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WO2009027016A1 - Article à revêtement nanoscopique de metal précieux/semi-précieux et son procédé de production - Google Patents

Article à revêtement nanoscopique de metal précieux/semi-précieux et son procédé de production Download PDF

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Publication number
WO2009027016A1
WO2009027016A1 PCT/EP2008/006638 EP2008006638W WO2009027016A1 WO 2009027016 A1 WO2009027016 A1 WO 2009027016A1 EP 2008006638 W EP2008006638 W EP 2008006638W WO 2009027016 A1 WO2009027016 A1 WO 2009027016A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
copper
coated article
article according
previous
Prior art date
Application number
PCT/EP2008/006638
Other languages
English (en)
Inventor
Bernhard Wessling
Original Assignee
Ormecon Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ormecon Gmbh filed Critical Ormecon Gmbh
Publication of WO2009027016A1 publication Critical patent/WO2009027016A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Definitions

  • the present invention relates to coated articles which contain a layer of copper or a copper alloy and a nanoscopic layer of precious metal and/or semiprecious metal, and which are particularly suitable as printed circuit boards or for the production of printed circuit boards.
  • Copper is one of the most widely used metallic materials of our time. Although copper is a semiprecious metal, this material is readily oxidizable, which often has an adverse effect on its use properties. This manifests itself not only visually but also has in particular practical technical disadvantages. Particular problems arise in the coating of printed circuit boards, which are then assembled in soldering processes, copper wires which are used as electrical conductors, or copper pipes. Finely divided copper powders are practically impossible to produce and use without oxidation protection.
  • Copper is normally not, like iron and steel, provided with protective coatings which in the case of lacquers often have to be applied in several layers. Instead, as protection against copper corrosion, substances which form complexes with copper, such as for example imidazoles, benzimidazoles, benzotriazoles, thiourea and imidazole-2-thione, are predominantly used.
  • Such organic complexing agents are admittedly inexpensive and easy to process, however they display a number of disadvantages .
  • formulations with imidazoles or benzimidazoles often contain formic acid and sometimes other organic acids which smell unpleasant, are corrosive and have toxicological disadvantages.
  • the thermal stability is low. Therefore, in the production of printed circuit boards, for protection against corrosion copper is often coated with other metals such as for example gold, silver or tin, in order to preserve the solderability of the copper contacts and the copper-plated drill holes, which is otherwise lost in a very- short time through oxidation.
  • Metallic coatings are in general very suitable for printed circuit boards, however they also display a number of disadvantages.
  • Coatings with gold (on an intermediate layer of nickel which is several micrometers thick) are expensive not only on account of the high price of gold, but in addition require special processes for the application of the gold layer.
  • gold cannot be chemically applied in so- called horizontal systems but only in vertical systems, which results in additional high process costs.
  • black pad phenomenon, which is a corrosion phenomenon, is known as a technical risk; likewise, so-called "microvoids” also occur.
  • silver- plated copper pads often tarnish e.g. due to sulphur compounds contained in the air.
  • mechanical strength and electric reliability of soldered joints on silver-plated copper pads is often greatly impaired by so-called "microvoids" which appear at the boundary surface.
  • Tin is admittedly satisfactory from the technical and economic point of view, in particular when it is applied with the aid of an organic metal, such as for example in the ORMECON CSN process of Ormecon GmbH, however its deposition as a rule requires several minutes, which renders correspondingly large- sized systems necessary in order to ensure a high throughput.
  • a process is known from patent application DE 10 2004 030 388 with which the copper surfaces ("pads") to be soldered are coated with dispersions which contain essentially intrinsically electrically conductive polymers which equally protect against oxidation and preserve solderability .
  • OSPs Organic Solderability Preservatives
  • One of the disadvantages is that the coating is not visually detectable due to its thin layer thickness (less than 100 nm) , which makes an initial quality check difficult.
  • its resistance to aging - although clearly improved compared with conventional OSPs - is still much less than that of metallic coatings.
