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WO2009072589A1 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
WO2009072589A1
WO2009072589A1 PCT/JP2008/072119 JP2008072119W WO2009072589A1 WO 2009072589 A1 WO2009072589 A1 WO 2009072589A1 JP 2008072119 W JP2008072119 W JP 2008072119W WO 2009072589 A1 WO2009072589 A1 WO 2009072589A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
led chip
cover member
emitting device
light emitting
Prior art date
Application number
PCT/JP2008/072119
Other languages
English (en)
French (fr)
Inventor
Keiichi Yamazaki
Naoko Takei
Tomoyuki Nakajima
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Priority to US12/734,913 priority Critical patent/US8294177B2/en
Priority to EP08856185.7A priority patent/EP2219233A4/en
Priority to CN2008801196360A priority patent/CN101889356B/zh
Priority to KR1020107014112A priority patent/KR101114487B1/ko
Publication of WO2009072589A1 publication Critical patent/WO2009072589A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies

Landscapes

  • Led Device Packages (AREA)

Abstract

　発光装置（１）は、ＬＥＤチップ（１０）と、当該ＬＥＤチップ（１０）が実装された実装基板（２０）とを備える。さらに、発光装置（１）は、透光性無機材料により形成されたドーム状のカバー部材（６０）と、ＬＥＤチップ（１０）から放射される光によって励起されてＬＥＤチップ（１０）よりも長波長の光を放射する蛍光体を含有した透光性材料（シリコーン樹脂など）により形成されたドーム状の色変換層（７０）とを備える。カバー部材（６０）は、実装基板（２０）との間に空気層（８０）が存在する形で実装基板（２０）に固着され、色変換層（７０）は、カバー部材（６０）の光出射面側に積層されている。
PCT/JP2008/072119 2007-12-07 2008-12-05 発光装置 WO2009072589A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/734,913 US8294177B2 (en) 2007-12-07 2008-12-05 Light emitting device utilizing a LED chip
EP08856185.7A EP2219233A4 (en) 2007-12-07 2008-12-05 LIGHT-EMITTING COMPONENT
CN2008801196360A CN101889356B (zh) 2007-12-07 2008-12-05 发光装置
KR1020107014112A KR101114487B1 (ko) 2007-12-07 2008-12-05 발광장치

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-317606 2007-12-07
JP2007317606 2007-12-07
JP2008213149 2008-08-21
JP2008-213149 2008-08-21
JP2008300175A JP2010074117A (ja) 2007-12-07 2008-11-25 発光装置
JP2008-300175 2008-11-25

Publications (1)

Publication Number Publication Date
WO2009072589A1 true WO2009072589A1 (ja) 2009-06-11

Family

ID=40717767

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072119 WO2009072589A1 (ja) 2007-12-07 2008-12-05 発光装置

Country Status (6)

Country Link
US (1) US8294177B2 (ja)
EP (1) EP2219233A4 (ja)
JP (1) JP2010074117A (ja)
KR (1) KR101114487B1 (ja)
CN (1) CN101889356B (ja)
WO (1) WO2009072589A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159813A (ja) * 2010-02-01 2011-08-18 Panasonic Electric Works Co Ltd 発光装置
CN102315371A (zh) * 2010-07-05 2012-01-11 松下电工株式会社 发光装置
US20120175661A1 (en) * 2009-09-25 2012-07-12 Mingjie Zhou Semiconductor light emitting package and method of manufacturing the same
US20130089729A1 (en) * 2010-05-20 2013-04-11 Dalian Luminglight Co., Ltd. Peelable light conversion luminescent film
CN103081567A (zh) * 2010-07-28 2013-05-01 通用电气照明解决方案有限责任公司 在硅酮中悬浮、在远程磷光体构造中模制/形成和使用的磷光体

