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WO2009078365A1 - ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物 - Google Patents

ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物 Download PDF

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Publication number
WO2009078365A1
WO2009078365A1 PCT/JP2008/072693 JP2008072693W WO2009078365A1 WO 2009078365 A1 WO2009078365 A1 WO 2009078365A1 JP 2008072693 W JP2008072693 W JP 2008072693W WO 2009078365 A1 WO2009078365 A1 WO 2009078365A1
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WIPO (PCT)
Prior art keywords
polyhydroxyimide
resin composition
photosensitive resin
composition containing
positive photosensitive
Prior art date
Application number
PCT/JP2008/072693
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English (en)
French (fr)
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Kazuya Ebara
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Nissan Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Industries, Ltd. filed Critical Nissan Chemical Industries, Ltd.
Priority to US12/747,543 priority Critical patent/US20100304291A1/en
Priority to JP2009546248A priority patent/JP5549801B2/ja
Publication of WO2009078365A1 publication Critical patent/WO2009078365A1/ja
Priority to US13/742,860 priority patent/US8796393B2/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

【課題】ポリヒドロキシイミドの簡便な製造方法を提供すること並びに該ポリヒドロキシイミドを含有するポジ型感光性樹脂組成物を提供すること。 【解決手段】式(１) (式中、Ｘは、４価の脂肪族基又は芳香族基を示し、Ｙは、少なくとも１つのＯＨ基で置換された芳香族基を含む有機基を示し、ｎは、１以上の整数を示す。)で表されるポリヒドロキシイミド前駆体に、少なくとも一種類のｐＫａが０乃至５のカルボン酸である酸成分を添加し、温度５０乃至１００°Cに加熱することにより、式(２) (式中、Ｘ、Ｙ及びｎは、前記と同じ意味を表す。)で表され、重量平均分子量が３,０００乃至１００,０００であるポリイミドを得ることを特徴とする、ポリヒドロキシイミドの製造方法、該ポリヒドロキシイミドを含有するポジ型感光性樹脂組成物。
PCT/JP2008/072693 2007-12-14 2008-12-12 ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物 WO2009078365A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/747,543 US20100304291A1 (en) 2007-12-14 2008-12-12 Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method
JP2009546248A JP5549801B2 (ja) 2007-12-14 2008-12-12 ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物
US13/742,860 US8796393B2 (en) 2007-12-14 2013-01-16 Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-323639 2007-12-14
JP2007323639 2007-12-14
JP2008-254178 2008-09-30
JP2008254178 2008-09-30

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/747,543 A-371-Of-International US20100304291A1 (en) 2007-12-14 2008-12-12 Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method
US13/742,860 Division US8796393B2 (en) 2007-12-14 2013-01-16 Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method

Publications (1)

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WO2009078365A1 true WO2009078365A1 (ja) 2009-06-25

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US (2) US20100304291A1 (ja)
JP (1) JP5549801B2 (ja)
KR (1) KR101588364B1 (ja)
TW (1) TWI458753B (ja)
WO (1) WO2009078365A1 (ja)

Cited By (5)

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WO2010131442A1 (ja) * 2009-05-12 2010-11-18 株式会社カネカ ポリアミド酸溶液の製造方法及びポリイミドフィルム
JP2012244181A (ja) * 2011-05-19 2012-12-10 Samsung Electronics Co Ltd 有機保護膜組成物およびこれから製造される有機保護膜を含む薄膜トランジスタ、並びに電子素子
WO2014050878A1 (ja) * 2012-09-25 2014-04-03 東レ株式会社 樹脂組成物、硬化膜、積層フィルム、および半導体装置の製造方法
JP2017025163A (ja) * 2015-07-17 2017-02-02 Jnc株式会社 樹脂溶液組成物およびポリイミドフィルム
JP2018146969A (ja) * 2012-12-20 2018-09-20 東レ株式会社 感光性樹脂組成物、耐熱性樹脂膜の製造方法および表示装置

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JP5549801B2 (ja) 2007-12-14 2014-07-16 日産化学工業株式会社 ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物
TWI473836B (zh) * 2012-01-13 2015-02-21 Lg Chemical Ltd 用於電子裝置之絕緣材料
CN103890859B (zh) * 2012-01-13 2017-02-22 株式会社Lg化学 用于电子器件的绝缘材料
CN109298601A (zh) * 2012-09-18 2019-02-01 旭化成株式会社 感光性树脂组合物
US9454078B2 (en) * 2012-09-25 2016-09-27 Toray Industries, Inc. Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same
KR102179145B1 (ko) * 2015-12-10 2020-11-16 피피지 인더스트리즈 오하이오 인코포레이티드 아민이미드 조성물
JP7145126B2 (ja) * 2018-08-01 2022-09-30 信越化学工業株式会社 ポリアミド、ポリアミドイミド、ポリイミド構造を含む重合体、感光性樹脂組成物、パターン形成方法、感光性ドライフィルム及び電気・電子部品保護用皮膜
JP7154184B2 (ja) * 2019-04-15 2022-10-17 信越化学工業株式会社 ポジ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
CN115960352B (zh) * 2022-12-29 2024-07-05 深圳市道尔顿电子材料股份有限公司 一种光敏聚酰亚胺前体树脂及其制备方法和感光树脂组合物

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010131442A1 (ja) * 2009-05-12 2010-11-18 株式会社カネカ ポリアミド酸溶液の製造方法及びポリイミドフィルム
JP2012244181A (ja) * 2011-05-19 2012-12-10 Samsung Electronics Co Ltd 有機保護膜組成物およびこれから製造される有機保護膜を含む薄膜トランジスタ、並びに電子素子
WO2014050878A1 (ja) * 2012-09-25 2014-04-03 東レ株式会社 樹脂組成物、硬化膜、積層フィルム、および半導体装置の製造方法
JPWO2014050878A1 (ja) * 2012-09-25 2016-08-22 東レ株式会社 樹脂組成物、硬化膜、積層フィルム、および半導体装置の製造方法
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JP2018146969A (ja) * 2012-12-20 2018-09-20 東レ株式会社 感光性樹脂組成物、耐熱性樹脂膜の製造方法および表示装置
JP2017025163A (ja) * 2015-07-17 2017-02-02 Jnc株式会社 樹脂溶液組成物およびポリイミドフィルム

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TWI458753B (zh) 2014-11-01
KR20100102656A (ko) 2010-09-24
JPWO2009078365A1 (ja) 2011-04-28
US20130131282A1 (en) 2013-05-23
US8796393B2 (en) 2014-08-05
US20100304291A1 (en) 2010-12-02
KR101588364B1 (ko) 2016-01-25
TW200946561A (en) 2009-11-16
JP5549801B2 (ja) 2014-07-16

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