WO2009078365A1 - ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物 - Google Patents
ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物 Download PDFInfo
- Publication number
- WO2009078365A1 WO2009078365A1 PCT/JP2008/072693 JP2008072693W WO2009078365A1 WO 2009078365 A1 WO2009078365 A1 WO 2009078365A1 JP 2008072693 W JP2008072693 W JP 2008072693W WO 2009078365 A1 WO2009078365 A1 WO 2009078365A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyhydroxyimide
- resin composition
- photosensitive resin
- composition containing
- positive photosensitive
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000011342 resin composition Substances 0.000 title abstract 3
- 125000003118 aryl group Chemical group 0.000 abstract 2
- 239000004642 Polyimide Substances 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 239000002243 precursor Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
- Electroluminescent Light Sources (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/747,543 US20100304291A1 (en) | 2007-12-14 | 2008-12-12 | Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method |
JP2009546248A JP5549801B2 (ja) | 2007-12-14 | 2008-12-12 | ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物 |
US13/742,860 US8796393B2 (en) | 2007-12-14 | 2013-01-16 | Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-323639 | 2007-12-14 | ||
JP2007323639 | 2007-12-14 | ||
JP2008-254178 | 2008-09-30 | ||
JP2008254178 | 2008-09-30 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/747,543 A-371-Of-International US20100304291A1 (en) | 2007-12-14 | 2008-12-12 | Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method |
US13/742,860 Division US8796393B2 (en) | 2007-12-14 | 2013-01-16 | Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009078365A1 true WO2009078365A1 (ja) | 2009-06-25 |
Family
ID=40795481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/072693 WO2009078365A1 (ja) | 2007-12-14 | 2008-12-12 | ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20100304291A1 (ja) |
JP (1) | JP5549801B2 (ja) |
KR (1) | KR101588364B1 (ja) |
TW (1) | TWI458753B (ja) |
WO (1) | WO2009078365A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010131442A1 (ja) * | 2009-05-12 | 2010-11-18 | 株式会社カネカ | ポリアミド酸溶液の製造方法及びポリイミドフィルム |
JP2012244181A (ja) * | 2011-05-19 | 2012-12-10 | Samsung Electronics Co Ltd | 有機保護膜組成物およびこれから製造される有機保護膜を含む薄膜トランジスタ、並びに電子素子 |
WO2014050878A1 (ja) * | 2012-09-25 | 2014-04-03 | 東レ株式会社 | 樹脂組成物、硬化膜、積層フィルム、および半導体装置の製造方法 |
JP2017025163A (ja) * | 2015-07-17 | 2017-02-02 | Jnc株式会社 | 樹脂溶液組成物およびポリイミドフィルム |
JP2018146969A (ja) * | 2012-12-20 | 2018-09-20 | 東レ株式会社 | 感光性樹脂組成物、耐熱性樹脂膜の製造方法および表示装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5549801B2 (ja) | 2007-12-14 | 2014-07-16 | 日産化学工業株式会社 | ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物 |
TWI473836B (zh) * | 2012-01-13 | 2015-02-21 | Lg Chemical Ltd | 用於電子裝置之絕緣材料 |
CN103890859B (zh) * | 2012-01-13 | 2017-02-22 | 株式会社Lg化学 | 用于电子器件的绝缘材料 |
CN109298601A (zh) * | 2012-09-18 | 2019-02-01 | 旭化成株式会社 | 感光性树脂组合物 |
US9454078B2 (en) * | 2012-09-25 | 2016-09-27 | Toray Industries, Inc. | Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same |
KR102179145B1 (ko) * | 2015-12-10 | 2020-11-16 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 아민이미드 조성물 |
JP7145126B2 (ja) * | 2018-08-01 | 2022-09-30 | 信越化学工業株式会社 | ポリアミド、ポリアミドイミド、ポリイミド構造を含む重合体、感光性樹脂組成物、パターン形成方法、感光性ドライフィルム及び電気・電子部品保護用皮膜 |
JP7154184B2 (ja) * | 2019-04-15 | 2022-10-17 | 信越化学工業株式会社 | ポジ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品 |
CN115960352B (zh) * | 2022-12-29 | 2024-07-05 | 深圳市道尔顿电子材料股份有限公司 | 一种光敏聚酰亚胺前体树脂及其制备方法和感光树脂组合物 |
