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WO2009011383A1 - 電子部品用接着剤 - Google Patents

電子部品用接着剤 Download PDF

Info

Publication number
WO2009011383A1
WO2009011383A1 PCT/JP2008/062906 JP2008062906W WO2009011383A1 WO 2009011383 A1 WO2009011383 A1 WO 2009011383A1 JP 2008062906 W JP2008062906 W JP 2008062906W WO 2009011383 A1 WO2009011383 A1 WO 2009011383A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
electronic component
fine particles
value
less
Prior art date
Application number
PCT/JP2008/062906
Other languages
English (en)
French (fr)
Inventor
Akinobu Hayakawa
Hideaki Ishizawa
Kohei Takeda
Ryohei Masui
Original Assignee
Sekisui Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co., Ltd. filed Critical Sekisui Chemical Co., Ltd.
Priority to US12/669,081 priority Critical patent/US7838577B2/en
Priority to JP2008534590A priority patent/JP4376957B2/ja
Priority to CN200880024920XA priority patent/CN101755328B/zh
Publication of WO2009011383A1 publication Critical patent/WO2009011383A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)

Abstract

　本発明は、塗布性に優れ、かつ、接合した電子部品に対する耐汚染性に優れ信頼性の高い電子部品を得ることができる電子部品用接着剤を提供することを目的とする。 　本発明は、硬化性化合物、硬化剤及び無機微粒子を含有する液状の電子部品用接着剤であって、含有する液状成分の溶解度パラメータ（ＳＰ値）が８以上１１未満であり、前記無機微粒子は、少なくとも、平均一次粒子径が５０ｎｍ以下、かつ、疎水化度（Ｍ値）が３０以上５０以下である無機微粒子（Ａ）と、平均一次粒子径が５０ｎｍ以下、かつ、疎水化度（Ｍ値）が６０以上である無機微粒子（Ｂ）との混合物である電子部品用接着剤である。
PCT/JP2008/062906 2007-07-19 2008-07-17 電子部品用接着剤 WO2009011383A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/669,081 US7838577B2 (en) 2007-07-19 2008-07-17 Adhesive for electronic component
JP2008534590A JP4376957B2 (ja) 2007-07-19 2008-07-17 電子部品用接着剤
CN200880024920XA CN101755328B (zh) 2007-07-19 2008-07-17 电子器件用胶粘剂

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-188623 2007-07-19
JP2007188623 2007-07-19

Publications (1)

Publication Number Publication Date
WO2009011383A1 true WO2009011383A1 (ja) 2009-01-22

Family

ID=40259715

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062906 WO2009011383A1 (ja) 2007-07-19 2008-07-17 電子部品用接着剤

Country Status (6)

Country Link
US (1) US7838577B2 (ja)
JP (1) JP4376957B2 (ja)
KR (1) KR100988184B1 (ja)
CN (1) CN101755328B (ja)
TW (1) TW200911946A (ja)
WO (1) WO2009011383A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010087444A1 (ja) * 2009-01-29 2010-08-05 積水化学工業株式会社 電子部品用接着剤
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
WO2016010067A1 (ja) * 2014-07-18 2016-01-21 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
JP2017041633A (ja) * 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
JP2017179154A (ja) * 2016-03-30 2017-10-05 株式会社日本触媒 ブロック共重合体及び樹脂組成物
WO2017170492A1 (ja) * 2016-03-30 2017-10-05 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
US11040024B2 (en) 2002-03-20 2021-06-22 Amgen Inc. Methods of using (+)-2-[1-(3-ethoxy-4-methoxyphenyl)-2-methylsulfonylethyl]-4-acetylaminoisoindoline-1,3-dione

