+

WO2009034953A1 - Transistor à couche mince - Google Patents

Transistor à couche mince Download PDF

Info

Publication number
WO2009034953A1
WO2009034953A1 PCT/JP2008/066198 JP2008066198W WO2009034953A1 WO 2009034953 A1 WO2009034953 A1 WO 2009034953A1 JP 2008066198 W JP2008066198 W JP 2008066198W WO 2009034953 A1 WO2009034953 A1 WO 2009034953A1
Authority
WO
WIPO (PCT)
Prior art keywords
thin film
film transistor
layer
layers
disclosed
Prior art date
Application number
PCT/JP2008/066198
Other languages
English (en)
Japanese (ja)
Inventor
Koki Yano
Kazuyoshi Inoue
Shigekazu Tomai
Masashi Kasami
Original Assignee
Idemitsu Kosan Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co., Ltd. filed Critical Idemitsu Kosan Co., Ltd.
Priority to JP2009532177A priority Critical patent/JPWO2009034953A1/ja
Publication of WO2009034953A1 publication Critical patent/WO2009034953A1/fr

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H10D30/6756Amorphous oxide semiconductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile

Landscapes

  • Thin Film Transistor (AREA)
  • Recrystallisation Techniques (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

L'invention concerne un transistor à couche mince comprenant un film semi-conducteur d'oxyde dans lequel une couche cristalline et une couche amorphe sont agencées en couches.
PCT/JP2008/066198 2007-09-10 2008-09-09 Transistor à couche mince WO2009034953A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009532177A JPWO2009034953A1 (ja) 2007-09-10 2008-09-09 薄膜トランジスタ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-233942 2007-09-10
JP2007233942 2007-09-10

Publications (1)

Publication Number Publication Date
WO2009034953A1 true WO2009034953A1 (fr) 2009-03-19

Family

ID=40451960

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066198 WO2009034953A1 (fr) 2007-09-10 2008-09-09 Transistor à couche mince

Country Status (3)

Country Link
JP (1) JPWO2009034953A1 (fr)
TW (1) TWI453915B (fr)
WO (1) WO2009034953A1 (fr)

