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WO2009097987A1 - Procédé de découpe au laser d'une pièce non métallique - Google Patents

Procédé de découpe au laser d'une pièce non métallique Download PDF

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Publication number
WO2009097987A1
WO2009097987A1 PCT/EP2009/000489 EP2009000489W WO2009097987A1 WO 2009097987 A1 WO2009097987 A1 WO 2009097987A1 EP 2009000489 W EP2009000489 W EP 2009000489W WO 2009097987 A1 WO2009097987 A1 WO 2009097987A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
laser light
generated
heat input
cutting line
Prior art date
Application number
PCT/EP2009/000489
Other languages
German (de)
English (en)
Inventor
Vitalij Lissotschenko
Original Assignee
Limo Patentverwaltung Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Limo Patentverwaltung Gmbh & Co. Kg filed Critical Limo Patentverwaltung Gmbh & Co. Kg
Publication of WO2009097987A1 publication Critical patent/WO2009097987A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a method of laser cutting a non-metallic workpiece along at least one cutting line for producing at least two workpiece parts.
  • the surface area of the workpiece which is acted upon by the writing beam with laser light is then quenched by application of a gas and / or fluid, so that the microcracks can propagate further along the desired cutting line.
  • a gas and / or fluid With the help of two other laser beams, which hit the surface after quenching, tensile forces are induced to split the workpiece into two parts along the desired cutting line.
  • the intermediate cooling after the previous heating of the workpiece with the writing beam can also lead to unwanted material chipping in the area of the cut surfaces.
  • European Patent Application EP 1 803 538 A1 discloses a method of cutting a workpiece from a brittle material, such as glass, with laser beams.
  • a brittle material such as glass
  • two areas on the surface of the workpiece are irradiated with laser light. Between these two areas there is an area with a certain width, the in turn is not acted upon with laser light, wherein the cutting line itself is not acted upon by the laser light.
  • a cooling device is provided which can generate a cooling spot in the region of the cutting line. In the areas acted upon by the laser beams, a compressive stress is first generated. By the subsequent cooling, a tensile stress is generated in the vicinity of the cooling spot, so that the workpiece can be divided into two parts along the desired cutting line. Even with such a method, the problem may arise that it can come in the area of the cut surfaces to unwanted material chipping.
  • the present invention has for its object to provide a method for laser cutting a non-metallic workpiece, which is easy to handle and in which the problem of material eruptions in the region of the cutting surfaces of the workpiece can be effectively prevented.
  • An inventive method for laser cutting a non-metallic workpiece along at least one cutting line for generating at least two workpiece parts is characterized according to claim 1 characterized in that the workpiece is exposed to laser light in ai adjacent to the cutting line to be generated region of the workpiece, a three-dimensional heat input zone with a lateral width E locally heated such that thermally induced tensile stresses are generated in two opposite side surfaces of the workpiece, which are so large that they generate a crack, which propagates along the cutting line, so that the workpiece is divided into at least two workpiece parts, each having a cut surface.
  • An advantage of the solution according to the invention is that only at the opposite side surfaces very high tensile stresses are generated, which induce cracking and a workpiece inwardly directed crack propagation.
  • cut line is to be understood to mean straight as well as at least partially curved cut line courses.
  • the cut line courses may be curved one or more times, but linear cut line courses can be generated particularly easily and are therefore
  • different laser light sources in particular semiconductor laser diode bars, and suitable ones can be used
  • Non-metallic workpieces which can be cut into at least two parts by means of the method according to the invention may consist, for example, of silicon, glass or ceramic.
  • the workpiece is acted upon by the laser light over its entire length L at the same time. It may be provided in a particularly preferred embodiment that thermally induced elevations are generated at the two opposite side surfaces of the workpiece, which extend away from the side surfaces. These bumps may be generated due to uneven heating of the workpiece in these areas of the heat input zone. The local heat input of the laser light into the heat input zone, there due to thermal expansions to heat-induced changes in the material structure, leading to the formation of the surveys. The tensile stress-induced cracking and crack propagation thus takes place from the outside - that is, starting from the elevations of the two side surfaces - inwardly towards the center of the workpiece.