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI435887B (zh) * 2008-02-26 2014-05-01 Toray Industries 環氧樹脂組成物、預浸透物及纖維強化複合材料
CA2793541C (en) 2010-04-16 2018-05-08 Valspar Sourcing, Inc. Coating compositions for packaging articles and methods of coating
ES2946409T3 (es) 2011-02-07 2023-07-18 Swimc Llc Composiciones de revestimiento para recipientes y otros artículos y métodos de revestimiento
DE112012004032A5 (de) * 2011-09-27 2014-07-24 Rupprecht Gabriel Elektrisch isolierendes Harz-Gehäuse für Halbleiterbauelemente oder Baugruppen und Herstellungsverfahren mit einem Mold-Prozess
EP2882819B8 (en) 2012-08-09 2018-12-19 Swimc Llc Compositions for containers and other articles and methods of using same
CN104540744B (zh) 2012-08-09 2017-08-25 威士伯采购公司 容器涂层体系
EP3131965B1 (en) 2014-04-14 2024-06-12 Swimc Llc Methods of preparing compositions for containers and other articles and methods of using same
KR20170093701A (ko) * 2014-12-04 2017-08-16 세키스이가가쿠 고교가부시키가이샤 경화성 조성물, 경화성 조성물의 제조 방법 및 반도체 장치
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
KR102268270B1 (ko) * 2018-01-23 2021-06-23 주식회사 엘지화학 접착제 조성물
KR102687874B1 (ko) 2018-12-17 2024-07-25 닛폰세이테츠 가부시키가이샤 스테이터용 접착 적층 코어, 그 제조 방법, 및 회전 전기 기기
EA202192059A1 (ru) 2018-12-17 2021-12-31 Ниппон Стил Корпорейшн Клеено-шихтованный сердечник для статора и электродвигатель
MY205652A (en) 2018-12-17 2024-11-02 Nippon Steel Corp Laminated core and electric motor
TWI753335B (zh) 2018-12-17 2022-01-21 日商日本製鐵股份有限公司 積層鐵芯、鐵芯塊、旋轉電機及鐵芯塊的製造方法
US11996231B2 (en) 2018-12-17 2024-05-28 Nippon Steel Corporation Laminated core and electric motor
EP3902120A4 (en) 2018-12-17 2022-10-05 Nippon Steel Corporation STACKED CORE AND ROTATING ELECTRICAL MACHINE
CA3131659C (en) 2018-12-17 2023-11-14 Nippon Steel Corporation Adhesively-laminated core for stator and electric motor
US11863017B2 (en) 2018-12-17 2024-01-02 Nippon Steel Corporation Laminated core and electric motor
CN113056859B (zh) 2018-12-17 2024-11-12 日本制铁株式会社 粘接层叠铁芯、其制造方法以及旋转电机
EP3902110A4 (en) 2018-12-17 2022-10-05 Nippon Steel Corporation Laminated core and rotary electric machine
JP7523356B2 (ja) 2018-12-17 2024-07-26 日本製鉄株式会社 ステータ用接着積層コア、その製造方法および回転電機
WO2020129928A1 (ja) 2018-12-17 2020-06-25 日本製鉄株式会社 積層コアおよび回転電機
JP7382962B2 (ja) * 2018-12-17 2023-11-17 日本製鉄株式会社 積層コア、積層コアの製造方法、および回転電機
KR102607589B1 (ko) 2018-12-17 2023-11-30 닛폰세이테츠 가부시키가이샤 적층 코어 및 회전 전기 기기
TWI725670B (zh) * 2018-12-17 2021-04-21 日商日本製鐵股份有限公司 積層鐵芯、其製造方法及旋轉電機
US11710990B2 (en) 2018-12-17 2023-07-25 Nippon Steel Corporation Laminated core with circumferentially spaced adhesion parts on teeth
BR112021006383A2 (pt) 2018-12-17 2021-07-06 Nippon Steel Corp núcleo laminado e motor elétrico