  • a process for the production of metallized materials is known in which the material to be metallized is first coated with an intrinsically conductive polymer, the intrinsically conductive polymer is then activated by reduction and finally the metal is applied in a non-electrochemical manner in that the coated material is brought into contact with a solution of ions of the metal.
  • the process is particularly suitable for the deposition of tin onto copper but also for the metallization of plastic surfaces .
  • the object of the invention is thus to provide a coating which can be applied as quickly and easily as organic coatings and also with very good reproducibility, but in the process at least attains the properties of metallic end-surfaces and avoids their disadvantages outlined above.
  • a nanoscopic layer 150 nm thick or less which contains at least 80 wt.-%, relative to layer (iii), of at least one precious metal and/or semiprecious metal other than copper and which does not contain electrically conductive polymer,
  • the copper or copper alloy layer (ii) is arranged between the layers (i) and (iii) .
  • the (average) thickness of layer (iii) is thus 150 nm, e.g. 100 nm or less. It is determined by means of methods known in the state of the art, e.g. electrochemically or by means of EDX (Engergy Dispersive X-Ray Analysis) . In particular, there are no other materials between layers (i) , (ii) and (iii) .
  • the solution according to the invention is particularly surprising in so far as it was not to be expected, in the light of the state of the art, that such a thin layer would attain and exceed the property of known metallic end-layers which are in each case much thicker.
  • the layer thickness of layer (iii) is thus 150 ran or less, which contradicts the general expectation that a greater effect would be achieved with thicker layers.
  • the layer is at least 80% composed of the (semi) precious metal, but is not necessarily homogeneous, uniformly thick or dense.
  • the details in this patent application relating to the thickness and composition in particular of layer (iii) according to the invention relate to the values as defined and measured above.
  • Layers according to the invention can be produced by various processes customary in nanotechnology. However, processes in which the (semi) precious metal is dissolved in a liquid medium together with one or more organic complexing agent (s) or dispersed finely divided, and the metal precipitated out of this dispersion/solution, are particularly preferred.
  • finely divided is meant that the metal, i.e. the compound containing the metal, is present in the liquid medium in the form of particles of an average size smaller than 500 nm, or that the remaining constituents of the dispersion are present colloidally dispersed in a particle size of ⁇ 500 nm.
  • Coatings produced in this way are remarkably resistant to various aging stresses. Thus the wetting angles are still below 60° even after 4 reflow steps.
  • This resistance to aging is at least equivalent to that of a conventional silver layer which is normally at least 200 - 250 nm thick and with conventional "chemical-silver” or “immersion silver” processes (e.g. as marketed by the companies Cookson-Electronics or Enthone or MacDermid) .
  • these Ag layers produced according to processes known from the state of the art are scarcely age- resistant and quickly reduce the initially good soluerability .
  • the surface and the deposition are evidently favourably influenced by the organic Cu complexing agents.
  • Layer (iii) contains at least one precious metal which is selected in particular from the group Ag, Au, Pt, Pd, Rh, Ir, Ru, Os and Re, and/or a semiprecious metal which is selected from the group Ni, Ti, Cu, Sn and Bi.
  • Layer (iii) can furthermore contain an organic component, in particular as a result of using complexing agents during production, but no electrically conductive polymer, or mixtures thereof with other substances such as electrically non-conductive components .
  • Layer (iii) can also contain further additives, in particular surfactants, non-conductive polymers, viscosity modifiers, flow aids, drying aids, gloss improvers, flatting agents and mixtures thereof, preferably in a concentration of up to 20 wt. -% together with the conductive polymers or organic nanometals relative to the mass of layer (iii) .
  • further additives in particular surfactants, non-conductive polymers, viscosity modifiers, flow aids, drying aids, gloss improvers, flatting agents and mixtures thereof, preferably in a concentration of up to 20 wt. -% together with the conductive polymers or organic nanometals relative to the mass of layer (iii) .
  • Preferred complexing agents are selected from the group consisting of nitrogen-containing organic compounds such as mono- or binuclear heterocycles, urea and its derivatives, chelating agents, polyamine carboxylic acid compounds or their salts and the like.