Cited By (131)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010131310A1 (fr) * 2009-05-13 2010-11-18 パナソニック株式会社 Cellule de mémoire à semi-conducteurs et son procédé de fabrication
JP2011023695A (ja) * 2009-07-15 2011-02-03 Samsung Mobile Display Co Ltd 有機電界発光表示装置及びその製造方法
JP2011029635A (ja) * 2009-07-03 2011-02-10 Semiconductor Energy Lab Co Ltd トランジスタを有する表示装置の作製方法
JP2011029628A (ja) * 2009-06-30 2011-02-10 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2011049549A (ja) * 2009-07-31 2011-03-10 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法
JP2011049539A (ja) * 2009-07-31 2011-03-10 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP2011066070A (ja) * 2009-09-15 2011-03-31 Idemitsu Kosan Co Ltd 多結晶薄膜、その成膜方法、及び薄膜トランジスタ
JP2011077510A (ja) * 2009-09-04 2011-04-14 Semiconductor Energy Lab Co Ltd トランジスタ及び表示装置
JP2011086923A (ja) * 2009-09-16 2011-04-28 Semiconductor Energy Lab Co Ltd トランジスタ及び表示装置
JP2011091375A (ja) * 2009-09-24 2011-05-06 Semiconductor Energy Lab Co Ltd 酸化物半導体膜及び半導体装置
JP2011100979A (ja) * 2009-10-08 2011-05-19 Semiconductor Energy Lab Co Ltd 酸化物半導体膜、および半導体装置
JP2011103452A (ja) * 2009-10-14 2011-05-26 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
JP2011109032A (ja) * 2009-11-20 2011-06-02 Semiconductor Energy Lab Co Ltd 薄膜トランジスタ
WO2011065210A1 (fr) * 2009-11-28 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Matériau d'oxyde empilé, dispositif à semi-conducteurs et procédé pour fabriquer le dispositif à semi-conducteurs
WO2011065216A1 (fr) * 2009-11-28 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Matériau oxyde empilé, dispositif semi-conducteur et procédé de fabrication du dispositif semi-conducteur
WO2011065329A1 (fr) * 2009-11-27 2011-06-03 株式会社日立製作所 Dispositif semi-conducteur oxyde et son procédé de fabrication
JP2011119718A (ja) * 2009-11-06 2011-06-16 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
WO2011070900A1 (fr) * 2009-12-08 2011-06-16 Semiconductor Energy Laboratory Co., Ltd. Dispositif semi-conducteur et son procédé de fabrication
JP2011123986A (ja) * 2009-11-13 2011-06-23 Semiconductor Energy Lab Co Ltd 半導体装置および半導体装置の駆動方法
WO2011074506A1 (fr) * 2009-12-18 2011-06-23 Semiconductor Energy Laboratory Co., Ltd. Dispositif à semi-conducteurs et procédé de fabrication de celui-ci
JP2011129895A (ja) * 2009-11-20 2011-06-30 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
WO2011081009A1 (fr) * 2009-12-28 2011-07-07 Semiconductor Energy Laboratory Co., Ltd. Procédé de fabrication d'un dispositif semi-conducteur
JP2011139054A (ja) * 2009-12-04 2011-07-14 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP2011146713A (ja) * 2010-01-15 2011-07-28 Samsung Electronics Co Ltd 表示基板
JP2011181802A (ja) * 2010-03-03 2011-09-15 Fujifilm Corp Igzo系アモルファス酸化物半導体膜の製造方法及びそれを用いた電界効果型トランジスタの製造方法
CN102194887A (zh) * 2010-03-04 2011-09-21 索尼公司 薄膜晶体管、薄膜晶体管的制造方法以及显示装置
WO2011135987A1 (fr) * 2010-04-28 2011-11-03 Semiconductor Energy Laboratory Co., Ltd. Procédé de fabrication d'un dispositif à semi-conducteur
JP2011237418A (ja) * 2010-04-16 2011-11-24 Semiconductor Energy Lab Co Ltd 電流測定方法、半導体装置の検査方法、半導体装置、および特性評価用回路
JP2011248356A (ja) * 2010-04-28 2011-12-08 Semiconductor Energy Lab Co Ltd 半導体表示装置及びその駆動方法
JP2012015491A (ja) * 2010-06-04 2012-01-19 Semiconductor Energy Lab Co Ltd 光電変換装置
JP2012015436A (ja) * 2010-07-05 2012-01-19 Sony Corp 薄膜トランジスタおよび表示装置
JP2012084863A (ja) * 2010-09-13 2012-04-26 Semiconductor Energy Lab Co Ltd 結晶性酸化物半導体膜の作製方法
JP2012099661A (ja) * 2010-11-02 2012-05-24 Idemitsu Kosan Co Ltd 酸化物半導体の製造方法
WO2012074046A1 (fr) * 2010-12-02 2012-06-07 株式会社神戸製鋼所 Structure de câblage et cible de pulvérisation cathodique
WO2012144557A1 (fr) * 2011-04-22 2012-10-26 株式会社神戸製鋼所 Structure de transistor en couche mince, et transistor en couche mince et dispositif d'affichage comportant ladite structure
KR20120120062A (ko) * 2011-04-22 2012-11-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 상기 반도체 장치의 제작 방법
KR20120125272A (ko) * 2010-01-15 2012-11-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20120127250A (ko) * 2011-05-11 2012-11-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
JP2012248868A (ja) * 2009-11-28 2012-12-13 Semiconductor Energy Lab Co Ltd 半導体装置
JP2012256824A (ja) * 2010-10-29 2012-12-27 Semiconductor Energy Lab Co Ltd 記憶装置
JPWO2011043300A1 (ja) * 2009-10-09 2013-03-04 シャープ株式会社 半導体装置およびその製造方法
JP2013047849A (ja) * 2009-09-04 2013-03-07 Semiconductor Energy Lab Co Ltd 半導体装置
KR20130033308A (ko) * 2011-09-26 2013-04-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
JP2013131765A (ja) * 2009-10-08 2013-07-04 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2013149965A (ja) * 2011-12-23 2013-08-01 Semiconductor Energy Lab Co Ltd 半導体装置
US8546182B2 (en) 2008-11-28 2013-10-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8552425B2 (en) 2010-06-18 2013-10-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN103489881A (zh) * 2011-12-31 2014-01-01 京东方科技集团股份有限公司 一种薄膜晶体管阵列基板及其制造方法和显示器件
US8629496B2 (en) 2010-11-30 2014-01-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8629438B2 (en) 2010-05-21 2014-01-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2014013917A (ja) * 2012-06-06 2014-01-23 Kobe Steel Ltd 薄膜トランジスタ
WO2014025002A1 (fr) * 2012-08-10 2014-02-13 Semiconductor Energy Laboratory Co., Ltd. Dispositif à semi-conducteur et son procédé de fabrication
JP2014029994A (ja) * 2012-06-27 2014-02-13 Semiconductor Energy Lab Co Ltd 半導体装置および半導体装置の作製方法
US8669556B2 (en) 2010-12-03 2014-03-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8704219B2 (en) 2010-03-26 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2014078704A (ja) * 2012-09-24 2014-05-01 Semiconductor Energy Lab Co Ltd 表示装置
KR101396102B1 (ko) * 2009-12-04 2014-05-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101400919B1 (ko) 2010-01-26 2014-05-30 주성엔지니어링(주) 박막 트랜지스터 및 그 제조 방법
JP2015015488A (ja) * 2009-10-30 2015-01-22 株式会社半導体エネルギー研究所 半導体装置
US8945982B2 (en) 2010-04-23 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
JP2015028837A (ja) * 2010-02-05 2015-02-12 株式会社半導体エネルギー研究所 半導体装置
JP2015043428A (ja) * 2009-11-06 2015-03-05 株式会社半導体エネルギー研究所 半導体装置
JP2015092687A (ja) * 2010-01-20 2015-05-14 株式会社半導体エネルギー研究所 半導体装置
JP2015092590A (ja) * 2009-10-30 2015-05-14 株式会社半導体エネルギー研究所 トランジスタ
JP2015092624A (ja) * 2009-06-30 2015-05-14 株式会社半導体エネルギー研究所 半導体装置
JP2015109476A (ja) * 2009-08-07 2015-06-11 株式会社半導体エネルギー研究所 半導体装置
US9059047B2 (en) 2010-04-09 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2015111705A (ja) * 2010-02-12 2015-06-18 株式会社半導体エネルギー研究所 トランジスタの作製方法
JP2015111715A (ja) * 2009-12-11 2015-06-18 株式会社半導体エネルギー研究所 半導体装置
US9082857B2 (en) 2008-09-01 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising an oxide semiconductor layer
US9130067B2 (en) 2008-10-08 2015-09-08 Semiconductor Energy Laboratory Co., Ltd. Display device
US9136389B2 (en) 2008-10-24 2015-09-15 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor, thin film transistor, and display device
JP2015165583A (ja) * 2009-09-24 2015-09-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2015165578A (ja) * 2009-06-30 2015-09-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2015173286A (ja) * 2009-12-18 2015-10-01 株式会社半導体エネルギー研究所 半導体装置
JP2015173278A (ja) * 2009-11-27 2015-10-01 株式会社半導体エネルギー研究所 半導体装置
CN104966738A (zh) * 2015-04-13 2015-10-07 友达光电股份有限公司 主动元件结构及其制作方法
JP2015181163A (ja) * 2010-03-05 2015-10-15 株式会社半導体エネルギー研究所 酸化物半導体膜の作製方法
US9171957B2 (en) 2012-01-26 2015-10-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9184245B2 (en) 2012-08-10 2015-11-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for fabricating the same
US9202927B2 (en) 2010-11-30 2015-12-01 Seminconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9218966B2 (en) 2011-10-14 2015-12-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
US9245958B2 (en) 2012-08-10 2016-01-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2016028432A (ja) * 2009-08-07 2016-02-25 株式会社半導体エネルギー研究所 半導体装置の作製方法
US9281358B2 (en) 2010-11-30 2016-03-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP2016075945A (ja) * 2010-03-31 2016-05-12 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
US9349874B2 (en) 2008-10-31 2016-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9366896B2 (en) 2012-10-12 2016-06-14 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and touch panel
JP2016519847A (ja) * 2013-03-21 2016-07-07 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. 薄膜トランジスタ及びその製造方法、アレイ基板、並びにディスプレイ
US9391097B2 (en) 2011-12-31 2016-07-12 Boe Technology Group Co., Ltd. Thin film transistor, array substrate and method of manufacturing the same and display device
US9419146B2 (en) 2012-01-26 2016-08-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9437747B2 (en) 2012-06-15 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor with multiple oxide semiconductor layers
JP2016171346A (ja) * 2009-12-11 2016-09-23 株式会社半導体エネルギー研究所 半導体装置
JP2016195262A (ja) * 2009-11-06 2016-11-17 株式会社半導体エネルギー研究所 半導体装置
US9553200B2 (en) 2012-02-29 2017-01-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2017062866A (ja) * 2010-08-31 2017-03-30 株式会社半導体エネルギー研究所 半導体装置
JP2017103486A (ja) * 2010-02-05 2017-06-08 株式会社半導体エネルギー研究所 半導体装置
US9691906B2 (en) 2013-10-24 2017-06-27 Joled Inc. Method for producing thin film transistor
US9716183B2 (en) 2014-03-11 2017-07-25 Sharp Kabushiki Kaisha Semiconductor device and method of manufacturing same
US9741860B2 (en) 2011-09-29 2017-08-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9806201B2 (en) 2014-03-07 2017-10-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101811257B1 (ko) 2010-03-31 2017-12-21 후지필름 가부시키가이샤 박막 전계 효과형 트랜지스터 및 그 제조방법
JP2018014530A (ja) * 2011-01-20 2018-01-25 株式会社半導体エネルギー研究所 半導体装置
US9947797B2 (en) 2009-05-29 2018-04-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US10043918B2 (en) 2011-07-08 2018-08-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US10079306B2 (en) 2009-07-31 2018-09-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2018148231A (ja) * 2012-10-17 2018-09-20 株式会社半導体エネルギー研究所 半導体装置
JP2018166220A (ja) * 2013-01-21 2018-10-25 株式会社半導体エネルギー研究所 トランジスタ
US10158026B2 (en) 2012-04-13 2018-12-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including oxide semiconductor stacked layers
US10304859B2 (en) 2013-04-12 2019-05-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an oxide film on an oxide semiconductor film
US10374030B2 (en) 2012-12-28 2019-08-06 Semiconductor Energy Laboratory Co., Ltd. Metal oxide semiconductor device
JP2019179933A (ja) * 2010-12-17 2019-10-17 株式会社半導体エネルギー研究所 トランジスタ及び表示装置
JPWO2018100465A1 (ja) * 2016-12-02 2019-10-31 株式会社半導体エネルギー研究所 半導体装置
JP2019220716A (ja) * 2009-10-30 2019-12-26 株式会社半導体エネルギー研究所 半導体装置
JP2019220543A (ja) * 2018-06-19 2019-12-26 日立金属株式会社 酸化物半導体層、酸化物半導体層形成用スパッタリングターゲット、および薄膜トランジスタ
JP2020014011A (ja) * 2012-11-16 2020-01-23 株式会社半導体エネルギー研究所 半導体装置
JP2020014023A (ja) * 2010-03-26 2020-01-23 株式会社半導体エネルギー研究所 半導体装置の作製方法
US10564698B2 (en) 2016-08-19 2020-02-18 Semiconductor Energy Laboratory Co., Ltd. Method for controlling power supply in semiconductor device
JP2020115544A (ja) * 2009-10-30 2020-07-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2020127034A (ja) * 2009-12-25 2020-08-20 株式会社半導体エネルギー研究所 半導体装置
CN111668315A (zh) * 2013-08-19 2020-09-15 出光兴产株式会社 氧化物半导体基板及肖特基势垒二极管元件
JP2020188276A (ja) * 2008-10-24 2020-11-19 株式会社半導体エネルギー研究所 半導体装置
JP2020198457A (ja) * 2009-11-20 2020-12-10 株式会社半導体エネルギー研究所 半導体装置
EP3790057A1 (fr) * 2019-09-06 2021-03-10 SABIC Global Technologies B.V. Transistor à couche mince à semi-conducteur traité à basse température
JP2021101485A (ja) * 2011-06-17 2021-07-08 株式会社半導体エネルギー研究所 液晶表示装置
US11152493B2 (en) 2009-07-10 2021-10-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2021192448A (ja) * 2010-11-05 2021-12-16 株式会社半導体エネルギー研究所 半導体装置
JP2022000895A (ja) * 2009-11-27 2022-01-04 株式会社半導体エネルギー研究所 半導体装置
JP2022008355A (ja) * 2009-07-17 2022-01-13 株式会社半導体エネルギー研究所 半導体装置の作製方法
EP4207303A4 (fr) * 2021-06-25 2024-01-10 BOE Technology Group Co., Ltd. Transistor à film mince d'oxyde et son procédé de préparation, et dispositif d'affichage
US12159600B2 (en) 2010-01-20 2024-12-03 Semiconductor Energy Laboratory Co., Ltd. Display device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011034012A1 (fr) * 2009-09-16 2011-03-24 Semiconductor Energy Laboratory Co., Ltd. Circuit logique, dispositif électroluminescent, dispositif à semi-conducteurs et dispositif électronique
WO2011048968A1 (fr) * 2009-10-21 2011-04-28 Semiconductor Energy Laboratory Co., Ltd. Dispositif semi-conducteur
WO2011055645A1 (fr) * 2009-11-06 2011-05-12 Semiconductor Energy Laboratory Co., Ltd. Dispositif a semi-conducteur
KR101520024B1 (ko) * 2009-11-28 2015-05-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
KR102008754B1 (ko) 2010-01-24 2019-08-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치와 이의 제조 방법
TWI487034B (zh) * 2010-09-24 2015-06-01 Au Optronics Corp 薄膜電晶體及其製造方法
TWI416737B (zh) * 2010-12-30 2013-11-21 Au Optronics Corp 薄膜電晶體及其製造方法
CN104865761B (zh) * 2014-02-25 2018-06-08 群创光电股份有限公司 显示面板及显示装置
TWI532154B (zh) 2014-02-25 2016-05-01 群創光電股份有限公司 顯示面板及顯示裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037268A (ja) * 2001-07-24 2003-02-07 Minolta Co Ltd 半導体素子及びその製造方法
WO2007063966A1 (fr) * 2005-12-02 2007-06-07 Idemitsu Kosan Co., Ltd. Substrat pour tft et procede de fabrication correspondant