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9780268B2 (en) 2006-04-04 2017-10-03 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
JP2009141219A (ja) * 2007-12-07 2009-06-25 Panasonic Electric Works Co Ltd 発光装置
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
JP5187746B2 (ja) * 2008-06-10 2013-04-24 Ｎｅｃライティング株式会社 発光装置
JP5226774B2 (ja) * 2009-07-27 2013-07-03 株式会社東芝 発光装置
KR101630152B1 (ko) * 2010-02-24 2016-06-14 엘지디스플레이 주식회사 하이브리드 발광다이오드 칩과 이를 포함하는 발광다이오드 소자 및 이의 제조방법
CN102803170A (zh) * 2010-04-19 2012-11-28 松下电器产业株式会社 玻璃组合物、光源装置以及照明装置
JP6072680B2 (ja) * 2010-07-01 2017-02-01 フィリップス ライティング ホールディング ビー ヴィ 封止ガラス管内のｔｌレトロフィットｌｅｄモジュール
CN103026518B (zh) * 2010-07-23 2016-04-20 京瓷株式会社 光照射设备、光照射模块以及印刷装置
CN102347420A (zh) * 2010-08-04 2012-02-08 展晶科技(深圳)有限公司 发光二极管制造方法
JP2012059893A (ja) * 2010-09-08 2012-03-22 Nippon Electric Glass Co Ltd 波長変換部材、光源及び波長変換部材の製造方法
CN102447035B (zh) * 2010-10-06 2015-03-25 赛恩倍吉科技顾问（深圳）有限公司 发光二极管、制造该发光二极管的模具及方法
US20130294082A1 (en) * 2011-01-18 2013-11-07 Panasonic Corporation Light bulb shaped lamp and lighting apparatus
FI122809B (fi) * 2011-02-15 2012-07-13 Marimils Oy Valolähde ja valolähdenauha
RU2457393C1 (ru) * 2011-02-17 2012-07-27 Закрытое Акционерное Общество "Научно-Производственная Коммерческая Фирма "Элтан Лтд" Светодиодный источник белого света с удаленным фотолюминесцентным конвертером
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US10490712B2 (en) 2011-07-21 2019-11-26 Cree, Inc. Light emitter device packages, components, and methods for improved chemical resistance and related methods
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
JP2013033890A (ja) * 2011-08-03 2013-02-14 Toyoda Gosei Co Ltd 発光装置
CN202613085U (zh) * 2011-08-12 2012-12-19 惠州元晖光电股份有限公司 Led照明装置
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9388959B2 (en) 2012-03-02 2016-07-12 Osram Sylvania Inc. White-light emitter having a molded phosphor sheet and method of making same
US10222032B2 (en) 2012-03-30 2019-03-05 Cree, Inc. Light emitter components and methods having improved electrical contacts
US9735198B2 (en) * 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
US10134961B2 (en) 2012-03-30 2018-11-20 Cree, Inc. Submount based surface mount device (SMD) light emitter components and methods
CN104235641B (zh) * 2013-06-09 2016-04-06 四川新力光源股份有限公司 超薄式led光引擎
EP2814078B1 (en) * 2013-06-14 2016-02-10 Saint-Gobain Glass France Transparent diffusive oled substrate and method for producing such a substrate
TW201511350A (zh) * 2013-09-14 2015-03-16 Lextar Electronics Corp 發光模組
JP6490932B2 (ja) * 2013-09-16 2019-03-27 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
CN103647011B (zh) * 2013-12-18 2018-09-21 杨毅 发光二极管封装结构和发光装置
CN103855283B (zh) * 2014-01-26 2017-05-10 上海瑞丰光电子有限公司 一种led封装体及照明装置
JP2015176960A (ja) * 2014-03-14 2015-10-05 株式会社東芝 発光装置
CN105185894B (zh) * 2014-06-05 2018-09-04 昆山科技大学 发光装置及其滤光方法
EP3158583B1 (en) * 2014-06-18 2022-01-26 X Display Company Technology Limited Micro assembled led displays
CN104393155B (zh) * 2014-11-03 2017-02-15 中国计量学院 基于对称周期的发光二极管封装方法以及led封装体
CN104409603B (zh) * 2014-11-03 2017-03-15 中国计量学院 基于厚度调节的发光二极管封装方法以及led封装体
DE102015213460A1 (de) * 2015-07-17 2017-01-19 Osram Gmbh Wellenlängenumwandlung von Primärlicht mittels eines Konversionskörpers
JP6740762B2 (ja) 2016-07-13 2020-08-19 日亜化学工業株式会社 発光装置およびその製造方法
US10748830B2 (en) * 2016-09-20 2020-08-18 Mitsubishi Electric Corporation Semiconductor device
JP7108171B2 (ja) * 2016-12-27 2022-07-28 日亜化学工業株式会社 発光装置
US10672957B2 (en) 2017-07-19 2020-06-02 Cree, Inc. LED apparatuses and methods for high lumen output density
US11099424B2 (en) * 2019-07-02 2021-08-24 Dell Products L.P. High color gamut LED bar with side illumination LED package
KR20210079898A (ko) * 2019-12-20 2021-06-30 엘지디스플레이 주식회사 표시장치

