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WO2009002345A1 - Procédé de détermination d'un profil de hauteur d'une boucle de câble sur une machine de liaison par câble - Google Patents

Procédé de détermination d'un profil de hauteur d'une boucle de câble sur une machine de liaison par câble Download PDF

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Publication number
WO2009002345A1
WO2009002345A1 PCT/US2007/072378 US2007072378W WO2009002345A1 WO 2009002345 A1 WO2009002345 A1 WO 2009002345A1 US 2007072378 W US2007072378 W US 2007072378W WO 2009002345 A1 WO2009002345 A1 WO 2009002345A1
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WO
WIPO (PCT)
Prior art keywords
wire
wire loop
height
bonding tool
loop
Prior art date
Application number
PCT/US2007/072378
Other languages
English (en)
Inventor
Gary S. Gillotti
Wei Qin
Jon W. Brunner
John Foley
Original Assignee
Kulicke And Soffa Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke And Soffa Industries, Inc. filed Critical Kulicke And Soffa Industries, Inc.
Priority to PCT/US2007/072378 priority Critical patent/WO2009002345A1/fr
Publication of WO2009002345A1 publication Critical patent/WO2009002345A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/20—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring contours or curvatures, e.g. determining profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H01L2224/85207—Thermosonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Definitions

  • the present invention relates to the formation of wire loops, and more particularly, to improved methods of making height measurements of wire loops.
  • wire bonding continues to be the primary method of providing electrical interconnection between two locations within a package (e.g., between a die pad of a semiconductor die and a lead of a leadframe). More specifically, using a wire bonder (also known as a wire bonding machine) wire loops are formed between respective locations to be electrically interconnected.
  • a wire bonder also known as a wire bonding machine
  • An exemplary conventional wire bonding sequence includes: (1) forming a free air ball on an end of a wire extending from a bonding tool; (2) forming a first bond on a die pad of a semiconductor die using the free air ball; (3) extending a length of wire in a desired shape between the die pad and a lead of a leadframe; (4) stitch bonding the wire to the lead of the leadframe; and (5) severing the wire.
  • bonding energy may be used including, for example, ultrasonic energy, thermosonic energy, thermocompressive energy, amongst others.
  • a method of determining a height profile of a wire loop includes: (1) moving a bonding tool towards a portion of the wire loop; (2) detecting when a portion of a conductive wire engaged with the bonding tool contacts the portion of the wire loop; (3) determining the height of the portion of the wire loop based on the position of the bonding tool when the portion of the conductive wire contacts the portion of the wire loop; and (4) repeating steps (1), (2), and (3) for a plurality of portions of the wire loop such that a height profile of the wire loop is determined.
  • the methods of the present invention may also be embodied as an apparatus (e.g., as part of the intelligence of a wire bonding machine), or as computer program instructions on a computer readable carrier (e.g., a computer readable carrier used in connection with a wire bonding machine).
  • Fig. IA is a side sectional view of a wire loop and a bonding tool, the wire loop providing interconnection between two bonding locations of a semiconductor device, in accordance with an exemplary embodiment of the present invention
  • Fig. IB is a view of the bonding tool of Fig. IA in contact with a portion of the wire loop of Fig. IA in accordance with an exemplary embodiment of the present invention
  • Fig. 1C is a view of the bonding tool of Fig. IA in contact with another portion of the wire loop of Fig. IA in accordance with an exemplary embodiment of the present invention
  • Fig. ID is a view of the bonding tool of Fig. IA in contact with yet another portion of the wire loop of Fig. IA in accordance with an exemplary embodiment of the present invention
  • Fig. IE is a view of the bonding tool of Fig. IA in contact with yet another portion of the wire loop of Fig. IA in accordance with an exemplary embodiment of the present invention
  • Fig. 2 is a detailed view of a portion of the semiconductor device and a portion of the wire loop of Fig. IA in accordance with an exemplary embodiment of the present invention
  • Fig. 3A is a top view of a portion of a semiconductor die, a portion of a leadframe, and a wire loop providing interconnection between a die pad of the semiconductor die and a lead of the leadframe, in accordance with an exemplary embodiment of the present invention
  • Fig. 3B is a detailed view of the wire loop of Fig. 3A where the wire loop has been labeled with various contact points for making height measurements of the wire loop;
  • Fig. 4 is a flow diagram illustrating a method of determining a height profile of a wire loop in accordance with an exemplary embodiment of the present invention.
  • the methods may use existing detection circuitry (e.g., a BITS system, that is, a bond integrity test system) that is conventionally used to detect if first bonds and second bonds of a wire loop are properly attached to their respective bonding locations (e.g., bond pads, leads, contacts, traces, etc.).
  • a BITS system that is, a bond integrity test system
  • first bonds and second bonds of a wire loop are properly attached to their respective bonding locations (e.g., bond pads, leads, contacts, traces, etc.).
  • a free air ball is formed at the end of bonding tool (e.g., a capillary).
  • the bonding tool travels (e.g., with the wire clamp cycled open then closed) down toward the wire loop seating the free air ball at the tip of the bonding tool.
  • the bonding tool moves downward toward a location (e.g., a predetermined or programmed location) along the wire loop.
  • the location may be determined by (1) manually targeting a location along the wire loop, or (2) automatically calculating a location along the wire loop.
