WO2009026998A2 - Connection of a chip comprising pads and bumps to a substrate comprising metallic strip conductors - Google Patents

Abstract

A connection of an RF chip (1) comprising pads (2; 2') is established by connecting said pads (2; 2') to substrate and strip conductors in an opening (10a; 10f) of a laminate. The connection to the strip conductors (3, 31) integrated into the substrate (4) is established via the chip pads (2). Once the connection has been established, the opening (10, 10', 10f) comprising the chip and the pads is filled with a sealing material that increases the compressive strength of the entire chip module. Preferably, the strip conductor structures are formed once the connection process of the chip (1) has been completed, thus significantly improving the cost efficiency and quality of the chip, simplifying the production processes, and optimizing a permanent safe connection between the chip and the strip conductors. Said connections can also be perfectly used in tough environments, e.g. in laundries.

Description

 Connection of a chip provided with pads and bumps with a substrate provided with metallic interconnects

The invention relates to a compound according to the preamble of claim 1.

Such connections in an RF chip or an electronic component with pads or bumps are provided with substrate equipped with metallic tracks, which are suitable for radiofrequency based transponder textile labels, transponder-the-TAG, transponder smart card, transponder inlays, chip modules and others similar IC circuits are used in superior quality. For this purpose, frequency ranges from 1 to 3000 megahertz are provided.

Smart cards can be functioning transponders and consist of chip modules and antennas. A chip module consists of at least one chip on a conductor track with an antenna connection.

The solutions known today for the production of the above-mentioned products require a complicated adhesive process with cyan-acrylate adhesives or a hotmelt process for the connection between the substrate and the chip. Also, the contact connection between the pad / bump and the trace is highly susceptible to adhesive because of the swelling of the plastic in the glue. Also, due to the different coefficients of thermal expansion of the various plastics and the adhesive, it is necessary to reckon with severe warping and delamination.

From US-A-6,259,408 is known to build a chip module in which the pads / bumps (bumps) of the chips are placed on the surface of the tracks and hold them by gluing in contact, such that a metallic contact arises, wherein it is also proposed to fix the chip with the substrate, for example by means of an adhesive in addition. Plastic foils are very smooth and uneven due to their manufacturing processes by rolling and casting processes. As a result, the additional adhesive (here called Globtop in technical language) has little opportunity to anchor itself sufficiently. The bump bond and the additional fixation style of the chip / bump chip are unable to withstand greater external forces encountered in daily processes (eg, laundry or carrying in purses). Applications with high humidity, increased pressure and temperatures are therefore not possible.

Document EP-A-0 706 152 shows a solution for the construction of smart cards using a substrate with metallic wiring pattern layer (antenna) with chip bonded thereto in conventional bonding technique (US 6,259,408). Another chip-cut substrate is punched over the chip in chip thickness to accommodate the chip, followed by another two films. This is a very complex working process, which places the highest demands on the centering process (indexing of the foils) and on the gluing. The use of multiple substrate layers gives this solution a relatively large thickness, making it very stiff (undesirable in inlets and card making). Due to the above-mentioned problems and requirements, this solution is very costly and not suitable for economical use in environments with increased load and where card flexibility and card quality are required.

Due to the very small dimensions of the chips, the connecting surfaces / bump and the printed conductors, which lie in the micrometer range, the smallest unevenness and tolerances have a negative effect on the connection quality. The required quality is difficult to control and maintain. The profitability of the manufacturing process is thereby enormously impaired.

Often labels for textiles are provided with so-called RFID (Radio Frequency Identification) chips, which can be used in process or sales logistics as well as serve to protect against theft. Such labels must e.g. also be suitable for cooking linen. Due to the moisture, the aforementioned conventional connection of the pads and bumps suffers from the corresponding traces. The plastic / adhesive surrounding the pads / bumps swells and can lift the connection feet by a few nanometers, resulting in a connection interruption. Due to the high temperature of the cooking laundry, thermal expansions are generated in the materials involved, which in turn generate the smallest displacements in the connection and also cause connection interruptions.

Since the interconnects and the individual joints are very close to each other (distance about 100 microns) and are not limited, there is also a risk of short circuit on the conductive connection means of the adjacent joints.