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100659759B1 (ko) * 2004-10-06 2006-12-19 삼성에스디아이 주식회사 바텀 게이트형 박막트랜지스터, 그를 구비하는평판표시장치 및 박막트랜지스터의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037268A (ja) * 2001-07-24 2003-02-07 Minolta Co Ltd 半導体素子及びその製造方法
WO2007063966A1 (fr) * 2005-12-02 2007-06-07 Idemitsu Kosan Co., Ltd. Substrat pour tft et procede de fabrication correspondant

Cited By (553)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10128381B2 (en) 2008-09-01 2018-11-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with oxygen rich gate insulating layer
US9082857B2 (en) 2008-09-01 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising an oxide semiconductor layer
US9397194B2 (en) 2008-09-01 2016-07-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device with oxide semiconductor ohmic conatct layers
US9703157B2 (en) 2008-10-08 2017-07-11 Semiconductor Energy Laboratory Co., Ltd. Display device
US9130067B2 (en) 2008-10-08 2015-09-08 Semiconductor Energy Laboratory Co., Ltd. Display device
US9915843B2 (en) 2008-10-08 2018-03-13 Semiconductor Energy Laboratory Co., Ltd. Display device with pixel including capacitor
US10254607B2 (en) 2008-10-08 2019-04-09 Semiconductor Energy Laboratory Co., Ltd. Display device
JP2020188276A (ja) * 2008-10-24 2020-11-19 株式会社半導体エネルギー研究所 半導体装置
US9136389B2 (en) 2008-10-24 2015-09-15 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor, thin film transistor, and display device
US9911860B2 (en) 2008-10-31 2018-03-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US11107928B2 (en) 2008-10-31 2021-08-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9349874B2 (en) 2008-10-31 2016-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US10269978B2 (en) 2008-10-31 2019-04-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9842942B2 (en) 2008-10-31 2017-12-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US11594643B2 (en) 2008-10-31 2023-02-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8546182B2 (en) 2008-11-28 2013-10-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9722054B2 (en) 2008-11-28 2017-08-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8552434B2 (en) 2008-11-28 2013-10-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
WO2010131310A1 (fr) * 2009-05-13 2010-11-18 パナソニック株式会社 Cellule de mémoire à semi-conducteurs et son procédé de fabrication
US9947797B2 (en) 2009-05-29 2018-04-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9576795B2 (en) 2009-06-30 2017-02-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9985118B2 (en) 2009-06-30 2018-05-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9852906B2 (en) 2009-06-30 2017-12-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US20180233589A1 (en) 2009-06-30 2018-08-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US11417754B2 (en) 2009-06-30 2022-08-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9831101B2 (en) 2009-06-30 2017-11-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2014053624A (ja) * 2009-06-30 2014-03-20 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP7217371B2 (ja) 2009-06-30 2023-02-02 株式会社半導体エネルギー研究所 半導体装置
JP2015092624A (ja) * 2009-06-30 2015-05-14 株式会社半導体エネルギー研究所 半導体装置
JP2020074403A (ja) * 2009-06-30 2020-05-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
US9054137B2 (en) 2009-06-30 2015-06-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US10418467B2 (en) 2009-06-30 2019-09-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2015109454A (ja) * 2009-06-30 2015-06-11 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法
JP2011029628A (ja) * 2009-06-30 2011-02-10 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP7561818B2 (ja) 2009-06-30 2024-10-04 株式会社半導体エネルギー研究所 半導体装置
US10332743B2 (en) 2009-06-30 2019-06-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2020102640A (ja) * 2009-06-30 2020-07-02 株式会社半導体エネルギー研究所 半導体装置
JP7538265B2 (ja) 2009-06-30 2024-08-21 株式会社半導体エネルギー研究所 半導体装置
US8513054B2 (en) 2009-06-30 2013-08-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US10790383B2 (en) 2009-06-30 2020-09-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9136115B2 (en) 2009-06-30 2015-09-15 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2015165578A (ja) * 2009-06-30 2015-09-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
US10090171B2 (en) 2009-06-30 2018-10-02 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2017017338A (ja) * 2009-06-30 2017-01-19 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2022063270A (ja) * 2009-06-30 2022-04-21 株式会社半導体エネルギー研究所 半導体装置
US9412768B2 (en) 2009-06-30 2016-08-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9293566B2 (en) 2009-06-30 2016-03-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR20180110174A (ko) * 2009-06-30 2018-10-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 제조 방법
KR102011616B1 (ko) * 2009-06-30 2019-08-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 제조 방법
US9299807B2 (en) 2009-06-30 2016-03-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US10211231B2 (en) 2009-07-03 2019-02-19 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US10714503B2 (en) 2009-07-03 2020-07-14 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US9837441B2 (en) 2009-07-03 2017-12-05 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US9130046B2 (en) 2009-07-03 2015-09-08 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
TWI471950B (zh) * 2009-07-03 2015-02-01 Semiconductor Energy Lab 包括電晶體的顯示裝置和其製造方法
JP2011029635A (ja) * 2009-07-03 2011-02-10 Semiconductor Energy Lab Co Ltd トランジスタを有する表示装置の作製方法
US9812465B2 (en) 2009-07-03 2017-11-07 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US12272698B2 (en) 2009-07-03 2025-04-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising driver circuit
US11257847B2 (en) 2009-07-03 2022-02-22 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US11637130B2 (en) 2009-07-03 2023-04-25 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US8735884B2 (en) 2009-07-03 2014-05-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including oxide semiconductor
US11978741B2 (en) 2009-07-03 2024-05-07 Semiconductor Energy Laboratory Co., Ltd. Display device including transistor and manufacturing method thereof
US11152493B2 (en) 2009-07-10 2021-10-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US11855194B2 (en) 2009-07-10 2023-12-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2011023695A (ja) * 2009-07-15 2011-02-03 Samsung Mobile Display Co Ltd 有機電界発光表示装置及びその製造方法
JP2022008355A (ja) * 2009-07-17 2022-01-13 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP7150958B2 (ja) 2009-07-17 2022-10-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2011049549A (ja) * 2009-07-31 2011-03-10 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法
US10079306B2 (en) 2009-07-31 2018-09-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9362416B2 (en) 2009-07-31 2016-06-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor wearable device
JP2015111684A (ja) * 2009-07-31 2015-06-18 株式会社半導体エネルギー研究所 半導体装置
JP7336499B2 (ja) 2009-07-31 2023-08-31 株式会社半導体エネルギー研究所 表示装置
JP7609942B2 (ja) 2009-07-31 2025-01-07 株式会社半導体エネルギー研究所 半導体装置
US9741779B2 (en) 2009-07-31 2017-08-22 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor device
JP2011049539A (ja) * 2009-07-31 2011-03-10 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US9024313B2 (en) 2009-07-31 2015-05-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10680111B2 (en) 2009-07-31 2020-06-09 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor device
JP2016167612A (ja) * 2009-07-31 2016-09-15 株式会社半導体エネルギー研究所 電子機器
JP2017204654A (ja) * 2009-07-31 2017-11-16 株式会社半導体エネルギー研究所 半導体装置
JP2022024005A (ja) * 2009-07-31 2022-02-08 株式会社半導体エネルギー研究所 半導体装置
JP2019091938A (ja) * 2009-07-31 2019-06-13 株式会社半導体エネルギー研究所 半導体装置
US11947228B2 (en) 2009-07-31 2024-04-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8937306B2 (en) 2009-07-31 2015-01-20 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor
US11106101B2 (en) 2009-07-31 2021-08-31 Semiconductor Energy Laboratory Co., Ltd. Display device
JP2016028432A (ja) * 2009-08-07 2016-02-25 株式会社半導体エネルギー研究所 半導体装置の作製方法
US9202851B2 (en) 2009-08-07 2015-12-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP2015109476A (ja) * 2009-08-07 2015-06-11 株式会社半導体エネルギー研究所 半導体装置
US9954005B2 (en) 2009-08-07 2018-04-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor layer
US10418384B2 (en) 2009-09-04 2019-09-17 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
JP2017120926A (ja) * 2009-09-04 2017-07-06 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP2022095639A (ja) * 2009-09-04 2022-06-28 株式会社半導体エネルギー研究所 表示装置
US9954007B2 (en) 2009-09-04 2018-04-24 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
US12272697B2 (en) 2009-09-04 2025-04-08 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
US9368641B2 (en) 2009-09-04 2016-06-14 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
JP2018174354A (ja) * 2009-09-04 2018-11-08 株式会社半導体エネルギー研究所 半導体装置
US9640670B2 (en) 2009-09-04 2017-05-02 Semiconductor Energy Laboratory Co., Ltd. Transistors in display device
US9105735B2 (en) 2009-09-04 2015-08-11 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
JP2013047849A (ja) * 2009-09-04 2013-03-07 Semiconductor Energy Lab Co Ltd 半導体装置
US10665615B2 (en) 2009-09-04 2020-05-26 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
JP2011077510A (ja) * 2009-09-04 2011-04-14 Semiconductor Energy Lab Co Ltd トランジスタ及び表示装置
US11862643B2 (en) 2009-09-04 2024-01-02 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
US11094717B2 (en) 2009-09-04 2021-08-17 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
JP2011066070A (ja) * 2009-09-15 2011-03-31 Idemitsu Kosan Co Ltd 多結晶薄膜、その成膜方法、及び薄膜トランジスタ
JP2018152605A (ja) * 2009-09-16 2018-09-27 株式会社半導体エネルギー研究所 トランジスタ
JP2017103469A (ja) * 2009-09-16 2017-06-08 株式会社半導体エネルギー研究所 半導体装置
JP2015015478A (ja) * 2009-09-16 2015-01-22 株式会社半導体エネルギー研究所 半導体装置
JP2014239242A (ja) * 2009-09-16 2014-12-18 株式会社半導体エネルギー研究所 半導体装置
JP2016006912A (ja) * 2009-09-16 2016-01-14 株式会社半導体エネルギー研究所 酸化物半導体層および半導体装置
US9935202B2 (en) 2009-09-16 2018-04-03 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device comprising oxide semiconductor layer
EP2478554B1 (fr) * 2009-09-16 2016-06-08 Semiconductor Energy Laboratory Co., Ltd. Transistor et dispositif d'affichage
JP2016174160A (ja) * 2009-09-16 2016-09-29 株式会社半導体エネルギー研究所 酸化物半導体層、半導体装置