  • a detection circuit is activated (or already has been activated) to detect contact between the ball seated in the bonding tool and the wire loop.
  • the detection circuit can detect a predetermined amount
  • the detection circuit may be particularly desirable when the detection circuit is a DC (i.e., direct current) based system.
  • the detection circuit can detect a predetermined change in capacitance that would occur when there is contact between the free air ball seated in the bonding tool and the wire loop.
  • Such a detection circuit may be particularly desirable when the detection circuit is an AC (i.e., alternating current) based system.
  • the detection circuit/system may be configured to be very sensitive to the electrical changed detected (e.g., a small amount of current flow, a small change in capacitance, etc), and as such, the wire loop will tend to be undeformed by the gentle contact of the free air ball.
  • the height at the the selected portion of the wire loop is determined (e.g., is reported and stored in memory of the wire bonding machine).
  • the height of the wire loop at the selected portion can be determined using the z-encoder which is a conventional component of a wire bonding system for determining a z-height of the bonding tool (i.e., the height along the z-axis or vertical axis of the wire bonding operation).
  • a height profile of the wire loop (or a portion of the wire loop) the operation described above is repeated at different locations along the wire loop.
  • a height profile of the wire loop may be provided.
  • real-time feedback regarding the height profile of a wire loop may be provided to the wire bonding machine (and/or an operator of the wire bonding machine).
  • This height profile serves many uses. For example, this height profile may be used to optimize looping parameters to achieve a desired height profile.
  • looping parameters may be adjusted based on the measured height profile as part of an iterative process in order to achieve the desired loop height profile.
  • Such adjustments to looping parameters may be made in any of a number of ways. For example, such adjustments may be made manually (e.g., by an operator of a wire bonding machine) in connection with an iterative process to obtain a desired height profile. Alternatievly, such adjustments may be made automatically in connection with a closed loop iterative process (e.g., the algorithm controlling the iterative process may adjust one or more looping parameters by a predetermined increment based on the height measurement at one or more locations along the height profile).
  • this height profile may be used to adjust portability between different wire bonding machines. That is, the same parameters may not achieve the same loop height profile in different wire bonding machines, and as such, the present invention may be used to determine the height profile on different wire bonding machines, and also may be used to achieve the substantially the same loop height profile on different wire bonding machines by adjusting parameters as part of the aforementioned iterative process.
  • present invention may be particularly useful in connection with complex loops/packages such as stacked and multi-tiered die packages.
  • the present invention may be used to provide a three-dimensional analysis of wire loop shapes (in contrast to conventional two dimensional analyses).
  • Wire loop 104 provides electrical interconnection between a first bonding location (i.e., bond pad 102b of semiconductor die 102) and a second bonding location (i.e., lead 100a of leadframe 100, where leadframe 100 supports semiconductor die 102).
  • Wire loop 104 includes first bond 104a (e.g., ball bond 104a), wire span 104b, and second bond 104c (e.g., stitch bond 104c).
  • First bond 104a is bonded to bond pad 102b of semiconductor die 102 (adjacent die pad 102a is also shown in Fig. IA).
  • Second bond 104c is bonded to lead 100a of leadframe 100.
  • conductive wire 110 is engaged in bonding tool 108 to form wire bonds and the like.
  • Wire clamp 112 is operated between closed and open positions in conjunction with a wire bonding operation.
  • Free air ball 110a is formed on the end of conductive wire 110 (e.g., using a electronic flame-off wand or the like) and has been seated at the tip portion of bonding tool 108.
  • Conductive path 114 (in the illustrated embodiment wire clamp 112 may be considered part of the conductive path) provides an electrical connection between conductive wire 110 and detection system 106.
  • exemplary system components are provided in connection with certain exemplary embodiments of the present invention just prior to approaching the wire loop (e.g., wire loop 104) with a portion of a conductive wire (e.g., free air ball 110 of conductive wire 110) engaged in a bonding tool (e.g., bonding tool 108).
  • bonding tool 108 In order to determine the height profile of wire loop 104, bonding tool 108 repeatedly approaches (and contacts with free air ball 110a) different portions of wire loop 104 as shown in Figs. IB-IE.
  • Fig. IB illustrates bonding tool 108 having been lowered towards a portion of wire loop 104 until free air ball 110a is in contact with the portion of wire loop 104.
  • Detection system 106 detects the contact between free air ball 110a and the portion of wire loop 104.
  • a height position of the portion of the wire loop contacted by free air ball 110a is then determined using the position of bonding tool 108 (that is, the position of bonding tool 108 during the contact between free air ball 110a and the portion of wire loop 104).
  • wire bonding machines often include encoder systems, vision systems, and the like for monitoring the position of the bonding tool.
  • Figs. IB-IE illustrate bonding tool 108 having been repeatedly raised and lowered such that free air ball 110a has contacted a number of portions of wire loop 104. More specifically, Fig. IB illustrates free air ball 110a in contact with a portion of wire loop 104 adjacent first bond 104a; Fig. 1C illustrates free air ball 110a in contact with a portion of wire loop 104 close to the end of the straight (e.g., horizontal) length of wire just before the downward kink; Fig. ID illustrates free air ball 110a in contact with a portion of wire loop 104 just after the kink; and Fig.