  • thermally induced tensile stresses are generated in the region of the elevations, which are higher than the elastic limit of the workpiece.
  • thermally induced tensile stresses can be generated in the region of the elevations, which are higher than the breaking stress of the workpiece. This can effectively improve cracking and crack propagation in these areas.
  • the maximum tensile stresses ⁇ x in the region of the elevations may advantageously be on the order of about 300 to about 400 N / mm 2 .
  • the heat input zone of the workpiece acted upon by the laser light have a total lateral width E of between approximately 0.25 mm and approximately 0.35 mm.
  • the heat input zone may have a total lateral width of about 0.3 mm. This ensures that the heat input over the entire length of the workpiece only takes place in a comparatively narrow, spatially limited area.
  • the thermal energy introduced by the laser light into the heat input zone is at least as great as the energy required to form the cut surfaces of the workpiece parts. It can thereby be achieved that a macrocrack once created in the region of the side surfaces can spread almost instantaneously along the desired cutting line over the entire length L from the outside inwards to the middle of the workpiece.
  • the energy introduced by the laser light into the heat input zone must therefore be at least twice the energy required to produce a cut surface
  • the total introduced into the heat input zone heat energy can also be slightly larger than the necessary energy to form the cut surfaces of the workpiece parts.
  • the wavelength ⁇ of the laser light is ⁇ 1 ⁇ m. It has been shown that at these wavelengths the cracking in the workpiece is not adversely affected.
  • the heat input zone is generated by the laser light of a single laser light source.
  • the heat input zone it is also possible for the heat input zone to be generated by the laser light from at least two laser light sources arranged at a distance from one another.
  • the beam shapes and beam parameters are chosen so that, depending on the material, an optimized entry of the Laser light in the heat input zone of the workpiece to effect.
  • the laser beams emitted from the laser light sources have substantially identical beam profiles.
  • the workpiece is heated with laser beams which generate substantially linear intensity distributions on the surface. It has also been found that the intensity profiles of the laser light, which may for example be substantially rectangular, triangular or even substantially Gaussian, do not adversely affect the cracking and crack propagation along the desired cutting line of the workpiece.
  • a particularly advantageous embodiment provides that the laser cutting of the workpiece takes place without coolant.
  • the workpiece is mechanically pre-cut along the cutting line before the workpiece is exposed to the laser light.
  • a mechanical cutting device can be guided over the surface of the workpiece in order to cut it at least in sections along the desired cutting line.
  • the desired cutting line course can be scratched in particular mechanically into the surface of the workpiece.
  • several cutting lines can be produced in the workpiece in order to cut out more than two parts from a workpiece.
  • Fig. 2 shows the course of the tension in the y-direction within the workpiece relative to the distance from the origin of the coordinate system.
  • a non-metallic, in this embodiment, substantially cuboid workpiece 1 is shown prior to the laser cutting process.
  • a Cartesian coordinate system whose origin lies exactly in the center of the workpiece 1, is shown here as well as in FIG.
  • the workpiece 1 consists of a non-metallic material, in particular of silicon, glass or ceramic, and has a width B in the x-direction, a length L in the y-direction and a thickness D in the z-direction.
  • the thickness D of the workpiece 1 is substantially smaller than its length L and its width B, so that it is formed overall substantially plate-shaped.
  • Coordinate system originates a first side surface 12 and at a distance -L / 2 from the coordinate system origin a second side surface 13.
  • laser light 2 generated by at least one laser light source is directed onto the first surface 10 of the workpiece 1 to cut the workpiece 1 along a desired cut line SL shown here in phantom under the influence of thermally induced tensile stresses ,