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JP2000505119A (ja) * | 1995-08-04 | 2000-04-25 | ナショナル エアロノーティクス アンド スペース アドミンストレーション | 突出したフェニルエチニル基を含むイミドオリゴマーとコオリゴマー、及びそれら由来のポリマー |
JP2005173027A (ja) * | 2003-12-09 | 2005-06-30 | Kyocera Chemical Corp | ポジ型感光性樹脂組成物及びその硬化物 |
JP2008076739A (ja) * | 2006-09-21 | 2008-04-03 | Nissan Chem Ind Ltd | 末端に不飽和基を有する化合物を含有するポジ型感光性樹脂組成物 |
WO2008153101A1 (ja) * | 2007-06-15 | 2008-12-18 | Nissan Chemical Industries, Ltd. | 熱硬化膜形成用樹脂組成物 |
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JPH02151629A (ja) | 1988-12-05 | 1990-06-11 | Mitsui Toatsu Chem Inc | 芳香族ポリイミドの製造方法 |
US5114826A (en) * | 1989-12-28 | 1992-05-19 | Ibm Corporation | Photosensitive polyimide compositions |
WO2000014604A1 (fr) * | 1998-09-09 | 2000-03-16 | Toray Industries, Inc. | Composition-precurseur de resine photosensible positive et procede de fabrication correspondant |
KR100732895B1 (ko) * | 1999-11-30 | 2007-06-27 | 닛산 가가쿠 고교 가부시키 가이샤 | 포지티브형 감광성 폴리이미드수지 조성물 |
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JP2001220443A (ja) * | 2000-02-08 | 2001-08-14 | Sumitomo Bakelite Co Ltd | ポリベンゾオキサゾール前駆体樹脂及びそれを用いた感光性樹脂組成物 |
JP2002212287A (ja) | 2001-01-22 | 2002-07-31 | Hitachi Cable Ltd | ポリイミドの製造方法 |
EP1431822A4 (en) * | 2001-09-26 | 2005-01-05 | Nissan Chemical Ind Ltd | POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION |
KR20050085331A (ko) * | 2002-12-05 | 2005-08-29 | 가부시키가이샤 가네카 | 적층체, 인쇄 배선판 및 이들의 제조 방법 |
KR100782437B1 (ko) * | 2005-12-30 | 2007-12-05 | 제일모직주식회사 | 액정 배향제 |
JP5549801B2 (ja) | 2007-12-14 | 2014-07-16 | 日産化学工業株式会社 | ポリヒドロキシイミドの製造方法並びに該製造方法より得られたポリヒドロキシイミドを含有するポジ型感光性樹脂組成物 |
-
2008
- 2008-12-12 JP JP2009546248A patent/JP5549801B2/ja active Active
- 2008-12-12 WO PCT/JP2008/072693 patent/WO2009078365A1/ja active Application Filing
- 2008-12-12 KR KR1020107015430A patent/KR101588364B1/ko active Active
- 2008-12-12 US US12/747,543 patent/US20100304291A1/en not_active Abandoned
- 2008-12-12 TW TW097148695A patent/TWI458753B/zh active
-
2013
- 2013-01-16 US US13/742,860 patent/US8796393B2/en active Active
Patent Citations (4)
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JP2000505119A (ja) * | 1995-08-04 | 2000-04-25 | ナショナル エアロノーティクス アンド スペース アドミンストレーション | 突出したフェニルエチニル基を含むイミドオリゴマーとコオリゴマー、及びそれら由来のポリマー |
JP2005173027A (ja) * | 2003-12-09 | 2005-06-30 | Kyocera Chemical Corp | ポジ型感光性樹脂組成物及びその硬化物 |
JP2008076739A (ja) * | 2006-09-21 | 2008-04-03 | Nissan Chem Ind Ltd | 末端に不飽和基を有する化合物を含有するポジ型感光性樹脂組成物 |
WO2008153101A1 (ja) * | 2007-06-15 | 2008-12-18 | Nissan Chemical Industries, Ltd. | 熱硬化膜形成用樹脂組成物 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010131442A1 (ja) * | 2009-05-12 | 2010-11-18 | 株式会社カネカ | ポリアミド酸溶液の製造方法及びポリイミドフィルム |
JP2012244181A (ja) * | 2011-05-19 | 2012-12-10 | Samsung Electronics Co Ltd | 有機保護膜組成物およびこれから製造される有機保護膜を含む薄膜トランジスタ、並びに電子素子 |
WO2014050878A1 (ja) * | 2012-09-25 | 2014-04-03 | 東レ株式会社 | 樹脂組成物、硬化膜、積層フィルム、および半導体装置の製造方法 |
JPWO2014050878A1 (ja) * | 2012-09-25 | 2016-08-22 | 東レ株式会社 | 樹脂組成物、硬化膜、積層フィルム、および半導体装置の製造方法 |
US9716026B2 (en) | 2012-09-25 | 2017-07-25 | Toray Industries, Inc. | Resin composition, cured film, laminated film, and method for manufacturing semiconductor device |
JP2018146969A (ja) * | 2012-12-20 | 2018-09-20 | 東レ株式会社 | 感光性樹脂組成物、耐熱性樹脂膜の製造方法および表示装置 |
JP2017025163A (ja) * | 2015-07-17 | 2017-02-02 | Jnc株式会社 | 樹脂溶液組成物およびポリイミドフィルム |
Also Published As
Publication number | Publication date |
---|---|
TWI458753B (zh) | 2014-11-01 |
KR20100102656A (ko) | 2010-09-24 |
JPWO2009078365A1 (ja) | 2011-04-28 |
US20130131282A1 (en) | 2013-05-23 |
US8796393B2 (en) | 2014-08-05 |
US20100304291A1 (en) | 2010-12-02 |
KR101588364B1 (ko) | 2016-01-25 |
TW200946561A (en) | 2009-11-16 |
JP5549801B2 (ja) | 2014-07-16 |
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