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WO2009060691A1 - Machining method of fragile material substrate and scribing device - Google Patents

Machining method of fragile material substrate and scribing device Download PDF

Info

Publication number
WO2009060691A1
WO2009060691A1 PCT/JP2008/068488 JP2008068488W WO2009060691A1 WO 2009060691 A1 WO2009060691 A1 WO 2009060691A1 JP 2008068488 W JP2008068488 W JP 2008068488W WO 2009060691 A1 WO2009060691 A1 WO 2009060691A1
Authority
WO
WIPO (PCT)
Prior art keywords
scribe line
substrate
along
break
cut
Prior art date
Application number
PCT/JP2008/068488
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshitaka Tsukada
Kazuya Maekawa
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Publication of WO2009060691A1 publication Critical patent/WO2009060691A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A machining method of a bonded substrate which can be machined surely according to a prescribed procedure even if the width of an end material portion to be cut off in order to expose a terminal portion becomes small. (a) A first scribe line (S1) is formed under low permeation condition along the outside end of a region to be cut off as an end material portion for a first substrate (51), and a second scribe line (S2) is formed under high permeation condition along the other end, (b) a break is performed along the second scribe line (S2) after forming a third scribe line (S3) for a second substrate (54), or formation of the third scribe line (S3) and the break along the second scribe line (S2) are performed in a reversed order, (c) the first substrate (51) and the second substrate (54) are separated by performing break along the third scribe line (S3), and (d) the end material portion of the first substrate (51) is cut off by performing a break along the first scribe line (S1).
PCT/JP2008/068488 2007-11-05 2008-10-10 Machining method of fragile material substrate and scribing device WO2009060691A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007287488 2007-11-05
JP2007-287488 2007-11-05

Publications (1)

Publication Number Publication Date
WO2009060691A1 true WO2009060691A1 (en) 2009-05-14

Family

ID=40625592

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068488 WO2009060691A1 (en) 2007-11-05 2008-10-10 Machining method of fragile material substrate and scribing device

Country Status (2)

Country Link
TW (1) TW200927684A (en)
WO (1) WO2009060691A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012027272A (en) * 2010-07-23 2012-02-09 Asahi Glass Co Ltd Manufacturing method of display panel, and display panel
CN103412430A (en) * 2013-08-15 2013-11-27 深圳市华星光电技术有限公司 Liquid crystal display panel mother board to be cut and manufacturing method thereof
WO2014130522A1 (en) * 2013-02-25 2014-08-28 Corning Incorporated Methods of manufacturing a thin glass pane
EP3330233A4 (en) * 2015-07-31 2019-03-13 Corning Precision Materials Co., Ltd. METHOD AND APPARATUS FOR CUTTING GLASS LAMINATE
CN115781944A (en) * 2022-12-23 2023-03-14 星为株式会社 Semiconductor substrate automatic cutting device
CN118005273A (en) * 2024-03-04 2024-05-10 深圳市晶向科技有限公司 Device and process for processing glass of planar liquid crystal display screen

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6287548B2 (en) * 2014-04-28 2018-03-07 三星ダイヤモンド工業株式会社 End material separating method and end material separating apparatus for brittle material substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004048058A1 (en) * 2002-11-22 2004-06-10 Mitsuboshi Diamond Industrial Co.,Ltd. Method for dividing substrate and method for manufacturing substrate using such method
JP2004348111A (en) * 2003-04-28 2004-12-09 Hitachi Displays Ltd Manufacturing method and manufacture apparatus for display device
JP2005266684A (en) * 2004-03-22 2005-09-29 Seiko Epson Corp Electro-optical device manufacturing method, electro-optical device, and electronic apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004048058A1 (en) * 2002-11-22 2004-06-10 Mitsuboshi Diamond Industrial Co.,Ltd. Method for dividing substrate and method for manufacturing substrate using such method
JP2004348111A (en) * 2003-04-28 2004-12-09 Hitachi Displays Ltd Manufacturing method and manufacture apparatus for display device
JP2005266684A (en) * 2004-03-22 2005-09-29 Seiko Epson Corp Electro-optical device manufacturing method, electro-optical device, and electronic apparatus

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012027272A (en) * 2010-07-23 2012-02-09 Asahi Glass Co Ltd Manufacturing method of display panel, and display panel
WO2014130522A1 (en) * 2013-02-25 2014-08-28 Corning Incorporated Methods of manufacturing a thin glass pane
CN105339316A (en) * 2013-02-25 2016-02-17 康宁股份有限公司 Methods of manufacturing thin glass pane
JP2016515085A (en) * 2013-02-25 2016-05-26 コーニング インコーポレイテッド Method for manufacturing a thin glass plate
US10035724B2 (en) 2013-02-25 2018-07-31 Corning Incorporated Methods of manufacturing a thin glass pane
CN103412430A (en) * 2013-08-15 2013-11-27 深圳市华星光电技术有限公司 Liquid crystal display panel mother board to be cut and manufacturing method thereof
CN103412430B (en) * 2013-08-15 2016-04-13 深圳市华星光电技术有限公司 A kind of liquid crystal panel motherboard to be cut and manufacture method thereof
EP3330233A4 (en) * 2015-07-31 2019-03-13 Corning Precision Materials Co., Ltd. METHOD AND APPARATUS FOR CUTTING GLASS LAMINATE
US10737968B2 (en) 2015-07-31 2020-08-11 Corning Precision Materials Co., Ltd Method and apparatus for cutting a glass laminate
CN115781944A (en) * 2022-12-23 2023-03-14 星为株式会社 Semiconductor substrate automatic cutting device
CN118005273A (en) * 2024-03-04 2024-05-10 深圳市晶向科技有限公司 Device and process for processing glass of planar liquid crystal display screen
CN118005273B (en) * 2024-03-04 2024-10-18 深圳市晶向科技有限公司 Device and process for processing glass of planar liquid crystal display screen

Also Published As

Publication number Publication date
TW200927684A (en) 2009-07-01

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