In the document DE-A-196 18 103 a smart card module design is proposed in which the Wirebond method is used. Very disadvantageous in this proposal is that the Wirebonddraht in any case runs over the upper edge of the connecting web of the carrier and must be protected by a so-called Globtop against damage. The reason for this is that the chip connection and the terminals of the contact surfaces can not be in the same cavity, which requires that the chip must be supported by connecting webs formed from the carrier. The bonding wire must cross this connecting web of the carrier. To protect the connection on the chip and the bonding wire (arc), a globtop raised from the surface of the carrier must be applied. This increase has a very disadvantageous effect, since no more flat surface is given. The process of attaching the globtop is very difficult to control because, on the one hand, the droplet on the carrier, because it is not guided, widens, and on the other hand, contamination is created on both sides of the chipcard module, which can only be removed with difficulty. Furthermore, there is no guarantee that the thin, sensitive wire will actually lie inside the globtop dome, because the dome is lowered uncontrollably due to widening on the support surface. The conductor track structure is prepared by punching before connecting the chip to the conductor track. Due to the many delicate process steps, the production costs for chip cards of this type are high. For these reasons, the design is not suitable for producing high-stress, high-quality and low-cost connections between microchip and interconnect structures on a polymer or leadframe laminate for use in harsh environments, for example for the production of transponders.

The document DE-A-195 00 925 shows another method for the production of smart cards. The chip card for contactless data transmission has various steps and elements, According to this method, the separately molded or stamped plastic card body with the following openings: a) a separately finished manufactured transmission module is attached, which is an antenna in the form of at least one coil and / or in Has form of electrically conductive layers. The separately finished transmission module consists of a single metallic printed circuit board (Lead) or can be combined in a special application applied to a carrier body made of plastic. The transmission module has connection surfaces for electrical connection to the connection surfaces of the chip module through openings in the card body. b) A finished card body already printed. This intermediate product (card body with embedded transmission module without expensive chip module) can now optionally be printed and then visually inspected according to committee criteria. c) A separately finished chip module with chip and on carrier mounted connecting tracks. d) Subsequent connection of the positions a and b and finally the assembly and connection of the position c with functional checks.

It turns out that the effort for the production of smart cards by this method is very costly and cumbersome, because

1) before a chip module of polymeric substrate with conductor and with at least one chip must be created;

2) a transmission module with antenna is to be created separately from the chip module and card body;

3) a card body is to be made by spraying or punching;

4) the transmission module must be fixed together with the card body;

5) the chip module must be installed in the card body with the transmission module.

Because of the many required work steps with relatively critical work processes, this results in high reject rates. These have a significant negative impact on the costs.

For the use of chip cards with the chip module and rougher operation (high bending load, elevated temperature and increased pressure and humidity), several problems arise with the connection chip module with transmission module, in particular: a) NCP glued connections that produce contacts only on a pressure basis, are sufficient limited in this case, since the glue swells due to absorption of moisture and creates a contact interruption gap, which leads to functional errors. b) Compounds with conductive glue are not possible for these solutions with a chip module, since the contact distances of the chip are too close to each other. - A -

The amount of glue can not be dosed in such a small amount, so that the glue crosses the small conductor separating gap and errors caused by short circuits between the individual contact points. c) It turns out that the creation of the connection by soldering between chip module and transmission module is a requirement.

With this method, the soldering of the connection chip module trace is very difficult because the soldering heat must be guided from below and from above through the card body and or the carrier. The following very negative effects arise:

1.) The card body is for reasons of stiffness a relatively thick plastic part made of a polymer such as PET or PEN or PEI. The required heat of soldering is around 232 ⁰ C. The contact on the surface of the plastic must be addressed with about 280 ⁰ C. At this temperature already starts the PET used for cost reasons; PEN plastic melt (250oC). So it must be an expensive polyimide plastic having a melting point above 300 ⁰ C used.

2.) This plastic is available but very expensive, about 15 to 20 times higher than a plastic made of PET. Thus, this plastic is too expensive to use as card stock and could be used only for applications where cost and stress are unproblematic. Unfortunately, the said also applies to the carrier of the transmission module. The economy is not given.

3.) Another disadvantage of the heat supply from the outside via the plastic to the junction is the poor heat conduction of the plastic, combined with the large Wärmeleitweg. The large heat conduction results because of the required stiffness of the card body, which requires a thicker plastic. This poor heat conduction slows down the automatic process enormously, which in turn leads to high costs.

For wirebending the transmission module must be executed in any case with a closed carrier with transmission tracks. The carrier must also be made of a polyimide plastic because of the relatively high bonding temperature. This also leads to high costs, on the one hand Wirebondkosten are already higher than soldering costs and on the other hand, the costs for the closed carrier in addition and because polyimide must be used, high. An economical production is not given. A punched lead without a closed support can not be used for this method, because the required adhesive sealant for the additional necessary fixation of the chip module in the card body through the openings in the punch runs out and can be cleaned later only by large expenses. Also, the production facilities are heavily affected by pollution and cause further costs.

