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WO2009035419A3 - An apparatus and method for dicing an ic substrate - Google Patents

An apparatus and method for dicing an ic substrate Download PDF

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Publication number
WO2009035419A3
WO2009035419A3 PCT/SG2008/000346 SG2008000346W WO2009035419A3 WO 2009035419 A3 WO2009035419 A3 WO 2009035419A3 SG 2008000346 W SG2008000346 W SG 2008000346W WO 2009035419 A3 WO2009035419 A3 WO 2009035419A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
inlet rail
dicing
loader
loaded
Prior art date
Application number
PCT/SG2008/000346
Other languages
French (fr)
Other versions
WO2009035419A2 (en
Inventor
Hae Choon Yang
Yun Suk Shin
Original Assignee
Rokko Ventures Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Ventures Pte Ltd filed Critical Rokko Ventures Pte Ltd
Publication of WO2009035419A2 publication Critical patent/WO2009035419A2/en
Publication of WO2009035419A3 publication Critical patent/WO2009035419A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)

Abstract

An apparatus (5) for dicing an integrated circuit substrate having a loader (30) for loading the substrate to the apparatus, said substrate loaded in a first direction corresponding to a loading axis, an inlet rail (35) said inlet rail including a first block (75) movable along said inlet rail (35) to which is loaded the substrate from said loader, wherein said inlet rail is arranged to deliver the first block (75) and substrate towards a chuck table (60) in a second direction orthogonal to the loading axis.
PCT/SG2008/000346 2007-09-12 2008-09-12 An apparatus and method for dicing an ic substrate WO2009035419A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200706569-1A SG151109A1 (en) 2007-09-12 2007-09-12 An apparatus and method for dicing an ic substrate
SG200706569-1 2007-09-12

Publications (2)

Publication Number Publication Date
WO2009035419A2 WO2009035419A2 (en) 2009-03-19
WO2009035419A3 true WO2009035419A3 (en) 2010-10-14

Family

ID=40452736

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2008/000346 WO2009035419A2 (en) 2007-09-12 2008-09-12 An apparatus and method for dicing an ic substrate

Country Status (2)

Country Link
SG (1) SG151109A1 (en)
WO (1) WO2009035419A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5963753A (en) * 1997-01-24 1999-10-05 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
WO2001085367A1 (en) * 2000-05-08 2001-11-15 Avalon Technology Pte Ltd Singulation and sorting system for electronic devices
US20050005849A1 (en) * 2003-05-22 2005-01-13 Noboru Masuoka Semiconductor processing system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5963753A (en) * 1997-01-24 1999-10-05 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
WO2001085367A1 (en) * 2000-05-08 2001-11-15 Avalon Technology Pte Ltd Singulation and sorting system for electronic devices
US20050005849A1 (en) * 2003-05-22 2005-01-13 Noboru Masuoka Semiconductor processing system

Also Published As

Publication number Publication date
SG151109A1 (en) 2009-04-30
WO2009035419A2 (en) 2009-03-19

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