  • IE illustrates free air ball 110a in contact with a portion of wire loop 104 farther down the sloped length extending toward second bond 104c.
  • these illustrated points of contact are exemplary in nature. Different (and additional) points of contact with the wire loop may be selected as is desired to provide a height profile of a wire loop.
  • the actual determination of the loop height at each of the selected portions of the wire loop may be accomplished in any of a number of ways depending upon, for example, the wire bonding machine provided, the desired algorithm, etc.
  • One approach to this determination is to establish a reference height such that the height of the portion of the wire loop can be determined by comparing (a) the position of the bonding tool when the portion of the conductive wire contacts the portion of the wire loop to (b) the reference height.
  • Fig. 2 is a detailed view of a portion of the components shown in Fig. IA useful for explaining an exemplary approach to determining the height of a selected portion of a wire loop. As in Fig.
  • FIG. 2 illustrates bond pads 102a and 102b of semiconductor die 102, where semiconductor die 102 is supported by leadframe 100. Also illustrated in Fig. 2 are two "phantom" bonding tools 108 with corresponding free air balls 110a.
  • the left hand free air ball 110a is shown in contact with die pad 102a of semiconductor die 102.
  • a reference height is established at 0.5 (0.5 and the other measurements are unitless numbers provided for explanatory purposes only).
  • the right hand free air ball 110a is shown in contact with a portion of wire loop 104.
  • a measured height of the contacted portion of wire loop 104 is determined to be 4.3.
  • the actual height of the selected portion of wire loop 104 is 3.8 (that is, the measured height of 4.3 minus the reference height of 0.5 is 3.8).
  • the reference height is selected to be the height of a bond pad (i.e., bond pad 102a) of a semiconductor device (e.g., semiconductor die 102) to which the wire loop has been bonded.
  • a bond pad i.e., bond pad 102a
  • other reference heights may be selected including, but not limited to, (a) a height corresponding to the first bond of the wire loop, (b) a height corresponding to the second bond of the wire loop, (c) a height corresponding to the leadframe surface or (d) a height corresponding to a surface of the semiconductor die.
  • free air ball 110a is used to contact both (a) the reference height (i.e., bond pad 102a) and (b) wire loop 104.
  • the height of free air ball 110a is not taken into account to determine the actual height because the free air ball is present at both contacts (i.e., the contact at bond pad 102a and the contact of the wire loop); however, in certain embodiments of the present invention, the height of free air ball 110a may be considered in the determination of the actual height of the wire loop.
  • the height of the free air ball may be relevant when using the position of bonding tool 108 (with free air ball 110a engaged therewith) to determine the relative height of wire loop 104 (e.g., the height of free air ball 110a, or a partial/deformed height of free air ball 110a, may be substracted from the calculated wire loop height).
  • Fig. 3A is a top view of a portion of semiconductor die 302, a portion of leadframe 300, and wire loop 304 providing interconnection between die pad 302b of semiconductor die 302 and lead 300a of leadframe 300. More specifically, first bond 304a of wire loop 304 is ball bonded to die pad 302b, and second bond 304c of wire loop 304 is stitch bonded to lead 300a. Wire span 304b extends between first bond 304a and second bond 304c. Adjacent die pad 302a (which may be used as a reference point as described above with respect to die pad 102a in Figs. 1A-1E) is also shown.
  • Fig. 3B is a detailed view of wire loop 304.
  • wire loop 304 is broken into segments using points "A" through "R.”
  • points "A" through "R” there are various ways of determining a height profile of a wire loop.
  • a plurality of points along the wire loop i.e., portions of the wire loop
  • the plurality of points may be selected (e.g., in accordance with an algorithm or the like) at predetermined length increments along the wire loop.
  • points "A" through “R” are at predetermined length increments along wire loop 304.
  • a portion of a wire engaged in a bonding tool e.g., a free air ball seated at the tip of a bonding tool
  • wire loop 304 is brought into contact with wire loop 304 at each of points "A" through “R.”
  • a height profile of wire loop 304 is provided.
  • wire loops are formed in three dimensions, and often have bends and slopes in different planes. In Fig. 3B, a bend in a substantially horizontal plane (i.e., a plane parallel with the sheet of paper of Fig.
  • wire edge detection system may be used to detect the two outside edges of the wire loop.
  • the bonding tool may desirably target the approximate center of the wire loop at the desired location. For example, referring again to Fig.
  • edges "Al” and “A2” have been detected (e.g., using a vision system or the like in connection with an edge detect algorithm) at point "A.”
  • an approximate center of wire loop 304 at point A may be determined such that the bonding tool (with the free air ball seated at the tip) can approach the appropriate portion of wire loop 304 at point "A.”
  • the bonding tool (with a portion of a wire such as a free air ball engaged therewith) may be lowered to contact point A of wire loop 304 multiple times, where each time the bonding tool is moved laterally a very small amount. Through these repeated contacts, a determination of the approximate highest point at point A is enabled.
  • a wire used to form a wire loop typically has a round or circular cross section, where the portion of the wire exposed to contact by the bonding tool may be viewed as an "arc" of a circle.
  • the bonding tool e.g., with a free air ball engaged therewith
  • point A i.e., the midpoint between endpoints Al and A2.
  • any of a number of alternative methods may be utilized to find the desired point along the wire length for use in providing a height profile.