  • cut line is to be understood to mean straight as well as at least partially curved cut line courses.
  • the cut line courses may be curved one or more times, a substantially linear course of the cut line SL, as illustrated here , however, can be produced particularly easily and is therefore particularly advantageous.
  • the surface 10 is not completely, but only partially exposed to the laser light 2.
  • the workpiece 1 is doing in the longitudinal direction (y direction) over its entire length L simultaneously with the laser light 2, on the surface 10 of the workpiece 1 a certain preset or presettable width, applied. Due to the absorption of the laser light 2, the workpiece 1 is locally heated, so that over the entire length L a three-dimensional heat input zone 100 is produced which has a lateral width E and a thickness D.
  • the thickness of the heat input zone 100 in the z direction thus corresponds to the thickness D of the workpiece 1. It is clear that the length L of the heat input zone 100 is substantially greater than the width E thereof.
  • the applied with the laser light 2 heat input zone 100 of the workpiece 1 has a lateral width E between about 0.25 mm and about 0.35 mm.
  • the total lateral width E of the heat input zone 100 applied to the laser light 2 can be about 0.3 mm. This ensures that the heat input takes place only in a comparatively narrow region of the workpiece 1.
  • the laser light 2 can be generated by a single laser light source not explicitly illustrated in FIG. 1 b.
  • the laser light 2 can also be generated by two separate, spaced-apart laser light sources, each of which generates a substantially line-shaped laser beam.
  • various types of laser light sources in particular semiconductor laser diode bars, and suitable beam shaping devices can be used to generate the desired beam shape in the region of the heat input zone 100 on the first surface 10 of the workpiece 1, so that the Workpiece 1 can be cut along the desired cutting line SL and then divided into two parts 1 a, 1 b.
  • at least one highly efficient, low-aberration-generating, refractive micro-optics adapted to the laser light source or to the laser light sources can produce homogeneous line profiles with very high intensity and high beam quality on the surface 10 of the workpiece.
  • the wavelength of the laser light 2 used in the laser cutting method presented here is preferably ⁇ ⁇ 1 ⁇ m. It has been shown that at these wavelengths the cracking in the workpiece 1 is not adversely affected. It has also been shown that the intensity distribution of the laser light 2, which may for example be substantially rectangular, triangular or even substantially Gaussian, also does not adversely affect the cracking and crack propagation along the desired cutting line SL of the workpiece 1.
  • each of the two workpiece parts 1 a, 1 b obtained by the laser cutting process presented here has a cut surface 16 a, 16 b.
  • the laser light 2 impinging on the first surface 10 of the workpiece 1 must have a sufficient width so that the energy stored in the heat input zone 100 of the workpiece 1, which is consumed in the crack propagation in the workpiece 1 along the desired cutting line SL, the losses of the System absorbed energy that is consumed for the formation of new free surfaces (cut surfaces 16a, 16b) always exceeds. Then, a macro-crack once formed in the area of the side surfaces 1 1, 12 develops almost instantaneously along the desired cutting line SL over the entire length L from outside to inside, so that the workpiece 1 is divided into two parts 1 a, 1 b.
  • the maximum achievable tensile stresses ⁇ x which can be generated in the region of the elevations 101, 102, amount to about 400 N / mm 2 , which corresponds to a temperature of about 1073 K.
  • the thickness D of the workpiece 1 divided into two workpiece parts 1 a, 1 b may be about 0.05 to 0.3 mm.
  • the range of the maximum allowable thickness D of the workpiece 1 may be extended to about 0.5 mm.
  • a workpiece 1 can be easily divided into (at least) two workpiece parts 1 a, 1 b.
  • One advantage of the solution presented here is that material chippings in the region of the cut surfaces 16a, 16b, which can arise in the methods known from the prior art due to the high heat input and the subsequent cooling in the region of the cutting zone, can be effectively avoided.
  • the workpiece 1 along the desired cutting line SL mechanically pre-cut (in particular scribed) before the workpiece 1 is acted upon by the laser light 2 to the workpiece 1 along the section line SL finally in the two workpiece parts 1 a, 1 b to share.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