Furthermore, the antenna structures of the transmission module with the openings in the card body must be designed precisely matching each other prior to connection to the chip module, which makes enormous demands on the indexing (match tolerance) of the layers.

This method is therefore for an intermetallic solder joint between the chip and antenna conductor on the one hand too uneconomical (additional support) for the conductor track structures and on the other hand, the connection opening can not seal pollution-free.

The invention has for its object to provide a compound of the type mentioned above, which has an improved connection quality, and in the negative effects of bumps and tolerances of the chips, the pads / bumps and the interconnects as well as the negative temperature and pressure influences can be largely eliminated. In addition, the invention aims for a clear, cost-effective production with high quality. This object is achieved according to the invention by a compound having the features of claim 1.

Further preferred embodiments of the inventive compound form the subject of the dependent claims.

According to the invention, in a substrate of a laminate of the polymer substrate film and a metal foil, openings are made in which the chip or the chip connection area is at least partially immersed. Electrically conductive connecting means are present in the openings and, or as an order on the pads / bumps. As connecting means soft solders, metal wires, adhesive and / or sealant are provided. The metal foil is structured and serves as an electrical conductor.

In this case, the pads / bump no longer need to be placed exactly on the corresponding tracks, but they are introduced with at least part of their height in the openings with connecting means and are anchored stable in position through the walls of the openings and the cured connection means. Thus, not only is more area available from the connection feet for the connection, but the unevenness or other dimensional deviations no longer matter. The economy and quality of the manufacturing process is thus significantly improved. Even with temperature-related small shifts, there is no connection interruption. Since now the electrically conductive connection means are guided in the openings and not on the track surface, the risk of short circuit is largely eliminated or at least reduced. In soft solder applications, an intermetallic compound is created at the transition points between the trace, the solder and the connection feet.

According to the invention, however, the entire chip with pads / bumps in the opening in the substrate can be completely immersed and connected with connecting means to the track and be poured with plastic compound, which results in a special protection against pressure, heat and moisture. This makes the transponder also capable of use under the most severe conditions such as: high pressure, high temperature and high humidity (laundry Kailander or Autoclave), which means that the inventive compound can be used in transponder in wet environment and laundries at washing temperatures up to 900C, in autoclaves up to 1380C and in laundry-kailander with surface temperatures (+ pressure) up to 1700C.

The invention will be explained in more detail with reference to the drawing. It shows purely schematically:

1 shows a section through bonding of a chip provided with connection surfaces with a substrate provided with metallic interconnects according to the prior art,

Fig. 2 is a sectional view of an embodiment of the invention

Connection of a chip provided with pads and bumps with an openings provided in metallic tracks,

3 an embodiment of a connection according to the invention in section, with openings made in the polymeric substrate for chip pads or bumps containing connecting means,

4 shows an embodiment of a chip with pads or bumps including the connecting means in section,

5 shows an embodiment in section, in which the chip and the pads or bumps at least partially embedded in the opening of the substrate (4) and are partially encapsulated with sealant, 6 shows a section of a variant in which the chip and the connection surfaces or bumps are completely embedded in the opening of the substrate and completely encapsulated with sealing compound,

7 is a section of an embodiment in which the connecting means is a metallic, electrically conductive wire which is connected to the bumps and the interconnects intermetallically in the Wirebond method,

8 shows a section of a variant in which the connecting means is connected in a wire-bonding process to a metallic, electronically conductive wire which extends intermetallically at the connecting surfaces or bumps and at the conductor tracks over at least part of the spirally laid turns.

9 is a plan view of the embodiment of FIG. 8, without cover sheets and

Adhesive,

10a and FIG. 10b, HF smartcard in plan view and side view with the connection according to the invention according to FIG. 7 or FIG. 8, FIG.

11a and 11b, a second application of the connection according to the invention according to FIG. 5 or FIG. 6 for a UHF smartcard in top view and side view, respectively, FIG.

12a and FIG. 12b, a third application of the solution according to the invention according to FIG. 5 or FIG. 6 for a strap chip module in plan view or longitudinal section along the line G-G according to FIG. 12a, FIG.

13a and 13b show a fourth application of the connection according to FIG. 4, FIG. 5 or FIG. 6 in a UHF foil inlay in plan view or in longitudinal section,

FIGS. 14a and 14b show a fifth application of the connection according to FIGS. 7 and 8 for a HF foil inlay in section along line K - K in FIG

Fig. 14b a side view.