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004161871A (ja) * 2002-11-12 2004-06-10 Nichia Chem Ind Ltd 燒結蛍光体層
JP2005537651A (ja) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー 効率が向上した被覆ｌｅｄ
JP2006179520A (ja) * 2004-12-20 2006-07-06 Nichia Chem Ind Ltd 半導体装置
JP2007059864A (ja) * 2005-07-29 2007-03-08 Toshiba Lighting & Technology Corp 照明装置および発光ダイオード装置
JP2007080872A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd 発光装置
JP2007088261A (ja) * 2005-09-22 2007-04-05 Sanyo Electric Co Ltd 発光装置
JP2007126536A (ja) * 2005-11-02 2007-05-24 Sharp Corp 波長変換部材及び発光装置
JP3978451B2 (ja) 2005-07-27 2007-09-19 京セラ株式会社 発光装置
JP2007535175A (ja) * 2004-04-26 2007-11-29 ゲルコアー リミテッド ライアビリティ カンパニー 発光ダイオード素子

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6155699A (en) * 1999-03-15 2000-12-05 Agilent Technologies, Inc. Efficient phosphor-conversion led structure
AT410266B (de) * 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
US6686676B2 (en) * 2001-04-30 2004-02-03 General Electric Company UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same
JP2003152227A (ja) * 2001-11-14 2003-05-23 Citizen Electronics Co Ltd Ｌｅｄの色補正手段および色補正方法
US6812503B2 (en) * 2001-11-29 2004-11-02 Highlink Technology Corporation Light-emitting device with improved reliability
US7800121B2 (en) * 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
US7768189B2 (en) 2004-08-02 2010-08-03 Lumination Llc White LEDs with tunable CRI
JP2004273798A (ja) * 2003-03-10 2004-09-30 Toyoda Gosei Co Ltd 発光デバイス
US20060012298A1 (en) * 2004-07-14 2006-01-19 Taiwan Oasis Technology Co., Ltd. LED chip capping construction
US20060181192A1 (en) 2004-08-02 2006-08-17 Gelcore White LEDs with tailorable color temperature
US20070241657A1 (en) 2004-08-02 2007-10-18 Lumination, Llc White light apparatus with enhanced color contrast
US7453195B2 (en) 2004-08-02 2008-11-18 Lumination Llc White lamps with enhanced color contrast
DE102004047640A1 (de) * 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Gehäuse für ein optoelektronisches Bauelement
EP1840977A4 (en) * 2004-12-24 2009-07-29 Kyocera Corp LIGHT SOURCE AND LIGHTING DEVICE
TWI249861B (en) * 2005-01-12 2006-02-21 Lighthouse Technology Co Ltd Wavelength converting substance and light emitting device and encapsulating material comprising the same
US20070114562A1 (en) * 2005-11-22 2007-05-24 Gelcore, Llc Red and yellow phosphor-converted LEDs for signal applications
KR20060132298A (ko) * 2005-06-17 2006-12-21 삼성전기주식회사 발광소자 패키지
US7800124B2 (en) * 2005-06-30 2010-09-21 Panasonic Electric Works Co., Ltd. Light-emitting device
JP2007049019A (ja) * 2005-08-11 2007-02-22 Koha Co Ltd 発光装置