L'invention concerne un procédé de découpe au laser d'une pièce non métallique (1), le long d'au moins une ligne de coupe (SL), pour la production d'au moins deux parties de pièce (1a, 1b), caractérisé en ce que la pièce (1) est soumise à l'action d'une lumière laser (2) qui chauffe localement, dans une zone de la pièce (1) délimitant la ligne de coupe à produire, une zone d'introduction de chaleur tridimensionnelle (100), d'une largeur latérale E, en ce qu'on génère dans deux faces latérales opposées (12, 13) de la pièce, des contraintes de traction induites thermiquement qui sont d'une grandeur telle qu'elles provoquent une fissure qui s'étend le long de la ligne de coupe (SL), de telle façon que la pièce (1) soit séparée en au moins deux parties (1a, 1b) présentant chacune une face de coupe (16a, 16b).
PCT/EP2009/000489 2008-02-04 2009-01-27 Procédé de découpe au laser d'une pièce non métallique WO2009097987A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008007632A DE102008007632A1 (de) 2008-02-04 2008-02-04 Verfahren zum Laserschneiden eines nichtmetallischen Werkstücks
DE102008007632.5 2008-02-04

Publications (1)

Publication Number Publication Date
WO2009097987A1 true WO2009097987A1 (fr) 2009-08-13

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PCT/EP2009/000489 WO2009097987A1 (fr) 2008-02-04 2009-01-27 Procédé de découpe au laser d'une pièce non métallique

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WO (1) WO2009097987A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113584279B (zh) * 2020-04-30 2023-09-12 宝山钢铁股份有限公司 一种耐消除应力退火刻痕取向硅钢及其制造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0448168A1 (fr) * 1990-03-21 1991-09-25 Koninklijke Philips Electronics N.V. Procédé de clivage d'une plaque fragile et dispositif convenant pour mettre en oeuvre le procÀ©dé
WO1993020015A1 (fr) * 1992-04-02 1993-10-14 Fonon Technology Limited Clivage de materiaux non metalliques
US5254833A (en) * 1991-01-11 1993-10-19 Soei Tsusho Company, Ltd. Brittle material cleavage-cutting apparatus
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
WO2006045130A1 (fr) * 2004-10-25 2006-05-04 Lisec Maschinenbau Gmbh Procede et dispositif permettant de diviser du verre, notamment du verre feuillete
EP1803538A1 (fr) * 2004-10-01 2007-07-04 Mitsuboshi Diamond Industrial Co., Ltd. Procede de decoupe d un materiau cassant et appareil de decoupe
US20070169849A1 (en) * 2006-01-20 2007-07-26 Susumu Yahagi Apparatus and method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6188046B1 (en) 1999-05-18 2001-02-13 The Rival Company Food-heating appliance and method of using same
DE102004024475A1 (de) * 2004-05-14 2005-12-01 Lzh Laserzentrum Hannover E.V. Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0448168A1 (fr) * 1990-03-21 1991-09-25 Koninklijke Philips Electronics N.V. Procédé de clivage d'une plaque fragile et dispositif convenant pour mettre en oeuvre le procÀ©dé
US5254833A (en) * 1991-01-11 1993-10-19 Soei Tsusho Company, Ltd. Brittle material cleavage-cutting apparatus
WO1993020015A1 (fr) * 1992-04-02 1993-10-14 Fonon Technology Limited Clivage de materiaux non metalliques
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
EP1803538A1 (fr) * 2004-10-01 2007-07-04 Mitsuboshi Diamond Industrial Co., Ltd. Procede de decoupe d un materiau cassant et appareil de decoupe
WO2006045130A1 (fr) * 2004-10-25 2006-05-04 Lisec Maschinenbau Gmbh Procede et dispositif permettant de diviser du verre, notamment du verre feuillete
US20070169849A1 (en) * 2006-01-20 2007-07-26 Susumu Yahagi Apparatus and method

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