Encapsulation of an LED array forming a light concentrator for use with edge-lit light-guided back lights |
WO2011117649A1 (en) * | 2010-03-26 | 2011-09-29 | Iti Scotland Limited | Encapsulated led array and edge light guide device comprising such an led array |
US9217822B2 (en) | 2010-03-26 | 2015-12-22 | Iti Scotland Limited | Encapsulated LED array and edge light guide device comprising such an LED array |
Also Published As
Publication number | Publication date |
---|---|
JP5437071B2 (ja) | 2014-03-12 |
CN101803046A (zh) | 2010-08-11 |
JPWO2009038069A1 (ja) | 2011-01-06 |
US20100246213A1 (en) | 2010-09-30 |
CN101803046B (zh) | 2012-09-05 |
KR20100057841A (ko) | 2010-06-01 |
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