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WO2009091333A3 - Method and apparatus for laminating a bumped wafer - Google Patents

Method and apparatus for laminating a bumped wafer Download PDF

Info

Publication number
WO2009091333A3
WO2009091333A3 PCT/SG2008/000014 SG2008000014W WO2009091333A3 WO 2009091333 A3 WO2009091333 A3 WO 2009091333A3 SG 2008000014 W SG2008000014 W SG 2008000014W WO 2009091333 A3 WO2009091333 A3 WO 2009091333A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
tape
laminate
laminating
vaccuum
Prior art date
Application number
PCT/SG2008/000014
Other languages
French (fr)
Other versions
WO2009091333A2 (en
Inventor
Siu Mun Leong
Peng Fah Low
Kee Meng Joey Ng
Original Assignee
Lintec Singapore Pte. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Singapore Pte. Ltd. filed Critical Lintec Singapore Pte. Ltd.
Priority to PCT/SG2008/000014 priority Critical patent/WO2009091333A2/en
Publication of WO2009091333A2 publication Critical patent/WO2009091333A2/en
Publication of WO2009091333A3 publication Critical patent/WO2009091333A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to an improved lamination process for a semiconductor wafer by reducing the occurrence of air bubbles between the wafer and the backgrinding tape in a vaccuum environment. A pre-cut laminate tape is held by vaccuum suction means and air is blown in an airbrushing manner to push the laminating tape onto the wafer. The apparatus provides a laminate tape reel loading and dispensing mechanism (30) which includes a tape dispenser (32) and a mechanism (50) for loading a cassette of stacked wafers. A robotic arm places wafers from the cassette on a table (52) which holds a wafer (54) to be laminated. An upper carriage (72) is able to pick up the laminate tape (35) and adheres the tape onto the wafer (54). The laminate tape (35) is supplied in a bobbin (34) and is pre-cut (35a) to a shape covering the corresponding topographic surface of the wafer (54).
PCT/SG2008/000014 2008-01-14 2008-01-14 Method and apparatus for laminating a bumped wafer WO2009091333A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/SG2008/000014 WO2009091333A2 (en) 2008-01-14 2008-01-14 Method and apparatus for laminating a bumped wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2008/000014 WO2009091333A2 (en) 2008-01-14 2008-01-14 Method and apparatus for laminating a bumped wafer

Publications (2)

Publication Number Publication Date
WO2009091333A2 WO2009091333A2 (en) 2009-07-23
WO2009091333A3 true WO2009091333A3 (en) 2009-12-30

Family

ID=40885835

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2008/000014 WO2009091333A2 (en) 2008-01-14 2008-01-14 Method and apparatus for laminating a bumped wafer

Country Status (1)

Country Link
WO (1) WO2009091333A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5687647B2 (en) * 2012-03-14 2015-03-18 株式会社東芝 Semiconductor device manufacturing method and semiconductor manufacturing apparatus
JP6871812B2 (en) * 2017-06-21 2021-05-12 リンテック株式会社 Sheet pasting device and pasting method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
DE102005060456A1 (en) * 2005-12-17 2007-06-28 Schott Ag Plastic film fabricating method for fabricating semiconductor components, involves filling fluid in area separated by film, so that pressure difference caused by filling presses film on wafer, where plastic coating is formed on film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
DE102005060456A1 (en) * 2005-12-17 2007-06-28 Schott Ag Plastic film fabricating method for fabricating semiconductor components, involves filling fluid in area separated by film, so that pressure difference caused by filling presses film on wafer, where plastic coating is formed on film

Also Published As

Publication number Publication date
WO2009091333A2 (en) 2009-07-23

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