JP2011086923A (ja) * 2009-09-16 2011-04-28 Semiconductor Energy Lab Co Ltd トランジスタ及び表示装置
US9214563B2 (en) 2009-09-24 2015-12-15 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
KR102180761B1 (ko) * 2009-09-24 2020-11-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
US9318617B2 (en) 2009-09-24 2016-04-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
JP2011091375A (ja) * 2009-09-24 2011-05-06 Semiconductor Energy Lab Co Ltd 酸化物半導体膜及び半導体装置
US9520288B2 (en) 2009-09-24 2016-12-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including IGZO layer and manufacturing method thereof
KR102054650B1 (ko) * 2009-09-24 2019-12-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
JP2022082632A (ja) * 2009-09-24 2022-06-02 株式会社半導体エネルギー研究所 半導体装置
KR20200133002A (ko) * 2009-09-24 2020-11-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
KR102321565B1 (ko) * 2009-09-24 2021-11-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
JP7297965B2 (ja) 2009-09-24 2023-06-26 株式会社半導体エネルギー研究所 表示装置
JP2020025113A (ja) * 2009-09-24 2020-02-13 株式会社半導体エネルギー研究所 半導体装置
KR20180118811A (ko) * 2009-09-24 2018-10-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
JP2015122519A (ja) * 2009-09-24 2015-07-02 株式会社半導体エネルギー研究所 半導体装置
US9853167B2 (en) 2009-09-24 2017-12-26 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
KR101810383B1 (ko) 2009-09-24 2017-12-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
JP7048552B2 (ja) 2009-09-24 2022-04-05 株式会社半導体エネルギー研究所 半導体装置
US10418491B2 (en) 2009-09-24 2019-09-17 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
JP7577793B2 (ja) 2009-09-24 2024-11-05 株式会社半導体エネルギー研究所 液晶表示装置
JP2015165583A (ja) * 2009-09-24 2015-09-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8492758B2 (en) 2009-09-24 2013-07-23 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
KR20190137959A (ko) * 2009-09-24 2019-12-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
CN102484139A (zh) * 2009-10-08 2012-05-30 株式会社半导体能源研究所 氧化物半导体层及半导体装置
JP2020145447A (ja) * 2009-10-08 2020-09-10 株式会社半導体エネルギー研究所 表示装置
KR20190071837A (ko) * 2009-10-08 2019-06-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101877149B1 (ko) * 2009-10-08 2018-07-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체층, 반도체 장치 및 그 제조 방법
JP2013131765A (ja) * 2009-10-08 2013-07-04 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
KR101980505B1 (ko) 2009-10-08 2019-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체층, 반도체 장치 및 그 제조 방법
US9406808B2 (en) 2009-10-08 2016-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device, and electronic appliance
JP2016167608A (ja) * 2009-10-08 2016-09-15 株式会社半導体エネルギー研究所 酸化物半導体膜の作製方法
KR101623619B1 (ko) 2009-10-08 2016-05-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체층 및 반도체 장치
KR20200051060A (ko) * 2009-10-08 2020-05-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102108943B1 (ko) 2009-10-08 2020-05-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20210048594A (ko) * 2009-10-08 2021-05-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2017092504A (ja) * 2009-10-08 2017-05-25 株式会社半導体エネルギー研究所 半導体装置
KR102246127B1 (ko) 2009-10-08 2021-04-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP6994537B2 (ja) 2009-10-08 2022-01-14 株式会社半導体エネルギー研究所 表示装置、及びテレビジョン装置
KR20220070050A (ko) * 2009-10-08 2022-05-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
US10115831B2 (en) 2009-10-08 2018-10-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an oxide semiconductor layer comprising a nanocrystal
CN105185837A (zh) * 2009-10-08 2015-12-23 株式会社半导体能源研究所 半导体器件、显示装置和电子电器
KR102399469B1 (ko) 2009-10-08 2022-05-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20180063355A (ko) * 2009-10-08 2018-06-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체층, 반도체 장치 및 그 제조 방법
KR102596694B1 (ko) 2009-10-08 2023-11-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
JP2013201440A (ja) * 2009-10-08 2013-10-03 Semiconductor Energy Lab Co Ltd 半導体装置
US9306072B2 (en) 2009-10-08 2016-04-05 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor layer and semiconductor device
JP2011100979A (ja) * 2009-10-08 2011-05-19 Semiconductor Energy Lab Co Ltd 酸化物半導体膜、および半導体装置
JP2018037685A (ja) * 2009-10-08 2018-03-08 株式会社半導体エネルギー研究所 半導体装置
JPWO2011043300A1 (ja) * 2009-10-09 2013-03-04 シャープ株式会社 半導体装置およびその製造方法
JP2011103452A (ja) * 2009-10-14 2011-05-26 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
JP2021168385A (ja) * 2009-10-14 2021-10-21 株式会社半導体エネルギー研究所 半導体装置
JP7150097B2 (ja) 2009-10-14 2022-10-07 株式会社半導体エネルギー研究所 半導体装置
JP2019186566A (ja) * 2009-10-14 2019-10-24 株式会社半導体エネルギー研究所 半導体装置
KR101680047B1 (ko) 2009-10-14 2016-11-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
US10811417B2 (en) 2009-10-30 2020-10-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10510757B2 (en) 2009-10-30 2019-12-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including storage element
JP2015092590A (ja) * 2009-10-30 2015-05-14 株式会社半導体エネルギー研究所 トランジスタ
JP2019220716A (ja) * 2009-10-30 2019-12-26 株式会社半導体エネルギー研究所 半導体装置
JP2020115544A (ja) * 2009-10-30 2020-07-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2015015488A (ja) * 2009-10-30 2015-01-22 株式会社半導体エネルギー研究所 半導体装置
US11963374B2 (en) 2009-10-30 2024-04-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9685447B2 (en) 2009-10-30 2017-06-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising transistor including oxide semiconductor
US11322498B2 (en) 2009-10-30 2022-05-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US12211534B2 (en) 2009-10-30 2025-01-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9373640B2 (en) 2009-10-30 2016-06-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US12205622B2 (en) 2009-10-30 2025-01-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP7413425B2 (ja) 2009-11-06 2024-01-15 株式会社半導体エネルギー研究所 半導体装置
US10056385B2 (en) 2009-11-06 2018-08-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including write access transistor whose oxide semiconductor layer including channel formation region
US10079251B2 (en) 2009-11-06 2018-09-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US11107838B2 (en) 2009-11-06 2021-08-31 Semiconductor Energy Laboratory Co., Ltd. Transistor comprising an oxide semiconductor
JP2018050062A (ja) * 2009-11-06 2018-03-29 株式会社半導体エネルギー研究所 半導体装置
US12080720B2 (en) 2009-11-06 2024-09-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR20190143500A (ko) * 2009-11-06 2019-12-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
KR101849321B1 (ko) * 2009-11-06 2018-04-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
US11107840B2 (en) 2009-11-06 2021-08-31 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating a semiconductor device comprising an oxide semiconductor
JP2022095673A (ja) * 2009-11-06 2022-06-28 株式会社半導体エネルギー研究所 半導体装置
US11710745B2 (en) 2009-11-06 2023-07-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US20210288079A1 (en) 2009-11-06 2021-09-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US11315954B2 (en) 2009-11-06 2022-04-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9853066B2 (en) 2009-11-06 2017-12-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2020053700A (ja) * 2009-11-06 2020-04-02 株式会社半導体エネルギー研究所 表示装置
KR102220606B1 (ko) 2009-11-06 2021-03-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
US10868046B2 (en) 2009-11-06 2020-12-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device applying an oxide semiconductor
US11961842B2 (en) 2009-11-06 2024-04-16 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US10249647B2 (en) 2009-11-06 2019-04-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device comprising oxide semiconductor layer
KR102128972B1 (ko) * 2009-11-06 2020-07-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
JP2018101788A (ja) * 2009-11-06 2018-06-28 株式会社半導体エネルギー研究所 半導体装置
JP2015043428A (ja) * 2009-11-06 2015-03-05 株式会社半導体エネルギー研究所 半導体装置
JP2015165577A (ja) * 2009-11-06 2015-09-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2016195262A (ja) * 2009-11-06 2016-11-17 株式会社半導体エネルギー研究所 半導体装置
CN105206676A (zh) * 2009-11-06 2015-12-30 株式会社半导体能源研究所 半导体装置及其制造方法
US9093544B2 (en) 2009-11-06 2015-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101763126B1 (ko) * 2009-11-06 2017-07-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
KR20180137596A (ko) * 2009-11-06 2018-12-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
KR102174366B1 (ko) * 2009-11-06 2020-11-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
EP2497115A4 (fr) * 2009-11-06 2015-09-02 Semiconductor Energy Lab Dispositif a semiconducteur et son procede de production
JP2017011296A (ja) * 2009-11-06 2017-01-12 株式会社半導体エネルギー研究所 半導体装置
JP2011119718A (ja) * 2009-11-06 2011-06-16 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
KR20190092631A (ko) * 2009-11-06 2019-08-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
US11776968B2 (en) 2009-11-06 2023-10-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor layer
JP2020113783A (ja) * 2009-11-06 2020-07-27 株式会社半導体エネルギー研究所 トランジスタ
JP7612812B2 (ja) 2009-11-06 2025-01-14 株式会社半導体エネルギー研究所 半導体装置
US9922685B2 (en) 2009-11-13 2018-03-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
JP2011123986A (ja) * 2009-11-13 2011-06-23 Semiconductor Energy Lab Co Ltd 半導体装置および半導体装置の駆動方法
JP2011109032A (ja) * 2009-11-20 2011-06-02 Semiconductor Energy Lab Co Ltd 薄膜トランジスタ
US10186619B2 (en) 2009-11-20 2019-01-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9093262B2 (en) 2009-11-20 2015-07-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9461181B2 (en) 2009-11-20 2016-10-04 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2020198457A (ja) * 2009-11-20 2020-12-10 株式会社半導体エネルギー研究所 半導体装置
US8592251B2 (en) 2009-11-20 2013-11-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2022009340A (ja) * 2009-11-20 2022-01-14 株式会社半導体エネルギー研究所 半導体装置
JP2011129895A (ja) * 2009-11-20 2011-06-30 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
US9748436B2 (en) 2009-11-27 2017-08-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2022000895A (ja) * 2009-11-27 2022-01-04 株式会社半導体エネルギー研究所 半導体装置
JPWO2011065329A1 (ja) * 2009-11-27 2013-04-11 株式会社日立製作所 酸化物半導体装置およびその製造方法
JP5503667B2 (ja) * 2009-11-27 2014-05-28 株式会社日立製作所 電界効果トランジスタおよび電界効果トランジスタの製造方法
JP2015173278A (ja) * 2009-11-27 2015-10-01 株式会社半導体エネルギー研究所 半導体装置
WO2011065329A1 (fr) * 2009-11-27 2011-06-03 株式会社日立製作所 Dispositif semi-conducteur oxyde et son procédé de fabrication