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
WO2008010555A1 (fr) * 2006-07-20 2008-01-24 Sekisui Chemical Co., Ltd. Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5827632A (en) * 1994-12-05 1998-10-27 Canon Kabushiki Kaisha Toner for developing electrostatic image containing hydrophobized inorganic fine powder
JP3521373B2 (ja) * 1996-03-29 2004-04-19 コニカミノルタホールディングス株式会社 フルカラー電子写真用トナーキット
EP0992549B1 (en) * 1998-04-21 2004-10-06 BASF NOF Coatings Co., Ltd., Antifouling agent, method for antifouling treatment, and article obtained through antifouling treatment
JP2000178342A (ja) 1998-12-17 2000-06-27 Sumitomo Bakelite Co Ltd 絶縁ペースト
CN101010364B (zh) * 2004-09-02 2011-07-27 株式会社日本触媒 吸水性材料、用于表面交联的吸水性树脂的生产方法以及用于吸水性材料的评价方法
JP2006181838A (ja) * 2004-12-27 2006-07-13 Fuji Photo Film Co Ltd 平版印刷版原版
KR101031973B1 (ko) * 2005-10-26 2011-04-29 캐논 가부시끼가이샤 토너

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
WO2008010555A1 (fr) * 2006-07-20 2008-01-24 Sekisui Chemical Co., Ltd. Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11260046B2 (en) 2002-03-20 2022-03-01 Amgen Inc. (+)-2-[1-(3-Ethoxy-4- methoxyphenyl)-2-methylsulfonylethyl]- 4-acetylaminoisoindoline-1,3-dione: methods of using and compositions thereof
US11040024B2 (en) 2002-03-20 2021-06-22 Amgen Inc. Methods of using (+)-2-[1-(3-ethoxy-4-methoxyphenyl)-2-methylsulfonylethyl]-4-acetylaminoisoindoline-1,3-dione
WO2010087444A1 (ja) * 2009-01-29 2010-08-05 積水化学工業株式会社 電子部品用接着剤
JP4729130B2 (ja) * 2009-01-29 2011-07-20 積水化学工業株式会社 電子部品用接着剤
CN102292407B (zh) * 2009-01-29 2014-01-01 积水化学工业株式会社 电子零件用胶粘剂
US8901207B2 (en) 2009-01-29 2014-12-02 Sekisui Chemical Co., Ltd. Adhesive for electronic components
TWI481685B (zh) * 2009-01-29 2015-04-21 Sekisui Chemical Co Ltd Adhesive for electronic parts
JP2012007007A (ja) * 2010-06-22 2012-01-12 Shin-Etsu Chemical Co Ltd ダイボンド剤組成物及び半導体装置。
TWI704649B (zh) * 2014-07-18 2020-09-11 日商積水化學工業股份有限公司 半導體元件保護用材料及半導體裝置
WO2016010067A1 (ja) * 2014-07-18 2016-01-21 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
JP2017041633A (ja) * 2015-08-17 2017-02-23 積水化学工業株式会社 半導体装置及び半導体素子保護用材料
WO2017170492A1 (ja) * 2016-03-30 2017-10-05 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP6232167B1 (ja) * 2016-03-30 2017-11-15 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP2018031019A (ja) * 2016-03-30 2018-03-01 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP2017179154A (ja) * 2016-03-30 2017-10-05 株式会社日本触媒 ブロック共重合体及び樹脂組成物
JP7028545B2 (ja) 2016-03-30 2022-03-02 株式会社日本触媒 ブロック共重合体及び樹脂組成物

Also Published As

Publication number Publication date
TWI321148B (ja) 2010-03-01
CN101755328B (zh) 2011-08-31
KR100988184B1 (ko) 2010-10-18
US7838577B2 (en) 2010-11-23
TW200911946A (en) 2009-03-16
US20100197830A1 (en) 2010-08-05
JPWO2009011383A1 (ja) 2010-09-24
KR20100018624A (ko) 2010-02-17
CN101755328A (zh) 2010-06-23
JP4376957B2 (ja) 2009-12-02

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