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WO2009075261A1 - Appareil de transfert de substrat, procédé de transfert de substrat et appareil de traitement sous vide - Google Patents

Appareil de transfert de substrat, procédé de transfert de substrat et appareil de traitement sous vide Download PDF

Info

Publication number
WO2009075261A1
WO2009075261A1 PCT/JP2008/072323 JP2008072323W WO2009075261A1 WO 2009075261 A1 WO2009075261 A1 WO 2009075261A1 JP 2008072323 W JP2008072323 W JP 2008072323W WO 2009075261 A1 WO2009075261 A1 WO 2009075261A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate transfer
frame
state
vertical state
Prior art date
Application number
PCT/JP2008/072323
Other languages
English (en)
Japanese (ja)
Inventor
Yoshihiro Tooyama
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to CN2008801206771A priority Critical patent/CN101889339B/zh
Publication of WO2009075261A1 publication Critical patent/WO2009075261A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un appareil de transfert de substrat dans lequel un support pour transférer un substrat à l'état vertical est de poids réduit. Un appareil de transfert de substrat (11) pour transférer un substrat en forme de plaque plate (W) sur un support (23) qui transfère le substrat (W) à l'état vertical est doté d'un mécanisme de positionnement (22). Le mécanisme de positionnement (22) comprend une structure (37) ayant un corps de structure rectangulaire et tourne autour d'un axe de rotation (L) s'étendant dans la direction horizontale ; une pluralité ventouses (46) disposées sur la structure pour aspirer le substrat (W) ; et une section d'entraînement (35) faisant tourner la structure dans un état entre l'état horizontal et l'état vertical. Le mécanisme de positionnement (22) aspire le substrat (W) à l'état horizontal grâce aux ventouses sur la structure à l'état horizontal, fait tourner la structure pour qu'elle passe de l'état horizontal à l'état vertical en maintenant le substrat sur la structure, et le substrat (W) à l'état vertical est transféré sur le support (23).
PCT/JP2008/072323 2007-12-11 2008-12-09 Appareil de transfert de substrat, procédé de transfert de substrat et appareil de traitement sous vide WO2009075261A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008801206771A CN101889339B (zh) 2007-12-11 2008-12-09 真空处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007319573A JP2009146932A (ja) 2007-12-11 2007-12-11 基板搬送装置、基板搬送方法及び真空処理装置
JP2007-319573 2007-12-11

Publications (1)

Publication Number Publication Date
WO2009075261A1 true WO2009075261A1 (fr) 2009-06-18

Family

ID=40755503

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072323 WO2009075261A1 (fr) 2007-12-11 2008-12-09 Appareil de transfert de substrat, procédé de transfert de substrat et appareil de traitement sous vide

Country Status (5)

Country Link
JP (1) JP2009146932A (fr)
KR (1) KR20100085128A (fr)
CN (1) CN101889339B (fr)
TW (1) TW200935547A (fr)
WO (1) WO2009075261A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104251250A (zh) * 2013-06-25 2014-12-31 英属开曼群岛商精曜有限公司 群集式真空接合系统
CN108909163A (zh) * 2018-08-30 2018-11-30 东莞市奇声电子实业有限公司 丝印夹具
CN111233313A (zh) * 2018-11-29 2020-06-05 塔工程有限公司 基板切割装置
CN117262731A (zh) * 2023-10-09 2023-12-22 旭显未来(北京)科技有限公司 一种led显示模组自动老化设备

