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WO2009031654A1 - 駆動制御方法、駆動制御装置、ステージ制御方法、ステージ制御装置、露光方法、露光装置及び計測装置 - Google Patents

駆動制御方法、駆動制御装置、ステージ制御方法、ステージ制御装置、露光方法、露光装置及び計測装置 Download PDF

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Publication number
WO2009031654A1
WO2009031654A1 PCT/JP2008/066086 JP2008066086W WO2009031654A1 WO 2009031654 A1 WO2009031654 A1 WO 2009031654A1 JP 2008066086 W JP2008066086 W JP 2008066086W WO 2009031654 A1 WO2009031654 A1 WO 2009031654A1
Authority
WO
WIPO (PCT)
Prior art keywords
exposure
drive control
control method
stage
stage control
Prior art date
Application number
PCT/JP2008/066086
Other languages
English (en)
French (fr)
Inventor
Hiroshi Fujimoto
Koichi Sakata
Kazuaki Saiki
Takeshi Ohtomo
Original Assignee
National University Corporation Yokohama National University
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National University Corporation Yokohama National University, Nikon Corporation filed Critical National University Corporation Yokohama National University
Priority to JP2009531297A priority Critical patent/JPWO2009031654A1/ja
Priority to CN200880115228A priority patent/CN101855705A/zh
Publication of WO2009031654A1 publication Critical patent/WO2009031654A1/ja
Priority to US12/719,457 priority patent/US20110046795A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/002—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion characterised by the control method or circuitry
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0277—Electrolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Vibration Prevention Devices (AREA)
  • Control Of Position Or Direction (AREA)

Abstract

　少なくとも第１方向と該第１方向とは異なる第２方向に移動可能な物体を制御する駆動制御方法であって、前記物体を前記第１方向に移動させるための第１アクチュエータを駆動する駆動信号と、前記物体の出力端における前記第２方向の外乱信号に基づいて生成される外乱補正信号と、に基づいて前記物体に加わる力を制御する。
PCT/JP2008/066086 2007-09-07 2008-09-05 駆動制御方法、駆動制御装置、ステージ制御方法、ステージ制御装置、露光方法、露光装置及び計測装置 WO2009031654A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009531297A JPWO2009031654A1 (ja) 2007-09-07 2008-09-05 駆動制御方法、駆動制御装置、ステージ制御方法、ステージ制御装置、露光方法、露光装置及び計測装置
CN200880115228A CN101855705A (zh) 2007-09-07 2008-09-05 驱动控制方法、驱动控制装置、载台控制方法、载台控制装置、曝光方法、曝光装置以及计测装置
US12/719,457 US20110046795A1 (en) 2007-09-07 2010-03-08 Drive control method, drive control apparatus, stage control method, stage control apparatus, exposure method, exposure apparatus and measuring apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007233325 2007-09-07
JP2007-233325 2007-09-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/719,457 Continuation US20110046795A1 (en) 2007-09-07 2010-03-08 Drive control method, drive control apparatus, stage control method, stage control apparatus, exposure method, exposure apparatus and measuring apparatus

Publications (1)

Publication Number Publication Date
WO2009031654A1 true WO2009031654A1 (ja) 2009-03-12

Family

ID=40428966

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066086 WO2009031654A1 (ja) 2007-09-07 2008-09-05 駆動制御方法、駆動制御装置、ステージ制御方法、ステージ制御装置、露光方法、露光装置及び計測装置

Country Status (6)

Country Link
US (1) US20110046795A1 (ja)
JP (1) JPWO2009031654A1 (ja)
KR (1) KR20100072015A (ja)
CN (1) CN101855705A (ja)
TW (1) TW200915019A (ja)
WO (1) WO2009031654A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010055673A1 (ja) * 2008-11-13 2010-05-20 株式会社ニコン 移動体の駆動制御方法、露光方法、ロボット制御方法、駆動制御装置、露光装置、及び、ロボット装置
JP2012114436A (ja) * 2010-11-22 2012-06-14 Asml Netherlands Bv コントローラ、リソグラフィ装置、オブジェクト位置の制御方法及びデバイス製造方法
WO2012102060A1 (ja) * 2011-01-28 2012-08-02 株式会社ニコン 駆動システム及び駆動方法、露光装置及び露光方法、並びに駆動システム設計方法
JP2013222962A (ja) * 2012-04-18 2013-10-28 Asml Holding Nv リソグラフィ装置及び固有モード結合を補償する方法