  • Preferred complexing agents are imidazoles, benzimidazoles or comparable complexing agents, such as benzotriazoles, urea, thiourea, imidazole-2-thione, (sodium) ethylenediamine tetraacetate (EDTA) , (Ka, Na) tartrates, ethylenediamine disuccinic acid, and mixtures thereof, which are characterized by a relatively good thermal stability.
  • Layer (iii) preferably contains more than 80% precious metal (s) or semiprecious metal (s), in particular more than 80 or e.g. 90 or 95%, relative to the mass of layer (iii) .
  • layer (iii) Further constituents of layer (iii) are the above complexing agents and optionally further constituents which result from the layer-deposition process.
  • layer (iii) does not contain tin.
  • the at least one precious metal other than copper of layer (iii) is silver and the layer does not contain tin. Furthermore, it is preferred that none of the layers of the coated article of the present invention contains tin.
  • the layers (i) , (ii) and (iii) of the coated article consist of the materials as disclosed above and in the following description of the invention.
  • layer (iii) preferably consists of the at least one precious metal, in particular silver, wherein the content of said precious metal is at least 80 wt.-%, relative to layer (iii), for example, at least 90 or at least 95 wt.-%, and additives selected from electrically non-conductive components, viscosity, modifiers, flow aids, drying aids, gloss improvers, flatting agents and mixtures thereof as well as components resulting from the deposition- process as described herein, with the proviso that layer (iii) does not contain an intrinsically conductive polymer.
  • base layer (i) all materials used in printed circuit board technology are suitable, in particular epoxides and epoxide composites, Teflon, cyanate esters, ceramics, cellulose and cellulose composites, such as for example cardboard, materials based on these substances and flexible base layers, for example based on polyimide .
  • the base layer preferably has a layer thickness of 0.1 to 3 mm.
  • the copper layer or copper alloy layer (ii) preferably has a thickness of 5 to 210 ⁇ m, in particular 15 to 35 ⁇ m.
  • a further metal or alloy layer (iv) can be positioned between layer (ii) and layer (iii) .
  • Layer (iv) preferably contains silver, tin, gold, palladium or platinum.
  • layer (iv) contains mainly, i.e. more than 50 wt.-% relative to the mass of layer (iv) , one or several of the said metals.
  • the said metals can in particular be present as an alloy with copper.
  • layer (iv) consists exclusively of the said metals, either in pure form or in the form of an alloy.
  • Layer (iv) preferably has a layer thickness of 10 to 800 nm.
  • layer (iv) can contain organic components in a concentration of preferably 1 to 80 wt. -% relative to the total mass of layer (iv) (metal content 20 to 99 wt.-%) .
  • Preferred organic components are conductive polymers or organic metals, or organic copper complexing agents such as thiourea or benzotriazoles .
  • the articles according to the invention are particularly suitable for the production of printed circuit boards, and the articles are preferably printed circuit boards which are also described as boards . These are thin plates used for the assembly of electrical components, with holes through which the leads of components are inserted for further soldering.
  • a layer of copper or a copper-containing alloy is applied onto the surface of a base layer;
  • step (2) the layer produced in step (1) is optionally structured;
  • a layer which contains at least one precious metal or semiprecious metal other than copper is applied to the optionally structured copper or copper alloy layer.
  • the copper or copper alloy layer (ii) is degreased and cleaned following step (1) .
  • the articles are preferably treated with normal commercial acidic cleaners. Cleaners based on sulphuric acid and citric acid, such as for example the cleaner ACL 7001 from Ormecon GmbH, are preferred.
  • the articles are preferably left in the cleaning bath for about 2 minutes at 45 0 C and then washed with water.
  • etching solutions are commercially available, such as for example the hydrogen peroxide-containing solution Etch 7000 from Ormecon GmbH.
  • the articles are preferably left in the etching solution for about 2 minutes at 30 0 C.
  • the layer produced in step (1) is preferably structured by lithographic or etching processes, whereby the conductor track structure is created.
  • Layer (iii) is preferably applied to the article by treating it, after rinsing with water, with a dispersion/solution of an organic complexing agent in a dispersion/solvent which is liquid at a temperature of >25°C, for example by dipping the article in the dispersion or by applying the latter to the article.
