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WO2009095110A2 - Capteur comprenant un boîtier, un module capteur et une pièce d'insertion - Google Patents

Capteur comprenant un boîtier, un module capteur et une pièce d'insertion Download PDF

Info

Publication number
WO2009095110A2
WO2009095110A2 PCT/EP2008/065580 EP2008065580W WO2009095110A2 WO 2009095110 A2 WO2009095110 A2 WO 2009095110A2 EP 2008065580 W EP2008065580 W EP 2008065580W WO 2009095110 A2 WO2009095110 A2 WO 2009095110A2
Authority
WO
WIPO (PCT)
Prior art keywords
sensor module
sensor
insert part
housing
inserts
Prior art date
Application number
PCT/EP2008/065580
Other languages
German (de)
English (en)
Other versions
WO2009095110A3 (fr
Inventor
Christian Ohl
Timo Nachtrab
Matthias Ludwig
Yi-Lok Tang
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2009095110A2 publication Critical patent/WO2009095110A2/fr
Publication of WO2009095110A3 publication Critical patent/WO2009095110A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets

Definitions

  • the invention is based on a sensor with a sensor housing, a sensor module arranged therein and at least one insert part, wherein the sensor module has at least two substantially opposite outer surfaces.
  • sensor modules which are installed with or without circuit board in the outer housing. Fixing and contacting of the sensor module in the outer housing takes place in a known manner, for example by a printed circuit board technology. This includes a montage of the
  • Sensor module on a circuit board by soldering. Installation and contacting of the printed circuit board takes place in an outer casing, e.g. by press-fitting. Closing the housing takes place e.g. through a lid or by casting.
  • Another example is module direct assembly.
  • Sensor module in an outer housing, e.g. by gluing.
  • the contacting of the terminal pins is e.g. accomplished by welding, soldering or wire bonding.
  • the closure of the housing and / or passivation of the components is e.g. guaranteed by a gel.
  • the object of the invention is a sensor in which the sensor module with minimal
  • the invention is based on a sensor with a sensor housing, a sensor module arranged therein and at least one insert part, wherein the sensor module has at least two substantially opposite outer surfaces.
  • the essence of the invention is that the at least one insert part engages around the sensor module, so that the sensor module at least at the two substantially opposite
  • Metal inserts are advantageously provided for this purpose, which are formed as cost-effective stamped parts in such a way that sensor modules can be mounted, contacted and optionally integrated in the outer housing without additional components or processes with minimal effort and expense.
  • Insert part indirectly by means of a mounting part, in particular by means of an adhesive plate is connected.
  • the sensor module is directly connected to the insert. It is advantageous that the sensor module is connected to the insert frictionally and / or positively. It is also advantageous that the sensor module has at least one electrical connection, which is connected to a contact zone of the insert.
  • the insert has a contact means, in particular a solder deposit, at the contact zone. It is also advantageous that the insert (13) has a shield (137) for at least partially shielding the sensor module (11) against electromagnetic radiation.
  • the inserts can be inexpensively produced as stamped / bent parts similar to the usual plug pins, additional parts, in particular
  • the positioning of the sensor module to the inserts is simple because it is mandatory by the shape of the inserts.
  • the inserts combine the functions of electrical contact, positioning, an E MV (electromagnetic compatibility) protection function and optionally the holding function for subsequent encapsulation / overmolding or other cladding processes.
  • the sensor module is a micromechanical module.
  • Such micromechanical modules can be particularly advantageous mechanically and electrically connect to the insert.
  • the micromechanical module is an acceleration sensor or yaw rate sensor. Particularly advantageous here is the correct positioning of the module in the housing, which is made possible by the invention inexpensive and accurate.
  • Figure 1 shows a sensor with printed circuit board in the prior art.
  • Figure 2 shows a sensor with direct enclosure.
  • Figure 3 shows schematically a sensor according to the invention with housing, sensor module and insert.
  • Figure 1 shows a sensor with printed circuit board in the prior art.
  • a sensor module 3 is arranged on a carrier strip 2 in an inner housing 3.
  • the carrier strip 3 has contact pins, by means of which the arrangement is mounted on a printed circuit board 4.
  • the circuit board 4 in turn is fastened by means of one or more inserts 6 in an outer housing 5.
  • Figure 2 shows a sensor with a direct envelope as described in the unpublished document DE 102007057441.
  • a sensor module 3 is attached on one side to one or more inserts 6.
  • additional mounting means are provided (not shown).
  • the arrangement is enveloped by an elastic medium 7 and surrounded by a housing 5.
  • Figure 3 shows schematically a sensor according to the invention with housing, sensor module and insert.
  • a second, mechanically strong material 16 for example, PBT or PA
  • Sensor module 11 is for example a micromechanical acceleration sensor.
  • Thickness and width of the inserts 13 are designed in a web portion 134 so that optionally acts a defined spring force as a holding function on the sensor module. Too high a load on the contact zone 132, for example due to mechanical stresses in the housing, is avoided by the elastic deformation of the webs.
  • the inserts 13, eg produced by stamping, support points 136 for a defined positioning of the sensor module 11 may contain. By the support points 136 and a defined gap width between module 11 and inserts 13 can be achieved.
  • a further component namely a mounting member 14 are used, which serves as a positioning aid and / or as a mechanical attachment, e.g. as an adhesive tile.
  • a mounting member 14 which serves as a positioning aid and / or as a mechanical attachment, e.g. as an adhesive tile.
  • Sensor module 11 contained, also flat shaped metallic parts, e.g. a carrier strip (leadframe) in a QFN housing or printed conductors in an LGA housing, at least a two-sided metallic shielding of the electronic components contained in the sensor module 11 against electromagnetic effects.
  • the shield 137 alone shields the sensor module 11 at least from one side, at least in some areas.
  • the inserts 13 may be formed in a region to a boundary 135 so that around the sensor module 11 around at 4 or 5
  • insertion bevels can be realized, which facilitate a manual or automatic mounting of the sensor module 11 to the inserts 13.
  • the electrical contacts between the inserts 13 and the sensor module 11 can be made for example by a solder, Leitklebe- or welded connection.
  • the inserts 13 can optionally contain a contact means in the contact region (132), for example a solder deposit, such as a tin depot, so that the subsequent application of a contact agent in the assembly process of the sensor module 11 can be dispensed with.
  • the invention is not limited to a sensor with a housing, a sensor module and one or more inserts. It may also be another electrical device with a housing, a semiconductor device and one or more inserts.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Pressure Sensors (AREA)