  • the locations may be manually targeted (e.g., by the operator) using the live video provided on the wire bonding machine. After selecting the desired points along the length of the wire span using the live video, the actual height measurements (using the bonding tool descending toward the selected points) may be conducted.
  • Yet another example relates to a relatively "straight" wire loop, where the wire loops are relatively straight lines in the X-Y plane extending between a first bonding location and a second bonding location. Knowing the positions of the first bonding location and the second bonding location, the present invention may utilize and algorithm or the like which specifies increments along the straight length at which to perform the height detection technique.
  • Fig. 4 is a flow diagram in accordance with certain exemplary embodiments of the present invention. As is understood by those skilled in the art, certain steps included in the flow diagram may be omitted; certain additional steps may be added; and the order of the steps may be altered from the order illustrated.
  • Fig. 4 is a flow diagram illustrating a method of determining a height profile of a wire loop in accordance with an exemplary embodiment of the present invention.
  • a bonding tool is moved towards a portion of the wire loop.
  • it is detected when a portion of a conductive wire engaged with the bonding tool (e.g., a free air ball seated at the tip of the bonding tool) contacts the portion of the wire loop.
  • a determination is made as to the height of the portion of the wire loop based on the position of the bonding tool when the portion of the conductive wire contacts the portion of the wire loop.
  • steps 400, 402, and 404 are repeated for a plurality of portions of the wire loop such that a height profile of the wire loop is determined.
  • the portions of the wire loop included in the height profile could be any as desired in the particular application.
  • Figs. IB-IE illustrate free air ball 110a contacting exemplary portions of wire loop 104 in order to provide an exemplary height profile.
  • the method illustrated in Fig. 4 may include additional or different steps.
  • the method may include a step of establishing a reference height such that the height of the portion of the wire loop can be determined at step 404 by comparing (a) the position of the bonding tool when the portion of the conductive wire contacts the portion of the wire loop to (b) the reference height.
  • the reference height may be established to be (a) a height of a bond pad of a semiconductor device to which the wire loop has been bonded; (b) a height corresponding to the first bond of the wire loop (e.g., a height at first bond after contact between a free air ball and the contact, a height at first bond prior to ultrasonic energy being applied, a height at first bond after ultrasonic energy is applied, etc.); (c) a height corresponding to the second bond of the wire loop (e.g., a height at second bond after contact between the end of the wire loop and the contact, a height at second bond prior to ultrasonic energy being applied, a height at second bond after ultraonic energy is applied, etc.); (d) a height corresponding to a surface of a substrate (e.g., a leadframe) to which a portion of the wire loop is bonded; or (e) a height corresponding to a surface of a semiconductor die to which a portion of the wire loop is bonded, amongst
  • the steps of the method of Fig. 4 may be repeated as part of an iterative process wherein a new wire loop is created in connection with each iteration.
  • the iterative process may be repeated until the height profile of the wire loop is within a predetermined height range (e.g., that the height profile meets predetermined height criteria).
  • such an iterative process may include changing one or more parameters of the wire bonding operation used to form the wire loop in connection with each iteration.
  • Step 402 described above may be accomplished using a variety of techniques.
  • step 402 may include detecting when a conductive path is established between (a) the portion of the wire loop, and (b) the portion of the conductive wire.
  • a conductive path may be established by detecting at least one of (a) a predetermined current flow in the conductive path, (b) a predetermined change in capacitance between the conductive path and a ground connection of a wire bonding machine used to form the wire loop, and (c) a predetermined phase shift of current flowing in the conductive path.
  • the conductive path may be established between (a) a detection system for detecting when the portion of the conductive wire engaged with the bonding tool contacts the portion of the wire loop, and (b) the wire loop.
  • the conductive path may include components of a wire bonding system such as, for example, at least one of (a) a wire clamp for clamping the conductive wire engaged with the bonding tool (e.g., wire clamp 112 shown in Figs.
  • a wire spool for supplying wire to the bonding tool (not shown)
  • a diverter element for assisting in the positioning of the conductive wire between the wire spool and the bonding tool (not shown)
  • an air guide system for assisting in the positioning of the conductive wire between the wire spool and the bonding tool (not shown), amongst others.
  • steps 400, 402, and 404 are repeated for a plurality of portions of the wire loop at step 406 of Fig. 4 in order to determine a height profile of the wire loop.
  • the plurality of portions of the wire loop may be spaced at predetermined increments between a first bonding point of the wire loop and a second bonding point of the wire loop (e.g., see Fig. 3B).
  • the present invention has been described primarily with respect to determining a height profile of a conductive wire loop, it is not limited thereto.
  • the techniques disclosed herein may be used to provide a height profile of a wire loop formed of a non-conductive wire (e.g., a conductive wire covered/coated with a non-conductive material).
  • detection of a capacitance change upon contact between (1) a free air ball engaged with a bonding tool and (2) the wire loop may be used to detect the contact therebetween, amongst other techniques.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