  • the precious metals or semiprecious metals are contained in particular as water-soluble ions in the dispersion medium in a concentration of ⁇ 150 mg/1, e.g. in particular in a concentration of 180 mg/1, such as e.g. 200 mg/1, or in a range of greater than 150 mg/1 to 250 mg/1, e.g. up to approx. 500 mg/1 or up to approx. 1000 mg/1. Concentrations of up to a few g/1, e.g. up to 10 g/1, can also be suitable.
  • the article is preferably brought into contact with the dispersion for more than 60 seconds to 5 minutes, e.g. for 90 to 120 seconds, at ⁇ 25°C. Contact is preferably established for 90 to 120 seconds at a temperature of 35°C to 45°C.
  • dispersion media organic solvents, preferably organic solvents miscible with water, water and mixtures thereof are suitable.
  • Preferred solvents miscible with water are alcohols, in particular alcohols with a boiling point of more than 100 0 C and preferably below 250 0 C.
  • Water and aqueous solvents are preferred as dispersion medium. These are advantageous not only with regard to emissions and the non-wetting of the solder stop lacquer; it has also been found that water and aqueous solvents yield better results. This was surprising in that oxidation processes on copper proceed particularly rapidly in an aqueous environment. Solder stop lacquer is used to mask the areas of the printed circuit board which must not be wetted by the solder during the assembly process. The solder stop lacquer should not be wetted by the conductive polymer, since otherwise this would cause short circuits between the copper surfaces.
  • dispersions which contain no formic acid are used, however, other acids and/or buffers can be contained in the dispersions .
  • water-based compositions which contain imidazole, urea, thiourea or other Cu complexing agents, preferably a mixture of at least 2 of these complexing agents, can be considered as solutions suitable for coating.
  • coated articles according to the invention are characterized in particular in that they can not only be soldered well even after prolonged storage, but are also solderable several times,- i.e. can bs used in multistage soldering processes, so-called reflow processes. In this respect, the properties of (much thicker) metallic coatings were attained and even exceeded.
  • the new coating is at least equivalent to all previously known end-surfaces.
  • the colour scarcely changes (from the original pale silver) . It just turns somewhat darker.
  • no degradation in solderability was established even after 4 reflow steps.
  • the dispersions/solutions according to the invention as defined herein can also be used to protect copper powders against oxidation, wherein the copper powder particles have a size in the micrometer range, or sub- ⁇ iicrcmster range, i.e. less than 1 ⁇ m.
  • Figure 1 shows a printed circuit board with a test design
  • Figure 2 shows the heat profile in a reflow test
  • Figure 3 shows an SEM image of a layer according to the invention, as outlined above
  • Example 1 Production of coated printed circuit boards
  • Printed circuit boards of epoxy resin composite were cleaned and degreased using a normal commercial cleaner based on sulphuric acid and citric acid (ACL 7001, Ormecon GmbH) in a cleaning bath for 2 minutes at 45°C.
  • the printed circuit boards used had a test design (see Figure 1) which has been agreed with test institutes and printed circuit board manufacturers and is modelled on real printed circuit board structures. These boards enable the solderability to be measured and assessed.
  • the printed circuit boards were rinsed with tap-water at room temperature and then treated with an H 2 0 2 -containing etching solution (Etch 7000, Ormecon GmbH) for 2 minutes at 30 0 C.
  • the plates were rinsed again with tap-water at room temperature and then coated with an aqueous formulation according to the invention which contained 400 mg/1 AgNO 3 , 100 mg/1 polyvinyl alcohol, 50 mg/1 complexing agent 2MZA from Shikokou (Japan) , and 55 mg/1 urea and 1.8 g/1 citric acid.
  • an aqueous formulation according to the invention which contained 400 mg/1 AgNO 3 , 100 mg/1 polyvinyl alcohol, 50 mg/1 complexing agent 2MZA from Shikokou (Japan) , and 55 mg/1 urea and 1.8 g/1 citric acid.
  • the boards were immersed in the aqueous dispersion at 35°C for 90 seconds. After this, the printed circuit boards were dried at up to 100 0 C.
  • Printed circuit boards were coated analogously to Example 1, but the dispersion used contained no AgNO 3 .
  • Example 4 Soldering angle measurement
  • the boards were subjected to a reflow test.
  • the board is subjected to a heat profile as shown in Figure 2 in a commercial reflow oven which is used for modern lead-free soldering methods.
  • the reflow cycles serve to simulate repeated soldering operations.
  • the soldering angle is then measured by means of a soldering balance .
  • the coating according to the invention has small soldering angles even after repeated reflow cycles and smaller angles than comparison surfaces . This indicates better solderability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