1 shows a prior art conventional connection of a chip (1, 2) provided with connecting surfaces (2, 2 ') with a polymeric substrate (4) of the laminate (26) provided with metallic conductor tracks (3, 3'). The chip (1) may for example have a size of 400x400x150 microns. The conductor tracks (3, 3 ') are preferably made of copper. The chip (1) is placed on the corresponding conductor tracks (3, 3 ') with the, for example, gold-plated connection surfaces (2, T), and the connection feet (2, 2') are materially connected to the conductor tracks (3, 3 ') , usually by a non-conductive adhesive. The corresponding connection means is designated in FIG. 1 with (6). Also, the chip (1) itself is connected to the substrate 4 and the conductor tracks (3, 3 ') cohesively, usually by means of the non-conductive adhesive (6). The result is the case that the adhesive (6) does not dry out to the desired line (dot-dashed line 24), but expands widely on the laminate (26), indicated by arrows D and D ^" Adhesive quality and there is a risk of moisture penetration into the joints (swelling of the adhesive 6) .This leads to corrosion and oxidation of the contact points.Also rises by the water absorption, the connection pad (2) / conductor track (3) from each other in the micrometer range (Swelling), which means that the transponder fails after a short period of use.

As already mentioned, in the case of the very small dimensions of the chips (1), the connection feet and the conductor tracks, the smallest unevenness and tolerances can have a negative effect on the connection quality, which in FIG. 1 does not affect the connection foot (2 ') Conductor track (3 ') "sits", indicated (arrow C). Also, the "lifting" of the pad (2 ¹ ) (which may cause a connection interruption) may be due to temperature, or caused by swelling of the adhesive 6. In Fig. 1, the possible skipping of the conductive connecting means of very close to each other lying joints is indicated by an arrow A, which means a risk of short circuit.

FIG. 2 shows a connection according to the invention of the same chip (1) to the substrate (4) and the conductor tracks (3, 3 '). The conductor tracks (3, 3 ') have openings (10, 10') which are open on the chip side and contain electrically conductive connection means (11) (soft solders or conductive adhesives). The connecting surfaces (2, 2 ') are immersed in the connecting means (11) at least with part of their height. Thus, not only is more area of connection feet (2, 2 ') available for the connection, but the unevenness or other dimensional deviations no longer matter. The economy of the manufacturing process is thus significantly improved. Even with temperature-related small shifts, there is no connection interruption. Since now the electrically conductive connecting means (1 1) in the openings (10, 10 ') and not on the conductor surface are present, the risk of short circuit is eliminated or at least reduced.

The materially connected, via adhesive sealing compound (16) to the substrate (4) and the conductor tracks (3) connected chip 1, the connection feet (2, 2 ') with the corresponding conductor tracks (3, 3') via the electrically conductive connection means (1 1) are additionally solidified by a protective coating (15) (preferably a plastic compound, epoxy paint or an adhesive) and covered moisture-proof.

3 shows a first embodiment according to the invention in which a chip (1a), which may be, for example, an RFID (Radio Frequency Identification) chip generation 2, and its connection to the conductor track (3), on a polymeric substrate 4a is laminated. The substrate may e.g. made of PE or PET, PI or PEI, or made of impregnated with epoxy resin fabric. In this embodiment, the copper interconnects (3a, 3a ') are mounted on the side of the substrate 4a facing away from the chip (1a). In the substrate 4a through openings (10a, 10a ') per pad or bump (2) are made. These are open on the chip side and closed on the opposite side by the conductor track and contain the electrically conductive connection means (11) (soft solders or conductive adhesives) in which the connection feet (2a, 2a ', 11d) are immersed at least part of their height. As a result, the chip is accurately positioned and firmly anchored to the laminate in the opening by the bump and Verbindungsungsmittelführung.

In another solution, the connecting means (11) as Lötbump (11 d) with the chip pads or bump (2) is supplied; this is such that a soldering tin is applied to the end face (2d ') of the connection surface (2d) of the chip (1). A stored in the opening connection means is therefore no longer mandatory. The conductor track (3) is open on the opposite side of the chip pad. As a result, the required Lötwärme, 220 ⁰ C, are optimally supplied to the junction. This via metal (copper) and chip quartz without going over the polymeric substrate. As a result, the soldering times are significantly shortened due to metallic heat conduction. The laminate bonding is significantly less stressed. This allows the use of less expensive substrates such as PE and less expensive laminate adhesives.