La présente invention concerne un procédé de détermination d'un profil de hauteur d'une boucle de câble. Le procédé comprend les étapes consistant à : (1) déplacer un outil de liaison en direction d'une partie de la boucle de câble ; (2) détecter le moment où une partie d'un câble conducteur coopérant avec l'outil de liaison entre en contact avec la partie de la boucle de câble ; (3) déterminer la hauteur de la partie de la boucle de câble sur la base de la position de l'outil de liaison au moment où la partie du câble conducteur entre en contact avec la partie de la boucle de câble ; et (4) répéter les étapes (1), (2) et (3) pour une pluralité de parties de la boucle de câble de façon à déterminer un profil de hauteur d'au moins une partie de la boucle de câble.
PCT/US2007/072378 2007-06-28 2007-06-28 Procédé de détermination d'un profil de hauteur d'une boucle de câble sur une machine de liaison par câble WO2009002345A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2007/072378 WO2009002345A1 (fr) 2007-06-28 2007-06-28 Procédé de détermination d'un profil de hauteur d'une boucle de câble sur une machine de liaison par câble

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2007/072378 WO2009002345A1 (fr) 2007-06-28 2007-06-28 Procédé de détermination d'un profil de hauteur d'une boucle de câble sur une machine de liaison par câble

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WO2009002345A1 true WO2009002345A1 (fr) 2008-12-31