US20190109259A1 (en) 2009-11-27 2019-04-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US11894486B2 (en) 2009-11-27 2024-02-06 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US10396236B2 (en) 2009-11-27 2019-08-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
JP7213318B2 (ja) 2009-11-27 2023-01-26 株式会社半導体エネルギー研究所 半導体装置
JP2017126772A (ja) * 2009-11-28 2017-07-20 株式会社半導体エネルギー研究所 半導体装置の作製方法および液晶表示パネルの作製方法
JP2022109270A (ja) * 2009-11-28 2022-07-27 株式会社半導体エネルギー研究所 半導体装置
WO2011065216A1 (fr) * 2009-11-28 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Matériau oxyde empilé, dispositif semi-conducteur et procédé de fabrication du dispositif semi-conducteur
JP2017123491A (ja) * 2009-11-28 2017-07-13 株式会社半導体エネルギー研究所 液晶表示パネルの作製方法
JP2022111377A (ja) * 2009-11-28 2022-07-29 株式会社半導体エネルギー研究所 半導体装置
WO2011065210A1 (fr) * 2009-11-28 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Matériau d'oxyde empilé, dispositif à semi-conducteurs et procédé pour fabriquer le dispositif à semi-conducteurs
US10079310B2 (en) 2009-11-28 2018-09-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including stacked oxide semiconductor material
US12080802B2 (en) 2009-11-28 2024-09-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising silicon and oxide semiconductor in channel formation region
JP2018207120A (ja) * 2009-11-28 2018-12-27 株式会社半導体エネルギー研究所 半導体装置、表示装置
JP2019195098A (ja) * 2009-11-28 2019-11-07 株式会社半導体エネルギー研究所 半導体装置
US9520287B2 (en) 2009-11-28 2016-12-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having stacked oxide semiconductor layers
JP7064542B2 (ja) 2009-11-28 2022-05-10 株式会社半導体エネルギー研究所 半導体装置
US11133419B2 (en) 2009-11-28 2021-09-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN105140101A (zh) * 2009-11-28 2015-12-09 株式会社半导体能源研究所 层叠的氧化物材料、半导体器件、以及用于制造该半导体器件的方法
JP2017168860A (ja) * 2009-11-28 2017-09-21 株式会社半導体エネルギー研究所 半導体装置、液晶表示装置
JP2020198455A (ja) * 2009-11-28 2020-12-10 株式会社半導体エネルギー研究所 半導体装置
US8779420B2 (en) 2009-11-28 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9214520B2 (en) 2009-11-28 2015-12-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP7645964B2 (ja) 2009-11-28 2025-03-14 株式会社半導体エネルギー研究所 半導体装置
US10347771B2 (en) 2009-11-28 2019-07-09 Semiconductor Energy Laboratory Co., Ltd. Stacked oxide material, semiconductor device, and method for manufacturing the semiconductor device
JP2012248868A (ja) * 2009-11-28 2012-12-13 Semiconductor Energy Lab Co Ltd 半導体装置
JP2011135066A (ja) * 2009-11-28 2011-07-07 Semiconductor Energy Lab Co Ltd 積層酸化物材料、半導体装置、および半導体装置の作製方法
US8765522B2 (en) 2009-11-28 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Stacked oxide material, semiconductor device, and method for manufacturing the semiconductor device
US11710795B2 (en) 2009-11-28 2023-07-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor with c-axis-aligned crystals
US10608118B2 (en) 2009-11-28 2020-03-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2016154257A (ja) * 2009-11-28 2016-08-25 株式会社半導体エネルギー研究所 半導体装置
JP2011135064A (ja) * 2009-11-28 2011-07-07 Semiconductor Energy Lab Co Ltd 積層酸化物材料、半導体装置、および半導体装置の作製方法
KR20210116711A (ko) * 2009-11-28 2021-09-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
KR102426613B1 (ko) 2009-11-28 2022-07-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
US10263120B2 (en) 2009-11-28 2019-04-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device and method for manufacturing liquid crystal display panel
US9887298B2 (en) 2009-11-28 2018-02-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8748881B2 (en) 2009-11-28 2014-06-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8748215B2 (en) 2009-11-28 2014-06-10 Semiconductor Energy Laboratory Co., Ltd. Stacked oxide material, semiconductor device, and method for manufacturing the semiconductor device
JP2012253363A (ja) * 2009-11-28 2012-12-20 Semiconductor Energy Lab Co Ltd 部材の作製方法
JP2012235150A (ja) * 2009-11-28 2012-11-29 Semiconductor Energy Lab Co Ltd 部材の作製方法
KR101396015B1 (ko) * 2009-11-28 2014-05-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2011139054A (ja) * 2009-12-04 2011-07-14 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP2022103211A (ja) * 2009-12-04 2022-07-07 株式会社半導体エネルギー研究所 半導体装置
JP2015109448A (ja) * 2009-12-04 2015-06-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP7436554B2 (ja) 2009-12-04 2024-02-21 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
JP2020010065A (ja) * 2009-12-04 2020-01-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR20220136513A (ko) * 2009-12-04 2022-10-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US11728437B2 (en) 2009-12-04 2023-08-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor layer containing a c-axis aligned crystal
US11342464B2 (en) 2009-12-04 2022-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising first and second insulating layer each has a tapered shape
JP2016129250A (ja) * 2009-12-04 2016-07-14 株式会社半導体エネルギー研究所 半導体装置
JP7066789B2 (ja) 2009-12-04 2022-05-13 株式会社半導体エネルギー研究所 半導体装置
US11923204B2 (en) 2009-12-04 2024-03-05 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device comprising oxide semiconductor
KR20210054603A (ko) * 2009-12-04 2021-05-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US9324881B2 (en) 2009-12-04 2016-04-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2016048800A (ja) * 2009-12-04 2016-04-07 株式会社半導体エネルギー研究所 半導体装置
US10861983B2 (en) 2009-12-04 2020-12-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor layer containing a c-axis aligned crystal
KR102450889B1 (ko) * 2009-12-04 2022-10-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US10014415B2 (en) 2009-12-04 2018-07-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device has an oxide semiconductor layer containing a C-axis aligned crystal
US10109500B2 (en) 2009-12-04 2018-10-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US12218249B2 (en) 2009-12-04 2025-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor layer containing a c-axis aligned crystal
US11456187B2 (en) 2009-12-04 2022-09-27 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor-device
US10505049B2 (en) 2009-12-04 2019-12-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device has an oxide semiconductor layer containing a c-axis aligned crystal
US10490420B2 (en) 2009-12-04 2019-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9735284B2 (en) 2009-12-04 2017-08-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide semiconductor
US8841163B2 (en) 2009-12-04 2014-09-23 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device comprising oxide semiconductor
US9721811B2 (en) 2009-12-04 2017-08-01 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device having an oxide semiconductor layer
US8957414B2 (en) 2009-12-04 2015-02-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising both amorphous and crystalline semiconductor oxide
KR101396102B1 (ko) * 2009-12-04 2014-05-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US10714358B2 (en) 2009-12-04 2020-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR102696119B1 (ko) * 2009-12-04 2024-08-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2017092494A (ja) * 2009-12-04 2017-05-25 株式会社半導体エネルギー研究所 半導体装置
JP2017085182A (ja) * 2009-12-04 2017-05-18 株式会社半導体エネルギー研究所 半導体装置
JP2020174222A (ja) * 2009-12-04 2020-10-22 株式会社半導体エネルギー研究所 半導体装置
CN102648526A (zh) * 2009-12-04 2012-08-22 株式会社半导体能源研究所 半导体器件及其制造方法
JP2018157219A (ja) * 2009-12-04 2018-10-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
US9240467B2 (en) 2009-12-04 2016-01-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8927349B2 (en) 2009-12-04 2015-01-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8558233B2 (en) 2009-12-08 2013-10-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8293661B2 (en) 2009-12-08 2012-10-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
WO2011070900A1 (fr) * 2009-12-08 2011-06-16 Semiconductor Energy Laboratory Co., Ltd. Dispositif semi-conducteur et son procédé de fabrication
JP2019216257A (ja) * 2009-12-08 2019-12-19 株式会社半導体エネルギー研究所 表示装置
US9040989B2 (en) 2009-12-08 2015-05-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2013021341A (ja) * 2009-12-08 2013-01-31 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2011142310A (ja) * 2009-12-08 2011-07-21 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP7430234B2 (ja) 2009-12-11 2024-02-09 株式会社半導体エネルギー研究所 半導体装置
US9735180B2 (en) 2009-12-11 2017-08-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
JP2015111715A (ja) * 2009-12-11 2015-06-18 株式会社半導体エネルギー研究所 半導体装置
US9508742B2 (en) 2009-12-11 2016-11-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having switching transistor that includes oxide semiconductor material
JP2017199919A (ja) * 2009-12-11 2017-11-02 株式会社半導体エネルギー研究所 半導体装置
JP2016171346A (ja) * 2009-12-11 2016-09-23 株式会社半導体エネルギー研究所 半導体装置
US10002888B2 (en) 2009-12-11 2018-06-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US10854641B2 (en) 2009-12-11 2020-12-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
JP2017123490A (ja) * 2009-12-11 2017-07-13 株式会社半導体エネルギー研究所 半導体装置
JP2016139816A (ja) * 2009-12-11 2016-08-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
US11961843B2 (en) 2009-12-11 2024-04-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US10600818B2 (en) 2009-12-11 2020-03-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US12274095B2 (en) 2009-12-11 2025-04-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US9893204B2 (en) 2009-12-11 2018-02-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having transistor including two oxide semiconductor layers having different lattice constants
US10312267B2 (en) 2009-12-11 2019-06-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US9978757B2 (en) 2009-12-18 2018-05-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2015173286A (ja) * 2009-12-18 2015-10-01 株式会社半導体エネルギー研究所 半導体装置
WO2011074506A1 (fr) * 2009-12-18 2011-06-23 Semiconductor Energy Laboratory Co., Ltd. Dispositif à semi-conducteurs et procédé de fabrication de celui-ci
US9034104B2 (en) 2009-12-18 2015-05-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device comprising single- and multi-component oxide semiconductor layers
JP2011146698A (ja) * 2009-12-18 2011-07-28 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP7015863B2 (ja) 2009-12-25 2022-02-03 株式会社半導体エネルギー研究所 半導体装置
JP2020127034A (ja) * 2009-12-25 2020-08-20 株式会社半導体エネルギー研究所 半導体装置