The chip (1 a) is connected to the substrate (4a) by means of an additional adhesive (16a), which may be mixed with soldering flux. The compound is solidified with an additional protective coating (15) and covered moisture-proof, preferably in the form of a plastic film, or an epoxy paint coating or adhesive. The development of the conductor track structure of the conductor foil on the laminate is carried out by etching or by a laser plasma method. 4 shows a chip (1) with a connection surface (2d) which is equipped with an additional solder bump (1 1 d), in such a way that a soldering tin is provided on the end face (2d ') of the connection surface (2d) of the chip (1) (1 1 d) is applied. An embedded in the opening (10a) connecting means (11) is thus no longer mandatory.

Fig. 5 shows a second embodiment according to the invention, in which the entire base of the chip (1) with bumps (2) with at least ei nem part of its height in the chip-side opening (1Of) of the substrate (4) dipped is and the pads or bumps (2) of the chip (1) with connecting means (11, 11d) in the recess with the conductor track (3) are connected. The opening (10f) is open on the chip side and bounded on the opposite side of the chip (1) by the conductor track. The conductor track (3) is freely open on the opposite side of the chip pad in this example. As a result, the required soldering heat of 220 ⁰ C can be optimally supplied to the junction. This via metal (copper) and chip quartz without going over the polymeric substrate. As a result, the soldering times (because metallic heat conduction) are significantly shortened. The laminate bonding is significantly less stressed. This allows the use of low-cost substrates such as PE and inexpensive laminate adhesive.

The difference from the previous embodiment according to the invention lies in the fact that the chip (1), the connection surfaces and bumps (2) and the affected conductor track part (3) with connecting means (11, 11d) lie in the opening (10f) and with plastic sealant (6,16, 16c) are moisture-proof over at least a part of their heights. As a result, the chip is precisely positioned and firmly anchored to the laminate by the chip and connection means guide in the opening.

Another difference is that the etching or lasing of the antenna conductor (3) / antenna structure (3) after complete connection of the chip (1) with the antenna conductor (3) and after pouring the opening (10f) with sealing compound (6, 16, 16c) can take place. Thus, a 100% tig controlled sealing mass order is limited by the edges of the opening (10f) guaranteed and the connection is of the highest quality and very inexpensive compared to other known methods. This procedure is very important, so that the opening without the system to pollute cleanly poured and then dried.

Fig. 6 shows a third embodiment according to the invention and analogous to FIG. 5, in which the chip (1) and its pads or bumps (2, 2 ') immersed entirely in the substrate (4) and with plastic sealant (16 ) are completely poured. The difference from the embodiment according to FIG. 5 lies in the fact that the chip with the connection surfaces and bumps are completely immersed in the substrate and completely surrounded by plastic sealing compound (6, 16, 16c). As a result, the connection surfaces or bumps (2) are connected to the conductor track (3) in an intermetallic manner in a particularly rigid, firm and secure manner. The whole chip (1) is completely immersed in the opening (10f) with plastic sealing compounds (6, 16, 16c) and surrounded. As a result, the chip is accurately positioned and firmly anchored by the chip potting compound in the opening with the laminate.

The conductor track (3) is at least partially exposed on the opposite side of the chip pad freely. As a result, the required soldering heat of approximately 220 ⁰ C can be optimally supplied to the junction, this via metal (copper) and chip quartz without going over the polymeric substrate. As a result, the soldering times (because metallic heat conduction) are significantly shortened. The laminate bonding is significantly less stressed. This allows the use of inexpensive substrate such as PE and inexpensive laminate adhesive.

The formation of the antenna conductor / antenna structure (3) by etching or lasing can also take place here after complete connection of the chip to the conductor foil and casting of the opening 10f with sealing compound (6, 16, 16c). This procedure •,. is preferred so that the opening, without polluting the plant, shed clean and can then be dried.

This design withstands chip, bumps and joints for increased pressure, temperature and humidity loads. These have an advantageous effect for continuous use in laundries (passing through calender rolls is made possible, etc.), high temperature pressure and humidity environment.

7 shows a fourth exemplary embodiment according to the invention, in which a metal, electrically conductive wire (21) which intermetallically connects the connection surfaces / bumps (2) and the conductor tracks (3, 28) is provided as connection means (27; ). The chip (1) is positioned in the opening (1 Of) with Die Attach adhesive (20) and glued to the conductor foil (3). The chip (1) and the connection surfaces / bumps (2) with the connecting wires (21) are completely embedded in the opening (10f) of the substrate (4) and completely molded with plastic sealant (16). As a result, the chip is exactly positioned, and firmly anchored by the chip potting compound in the opening (10f) with the laminate (26).