La présente invention concerne un article revêtu contenant (i) au moins une couche de base non conductrice d'électricité, (ii) au moins une couche de cuivre et/ou d'alliage de cuivre, et (iii) une couche nanoscopique ayant une épaisseur égale ou inférieure à 150 nm, contenant au moins 80% en poids par rapport à la couche (iii), au moins un métal précieux et/ou semi-précieux autre que le cuivre, la couche de cuivre ou d'alliage de cuivre (ii) étant disposée entre les couches (i) et (iii). L'invention concerne également un procédé pour la production d'un tel article revêtu.
PCT/EP2008/006638 2007-08-24 2008-08-12 Article à revêtement nanoscopique de metal précieux/semi-précieux et son procédé de production WO2009027016A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007040065.0 2007-08-24
DE200710040065 DE102007040065A1 (de) 2007-08-24 2007-08-24 Artikel mit einer nanoskopischen Beschichtung aus Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
WO2009027016A1 true WO2009027016A1 (fr) 2009-03-05

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ID=39967813

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/006638 WO2009027016A1 (fr) 2007-08-24 2008-08-12 Article à revêtement nanoscopique de metal précieux/semi-précieux et son procédé de production

Country Status (3)

Country Link
DE (1) DE102007040065A1 (fr)
TW (1) TW200922416A (fr)
WO (1) WO2009027016A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004003784B4 (de) 2004-01-23 2011-01-13 Ormecon Gmbh Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung
DE102005010162B4 (de) 2005-03-02 2007-06-14 Ormecon Gmbh Leitfähige Polymere aus Teilchen mit anisotroper Morphologie
DE102005039608A1 (de) 2005-08-19 2007-03-01 Ormecon Gmbh Zusammensetzung mit intrinsisch leitfähigem Polymer
EP2062467B1 (fr) 2006-09-13 2012-02-15 Enthone, Inc. Article à revêtement combiné de polymère électro-conducteur et de métal précieux/semi-précieux et son procédé de production
DE102017113871A1 (de) * 2017-06-22 2018-12-27 Doduco Solutions Gmbh Bondsubstrat sowie Verfahren zum Schützen von zum Drahtbonden vorgesehenen Oberflächen

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Publication number Priority date Publication date Assignee Title
EP0407492A1 (fr) * 1988-10-11 1991-01-16 Zipperling Kessler & Co Procede pour fabriquer des couches minces en polymeres conducteurs.
WO1997039610A1 (fr) * 1996-04-18 1997-10-23 International Business Machines Corporation Revetement composite organique-metallique pour la protection des surfaces de cuivre
EP0807190A1 (fr) * 1995-11-29 1997-11-19 Zipperling Kessler & Co (GmbH & Co) Procede de production de materiaux metallises
WO2002029132A1 (fr) * 2000-10-06 2002-04-11 Atotech Deutschland Gmbh Bain et procede de depot autocatalytique d'argent sur des surfaces metalliques
DE202005010364U1 (de) * 2005-07-01 2005-09-08 Ormecon Gmbh Zinnbeschichtete flexible Leiterplatten mit geringer Neigung zur Whiskerbildung
EP1615484A1 (fr) * 2004-06-23 2006-01-11 Ormecon GmbH Article avec une couche d'un polymère électroconducteur et procédé de sa production
US20060024430A1 (en) * 2004-07-29 2006-02-02 Enthone Inc. Silver plating in electronics manufacture

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DE102004030930A1 (de) * 2004-06-25 2006-02-23 Ormecon Gmbh Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung

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Publication number Priority date Publication date Assignee Title
EP0407492A1 (fr) * 1988-10-11 1991-01-16 Zipperling Kessler & Co Procede pour fabriquer des couches minces en polymeres conducteurs.
EP0807190A1 (fr) * 1995-11-29 1997-11-19 Zipperling Kessler & Co (GmbH & Co) Procede de production de materiaux metallises
WO1997039610A1 (fr) * 1996-04-18 1997-10-23 International Business Machines Corporation Revetement composite organique-metallique pour la protection des surfaces de cuivre
WO2002029132A1 (fr) * 2000-10-06 2002-04-11 Atotech Deutschland Gmbh Bain et procede de depot autocatalytique d'argent sur des surfaces metalliques
EP1615484A1 (fr) * 2004-06-23 2006-01-11 Ormecon GmbH Article avec une couche d'un polymère électroconducteur et procédé de sa production
US20060024430A1 (en) * 2004-07-29 2006-02-02 Enthone Inc. Silver plating in electronics manufacture
DE202005010364U1 (de) * 2005-07-01 2005-09-08 Ormecon Gmbh Zinnbeschichtete flexible Leiterplatten mit geringer Neigung zur Whiskerbildung

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Title
ZHELIANG WEI, DIAN TANG, THOMAS O'KEEFE: "Nano-structured silvercoating on copper prepared in an ethanol-based solution", CHINA PARTICUOLOGY, vol. 3, no. 5, 2005, pages 271 - 274, XP002504708 *

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TW200922416A (en) 2009-05-16
DE102007040065A1 (de) 2009-02-26

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