JP2011155249A (ja) * 2009-12-28 2011-08-11 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
TWI595569B (zh) * 2009-12-28 2017-08-11 半導體能源研究所股份有限公司 半導體裝置之製造方法
KR20180037333A (ko) * 2009-12-28 2018-04-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
JP2016201564A (ja) * 2009-12-28 2016-12-01 株式会社半導体エネルギー研究所 半導体装置
CN102668098A (zh) * 2009-12-28 2012-09-12 株式会社半导体能源研究所 制造半导体装置的方法
JP7642021B2 (ja) 2009-12-28 2025-03-07 株式会社半導体エネルギー研究所 半導体装置
US8686425B2 (en) 2009-12-28 2014-04-01 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9859401B2 (en) 2009-12-28 2018-01-02 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR101883802B1 (ko) 2009-12-28 2018-07-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
WO2011081009A1 (fr) * 2009-12-28 2011-07-07 Semiconductor Energy Laboratory Co., Ltd. Procédé de fabrication d'un dispositif semi-conducteur
KR101436120B1 (ko) 2009-12-28 2014-09-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
US10141425B2 (en) 2009-12-28 2018-11-27 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9054134B2 (en) 2009-12-28 2015-06-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8530285B2 (en) 2009-12-28 2013-09-10 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
CN102903758A (zh) * 2009-12-28 2013-01-30 株式会社半导体能源研究所 制造半导体装置的方法
JP2013058770A (ja) * 2010-01-15 2013-03-28 Semiconductor Energy Lab Co Ltd 半導体装置
JP2011146713A (ja) * 2010-01-15 2011-07-28 Samsung Electronics Co Ltd 表示基板
US10439067B2 (en) 2010-01-15 2019-10-08 Samsung Display Co., Ltd. Display substrate including thin film transistors having a multilayered oxide semiconductor pattern
US9159745B2 (en) 2010-01-15 2015-10-13 Samsung Display Co., Ltd. Display substrate
KR20120125272A (ko) * 2010-01-15 2012-11-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US8866233B2 (en) 2010-01-15 2014-10-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101698537B1 (ko) * 2010-01-15 2017-01-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US10454475B2 (en) 2010-01-20 2019-10-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2015092687A (ja) * 2010-01-20 2015-05-14 株式会社半導体エネルギー研究所 半導体装置
US12159600B2 (en) 2010-01-20 2024-12-03 Semiconductor Energy Laboratory Co., Ltd. Display device
US9614097B2 (en) 2010-01-20 2017-04-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101400919B1 (ko) 2010-01-26 2014-05-30 주성엔지니어링(주) 박막 트랜지스터 및 그 제조 방법
JP2015028837A (ja) * 2010-02-05 2015-02-12 株式会社半導体エネルギー研究所 半導体装置
US11101295B2 (en) 2010-02-05 2021-08-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9991288B2 (en) 2010-02-05 2018-06-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US11749686B2 (en) 2010-02-05 2023-09-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US11469255B2 (en) 2010-02-05 2022-10-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US12113074B2 (en) 2010-02-05 2024-10-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2017103486A (ja) * 2010-02-05 2017-06-08 株式会社半導体エネルギー研究所 半導体装置
US9659653B2 (en) 2010-02-05 2017-05-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10615179B2 (en) 2010-02-05 2020-04-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2015119189A (ja) * 2010-02-12 2015-06-25 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2015122512A (ja) * 2010-02-12 2015-07-02 株式会社半導体エネルギー研究所 半導体装置
JP2015111705A (ja) * 2010-02-12 2015-06-18 株式会社半導体エネルギー研究所 トランジスタの作製方法
KR101808570B1 (ko) * 2010-03-03 2017-12-13 후지필름 가부시키가이샤 Igzo계 아모퍼스 산화물 반도체막의 제조 방법 및 그것을 사용한 전계 효과형 트랜지스터의 제조 방법
JP2011181802A (ja) * 2010-03-03 2011-09-15 Fujifilm Corp Igzo系アモルファス酸化物半導体膜の製造方法及びそれを用いた電界効果型トランジスタの製造方法
JP2011187506A (ja) * 2010-03-04 2011-09-22 Sony Corp 薄膜トランジスタおよびその製造方法、並びに表示装置
CN102194887A (zh) * 2010-03-04 2011-09-21 索尼公司 薄膜晶体管、薄膜晶体管的制造方法以及显示装置
JP2015181163A (ja) * 2010-03-05 2015-10-15 株式会社半導体エネルギー研究所 酸化物半導体膜の作製方法
JP2019153794A (ja) * 2010-03-05 2019-09-12 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2017152717A (ja) * 2010-03-05 2017-08-31 株式会社半導体エネルギー研究所 酸化物半導体膜の作製方法
JP7279141B2 (ja) 2010-03-26 2023-05-22 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2020014023A (ja) * 2010-03-26 2020-01-23 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8704219B2 (en) 2010-03-26 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2022027774A (ja) * 2010-03-26 2022-02-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP7610642B2 (ja) 2010-03-26 2025-01-08 株式会社半導体エネルギー研究所 半導体装置
US9646521B2 (en) 2010-03-31 2017-05-09 Semiconductor Energy Laboratory Co., Ltd. Driving method of liquid crystal display device
KR101811257B1 (ko) 2010-03-31 2017-12-21 후지필름 가부시키가이샤 박막 전계 효과형 트랜지스터 및 그 제조방법
JP2016075945A (ja) * 2010-03-31 2016-05-12 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
US10043424B2 (en) 2010-03-31 2018-08-07 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a display device having an oxide semiconductor switching transistor
US9059047B2 (en) 2010-04-09 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10510777B2 (en) 2010-04-09 2019-12-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10008515B2 (en) 2010-04-09 2018-06-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9431429B2 (en) 2010-04-09 2016-08-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10879274B2 (en) 2010-04-09 2020-12-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2011237418A (ja) * 2010-04-16 2011-11-24 Semiconductor Energy Lab Co Ltd 電流測定方法、半導体装置の検査方法、半導体装置、および特性評価用回路
US8945982B2 (en) 2010-04-23 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US9978878B2 (en) 2010-04-23 2018-05-22 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US9390918B2 (en) 2010-04-23 2016-07-12 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US11983342B2 (en) 2010-04-28 2024-05-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and driving method the same
JP2011248356A (ja) * 2010-04-28 2011-12-08 Semiconductor Energy Lab Co Ltd 半導体表示装置及びその駆動方法
US9449852B2 (en) 2010-04-28 2016-09-20 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2011135987A1 (fr) * 2010-04-28 2011-11-03 Semiconductor Energy Laboratory Co., Ltd. Procédé de fabrication d'un dispositif à semi-conducteur
US10013087B2 (en) 2010-04-28 2018-07-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and driving method the same
US10871841B2 (en) 2010-04-28 2020-12-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and driving method the same
US8790960B2 (en) 2010-04-28 2014-07-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US11392232B2 (en) 2010-04-28 2022-07-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor display device and driving method the same
US8629438B2 (en) 2010-05-21 2014-01-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9142648B2 (en) 2010-05-21 2015-09-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9601602B2 (en) 2010-05-21 2017-03-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9667148B2 (en) 2010-06-04 2017-05-30 Semiconductor Energy Laboratory Co., Ltd. Photoelectric transducer device including a transistor including an oxide semiconductor layer
JP2012015491A (ja) * 2010-06-04 2012-01-19 Semiconductor Energy Lab Co Ltd 光電変換装置
US9685561B2 (en) 2010-06-18 2017-06-20 Semiconductor Energy Laboratories Co., Ltd. Method for manufacturing a semiconductor device
US9076876B2 (en) 2010-06-18 2015-07-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8552425B2 (en) 2010-06-18 2013-10-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9349820B2 (en) 2010-06-18 2016-05-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2012015436A (ja) * 2010-07-05 2012-01-19 Sony Corp 薄膜トランジスタおよび表示装置
JP2017062866A (ja) * 2010-08-31 2017-03-30 株式会社半導体エネルギー研究所 半導体装置
JP2012084863A (ja) * 2010-09-13 2012-04-26 Semiconductor Energy Lab Co Ltd 結晶性酸化物半導体膜の作製方法
US9546416B2 (en) 2010-09-13 2017-01-17 Semiconductor Energy Laboratory Co., Ltd. Method of forming crystalline oxide semiconductor film
US9263451B2 (en) 2010-10-29 2016-02-16 Semiconductor Energy Laboratory Co., Ltd. Storage device including memory cell using transistor having oxide semiconductor and amplifier circuit
JP2012256824A (ja) * 2010-10-29 2012-12-27 Semiconductor Energy Lab Co Ltd 記憶装置
JP2012099661A (ja) * 2010-11-02 2012-05-24 Idemitsu Kosan Co Ltd 酸化物半導体の製造方法
JP2023017090A (ja) * 2010-11-05 2023-02-02 株式会社半導体エネルギー研究所 半導体装置
JP2021192448A (ja) * 2010-11-05 2021-12-16 株式会社半導体エネルギー研究所 半導体装置
JP7194791B2 (ja) 2010-11-05 2022-12-22 株式会社半導体エネルギー研究所 半導体装置
JP7510995B2 (ja) 2010-11-05 2024-07-04 株式会社半導体エネルギー研究所 半導体装置
US8629496B2 (en) 2010-11-30 2014-01-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2018133596A (ja) * 2010-11-30 2018-08-23 株式会社半導体エネルギー研究所 半導体装置
JP2021097251A (ja) * 2010-11-30 2021-06-24 株式会社半導体エネルギー研究所 半導体装置
US9281358B2 (en) 2010-11-30 2016-03-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP7572469B2 (ja) 2010-11-30 2024-10-23 株式会社半導体エネルギー研究所 半導体装置
US9202927B2 (en) 2010-11-30 2015-12-01 Seminconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9634082B2 (en) 2010-11-30 2017-04-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
WO2012074046A1 (fr) * 2010-12-02 2012-06-07 株式会社神戸製鋼所 Structure de câblage et cible de pulvérisation cathodique
US9184298B2 (en) 2010-12-02 2015-11-10 Kobe Steel, Ltd. Interconnect structure and sputtering target
US10103277B2 (en) 2010-12-03 2018-10-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing oxide semiconductor film
US8669556B2 (en) 2010-12-03 2014-03-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9711655B2 (en) 2010-12-03 2017-07-18 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
US8994021B2 (en) 2010-12-03 2015-03-31 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
US10916663B2 (en) 2010-12-03 2021-02-09 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
JP2022103433A (ja) * 2010-12-03 2022-07-07 株式会社半導体エネルギー研究所 半導体装置
US9331208B2 (en) 2010-12-03 2016-05-03 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
US11688810B2 (en) 2010-12-17 2023-06-27 Semiconductor Energy Laboratory Co., Ltd. Oxide material and semiconductor device
JP2019179933A (ja) * 2010-12-17 2019-10-17 株式会社半導体エネルギー研究所 トランジスタ及び表示装置
JP7228620B2 (ja) 2010-12-17 2023-02-24 株式会社半導体エネルギー研究所 トランジスタ
JP2021132213A (ja) * 2010-12-17 2021-09-09 株式会社半導体エネルギー研究所 トランジスタ
US11217702B2 (en) 2010-12-17 2022-01-04 Semiconductor Energy Laboratory Co., Ltd. Oxide material and semiconductor device
US11049977B2 (en) 2010-12-17 2021-06-29 Semiconductor Energy Laboratory Co., Ltd. Oxide material and semiconductor device
US12057510B2 (en) 2010-12-17 2024-08-06 Semiconductor Energy Laboratory Co., Ltd. Oxide material and semiconductor device