The conductor track (3) is at least partially exposed on the opposite side of the chip pad. As a result, the required heat of welding (temperature above 220 ⁰ C), which arises at the junction, be optimally dissipated or controlled. This via metal (copper) and chip quartz on appropriate cooling plates, without going over the polymeric substrate. This significantly improves the quality of the weld. The laminate bonding is significantly less thermally stressed. The wirebond process can be greatly accelerated. Furthermore, this inventive method allows the use of less expensive substrates such as PE and less expensive laminate adhesive.

The formation of the antenna conductor (3) / antenna structure (22) by etching, laser or plasma method can also advantageously after complete connection of the chip to the antenna conductor, and after pouring the opening (10) with the sealant (6, 16) This is analogous to Fig. 2, Fig. 4, Fig. 5. Here, a hundred percent controlled sealing compound order is guaranteed and the connection is of the highest quality. With this design, the chip, the bumps and joints with the wire (21) withstand increased pressure, temperature and humidity loads.

Fig. 8 shows a fifth embodiment in which a metallically electrically conductive wire (21) with the pads / bumps (2,2 ') and the interconnects (3) is intermetallically connected (Wirebondverfahren). The chip (1) is positioned in the opening (10f) with Die attach adhesive (20) and glued to the conductor foil (3). The chip (1) and the connecting surfaces / bumps (2,2 ') with the connecting wires (21) are completely embedded in the opening (10f) of the substrate (4) and completely encapsulated with plastic sealant (6, 16). As a result, the chip is precisely positioned and firmly anchored by the chip potting compound in the opening (10f) to the laminate (26).

The conductor track (3) is embodied here as a spiral antenna / coil antenna, as used for the production of HF smartcads (FIG. 9). In Fig. 8 illustrates how the connection of the start and end of the spiral antenna antenna track (3) with the pads / bumps) of the chip (1) through the connecting wire (21) in Wirebondverfahren in the simplest, most universal and cost-effective manner is solved. Furthermore, it is clearly visible how the loops of the antenna cross the chips and how the beginning and the end of the coil antenna (3) are connected to the chip (1). The formation of the antenna conductor (3) / antenna structure (3; 31) by etching, laser or plasma method can also be advantageously carried out after complete connection of the chip to the antenna conductor foil and after pouring the opening (10f) with sealing compound (6,16). This is one to one hundred percent Controlled sealing compound ensures and the connection is of the highest quality. By this design, the chip, the bumps and the joints with the wire (21) are resistant to elevated pressure, temperature and humidity loads. These have an advantageous effect for continuous use at high temperatures and or high pressure and or high humidity.

9 shows a top view of the solution according to the invention of FIG. 8. The cover films and the sealant (16) have been omitted here for the sake of simplicity. The optimal solution possibility of the connecting means (27, 28) and the simple bridging of the chip (1) over the antenna loops (3) by using the connecting wire (21), which allows a great flexibility with regard to the connection distances, are apparent.

10a and 10b show an application for HF smart card (35), which is constructed according to the invention of FIG. 8 and FIG. The spiral antenna (3) is made up of the antenna layer which is integrated (connected) to the substrate (4). The entire smart card (35) is realized from a thickness of 0.1 mm and upwards. Again, the simple and inexpensive bridging of the antenna loop is clearly visible. The two cover sheets (23) required for smart cards are applied to the laminate (26) by lamination. The cover sheets are made of paper or polymer films and can be provided with fonts and logos before or after lamination.

11a and 11b show an application for UHF smart card (36), which is constructed according to the invention according to FIG. 6 and FIG. The dipole antenna is made up of the antenna layer (3) which is integrated with the substrate (4). The entire smartcard (36) has a thickness from 0.1 mm. Again, the simple and inexpensive and thus optimal connection (40) of the antennas (trace) (3) to the chip pad (2) is clearly visible. The two cover sheets (23) required for smart cards are applied to the laminate (26) by lamination. The cover sheets (23) are made of paper or polymer films and can be provided with fonts and logos, before or after lamination. Smart card with UHF antennas respond to a greater distance than HF antennas. The choice of antenna type is made according to their requirement.

Figures 12a and 12b show an application for UHF chip modules (37). These can be found in separately fabricated antennas, e.g. Metal antennas woven into textile or large antennas made in plastic application. The connection to the antenna track (3) can be soldered or glued or mechanical. This embodiment is constructed analogously as in FIG. 5 or FIG. 6 or FIG. 7 in the context of the invention and constructed in a thickness of the chip module from 0.1 mm. Also, the simple and inexpensive construction is clearly perceptible. As can be seen in Fig. 6 and Fig. 7, the chip (1) is completely covered by the substrate (4). The chip module is suitable for heavy loads (laundry machines, high temperatures and pressures).