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JP5308249B2 (ja) * 2009-06-22 2013-10-09 三菱重工業株式会社 サーボ制御装置
EP2871526B1 (en) * 2012-07-09 2018-11-28 Nikon Corporation Drive system and drive method, and exposure device and exposure method
NL2014562A (en) * 2014-04-04 2015-10-13 Asml Netherlands Bv Control system, positioning system, lithographic apparatus, control method, device manufacturing method and control program.
JP6438219B2 (ja) * 2014-06-17 2018-12-12 キヤノン株式会社 ステージ装置、リソグラフィ装置、物品の製造方法、および決定方法
KR101783832B1 (ko) 2015-04-27 2017-10-10 주식회사 동운아나텍 카메라의 보이스 코일 액츄에이터 구동장치 및 그 방법
DE112018001626T5 (de) * 2017-04-27 2020-01-16 Nidec Corporation Steuervorrichtung, die einen befehlsspannungswert ausgibt
TWI644188B (zh) * 2017-09-05 2018-12-11 士林電機廠股份有限公司 伺服馬達驅動控制系統之即時電流擾動估測器
CN109541899B (zh) * 2018-12-21 2021-08-17 东莞市多普光电设备有限公司 一种基板预定位曝光方法及预定位机构

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JPH088630A (ja) * 1994-06-22 1996-01-12 Nec Corp アンテナの駆動制御装置
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JP2001195850A (ja) * 2000-01-12 2001-07-19 Hitachi Ltd 位置決め制御装置
JP2001325005A (ja) * 2000-03-09 2001-11-22 Hiroshi Fujimoto 制御システム
WO2002082194A1 (fr) * 2001-03-30 2002-10-17 Mitsubishi Denki Kabushiki Kaisha Dispositif de commande asservie
JP2005303196A (ja) * 2004-04-15 2005-10-27 Canon Inc 位置決め装置、露光装置、半導体デバイスの製造方法
JP2005322720A (ja) * 2004-05-07 2005-11-17 Nikon Corp ステージ制御装置及び方法、露光装置及び方法、並びにデバイス製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010055673A1 (ja) * 2008-11-13 2010-05-20 株式会社ニコン 移動体の駆動制御方法、露光方法、ロボット制御方法、駆動制御装置、露光装置、及び、ロボット装置
JP2012114436A (ja) * 2010-11-22 2012-06-14 Asml Netherlands Bv コントローラ、リソグラフィ装置、オブジェクト位置の制御方法及びデバイス製造方法
US8854607B2 (en) 2010-11-22 2014-10-07 Asml Netherlands B.V. Controller, lithographic apparatus, method of controlling the position of an object and device manufacturing method
WO2012102060A1 (ja) * 2011-01-28 2012-08-02 株式会社ニコン 駆動システム及び駆動方法、露光装置及び露光方法、並びに駆動システム設計方法
JP5909451B2 (ja) * 2011-01-28 2016-04-26 国立大学法人 東京大学 駆動システム及び駆動方法、露光装置及び露光方法、並びに駆動システム設計方法
JP2013222962A (ja) * 2012-04-18 2013-10-28 Asml Holding Nv リソグラフィ装置及び固有モード結合を補償する方法
US9329502B2 (en) 2012-04-18 2016-05-03 Asml Holding N.V. Lithographic apparatuses and methods for compensating for eigenmode coupling

Also Published As

Publication number Publication date
JPWO2009031654A1 (ja) 2010-12-16
KR20100072015A (ko) 2010-06-29
US20110046795A1 (en) 2011-02-24
CN101855705A (zh) 2010-10-06
TW200915019A (en) 2009-04-01

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