JP7358577B2 (ja) 2011-01-20 2023-10-10 株式会社半導体エネルギー研究所 半導体装置
JP2022141904A (ja) * 2011-01-20 2022-09-29 株式会社半導体エネルギー研究所 半導体装置
JP2018014530A (ja) * 2011-01-20 2018-01-25 株式会社半導体エネルギー研究所 半導体装置
CN103493209A (zh) * 2011-04-22 2014-01-01 株式会社神户制钢所 薄膜晶体管构造以及具备该构造的薄膜晶体管和显示装置
US9093542B2 (en) 2011-04-22 2015-07-28 Kobe Steel, Ltd. Thin-film transistor structure, as well as thin-film transistor and display device each having said structure
KR20120120062A (ko) * 2011-04-22 2012-11-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 상기 반도체 장치의 제작 방법
US10079295B2 (en) 2011-04-22 2018-09-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing thereof
WO2012144557A1 (fr) * 2011-04-22 2012-10-26 株式会社神戸製鋼所 Structure de transistor en couche mince, et transistor en couche mince et dispositif d'affichage comportant ladite structure
KR101972759B1 (ko) * 2011-04-22 2019-09-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 상기 반도체 장치의 제작 방법
US9893195B2 (en) 2011-05-11 2018-02-13 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
JP2016139819A (ja) * 2011-05-11 2016-08-04 株式会社半導体エネルギー研究所 半導体装置
JP2012253331A (ja) * 2011-05-11 2012-12-20 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
KR20120127250A (ko) * 2011-05-11 2012-11-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
KR101999096B1 (ko) * 2011-05-11 2019-07-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
JP2021101485A (ja) * 2011-06-17 2021-07-08 株式会社半導体エネルギー研究所 液晶表示装置
JP7258996B2 (ja) 2011-07-08 2023-04-17 株式会社半導体エネルギー研究所 半導体装置
KR102437211B1 (ko) 2011-07-08 2022-08-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US11011652B2 (en) 2011-07-08 2021-05-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP7456042B2 (ja) 2011-07-08 2024-03-26 株式会社半導体エネルギー研究所 半導体装置
US11588058B2 (en) 2011-07-08 2023-02-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP6995936B2 (ja) 2011-07-08 2022-01-17 株式会社半導体エネルギー研究所 半導体装置
JP2022050414A (ja) * 2011-07-08 2022-03-30 株式会社半導体エネルギー研究所 半導体装置
US10658522B2 (en) 2011-07-08 2020-05-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR20220121762A (ko) * 2011-07-08 2022-09-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20210061988A (ko) * 2011-07-08 2021-05-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US10043918B2 (en) 2011-07-08 2018-08-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR102663353B1 (ko) 2011-07-08 2024-05-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2020174183A (ja) * 2011-07-08 2020-10-22 株式会社半導体エネルギー研究所 半導体装置
US12132121B2 (en) 2011-07-08 2024-10-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR20130033308A (ko) * 2011-09-26 2013-04-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
KR102108572B1 (ko) * 2011-09-26 2020-05-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
US11217701B2 (en) 2011-09-29 2022-01-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9741860B2 (en) 2011-09-29 2017-08-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US12218251B2 (en) 2011-09-29 2025-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US12225739B2 (en) 2011-09-29 2025-02-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US11791415B2 (en) 2011-09-29 2023-10-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10622485B2 (en) 2011-09-29 2020-04-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10290744B2 (en) 2011-09-29 2019-05-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9218966B2 (en) 2011-10-14 2015-12-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
US9559213B2 (en) 2011-12-23 2017-01-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2013149965A (ja) * 2011-12-23 2013-08-01 Semiconductor Energy Lab Co Ltd 半導体装置
JP2020145478A (ja) * 2011-12-23 2020-09-10 株式会社半導体エネルギー研究所 半導体装置
US9391097B2 (en) 2011-12-31 2016-07-12 Boe Technology Group Co., Ltd. Thin film transistor, array substrate and method of manufacturing the same and display device
CN103489881A (zh) * 2011-12-31 2014-01-01 京东方科技集团股份有限公司 一种薄膜晶体管阵列基板及其制造方法和显示器件
KR20200029412A (ko) 2012-01-26 2020-03-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
US12191313B2 (en) 2012-01-26 2025-01-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US11081502B2 (en) 2012-01-26 2021-08-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9419146B2 (en) 2012-01-26 2016-08-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US10243064B2 (en) 2012-01-26 2019-03-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR20210000709A (ko) 2012-01-26 2021-01-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
US9171957B2 (en) 2012-01-26 2015-10-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US11682677B2 (en) 2012-01-26 2023-06-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9553200B2 (en) 2012-02-29 2017-01-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US10559699B2 (en) 2012-04-13 2020-02-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10158026B2 (en) 2012-04-13 2018-12-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including oxide semiconductor stacked layers
US11929437B2 (en) 2012-04-13 2024-03-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising various thin-film transistors
US10872981B2 (en) 2012-04-13 2020-12-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising an oxide semiconductor
US11355645B2 (en) 2012-04-13 2022-06-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising stacked oxide semiconductor layers
JP2014013917A (ja) * 2012-06-06 2014-01-23 Kobe Steel Ltd 薄膜トランジスタ
US10032926B2 (en) 2012-06-15 2018-07-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including an oxide semiconductor
US10483404B2 (en) 2012-06-15 2019-11-19 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor with multiple oxide semiconductor layers
US11424368B2 (en) 2012-06-15 2022-08-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including an oxide semiconductor
US9437747B2 (en) 2012-06-15 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor with multiple oxide semiconductor layers
US10741695B2 (en) 2012-06-15 2020-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including an oxide semiconductor
JP2014029994A (ja) * 2012-06-27 2014-02-13 Semiconductor Energy Lab Co Ltd 半導体装置および半導体装置の作製方法
US9437749B2 (en) 2012-08-10 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for fabricating the same
US9502580B2 (en) 2012-08-10 2016-11-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US10446668B2 (en) 2012-08-10 2019-10-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for fabricating the same
JP2023024585A (ja) * 2012-08-10 2023-02-16 株式会社半導体エネルギー研究所 半導体装置
US9184245B2 (en) 2012-08-10 2015-11-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for fabricating the same
US9240492B2 (en) 2012-08-10 2016-01-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for fabricating the same
WO2014025002A1 (fr) * 2012-08-10 2014-02-13 Semiconductor Energy Laboratory Co., Ltd. Dispositif à semi-conducteur et son procédé de fabrication
US9245958B2 (en) 2012-08-10 2016-01-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP2014078704A (ja) * 2012-09-24 2014-05-01 Semiconductor Energy Lab Co Ltd 表示装置
US9366896B2 (en) 2012-10-12 2016-06-14 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and touch panel
JP2018148231A (ja) * 2012-10-17 2018-09-20 株式会社半導体エネルギー研究所 半導体装置
US11710794B2 (en) 2012-11-16 2023-07-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2020014011A (ja) * 2012-11-16 2020-01-23 株式会社半導体エネルギー研究所 半導体装置
US12243943B2 (en) 2012-11-16 2025-03-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US10374030B2 (en) 2012-12-28 2019-08-06 Semiconductor Energy Laboratory Co., Ltd. Metal oxide semiconductor device
US10964821B2 (en) 2013-01-21 2021-03-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2018166220A (ja) * 2013-01-21 2018-10-25 株式会社半導体エネルギー研究所 トランジスタ
US11888071B2 (en) 2013-01-21 2024-01-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US11380802B2 (en) 2013-01-21 2022-07-05 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2016519847A (ja) * 2013-03-21 2016-07-07 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. 薄膜トランジスタ及びその製造方法、アレイ基板、並びにディスプレイ
US12218144B2 (en) 2013-04-12 2025-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having specified relative material concentration between In—Ga—Zn—O films
US11063066B2 (en) 2013-04-12 2021-07-13 Semiconductor Energy Laboratory Co., Ltd. C-axis alignment of an oxide film over an oxide semiconductor film
US11843004B2 (en) 2013-04-12 2023-12-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having specified relative material concentration between In—Ga—Zn—O films
US10304859B2 (en) 2013-04-12 2019-05-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having an oxide film on an oxide semiconductor film
CN111668315A (zh) * 2013-08-19 2020-09-15 出光兴产株式会社 氧化物半导体基板及肖特基势垒二极管元件
CN111668315B (zh) * 2013-08-19 2023-09-12 出光兴产株式会社 氧化物半导体基板及肖特基势垒二极管元件
US9691906B2 (en) 2013-10-24 2017-06-27 Joled Inc. Method for producing thin film transistor
US9806201B2 (en) 2014-03-07 2017-10-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9716183B2 (en) 2014-03-11 2017-07-25 Sharp Kabushiki Kaisha Semiconductor device and method of manufacturing same
CN104966738A (zh) * 2015-04-13 2015-10-07 友达光电股份有限公司 主动元件结构及其制作方法
US11281285B2 (en) 2016-08-19 2022-03-22 Semiconductor Energy Laboratory Co., Ltd. Method for controlling power supply in semiconductor device
US10564698B2 (en) 2016-08-19 2020-02-18 Semiconductor Energy Laboratory Co., Ltd. Method for controlling power supply in semiconductor device
JPWO2018100465A1 (ja) * 2016-12-02 2019-10-31 株式会社半導体エネルギー研究所 半導体装置
JP7085491B2 (ja) 2016-12-02 2022-06-16 株式会社半導体エネルギー研究所 半導体装置
US11688602B2 (en) 2016-12-02 2023-06-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with electrodes over oxide semiconductor
JP2019220543A (ja) * 2018-06-19 2019-12-26 日立金属株式会社 酸化物半導体層、酸化物半導体層形成用スパッタリングターゲット、および薄膜トランジスタ
JP7070130B2 (ja) 2018-06-19 2022-05-18 日立金属株式会社 酸化物半導体層、酸化物半導体層形成用スパッタリングターゲット、および薄膜トランジスタ
EP3790057A1 (fr) * 2019-09-06 2021-03-10 SABIC Global Technologies B.V. Transistor à couche mince à semi-conducteur traité à basse température
EP4207303A4 (fr) * 2021-06-25 2024-01-10 BOE Technology Group Co., Ltd. Transistor à film mince d'oxyde et son procédé de préparation, et dispositif d'affichage
US20240097042A1 (en) * 2021-06-25 2024-03-21 Boe Technology Group Co., Ltd. Oxide thin film transistor and preparation method thereof, and display device

