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WO2009078469A1 - 絶縁被覆導電粒子、異方導電接着フィルム及びそれらの製造方法 - Google Patents

絶縁被覆導電粒子、異方導電接着フィルム及びそれらの製造方法 Download PDF

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Publication number
WO2009078469A1
WO2009078469A1 PCT/JP2008/073119 JP2008073119W WO2009078469A1 WO 2009078469 A1 WO2009078469 A1 WO 2009078469A1 JP 2008073119 W JP2008073119 W JP 2008073119W WO 2009078469 A1 WO2009078469 A1 WO 2009078469A1
Authority
WO
WIPO (PCT)
Prior art keywords
particle
insulator
methods
adhesive film
covered
Prior art date
Application number
PCT/JP2008/073119
Other languages
English (en)
French (fr)
Inventor
Yuuko Nagahara
Jun Taketatsu
Kenji Takai
Takuya Chayama
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Publication of WO2009078469A1 publication Critical patent/WO2009078469A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

基材粒子と該基材粒子表面の少なくとも一部を被覆する多層の金属めっき層とを有する導電粒子と、導電粒子表面の少なくとも一部を被覆する絶縁性微粒子と、を備える絶縁被覆導電粒子であって、前記基材粒子が平均粒径４．０μｍ以下の樹脂粒子であり、導電粒子が水酸基、カルボキシル基、アルコキシ基及びアルコキシカルボニル基から選ばれる少なくとも１種の官能基を表面に有し、絶縁性微粒子が水酸基を表面に有する無機酸化物微粒子である、絶縁被覆導電粒子。
PCT/JP2008/073119 2007-12-18 2008-12-18 絶縁被覆導電粒子、異方導電接着フィルム及びそれらの製造方法 WO2009078469A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-325862 2007-12-18
JP2007325862 2007-12-18

Publications (1)

Publication Number Publication Date
WO2009078469A1 true WO2009078469A1 (ja) 2009-06-25

Family

ID=40795582

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/073119 WO2009078469A1 (ja) 2007-12-18 2008-12-18 絶縁被覆導電粒子、異方導電接着フィルム及びそれらの製造方法

Country Status (2)

Country Link
JP (1) JP2009170414A (ja)
WO (1) WO2009078469A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011002065A1 (ja) * 2009-07-01 2011-01-06 日立化成工業株式会社 被覆導電粒子及びその製造方法
US8698394B2 (en) 2010-03-31 2014-04-15 3M Innovative Properties Company Electronic articles for displays and methods of making same
CN114630813A (zh) * 2019-10-29 2022-06-14 京瓷株式会社 陶瓷结构体、吸嘴、刀具、镊子、磨损检测器、粉体除电装置、粉体制造装置、顶销、搬运手及纤维引导件

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0250858A (ja) * 1988-08-12 1990-02-20 Tokyo Electric Co Ltd 印刷装置
JP5554077B2 (ja) * 2009-09-15 2014-07-23 株式会社日本触媒 絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体
JP5471504B2 (ja) * 2010-01-25 2014-04-16 日立化成株式会社 異方導電性フィルム
JP5803393B2 (ja) * 2011-08-02 2015-11-04 日立化成株式会社 絶縁被覆導電粒子及び異方導電性接着フィルム
US9446484B2 (en) 2012-02-21 2016-09-20 Sekisui Chemical Co., Ltd. Conductive particles, method for producing conductive particles, conductive material and connection structure
JP6212374B2 (ja) * 2012-12-05 2017-10-11 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
WO2017010445A1 (ja) * 2015-07-14 2017-01-19 積水化学工業株式会社 導電材料及び接続構造体

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000149677A (ja) * 1998-11-05 2000-05-30 Hitachi Chem Co Ltd 異方導電性接着フィルムの製造装置
JP2003317827A (ja) * 2002-04-26 2003-11-07 Hitachi Chem Co Ltd 異方導電性接着剤及び回路板
WO2005004171A1 (ja) * 2003-07-04 2005-01-13 Natoco Co., Ltd. 被覆導電性粒子、導電性材料、異方性導電接着剤および異方性導電接合構造
JP2005044773A (ja) * 2003-07-07 2005-02-17 Sekisui Chem Co Ltd 被覆導電性粒子、異方性導電材料及び導電接続構造体
JP2005187637A (ja) * 2003-12-25 2005-07-14 Sekisui Chem Co Ltd 異方導電性接着剤、液晶表示素子用上下導通材料及び液晶表示素子
JP2005197091A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000149677A (ja) * 1998-11-05 2000-05-30 Hitachi Chem Co Ltd 異方導電性接着フィルムの製造装置
JP2003317827A (ja) * 2002-04-26 2003-11-07 Hitachi Chem Co Ltd 異方導電性接着剤及び回路板
WO2005004171A1 (ja) * 2003-07-04 2005-01-13 Natoco Co., Ltd. 被覆導電性粒子、導電性材料、異方性導電接着剤および異方性導電接合構造
JP2005044773A (ja) * 2003-07-07 2005-02-17 Sekisui Chem Co Ltd 被覆導電性粒子、異方性導電材料及び導電接続構造体
JP2005187637A (ja) * 2003-12-25 2005-07-14 Sekisui Chem Co Ltd 異方導電性接着剤、液晶表示素子用上下導通材料及び液晶表示素子
JP2005197091A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011002065A1 (ja) * 2009-07-01 2011-01-06 日立化成工業株式会社 被覆導電粒子及びその製造方法
CN102474023A (zh) * 2009-07-01 2012-05-23 日立化成工业株式会社 包覆导电粒子及其制造方法
US8698394B2 (en) 2010-03-31 2014-04-15 3M Innovative Properties Company Electronic articles for displays and methods of making same
CN114630813A (zh) * 2019-10-29 2022-06-14 京瓷株式会社 陶瓷结构体、吸嘴、刀具、镊子、磨损检测器、粉体除电装置、粉体制造装置、顶销、搬运手及纤维引导件
CN114630813B (zh) * 2019-10-29 2023-11-21 京瓷株式会社 陶瓷结构体、吸嘴、刀具、镊子、磨损检测器、粉体除电装置、粉体制造装置、顶销、搬运手及纤维引导件

Also Published As

Publication number Publication date
JP2009170414A (ja) 2009-07-30

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