FIGS. 13a and 13b show an application for UHF inlay (38), which is constructed analogously to the connection according to FIG. 5 or FIG. 6 or FIG. The dipole antenna is formed from the antenna layer (3) integrated with the substrate (4). The total inlet thickness is realized from 0.1 mm. Also, the simple and inexpensive construction is clearly visible.

Figures 14a and 14b show an application for RF inlay (39) constructed in accordance with the invention of Figures 8 and 9. The spiral antenna is formed of the antenna layer (3) integrated with the substrate (4). Again, the simple and inexpensive bridging of the antenna loop and thus the simple design of the solution is well visible. The connection variants according to the invention described above are examples and, compared with the conventional connection solutions, have a significantly improved quality of connection and are much easier to manufacture, more cost-effective and usable in harsh and damp environments, such as in laundries.

LEGEND:

1 chip

1 a chip

1 b chip

1 c chip

2, 2 'connection surface

2a, 2a ¹ Anschlussfäche

2b pad / bump

2c connection area

2d connection surface

2d 'end face of the pad

2d "shell side of the connection surface

3, 3 'tracks

3a, 3a 'conductor tracks

3b trace

3, 3 'tracks

3b, 3b ¹ tracks

3b ", 3b" "printed conductors

3c trace

4 polymeric substrate

4a polymeric substrate

5 bonding agent, conductive glue

6 adhesive, electrically non-conductive

10; 10 'opening in the conductor track

10a, 10. ϊ Opening in the substrate

10b opening in the conductor track

10e opening in the conductor track

10f opening in the substrate

1 1 connecting means, solders

1 1 d Connection means (solder bumps)

13b Thickened part

15 protective cover

16 sealant, (underfill), electrically non-conductive

16a glue

16b plastic mass

16c adhesive with solder flux

18 slot

20 adhesive for die attach

21 Wirebonds for Wirebondverfahren

22 Distance between the tracks

23 cover sheets

26 laminate

27, 28 connecting means

31 antenna structure

35, 36 Smartcard

37 UHF chip module

38 UHF inlay

39 RF inlay

40 connection

C Distance between two tracks D Bending adhesive h2 Height of sealing compound above chip h1 Height of connecting surface / bumps x1 Opening size x2 Opening size x3 Opening dimension