Also Published As

Publication number Publication date
TWI453915B (zh) 2014-09-21
TW200915579A (en) 2009-04-01
JPWO2009034953A1 (ja) 2010-12-24

Similar Documents

Publication Publication Date Title
WO2009034953A1 (fr) Transistor à couche mince
WO2008124154A3 (fr) Photovoltaïque sur silicium
GB0623876D0 (en) Thin film transistor array substrate and method fabricating the same
EP2226836A4 (fr) Procédé de formation de couche mince de semi-conducteur et procédé de fabrication de dispositif semi-conducteur en couche mince
TWI373097B (en) Method for fabricating thin film transistor array substrate
WO2012021197A3 (fr) Procédé de fabrication de dispositifs électroniques sur les deux côtés d'un substrat porteur et dispositifs électroniques ainsi obtenus
TWI373074B (en) Methods for forming a silicon oxide layer over a substrate
WO2008067181A3 (fr) Dispositif photovoltaïque comprenant un empilement métallique
WO2009045293A3 (fr) Dispositifs photovoltaïques comprenant une couche interfaciale
WO2011028513A3 (fr) Films barrières destinés à des cellules photovoltaïques à film mince
EP2135910A4 (fr) Composition adhésive photosensible, adhésif en forme de film, feuille adhesive, motif addhésif semi-conducteurs et procédé de fabrication de dispositif à semi-conducteurs
WO2007095061A3 (fr) Dispositif comprenant des nanocristaux semi-conducteurs et une couche comprenant un matériau organique dopé et procédés correspondant
JP2010242187A5 (fr)
EP2579237A4 (fr) Substrat pour transistor à film mince et son procédé de production
WO2008126729A1 (fr) Élément semi-conducteur, son procédé de fabrication et dispositif électronique équipé dudit élément
PL2379463T3 (pl) Substrat wyposażony w stos o właściwościach termicznych i z warstwą pochłaniającą
TWI367381B (en) Thin film transistor substrate and method of fabricating same
HK1139789A1 (en) Layers composite comprising a pyrogenic zinc oxide layer and field-effect transistor comprising this composite
TWI318458B (en) Thin film transistor substrate and manufacturing method thereof
PL2031082T3 (pl) Metalowe podłoże o teksturze krystalograficznej, układ o teksturze krystalograficznej, ogniowo fotowoltaiczne i moduł fotowoltaiczny zawierające taki układ i sposób powlekania cienkimi warstwami
WO2009028453A1 (fr) Transistor à couches minces
WO2007124209A3 (fr) Intégration d'élément de contrainte et procédé associé
TWI348221B (en) Thin film transistor array substrate structures and fabrication method thereof
GB2441702B (en) Method for forming thin organic semiconductor material film and method for producing organic thin-film transistor
TWI350567B (en) Method for forming silicon oxide film and for manufacturing capacitor and semiconductor device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08830432

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009532177

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08830432

Country of ref document: EP

Kind code of ref document: A1

点击 这是indexloc提供的php浏览器服务,不要输入任何密码和下载