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WO2009066979A3 - Mems based probe card and a method of testing semiconductor ion sensor using the same - Google Patents

Mems based probe card and a method of testing semiconductor ion sensor using the same Download PDF

Info

Publication number
WO2009066979A3
WO2009066979A3 PCT/MY2008/000144 MY2008000144W WO2009066979A3 WO 2009066979 A3 WO2009066979 A3 WO 2009066979A3 MY 2008000144 W MY2008000144 W MY 2008000144W WO 2009066979 A3 WO2009066979 A3 WO 2009066979A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
mems based
same
circuit board
printed circuit
Prior art date
Application number
PCT/MY2008/000144
Other languages
French (fr)
Other versions
WO2009066979A2 (en
Inventor
Mohd Ismahadi Syono
Original Assignee
Mimos Berhad
Mohd Ismahadi Syono
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimos Berhad, Mohd Ismahadi Syono filed Critical Mimos Berhad
Publication of WO2009066979A2 publication Critical patent/WO2009066979A2/en
Publication of WO2009066979A3 publication Critical patent/WO2009066979A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

An MEMS based Probe Card (100) for testing integrated circuits at wafer level comprising a printed circuit board (1) in which an opening is formed on a middle portion therethrough; at least two opposing first electrode pad (3) being deposited on a periphery of the printed circuit board (1); and a wafer assembly disposed around the central of the printed circuit board (1) comprising a substrate layer (5) in which an opening is formed on a middle portion therethrough;an insulating layer (7) on the substrate layer (5); at least two opposing second electrode pads (9) in the peripheral region of the insulating layer (7); and a probe pin (11) on each second electrode pad (9), wherein the first electrode pads (3) and the second electrode pads (9) are electrically interconnected by a electrical conductor (13).
PCT/MY2008/000144 2007-11-20 2008-11-20 Mems based probe card and a method of testing semiconductor ion sensor using the same WO2009066979A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI20072045 MY144280A (en) 2007-11-20 2007-11-20 Mems based probe card and a method of testing semiconductor ion sensor using the same
MYPI20072045 2007-11-20

Publications (2)

Publication Number Publication Date
WO2009066979A2 WO2009066979A2 (en) 2009-05-28
WO2009066979A3 true WO2009066979A3 (en) 2009-07-23

Family

ID=40668014

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/MY2008/000144 WO2009066979A2 (en) 2007-11-20 2008-11-20 Mems based probe card and a method of testing semiconductor ion sensor using the same

Country Status (2)

Country Link
MY (1) MY144280A (en)
WO (1) WO2009066979A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006030020A (en) * 2004-07-16 2006-02-02 Jsr Corp Probe card and its manufacturing method
WO2006023741A2 (en) * 2004-08-19 2006-03-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
US20070069745A1 (en) * 2005-09-28 2007-03-29 Star Technologies Inc. Probe card for integrated circuits

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006030020A (en) * 2004-07-16 2006-02-02 Jsr Corp Probe card and its manufacturing method
WO2006023741A2 (en) * 2004-08-19 2006-03-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
US20070069745A1 (en) * 2005-09-28 2007-03-29 Star Technologies Inc. Probe card for integrated circuits

Also Published As

Publication number Publication date
WO2009066979A2 (en) 2009-05-28
MY144280A (en) 2011-08-29

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