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WO2009011337A1 - 樹脂組成物およびその用途 - Google Patents

樹脂組成物およびその用途 Download PDF

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Publication number
WO2009011337A1
WO2009011337A1 PCT/JP2008/062705 JP2008062705W WO2009011337A1 WO 2009011337 A1 WO2009011337 A1 WO 2009011337A1 JP 2008062705 W JP2008062705 W JP 2008062705W WO 2009011337 A1 WO2009011337 A1 WO 2009011337A1
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WIPO (PCT)
Prior art keywords
light
less
wavelength
resin composition
range
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PCT/JP2008/062705
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English (en)
French (fr)
Inventor
Mina Onishi
Hirofumi Inoue
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Priority to US12/669,407 priority Critical patent/US20100201802A1/en
Priority to CN2008800248103A priority patent/CN101743283B/zh
Priority to EP08791130A priority patent/EP2172524A4/en
Priority to KR1020107003445A priority patent/KR101148490B1/ko
Priority to JP2009523646A priority patent/JP5615545B2/ja
Publication of WO2009011337A1 publication Critical patent/WO2009011337A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
    • C08G18/348—Hydroxycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44—Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633—Compounds of group C08G18/42
    • C08G18/6659—Compounds of group C08G18/42 with compounds of group C08G18/34
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/69—Polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/758—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing two or more cycloaliphatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　本発明は、緑色または赤色の照明下、照明の強度やＣＣＤカメラの条件によらずＣＣＤカメラの白黒画像に実像を反映し得るよう視認性に優れた樹脂組成物を提供する。 　本発明の樹脂組成物は、着色顔料（Ａ）および硬化性樹脂（Ｂ）を含む樹脂組成物であって、該樹脂組成物の硬化物からなる膜が下記条件（I）、（II）、（III）、（IV）および（V）を満たす。（I）５００ｎｍから５５０ｎｍの範囲の波長における光の透過率の最大値が９０％以上を示すこと。（II）６００ｎｍから６５０ｎｍの範囲の波長における光の透過率の最小値が８０％未満を示すこと。（III）５００ｎｍから５５０ｎｍの範囲の波長における光の反射率の最大値が１２％未満を示すこと。（IV）６００ｎｍから６５０ｎｍの範囲の波長における光の反射率の最小値が７％未満を示すこと。（V）白色光を用いた場合の６０°光沢度が８０以上を示すこと。
PCT/JP2008/062705 2007-07-18 2008-07-14 樹脂組成物およびその用途 WO2009011337A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/669,407 US20100201802A1 (en) 2007-07-18 2008-07-14 Resin composition and use thereof
CN2008800248103A CN101743283B (zh) 2007-07-18 2008-07-14 树脂组合物及其用途
EP08791130A EP2172524A4 (en) 2007-07-18 2008-07-14 RESIN COMPOSITION AND ITS USE
KR1020107003445A KR101148490B1 (ko) 2007-07-18 2008-07-14 수지 조성물 및 그 용도
JP2009523646A JP5615545B2 (ja) 2007-07-18 2008-07-14 樹脂組成物およびその用途

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007186491 2007-07-18
JP2007-186491 2007-07-18

Publications (1)

Publication Number Publication Date
WO2009011337A1 true WO2009011337A1 (ja) 2009-01-22

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PCT/JP2008/062705 WO2009011337A1 (ja) 2007-07-18 2008-07-14 樹脂組成物およびその用途

Country Status (7)

Country Link
US (1) US20100201802A1 (ja)
EP (1) EP2172524A4 (ja)
JP (1) JP5615545B2 (ja)
KR (1) KR101148490B1 (ja)
CN (1) CN101743283B (ja)
TW (1) TWI454520B (ja)
WO (1) WO2009011337A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009280686A (ja) * 2008-05-21 2009-12-03 Hitachi Chem Co Ltd 熱硬化性樹脂組成物
EP2059102A3 (en) * 2007-11-06 2009-12-23 Nitto Denko Corporation Wired circuit board
JP2010251513A (ja) * 2009-04-15 2010-11-04 Nitto Denko Corp 配線回路基板の製造方法
JP2012063245A (ja) * 2010-09-16 2012-03-29 Nitto Denko Corp 検査装置、および、配線回路基板の製造方法
JP2013501850A (ja) * 2009-08-13 2013-01-17 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 艶消仕上げポリイミドフィルムおよびそれに関連する方法
JP2015090954A (ja) * 2013-11-07 2015-05-11 ナミックス株式会社 フレキシブルプリント配線板、およびその製造方法
JP2019006981A (ja) * 2017-06-26 2019-01-17 味の素株式会社 樹脂組成物層