US7956372B2 (en) * 2005-09-20 2011-06-07 Panasonic Electric Works Co., Ltd. Light emitting device
JP5209177B2 (ja) * 2005-11-14 2013-06-12 新光電気工業株式会社 半導体装置および半導体装置の製造方法
JP3992059B2 (ja) * 2005-11-21 2007-10-17 松下電工株式会社 発光装置の製造方法
US7473939B2 (en) * 2006-01-06 2009-01-06 Formosa Epitaxy Incorporation Light-emitting diode structure with transparent window covering layer of multiple films
JP4996101B2 (ja) * 2006-02-02 2012-08-08 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP2007250817A (ja) * 2006-03-16 2007-09-27 Stanley Electric Co Ltd Ｌｅｄ
JP4665832B2 (ja) * 2006-05-26 2011-04-06 パナソニック電工株式会社 発光装置ならびにそれを用いる白色光源および照明装置
US7804147B2 (en) * 2006-07-31 2010-09-28 Cree, Inc. Light emitting diode package element with internal meniscus for bubble free lens placement
US7842960B2 (en) * 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
JP4976974B2 (ja) 2007-03-28 2012-07-18 パナソニック株式会社 発光装置
JP2009141219A (ja) * 2007-12-07 2009-06-25 Panasonic Electric Works Co Ltd 発光装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537651A (ja) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー 効率が向上した被覆ｌｅｄ
JP2004161871A (ja) * 2002-11-12 2004-06-10 Nichia Chem Ind Ltd 燒結蛍光体層
JP2007535175A (ja) * 2004-04-26 2007-11-29 ゲルコアー リミテッド ライアビリティ カンパニー 発光ダイオード素子
JP2006179520A (ja) * 2004-12-20 2006-07-06 Nichia Chem Ind Ltd 半導体装置
JP3978451B2 (ja) 2005-07-27 2007-09-19 京セラ株式会社 発光装置
JP2007059864A (ja) * 2005-07-29 2007-03-08 Toshiba Lighting & Technology Corp 照明装置および発光ダイオード装置
JP2007080872A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd 発光装置
JP2007088261A (ja) * 2005-09-22 2007-04-05 Sanyo Electric Co Ltd 発光装置
JP2007126536A (ja) * 2005-11-02 2007-05-24 Sharp Corp 波長変換部材及び発光装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2219233A4

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120175661A1 (en) * 2009-09-25 2012-07-12 Mingjie Zhou Semiconductor light emitting package and method of manufacturing the same
JP2011159813A (ja) * 2010-02-01 2011-08-18 Panasonic Electric Works Co Ltd 発光装置
US20130089729A1 (en) * 2010-05-20 2013-04-11 Dalian Luminglight Co., Ltd. Peelable light conversion luminescent film
CN102315371A (zh) * 2010-07-05 2012-01-11 松下电工株式会社 发光装置
CN103081567A (zh) * 2010-07-28 2013-05-01 通用电气照明解决方案有限责任公司 在硅酮中悬浮、在远程磷光体构造中模制/形成和使用的磷光体
CN103081567B (zh) * 2010-07-28 2016-03-23 通用电气照明解决方案有限责任公司 在硅酮中悬浮、在远程磷光体构造中模制/形成和使用的磷光体

Also Published As

Publication number Publication date
US20100237375A1 (en) 2010-09-23
JP2010074117A (ja) 2010-04-02
CN101889356B (zh) 2013-08-21
CN101889356A (zh) 2010-11-17
US8294177B2 (en) 2012-10-23
EP2219233A4 (en) 2013-12-11
EP2219233A1 (en) 2010-08-18
KR20100098660A (ko) 2010-09-08
KR101114487B1 (ko) 2012-03-13

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