Abstract

L'invention concerne un capteur comprenant un boîtier de capteur (15, 16), un module capteur (11) placé dans le boîtier, ainsi qu'au moins une pièce d'insertion (13), le module capteur (11) présentant au moins deux surfaces extérieures pratiquement opposées. L'invention est caractérisée en ce que la pièce d'insertion (13) enveloppe le module capteur (11) de sorte que le module capteur (11) est relié à la pièce d'insertion (13) au moins au niveau des deux surfaces extérieures pratiquement opposées.
PCT/EP2008/065580 2008-01-30 2008-11-14 Capteur comprenant un boîtier, un module capteur et une pièce d'insertion WO2009095110A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008006707.5 2008-01-30
DE200810006707 DE102008006707A1 (de) 2008-01-30 2008-01-30 Sensor mit Gehäuse, Sensormodul und Einlegeteil

Publications (2)

Publication Number Publication Date
WO2009095110A2 true WO2009095110A2 (fr) 2009-08-06
WO2009095110A3 WO2009095110A3 (fr) 2010-04-15

Family

ID=40822009

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/065580 WO2009095110A2 (fr) 2008-01-30 2008-11-14 Capteur comprenant un boîtier, un module capteur et une pièce d'insertion

Country Status (2)

Country Link
DE (1) DE102008006707A1 (fr)
WO (1) WO2009095110A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9377347B2 (en) 2012-10-09 2016-06-28 Pruftechnik Dieter Busch Ag Sensor arrangement and method for producing a sensor arrangement
US10018488B2 (en) 2012-10-09 2018-07-10 Prüftechnik Dieter Busch AG Sensor arrangement and method for creating an output signal

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010061750B4 (de) 2010-11-23 2024-07-04 Robert Bosch Gmbh Bauteil mit einer elektronischen Einrichtung und Verfahren zu dessen Herstellung
DE102012222491A1 (de) 2012-12-06 2014-06-12 Robert Bosch Gmbh Elektronisches Bauteil mit einem gespritzten Bauteilgehäuse
DE102016209840A1 (de) * 2016-06-03 2017-12-07 Continental Teves Ag & Co. Ohg Sensor, Verfahren und Sensoranordnung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4699445A (en) * 1986-07-28 1987-10-13 Amp Incorporated Electrical terminal assembly for thermistors
US6158268A (en) * 1994-01-05 2000-12-12 Heraeus Electro-Nite International N.V. Measuring sensor
DE20020805U1 (de) * 2000-01-07 2001-03-08 Leopold Kostal GmbH & Co KG, 58507 Lüdenscheid Sensormodul für ein elektrisches Steckergehäuse

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007057441B4 (de) 2007-11-29 2019-07-11 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements mit einem volumenelastischen Medium und mikromechanischen Bauelement

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4699445A (en) * 1986-07-28 1987-10-13 Amp Incorporated Electrical terminal assembly for thermistors
US6158268A (en) * 1994-01-05 2000-12-12 Heraeus Electro-Nite International N.V. Measuring sensor
DE20020805U1 (de) * 2000-01-07 2001-03-08 Leopold Kostal GmbH & Co KG, 58507 Lüdenscheid Sensormodul für ein elektrisches Steckergehäuse

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9377347B2 (en) 2012-10-09 2016-06-28 Pruftechnik Dieter Busch Ag Sensor arrangement and method for producing a sensor arrangement
US10018488B2 (en) 2012-10-09 2018-07-10 Prüftechnik Dieter Busch AG Sensor arrangement and method for creating an output signal

Also Published As

Publication number Publication date
DE102008006707A1 (de) 2009-08-06
WO2009095110A3 (fr) 2010-04-15

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