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Cited By (8)

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Publication number Priority date Publication date Assignee Title
US20130125390A1 (en) * 2010-08-10 2013-05-23 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
KR20200127866A (ko) * 2019-05-02 2020-11-11 에이에스엠 테크놀러지 싱가포르 피티이 엘티디 와이어 상호 접속부의 높이를 측정하는 방법
CN112325827A (zh) * 2020-10-20 2021-02-05 广州好未来科技研究有限公司 一种零件智能制造中的自动检测装置
US11581285B2 (en) 2019-06-04 2023-02-14 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
WO2023200565A1 (fr) * 2022-04-14 2023-10-19 Kulicke And Soffa Industries, Inc. Procédés de détermination d'une hauteur, et d'un profil de hauteur, d'une boucle de fil sur une machine de liaison de fil
US20240014169A1 (en) * 2022-07-11 2024-01-11 Kulicke And Soffa Industries, Inc. Methods of testing bonded wires on wire bonding machines
US12113043B2 (en) 2021-11-16 2024-10-08 Kulicke And Soffa Industries, Inc. Methods of calibrating an ultrasonic characteristic on a wire bonding system
US12255109B2 (en) 2018-06-29 2025-03-18 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine

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US20060054665A1 (en) * 2004-09-08 2006-03-16 Kulicke And Soffa Industries Inc. Methods for forming conductive bumps and wire loops
JP2006080139A (ja) * 2004-09-07 2006-03-23 Shinko Electric Ind Co Ltd ワイヤボンディング装置

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JPH01152740A (ja) * 1987-12-10 1989-06-15 Toshiba Corp ワイヤボンディング検査方法
JP2006080139A (ja) * 2004-09-07 2006-03-23 Shinko Electric Ind Co Ltd ワイヤボンディング装置
US20060054665A1 (en) * 2004-09-08 2006-03-16 Kulicke And Soffa Industries Inc. Methods for forming conductive bumps and wire loops

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130125390A1 (en) * 2010-08-10 2013-05-23 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
US9455544B2 (en) * 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
US12255109B2 (en) 2018-06-29 2025-03-18 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
KR20200127866A (ko) * 2019-05-02 2020-11-11 에이에스엠 테크놀러지 싱가포르 피티이 엘티디 와이어 상호 접속부의 높이를 측정하는 방법
KR102462567B1 (ko) * 2019-05-02 2022-11-04 에이에스엠피티 싱가포르 피티이. 엘티디. 와이어 상호 접속부의 높이를 측정하는 방법
US11543362B2 (en) 2019-05-02 2023-01-03 Asmpt Singapore Pte. Ltd. Method for measuring the heights of wire interconnections
US11581285B2 (en) 2019-06-04 2023-02-14 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
US12255172B2 (en) 2019-06-04 2025-03-18 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
CN112325827A (zh) * 2020-10-20 2021-02-05 广州好未来科技研究有限公司 一种零件智能制造中的自动检测装置
US12113043B2 (en) 2021-11-16 2024-10-08 Kulicke And Soffa Industries, Inc. Methods of calibrating an ultrasonic characteristic on a wire bonding system
WO2023200565A1 (fr) * 2022-04-14 2023-10-19 Kulicke And Soffa Industries, Inc. Procédés de détermination d'une hauteur, et d'un profil de hauteur, d'une boucle de fil sur une machine de liaison de fil
US20240014169A1 (en) * 2022-07-11 2024-01-11 Kulicke And Soffa Industries, Inc. Methods of testing bonded wires on wire bonding machines

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