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5401210B2 (ja) * 2009-08-20 2014-01-29 株式会社テセック ウェーハフレームの搬送装置および搬送方法
WO2011048961A1 (fr) * 2009-10-22 2011-04-28 株式会社アルバック Appareil de traitement sous vide et procédé de présentation de graphe
JP2011093707A (ja) * 2009-10-30 2011-05-12 Sun Yueh Way 基板吸着ユニットおよび基板吸着アセンブリ
JP5562719B2 (ja) * 2010-05-18 2014-07-30 タツモ株式会社 ストレス付与装置、及びこれを用いた実装基板の製造方法
JP4992137B1 (ja) * 2011-10-15 2012-08-08 株式会社Ａｋシステム 板状被処理材の取扱装置
TWI467687B (zh) * 2011-11-29 2015-01-01 Tera Automation Corp Ltd Glass substrate transfer device
JP5945968B2 (ja) * 2013-09-03 2016-07-05 株式会社安川電機 ロボットハンド、ロボットシステム、及び物品のデパレタイズ方法
CN105097605B (zh) * 2014-05-09 2019-07-02 深圳莱宝高科技股份有限公司 基板处理系统及其处理方法
JP6526795B2 (ja) * 2015-04-15 2019-06-05 株式会社アルバック 基板の保持方法
CN105655487B (zh) 2016-01-05 2018-10-16 京东方科技集团股份有限公司 撕膜装置以及撕膜方法
CN106783705B (zh) * 2016-11-30 2019-05-14 上海华力微电子有限公司 一种用于优化晶圆边缘缺陷的晶圆传送方法
CN108323150A (zh) * 2017-12-29 2018-07-24 重庆市中光电显示技术有限公司 Fpc供料机
CN110482220A (zh) * 2019-07-26 2019-11-22 蚌埠凯盛工程技术有限公司 一种玻璃基板存储工艺、装置及应用
TWI769737B (zh) * 2021-03-12 2022-07-01 旭東機械工業股份有限公司 盒蓋裝卸機構及盒蓋檢測方法
CN117568757B (zh) * 2023-09-27 2024-08-02 江苏信核芯微电子有限公司 一种金属薄膜陶瓷基板加工用溅射镀膜设备及方法

Citations (5)

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JPH1076491A (ja) * 1996-09-03 1998-03-24 Nikon Corp プレート受渡しシステム
JPH1086085A (ja) * 1996-09-19 1998-04-07 Dainippon Screen Mfg Co Ltd 基板吸着装置および基板吸着方法
JP2001081557A (ja) * 1999-09-13 2001-03-27 Mitsubishi Heavy Ind Ltd マルチチャンバ型真空処理システム及び基板搬送装置
JP2003245884A (ja) * 2002-02-22 2003-09-02 Dainippon Screen Mfg Co Ltd 吸着固定装置および吸着固定方法
JP2006182502A (ja) * 2004-12-27 2006-07-13 Murata Mach Ltd トレイ搬送システム

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JPH0356141U (fr) * 1989-05-31 1991-05-30

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1076491A (ja) * 1996-09-03 1998-03-24 Nikon Corp プレート受渡しシステム
JPH1086085A (ja) * 1996-09-19 1998-04-07 Dainippon Screen Mfg Co Ltd 基板吸着装置および基板吸着方法
JP2001081557A (ja) * 1999-09-13 2001-03-27 Mitsubishi Heavy Ind Ltd マルチチャンバ型真空処理システム及び基板搬送装置
JP2003245884A (ja) * 2002-02-22 2003-09-02 Dainippon Screen Mfg Co Ltd 吸着固定装置および吸着固定方法
JP2006182502A (ja) * 2004-12-27 2006-07-13 Murata Mach Ltd トレイ搬送システム

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104251250A (zh) * 2013-06-25 2014-12-31 英属开曼群岛商精曜有限公司 群集式真空接合系统
CN104251250B (zh) * 2013-06-25 2016-03-02 英属开曼群岛商精曜有限公司 群集式真空接合系统
CN108909163A (zh) * 2018-08-30 2018-11-30 东莞市奇声电子实业有限公司 丝印夹具
CN108909163B (zh) * 2018-08-30 2024-04-26 东莞市奇声电子实业有限公司 丝印夹具
CN111233313A (zh) * 2018-11-29 2020-06-05 塔工程有限公司 基板切割装置
CN111233313B (zh) * 2018-11-29 2022-11-01 塔工程有限公司 基板切割装置
CN117262731A (zh) * 2023-10-09 2023-12-22 旭显未来(北京)科技有限公司 一种led显示模组自动老化设备
CN117262731B (zh) * 2023-10-09 2024-05-31 旭显未来(北京)科技有限公司 一种led显示模组自动老化设备

Also Published As

Publication number Publication date
CN101889339B (zh) 2012-09-05
CN101889339A (zh) 2010-11-17
TW200935547A (en) 2009-08-16
JP2009146932A (ja) 2009-07-02
KR20100085128A (ko) 2010-07-28

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