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US8425785B2 (en) 2008-03-31 2013-04-23 Intel Corporation Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
US20110285840A1 (en) * 2010-05-20 2011-11-24 Applied Materials, Inc. Solder bonding and inspection method and apparatus
KR102431154B1 (ko) * 2015-02-09 2022-08-10 가부시키가이샤 아리사와 세이사쿠쇼 저유전 수지 조성물
EP3410429A4 (en) * 2016-01-26 2019-09-04 Yamaha Corporation WIND MUSIC INSTRUMENT REED AND METHOD FOR MANUFACTURING WIND MUSIC INSTRUMENT REED
CN107271229A (zh) * 2016-04-07 2017-10-20 北京有色金属研究总院 一种用粉末制备光片的优化方法

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JPH10163588A (ja) * 1996-12-03 1998-06-19 Sumitomo Kinzoku Erekutorodebaisu:Kk 回路基板
JP2000088543A (ja) * 1998-09-16 2000-03-31 Nec Corp 電子部品外観検査装置及び方法
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JP4799740B2 (ja) * 2001-01-17 2011-10-26 日東電工株式会社 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板
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JPH05299793A (ja) * 1992-04-17 1993-11-12 Sony Corp プリント配線板
JPH10163588A (ja) * 1996-12-03 1998-06-19 Sumitomo Kinzoku Erekutorodebaisu:Kk 回路基板
JP2000088543A (ja) * 1998-09-16 2000-03-31 Nec Corp 電子部品外観検査装置及び方法
JP2002194242A (ja) 2000-12-22 2002-07-10 Toyo Ink Mfg Co Ltd ハロゲン原子を含有しない緑色顔料組成物
JP2003206418A (ja) * 2002-01-15 2003-07-22 Toppan Printing Co Ltd 活性エネルギー線硬化ハードコート樹脂組成物およびハードコート層を含む積層体
JP2004070048A (ja) * 2002-08-07 2004-03-04 Toyo Ink Mfg Co Ltd カラーフィルタ用着色組成物およびカラーフィルタ
JP2004204174A (ja) * 2002-12-26 2004-07-22 Catalysts & Chem Ind Co Ltd 透明導電性被膜形成用塗布液および透明導電性被膜付基材、表示装置
JP2004307529A (ja) * 2003-04-02 2004-11-04 C I Kasei Co Ltd 黄色透明塗料、その製造方法、及びそれを用いたランプ
JP2005154453A (ja) * 2003-11-20 2005-06-16 Sumitomo Metal Mining Co Ltd 透明導電層形成用塗布液及び透明導電性基材
JP2005315767A (ja) 2004-04-30 2005-11-10 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテープ用絶縁フィルムの検査方法、検査装置、該フィルムの打ち抜き加工装置及び該加工装置の制御方法

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Title
See also references of EP2172524A4

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2059102A3 (en) * 2007-11-06 2009-12-23 Nitto Denko Corporation Wired circuit board
US8378226B2 (en) 2007-11-06 2013-02-19 Nitto Denko Corporation Wired circuit board
JP2009280686A (ja) * 2008-05-21 2009-12-03 Hitachi Chem Co Ltd 熱硬化性樹脂組成物
JP2010251513A (ja) * 2009-04-15 2010-11-04 Nitto Denko Corp 配線回路基板の製造方法
JP2013501850A (ja) * 2009-08-13 2013-01-17 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 艶消仕上げポリイミドフィルムおよびそれに関連する方法
JP2012063245A (ja) * 2010-09-16 2012-03-29 Nitto Denko Corp 検査装置、および、配線回路基板の製造方法
JP2015090954A (ja) * 2013-11-07 2015-05-11 ナミックス株式会社 フレキシブルプリント配線板、およびその製造方法
JP2019006981A (ja) * 2017-06-26 2019-01-17 味の素株式会社 樹脂組成物層
JP7210901B2 (ja) 2017-06-26 2023-01-24 味の素株式会社 樹脂組成物層

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KR101148490B1 (ko) 2012-05-25
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TW200922995A (en) 2009-06-01
EP2172524A4 (en) 2012-05-23
JPWO2009011337A1 (ja) 2010-09-24
EP2172524A1 (en) 2010-04-07
CN101743283A (zh) 2010-06-16
CN101743283B (zh) 2013-08-21
JP5615545B2 (ja) 2014-10-29
TWI454520B (zh) 2014-10-01

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