Claims

1. Connection of a chips or chips provided with bumps (1) for the production of chip modules, tags, inlays for textile labels, chip cards or the like, with a laminate (26) of metallic interconnects (3, 3 ', 3a, 3a'; 3b, 3b ', 3b ", 3b ¹ ") and a substrate (4), in particular of polymeric plastics, and with connection means (5, 11, 11d, 21) for connecting the bumps (2) to the conductor tracks, wherein the Conductor tracks form antenna structures for transponders or have external electrical contacts for subsequent connection to antenna structures, characterized in that the laminate (26) with openings (10, 10 '; 10a, 10a';10b;10e; 10f) and / or Recesses is provided, in which the chip pads (2, 2 '; 2a, 2a';2b;2c; 2d) and / or the complete chip (1) are immersed with at least a portion of the height, and in which the electrical Connection of the chip over that in the correspondent Erenden opening lying connecting means (5, 11, 11d, 21) with the respective conductor track (3, 3 '; 3a, 3a '; 3b, 3b ', 3b ", 3b'"). 2. A compound according to claim 1, characterized in that the compound is also intended for use in harsh environment, such as high external pressure, high temperature and high humidity or use in the laundry is provided. 3. A compound according to claim 1 or 2, characterized in that the connection and conductor track structures in the metallic conductor foil after the complete connection process of the chip (1) on the unstructured conductor foil can be generated. 4. A compound according to claim 1, characterized in that the connection and conductor track structures in the metallic conductor foil before the connection process of the chip with the conductor track (1) by soldering, welding and / or casting with plastic can be generated. 5. A compound according to any one of claims 1 to 4, characterized in that the chip (1) and the connecting means (5.1, 11d) are mounted on the substrate side, that the opening in the substrate (4) before lamination with the conductor foil ( 3) is carried out continuously to the conductor track surface (3), such that the chip bump (2) is received therein and immersed with at least a portion of its height, wherein the thickness of the substrate (4) and the conductor track (3) is arbitrary , 6. A compound according to any one of claims 1 to 4, characterized in that the chip (1) and the connecting means (5, 11, 11d) are conductor track side installed, that the opening or depression (10) is designed in the conductor track, in such that the chip bump or the pads (2) is received with the at least a part of its height therein, wherein the thickness of the substrate (4) and the thickness of the conductor track (3) is arbitrary. 7. A compound according to any one of claims 1 to 4, characterized in that the chip (1) and the connecting means (5, 1 1, 1 1d, 21) are installed on the substrate side, that the opening (1 Of) in the substrate (4) before lamination with the conductor foil (3) is carried out continuously to the conductor surface (3), such that the entire base of the chip (1) with the pads with at least part of the chip height with the pads or bump (2) therein dips, wherein the thickness of the substrate (4) is at least the height of the pad or bump (2) to a maximum of 1 mm above the height of the chip with the bump (2) and the thickness of the conductor track (3) is arbitrary. 8. A compound according to any one of claims 1 to 7, characterized in that the connection of the pads or bumps (2) in the flip-chip method with the corresponding conductor track (3) via connecting means (5,11, 1 Id) can be generated, wherein the connecting means (5, 1 1, 1 1 d) are deposited on the conductor track (3) and / or on the connecting surfaces or bumps (2) and that at least one pitch of the conductor track (3) to the conductor track (3) between the connecting surfaces or Bump (2) of the chip (1) runs. 9. A compound according to claim 8, characterized in that the connecting means (5) are conductive, such as soft solders or electrically conductive adhesives or non-conductive adhesives. 10. A compound according to claim 8, characterized in that the connection surfaces (2d ') and bumps (2d,) of the chip (1b) before insertion into the openings (10, 10', 10a, 10a ', 10b, 10e ) with electrically conductive connection means (11d), such as solder bumps, which produce the electrical connections. 1 1. A compound according to any one of claims 1 to 6, characterized in that the connection of the pads or bumps (2) with the corresponding conductor track (3) via connecting means (21), which are designed as metallic, electrically conductive wires, wherein an intermetallic connection between connecting means, bumps (2) and the conductor tracks (3) is present, and wherein the connecting means (21) and the chip (1) in the corresponding sub stratseitigen opening (10f) are immersed Chip (1) with its the pads / Bump (2) opposite surface is adhesively connected to the tracks, the substrate thickness (4) equal to or greater than the height of the chip (1) with its connection feet (2) and connecting wires (21 ), and wherein the conductor tracks are made arbitrarily thick. 12. A compound according to any one of claims 1 to 1 1, characterized in that the opening (10, 10 ', 10b, 10e) in the substrate (4) or in the conductor track (3) by punching or other mechanical processes or chemically or electrolytically before the lamination of the antenna conductor (3) can be generated. 13. A compound according to any one of claims 1 to 12, characterized in that the opening (1Of) in the substrate after the connection with an electrically insulating plastic compound (6, 16; 16c) to a maximum of the height of the surface of the substrate (4) sealed solidifying is. 14. A compound according to one of the preceding claims 1 to 14, characterized in that the metallic conductor tracks (3, 3 ¹ , 3 a, 3 a ', 3 b, 3 b', 3 b ", 3 b '") on polymeric substrates (4, 4 a) are laminated from PA or PE, PET, PEN, PEI, PI or a fabric with epoxy adhesive and that the conductor tracks (3, 3 ', 3a, 3a', 3b, 3b ', 3b ", 3b ¹ ") from Copper exist. 15. A compound according to any one of claims 1 to 14, characterized in that the chip (1, 1a, 1 b, 1 c) is an RFID (Radio Frequency Identification) chip and or a resonant circuit. 16. A compound according to any one of claims 1 to 15, characterized in that the cohesively connected to the substrate (4, 4a) chip (1, 1a, 1 b), the bump surfaces (2, 2 ', 2a, 2a 2b) are connected to the corresponding conductor tracks via the electrically conductive connection means (11, 11d), additionally solidified by a protective cover (15), preferably made of a plastic film or of epoxy paint or of an adhesive, and covered in a moisture-proof manner. 17. A compound according to any one of claims 1 to 16, characterized by a high frequency (HF or UHF) Smartcard containing. 18. A compound according to any one of claims 1 to 17, characterized by a strap chip module containing. 19. A compound according to any one of claims 1 to 18, characterized by an ultra-high frequency inlay containing. 20. Machine or machinery for the production of a compound according to one of claims 1 to 19. 21. A method for producing a compound according to any one of claims 1 to 19, characterized in that the openings in the substrate (4) before, while the antenna structures after laminating the substrate (4) with the conductor track (3, 3 ', 3a, 3a 3b, 3b ', 3b ", 3b'").